Display panel and manufacturing method thereof, and display device

Abstract

The present application discloses a display panel and a manufacturing method thereof, and a display device, which belong to the field of display technology. The display panel includes: a substrate, a light-emitting device, an encapsulation layer, at least one retaining wall, and a signal routing line. Since there is an opening on the signal routing line in the display panel, and the orthographic projection of the opening on the substrate is located within the orthographic projection of at least one retaining wall in the display panel on the substrate, therefore, at the at least one retaining wall, the water vapor absorbed by the organic film layer located on the side of the signal routing line close to the substrate can be released through the opening, thereby ensuring the flatness of the signal routing line, reducing the impact on the electrical signal loaded on the signal routing line, and thus improving the display effect of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, display devices are used more and more widely. Commonly used display devices include smart phones, tablet computers, televisions, monitors, etc.

[0003] The display panel may generally include: a substrate, a light-emitting device and an encapsulation layer located on the substrate, and a retaining wall and a signal routing located on the side of the encapsulation layer close to the substrate. The encapsulation layer may include: a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are stacked, and the encapsulation layer is used to encapsulate the light-emitting device, isolate the light-emitting device from the outside air, and prevent the light-emitting layer in the light-emitting device from being corroded by components such as moisture and oxygen in the air. The retaining wall is located in the non-display area of ​​the display panel and is composed of an organic film layer in the display panel. The retaining wall can be used to block the organic encapsulation layer in the encapsulation layer so that the orthographic projection of the organic encapsulation layer in the encapsulation layer on the substrate is located in the display area. In this way, the probability that the organic encapsulation layer in the encapsulation layer absorbs moisture in the non-display area and affects the encapsulation effect of the encapsulation layer can be reduced.

[0004] However, at the retaining wall, since there is an organic film layer on the side of the signal line in the display panel close to the substrate, and the organic film layer easily absorbs moisture, the signal line in the display panel has poor flatness at the retaining wall, which in turn affects the electrical signal loaded on the signal line, resulting in poor effect of the display panel. Summary of the invention

[0005] The embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device, which can solve the problem of poor display effect of the display panel in the prior art. The technical solution is as follows:

[0006] In a first aspect, a display panel is provided, the display panel comprising:

[0007] A substrate, the substrate having a display area and a non-display area located outside the display area;

[0008] A light emitting device and an encapsulation layer located on the substrate;

[0009] and at least one retaining wall and a signal trace located on a side of the packaging layer close to the substrate;

[0010] The light-emitting device is located in the display area, the at least one retaining wall and the signal wiring are both located in the non-display area, the signal wiring is electrically connected to the light-emitting device, and the signal wiring has an opening, and the orthographic projection of the opening on the substrate is located within the orthographic projection of the at least one retaining wall on the substrate.

[0011] Optionally, the light-emitting device includes: an anode, a light-emitting layer and a cathode arranged in a stacked manner, the signal routing includes: a first power signal lead electrically connected to the cathode, and a second power signal lead electrically connected to the anode, and the opening is located in the first power signal lead and / or the second power signal lead.

[0012] Optionally, the display panel further comprises: a touch control unit and a touch signal lead located on a side of the encapsulation layer away from the substrate, wherein the touch signal lead is connected to the touch control unit;

[0013] Among them, the touch unit is located in the display area, the touch signal lead is located in the non-display area, at least part of the orthographic projection of the touch signal lead on the substrate is located within the orthographic projection of the first power signal lead on the substrate, and is staggered with the orthographic projection of the opening on the substrate.

[0014] Optionally, there are a plurality of touch signal leads, and at least one opening is arranged between at least two adjacent touch signal leads.

[0015] Optionally, there are a plurality of openings in the first power signal lead, and at least one opening is arranged between any two adjacent touch signal leads.

[0016] Optionally, a distance between any two adjacent touch signal leads is greater than a width of the opening, and a width direction of the opening is perpendicular to an extension direction of the touch signal leads.

[0017] Optionally, the number of the first power signal leads is two, and the multiple touch signal leads are divided into two groups of touch signal leads. The two first power signal leads correspond one-to-one to the two groups of touch signal leads, and at least a portion of the orthographic projection of each group of touch signal leads on the substrate is located within the orthographic projection of a corresponding first power signal lead on the substrate.

[0018] Optionally, one group of the touch signal leads includes: a plurality of first touch signal leads arranged in a connected manner, and another group of the touch signal leads includes: a plurality of second touch signal leads arranged in a continuous manner;

[0019] The touch control unit includes: a touch sensing electrode and a touch driving electrode which are insulated from each other, the first touch signal lead is connected to the touch sensing electrode, and the second touch signal lead is connected to the touch driving electrode.

[0020] Optionally, the touch signal lead includes: a first sub-lead and a second sub-lead electrically connected to the first sub-lead, and the first sub-lead and the second sub-lead are arranged in different layers.

[0021] Optionally, the orthographic projection of the first sub-lead on the substrate coincides with the orthographic projection of the second sub-lead on the substrate.

