Display substrate, detection equipment, detection method and display device

Abstract

The present application provides a display substrate, a detection device, a detection method, and a display device, wherein the display substrate includes a display area and a wiring area located around the display area, the wiring area has an electroluminescent test layer and a power module, and the display substrate also includes a test circuit, the test circuit is connected to the electroluminescent test layer through a first test point, and is connected to the power module through a second test point; wherein the first test point is configured to receive a first test signal input by the detection device so that the test circuit detects the working state of the electroluminescent test layer; the second test point is configured to receive a second test signal input by the detection device so that the test circuit detects the working state of the power module. The display substrate provided by the present application can use the detection device to perform electrical detection and power module detection, thereby meeting the open and short circuit status detection of the power module of the display substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display substrate, a detection device, a detection method, and a display apparatus. Background Art

[0002] Currently, after the OLED (Organic Light-Emitting Diode) display substrate is manufactured, it is impossible to determine whether the power supply and timing signals related to the FPC (Flexible Printed Circuit) on the cover chip film or panel are short-circuited or open-circuited. After the display modules are mass-produced, these short-circuits or open-circuits are discovered only when problems are discovered and traced. This leads to low production efficiency, low yield, and significant cost losses. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a display substrate, a detection device, a detection method and a display apparatus.

[0004] Based on the above objectives, in a first aspect, the present application provides a display substrate, comprising a display area and a wiring area located around the display area, wherein the wiring area has an electroluminescent test layer and a power module, and the display substrate further comprises:

[0005] a test circuit connected to the electroluminescent test layer via a first test point and connected to the power module via a second test point;

[0006] In which, the first test point is configured to receive a first test signal input by a detection device so that the test circuit detects the working status of the electroluminescent test layer; the second test point is configured to receive a second test signal input by the detection device so that the test circuit detects the working status of the power module.

[0007] In some embodiments, the first test point and / or the second test point is a connector pin, and the connector pin is configured to be connected to the detection device by pressing.

[0008] In some embodiments, the first test point and the second test point are connector pins, and the first test point and the second test point are located on the same connector pin seat.

[0009] In some embodiments, the power supply module includes at least: a digital module, an analog module, an internal power supply, and a virtual channel identifier.

[0010] In a second aspect of the present application, a testing device is provided, comprising: a base configured to receive a display substrate, wherein the base is provided with a connection terminal for connecting to a test circuit of the display substrate, the connection terminal being configured to apply a first test signal or a second test signal to the test circuit;

[0011] The pressing plate is provided on the base and is configured to press the display substrate so as to connect the test circuit of the display substrate to the connection terminal.

[0012] In some embodiments, the connection end is configured to be press-fit connected to the test circuit.

[0013] In some embodiments, further comprising:

[0014] The alarm unit is electrically connected to the base station and is configured to cut off power to the base station and issue an alarm when detecting that the base station is in an abnormal current state.

[0015] In a third aspect, the present application further provides a method for detecting a display substrate as described in any one of the above items, comprising:

[0016] Applying a second test signal to a second test point of a test circuit of the detection substrate through a detection device, and obtaining a voltage value of a power module of the display substrate after the second test signal is applied;

[0017] detecting a working state of the power module according to a voltage value of the power module;

[0018] In response to the voltage value being within a preset threshold range, it is determined that the operating state of the power module is normal.

[0019] In some embodiments, before applying the second test signal to the second test point of the test circuit of the display substrate by the detection device, the method further includes:

[0020] A first test signal is applied to a first test point of the display substrate by the detection device, and a working state of the wiring area of ​​the display substrate is detected according to the luminous state of the electroluminescent test layer of the display substrate.

[0021] In a fourth aspect of the present application, a display device is provided, comprising a display substrate as described in any one of the above items.

