Substrate manufacturing apparatus and method for substrate manufacturing

Abstract

The disclosed manufacturing method includes a process of forming a solder pre-coating (2) on a pad (1b), a process of holding a substrate (1) with a first substrate holding portion and obtaining height position information PH1 related to the height position of the upper surface of the solder pre-coating (2) and height position information SH1 related to the height position of the upper surface of the substrate (1), a process of holding a substrate (1) with a second substrate holding portion and obtaining height position information SH2 related to the height position of the upper surface of the substrate (1), a process of mounting an electronic component (4) on the solder pre-coating (2) of the substrate (1) held by the second substrate holding portion, and a process of calculating a target height position used when mounting the electronic component (4) on the solder pre-coating (2) using the height position information PH1, height position information SH1 and height position information SH2.

Description

Technical Field

[0001] This invention relates to an apparatus for manufacturing a mounting substrate and a method for manufacturing a mounting substrate. Background Technology

[0002] There are known electronic component mounting methods that manufacture electronic component mounting substrates by soldering electronic components onto a substrate (e.g., Patent Document 1). The method in Patent Document 1 includes a process of printing solder paste and a process of placing electronic components on the solder paste and performing reflow soldering. However, such methods cannot handle high-density mounting. Therefore, in recent years, methods for pre-forming solder coatings on the pads of the substrate on which electronic components are placed (solder pre-coating method) have once again attracted attention (e.g., Patent Document 2). The formed solder coating is sometimes referred to as a "solder pre-coating layer".

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-243222

[0006] Patent Document 2: Japanese Patent Application Publication No. 2018-167297 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] Manufacturers of electronic component mounting substrates (ECS) who wish to manufacture ECS using the solder pre-coating method require substrates pre-coated with solder. There are two methods for obtaining this: either procuring pre-coated substrates externally or preparing them in-house. However, procuring externally increases the manufacturing cost of the ECS. Furthermore, it makes it difficult to quickly respond to design changes to the ECS.

[0009] On the other hand, it is not impossible to use the mounting lines of the electronic component mounting substrate for the formation of solder pre-coating when preparing it independently. However, in this case, it would be necessary to change the mounting line settings when forming the solder pre-coating and when manufacturing the electronic component mounting substrate, thus complicating the application and making it impractical.

[0010] Furthermore, when mounting electronic components onto a substrate, the aim is to accurately mount the electronic components onto the substrate with a good yield. On the other hand, due to the miniaturization of electronic components, it is difficult to accurately mount electronic components onto the substrate with a good yield.

[0011] Under such circumstances, one of the objectives of the present invention is to provide a mounting substrate manufacturing apparatus and a mounting substrate manufacturing method that can continuously perform the process from the formation of solder pre-coating to the soldering of electronic components onto a substrate, and can accurately mount electronic components onto the substrate with a good yield.

[0012] Solution for solving the problem

[0013] One aspect of the present invention relates to a mounting substrate manufacturing apparatus. This manufacturing apparatus is for manufacturing mounting substrates including a substrate having pads and electronic components soldered to the pads, wherein the mounting substrate manufacturing apparatus includes: a substrate transport line for transporting the substrate having the pads; a solder pre-coating forming section for forming a solder pre-coating on the pads; a first substrate holding section for holding the substrate transported from the solder pre-coating forming section by the substrate transport line; a first height position measuring section for obtaining height position information PH1 related to the height position of the upper surface of the solder pre-coating and height position information SH1 related to the height position of the upper surface of the substrate by measuring the first height position of the substrate held by the first substrate holding section; and a second substrate holding section for holding the substrate transported from the first substrate holding section by the substrate transport line. The substrate is held; a second height position measuring unit obtains height position information SH2 related to the height position of the upper surface of the substrate held by the second substrate holding unit through the second height position measuring; an electronic component mounting unit uses a component holding tool to mount the electronic component onto the solder pre-coating layer of the substrate held by the second substrate holding unit; and a calculation unit uses the height position information PH1, the height position information SH1, and the height position information SH2 to calculate the target height position of the component holding tool holding the electronic component when it descends toward the substrate to mount the electronic component onto the solder pre-coating layer, and the electronic component mounting unit controls the lifting and lowering action of the component holding tool based on the target height position to mount the electronic component onto the solder pre-coating layer.

[0014] Another aspect of the present invention relates to a mounting substrate manufacturing apparatus. This manufacturing apparatus is for manufacturing mounting substrates including a substrate having pads and electronic components soldered to the pads, wherein the mounting substrate manufacturing apparatus includes: a substrate transport line for transporting the substrate having the pads; a solder pre-coating forming section for forming a solder pre-coating on the pads; a substrate holding section for holding the substrate transported from the solder pre-coating forming section by the substrate transport line; and a height position measuring section for measuring the height of the substrate held by the substrate holding section relative to the upper surface of the solder pre-coating. The system includes: height position information PH2 related to the degree position; an electronic component mounting unit that uses a component holding tool to mount the electronic component onto the solder pre-coating layer of the substrate held by the substrate holding unit; and a calculation unit that uses the height position information PH2 to calculate the target height position of the component holding tool, which holds the electronic component, when it descends toward the substrate to mount the electronic component onto the solder pre-coating layer, and the electronic component mounting unit controls the lifting and lowering action of the component holding tool based on the target height position to mount the electronic component onto the solder pre-coating layer.

[0015] Another aspect of the present invention relates to a method for manufacturing a mounting substrate. This manufacturing method is for manufacturing a mounting substrate including a substrate having pads and electronic components soldered to the pads, wherein the method sequentially includes: a solder pre-coating forming step, in which a solder pre-coating is formed on the pads; a first height position measurement step, in which, while the substrate having the solder pre-coating is held by a first substrate holding portion, height position information PH1 related to the height position of the upper surface of the solder pre-coating and height position information SH1 related to the height position of the upper surface of the substrate are obtained by first height position measurement; and a second height position measurement step, in which, while the substrate having undergone the first height position measurement step is held by a second substrate holding portion, height position information SH1 related to the height position of the upper surface of the substrate is obtained by second height position measurement. The system includes a height position information SH2 related to the height position of the upper surface of the substrate; and an electronic component mounting process, in which an electronic component mounting process is performed, in which a component holding tool is used to mount the electronic component onto the solder pre-coating layer of the substrate held by the second substrate holding part. Between the second height position measurement process and the electronic component mounting process, a calculation process is also included, in which the target height position of the component holding tool holding the electronic component when it descends toward the substrate in order to mount the electronic component onto the solder pre-coating layer is calculated using the height position information PH1, the height position information SH1, and the height position information SH2. In the electronic component mounting process, the lifting and lowering movement of the component holding tool is controlled based on the target height position calculated in the calculation process to mount the electronic component onto the solder pre-coating layer.

[0016] Another aspect of the present invention relates to a method for manufacturing a mounting substrate. This method is for manufacturing a mounting substrate comprising a substrate having pads and electronic components soldered to the pads, wherein the method sequentially includes: a solder pre-coating forming step, in which a solder pre-coating is formed on the pads; a height position measurement step, in which height position information PH2 related to the height position of the upper surface of the solder pre-coating is obtained by height position measurement while the substrate having the solder pre-coating is held by a substrate holding portion; and an electronic component mounting step, in which the electronic component is mounted... In the process, a component holding tool is used to mount the electronic component onto the solder pre-coating of the substrate held by the substrate holding part. Between the height position measurement step and the electronic component mounting step, a calculation step is also included. In this calculation step, the target height position of the component holding tool holding the electronic component as it descends toward the substrate to mount the electronic component onto the solder pre-coating is calculated using the height position information PH2. In the electronic component mounting step, the lifting and lowering movement of the component holding tool is controlled based on the target height position to mount the electronic component onto the solder pre-coating.

[0017] Invention Effects

[0018] According to the mounting substrate manufacturing apparatus and mounting substrate manufacturing method of the present invention, the processes from the formation of solder pre-coating to the soldering of electronic components onto the substrate can be performed continuously.

[0019] The novel features of the invention are described in the appended technical solutions. Both the structure and content of the invention, together with other objects and features of the invention, can be further fully understood by referring to the following detailed description of the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a diagram schematically illustrating the structure of the mounting substrate manufacturing apparatus according to Embodiment 1.

[0021] Figure 2 It is shown schematically. Figure 1 A diagram showing an example of the control system of the substrate manufacturing apparatus.

[0022] Figure 3 It is shown schematically. Figure 1 A diagram showing an example of the structure of the solder pre-coating forming section included in the device.

[0023] Figure 4 It is shown schematically. Figure 3 A diagram showing a portion of the solder pre-coating formation area.

[0024] Figure 5 This is a schematic diagram illustrating a step of a method for applying solder paste to a substrate using the apparatus of this embodiment.

[0025] Figure 6A This is a cross-sectional view schematically illustrating a step in the process of forming a solder pre-coating using the apparatus of Embodiment 1.

[0026] Figure 6B It is an illustrative representation of what follows. Figure 6A The diagram shows a sectional view of one step of the process.

[0027] Figure 6C It is an illustrative representation of what follows. Figure 6B The diagram shows a sectional view of one step of the process.

[0028] Figure 6D It is an illustrative representation of what follows. Figure 6C The diagram shows a sectional view of one step of the process.

[0029] Figure 7 It is shown schematically. Figure 1 The diagram shows an example of a solder pre-coating inspection device included in the apparatus shown.

[0030] Figure 8 This is a flowchart illustrating an example of a process in a solder pre-coating inspection apparatus.

[0031] Figure 9A This is a schematic diagram illustrating one step of an example of a method for holding a substrate in a solder pre-coating inspection apparatus.

[0032] Figure 9B It is an illustrative representation of what follows. Figure 9A The diagram shows the steps performed one by one.

[0033] Figure 10 It is a top view schematically showing the measurement positions, etc., in the solder pre-coating inspection device.

[0034] Figure 11 This is a schematic diagram illustrating the height position measurement in a solder pre-coating inspection device.

[0035] Figure 12 It is shown schematically. Figure 1 The diagram shows an example of an electronic component mounting device included in the illustrated apparatus.

[0036] Figure 13 It is shown Figure 12 A flowchart illustrating an example of a process in the electronic component mounting device shown.

[0037] Figure 14 It is shown schematically in Figure 12 The diagram shows an example of the process of mounting electronic components in the electronic component mounting device.

[0038] Figure 15A This is a cross-sectional view schematically illustrating one step of a process in manufacturing a mounting substrate in the manufacturing apparatus of Embodiment 1.