[0022] Optionally, the display panel further includes: a first conductive layer, an insulating layer, and a second conductive layer located on the encapsulation layer and stacked in a direction perpendicular to and away from the encapsulation layer;

[0023] The first conductive layer includes: the first sub-lead, the second conductive layer includes: the second sub-lead, the touch sensing electrode and the touch driving electrode, the insulating layer has a first via hole, and the first sub-lead and the second sub-lead are electrically connected through the first via hole.

[0024] Optionally, there are multiple touch drive electrodes, and the multiple touch drive electrodes are arranged in multiple rows. The first conductive layer further includes: multiple connection bridges, and the insulating layer further has second via holes, and each of the connection bridges is connected to two adjacent touch drive electrodes in the same row through the second via holes;

[0025] There are a plurality of touch sensing electrodes, which are arranged in a plurality of columns. The second conductive layer further comprises: a plurality of connecting electrodes, each of which is connected to two adjacent touch sensing electrodes in the same column.

[0026] Optionally, the display panel further includes: a touch signal line for connecting the touch unit and the touch signal lead;

[0027] The orthographic projections of the touch control unit and the touch control signal line on the substrate are both located within the orthographic projection of the cathode on the substrate.

[0028] Optionally, the signal routing line further includes: a power connection bus electrically connected to the second power signal lead, and the opening is also located in the power connection bus;

[0029] The display panel further comprises: a power signal line located in the display area, and the power connection bus is respectively connected to the power signal line and the second power signal lead.

[0030] Optionally, the number of the first power signal leads and the number of the second power signal leads are both two, and the two second power signal leads are located between the two first power signal leads;

[0031] The display panel also includes: a plurality of drive signal lines located in the display area, and a plurality of drive signal leads located in the non-display area, the plurality of drive signal lines are connected to the plurality of drive signal line leads in a one-to-one correspondence, and the plurality of drive signal leads are located between two of the second power signal leads.

[0032] Optionally, the first power signal lead, the power connection bus and the second power signal lead are arranged in the same layer and are made of the same material; the first power signal lead and the drive signal lead are arranged in different layers.

[0033] Optionally, each of the retaining walls includes: at least two stacked organic insulating layers, the display panel further includes: a third conductive layer, the third conductive layer is located between two adjacent organic insulating layers in at least one of the retaining walls, and the third conductive layer includes: the signal wiring.

[0034] Optionally, the at least one retaining wall includes: a first retaining wall and a second retaining wall, wherein the second retaining wall is closer to the display area than the first retaining wall;

[0035] The at least two organic insulating layers in the first barrier wall include: a first organic insulating layer, a second organic insulating layer and a pixel defining layer which are stacked;

[0036] The at least two organic insulating layers in the second barrier wall include: the second organic insulating layer and the pixel defining layer stacked in layers;

[0037] The third conductive layer is located between the first organic insulating layer and the second organic insulating layer, and the orthographic projection of the opening on the substrate is located within the orthographic projection of the first retaining wall on the substrate.

[0038] In a second aspect, a method for manufacturing a display panel is provided, the method comprising:

[0039] Providing a substrate, the substrate having a display area and a non-display area located outside the display area;

[0040] forming a light-emitting device, a packaging layer, at least one retaining wall and a signal wiring on the substrate;

[0041] The light-emitting device is located in the display area, the at least one retaining wall and the signal wiring are both located in the non-display area, the signal wiring is electrically connected to the light-emitting device, and the signal wiring has an opening, and the orthographic projection of the opening on the substrate is located within the orthographic projection of the at least one retaining wall on the substrate.

[0042] In a third aspect, a display device is provided, the display device comprising:

[0043] Display panel and driver chip;

[0044] The display panel comprises: the display panel mentioned above;

[0045] Wherein, the driving chip is electrically connected to the signal wiring in the display panel.

[0046] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0047] The display panel includes: a substrate, a light-emitting device, an encapsulation layer, at least one retaining wall and a signal line. In the display panel, the signal line has an opening, and the orthographic projection of the opening on the substrate is located within the orthographic projection of at least one retaining wall in the display panel on the substrate. Therefore, at the at least one retaining wall, water vapor absorbed by the organic film layer located on the side of the signal line close to the substrate can be released through the opening, thereby ensuring the flatness of the signal line, reducing the impact on the electrical signal loaded on the signal line, and further improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0049] Figure 1 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0050] Figure 2 yes Figure 1 A cross-sectional view of the display panel at AA' is shown;

[0051] Figure 3 yes Figure 1 A partial enlarged view of the display panel at position B is shown;

[0052] Figure 4 is a schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0053] Figure 5 yes Figure 4 A cross-sectional view of the display panel at CC' is shown;

[0054] Figure 6 yes Figure 5 A partial enlarged view of the display panel at position D is shown;

[0055] Figure 7 It is a structural schematic diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0056] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0057] Please refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application, Figure 2 yes Figure 1 The cross-sectional view of the display panel at AA' is shown. Figure 3 yes Figure 1 The display panel is shown in a partially enlarged view at B. The display panel 000 may include a substrate 100. The substrate 100 has a display area 100a and a non-display area 100b located outside the display area 100a.

