Laser processing position compensation method, device, storage medium and computer equipment

Abstract

The present application provides a position compensation method, device, storage medium, and computer equipment for laser processing. The position compensation method for laser processing is applied to a laser processing device and includes processing a workpiece unit on a workpiece to be processed based on the coordinate information of a drawing of the workpiece unit's processing contour; photographing the processed workpiece unit with a camera to obtain detection information of the processed workpiece unit, and binding the detection information to the position of the workpiece unit on the workpiece to be processed, wherein the detection information includes the actual coordinate information of the workpiece unit's processing contour; calculating the coordinate deviation value of the workpiece unit based on the drawing coordinate information and the actual coordinate information; compensating workpiece units located at the same position on subsequent workpieces to be processed based on the coordinate deviation value; and performing statistical analysis based on the coordinate deviation value to determine the operating status of the laser processing device. The position compensation method for laser processing provided in the present application can improve the accuracy of laser processing.

Description

Technical Field

[0001] The present application belongs to the field of laser processing technology, and more specifically, relates to a position compensation method, device, storage medium and computer equipment for laser processing. Background Art

[0002] Methods for cutting large-format circuit boards typically include milling and laser processing. Compared to milling, laser processing improves processing efficiency and cross-sectional quality, and can be used to process flexible circuit boards. Therefore, it is widely used for cutting large-format circuit boards. However, current laser processing is prone to errors, resulting in low precision and affecting product quality. Summary of the Invention

[0003] The purpose of this application is to provide a position compensation method for laser processing to improve the accuracy of laser processing.

[0004] To achieve the above-mentioned purpose, the technical solution adopted in this application is to provide a position compensation method for laser processing, which is applied to a laser processing device, comprising:

[0005] Processing the workpiece unit on the workpiece to be processed according to the coordinate information of the workpiece unit processing contour in the drawing file;

[0006] Using a camera to photograph the processed workpiece unit to obtain detection information of the processed workpiece unit, and binding the detection information to the position of the workpiece unit on the workpiece to be processed, the detection information including actual coordinate information of the processing contour of the workpiece unit;

[0007] Calculating a coordinate deviation value of a workpiece unit according to the drawing coordinate information and the actual coordinate information;

[0008] Compensating a workpiece unit located at the same position of a subsequent workpiece to be processed according to the coordinate deviation value;

[0009] Statistical analysis is performed based on the coordinate deviation values ​​to determine the operating status of the laser processing device.

[0010] Furthermore, the step of “performing statistical analysis based on the coordinate deviation value to determine the operating status of the laser processing device” specifically includes:

[0011] The coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed are analyzed to determine the operating status of the laser processing device.

[0012] Furthermore, the step of “analyzing the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed to determine the operating status of the laser processing device” specifically includes:

[0013] Comparing the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the X-axis direction, if the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the X-axis direction are within a first preset range, it is determined that the laser processing device has an error in the X-axis direction;

[0014] The coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the Y-axis direction are compared. If the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the Y-axis direction are within the second preset range, it is determined that there is an error in the Y-axis direction of the laser processing device.

[0015] Furthermore, the laser processing device includes a movable platform for carrying the workpiece to be processed, and a galvanometer for processing the workpiece unit on the workpiece to be processed. "The laser processing device has an error in the X-axis direction" specifically includes that the movable platform has an error in the X-axis direction and / or the galvanometer has an error in the X-axis direction, and "the laser processing device has an error in the Y-axis direction" specifically includes that the movable platform has an error in the Y-axis direction and / or the galvanometer has an error in the Y-axis direction.

[0016] Furthermore, the detection information also includes defect information of the workpiece unit, and after the step of "performing statistical analysis based on the coordinate deviation value to determine the operating status of the laser processing device", the following steps are further included:

[0017] The defect information of workpiece units located at the same position on different workpieces to be processed is counted to determine the incoming material situation.

[0018] Furthermore, the detection information also includes identification information of the workpiece unit, and each workpiece unit has a unique identity ID.