[0022] From the above description, it can be seen that the display substrate, detection equipment, detection method and display device provided by the present application, by setting a test circuit on the display substrate, the test circuit can detect the electroluminescent detection layer and the power module, and can detect whether there are defective products with open and short circuits in the power module during the assembly line finished product process stage of the display substrate. This setting can effectively avoid the situation where short circuits are found after assembling and forming a large number of display modules and the problem needs to be traced back later, thereby effectively reducing the later detection costs and losses, and is conducive to ensuring the normal processing and forming of the display substrate in the later stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in this application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are merely embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 Schematic diagram of the structure of a display substrate according to a related solution in an embodiment of the present application;

[0025] Figure 2 This is a schematic diagram of the structure of the detection device in the relevant scheme of the embodiment of the present application;

[0026] Figure 3 This is a schematic diagram of the three-dimensional structure of the detection device in the embodiment of the present application;

[0027] Figure 4 This is a schematic diagram of the circuit principle of connecting AVDD and the detection device in an embodiment of the present application;

[0028] Figure 5 Schematic diagram of the detection method in the embodiment of the present application.

[0029] in:

[0030] 1. Display substrate; 11. Display area; 12. Routing area; 13. Test circuit;

[0031] 21. Base; 22. Pressing plate; 23. Detection and alignment unit; 24. Connecting end. DETAILED DESCRIPTION

[0032] In order to make the objectives, technical solutions and advantages of this application more clear, the application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0033] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should have the usual meanings understood by people with ordinary skills in the field to which this application belongs. The "first", "second" and similar words used in the embodiments of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0034] In the related art, during the OLED manufacturing process, after the display substrate 1 is completed, an ET test (Electric Test) is required to check whether the display image of the display substrate 1 is normal. In other words, an external circuit detects the working status of the display substrate 1 by the on and off status of a test light. For example, in some micro OLED display panels, whether the display image of the display substrate 1 is normal is more urgent.

[0035] Micro OLED display panels typically include display devices, such as silicon-based OLEDs, that integrate millions or more light-emitting pixels on a substrate smaller than 2 inches. For example, during the silicon-based OLED manufacturing process, after the display substrate 1 is fabricated, an ET (Electric Test) is required to verify that the display image on the display substrate 1 is functioning properly. This involves an external circuit monitoring the operating status of the display substrate 1 by monitoring the on / off status of a test light.

[0036] During ET testing, the pins of the test circuit 13 are generally crimped onto the test electrodes of the wiring area 12 of the display substrate 1 to implement testing of the wiring area 12 of the display substrate 1. However, in the above-mentioned test steps, the ET test generally tests the power and timing signals of the GOA (Gate Driver on Array) circuit and the DATA circuit. It is impossible to determine whether the power and timing signals related to the FPC (Flexible Printed Circuit) on the cover chip film or panel are short-circuited or open-circuited. After the display modules are mass-produced, the above-mentioned short circuits or open circuits will not be discovered until the display modules are found and the problem is traced. This leads to low production efficiency, low yield rate, and significant cost losses.

[0037] In view of this, if Figure 1As shown, an embodiment of the present application provides a display substrate 1, including a display area 11 and a routing area 12 located around the display area 11, the routing area 12 having an electroluminescent test layer and a power module, the display substrate 1 also includes a test circuit 13, the test circuit 13 is connected to the electroluminescent test layer through a first test point, and is connected to the power module through a second test point; wherein the first test point is configured to be able to receive a first test signal input by a detection device, so that the test circuit 13 detects the working status of the electroluminescent test layer; the second test point is configured to be able to receive a second test signal input by the detection device, so that the test circuit 13 detects the working status of the power module.

[0038] Here, in the above embodiment, a test circuit 13 is set on the display substrate 1. The test circuit 13 can detect the electroluminescent detection layer and the power module, and can detect whether there are defective products with short circuits in the assembly line finished product process stage of the display substrate 1. This setting can effectively avoid the situation where a short circuit is found after a large number of display modules are assembled and formed, and the problem needs to be traced later, thereby effectively reducing the later detection cost and loss, and is conducive to ensuring the normal later processing and forming of the display substrate 1.

[0039] In the above embodiment, the test circuit 13 is connected to the electroluminescent test layer through a first test point and a first test signal is inputted, and the power supply and timing signals of the GOA circuit and the DATA circuit in the routing area 12 are detected to be working normally by observing the luminescence of the electroluminescent test layer; the test circuit 13 is connected to the power module through a second test point and a second test signal is inputted, and the voltage or current of the power module is detected to determine whether the power module is in an open-short circuit state, thereby screening the working state of the power module to facilitate the subsequent location and tracing of the problem of defective products.