[0058] The display panel 000 may further include: a light emitting device (not shown in the figure) and an encapsulation layer 200 located on the substrate 100 , and at least one retaining wall 300 and a signal trace 400 located on a side of the encapsulation layer 200 close to the substrate 100 .

[0059] The light-emitting device is located in the display area 100a, the at least one retaining wall 300 and the signal wiring 400 are both located in the non-display area 100b, the signal wiring 400 is electrically connected to the light-emitting device, and the signal wiring 400 has an opening 400a, and the orthographic projection of the opening 400a on the substrate 100 is located within the orthographic projection of the at least one retaining wall 300 on the substrate 100. The signal wiring 400 is used to provide a power signal to the light-emitting device.

[0060] In the present application, since in the display panel 000, there is an opening 400a on the signal wiring 400, and the orthographic projection of the opening 400a on the substrate 100 is located within the orthographic projection of at least one retaining wall 300 in the display panel 000 on the substrate 100, therefore, at the at least one retaining wall 300, water vapor absorbed by the organic film layer located on the side of the signal wiring 400 close to the substrate 100 can be released through the opening 400a, thereby ensuring the flatness of the signal wiring 400, reducing the impact on the electrical signal loaded on the signal wiring 400, and thereby improving the display effect of the display panel 000.

[0061] In summary, the display panel provided in the embodiment of the present application includes: a substrate, a light-emitting device, an encapsulation layer, at least one retaining wall and a signal line. Since in the display panel, there is an opening on the signal line, and the orthographic projection of the opening on the substrate is located within the orthographic projection of at least one retaining wall in the display panel on the substrate, therefore, at the at least one retaining wall, the water vapor absorbed by the organic film layer located on the side of the signal line close to the substrate can be released through the opening, thereby ensuring the flatness of the signal line, reducing the impact on the electrical signal loaded on the signal line, and further improving the display effect of the display panel.

[0062] In the examples of this application, please refer to Figure 4 , Figure 5 and Figure 6 , Figure 4 is a schematic diagram of the structure of another display panel provided in an embodiment of the present application, Figure 5 yes Figure 4 A cross-sectional view of the display panel at CC' is shown. Figure 6 yes Figure 5 The display panel is shown in a partially enlarged view at D. The light emitting device in the display panel 000 may include: an anode, a light emitting layer and a cathode arranged in layers, and the signal trace 400 may include: a first power signal lead 401 electrically connected to the cathode, and a second power signal lead 402 electrically connected to the anode.

[0063] In the present application, there are multiple possible implementations of the positional relationship between the opening 400a and the first power signal lead 401 and the second power signal lead 402. The present application embodiment uses the following three possible implementations as examples for schematic illustration:

[0064] In a first possible implementation, the opening 400a is located in the first power signal lead 401 and the second power signal lead 402. For example, the orthographic projection of the first power signal lead 401 on the substrate 100 and the orthographic projection of at least one retaining wall 300 on the substrate 100 have a first overlapping region, and the orthographic projection of the opening 400a in the first power signal lead 401 on the substrate 100 is located in the first overlapping region. The orthographic projection of the second power signal lead 402 on the substrate 100 and the orthographic projection of at least one retaining wall 300 on the substrate 100 have a second overlapping region, and the orthographic projection of the opening 400a in the second power signal lead 402 on the substrate 100 is located in the second overlapping region. In this way, the flatness of the first power signal lead 401 and the second power signal lead 402 at the at least one retaining wall 300 can be ensured.

[0065] In a second possible implementation, the opening 400a is located in the first power signal lead 401. For example, the orthographic projection of the first power signal lead 401 on the substrate 100 and the orthographic projection of at least one retaining wall 300 on the substrate 100 have a first overlapping region, and the orthographic projection of the opening 400a in the first power signal lead 401 on the substrate 100 is located in the first overlapping region. In this way, the flatness of the first power signal lead 401 at the at least one retaining wall 300 can be ensured.

[0066] In a third possible implementation, the opening 400a is located in the second power signal lead 402. For example, the orthographic projection of the second power signal lead 402 on the substrate 100 and the orthographic projection of at least one retaining wall 300 on the substrate 100 have a second overlapping region, and the orthographic projection of the opening 400a in the second power signal lead 402 on the substrate 100 is located in the second overlapping region. In this way, the flatness of the second power signal lead 402 at the at least one retaining wall 300 can be ensured.

[0067] It should be noted that a constant low-level voltage may be loaded on the first power signal lead 401, for example, a VSS signal may be loaded on the first power signal lead 401, and the first power signal lead 401 may be referred to as a VSS signal lead. A high-level voltage may be loaded on the second power signal lead 402, for example, a VDD signal may be loaded on the second power signal lead 402, and the second power signal lead 402 may be referred to as a VDD signal lead.

[0068] It should also be noted that the following embodiments of the present application are schematically described using the example that the opening 400a is located in the first power signal lead 401, or the opening 400a is located in the first power signal lead 401 and the second power signal lead 402.

