power divider

By adjusting the air cavity height and dielectric thickness of the power divider, the problem of low power tolerance in microstrip power dividers was solved, achieving improved power tolerance and miniaturization design, and ensuring high efficiency and consistency in signal distribution.

CN115332754BActive Publication Date: 2026-03-03SHAANXI HAIJI INFORMATION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-08-23
Publication Date
2026-03-03

AI Technical Summary

Technical Problem

Existing microstrip power dividers have low power tolerance and cannot handle large power outputs.

Method used

By designing a power divider, including an input connector, a power dividing device, and multiple output connectors, and utilizing a stripline structure composed of a metal upper cover plate, a power dividing dielectric plate, and a metal lower cover plate, the height of the air cavity and the dielectric thickness are adjusted to improve the power withstand capability of the power divider.

Benefits of technology

The power divider's tolerance power has been increased, and its miniaturized design reduces its size while ensuring signal distribution loss and phase consistency.

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Abstract

The application relates to a power divider, which comprises an input connector, a power dividing device and a plurality of output connectors, the input connector and the plurality of output connectors are connected with the power dividing device respectively, the power dividing device comprises a metal upper cover plate, a power dividing medium plate and a metal lower cover plate, the power dividing medium plate is arranged between the metal upper cover plate and the metal lower cover plate; a plurality of first air cavities corresponding to the plurality of output connectors are arranged on the metal upper cover plate, the power dividing medium plate comprises a feeding point, a medium substrate and a power dividing network, the power dividing network and the feeding point are arranged on the medium substrate, a plurality of second air cavities corresponding to the plurality of first air cavities are arranged on the metal lower cover plate, and the inner core of the input connector is connected with the feeding point through the metal upper cover plate. In the embodiment of the application, the height of the first air cavity and the height of the second air cavity are changed, and the thickness of the air medium filled in the first air cavity and the second air cavity is changed, so that the tolerance power of the power divider is improved.
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Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and in particular to a power divider. Background Technology

[0002] A power divider is a device that can split the energy of one input signal into two or more outputs with equal or unequal energy, and plays an important role in antenna feeding networks.

[0003] Current power dividers mainly employ the principles of T-type or Wilkins power dividers to achieve microstrip power dividers. However, microstrip power dividers have low power tolerance and cannot handle large power loads. Therefore, how to provide a power divider with high power tolerance has become a key research issue for those skilled in the art. Summary of the Invention

[0004] Therefore, it is necessary to provide a power divider that can improve the power tolerance of the above-mentioned technical problems.

[0005] In a first aspect, this application provides a power divider, which includes an input connector, a power dividing device, and a plurality of output connectors. The input connector and the plurality of output connectors are respectively connected to the power dividing device. The power dividing device includes a metal upper cover plate, a power dividing medium plate, and a metal lower cover plate. The power dividing medium plate is disposed between the metal upper cover plate and the metal lower cover plate.

[0006] The metal upper cover plate is provided with a plurality of first air cavities corresponding to the plurality of output connectors. The power divider dielectric board includes a power feed point, a dielectric substrate and a power divider network. The power divider network and the power feed point are provided on the dielectric substrate. The metal lower cover plate is provided with a plurality of second air cavities corresponding to the plurality of first air cavities. The inner core of the input connector passes through the metal upper cover plate and is connected to the power feed point.

[0007] Wherein, the height of the first air cavity is greater than or equal to a first preset height threshold, and the height of the second air cavity is greater than or equal to a second preset height threshold.

[0008] In one embodiment, each of the first air cavities is equally spaced on the metal upper cover plate, and a first partition rib is provided between two adjacent first air cavities.

[0009] In one embodiment, each of the first air cavities includes a plurality of sub-air cavities, each of which has a different height.

[0010] In one embodiment, the height of each sub-air cavity is negatively correlated with the distance between the sub-air cavity and the center of the metal top cover.

[0011] In one embodiment, each of the second air cavities is equally spaced on the lower metal cover plate, and a second partition is provided between two adjacent second air cavities.