[0039] Figure 15B It is an illustrative representation of what follows. Figure 15A The diagram shows a sectional view of one step of the process.

[0040] Figure 15C It is an illustrative representation of what follows. Figure 15B The diagram shows a sectional view of one step of the process.

[0041] Figure 15D It is an illustrative representation of what follows. Figure 15C The diagram shows a sectional view of one step of the process.

[0042] Figure 15E It is an illustrative representation of what follows. Figure 15D The diagram shows a sectional view of one step of the process.

[0043] Figure 16 This is a flowchart illustrating an example of a process in the electronic component mounting device included in the manufacturing apparatus of Embodiment 2.

[0044] Figure 17 This is a schematic diagram illustrating the height position measurement in the electronic component mounting device included in the manufacturing apparatus of Embodiment 2.

[0045] Figure 18 This is a schematic diagram illustrating an example of the process of mounting electronic components in the electronic component mounting device included in the manufacturing apparatus of Embodiment 2. Detailed Implementation

[0046] The following examples illustrate embodiments of the present invention. It should be noted that the present invention is not limited to the examples described below. In this specification, "height position" refers to the coordinate position when the vertical direction is used as the coordinate axis. "Height position" can also be expressed as the relative height to a reference height position.

[0047] (Installation substrate manufacturing apparatus)

[0048] The manufacturing apparatus of this embodiment is an apparatus for manufacturing a mounting substrate on which multiple electronic components are mounted. The mounting substrate is a substrate on which electronic components are mounted. That is, the manufacturing apparatus of this embodiment is an electronic component mounting substrate manufacturing apparatus. Hereinafter, two examples of the manufacturing apparatus of this embodiment will be described. These two examples are sometimes referred to as "manufacturing apparatus (D1)" and "manufacturing apparatus (D2)".

[0049] (Manufacturing Unit (D1))

[0050] Manufacturing apparatus (D1) is an apparatus for manufacturing mounting substrates including a substrate having pads and electronic components soldered to the pads. Manufacturing apparatus (D1) includes: a substrate transport line that transports a substrate having pads; a solder pre-coating forming section that forms a solder pre-coating on the pads; a first substrate holding section that holds a substrate transported from the solder pre-coating forming section by the substrate transport line; a first height position measuring section that obtains height position information PH1 related to the height position of the upper surface of the solder pre-coating and height position information SH1 related to the height position of the upper surface of the substrate by measuring the first height position of the substrate held by the first substrate holding section; and a second substrate holding section that holds a substrate transported from the first substrate holding section by the substrate transport line. The system includes: a substrate holding unit; a second height position measuring unit that obtains height position information SH2 related to the height position of the upper surface of the substrate held by the second substrate holding unit; an electronic component mounting unit that uses a component holding tool to mount an electronic component onto the solder pre-coating layer of the substrate held by the second substrate holding unit; and a calculation unit that uses height position information PH1, height position information SH1, and height position information SH2 to calculate the target height position of the component holding tool, which holds the electronic component, as it descends toward the substrate to mount the electronic component onto the solder pre-coating layer. The electronic component mounting unit controls the lifting and lowering movement of the component holding tool based on the target height position and mounts the electronic component onto the solder pre-coating layer.

[0051] Using the manufacturing apparatus (D1), the process from forming solder pre-coating to mounting electronic components onto the substrate can be performed continuously, and the electronic components can be accurately mounted onto the substrate with a good yield.

[0052] Hereinafter, the terms "upstream side" and "downstream side" will sometimes be used depending on the direction in which the substrate is transported. The substrate is transported from the upstream side to the downstream side, during which solder pre-coating is formed and electronic components are mounted. From the upstream side to the downstream side, a solder paste supply unit, a heating unit, a solder flux coating unit, an electronic component mounting unit, and a reflow soldering unit are arranged sequentially. The first substrate holding unit and the first height position measuring unit may be disposed between the heating unit and the solder flux coating unit (described later), or they may be included in other structural units. For example, the first substrate holding unit and the first height position measuring unit may be assembled in a solder pre-coating inspection device (described later), or they may be assembled in the solder flux coating unit.

[0053] A substrate is a substrate for mounting electronic components. The substrate has wiring portions for soldering electronic components. For example, the substrate may have portions called solder pads for soldering electronic components. The substrate is not particularly limited and may be any known substrate for mounting electronic components.

[0054] The first substrate holding portion and the second substrate holding portion preferably have the same structure. By making them have the same structure, the height position information measured by the first substrate holding portion can be used with good accuracy as the height position information of the substrate held by the second substrate holding portion.

[0055] Alternatively, the manufacturing apparatus (D1) may further include a height position measurement information storage unit that stores height position information PH1 and height position information SH1 obtained from the first height position measurement unit. In this case, the calculation unit can also read the height position information PH1 and height position information SH1 from the height position measurement information storage unit. With this structure, the height position information obtained based on the measurement of the first height position measurement unit can be reliably transmitted to the calculation unit.

[0056] Alternatively, identification information for individual substrate identification may be marked on the substrate. Furthermore, the first height position measuring unit may store the height position information PH1 and SH1 obtained through the first height position measurement along with the identification information in the height position measuring information storage unit. Alternatively, the calculation unit may read the identification information, height position information PH1, and height position information SH1 from the height position measuring information storage unit. With this structure, appropriate height position information PH1 and height position information SH1 can be reliably transmitted to the calculation unit.

[0057] Alternatively, the solder pre-coating forming section may include: a solder paste supply section that supplies solder paste to the pads; and a heating section that heats the solder paste, thereby forming a solder pre-coating on the pads. According to this structure, the solder pre-coating is formed using solder paste, thus reducing the manufacturing cost of the mounting substrate.

[0058] In a typical example, the solder pre-coating has solder paste residue on its surface. In this case, a first height position measuring unit may measure the height of the upper surface of the residue. In this configuration, the solder pre-coating covered by the residue is measured using the first height position measuring unit. This eliminates the need for equipment to remove residue from the surface of the solder pre-coating, simplifying the mounting substrate manufacturing apparatus and the mounting substrate manufacturing process.

[0059] Flux residue is obtained by modifying and hardening the flux in solder paste through heating. Unlike the flux before hardening, the residue has low light transmittance. Therefore, the surface elevation of the residue can be accurately measured optically compared to the flux before hardening.

[0060] In the typical installation of electronic components, flux residue is preferably removed by cleaning or the like. However, this requires a cleaning process using a cleaning device, and sometimes a drying process using a drying device. Therefore, when cleaning flux residue, the installation system for electronic components becomes long and complex. Furthermore, the time required for installing electronic components increases. In the manufacturing apparatus of this embodiment and the manufacturing method (M) of this embodiment described later, electronic components can be installed without removing flux residue. Therefore, the apparatus and processes required for removing flux residue can be omitted.

[0061] Alternatively, the manufacturing apparatus (D1) may also include a solder flux coating section disposed between the first substrate holding section and the second substrate holding section. This solder flux coating section applies solder flux to the solder pre-coating layer of the substrate. Alternatively, a second height position measuring section may perform a second height position measurement on the portion of the substrate not covered by the solder flux, thereby obtaining height position information SH2. With this structure, since the surface of the substrate not covered by the solder flux is measured, accurate measurement can be performed.

[0062] (Manufacturing Unit (D2))

[0063] The manufacturing apparatus (D2) is an apparatus for manufacturing a mounting substrate including a substrate with pads and electronic components soldered to the pads. The manufacturing apparatus (D2) includes: a substrate transport line that transports the substrate with pads; a solder pre-coating forming section that forms a solder pre-coating on the pads; a substrate holding section that holds the substrate transported from the solder pre-coating forming section by the substrate transport line; a height position measuring section that obtains height position information PH2 related to the height position of the upper surface of the solder pre-coating for the substrate held by the substrate holding section; an electronic component mounting section that uses a component holding tool to mount electronic components onto the solder pre-coating of the substrate held by the substrate holding section; and a calculation section that uses the height position information PH2 to calculate a target height position when the component holding tool, holding the electronic components, descends toward the substrate to mount the electronic components onto the solder pre-coating. The electronic component mounting section controls the lifting and lowering movement of the component holding tool based on the target height position to mount the electronic components onto the solder pre-coating.

[0064] The manufacturing apparatus (D2) can be implemented using part or all of the structure of the manufacturing apparatus (D1), therefore repeated descriptions are sometimes omitted. The same effects as those of the manufacturing apparatus (D1) can be obtained using the manufacturing apparatus (D2).

[0065] Alternatively, the manufacturing apparatus (D2) may also include a solder flux coating section disposed between the solder pre-coating section and the substrate holding section. Alternatively, the solder flux coating section may coat the solder pre-coating layer on the substrate with solder flux. A height position measuring section measures the height position of the solder pre-coating layer covered by the solder flux, thereby obtaining height position information PH2. In this case, the height position measuring section may also use a laser for height position measurement.

[0066] (Substrate manufacturing method)

[0067] The manufacturing method of this embodiment is a method for manufacturing a mounting substrate on which multiple electronic components are mounted. Hereinafter, two examples of the manufacturing method of this embodiment will be described. These two examples are sometimes referred to as "manufacturing method (M1)" and "manufacturing method (M2)". Manufacturing method (M1) and manufacturing method (M2) are methods corresponding to manufacturing apparatus (D1) and manufacturing apparatus (D2), respectively; therefore, repeated descriptions are sometimes omitted. According to manufacturing method (M1) and manufacturing method (M2), the same effects as those of manufacturing apparatus (D1) and manufacturing apparatus (D2) can be obtained.

[0068] (Manufacturing Method (M1))

[0069] Manufacturing method (M1) is a method for manufacturing a mounting substrate including a substrate with pads and mounting substrates for electronic components soldered to the pads. Manufacturing method (M1) sequentially includes: a solder pre-coating forming step, in which a solder pre-coating is formed on the pads; a first height position measurement step, in which height position information PH1 related to the height position of the upper surface of the solder pre-coating and height position information SH1 related to the height position of the upper surface of the substrate are obtained by first height position measurement while the substrate with the solder pre-coating is held by a first substrate holding portion; a second height position measurement step, in which height position information SH2 related to the height position of the upper surface of the substrate is obtained by second height position measurement while the substrate having undergone the first height position measurement step is held by a second substrate holding portion; and an electronic component mounting step, in which an electronic component is mounted on the solder pre-coating of the substrate held by the second substrate holding portion using a component holding tool. Between the second height position measurement process and the electronic component mounting process, there is also a calculation process. In this calculation process, the target height position of the component holding tool holding the electronic component when it descends toward the substrate in order to mount the electronic component on the solder pre-coating is calculated using the height position information PH1, height position information SH1, and height position information SH2. In the electronic component mounting process, the lifting and lowering movement of the component holding tool is controlled based on the target height position calculated in the calculation process to mount the electronic component on the solder pre-coating.