[0019] Furthermore, before the step of "machining the workpiece unit on the workpiece to be machined according to the drawing coordinate information of the machining contour of the workpiece unit", the step also includes: obtaining the drawing coordinate information of the machining contour of the workpiece unit.

[0020] The present application also provides a laser processing device, comprising:

[0021] A galvanometer is used to process the workpiece unit on the workpiece to be processed according to the coordinate information of the workpiece unit processing contour in the drawing;

[0022] A camera is used to take a picture of the processed workpiece unit to obtain detection information of the processed workpiece unit, and to bind the detection information to the position of the workpiece unit on the workpiece to be processed, wherein the detection information includes actual coordinate information of the processing contour of the workpiece unit;

[0023] A calculation module, configured to calculate a coordinate deviation value of a workpiece unit according to the drawing coordinate information and the actual coordinate information;

[0024] a compensation module, configured to compensate a workpiece unit located at the same position of a subsequent workpiece to be processed according to the coordinate deviation value; and

[0025] The statistical module is used to perform statistical analysis based on the coordinate deviation value to determine the operating status of the laser processing device.

[0026] The present application also provides a computer device, comprising:

[0027] a processor configured to execute computer-executable instructions;

[0028] The memory stores one or more computer executable instructions, and when the computer executable instructions are executed by the processor, the various steps of the position compensation method for laser processing as described above are implemented.

[0029] The present application also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program is executed by a processor to implement the various steps of the position compensation method for laser processing as described above.

[0030] The beneficial effect of the laser processing position compensation method provided by the present application is that: the coordinate deviation value of the workpiece unit is calculated by using the coordinate information of the drawing and the actual coordinate information, and the workpiece unit located at the same position on the subsequent workpiece to be processed is compensated according to the coordinate deviation value, thereby improving the accuracy of laser processing and thus improving product quality. At the same time, a camera is used to take a picture of the processed workpiece unit to obtain detection information of the processed workpiece unit, and the detection information is bound to the position of the workpiece unit on the workpiece to be processed. In addition, statistical analysis is performed based on the coordinate deviation value to determine the operating status of the laser processing device, thereby determining the operating status of the laser processing device and avoiding problems in processing quality caused by problems with the laser processing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0032] Figure 1 A schematic flow chart of a position compensation method for laser processing provided in one embodiment of the present application;

[0033] Figure 2 A schematic structural diagram of a workpiece to be processed provided in one embodiment of the present application;

[0034] Figure 3 A schematic diagram of a specific process of S600 provided in one embodiment of the present application;

[0035] Figure 4 A schematic flow chart of a position compensation method for laser processing provided in another embodiment of the present application.

[0036] Among them, the reference numerals in the figures are:

[0037] 10. Workpiece to be processed; 11. Workpiece unit. DETAILED DESCRIPTION

[0038] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0039] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0040] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0042] See also Figure 1 The position compensation method for laser processing provided by the present application is now described. The position compensation method for laser processing provided by the present application is applied to a laser processing device and includes steps S200, S300, S400, S500, and S600.

[0043] S200 , machining a workpiece unit on the workpiece to be machined according to the drawing coordinate information of the machining contour of the workpiece unit.

[0044] Among them, see Figure 2 As shown, multiple workpiece units 11 can be machined from a workpiece 10 to be machined. The workpiece to be machined can be a circuit board to be machined. The "workpiece unit machining contour" refers to the machining of the workpiece unit along the machining contour. For example, during the cutting process of the workpiece unit 10, the "workpiece unit machining contour" refers to the outer contour of the workpiece unit 10.

[0045] S300 , using a camera to take a picture of the processed workpiece unit to obtain detection information of the processed workpiece unit, and binding the detection information with the position of the workpiece unit on the workpiece to be processed, the detection information including actual coordinate information of the processing contour of the workpiece unit.