[0040] It should be noted that the first test signal or the second test signal described in this embodiment can be a test current. That is, the test current is input into the electroluminescent test layer or the power module, and the operating status of the electroluminescent test layer or the power module is determined by real-time detection data of the input current. As an alternative embodiment, the first test signal or the second test signal can also use other detection parameters such as a test voltage.

[0041] In some embodiments, the first test point and / or the second test point is a connector pin, and the connector pin is configured to be connected to the detection device by pressing. Here, the connector pin is an existing mature pin pin. Optionally, the first test point and the second test point are both configured with a pin pin. The first test point and the second test point are located on the same pin pin holder. When the electroluminescent test layer needs to be tested, the pin pin corresponding to the first test point inputs a first test current. When the power module needs to be tested, the pin pin corresponding to the second test point inputs a second test current. The above-mentioned setting can facilitate the integration of the first test point and the second test point, and is conducive to the convenient implementation of subsequent detection work.

[0042] In this embodiment, since the actual detection target objects are different, the pin needles corresponding to the first test point and the second test point are also different. Specifically, the first test point corresponds to one or more pin needles for detecting the electroluminescent test layer, and the second test point corresponds to one or more pin needles for detecting the power module. The specific layout position and layout number of the pin needles should be set according to the actual detection target object.

[0043] As shown in Table 1 below, in some embodiments, the left column of Table 1 indicates pin numbers, and the right column indicates the actual pin array pins connected to the target objects corresponding to the test circuit 13. In this case, there are 34 pins in total, which together constitute the first test point and are used to perform a lighting test on the electroluminescent test layer. Here, each target object in Table 1 is located on the GOA circuit and the DATA circuit. When the test signal is input, the electroluminescent test layer can illuminate normally, indicating that the target objects corresponding to the first test point are operating normally.

[0044] As shown in Table 2 below, in some embodiments, Table 2 indicates pin numbers, and the right column indicates the actual pin array pins connected to the target objects corresponding to the test circuit 13. In this case, there are a total of 38 pins, of which four pin array pins that differ from those in Table 1 constitute the second test points and are used to test the power module. It should be noted that the four pins that differ from those in Table 1 are AVDD (digital module), DVDD (analog module), VDDI (internal power), and VCI (virtual channel identifier). These four target objects are generally located on a FOF (FPC on COF, flexible circuit board on chip film) or FOP (FPC on panel). Compared to the target objects in Table 1, they are located in different locations and are not based on the power timing signals of the GOA circuit or the DATA circuit. This configuration can facilitate the detection of the FOF or FOP, thereby further improving the inspection accuracy of the display substrate and preventing defective display substrates 1 due to the aforementioned signal parameter failures.

[0045] It should be noted that, according to the actual parameters of the display substrate 1 to be detected, the signal parameters corresponding to the detection of the above-mentioned pin connection ends 24 can be adjusted, for example, pins for detecting other power module parameters can be added.

[0046] pin ET pin ET pin ET pin ET pin ET 1 VSS 9 Nout 17 VGH 25 ECB 33 Vinitl 2 VSS 10 Gout 18 Dummy 26 ECK 34 Vinit 3 VSS 11 DR 19 VGLl 27 NSTV 4 VDD 12 SWR 20 Dummy 28 NCB 5 VDD 13 SWB 21 VGH 29 NCK 6 VDD 14 DB 22 Dummv 30 GSTV 7 Dummv 15 SWG 23 VGL 31 GCB 8 Eout 16 DG 24 ESTY 32 GCK

[0047] Table 1 Correspondence between pins and target objects of electroluminescent test layer