[0069] In the embodiment of the present application, the signal routing 400 may further include: a power connection bus 403 electrically connected to the second power signal lead 402, and the opening 400a may also be located in the power connection bus 403. For example, the orthographic projection of the power connection bus 403 on the substrate 100 and the orthographic projection of at least one retaining wall 300 on the substrate 100 have a third overlapping area, and the orthographic projection of the opening 400a in the power connection bus 403 on the substrate 100 is located in the third overlapping area. In this way, the flatness of the power connection bus 403 at the at least one retaining wall 300 can be ensured. The display panel 000 may further include a power signal line (not shown in the figure) located in the display area 100a. The power connection bus 403 is electrically connected to each power signal line and each second power signal lead 402 respectively. In this way, the driver chip in the display device prepared using the display panel 000 can load a high voltage level to the power signal line located in the display area 100a through the second power signal lead 402 and the power connection bus 403.

[0070] In this application, please refer to Figure 4 The display panel 000 may further include: a touch unit 500 and a touch signal lead 600 located on a side of the encapsulation layer 200 away from the substrate 100, and the touch signal lead 600 is connected to the touch unit 500. The touch unit 500 is located in the display area 100a, the touch signal lead 600 is located in the non-display area 100b, and at least part of the orthographic projection of the touch signal lead 600 on the substrate 100 is located within the orthographic projection of the first power signal lead 401 on the substrate 100, and is staggered with the orthographic projection of the opening 400a on the substrate 100. Since a constant low-level voltage is loaded on the first power signal lead 401, when at least part of the orthographic projection of the touch signal lead 600 on the substrate 100 is located within the orthographic projection of the first power signal lead 401 on the substrate 100 and is offset from the orthographic projection of the opening 400a on the substrate 100, the first power signal lead 401 can shield the touch signal lead 600, thereby avoiding the generation of parasitic capacitance between the touch signal lead 600 and the signal lead of the display panel 000 located on the side of the first power signal lead 401 close to the substrate 100, thereby reducing the probability of crosstalk between the signal loaded on the touch signal lead 600 and the signal loaded on the signal lead, thereby improving the display effect of the display panel 000.

[0071] In the embodiment of the present application, there may be a plurality of touch signal leads 600 in the display panel 000 , and at least one opening 400 a is arranged between at least two adjacent touch signal leads 600 .

[0072] For example, the number of openings 400a in the first power signal lead 401 in the display panel 000 can be multiple, and at least one opening 400a is arranged between any two adjacent touch signal leads 600. In this way, the touch signal leads 600 and the openings 400a are arranged alternately. It should be noted that when multiple openings 400a are arranged between any two adjacent touch signal leads 600, the arrangement direction of the multiple openings 400a is parallel to the extension direction of the touch signal leads 600.

[0073] Optionally, in the display panel 000, the distance between any two adjacent touch signal leads 600 is greater than the width of the opening 400a, and the width direction of the opening 400a is perpendicular to the extension direction of the touch signal lead 600. In this way, the shielding effect of the first power signal lead 401 on the touch signal lead 600 can be ensured, and the probability of crosstalk between the signal loaded on the touch signal lead 600 and the signal loaded on the signal lead can be avoided, thereby further improving the display effect of the display panel 000.

[0074] For example, within the process error range, the width of the opening 400 a may be in the range of 12 to 18 microns.

[0075] In this application, if Figure 4 As shown, there are two first power signal leads 401, and the touch signal leads 600 are divided into two groups of touch signal leads 600. The two first power signal leads 401 correspond to the two groups of touch signal leads 600 one by one, and at least a portion of the orthographic projection of each group of touch signal leads 600 on the substrate 100 is located within the orthographic projection of the corresponding first power signal lead 401 on the substrate 100.

[0076] For example, the group of touch signal leads 600 may include: a plurality of first touch signal leads arranged in series, and the other group of touch signal leads 600 may include: a plurality of second touch signal leads arranged in series. The touch unit 500 in the display panel 000 may include: a touch sensing electrode 501 and a touch driving electrode 502 insulated from each other, the first touch signal lead is connected to the touch sensing electrode 501, and the second touch signal lead is connected to the touch driving electrode 502. In this way, the touch sensing signal can be loaded on the first touch signal lead, and the touch driving signal can be loaded on the second touch signal lead.

[0077] For example, there may be multiple touch sensing electrodes 501 and touch driving electrodes 502 in the display panel 000. The multiple touch sensing electrodes 501 may be arranged in multiple columns, and the multiple columns of touch sensing electrodes 501 correspond to the first touch signal leads one by one; the multiple touch driving electrodes 502 may be arranged in multiple rows, and the multiple rows of touch driving electrodes 502 correspond to the second touch signal leads one by one.

[0078] In the embodiments of the present application, Figure 5 and Figure 6 As shown, the touch signal lead 600 may include: a first sub-lead 601, and a second sub-lead 602 electrically connected to the first sub-lead 601, wherein the first sub-lead 601 and the second sub-lead 602 are arranged in different layers. In this way, the cross-sectional area of ​​the touch signal lead 600 can be increased, and the resistance of the touch signal lead 600 can be reduced.