[0012] In one embodiment, the first rib and the second rib are fan-shaped;

[0013] The central angle of the first rib is close to the center of the metal upper cover plate, and the arc of the first rib is far away from the center of the metal upper cover plate;

[0014] The central angle of the second rib is close to the center of the lower metal cover plate, and the arc of the second rib is far from the center of the lower metal cover plate.

[0015] In one embodiment, the central angles of the first rib and the second rib are rounded.

[0016] In one embodiment, the thickness of the dielectric substrate is greater than or equal to a first preset thickness threshold.

[0017] In one embodiment, the power divider network is a network formed after covering the dielectric substrate with a metal layer, and the thickness of the metal layer is greater than or equal to a second preset thickness threshold.

[0018] In one embodiment, the dielectric substrate includes a first region dielectric substrate and a second region dielectric substrate. The first region dielectric substrate is circular, and the second region dielectric substrate includes a plurality of sub-dielectric substrates arranged at equal intervals along the radial direction of the first region dielectric substrate. The plurality of sub-dielectric substrates correspond one-to-one with the plurality of output connectors.

[0019] In one embodiment, the inner core of each output connector is connected to the power divider network on the corresponding sub-medium substrate, and the outer conductor of each output connector is disposed in the cavity formed by the corresponding second air cavity.

[0020] The aforementioned power divider includes an input connector, a power dividing device, and multiple output connectors. The input connector and the multiple output connectors are respectively connected to the power dividing device. The power dividing device includes a metal upper cover plate, a power dividing dielectric plate, and a metal lower cover plate. The power dividing dielectric plate is disposed between the metal upper cover plate and the metal lower cover plate. Multiple first air cavities, each corresponding to one of the multiple output connectors, are provided on the metal upper cover plate. The power dividing dielectric plate includes a feed point, a dielectric substrate, and a power dividing network. The dielectric substrate has the power dividing network and the feed point. Multiple second air cavities, each corresponding to one of the multiple first air cavities, are provided on the metal lower cover plate. The inner core of the input connector passes through the metal upper cover plate and connects to the feed point. The height of the first air cavity is greater than or equal to a first preset height threshold, and the height of the second air cavity is greater than or equal to a second preset height threshold. In this embodiment, by changing the height of the first air cavity and the height of the second air cavity, the thickness of the air medium filling the first and second air cavities is changed. The thicker the air medium, the wider the linewidth of the stripline under the same impedance, thereby improving the power tolerance of the power divider. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a power divider in one embodiment;

[0022] Figure 2 This is a schematic diagram of a first-view power divider in one embodiment;

[0023] Figure 3 This is a schematic diagram of a second-view power divider in one embodiment;

[0024] Figure 4 This is a schematic diagram of a third-view power divider in one embodiment;

[0025] Figure 5 This is a schematic diagram of a fourth-view power divider in one embodiment;

[0026] Figure 6 This is a schematic diagram of a fifth-view power divider in one embodiment;

[0027] Figure 7 This is a schematic diagram of a sixth-view power divider in one embodiment;

[0028] Figure 8 This is a schematic diagram of a seventh-view power divider in one embodiment;

[0029] Figure 9 This is a schematic diagram of an eighth-view power divider in one embodiment;

[0030] Figure 10 This is a schematic diagram of a metal top cover plate in one embodiment;

[0031] Figure 11 This is a schematic diagram of a metal lower cover plate in one embodiment;

[0032] Figure 12 This is a schematic diagram of a power divider plate in one embodiment;

[0033] Figure 13 This is a schematic diagram of a 1-to-6 power divider in one embodiment;

[0034] Figure 14 This is a schematic diagram of the power loss of a one-to-many power divider in one embodiment;

[0035] Figure 15 This is a schematic diagram of the output port phase of a one-to-many power divider in one embodiment;

[0036] Figure 16 This is a schematic diagram of the VSWR at the input port of a power divider in one embodiment.