[0048] pin ET pin ET pin ET pin ET pin ET 1 VSS 9 Nout 17 VGH 25 ECB 33 Vinitl 2 VSS 10 Gout 18 Dummy 26 ECK 34 Vinit 3 VSS 11 DR 19 VGLl 27 NSTV 35 AVDD 4 VDD 12 SWR 20 Dummy 28 NCB 36 DVDD 5 VDD 13 SWB 21 VGH 29 NCK 37 VDDI 6 VDD 14 DB 22 Dummv 30 [[ID= 38 ​ 7 ​ 15 ​ 23 ​ 31 ​ 8 ​ 16 ​ 24 ​ 32 ​

[0049] Table 2: Pin Correspondence Table for the Overall Target Objects of the Power Module and the Electroluminescent Test Layer. In some embodiments, at least one of the four pins of the power module (AVDD (digital module), DVDD (analog module), VDDI (internal power supply), and VCI (virtual channel identifier)) is designed to be away from pins that are closer to the required test signals (e.g., voltage or current) in the electroluminescent test layer. For example, at least one of AVDD (digital module), DVDD (analog module), VDDI (internal power supply), and VCI (virtual channel identifier) ​​is away from pins such as VDD in the electroluminescent test layer. This design can effectively prevent malfunction or misjudgment of the detection equipment, while also minimizing process difficulty and minimizing changes to the original electroluminescent test layer test structure.

[0050] As an alternative implementation, the first test point or the second test point may also be connected in other ways, such as directly connecting to the detection device using a pad.

[0051] Based on the same inventive concept, the present application also provides a detection device, such as ​ and ​ As shown, it includes a base 21 and a pressing plate 22, wherein the base 21 is configured to receive the display substrate 1, wherein the base 21 is provided with a connection terminal 24 for connecting the test circuit 13 of the display substrate 1, and the connection terminal 24 is configured to apply a first test current or a second test current to the test circuit 13; the pressing plate 22 is provided on the base 21, and is configured to be able to press the display substrate 1 so that the test circuit 13 of the display substrate 1 is connected to the connection terminal 24.

[0052] Here, the above-mentioned detection equipment is capable of performing the detection process of the electroluminescent test layer and the power module on the aforementioned display substrate 1. The pressure plate 22 on the base 21 is rotatably connected to the base 21. After the display substrate 1 is placed on the base 21, the pressure plate 22 is rotated to the position of pressing the display substrate 1 and fixedly locked. The first test point and the second test point of the test circuit 13 of the display substrate 1 are connected to the connection end 24, thereby facilitating subsequent detection processes.

[0053] In some embodiments, when the first test point and the second test point are located on the same pin header, the connecting section and the pins corresponding to the pin header are pressed together to form an electrical connection. This press-fit connection method facilitates quick placement of the display substrate 1 on the base 21 to form an electrical connection, or removal of the display substrate 1 to disconnect the electrical connection for testing, thereby improving testing efficiency.

[0054] The detection device also includes an alarm unit, which is electrically connected to the base station 21 and is configured to disconnect the power to the base station 21 and issue an alarm when it detects that the base station 21 is in an abnormal current state. The alarm unit can employ an existing mature operating module. The abnormal current state detected by the alarm unit includes, for example, an open circuit or short circuit when the test current is input. Of course, the abnormal current state in this embodiment is merely an example.

[0055] In addition, the base 21 in this embodiment is provided with a detection alignment unit 23, which is electrically connected to the connection terminal 24. When the test circuit 13 and the connection terminal 24 are successfully crimped, the detection alignment unit 23 can emit a successful alignment mark because the test circuit 13 and the connection terminal 24 form a path, allowing the staff to determine that the connection is successful. This configuration can help calibrate the crimping accuracy and effectively improve the crimping stability of the test circuit 13 and the connection terminal 24.

[0056] It should be noted that, in the detection equipment of this embodiment, the circuit structure used for outputting test current, detecting the working status of the display substrate 1, etc. can be an RFPC (rigid flexible printed circuit) circuit structure, or an existing mature FPC circuit structure can be used.

[0057] Based on the same inventive concept, the present application further provides a detection method applied to the display substrate 1 as described in any of the aforementioned embodiments, comprising:

[0058] S11, applying a second test current to a second test point of the test circuit 13 of the detection substrate through a detection device, and obtaining a voltage value of the power module of the display substrate 1 after the second test current is applied;

[0059] S12, detecting the working state of the power module according to the voltage value of the power module;

[0060] S13: In response to the voltage value being within a preset threshold range, determining that the operating state of the power module is normal.