[0070] Alternatively, the manufacturing method (M1) may further include a height position information storage step, in which height position information PH1 and height position information SH1 obtained from the first height position measurement step are stored in a height position measurement information storage unit. In this case, height position information PH1 and height position information SH1 may also be read from the height position measurement information storage unit during the calculation step.

[0071] In the manufacturing method (M1), identification information for individually identifying the substrate may be marked on the substrate. In this case, the height position information PH1 and height position information SH1 obtained by the first height position measurement process may be stored together with the identification information in the height position measurement information storage unit. In this case, the identification information, height position information PH1, and height position information SH1 may be read from the height position measurement information storage unit in the calculation process.

[0072] In the manufacturing method (M1), the solder pre-coating process may include: a solder paste supply process in which solder paste is supplied to the pad; and a heating process in which the solder paste is heated to form a solder pre-coating on the pad.

[0073] In a typical example, the solder pre-coating has solder paste residue on its surface. In the manufacturing method (M1), the height of the upper surface of the residue may also be measured during the first height position measurement step.

[0074] Alternatively, the manufacturing method (M1) may further include a solder flux coating step between the first height position measurement step and the second height position measurement step. The solder flux coating step is a step of coating solder flux onto a solder pre-coating layer on the substrate. Alternatively, in the second height position measurement step, a second height position measurement may be performed on the portion of the substrate not covered by the solder flux, thereby obtaining height position information SH2.

[0075] (Manufacturing Method (M2))

[0076] Manufacturing method (M2) is a method for manufacturing a mounting substrate including a substrate with pads and electronic components soldered to the pads. Manufacturing method (M2) sequentially includes: a solder pre-coating forming step, in which a solder pre-coating is formed on the pads; a height position measuring step, in which height position information PH2, related to the height position of the upper surface of the solder pre-coating, is obtained by height position measuring while the substrate with the solder pre-coating is held by a substrate holding member; and an electronic component mounting step, in which an electronic component is mounted on the solder pre-coating of the substrate held by the substrate holding member using a component holding tool. Manufacturing method (M2) further includes a calculation step between the height position measuring step and the electronic component mounting step, in which a target height position is calculated using the height position information PH2 when the component holding tool holding the electronic component descends toward the substrate to mount the electronic component on the solder pre-coating. Furthermore, in the electronic component mounting process, the lifting and lowering motion of the component holding tool is controlled based on the target height position to mount the electronic component onto the solder pre-coating.

[0077] Alternatively, the manufacturing method (M2) may include a solder flux coating process between the solder pre-coating formation process and the electronic component mounting process. The solder flux coating process involves applying solder flux onto the solder pre-coating layer of the substrate. Alternatively, in the height position measurement process, the height position of the solder pre-coating layer covered by the solder flux may be measured to obtain height position information PH2.

[0078] In manufacturing method (M2), the height position measurement can also be performed using a laser during the height position measurement process.

[0079] Hereinafter, examples of the manufacturing apparatus and manufacturing method of the present invention will be specifically described with reference to the accompanying drawings. The aforementioned components and processes can be applied to the components of the manufacturing apparatus and the processes of the manufacturing method described below. Furthermore, the components of the manufacturing apparatus and the processes of the manufacturing method described below can be modified based on the above description. Additionally, the matters described below can be applied to the embodiments described above. Furthermore, in the embodiments described below, components and processes that are not essential to the manufacturing apparatus and manufacturing method of the present invention may be omitted. It should be noted that, in the following drawings, for ease of understanding, illustrations of some components and some reference numerals are sometimes omitted.

[0080] (Implementation Method 1)

[0081] In Embodiment 1, an example of the manufacturing apparatus (D1) and an example of the manufacturing method (M1) will be described. Figure 1 The structure of the mounting substrate manufacturing apparatus 10 according to Embodiment 1 is schematically shown. The manufacturing apparatus 10 is an example of the manufacturing apparatus (D1) described above. The manufacturing apparatus 10 includes a substrate transport line 11, an information processing device 20, a loader 50, a solder pre-coating forming unit 90, a solder pre-coating inspection device 300, a flux coating device (flux coating unit) 400, electronic component mounting devices (electronic component mounting units) 501 and 502, a mounting status inspection device 600, a reflow soldering device 700, a substrate inspection device 800, and an unloader 900. They are arranged in the above order from upstream to downstream. Known structures other than those unique to this invention may also be applied. Hereinafter, electronic component mounting devices 501 and 502 will sometimes be collectively referred to as "electronic component mounting device 500".

[0082] The substrate transport line 11 transports the substrate 1 (described later) from the solder pre-coating forming section 90 to the substrate inspection apparatus 800. The substrate transport line 11 may not be a continuous line, or it may be composed of multiple transport lines. The substrate transport line 11 may use a known substrate transport line.

[0083] In manufacturing apparatus 10, Figure 2The diagram schematically illustrates the structure for processing the actions and information of each component (device). The information processing device 20 is connected to each component (device). The information processing device 20 includes a processing unit 20a and a storage device 20b. The solder pre-coating inspection device 300 includes a processing unit 302a and a storage device 302b constituting the control unit. The electronic component mounting device 501 includes a processing unit 501a and a storage device 501b constituting the control unit. The processing unit 20a, storage device 20b, processing unit 302a, storage device 302b, processing unit 501a, and storage device 501b include… Figure 2 The parts shown, or as Figure 2 The various parts shown function accordingly. It should be noted that the electronic component mounting device 502, like the electronic component mounting device 501, also includes a processing unit and a storage unit.

[0084] The aforementioned processing unit consists of a CPU (Central Processing Unit) or similar components. The aforementioned storage device consists of one or more RAM (Random Access Memory), hard disks, or similar components. These can be individual circuits, LSIs (Large-Scale Integrated Circuits), or integrated into a single unit. The information processing unit 20 is connected to other devices included in the mounting substrate manufacturing apparatus 10 (including the solder pre-coating forming unit 90, solder pre-coating inspection device 300, flux coating device 400, electronic component mounting device 500, and reflow soldering device 700) via a local area network 20N, either wired or wireless. The information processing unit 20 exchanges data between these devices. Thus, the information processing unit 20 manages the processes performed by the mounting substrate manufacturing apparatus 10.

[0085] The information processing device 20 stores the programs and data required for each device in the substrate manufacturing apparatus 10. For example, the data required for the electronic component mounting devices 501 and 502 includes assembly programs, control parameters, and workpiece information. The assembly program includes the coordinates of the mounting point of the substrate 1 (assembly coordinates of the electronic component 4), information about the electronic component 4 mounted at the mounting point, the supply position of the electronic component 4, and the assembly sequence for mounting onto the substrate 1. The control parameters are information (e.g., speed, acceleration, etc.) required for the motion control of the electronic component mounting devices 501 and 502. The workpiece data includes at least the information of the component and the substrate. The information of the electronic component includes data related to the shape and size (width, length, thickness) of the electronic component. In addition, the information of the substrate includes data related to the size and thickness of the substrate, as well as the coordinates of reference marks. The data required for the solder pre-coating inspection device 300 includes a measurement program, which includes the coordinates of the measurement area in the substrate 1. The inspection data required for the mounting condition inspection device 600 includes the coordinates of the inspection object (electronic component) on the substrate 1, the judgment criteria used in the inspection, image processing parameters, etc. The data required for the reflow soldering device 700 includes the set temperature of the heating device used to heat the substrate, the transport speed of the substrate 1, etc. The information processing device 20 sends (downloads) these programs and data to each device constituting the mounting substrate manufacturing apparatus 10 before operation begins. Each device downloads the programs and data from the information processing device 20 and saves them in its own control unit. It should be noted that the control unit of each device has an arithmetic processing unit composed of a CPU and a storage device composed of one or more RAM (random access memory), hard disks, etc., and performs prescribed processing and operations in each device based on the downloaded programs and data.

[0086] The loader 50 supplies the substrate housed on the stand (not shown) to the solder pre-coating forming section 90. The unloader 900 retrieves the completed substrate back to the stand. Each device from the solder pre-coating forming section 90 to the substrate inspection device 800 includes a substrate transport conveyor (substrate transport line 11). Each conveyor is configured to receive a substrate from the upstream device (loader 50 side) and transfer the substrate to the downstream device (unloader 900 side).

[0087] Next, the solder pre-coating forming unit 90, solder pre-coating inspection device 300, and electronic component mounting device 500, which constitute the various parts (devices) of the mounting substrate manufacturing apparatus 10, will be described below.

[0088] (Solder pre-coating formation area)

[0089] exist Figure 3The diagram schematically illustrates the structure of the solder pre-coating forming section 90 according to Embodiment 1. It should be noted that in this specification, the direction along which the substrate 1 is transported is designated as the X-axis, the vertical direction as the Z-axis, and the direction perpendicular to both the X-axis and Z-axis as the Y-axis. Furthermore, the directions along each axis are designated as the X-direction, Y-direction, and Z-direction.

[0090] The solder pre-coating forming section 90 is an apparatus for forming a solder pre-coating section on the substrate 1. For example... Figure 3 As shown, the solder pre-coating forming section 90 includes a control section 95, a solder paste supply section 100, a heating section 210, and a cooling section 220. They are arranged in a row along the X-axis direction on the base 101. Inside them is a substrate transport section 230 that transports substrates along the X-axis direction. The transport section 230 forms part of the substrate transport line 11.

[0091] Solder paste supply unit 100 supplies solder paste to substrate 1. Heating unit 210 heats the solder paste supplied to substrate 1 to melt the solder particles contained in the solder paste. Cooling unit 220 cools and solidifies the molten solder particles (hereinafter, sometimes referred to as "molten solder"). Substrate transport unit 230 transports substrate 1 in the order of solder paste supply unit 100, heating unit 210, and cooling unit 220. A control unit 95 for controlling solder pre-coating forming unit 90 is disposed inside base 101. Control unit 95 controls solder paste supply unit 100, heating unit 210, cooling unit 220, and substrate transport unit 230 to cause solder pre-coating forming unit 90 to perform the operation of forming solder pre-coating on substrate 1. Thus, the solder pre-coating forming unit 90 of the present invention integrates the solder paste supply unit 100 and heating unit 210 required for solder pre-coating formation.