[0079] Optionally, the orthographic projection of the first sub-lead 601 on the substrate 100 coincides with the orthographic projection of the second sub-lead 602 on the substrate 100. In this way, the width of the touch signal lead 600 can be reduced, thereby increasing the distance between adjacent touch signal leads 600 and reducing the difficulty of manufacturing the touch signal lead 600.

[0080] In the examples of this application, please refer to Figure 5 , the display panel 000 may further include: a first conductive layer 700, an insulating layer 800, and a second conductive layer 900, which are stacked on the encapsulation layer 200 and are arranged in a direction perpendicular to and away from the encapsulation layer 200. The first conductive layer 700 may include: a first sub-lead 601. The second conductive layer 900 may include a second sub-lead 602, a touch sensing electrode 501, and a touch driving electrode 502. The insulating layer 800 has a first via hole (not shown in the figure), and the first sub-lead 601 and the second sub-lead 602 are electrically connected through the first via hole. In this case, the second sub-lead 602, the touch sensing electrode 501, and the touch driving electrode 502 can be formed by the same patterning process, which effectively simplifies the manufacturing process of the display panel 000 and reduces the manufacturing cost of the display panel 000.

[0081] Optionally, in the display panel 000, the number of touch drive electrodes 502 is multiple, and the multiple touch drive electrodes 502 can be arranged in multiple rows. The first conductive layer 700 can also include: multiple connection bridges (not shown in the figure). The insulating layer 800 also has a second via (not shown in the figure), and each connection bridge can be connected to two adjacent touch drive electrodes 502 in the same row through the second via. In this way, electrical connection between the touch drive electrodes 502 can be achieved, so that the electrically connected touch drive electrodes 502 can be used to detect the touch position. In this case, the connection bridge and the first sub-lead 601 can be formed by the same patterning process, which further simplifies the manufacturing process of the display panel 000 and reduces the manufacturing cost of the display panel 000.

[0082] In the display panel 000, there are multiple touch sensing electrodes 501, and the multiple touch sensing electrodes 501 are arranged in multiple columns. The second conductive layer 900 may also include: multiple connecting electrodes (not shown in the figure), each connecting electrode is connected to two adjacent touch sensing electrodes 501 in the same column. In this way, electrical connection between the touch sensing electrodes 501 can be achieved, so that the electrically connected touch sensing electrodes 501 can be used to sense the touch position. In this case, the connecting electrode and the second sub-lead 602, the touch sensing electrode 501 and the touch driving electrode 502 can be formed by the same patterning process, which further simplifies the manufacturing process of the display panel 000 and reduces the manufacturing cost of the display panel 000.

[0083] For example, Figure 4 As shown, the touch sensing electrode 501 and the touch driving electrode 502 may both be in a diamond plate shape. The touch sensing electrode 501 and the touch driving electrode 502 may also be in other shapes, which is not limited in the embodiment of the present application.

[0084] In this application, if Figure 4 As shown, the display panel 000 may also include: a touch signal line 1000 connecting the touch unit 500 and the touch signal lead 600. The orthographic projections of the touch unit 500 and the touch signal line 1000 on the substrate 100 are both located within the orthographic projection of the cathode in the light-emitting device on the substrate 100, and the cathode is connected to the first power signal lead 401. Since the cathode is connected to the first power signal lead 401, a constant first power signal is also loaded on the cathode. In this way, the cathode can shield the touch unit 500 and the touch signal line 1000, avoiding crosstalk between the signals loaded on the touch unit 500 and the touch signal line 1000 and the signals loaded on the signal line located on the side of the cathode close to the substrate 100 in the display panel 000, further improving the display effect of the display panel 000.

[0085] Optionally, there may be multiple touch signal lines 1000, and the multiple touch signal lines 1000 may include: multiple first touch signal lines and multiple second touch signal lines, the multiple first touch signal lines are electrically connected to multiple columns of touch sensing electrodes 501 in a one-to-one correspondence, and the multiple first touch signal lines are electrically connected to multiple first touch signal leads in a one-to-one correspondence. In this way, the touch chip in the display device prepared using the display panel 000 can apply a touch signal to each column of touch sensing electrodes 501 through the first touch signal leads and the first touch signal lines; the multiple second touch signal lines are electrically connected to multiple rows of touch driving electrodes 502 in a one-to-one correspondence, and the multiple second touch signal lines are electrically connected to multiple second touch signal leads in a one-to-one correspondence. In this way, the touch chip in the display device prepared using the display panel 000 can apply a touch signal to each row of touch driving electrodes 502 through the second touch signal leads and the second touch signal lines.

[0086] Optional, such as Figure 4 As shown, the number of the first power signal leads 401 and the number of the second power signal leads 402 are both two, and the two second power signal leads 402 are located between the two first power signal leads 401. The display panel 000 may also include: a plurality of drive signal lines (not shown in the figure) located in the display area 100a, and a plurality of drive signal leads (not shown in the figure) located in the non-display area 100b, the plurality of drive signal lines are connected to the plurality of drive signal leads in a one-to-one correspondence, and the plurality of drive signal leads are located between the two first power signal leads 400. The plurality of drive signal leads are located in the fan-out area 100c.