[0037] Explanation of reference numerals in the attached figures:

[0038] 100. Power divider; 1. Input connector; 2. Power dividing device;

[0039] 3. Output connector; 21. Metal top cover; 22. Power divider board;

[0040] 23. Metal lower cover plate; 211. First air cavity; 221. Power supply point;

[0041] 222. Dielectric substrate; 223. Power divider network; 231. Second air cavity;

[0042] 212. First diaphragm; 2111. Sub-air cavity; 232. Second diaphragm;

[0043] 2221, First region dielectric substrate; 2222, Second region dielectric substrate. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0045] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0046] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise explicitly specified.

[0047] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0048] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0049] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0050] Figure 1 This is a schematic diagram of a power divider in one embodiment, such as... Figure 1 As shown, the power divider 100 includes an input connector 1, a power dividing device 2, and multiple output connectors 3. The input connector 1 and the multiple output connectors 3 are respectively connected to the power dividing device 2. The power dividing device 2 includes a metal upper cover plate, a power dividing dielectric plate, and a metal lower cover plate. The power dividing dielectric plate is disposed between the metal upper cover plate and the metal lower cover plate. The metal upper cover plate is provided with multiple first air cavities corresponding to the multiple output connectors 3. The power dividing dielectric plate includes a power feed point, a dielectric substrate, and a power dividing network. The dielectric substrate is provided with the power dividing network and the power feed point. The metal lower cover plate is provided with multiple second air cavities corresponding to the multiple first air cavities. The inner core of the input connector 1 passes through the metal upper cover plate and is connected to the power feed point. The height of the first air cavity is greater than or equal to a first preset height threshold, and the height of the second air cavity is greater than or equal to a second preset height threshold.

[0051] In this embodiment, the power divider 100 can be either circular or cuboid. From top to bottom, it comprises an input connector 1, a power divider device 2, and multiple output connectors 3. One end of the input connector 1 is connected to the power divider device 2, and the other end of the power divider device 2 is connected to one end of the output connector 3. The power divider device 2 includes a metal upper cover plate, a power divider dielectric plate, and a metal lower cover plate, which are fixedly connected by screws. Figures 2-9 The figures shown are schematic diagrams of the power divider from different perspectives.

[0052] Specifically, the upper metal cover plate is provided with multiple first air cavities corresponding one-to-one with the multiple output connectors 3, and the lower metal cover plate is provided with multiple second air cavities corresponding one-to-one with the multiple first air cavities. It should be noted that the multiple output connectors 3, the multiple first air cavities, and the multiple second air cavities are related to how many outputs the power divider 100 is divided into. When there are eight output connectors 3, eight first air cavities, and eight second air cavities, the power divider 100 is a 1-to-8 power divider. When there are sixteen output connectors 3, sixteen first air cavities, and sixteen second air cavities, the power divider 100 is a 1-to-16 power divider. This application embodiment does not impose any limitations on this.

[0053] Furthermore, the power divider dielectric board includes a power supply point, a dielectric substrate, and a power divider network. The power divider network and the power supply point are disposed on the dielectric substrate. The inner core of the input connector 1 passes through the metal top cover plate and connects to the power supply point to supply power to the power divider network. Power division is achieved through the power divider network, and output is achieved through the output connector 3.

[0054] Optionally, input connector 1 can be a coaxial converter, etc.

[0055] Optionally, the material of the dielectric substrate can be glass fiber, ceramic powder, or other filler materials, and the embodiments of this application do not limit this.

[0056] Optionally, the output connector 3 can be a crimp connector, solder connector, wrap connector, surface mount connector, etc., and this application embodiment does not limit this.

[0057] In this embodiment, a stripline power divider is constructed using a metal upper cover plate, a power divider network, and a metal lower cover plate. The stripline is a high-frequency transmission wire (i.e., a power divider network) placed between two parallel ground planes or power planes (i.e., the metal upper cover plate and the metal lower cover plate) and a dielectric material. Optionally, air is filled between the first air cavity of the metal upper cover plate and the second air cavity of the metal lower cover plate. The thickness of the filled air medium can be adjusted by adjusting the height of the first air cavity and the height of the second air cavity.

[0058] In existing technologies, when implementing a 1-to-2 power divider, the input signal is first divided into two equal parts according to the principle of a 1-to-2 power divider. Then, each output signal is used as a new input signal, and the same principle is applied again. Therefore, implementing a 1-to-2 power divider requires combining multiple 1-to-2 power dividers, resulting in a large power divider size. This method can directly output a single input signal into multiple outputs, thus miniaturizing the power divider.