[0046] In step S300, "the position of the workpiece unit on the workpiece to be processed" refers to the position of the workpiece unit on the workpiece to be processed. n is defined as the number of columns of the workpiece unit on the workpiece to be processed along the X-axis direction, and m is defined as the number of rows of the workpiece unit on the workpiece to be processed along the Y-axis direction. Then, (n, m) represents the position of the workpiece unit on the workpiece to be processed, that is, the position of the workpiece unit on the workpiece to be processed is the nth column and the mth row. For example, when n is 2 and m is 3, it means that the position of the workpiece unit on the workpiece to be processed is the 2nd column and the 3rd row. By binding the detection information with the position of the workpiece unit on the workpiece to be processed, subsequent tracking can be facilitated.

[0047] S400 , calculating a coordinate deviation value of a workpiece unit according to the drawing coordinate information and the actual coordinate information.

[0048] S500 , compensating a workpiece unit located at the same position of a subsequent workpiece to be processed according to the coordinate deviation value.

[0049] In step S500, the coordinate deviation value can be used to compensate for workpiece units located at the same position on the subsequent workpiece to be processed, thereby improving the accuracy of laser processing and further improving product quality. For example, in one embodiment of the present application, after calculating the coordinate deviation value of the workpiece unit located at the 2nd column and 3rd row on the workpiece to be processed, the same coordinate deviation value compensation is performed on the workpiece unit located at the 2nd column and 3rd row during the subsequent processing of the workpiece to be processed. When there are multiple bow and arrow units on the workpiece to be processed, the coordinate deviation value of each workpiece unit is calculated sequentially.

[0050] S600: Perform statistical analysis based on the coordinate deviation value to determine the operating status of the laser processing device.

[0051] In step S600, since the detection information is bound to the position of the workpiece unit on the workpiece to be processed, the operating status of the laser processing device can be determined by statistical analysis of the coordinate deviation value, thereby avoiding processing quality problems caused by problems with the laser processing device.

[0052] The position compensation method for laser processing provided in this application calculates the coordinate deviation value of the workpiece unit by using the coordinate information of the drawing and the actual coordinate information, and compensates the workpiece unit located at the same position on the subsequent workpiece to be processed based on the coordinate deviation value, thereby improving the accuracy of laser processing and thus improving product quality. At the same time, a camera is used to take a picture of the processed workpiece unit to obtain detection information of the processed workpiece unit, and the detection information is bound to the position of the workpiece unit on the workpiece to be processed. Statistical analysis is then performed based on the coordinate deviation value to determine the operating status of the laser processing device. This can determine the operating status of the laser processing device and avoid problems with processing quality caused by problems with the laser processing device.

[0053] Step S600 of “performing statistical analysis based on coordinate deviation values ​​to determine the operating status of the laser processing device” may specifically include: analyzing the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed to determine the operating status of the laser processing device.

[0054] By analyzing the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed, the deviation trend of the processing size of the same workpiece to be processed can be statistically calculated.

[0055] See also Figure 3 The step of “analyzing the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed to determine the operating status of the laser processing device” may specifically include steps S610 and S620.

[0056] S610. Compare the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the X-axis direction. If the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the X-axis direction are within a first preset range, it is determined that the laser processing device has an error in the X-axis direction.

[0057] In step S610, the "first preset range" refers to the allowable fluctuation range of the numerical values ​​of the coordinate deviation values ​​in the X-axis direction. When the values ​​of the coordinate deviation values ​​fall within the first preset range, it can be determined that the laser processing device has an error in the X-axis direction. For example, in one embodiment of the present application, if the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the X-axis direction are all too large or too small and are within the first preset range, it can be determined that the laser processing device has an error in the X-axis direction. In this case, it is necessary to stop the processing operation promptly to avoid unnecessary losses.

[0058] S620. Compare the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the Y-axis direction. If the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the Y-axis direction are within a second preset range, it is determined that there is an error in the Y-axis direction of the laser processing device.

[0059] In step S620, the "second preset range" refers to the allowable fluctuation range of the numerical values ​​of the coordinate deviation values ​​in the Y-axis direction. When the magnitude of the coordinate deviation values ​​falls within the second preset range, it can be determined that the laser processing device has an error in the Y-axis direction. For example, in one embodiment of the present application, if the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the Y-axis direction are all too large or too small and are within the second preset range, it can be determined that the laser processing device has an error in the Y-axis direction. In this case, it is necessary to stop the processing operation in a timely manner to avoid unnecessary losses.