[0061] like ​ The above is a schematic diagram of the circuit principle corresponding to the AVDD target object in the detection power supply module, wherein the external input power supply M is located relatively above and is used to power the detection equipment; U1 is an external power supply, D1 and D2 are two diodes in the connection circuit, and D3 is a voltage regulator diode. Due to the unidirectional conductivity of the diode, when the detection equipment applies a forward current to AVDD, the diode D1 close to the input power supply M is turned on. At this time, the voltage at the AVDD end can be measured as a certain value of the diode voltage drop. By determining whether the voltage drop value is within a preset threshold range, it can be determined whether the AVDD working state in the power supply module is normal.

[0062] For example, by using the power supply U1, the detection device applies a forward current of 10mA to AVDD. At this time, the diode D1 is turned on, and the voltage at the AVDD end is a diode voltage drop in the range of 0.65-0.7V. If the diode voltage drop is between -0.2V and -1.5V, the AVDD working state is normal. If the diode voltage drop is greater than 1.5V, it means that the AVDD working state is open circuit. If the diode voltage drop is less than 0.2V, the AVDD working state is short circuit.

[0063] Alternatively, by using the power supply U1, the detection equipment applies a negative current of 10mA to AVDD. At this time, the diode D2 close to the ground terminal is turned on, and the voltage at the power supply M terminal is a diode voltage drop in the range of -0.65--0.7V. If the diode voltage drop is between -0.2V and -1.5V, the AVDD working state is normal. If the diode voltage drop is greater than 1.5V, it means that the AVDD working state is open circuit. If the diode voltage drop is less than 0.2V, the AVDD working state is short circuit.

[0064] Similarly, the above circuit structure can be used for other relevant detection objects of the power module, such as DVDD, VDDI, VCI, etc., and the corresponding input current can be detected.

[0065] It should be noted that in this embodiment, the above-mentioned AVDD detection terminal input current and diode voltage drop range are illustrated as examples. When different input currents or diode components of different specifications are used, the above-mentioned voltage drop range and preset threshold range should also be changed accordingly; in addition, when targeting different detection objects, the preset threshold range should also be adjusted according to different detection objects.

[0066] It should be noted that in some embodiments, the test circuit described above can be directly set on the detection device, and the connection end of the detection device is the output end of the test circuit. The principle of the test circuit is the same as the principle of the aforementioned test AVDD circuit. No additional test circuit is set on the display substrate. After the connection end is connected to the display substrate, the target object parameters on the power module of the display substrate are detected by the test circuit on the detection device. For example: the detection device includes multiple test circuits that are the same as the test AVDD circuit, which are used to separately detect the power modules, such as detecting at least one of DVDD, VDDI, and VCI, wherein the size of the diodes D1, D2, D3, U1, etc. of the test circuit can be adjusted according to the situation. Of course, the connection end of the detection device can also include multiple pins (that is, the output end of the test circuit includes multiple pins) for separately detecting the power modules.

[0067] like ​As shown, in some embodiments, before step S11, the following is further included: S10, applying a first test current to the first test point of the display substrate 1 through the detection device, and detecting the working state of the wiring area 12 of the display substrate 1 according to the luminous state of the electroluminescent test layer of the display substrate 1. Here, since the lighting detection of the electroluminescent test layer cannot completely detect the parameter state of the power module of the display substrate during the ET test phase, the step S10 can first detect the electroluminescent detection layer and then add the power module detection step of the display substrate. This setting can be used to detect whether there is a manufacturing defect in the front-end process that causes a signal short circuit, so as to prevent all the modules from being defective after mass production, resulting in high cost loss of the display module.

[0068] It should be noted that, in order to improve detection efficiency, the detection method in this embodiment may be to perform random inspections on some display substrates 1 of the same batch, and detect the yield rate of the display substrates 1 of the batch through the random inspection data.

[0069] In addition, the present application also provides a display device, comprising the display substrate 1 as described in any of the aforementioned embodiments.