[0087] At the same time, the plurality of driving signal lines are located on the side of the cathode close to the substrate 100, and the plurality of driving signal lines are located on the side of the first power signal lead 401 close to the substrate 100. In this way, the cathode can prevent the signal loaded on the driving signal line from crosstalking with the signal loaded on the touch unit 500 and the touch signal line 1000; the first power signal line 401 can prevent the signal loaded on the driving signal lead from crosstalking with the signal loaded on the touch signal lead 600.

[0088] Optionally, the first power signal lead 401, the power connection bus 403 and the second power signal lead 402 are arranged on the same layer and are made of the same material. In this way, the first power signal lead 401, the power connection bus 403 and the second power signal lead 402 can be formed by the same composition process; the first power signal lead 401 and the drive signal lead are arranged on different layers, and the drive signal lead is located on the side of the first power signal lead 401 close to the substrate 100.

[0089] In the embodiment of the present application, at least one retaining wall 300 in the display panel 000 is arranged around the display area 100a, and the retaining wall 300 may be a ring-shaped retaining wall. Figure 5 As shown, each retaining wall 300 may include: at least two stacked organic insulating layers, the display panel 000 may also include: a third conductive layer 1100, the third conductive layer 1100 is located between two adjacent organic insulating layers in at least one retaining wall 300, and the third conductive layer 1100 may include: a signal trace 400.

[0090] In the display panel 000, the encapsulation layer 200 is used to encapsulate the light-emitting device in the display panel 000, isolate the light-emitting device from the outside air, and prevent the light-emitting layer in the light-emitting device from being corroded by components such as moisture and oxygen in the air. The encapsulation layer 200 may include: a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are stacked. The at least one retaining wall 300 may be used to block the organic encapsulation layer in the encapsulation layer 200, so that the orthographic projection of the organic encapsulation layer in the encapsulation layer 200 on the substrate 100 is located in the display area 100a. In this way, the probability that the organic encapsulation layer in the encapsulation layer 200 absorbs moisture in the non-display area 100b and affects the encapsulation effect of the encapsulation layer 200 can be reduced.

[0091] Optional, such as Figure 4 and Figure 5 As shown, the at least one retaining wall 300 may include: a first retaining wall 301 and a second retaining wall 302, and the second retaining wall 302 is closer to the display area 100a relative to the first retaining wall 301. The at least two organic insulating layers in the first retaining wall 301 may include: a first organic insulating layer 300a, a second organic insulating layer 300b and a pixel defining layer 300c arranged in a stacked manner; the at least two organic insulating layers in the second retaining wall 302 may include: a second organic insulating layer 300b and a pixel defining layer 300c. In this way, the height of the first retaining wall 301 may be greater than that of the second retaining wall 302, and the first retaining wall 301 is farther away from the display area 100a relative to the second retaining wall 302. When the second retaining wall 301 fails to completely block the organic encapsulation layer in the encapsulation layer 200, the first retaining wall 301 may further block the organic encapsulation layer in the encapsulation layer 200, thereby improving the reliability of the encapsulation layer 200.

[0092] In the present application, the third conductive layer 1100 is located between the first organic insulating layer 300a and the second organic insulating layer 300b, and the orthographic projection of the opening 400a on the substrate 100 is located within the orthographic projection of the first retaining wall 301 on the substrate 100. Since the first organic insulating layer 300a is present below the third conductive layer 1100 at the first retaining wall 301, and the first organic insulating layer 300a is prone to absorb water, when the orthographic projection of the opening 400a in the signal wiring 400 on the substrate 100 is located within the orthographic projection of the first retaining wall 301 on the substrate 100, the opening 400a can release the water vapor absorbed by the first organic insulating layer 300a in the first retaining wall 301, thereby ensuring the flatness of the signal wiring 400.

[0093] For example, Figure 4 As shown, the orthographic projection of the first power signal lead 401 in the signal routing 400 on the substrate 100 has a first overlapping region with the orthographic projections of the first retaining wall 301 and the second retaining wall 302 on the substrate 100, and the orthographic projection of the opening 400a in the first power signal lead 401 on the substrate 100 is located in the first overlapping region. The orthographic projection of the second power signal lead 402 in the signal routing 400 on the substrate 100 has a second overlapping region with the orthographic projection of the first retaining wall 301 on the substrate 100, and does not have an overlapping region with the orthographic projection of the second retaining wall 302 on the substrate 100, and the orthographic projection of the opening 400a in the second power signal lead 402 on the substrate 100 is located in the second overlapping region.

[0094] It is necessary to add that, if Figure 4 As shown, when the orthographic projection of the power connection bus 403 in the signal wiring 400 on the substrate 100 does not overlap with the orthographic projection of the first retaining wall 301 on the substrate 100 , the opening 400 a may not be provided on the power connection bus 403 .

[0095] Optionally, the display panel 000 may further include: an optical adhesive 1200. The optical adhesive 1200 is located on a side of the second conductive layer 800 away from the substrate 100. The optical adhesive 1200 is used to bond the display panel 000 to the glass cover.