[0059] This application provides a power divider, which includes an input connector, a power dividing device, and multiple output connectors. The input connector and the multiple output connectors are respectively connected to the power dividing device. The power dividing device includes a metal upper cover plate, a power dividing dielectric plate, and a metal lower cover plate. The power dividing dielectric plate is disposed between the metal upper cover plate and the metal lower cover plate. The metal upper cover plate has multiple first air cavities corresponding to the multiple output connectors. The power dividing dielectric plate includes a feed point, a dielectric substrate, and a power dividing network. The dielectric substrate has a power dividing network and a feed point. The metal lower cover plate has multiple second air cavities corresponding to the multiple first air cavities. The inner core of the input connector passes through the metal upper cover plate and connects to the feed point. The height of the first air cavity is greater than or equal to a first preset height threshold, and the height of the second air cavity is greater than or equal to a second preset height threshold. In this application embodiment, by changing the height of the first air cavity and the height of the second air cavity, the thickness of the air dielectric filling the first air cavity and the second air cavity is changed. The thicker the air dielectric, the wider the linewidth of the stripline under the same impedance, thereby improving the power withstand capability of the power divider.

[0060] Figure 10 This is a schematic diagram of a metal top cover plate in one embodiment, as shown below. Figure 10 As shown, each first air cavity 211 is equally spaced on the metal upper cover plate 21, and a first partition 212 is provided between two adjacent first air cavities 211.

[0061] In the embodiments of this application, such as Figure 10 As shown, a first partition 212 is provided between two adjacent first air cavities 211. Optionally, the first air cavity 211 may include multiple sub-air cavities 2111, or the first air cavity 211 may be just one air cavity.

[0062] Furthermore, each first air cavity 211 includes multiple sub-air cavities 2111, each with a different height. The height of each sub-air cavity 2111 is negatively correlated with the distance between the sub-air cavity 2111 and the center of the metal upper cover plate 21.

[0063] In this embodiment, when the first air cavity 211 includes multiple sub-air cavities 2111, multi-stage impedance matching is performed. Due to the need to meet the requirements of high power and to ensure the line width, the impedance of the first-order impedance matching section is relatively high, so a higher dielectric thickness and a lower dielectric constant are required. Therefore, the height of the sub-air cavity 2111 closest to the center of the metal cover plate 21 is set to the highest, and the height of the sub-air cavity 2111 further away from the center of the metal cover plate 21 is lower.

[0064] Figure 11 This is a schematic diagram of a metal lower cover plate in one embodiment, as shown below. Figure 11As shown, each second air cavity 231 is equally spaced on the metal lower cover plate 23, and a second partition 232 is provided between two adjacent second air cavities 231.

[0065] In this application embodiment, in conjunction with the above Figure 10 Each second air cavity 231 corresponds to each first air cavity 211 and is equally spaced on the lower metal cover plate 23, with a second partition 232 between adjacent second air cavities 231. Each second air cavity 231 mainly works with each first air cavity 211 to adjust the linewidth of the air strip.

[0066] As mentioned above Figure 10 and Figure 11 The first partition 212 and the second partition 232 are fan-shaped. The central angle of the first partition 212 is close to the center of the upper metal cover plate 21, and the arc of the first partition 212 is far from the center of the upper metal cover plate 21. The central angle of the second partition 232 is close to the center of the lower metal cover plate 23, and the arc of the second partition 232 is far from the center of the lower metal cover plate 23. The central angles of the first partition 212 and the second partition 232 are rounded.

[0067] In the embodiments of this application, as described above Figure 10 and Figure 11 As shown, the first partition 212 and the second partition 232 are shaped like a fan. The arc of the first partition 212 is far from the center of the metal upper cover plate 21, and the central angle of the first partition 212 is close to the center of the metal upper cover plate 21. The central angle of the second partition 232 is close to the center of the metal lower cover plate 23, and the arc of the second partition 232 is far from the center of the metal lower cover plate 23. The central angles of the first partition 212 and the second partition 232 may be acute angles or right angles, depending on the number of the first air cavities 211 and the second air cavities 231.