[0070] It should be noted that the discussion of any of the above embodiments is merely exemplary, and is based on a silicon-based OLED display panel as an example, but is not limited thereto and may also be applicable to other types of OLED display panels.

[0071] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. Within the scope of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0072] In addition, for simplicity of description and discussion, and in order not to make the embodiment of the application difficult to understand, the known power supply / ground connection with integrated circuit (IC) chip and other components may or may not be shown in the accompanying drawings provided. In addition, the device can be shown in the form of a block diagram to avoid making the embodiment of the application difficult to understand, and this also takes into account the following fact, that is, the details of the embodiment of these block diagram devices are highly dependent on the platform to be implemented in the embodiment of the application (that is, these details should be fully within the scope of understanding of those skilled in the art). When specific details (for example, circuit) are set forth to describe exemplary embodiments of the application, it will be apparent to those skilled in the art that the embodiment of the application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0073] Although the present invention has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those skilled in the art based on the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may utilize the embodiments discussed.

[0074] The embodiments of the present application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of this application.

Claims

1. A display substrate, characterized in that: The display substrate includes a display area and a wiring area located around the display area, wherein the wiring area has an electroluminescent test layer and a power module. The display substrate also includes: a test circuit connected to the electroluminescent test layer via a first test point and connected to the power module via a second test point; The first test point is configured to receive a first test signal input by a detection device, so that the test circuit detects the working state of the electroluminescent test layer; the second test point is configured to receive a second test signal input by the detection device, so that the test circuit detects the working state of the power module; When the test circuit is connected to the electroluminescent test layer through the first test point and the first test signal is input, the power supply and timing signals of the GOA circuit and the DATA circuit in the routing area are detected according to the luminescence of the electroluminescent test layer to determine whether they are working properly; When the test circuit is connected to the power module through the second test point and the second test signal is input, the second test point is located at the pin of the FOF or FOP of the display substrate. The voltage or current of the power module is detected to check whether the power module is in an open-short circuit state, and the open-short circuit state of the FOF or FOP of the display substrate is checked by screening the working state of the power module.

2. The display substrate according to claim 1, wherein: The first test point and / or the second test point is a connector pin, and the connector pin is configured to be connected to the detection device by pressing.

3. The display substrate according to claim 2, wherein: The first test point and the second test point are connector pins, and the first test point and the second test point are located on the same connector pin seat.

4. The display substrate according to claim 1, wherein: The power supply module at least includes: a digital module, an analog module, an internal power supply and a virtual channel identifier.

5. A detection device suitable for detecting the display substrate according to any one of claims 1 to 4, characterized in that: include: a base, configured to receive the display substrate, wherein the base is provided with a connection terminal for connecting a test circuit of the display substrate, and the connection terminal is configured to apply a first test signal or a second test signal to the test circuit; The pressing plate is provided on the base and is configured to press the display substrate so as to connect the test circuit of the display substrate to the connection terminal.

6. The detection device according to claim 5, characterized in that The connection end is configured to be press-fit connected to the test circuit.

7. The detection device according to claim 5, characterized in that Also includes: The alarm unit is electrically connected to the base station and is configured to cut off power to the base station and issue an alarm when detecting that the base station is in an abnormal current state.

8. A method for detecting a display substrate according to any one of claims 1 to 4, characterized in that: include: Applying a second test signal to a second test point of a test circuit of the detection substrate through a detection device, and obtaining a voltage value of a power module of the display substrate after the second test signal is applied; detecting a working state of the power module according to a voltage value of the power module; In response to the voltage value being within a preset threshold range, it is determined that the operating state of the power module is normal.

9. The method for detecting a display substrate according to claim 8, wherein: Before applying the second test signal to the second test point of the test circuit of the display substrate by the detection device, the method further includes: A first test signal is applied to a first test point of the display substrate by the detection device, and a working state of the wiring area of ​​the display substrate is detected according to the luminous state of the electroluminescent test layer of the display substrate.

10. A display device, characterized in that: The display substrate comprises the display substrate according to any one of claims 1 to 4.

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