[0060] The laser processing device may include a mobile platform for carrying a workpiece to be processed, and a galvanometer for processing workpiece units on the workpiece to be processed. "An error in the laser processing device in the X-axis direction" may specifically include an error in the mobile platform in the X-axis direction and / or an error in the galvanometer in the X-axis direction. "An error in the laser processing device in the Y-axis direction" may specifically include an error in the mobile platform in the Y-axis direction and / or an error in the galvanometer in the Y-axis direction. In this case, it is necessary to troubleshoot the mobile platform or the galvanometer separately to determine the source of the error.

[0061] See also Figure 4 The detection information may also include defect information of the workpiece unit. Step S600 "performing statistical analysis based on the coordinate deviation value to determine the operating status of the laser processing device" may also include step S700.

[0062] S700 , collecting statistics on defect information of workpiece units located at the same position on different workpieces to be processed to determine the incoming material situation.

[0063] In step S700, by collecting statistics on defects in workpiece units located at the same position on different workpieces to be processed, the incoming material condition can be determined, thereby preventing material waste. Specifically, when the number of defects in workpiece units located at the same position on different workpieces to be processed reaches a preset number, it can be determined that there is a problem with the incoming material and timely intervention is required.

[0064] Inspection information can also include workpiece unit identification information. Each workpiece unit has a unique ID. By using a camera to identify the workpiece unit's identification information, it is easy to associate the workpiece unit with its location on the workpiece being processed, facilitating subsequent statistical analysis. Specifically, the ID can be a QR code carrying the identification information.

[0065] Before step S200 of "machining the workpiece unit on the workpiece to be machined according to the drawing coordinate information of the machining contour of the workpiece unit", step S100 of obtaining the drawing coordinate information of the machining contour of the workpiece unit is also included.

[0066] In step S100 , the coordinate information of the workpiece unit machining contour drawing can usually be set on the drawing software.

[0067] Step S500 "compensating the workpiece unit located at the same position on the subsequent workpiece to be processed according to the coordinate deviation value" can specifically include: when processing the workpiece unit located at the same position on the subsequent workpiece to be processed, the actual coordinate information of the workpiece unit is the drawing coordinate information of the workpiece unit plus or minus the coordinate deviation value.

[0068] The actual coordinate information of the workpiece unit can be obtained by adding or subtracting the coordinate deviation value from the drawing coordinate information of the workpiece unit, thereby improving the processing accuracy.

[0069] The present application also provides a laser processing device, including a galvanometer, a camera, a calculation module, a compensation module and a statistical module. The galvanometer is used to process a workpiece unit on a workpiece to be processed according to the coordinate information of the drawing of the workpiece unit processing contour. The camera is used to take a picture of the processed workpiece unit to obtain detection information of the processed workpiece unit, and bind the detection information with the position of the workpiece unit on the workpiece to be processed. The detection information includes the actual coordinate information of the workpiece unit processing contour. The calculation module is used to calculate the coordinate deviation value of the workpiece unit based on the drawing coordinate information and the actual coordinate information. The compensation module is used to compensate the workpiece unit located at the same position on the subsequent workpiece to be processed according to the coordinate deviation value. The statistical module is used to perform statistical analysis based on the coordinate deviation value to determine the operating status of the laser processing device.

[0070] The present application also provides a computer device, comprising:

[0071] a processor configured to execute computer-executable instructions;

[0072] The memory stores one or more computer executable instructions. When the computer executable instructions are executed by the processor, each step of the position compensation method for laser processing in any of the above embodiments is implemented.

[0073] The memory, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as program instructions corresponding to the laser processing method in the embodiments of the present application. The processor implements the aforementioned laser processing position compensation method by executing the software programs, instructions, and modules stored in the memory.