[0092] Solder Paste Supply Department

[0093] The solder paste supply unit 100 shown in Embodiment 1 supplies solder paste onto the substrate 1 via screen printing. The solder paste includes solder (solder alloy) particles and flux. It should be noted that solder paste can also be supplied by methods other than screen printing. For ease of understanding, in Figure 3 The image shows an example in which a substrate 1 is disposed in the solder paste supply section 100, the heating section 210, and the cooling section 220, respectively.

[0094] The solder paste supply unit 100 includes a movable worktable 102, a lifting mechanism 103, a printing table 104, a printing head 113, a camera unit 115, a photomask 116, a printing table conveyor (first substrate transport unit) 231, a substrate loading conveyor 234, and a substrate relay conveyor (second substrate transport unit) 232.

[0095] exist Figure 4 , Figure 5 The diagram shows a view of the printing table 104 and the periphery of the printing head 113 from the side where the substrate is loaded into the conveyor 234.

[0096] A pair of support frames 91 are erected at intervals along the X-direction on the base 101. A movable worktable 102 is arranged on the base 101, which is sandwiched between the support frames 91. A lifting mechanism 103 for raising and lowering the printing table 104 is arranged on the movable worktable 102. The movable worktable 102 causes the lifting mechanism 103 to move in the horizontal direction (along the X-axis and Y-axis, and in the direction of rotation in the horizontal plane with the Z-axis as the rotation axis, hereinafter the same), thereby moving the printing table 104 in the horizontal direction. The lifting mechanism 103 causes the printing table 104 to move, i.e., to rise and fall, along the Z-axis.

[0097] The printing table 104 includes a base 104a that is coupled to a lifting mechanism 103. A support column 104b is provided on the upper surface of the base 104a. A substrate guide 104c extending along the X-axis is coupled to the upper end of the support column 104b. A printing table conveyor 231 including a belt for transporting substrate 1 is disposed inside the substrate guide 104c.

[0098] The printing table conveyor 231 is capable of transferring substrate 1 between substrate infeed conveyor 234 and substrate relay conveyor 232. The substrate infeed conveyor 234 is configured with an opening through one support frame 91, and the substrate relay conveyor 232 is configured with an opening through the other support frame 91. The substrate 1 brought in by the substrate infeed conveyor 234 is transferred to the printing table conveyor 231 and conveyed to the solder paste supply area PA, where it is held by the printing table 104. The substrate 1, having been supplied with solder paste in the printing table 104, is removed from the solder paste supply area PA of the printing table conveyor 231 and transferred to the substrate relay conveyor 232.

[0099] A back support lifting mechanism 104e is disposed on the upper surface of the base 104a. The back support lifting mechanism 104e lifts and lowers the back support portion 104f that supports the substrate 1 from below. The lower surface of the substrate 1 is supported by the back support portion 104f by raising the back support portion 104f while the substrate 1 is being moved into the solder paste supply area PA of the printing table conveyor 231.

[0100] Side clamping members 104d extending along the X-axis are respectively provided on the upper surface of a pair of substrate guides 104c. The side clamping members 104d are opened and closed by a drive mechanism (not shown). The back support 104f supports the lower surface of the substrate 1 while raising the substrate 1 to a height where the upper surface of the substrate 1 is aligned with the upper surface of the side clamping members 104d. When the substrate 1 is aligned with the height of the side clamping members 104d, the side clamping members 104d are closed, thereby clamping the two sides of the substrate 1 and fixing the substrate 1. In this way, the printing table 104 holds the substrate 1.

[0101] At the upper end of a pair of support frames 91, a support beam 113a supporting the printing head 113 is configured to move freely in the Y direction via a direct-acting guide mechanism 11a. One end of the support beam 113a is configured to be connected to a known printing head moving mechanism 91b, which consists of a feed screw and a motor that rotates the feed screw. Driven by the printing head moving mechanism 91b, the printing head 113 is reciprocated in the coating direction, i.e., the Y direction.

[0102] like Figure 4 As shown, the printing head 113 includes a rear scraper 113b and a front scraper 113c extending downward from the support beam 113a. By driving the scraper drive unit 113d provided on the upper surface of the support beam 113a, either the rear scraper 113b or the front scraper 113c is lowered in the scraping direction.

[0103] A mask 116 is horizontally positioned below the print head 113. An opening 116a extending through the thickness direction is formed in the mask 116 (see Figure 6). The solder paste supply unit 100 moves the solder paste P (described later) supplied to the upper surface of the mask 116 using either the rear scraper 113b or the front scraper 113c, thereby performing screen printing to supply the solder paste P onto the substrate 1 in a predetermined printing pattern. The solder paste P includes a solder alloy and a flux.

[0104] A camera unit 115 is disposed below the mask 116 (see reference). Figure 3The camera unit 115 is movable in the X and Y directions via a known camera moving mechanism (not shown) fixed to the support frame 91. The camera unit 115 houses a camera for capturing images of the substrate 1 and the mask 116 held on the printing table 104. A substrate reference mark (not shown) for identifying the position of the substrate 1 is formed on the surface of the substrate 1. Similarly, a mask reference mark or hole for the same purpose is formed on the mask 116. The control unit 95 captures images of the substrate reference mark and the mask reference mark using the camera unit 115, performs image recognition on the acquired images, and calculates the relative positional offset between the substrate 1 and the mask 116. Then, the moving stage 102 is driven to adjust the position of the printing table 104 so that the positional offset between the two is zero or minimized, thereby aligning the substrate 1 and the mask 116.

[0105] (Heating section)

[0106] Next, the structure of the heating unit 210 will be described. The heating unit 210 includes: a housing 213 that covers the downstream side of the substrate relay conveyor 232 extending from the solder paste supply unit 100; and a substrate heating device 211 and a local heating device 212 (heating device) disposed inside the housing 213. A vent hole 215 is formed in the housing 213 for discharging volatile components from the solder paste generated by heating.

[0107] A local heating device 212 is positioned above the substrate relay conveyor 232 and can move horizontally via a moving mechanism 216 mounted on the housing 213. The local heating device 212 can be any device that locally heats the substrate 1 or the solder paste P using microwave heating or induction heating. A heating zone HA is provided on the substrate relay conveyor 232, and the local heating device 212 locally heats a portion of the solder paste P on the substrate 1 located in the heating zone HA, melting the solder contained in that portion of the solder paste P. A substrate heating device 211 is positioned below the substrate relay conveyor 232 and heats the entire substrate 1 located in the heating zone HA from below. The heating performed by the substrate heating device 211 is an auxiliary heating method to facilitate the melting of the solder by the local heating device 212. It should be noted that if the solder in the solder paste P can be melted even without the substrate heating device 211, the substrate heating device 211 can be omitted.

[0108] The substrate 1, on which solder paste P has been supplied by the solder paste supply unit 100, is received on the substrate relay conveyor 232 and transported to the heating zone HA. Furthermore, when the melting of the solder by the local heating device 212 ends, the substrate 1 is removed from the heating zone HA and transported to the cooling unit 220 (described later). In this embodiment, the substrate relay conveyor 232 is a second substrate transport unit that transports the substrate 1 in the heating zone HA heated by the heating device. The substrate relay conveyor 232 extends from the solder paste supply unit 100 to the heating unit 210 and is shared by both. Therefore, the substrate 1 can be transported from the solder paste supply unit 100 to the heating unit 210 along the path, simplifying and miniaturizing the solder pre-coating manufacturing apparatus. It should be noted that the substrate relay conveyor 232 may also be composed of multiple substrate transport mechanisms divided into sections passing through the heating zone HA and other sections.

[0109] (Cooling section)

[0110] Next, the structure of the cooling unit 220 will be described. The cooling unit 220 includes: a housing 224 that covers the substrate transport conveyor 233; and a cooling fan (cooling device) 221 disposed inside the housing 224. Ventilation holes 220a and 220b for introducing and expelling cooling air are formed in the housing 224. The substrate 1 on the substrate transport conveyor 233 is cooled by operating the cooling fan 221. As a result, the solder molten by the heating unit 210 is cooled and solidified. In this embodiment, the substrate transport conveyor 233 constitutes part of the substrate transport unit 230.

[0111] The solder pre-coating formation process will be described with reference to FIG6. As shown in FIG6, the substrate 1 includes a plate-shaped portion 1a and a plurality of pads 1b formed on the plate-shaped portion 1a. The pads 1b are part of the wiring pattern and are the portion for which the solder pre-coating is formed.

[0112] In the formation of the solder pre-coating, firstly, as... Figure 6A As shown, a mask 116 is disposed on substrate 1. Figure 6A As shown, a plurality of openings 116a are formed in the photomask 116. The positions of the openings 116a correspond to the positions of the pads 1b. In one example shown in Embodiment 1, the openings 116a are larger than the corresponding pads 1b. That is, the area of ​​the openings 116a is larger than the area of ​​the corresponding pads 1b. Therefore, if the substrate 1 is perfectly aligned with the photomask 116 in an ideal state, the pads 1b are located inside the openings 116a.

[0113] When the size of the pad 1b is small, if an opening 116a with the same shape (i.e., the same area) as the pad 1b is used, there may be insufficient solder particles to fill the opening 116a by screen printing. To avoid this, solder paste with very small solder particle size is also considered, but in this case, expensive solder paste is required. Therefore, by using an opening 116a with an area larger than the corresponding pad 1b, as in this embodiment, the problems of insufficient solder and cost can be solved. It should be noted that the size of the opening 116a can also be set to be smaller than the size of the pad 1b.

[0114] Next, the solder paste P on the upper surface of the mask 116 is moved on the mask 116 using the rear scraper 113b or the front scraper 113c. Thus, as... Figure 6B As shown, the portion of solder paste P that passes through opening 116a is filled in opening 116a.

[0115] Next, the substrate 1 is separated from the mask template 116 by driving the lifting mechanism 103. Figure 6C The substrate 1 is shown after the mask 116 has been separated. Solder paste P is disposed on the pad 1b.

