Intelligent refrigerant distribution unit for data center cooling systems

By combining an intelligent refrigerant distribution unit with R2RHX, the cooling problem of high heat density computing equipment in data centers is solved, achieving efficient and low-corrosion heat removal, which is suitable for the cooling needs of edge data centers.

CN115348795BActive Publication Date: 2026-06-05NVIDIA CORP
View PDF 2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NVIDIA CORP
Filing Date
2022-04-25
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Existing data center cooling systems struggle to efficiently handle the high heat density demands of computing components. In particular, in high heat density computing devices, the high-speed flow of coolant can lead to corrosion and erosion of cold plates. Traditional cooling systems cannot economically meet the changing cooling requirements.

Method used

The intelligent refrigerant distribution unit (RDU) is used to achieve efficient heat removal by using two refrigerant cooling circuits through the R2RHX interface between the refrigerant cooling circuits. Combined with the subcooler and flow controller, it ensures stable flow of refrigerant in the cold plate and reduces the risk of corrosion.

Benefits of technology

It achieves efficient and low-power heat removal in high heat density computing devices, reduces cold plate corrosion, supports the cooling needs of edge data centers, avoids the shortcomings of traditional systems, and provides higher density cooling capacity.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN115348795B_ABST
    Figure CN115348795B_ABST
Patent Text Reader

Abstract

Intelligent refrigerant distribution units for data center cooling systems are disclosed, specifically systems and methods for cooling a data center are disclosed. In at least one embodiment, a refrigerant distribution unit (RDU) distributes a first refrigerant from a refrigerant reservoir to one or more cold plates to extract heat from at least one computing device and also interfaces between a first refrigerant cooling loop having the first refrigerant and a second refrigerant cooling loop such that the second refrigerant cooling loop dissipates at least a portion of such heat to an ambient environment using a second refrigerant through a second condenser unit.
Need to check novelty before this filing date? Find Prior Art