[0068] In this embodiment of the application, in order to prevent internal arcing of the power divider under high power conditions and damage to the power divider network, the central angle of the first partition 212 and the central angle of the second partition 232 are set as rounded corners.

[0069] Figure 12 This is a schematic diagram of a power divider dielectric substrate in one embodiment, as shown below. Figure 12 As shown, the thickness of the dielectric substrate 222 is greater than or equal to the first preset thickness threshold.

[0070] In this embodiment, the power divider dielectric substrate 22 includes a feed point 221, a dielectric substrate 222, and a power divider network 223. The thicker the dielectric substrate 222, the lower the effective dielectric constant. The lower the dielectric constant, the wider the linewidth of the stripline under the same impedance, thereby improving the power withstand capability of the power divider.

[0071] In one embodiment, as described above Figure 12 For example, the power divider network 223 is a network formed after covering a metal layer on the dielectric substrate 222, and the thickness of the metal layer is greater than or equal to a second preset thickness threshold. The dielectric substrate 222 includes a first region dielectric substrate 2221 and a second region dielectric substrate 2222. The first region dielectric substrate 2221 is circular, and the second region dielectric substrate 2222 includes a plurality of sub-dielectric substrates arranged at equal intervals along the radial direction of the first region dielectric substrate 2221. The plurality of sub-dielectric substrates correspond one-to-one with a plurality of output connectors.

[0072] In this embodiment, the power divider network 223 is a network formed after covering the dielectric substrate 222 with a metal layer. Optionally, the metal layer can be copper wire and immersion gold, or copper wire and immersion copper, etc., as long as the thickness of the metal layer is greater than or equal to the second preset thickness threshold. Increasing the thickness of the metal layer improves the thermal conductivity of the power divider, thereby increasing the power withstand capability of the power divider. Optionally, the second preset thickness threshold can be 0.1 mm, 0.2 mm, etc.

[0073] Furthermore, the dielectric substrate 222 includes a first region dielectric substrate 2221 and a second region dielectric substrate 2222, such as Figure 12 As shown, the first region dielectric substrate 2221 is the central circular portion, and the second region dielectric substrate 2222 includes a plurality of sub-dielectric substrates arranged at equal intervals along the radial direction of the first region dielectric substrate 2221. The shapes of the plurality of sub-dielectric substrates are consistent with the shapes of the first air cavity and the second air cavity. When the dielectric substrate 222 is fixedly connected to the metal upper cover plate and the metal lower cover plate, the metal upper cover plate, the sub-dielectric substrates, and the metal lower cover plate are fixedly connected by screws. It should be noted that the sub-dielectric substrates 2221 of the first region and the sub-dielectric substrates 2222 of the second region are dielectric substrates of the same material and type.

[0074] In one embodiment, in conjunction with the above Figure 1 , Figure 11 and Figure 12 As shown, the inner core of each output connector 3 is connected to the power divider network 223 on the corresponding sub-medium substrate, and the outer conductor of each output connector 3 is disposed in the cavity formed by the corresponding second air cavity 231.

[0075] In this embodiment, the inner core of each output connector 3 can be soldered to the power divider network 223 on the corresponding sub-medium substrate, and the outer conductor of each output connector 3 can be disposed in the cavity formed by the corresponding second air cavity 231, so that the signal after being equally divided by the power divider network 223 can be output through the output connector 3.

[0076] Figure 13 Here is a schematic diagram of a 1 to 16 power divider in one embodiment, as follows: Figure 13As shown in the figure, the center impedance of the input port is 50 ohms. This means that the impedance of the 16 ports connected in parallel needs to reach 50 ohms. According to the parallel characteristics of resistors, the impedance of each port can be calculated to be 800Ω. Then, each path is impedance matched according to the quarter impedance matching principle. The characteristic impedance is 200 ohms when performing the first-stage impedance matching and 35 ohms when performing the second-stage impedance matching. Finally, the output signal has an impedance of 50 ohms.