[0116] Subsequently, substrate 1 is transported to heating zone HA within heating unit 210. Substrate 1, transported to heating zone HA, is heated by substrate heating device 211. Heating by substrate heating device 211 is an auxiliary heating method to facilitate the melting of solder by local heating device 212. Control unit 95 uses local heating device 212 to heat the solder paste P on substrate 1 located in heating zone HA, thereby melting the solder contained in solder paste P. When heating by substrate heating device 211 has elapsed for a predetermined time, control unit 95 activates moving mechanism 216, thereby positioning local heating device 212 against the solder paste P supplied to substrate 1. As a result, the solder in solder paste P melts and wets and spreads on the surface of pad 1b. It should be noted that even when solder paste P is connected between adjacent pads 1b, because the solder on pads 1b is melted first by local heating device 212, the solder between pads 1b is also drawn closer to the molten solder. Therefore, so-called solder bridges, which are formed by molten solder connecting the pads 1b, will not be generated.

[0117] When the solder melting operation performed by the local heating device 212 is completed, the control unit 95 activates the substrate relay conveyor 232 and the substrate unloading conveyor 233 to transport the substrate 1 to the cooling unit 220. The cooling unit 220 activates the cooling fan 221 to blow air drawn from the vents 220a and / or vent 220b onto the substrate 1 to cool it. It should be noted that if special cooling of the substrate 1 is not required, the cooling performed by the cooling unit 220 can be omitted.

[0118] The cooled substrate 1 is discharged from the cooling section 220 by the drive substrate conveyor 233. In this way, a solder pre-coating 2 is formed on the pads 1b of the substrate 1. Figure 6D The substrate 1 with the solder pre-coating 2 is transported by the substrate transport line 11 to the solder pre-coating inspection device 300.

[0119] (Solder pre-coating inspection device)

[0120] exist Figure 7 The structure of a solder pre-coating inspection apparatus 300 is schematically shown. The inspection apparatus 300 is used to inspect whether the solder pre-coating 2 has been properly formed. The inspection apparatus 300 includes an inspection head 310, a first substrate holding section 320, and a substrate transport conveyor 330. The inspection head 310 includes a height position measuring device (first height position measuring section) and a camera section. The inspection head 310 can move horizontally using a known XY movement device (not shown). The first height position measuring section includes a distance sensor and a displacement sensor, measuring the height position in a non-contact manner.

[0121] A substrate transporter 330 is disposed on a pair of substrate guides 331 extending parallel to each other in the X direction. The substrate transporter 330 forms part of the substrate transport line 11.

[0122] The first substrate holding part 320 includes a lifting platform 321, a plurality of back support pins 322 extending vertically upward from the lifting platform 321, and an upper surface pressing member 323. The lifting platform 321 moves up and down via a lifting mechanism 324.

[0123] It should be noted that the first substrate holding part 320 can be any structure other than the one shown in the figure, as long as it can hold the substrate 1. It can also include other structures in addition to the structure shown in the figure.

[0124] Regarding the processing of substrate 1 in the solder pre-coating inspection device 300, refer to... Figures 8-10 The following explanation will be provided. First, the substrate 1 is moved into the inspection apparatus 300 and held (step S301). The substrate 1 is transported by the substrate transport conveyor 330 to the working area W1 (first working position) inside the apparatus, where it is held by the first substrate holding unit 320. Figure 9A The image shows the state before the substrate 1 is fixed. Figure 9B The image shows the state in which substrate 1 is fixed. For example... Figure 9B As shown, when fixing the substrate 1, the back support pin 322 is raised. The raised back support pin 322 abuts against the lower surface of the substrate 1, causing the substrate 1 to rise. The upper surface pressing member 323 presses against the upper surface of the substrate 1, which has risen with the help of the back support pin 322. By raising the back support pin 322, the substrate 1 is fixed between the back support pin 322 and the upper surface pressing member 323.

[0125] It should be noted that the data required for processing the substrate 1 (substrate information related to the substrate 1, etc.) can be pre-stored in the storage device 302b of the inspection device 300, or downloaded from the storage device 20b of the information processing device 20 and stored in the storage device 302b.

[0126] Next, under the control of the processing unit 302a, the reference mark 1r of the substrate 1 is identified (step S302). Specifically, the substrate 1 is photographed using a camera unit, and the captured image is processed to identify the reference mark 1r. Figure 10 The diagram shows a top view of an example of substrate 1. Multiple reference marks 1r are formed on substrate 1. Based on the positions of the multiple reference marks 1r determined by the identification process, information about the horizontal position of substrate 1 held in the first substrate holding section 320, i.e., the position of the measurement area set on substrate 1, is obtained. The inspection head 310 measures the height of the measurement area set at the predetermined horizontal position, and at this time, adjusts the horizontal position of the inspection head 310 based on the information about the horizontal position of substrate 1.

[0127] Next, the height position measurement processing unit of the processing unit 302a controls the first height position measurement unit (inspection head 310) of the solder pre-coating inspection unit 300 to obtain height position information PH1 related to the height position of the upper surface of the solder pre-coating 2 and height position information SH1 related to the height position of the upper surface of the substrate 1 by the first height position measurement (step S303). The obtained height position information PH1 and height position information SH1 are stored in the storage device 302b. At this time, the height position information PH1 and height position information SH1 are stored together with the identification information for individually identifying the substrate 1.

[0128] exist Figure 10The black dots represent the measurement points ph1 of height position information PH1 related to the height position of the upper surface of the solder pre-coating 2. The position of the measurement point ph1 is, for example, selected from a position near the center of the solder pre-coating 2 (e.g., the center). The height position information PH1 is a set of height positions Hp of multiple measurement points ph1 obtained from a first height position measurement. Additionally, in... Figure 10 The measurement location sh1, marked with an "×", is a height position information SH1 related to the height position of the upper surface of substrate 1. The location of the measurement location sh1 is, for example, a position away from the pad 1b where the solder pre-coating 2 is formed, and multiple locations are defined. The height position information SH1 is a set of height positions H1 of multiple measurement locations sh1 obtained from a first height position measurement. Figure 10 In the diagram, a "+" sign indicates the center of the electronic component's mounting location. It should be noted that solder resist is formed on substrate 1, but... Figure 10 The diagram of solder resist is omitted.

[0129] An example inspection head 310 includes a light-emitting element and a light-receiving element. The light-emitting element is, for example, a laser element, and the light-receiving element is, for example, an image sensor or a photodiode (position detection element). Light (e.g., laser light) emitted from the light-emitting element and reflected by the object being measured is received by the light-receiving element. The light-receiving element outputs a signal corresponding to the position of the light received. The height position of the measured part is obtained based on the output signal of the light-receiving element. In order to obtain an accurate height position, a reference height position is set in the solder pre-coating inspection device 300 as a reference for height measurement. A correspondence is established in advance between the output signal of the corresponding light-receiving element and the reference height position, thereby obtaining an accurate height position. The height reference position can be the surface of the components disposed in the inspection device 300, such as the upper surface of the substrate guide 331. Furthermore, the height position of the measured part can also be a relative height based on the reference height position. The above structure is known, and known techniques can be applied. In addition, the inspection head 310 described herein is not limited to any height measuring device that can perform the measurement required by the present invention.

[0130] Next, the pass / fail determination unit of the processing unit 302a calculates the thickness of the solder pre-coating layer based on the measured value (step S304). Regarding the acquisition of height position information PH1 and height position information SH1 and the calculation of the solder pre-coating layer thickness, refer to... Figure 11 Let me explain.

[0131] In the inspection apparatus 300, the height position Hp from the reference height H0 to the upper surface of the solder pre-coating 2 is measured by a first height position meter. Since residue 2a exists on the surface of the solder pre-coating 2, it is possible that each height position Hp represents the height position of the upper surface of the residue 2a. However, given that the residue 2a on the upper surface of the solder pre-coating 2 is a very thin film of a few micrometers, and may be so transparent as to be undetectable as a height position due to the material, treating the height position Hp as a value representing the height position of the solder pre-coating 2 is not problematic.

[0132] Additionally, the height position H1 from the reference height H0 to the upper surface of the solder resist 1s on the substrate 1 is also obtained by the first height position measurement. Identification information for individual identification of the substrate 1 is marked on the substrate 1. The height position measurement information storage unit of the storage device 302b of the inspection device 300 stores multiple height positions Hp (height position information PH1) and multiple height positions Hs (height position information SH1) obtained by the first height position measurement unit, and the identification information of the substrate 1 (height position information storage process). It should be noted that as long as the height position of the upper surface of the substrate 1 can be measured, it is sufficient to measure the height position of the upper surface of the substrate 1 where the solder resist 1s is not formed, rather than the height position of the upper surface of the solder resist 1s (the same applies to the height position measurement of the electronic component mounting device 501).

[0133] The height position H1 is the height position of the upper surface of the substrate 1, which is measured to estimate the height position of the portion where the solder pre-coating 2 is formed. Therefore, the measurement location sh1 is preferably selected from the vicinity of the solder pre-coating 2. In addition, when estimating the shape of the upper surface of the substrate 1 based on the measurement results, the number and position of the measurement locations sh1 are selected in a way that allows for an appropriate estimation of the shape.

[0134] The calculation unit of the arithmetic processing unit 302a of the inspection device 300 reads the height position information PH1 and the height position information SH1 from the height position measurement information storage unit. Furthermore, the calculation unit of the arithmetic processing unit 302a uses the read values ​​to calculate the thickness TP of the solder pre-coating layer 2. Specifically, the thickness TP of the solder pre-coating layer is calculated according to the following formula (1).

[0135] TP=Hp(ph1)-Hs(ph1)-HL···(1)

[0136] Here, the height position Hp (ph1) is the height from the reference height H0 at the measurement location ph1 to the upper surface of the solder pre-coating 2 (the upper surface of the residue 2a). The height position Hs (ph1) is the height from the reference height H0 to the upper surface of the substrate 1 at the measurement location ph1. Additionally, HL is the thickness of the pad 1b. The thickness of the pad 1b and the thickness Ds of the solder resist 1s are obtained in advance as information about the substrate 1.

[0137] Since a solder pre-coating 2 is present at the measurement location ph1, it is impossible to directly measure the height position Hs(ph1) of the measurement location ph1 using the inspection head 310. However, the height position Hs(ph1) can be approximated by the height position Hs(sh1) of the upper surface of the substrate 1 at a measurement location sh1 near the measurement location ph1. In the case where solder resist 1s is present at the measurement location sh1, the thickness TP of the solder pre-coating is calculated according to equation (2).