[0096] It should be noted that a single patterning process in the above embodiment may include: photoresist coating, exposure, development, etching and photoresist stripping.

[0097] In summary, the display panel provided in the embodiment of the present application includes: a substrate, a light-emitting device, an encapsulation layer, at least one retaining wall and a signal line. Since in the display panel, there is an opening on the signal line, and the orthographic projection of the opening on the substrate is located within the orthographic projection of at least one retaining wall in the display panel on the substrate, therefore, at the at least one retaining wall, the opening can release the water vapor absorbed by the organic film layer located on the side of the signal line close to the substrate, thereby ensuring the flatness of the signal line, reducing the impact on the electrical signal loaded on the signal line, and further improving the display effect of the display panel.

[0098] The present application also provides a method for manufacturing a display panel. The method for manufacturing a display panel is used to manufacture Figure 1 The display panel shown. The manufacturing method of the display panel may include:

[0099] Step A: providing a substrate, wherein the substrate has a display area and a non-display area located outside the display area.

[0100] Step B: forming a light-emitting device, a packaging layer, at least one retaining wall and a signal wiring on a substrate.

[0101] The light emitting device is located in the display area, and at least one retaining wall and a signal line are both located in the non-display area. The signal line is electrically connected to the light emitting device, and the signal line has an opening, and the orthographic projection of the opening on the substrate is located within the orthographic projection of at least one retaining wall on the substrate.

[0102] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific principles of the display panel described above can refer to the corresponding contents in the aforementioned embodiment of the structure of the array substrate, and will not be repeated here.

[0103] To summarize, the manufacturing method of the display panel provided in the embodiment of the present application is that in the display panel, there is an opening on the signal line, and the orthographic projection of the opening on the substrate is located within the orthographic projection of at least one retaining wall in the display panel on the substrate. Therefore, at the at least one retaining wall, the opening can release water vapor absorbed by the organic film layer located on the side of the signal line close to the substrate, thereby ensuring the flatness of the signal line, reducing the impact on the electrical signal loaded on the signal line, and further improving the display effect of the display panel.

[0104] The present application also provides a display device, which can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc. Figure 7 As shown, Figure 7001 is a schematic diagram of the structure of a display device provided in an embodiment of the present application. The display device 010 may include: a display panel 000 and a flexible circuit board 001, on which a driver chip 002 is packaged. The display panel 000 may be the display panel in the above embodiment. The driver chip 002 is electrically connected to the signal routing in the display panel 000. The driver chip 002 may also be electrically connected to the drive signal lead in the display panel 000.

[0105] Optionally, a touch chip may be packaged on the flexible circuit board 001 , and the touch chip is electrically connected to a touch signal lead in the display panel 000 .

[0106] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0107] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0108] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: A substrate, the substrate having a display area and a non-display area located outside the display area; A light emitting device and an encapsulation layer located on the substrate; and at least one retaining wall and a signal trace located on a side of the packaging layer close to the substrate; The light-emitting device is located in the display area, the at least one retaining wall and the signal wiring are both located in the non-display area, the signal wiring is electrically connected to the light-emitting device, and the signal wiring has an opening, and the orthographic projection of the opening on the substrate is located within the orthographic projection of the at least one retaining wall on the substrate; The light emitting device comprises: an anode, a light emitting layer and a cathode which are stacked, the signal wiring comprises: a first power signal lead electrically connected to the cathode, and a second power signal lead electrically connected to the anode, and the opening is located in the first power signal lead and / or the second power signal lead; The display panel further comprises: a touch control unit and a touch control signal lead located on a side of the encapsulation layer away from the substrate, wherein the touch control signal lead is connected to the touch control unit; Among them, the touch unit is located in the display area, the touch signal lead is located in the non-display area, at least part of the orthographic projection of the touch signal lead on the substrate is located within the orthographic projection of the first power signal lead on the substrate, and is staggered with the orthographic projection of the opening on the substrate.

2. The display panel according to claim 1, characterized in that: There are a plurality of touch signal leads, and at least one opening is arranged between at least two adjacent touch signal leads.

3. The display panel according to claim 2, characterized in that: There are a plurality of openings in the first power signal lead, and at least one opening is arranged between any two adjacent touch signal leads.

4. The display panel according to claim 3, characterized in that: The distance between any two adjacent touch signal leads is greater than the width of the opening, and the width direction of the opening is perpendicular to the extending direction of the touch signal leads.

5. The display panel according to claim 3, characterized in that: The number of the first power signal leads is two, and the multiple touch signal leads are divided into two groups of touch signal leads. The two first power signal leads correspond to the two groups of touch signal leads one by one, and at least a partial orthographic projection of each group of touch signal leads on the substrate is located within the orthographic projection of a corresponding first power signal lead on the substrate.

6. The display panel according to claim 5, characterized in that: One group of the touch signal leads includes: a plurality of first touch signal leads arranged in a connected manner, and another group of the touch signal leads includes: a plurality of second touch signal leads arranged in a continuous manner; The touch control unit includes: a touch sensing electrode and a touch driving electrode which are insulated from each other, the first touch signal lead is connected to the touch sensing electrode, and the second touch signal lead is connected to the touch driving electrode.