[0077] Figure 14 This is a schematic diagram of the power loss of a one-to-many power divider in one embodiment, as shown below. Figure 14 As shown in the figure, the power loss of a 1-to-2 power divider, a 1-to-3 power divider, and up to a 1-to-16 power divider are represented respectively. It can be seen from the figure that the loss value is between 12.15dB and 12.26dB. Therefore, the insertion loss of 16 ports is ≤0.3dB, and the power distribution loss of a 1-to-16 power divider is 12dB. The amplitude consistency is within ±0.3dB.

[0078] Figure 15 This is a schematic diagram of the output port phase of a one-to-many power divider in one embodiment, as shown below. Figure 15 As shown, this also includes the phase consistency of the output ports of different power dividers, from 1 to 2, 1 to 3, up to 1 to 16. As can be seen from the figure, the phase range is between 41.28° and 41.88°, with a difference of 0.6°. Therefore, the phase consistency of the 16 ports of the power divider is within ±3°.

[0079] Figure 16 This is a schematic diagram of the input port VSWR of a power divider in one embodiment, as shown below. Figure 16 As shown in the figure, the horizontal axis represents frequency and the vertical axis represents standing wave ratio (VSWR). When the VSWR of the input port of the power divider is ≤1.1:1 within the designed frequency band, the return loss is small, which can reduce heat generation. It can be seen from the figure that the operating frequency of the power divider is approximately between 3.7GHz and 3.8GHz to meet the requirements.

[0080] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A power divider, characterized in that, The power divider includes an input connector, a power dividing device, and multiple output connectors. The input connector and the multiple output connectors are respectively connected to the power dividing device. The power dividing device includes a metal upper cover plate, a power dividing medium plate, and a metal lower cover plate. The power dividing medium plate is disposed between the metal upper cover plate and the metal lower cover plate. The metal upper cover plate is provided with a plurality of first air cavities corresponding to the plurality of output connectors. The power divider dielectric board includes a power feed point, a dielectric substrate and a power divider network. The power divider network and the power feed point are provided on the dielectric substrate. The metal lower cover plate is provided with a plurality of second air cavities corresponding to the plurality of first air cavities. The inner core of the input connector passes through the metal upper cover plate and is connected to the power feed point. The height of the first air cavity is greater than or equal to a first preset height threshold, and the height of the second air cavity is greater than or equal to a second preset height threshold. Each of the second air cavities is equally spaced on the lower metal cover plate, and a second partition rib is provided between adjacent second air cavities. The central angle of the second partition rib is close to the center of the lower metal cover plate, and the arc of the second partition rib is far from the center of the lower metal cover plate; the central angle of the second partition rib is rounded. The dielectric substrate includes a first region dielectric substrate and a second region dielectric substrate. The first region dielectric substrate is circular, and the second region dielectric substrate includes a plurality of sub-dielectric substrates equally spaced radially from the first region dielectric substrate. Each of the plurality of sub-dielectric substrates corresponds one-to-one with the plurality of output connectors.

2. The power divider according to claim 1, characterized in that, Each of the first air cavities is equally spaced on the metal upper cover plate, and a first partition rib is provided between two adjacent first air cavities.

3. The power divider according to claim 2, characterized in that, Each of the first air cavities includes multiple sub-air cavities, and each sub-air cavity has a different height.

4. The power divider according to claim 3, characterized in that, The height of each sub-air cavity is negatively correlated with the distance between the sub-air cavity and the center of the metal top cover.

5. The power divider according to claim 2, characterized in that, The first and second ribs are fan-shaped; The central angle of the first rib is close to the center of the metal top cover plate, and the arc of the first rib is far away from the center of the metal top cover plate.

6. The power divider according to claim 5, characterized in that, The central angle of the first rib is rounded.

7. The power divider according to claim 1, characterized in that, The thickness of the dielectric substrate is greater than or equal to a first preset thickness threshold.

8. The power divider according to claim 1, characterized in that, The inner core of each output connector is connected to the power divider network on the corresponding sub-medium substrate, and the outer conductor of each output connector is disposed in the cavity formed by the corresponding second air cavity.

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