[0138] TP=Hp(ph1)-[H1(sh1)-Ds]-HL···(2)

[0139] Here, H1(sh1) is the height position of the upper surface of the substrate at the measurement location sh1. Therefore, Hs(sh1) can be obtained by subtracting the thickness Ds of the solder resist 1s from H1(sh1). That is, if Hs(sh1) can be regarded as Hs(ph1), the thickness TP of the solder pre-coating can be obtained from the height position information SH1 and PH1 obtained by measuring the first height position and the information of the substrate 1 (the thickness HL of the pad 1b and the thickness Ds of the solder resist 1s). Alternatively, Hs(ph1) can also be approximated by the average value of the height positions Hs(sh1) of the upper surface of the substrate 1 at multiple measurement locations sh1 near the measurement location ph1. The calculation formula in this case is obtained by replacing "H1(sh1)" in equation (2) with the average value of the height positions of multiple measurement locations sh1. Alternatively, the shape of the upper surface of the substrate 1 can be estimated from the Hs(sh1) at multiple measurement locations sh1, and Hs(ph1) can be calculated based on the estimated shape (imaginary plane). The estimation of such an imaginary plane can be done by known methods. For the calculation formula in this case, simply replace "Hs(ph1)" in equation (1) with Hs(ph1) estimated based on the imaginary plane.

[0140] Next, the pass / fail determination unit of the calculation processing device 302a determines whether the solder pre-coating 2 is pass / fail based on the calculated thickness TP of the solder pre-coating 2 (step S305). If the thickness TP of the solder pre-coating 2 is within a preset appropriate range, it is determined to be pass / fail; otherwise, it is determined to be fail / fail. To correct the fail / fail solder pre-coating 2, the substrate 1 determined to be fail / fail is removed from the manufacturing device (D1), and after correction, it is reinserted into the solder pre-coating inspection device 300 and transported to the remaining processes. The substrate 1 determined to be pass / fail / fail solder pre-coating 2 is then subjected to subsequent processes.

[0141] Next, the processing unit 302a uploads the inspection result information, including height position information PH1 and SH1, the pass / fail determination result of the solder pre-coating 2, the calculated thickness TP of the solder pre-coating 2, and the identification information of the inspected substrate 1, to the storage device 20b of the information processing unit 20 (step S306). After the inspection of the solder pre-coating 2 is completed, the substrate 1 is released and removed (step S307).

[0142] (Fluoride coating apparatus)

[0143] The substrate 1, inspected by the inspection device 300, is conveyed by the substrate transport line 11 to the flux coating apparatus 400. In the flux coating apparatus 400, flux for soldering using reflow soldering is applied to the solder pre-coating layer 2. The flux application method is not particularly limited, and known methods (such as screen printing) can also be used. The substrate 1 coated with flux is conveyed by the substrate transport line 11 to the electronic component mounting device 501.

[0144] (Electronic component mounting device)

[0145] exist Figure 12 The structure of the electronic component mounting device 501 is schematically shown. It should be noted that the electronic component mounting device 502 has the same structure and the same function as the electronic component mounting device 501, so repeated descriptions are omitted.

[0146] Electronic component mounting device 501 mounts electronic components 4 on a solder pre-coating 2 covered with flux (not shown). Electronic component mounting device 501 includes a substrate transport conveyor 521 for transporting substrate 1, multiple component supply units 580 arranged to the side of substrate transport conveyor 521, mounting head 542, and a second substrate holding part 550. The substrate transport conveyor 521 is provided on a pair of substrate guides 520 extending parallel to each other in the X direction. The substrate transport conveyor 521 forms part of substrate transport line 11.

[0147] The substrate transport conveyor 521 is driven by a drive source (not shown) from both ends of the substrate 1 in the Y direction, which support it from below, to transport the substrate 1 in the X direction. The middle portion of the substrate transport conveyor 521 in the X direction becomes the working area W2 (second working position) for mounting electronic components 4 onto the substrate 1. A member (part of the substrate holding part 550) that supports the substrate 1 from below is disposed below this working area W2.

[0148] The substrate holding section 550 includes: a plurality of back support pins 552 that support the lower surface of the substrate 1; a lifting platform 551 on which the back support pins 552 are disposed; a lifting section 553 that lifts and lowers the lifting platform 551; and upper surface pressing members 554. When the back support pin lifting section 553 is driven while the substrate 1 is being moved into the work area W2 by means of the substrate transport conveyor 521, the back support pins 552 push the substrate 1 up and press the upper surfaces of its two ends in the Y direction against the upper surface pressing members 554. Thus, the substrate 1 is temporarily fixed in the work area W2 in a state where it is clamped from above and below by the plurality of back support pins 552 and a pair of upper surface pressing members 554. The substrate transport conveyor 521 of the electronic component mounting device 501 moves the substrate 1 received from upstream into the work area W2 within the device, and moves the substrate 1, after the mounting of the electronic component 4 has been completed, out of the device downstream.

[0149] The electronic component mounting device 501 includes a mounting head 542, a moving mechanism (not shown) for moving the mounting head 542 along the X and Y directions, a height position measuring unit 543, and a known substrate camera (not shown). The height position measuring unit 543 and the substrate camera are mounted on the mounting head 542 and move along the X and Y directions by means of the moving mechanism for moving the mounting head 542. The mounting head 542 has a plurality of suction nozzles 541 for attracting and holding electronic components 4, and a suction nozzle drive mechanism (not shown) for lifting and lowering the suction nozzles 541 and rotating them around the Z-axis. The mounting head 542 performs the operation of holding the electronic components 4 supplied by the component supply unit 580 using the suction nozzles 541 and mounting the electronic components 4 onto a solder pre-coating 2 coated with flux. The height position measuring unit 543 (second height position measuring unit) obtains height position information SH2 related to the height position of the upper surface of the substrate 1 held by the second substrate holding unit (substrate holding unit 550) through second height position measurement. The height position measuring unit 543 can be applied to the structure described in the first height position measuring unit.

[0150] Regarding the operation of the electronic component mounting device 501, refer to... Figure 13 Let me explain. Figure 13The process of mounting electronic components onto a substrate 1 is shown. First, the processing unit 501a of the electronic component mounting device 501 downloads the required data from the storage device 20b of the information processing device 20 and updates the storage unit of the storage device 501b (step S501). The downloaded data includes at least the data required for calculating the target height position, which will be described later. In this embodiment, inspection result information is downloaded.

[0151] Next, under the control of the computing processing device 501a and the like, the substrate 1 is moved into the electronic component mounting device 501, and the substrate 1 is held by the second substrate holding part (substrate holding part 550) (step S502).

[0152] Next, the processing unit 501a controls the camera mounted on the head 542 to identify the reference mark 1r on the substrate 1 (step S503). From this, the horizontal position of the substrate 1 held by the substrate holding unit 550 is determined. Based on the horizontal position of the substrate 1, the height position of a predetermined location is measured and the electronic components 4 are configured.

[0153] Next, the substrate height position measurement and processing unit of the arithmetic processing device 501a obtains height position information SH2 related to the height position of the upper surface of the substrate 1 held by the second substrate holding part (substrate holding part 550) through second height position measurement (step S504). Regarding the acquisition of height position information SH2, refer to Figure 14 Let me explain.

[0154] In the electronic component mounting device 501, the height of the upper surface of the solder resist 1s at a predetermined measurement location sh2 is measured. Specifically, the height (height position H2(sh2)) from the reference height H0 to the upper surface of the solder resist 1s is measured using a height position measuring unit 543 (second height position measurement). The height position information SH2 obtained by the second height position measurement includes the height positions H2(sh2) of multiple measurement locations sh2.

[0155] To ensure the integration of measurement results between the solder pre-coating inspection device 300 and the electronic component mounting device 500, the measurement location sh2 is preferably set at the same location as the measurement location sh1. Furthermore, to avoid false detections caused by the solder flux 3, it is preferable to set the measurement location sh2 at a location where the solder flux 3 is not applied. That is, the second height position measuring unit can also perform second height position measurement on a portion of the substrate 1 not covered by the solder flux 3 to obtain height position information sh2. By performing the measurement at a location where the solder flux 3 is not applied, more accurate measurements can be performed. The measurement location sh2 can also be a location where solder resist 1s has not formed.

[0156] Next, the calculation unit of the arithmetic processing device 501a calculates the target height position NH of the suction nozzle 541 (component holding tool) as it descends toward the substrate 1 (step S505). Specifically, the arithmetic processing device 501a calculates the target height position NH of the lowest point of the suction nozzle 541 when the suction nozzle 541, on which the electronic component 4 is attached, mounts the electronic component 4 onto the solder pre-coating layer 2 (more specifically, on the solder pre-coating layer 2 coated with solder flux 3).

[0157] The target height position NH at the mounting point of the measurement location ph1 is calculated according to the following formula (3) based on the thickness TP of the solder pre-coating 2 obtained by the solder pre-coating inspection device 300, the height position Hs(ph1) of the upper surface of the substrate 1 at the measurement location ph1, the thickness HL of the pad 1b, and the thickness TE of the electronic component 4. It should be noted that when there are multiple pads 1b at a mounting point and multiple height positions Hs(ph1) can be used, the highest height position Hs(ph1) is adopted and the thickness TP of the solder pre-coating 2 at the measurement location ph1 at the adopted height position Hs(ph1) is used for the calculation of the target height position NH.

[0158] NH=Hs(ph1)+HL+TP+TE···(3)

[0159] Here, the height position Hs(ph1) of the upper surface of the substrate 1 at the measurement point ph1 can be approximated by the height position of a measurement point sh2 located near the mounting point including the measurement point ph1. The target height position NH in this case is calculated according to equation (4).

[0160] NH=[H2(sh2)--Ds]+HL+TP+TE···(4)

[0161] Here, H2(sh2) is the height position at the measured location sh2. Hs(sh2) can be obtained by subtracting the thickness Ds of the solder resist 1s from H2(sh2). Therefore, according to equation (4), the electronic component mounting device 500 can determine the target height position NH based on the height position information SH2 obtained from the second height position measurement, the workpiece information (thickness HL of pad 1b, thickness Ds of solder resist 1s, thickness TE of electronic component 4), and the thickness TP of the solder pre-coating layer 2 included in the inspection result information downloaded by S501. It should be noted that the thickness TP of the solder pre-coating layer 2 is calculated using the height position information PH1 related to the height position of the upper surface of the solder pre-coating layer 2 and the height position information SH1 related to the height position of the upper surface of the substrate 1. That is, if equation (2) is applied to equation (4), equation (5) can be derived.