[0074] The memory may primarily include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function; the data storage area may store data generated based on the use of the terminal. Furthermore, the memory may include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. Examples of the aforementioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0075] The present application also provides a computer-readable storage medium on which a computer program is stored. The computer program is executed by a processor to implement the various steps of the position compensation method for laser processing in any of the above embodiments.

[0076] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A position compensation method for laser processing, applied to a laser processing device, characterized by: include: Processing the workpiece unit on the workpiece to be processed according to the coordinate information of the workpiece unit processing contour in the drawing file; Using a camera to photograph the processed workpiece unit to obtain detection information of the processed workpiece unit, and binding the detection information to the position of the workpiece unit on the workpiece to be processed, the detection information including actual coordinate information of the workpiece unit processing contour and defect information of the workpiece unit; Calculating a coordinate deviation value of a workpiece unit according to the drawing coordinate information and the actual coordinate information; Compensating a workpiece unit located at the same position of a subsequent workpiece to be processed according to the coordinate deviation value; Performing statistical analysis based on the coordinate deviation value to determine the operating status of the laser processing device; The defect information of workpiece units located at the same position on different workpieces to be processed is counted to determine the incoming material situation.

2. The position compensation method for laser processing according to claim 1, wherein: The step of "performing statistical analysis based on the coordinate deviation value to determine the operating status of the laser processing device" specifically includes: The coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed are analyzed to determine the operating status of the laser processing device.

3. The position compensation method for laser processing according to claim 2, wherein: The step of "analyzing the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed to determine the operating status of the laser processing device" specifically includes: Comparing the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the X-axis direction, if the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the X-axis direction are within a first preset range, it is determined that the laser processing device has an error in the X-axis direction; The coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the Y-axis direction are compared. If the coordinate deviation values ​​of each workpiece unit on the same workpiece to be processed in the Y-axis direction are within the second preset range, it is determined that there is an error in the Y-axis direction of the laser processing device.

4. The position compensation method for laser processing according to claim 3, wherein: The laser processing device includes a mobile platform for carrying a workpiece to be processed, and a galvanometer for processing a workpiece unit on the workpiece to be processed. "The laser processing device has an error in the X-axis direction" specifically includes that the mobile platform has an error in the X-axis direction and / or the galvanometer has an error in the X-axis direction; "The laser processing device has an error in the Y-axis direction" specifically includes that the mobile platform has an error in the Y-axis direction and / or the galvanometer has an error in the Y-axis direction.

5. The position compensation method for laser processing according to claim 1, wherein: The detection information also includes identification information of the workpiece unit, and each workpiece unit has a unique identity ID.

6. The position compensation method for laser processing according to claim 1, wherein: Before the step of "machining the workpiece unit on the workpiece to be machined according to the drawing coordinate information of the machining contour of the workpiece unit", the step also includes: obtaining the drawing coordinate information of the machining contour of the workpiece unit.

7. A laser processing device, characterized in that: include: A galvanometer is used to process the workpiece unit on the workpiece to be processed according to the coordinate information of the workpiece unit processing contour in the drawing; A camera is used to take a picture of the processed workpiece unit to obtain detection information of the processed workpiece unit, and to bind the detection information to the position of the workpiece unit on the workpiece to be processed, wherein the detection information includes actual coordinate information of the processing contour of the workpiece unit and defect information of the workpiece unit; A calculation module, configured to calculate a coordinate deviation value of a workpiece unit according to the drawing coordinate information and the actual coordinate information; a compensation module, configured to compensate a workpiece unit located at the same position of a subsequent workpiece to be processed according to the coordinate deviation value; and a statistical module, configured to perform statistical analysis based on the coordinate deviation value to determine an operating state of the laser processing device; It is used to collect statistics on the defect information of workpiece units located at the same position on different workpieces to be processed to determine the incoming material situation.

8. A computer device, characterized in that: include: a processor configured to execute computer-executable instructions; A memory storing one or more computer executable instructions, wherein when the computer executable instructions are executed by the processor, each step of the position compensation method for laser processing according to any one of claims 1 to 6 is implemented.

9. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and the computer program is executed by a processor to implement each step of the position compensation method for laser processing according to any one of claims 1 to 6.

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