7. The display panel according to claim 6, characterized in that: The touch signal lead includes: a first sub-lead and a second sub-lead electrically connected to the first sub-lead, and the first sub-lead and the second sub-lead are arranged in different layers.

8. The display panel according to claim 7, characterized in that: An orthographic projection of the first sub-lead on the substrate coincides with an orthographic projection of the second sub-lead on the substrate.

9. The display panel according to claim 7, characterized in that: The display panel further comprises: a first conductive layer, an insulating layer, and a second conductive layer which are stacked on the encapsulation layer in a direction perpendicular to and away from the encapsulation layer; The first conductive layer includes: the first sub-lead, the second conductive layer includes: the second sub-lead, the touch sensing electrode and the touch driving electrode, the insulating layer has a first via hole, and the first sub-lead and the second sub-lead are electrically connected through the first via hole.

10. The display panel according to claim 9, characterized in that: There are a plurality of touch drive electrodes, and the plurality of touch drive electrodes are arranged in a plurality of rows. The first conductive layer further comprises: a plurality of connection bridges, and the insulating layer further comprises a second via hole, and each of the connection bridges is connected to two adjacent touch drive electrodes in the same row through the second via hole; There are a plurality of touch sensing electrodes, which are arranged in a plurality of columns. The second conductive layer further comprises: a plurality of connecting electrodes, each of which is connected to two adjacent touch sensing electrodes in the same column.

11. The display panel according to claim 1, characterized in that: The display panel further includes: a touch signal line for connecting the touch unit and the touch signal lead; The orthographic projections of the touch control unit and the touch control signal line on the substrate are both located within the orthographic projection of the cathode on the substrate.

12. The display panel according to claim 1, characterized in that: The signal routing line further comprises: a power connection bus electrically connected to the second power signal lead, and the opening is also located in the power connection bus; The display panel further comprises: a power signal line located in the display area, and the power connection bus is respectively connected to the power signal line and the second power signal lead.

13. The display panel according to claim 12, characterized in that: The number of the first power signal leads and the number of the second power signal leads are both two, and the two second power signal leads are located between the two first power signal leads; The display panel also includes: a plurality of drive signal lines located in the display area, and a plurality of drive signal leads located in the non-display area, the plurality of drive signal lines are connected to the plurality of drive signal line leads in a one-to-one correspondence, and the plurality of drive signal leads are located between two of the second power signal leads.

14. The display panel according to claim 13, characterized in that: The first power signal lead, the power connection bus and the second power signal lead are arranged in the same layer and made of the same material; the first power signal lead and the drive signal lead are arranged in different layers.

15. The display panel according to any one of claims 1 to 14, characterized in that: Each of the retaining walls comprises: at least two stacked organic insulating layers, the display panel further comprises: a third conductive layer, the third conductive layer is located between two adjacent organic insulating layers in at least one of the retaining walls, and the third conductive layer comprises: the signal wiring.

16. The display panel according to claim 15, characterized in that: The at least one retaining wall comprises: a first retaining wall and a second retaining wall, wherein the second retaining wall is closer to the display area than the first retaining wall; The at least two organic insulating layers in the first barrier wall include: a first organic insulating layer, a second organic insulating layer and a pixel defining layer which are stacked; The at least two organic insulating layers in the second barrier wall include: the second organic insulating layer and the pixel defining layer stacked in layers; The third conductive layer is located between the first organic insulating layer and the second organic insulating layer, and the orthographic projection of the opening on the substrate is located within the orthographic projection of the first retaining wall on the substrate.

17. A method for manufacturing a display panel, characterized in that: include: Providing a substrate, the substrate having a display area and a non-display area located outside the display area; forming a light-emitting device, a packaging layer, at least one retaining wall and a signal wiring on the substrate; The light-emitting device is located in the display area, the at least one retaining wall and the signal wiring are both located in the non-display area, the signal wiring is electrically connected to the light-emitting device, and the signal wiring has an opening, and the orthographic projection of the opening on the substrate is located within the orthographic projection of the at least one retaining wall on the substrate; The light emitting device comprises: an anode, a light emitting layer and a cathode which are stacked, the signal wiring comprises: a first power signal lead electrically connected to the cathode, and a second power signal lead electrically connected to the anode, and the opening is located in the first power signal lead and / or the second power signal lead; The display panel further comprises: a touch control unit and a touch control signal lead located on a side of the encapsulation layer away from the substrate, wherein the touch control signal lead is connected to the touch control unit; Among them, the touch unit is located in the display area, the touch signal lead is located in the non-display area, at least part of the orthographic projection of the touch signal lead on the substrate is located within the orthographic projection of the first power signal lead on the substrate, and is staggered with the orthographic projection of the opening on the substrate.

18. A display device, characterized in that: include: Display panel and driver chip; The display panel comprises: the display panel according to any one of claims 1 to 16; Wherein, the driving chip is electrically connected to the signal wiring in the display panel.

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