[0162] NH=H2(sh2)--H1(sh1)+Hp(ph1)+TE···(5)

[0163] According to formula (5), the electronic component mounting device 500 can calculate NH based on the height position information PH1 and SH1 obtained by measuring the first height position, the height position information SH2 obtained by measuring the second height position, and the size (thickness) of the electronic component 4.

[0164] It should be noted that the above formulas (3) and (4) may also include items other than height position information and workpiece information. For example, they may also include items that add or subtract arbitrary margins, or add or subtract parameters for deforming the elastomer that presses the nozzle 541 toward the substrate 1 (the same applies in other embodiments).

[0165] It should be noted that "H2(sh2)" in equations (4) and (5) can also be approximated by the average value of the height position Hs(sh2) of the upper surface of the substrate 1 at multiple measurement points sh2 near the mounting point of the measurement point ph1. Alternatively, Hs(ph1) can be calculated based on an imaginary plane estimated from the height positions Hs(sh2) at multiple measurement points sh2, and then applied to equation (3). Such an imaginary plane can be estimated by known methods. It should be noted that the inspection result information used in equations (3) to (5) is inspection result information that includes the identification information of the substrate 1 held in the second substrate holding part (substrate holding part 550).

[0166] Next, the electronic component mounting processing unit of the arithmetic processing device 501a, based on the calculated target height position, controls the lifting and lowering movement of the nozzle 541 (component holding tool) to mount the electronic component 4 onto the solder pre-coating layer 2 (more specifically, onto the solder pre-coating layer 2 coated with solder flux 3) (step S506). Specifically, the electronic component mounting processing unit of the arithmetic processing device 501a drives the nozzle drive mechanism based on the target height position NH, thereby lowering the nozzle 541 holding the electronic component 4 toward the mounting point on the substrate 1. By controlling the movement of the nozzle 541 in this way, the electronic component 4 can be released at an appropriate height position. As a result, poor mounting of the electronic component 4 can be reduced.

[0167] Solder flux 3 is applied to the solder pre-coating 2 of the substrate 1, which is being loaded into the electronic component mounting apparatus 501. Sometimes it is difficult to accurately measure the height of the upper surface of the solder pre-coating 2 to which the solder flux 3 is applied. In Embodiment 1, since the height of the upper surface of the solder pre-coating 2 is measured before the solder flux 3 is applied, the thickness of the solder pre-coating 2 can be calculated more accurately. Therefore, according to the manufacturing apparatus and manufacturing method of Embodiment 1, electronic components 4 can be mounted on the solder pre-coating 2 with good yield and accuracy.

[0168] After the electronic component 4 is mounted in the electronic component mounting device 501, the substrate 1 is released and removed from the electronic component mounting device 501 (step S507). Thus, the processing of the substrate 1 in the electronic component mounting device 501 is complete. The electronic component 4 is also mounted in the electronic component mounting device 502 below.

[0169] The substrate 1, with all electronic components 4 mounted, is transported by the substrate transport line 11 to the mounting status inspection device 600. The mounting status inspection device 600 inspects the mounting status of the electronic components 4 on the substrate 1. Inspection items include mounting misalignment, improper posture, and presence / absence of the electronic components 4. The mounting status inspection device 600 uses optical measuring devices such as cameras and 3D measuring machines to identify the mounting position, posture, presence / absence, and other mounting status of the electronic components 4, and determines whether it meets predetermined standards. If a substrate 1 is found to have improperly mounted electronic components 4, that substrate 1 may be excluded from subsequent processing. Alternatively, subsequent processing may continue after correcting the improper mounting of the electronic components 4.

[0170] After inspection, the substrate 1 is transported to the reflow soldering apparatus 700 via the substrate transport line 11. The reflow soldering apparatus 700 heats the substrate 1, which houses the electronic components 4, to melt the solder pre-coating 2 and solders the electronic components 4 to the pads 1b. In this way, the mounting substrate 1x with the electronic components 4 is manufactured.

[0171] The mounting substrate 1x, after processing in the reflow soldering apparatus 700, is transported by the substrate transport line 11 to the substrate inspection apparatus 800 for inspection. The mounting substrate 1x, having completed inspection in the substrate inspection apparatus 800, is then transported by the substrate transport line 11 to the unloader 900. The unloader 900 retrieves the completed mounting substrate 1x back to the rack.

[0172] Reference Figures 15A-15E This section describes the overall manufacturing process of the mounting substrate 1x. First, preparation... Figure 15A The substrate 1 shown. The substrate 1 includes pads 1b. Solder resist 1s is formed on the surface of the substrate 1.

[0173] Next, as Figure 15B As shown, a solder pre-coating 2 is formed on the pad 1b. The solder pre-coating 2 includes surface residue 2a. It should be noted that the substrate 1 held by the substrate holding portion may experience warping or other deformation. Therefore, in order to accurately mount the electronic component 4 in the electronic component mounting device 501, it is preferable to calculate the target height position taking into account the warping of the substrate 1. According to the manufacturing apparatus and manufacturing method of the present invention, the target height position can be calculated taking into account the warping of the substrate 1.

[0174] Next, as Figure 15C As shown, solder flux 3 is applied to the solder pre-coating 2. Then, as... Figure 15D As shown, electronic components 4 are mounted on the solder pre-coating 2, which is coated with solder flux 3. Next, as... Figure 15E As shown, the solder pre-coating 2 is melted and then cured, thereby brazing the pad 1b to the terminal portion of the electronic component 4 via solder 2x. In this way, the mounting substrate 1x on which the electronic component 4 is mounted is manufactured.

[0175] (Implementation Method 2)

[0176] In Embodiment 2, an example of the manufacturing apparatus (D2) and an example of the manufacturing method (M2) will be described. The only difference between the mounting substrate manufacturing apparatus and the mounting substrate manufacturing method of Embodiment 2 and those of Embodiment 1 is the method for obtaining the target height position in the electronic component mounting section; therefore, repeated descriptions are omitted. The structure of the mounting substrate manufacturing apparatus of Embodiment 2 can also be the same as the structure of the mounting substrate manufacturing apparatus 10 of Embodiment 1.

[0177] The manufacturing apparatus of Embodiment 2 includes a height position measuring unit that obtains height position information PH2 related to the height position of the upper surface of the solder pre-coating by measuring the height position in the substrate held by the substrate holding unit. The substrate holding unit and the height position measuring unit can be the substrate holding unit (second substrate holding unit 550) and the height position measuring unit (height position measuring unit 543) of the electronic component mounting device 501 of Embodiment 1. That is, the electronic component mounting unit in the manufacturing apparatus of Embodiment 2 can be the electronic component mounting unit (electronic component mounting device 500) of the manufacturing apparatus 10 of Embodiment 1.

[0178] Regarding the operation (electronic component mounting process) in the electronic component mounting device 501, refer to... Figure 16 This will be explained in more detail. It should be noted that the operation of the electronic component mounting device 502 can also be set to the same.

[0179] First, the processing unit 501a of the electronic component mounting device 501 downloads the required data and updates the storage unit of the storage device 501b (step S1501). The downloaded data includes the solder pre-coating inspection result, i.e., the pass / fail determination result. In Embodiment 2, unlike Embodiment 1, values ​​related to the thickness of the solder pre-coating and data related to the height position measured from the first height position are not needed for calculating the target height position. Therefore, these values ​​do not need to be downloaded.

[0180] Next, under the control of the processing unit 501a, the substrate 1 is moved into the electronic component mounting device 501, and the substrate 1 is held by the second substrate holding part (substrate holding part 550) (step S1502). Next, the processing unit 501a controls the camera of the mounting head 542 to identify the reference mark 1r on the substrate 1 (step S1503). Steps S1502 and S1503 are the same processes as steps S502 and S503.

[0181] Next, the substrate height position measurement and processing unit of the processing unit 501a obtains height position information PH2 related to the height position Hp of the upper surface of the solder pre-coating 2 by measuring the height position of the substrate 1 held by the substrate holding unit (step S1504). Regarding the acquisition of the height position information PH2, refer to... Figure 17 Let me explain.

[0182] In Embodiment 2, at the measurement location ph1, the height position Hp(ph1) of the upper surface (upper surface of residue 2a) of the solder pre-coating 2 coated with solder flux 3 is obtained by the height position measuring unit 543. The height position Hp(ph1) is a height based on the reference height H0. The height position Hp(ph1) is the height position information PH2. The position of the measurement location ph1 is selected, for example, from a position near the center of the solder pre-coating 2 (e.g., the center). As described above, the height position measuring unit 543 can also use a laser for measurement.

[0183] Next, the calculation unit of the arithmetic processing device 501a calculates the target height position NH of the suction nozzle 541 (component holding tool) as it descends toward the substrate 1 (step S1505). For example, the arithmetic processing device 501a may calculate the target height position NH of the lowest point of the suction nozzle 541 when the suction nozzle 541, which adsorbs the electronic component 4, moves the electronic component 4 onto the solder pre-coating layer 2 (more specifically, onto the solder pre-coating layer 2 coated with solder flux 3) and releases the electronic component 4.

[0184] The target height position NH at the measurement location ph1 is calculated according to the measured height position Hp(ph1) and the thickness TE of the electronic component 4, according to the following formula (6).

[0185] NH=Hp(ph1)+TE···(6)

[0186] In the manufacturing apparatus and method of Embodiment 2, it is not necessary to measure the height position of the upper surface of the substrate 1 in the electronic component mounting device 501. Therefore, the time required for mounting the electronic component can be shortened.

[0187] Next, as Figure 18 As shown, the electronic component mounting processing unit of the computing processing device 501a controls the lifting and lowering action of the nozzle 541 (component holding tool) based on the calculated target height position NH to mount the electronic component 4 onto the solder pre-coating layer 2 (more specifically, onto the solder pre-coating layer 2 coated with solder flux 3) (step S1506). Step S1506 is the same as step S506.

[0188] After the electronic component 4 is mounted in the electronic component mounting device 501, the holding of the substrate 1 is released, and the substrate 1 is removed from the electronic component mounting device 501 (step S1507). Step S1507 is the same as step S507. In this way, the mounting of the electronic component 4 in the electronic component mounting device 501 is performed.

[0189] The substrate 1, on which the electronic component 4 is mounted, is processed in the same manner as in Embodiment 1. Thus, in Embodiment 2, the mounting substrate 1x on which the electronic component 4 is mounted is also manufactured.

[0190] Thus, in the manufacturing apparatus (D2) of Embodiment 2, the height position Hp of the upper surface of the solder pre-coating layer 2 covered by the solder flux 3 is obtained by the height position measuring unit 543. Therefore, the solder flux 3 that can be used in the manufacturing apparatus (D2) is limited to a solder flux that is easily transparent to light for height position measurement. Although this is disadvantageous to the manufacturing apparatus (D1) of Embodiment 1, it is advantageous to the manufacturing apparatus (D1) in terms of productivity because the height position of the solder pre-coating layer 2 is measured using the electronic component mounting device 500.

[0191] Industrial applicability

[0192] This embodiment can be used in a substrate manufacturing apparatus and a substrate manufacturing method.

[0193] The present invention has been described with respect to preferred embodiments at the current point in time, but this disclosure should not be interpreted as limiting. For those skilled in the art, various modifications and alterations should become clear from the above disclosure. Therefore, without departing from the essential spirit and scope of the invention, additional technical solutions should be interpreted as including all modifications and alterations.

[0194] Explanation of reference numerals in the attached figures

[0195] 1: Substrate

[0196] 1b: solder pad

[0197] 1x: Mounting substrate

[0198] 2: Solder pre-coating

[0199] 2a: Residue

[0200] 2x: Solder

[0201] 3: Solder flux

[0202] 4: Electronic components

[0203] 10: Install substrate manufacturing equipment

[0204] 11: Substrate handling line

[0205] 90: Solder pre-coating formation section

[0206] 100: Solder Paste Supply Department

[0207] 210: Heating section

[0208] 320: First substrate holding section

[0209] 500, 501, 502: Electronic component mounting device (electronic component mounting section)

[0210] 550: Second substrate holding section.

Claims

1. A mounting substrate manufacturing apparatus for manufacturing a mounting substrate including a substrate having a land and an electronic component soldered to the land, wherein the mounting substrate manufacturing apparatus includes: a substrate conveyance line that conveys the substrate having the land; a solder precoat forming section that forms a solder precoat on the land; a first substrate holding section that holds the substrate conveyed from the solder precoat forming section by the substrate conveyance line; a first height position measuring section that acquires height position information PH1 related to a height position of an upper surface of the solder precoat and height position information SH1 related to a height position of an upper surface of the substrate by first height position measurement with respect to the substrate held by the first substrate holding section; a second substrate holding section that holds the substrate conveyed from the first substrate holding section by the substrate conveyance line; a second height position measuring section that acquires height position information SH2 related to a height position of an upper surface of the substrate held by the second substrate holding section by second height position measurement; an electronic component mounting section that mounts the electronic component on the solder precoat of the substrate held by the second substrate holding section using a component holding tool; and a calculation section that calculates a target height position when the component holding tool holding the electronic component is lowered toward the substrate in order to mount the electronic component on the solder precoat, using the height position information PH1, the height position information SH1, and the height position information SH2, the solder precoat forming section includes: a solder paste supply section that supplies solder paste onto the land; and a heating section that heats the solder paste, thereby forming the solder precoat on the land, the solder precoat has a residue of the solder paste on a surface, the first height position measuring section measures a height of an upper surface of the residue, the electronic component mounting section mounts the electronic component on the residue of the solder precoat based on the target height position by controlling a raising and lowering operation of the component holding tool.

2. The mounting substrate manufacturing apparatus according to claim 1, wherein the mounting substrate manufacturing apparatus further includes a height position measurement information storage section that stores the height position information PH1 and the height position information SH1 obtained by the first height position measuring section, and the calculation section reads the height position information PH1 and the height position information SH1 from the height position measurement information storage section.

3. The mounting substrate manufacturing apparatus according to claim 2, wherein identification information for individually identifying the substrate is marked on the substrate, the first height position measuring section stores the height position information PH1 and the height position information SH1 obtained by the first height position measurement together with the identification information in the height position measurement information storage section, and the calculation section reads the identification information, the height position information PH1, and the height position information SH1 from the height position measurement information storage section. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 4. The mounting substrate manufacturing apparatus according to claim 1 or 2, wherein the mounting substrate manufacturing apparatus further includes a fluxing agent application section disposed between the first substrate holding section and the second substrate holding section, the fluxing agent application section applies a fluxing agent to the solder precoat layer of the substrate, the second height position measuring section measures the second height position at a portion of the substrate that is not covered by the fluxing agent, thereby acquiring the height position information SH2.

5. A mounting substrate manufacturing apparatus for manufacturing a mounting substrate including a substrate having a land and an electronic component soldered to the land, wherein the mounting substrate manufacturing apparatus includes: a substrate conveyance line that conveys the substrate having the land; a solder precoat layer forming section that forms a solder precoat layer on the land; a substrate holding section that holds the substrate conveyed from the solder precoat layer forming section by the substrate conveyance line; a height position measuring section that acquires height position information PH2 related to a height position of an upper surface of the solder precoat layer by height position measurement for the substrate held by the substrate holding section; an electronic component mounting section that mounts the electronic component on the solder precoat layer of the substrate held by the substrate holding section using a component holding tool; and a calculation section that calculates a target height position when the component holding tool holding the electronic component descends toward the substrate in order to mount the electronic component on the solder precoat layer using the height position information PH2, the solder precoat layer forming section includes: a solder paste supply section that supplies solder paste to the land; and a heating section that heats the solder paste, thereby forming the solder precoat layer on the land, the solder precoat layer has a residue of the solder paste on a surface, the height position measuring section measures a height of an upper surface of the residue, the electronic component mounting section mounts the electronic component on the residue of the solder precoat layer based on the target height position by controlling a lifting action of the component holding tool.

6. The mounting substrate manufacturing apparatus according to claim 5, wherein the mounting substrate manufacturing apparatus further includes a fluxing agent application section disposed between the solder precoat layer forming section and the substrate holding section, the fluxing agent application section applies a fluxing agent to the solder precoat layer of the substrate, the height position measuring section measures the height position of the solder precoat layer covered by the fluxing agent, thereby acquiring the height position information PH2.

7. The mounting substrate manufacturing apparatus according to claim 6, wherein the height position measuring section measures the height position by laser.

8. A mounting substrate manufacturing method for manufacturing a mounting substrate including a substrate having a land and an electronic component soldered to the land, wherein the mounting substrate manufacturing method includes, in order: a solder precoat layer forming process in which a solder precoat layer is formed on the land; a first height position measurement process in which height position information PH1 related to a height position of an upper surface of the solder precoat layer and height position information SH1 related to a height position of an upper surface of the substrate are obtained by first height position measurement in a state where the substrate formed with the solder precoat layer is held by the first substrate holding section; a second height position measurement process in which height position information SH2 related to a height position of an upper surface of the substrate is obtained by second height position measurement in a state where the substrate that has undergone the first height position measurement process is held by the second substrate holding section; and an electronic component mounting process in which the electronic component is mounted on the solder precoat layer of the substrate held by the second substrate holding section using a component holding tool, the manufacturing method of the mounting substrate further includes an arithmetic process in which a target height position at the time when the component holding tool holding the electronic component is lowered toward the substrate in order to mount the electronic component on the solder precoat layer is calculated using the height position information PH1, the height position information SH1, and the height position information SH2, the solder precoat layer forming process includes: a solder paste supplying process in which solder paste is supplied to the pad; and a heating process in which the solder precoat layer is formed on the pad by heating the solder paste, the solder precoat layer has a residue of the solder paste on a surface thereof, in the first height position measurement process, a height of an upper surface of the residue is measured, in the electronic component mounting process, the electronic component is mounted on the residue of the solder precoat layer based on the target height position calculated in the arithmetic process by controlling a raising and lowering operation of the component holding tool.

9. The manufacturing method of the mounting substrate according to claim 8, wherein the manufacturing method of the mounting substrate further includes a height position information storage process in which the height position information PH1 and the height position information SH1 obtained by the first height position measurement process are stored in a height position measurement information storage section, in the arithmetic process, the height position information PH1 and the height position information SH1 are read from the height position measurement information storage section.

10. The manufacturing method of the mounting substrate according to claim 9, wherein the substrate is labeled with identification information for individually identifying the substrate, the height position information PH1 and the height position information SH1 obtained by the first height position measurement in the first height position measurement process are stored in the height position measurement information storage section together with the identification information, In the calculating process, the identification information, the height position information PH1, and the height position information SH1 are read from the height position measurement information storage section.

11. The mounting substrate manufacturing method according to claim 8 or 9, wherein the mounting substrate manufacturing method further includes a solder flux application process between the first height position measurement process and the second height position measurement process, the solder flux application process is a process of applying a solder flux to the solder precoat layer of the substrate, in the second height position measurement process, the second height position measurement is performed on a portion of the substrate that is not covered with the solder flux, and thus the height position information SH2 is acquired.

12. A mounting substrate manufacturing method for manufacturing a mounting substrate including a substrate having a land and an electronic component soldered to the land, wherein the mounting substrate manufacturing method sequentially includes: a solder precoat layer forming process in which a solder precoat layer is formed on the land; a height position measurement process in which height position information PH2 related to a height position of an upper surface of the solder precoat layer is acquired by height position measurement in a state in which the substrate on which the solder precoat layer is formed is held by a substrate holding section; and an electronic component mounting process in which the electronic component is mounted on the solder precoat layer of the substrate held by the substrate holding section using a component holding tool, the mounting substrate manufacturing method further includes a calculating process between the height position measurement process and the electronic component mounting process, in which a target height position at which the component holding tool holding the electronic component descends toward the substrate in order to mount the electronic component on the solder precoat layer is calculated using the height position information PH2, the solder precoat layer forming process includes: a solder paste supplying process in which solder paste is supplied to the land; and a heating process in which the solder precoat layer is formed on the land by heating the solder paste, the solder precoat layer has a residue of the solder paste on a surface thereof, in the height position measurement process, a height of an upper surface of the residue is measured, in the electronic component mounting process, the electronic component is mounted on the residue of the solder precoat layer based on the target height position by controlling a lifting action of the component holding tool.

13. The mounting substrate manufacturing method according to claim 12, wherein the mounting substrate manufacturing method further includes a solder flux application process between the solder precoat layer forming process and the electronic component mounting process, the solder flux application process is a process of applying a solder flux to the solder precoat layer of the substrate, in the height position measurement process, the height position measurement is performed on the solder precoat layer covered with the solder flux, and thus the height position information PH2 is acquired.

14. The mounting substrate manufacturing method according to claim 13, wherein In the height position measuring step, the height position is measured by laser.

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