Camera module and method for manufacturing the same

Abstract

The present application provides an imaging module and a preparation method thereof. The imaging module includes a photosensitive component, a filter, and a split lens component sequentially arranged along the photosensitive path of the photosensitive component. The photosensitive component includes a photosensitive chip and a molding seat with an opening arranged around the photosensitive chip. The opening is located on the photosensitive path. The filter is arranged in the opening. The split lens component includes a zoom lens component. The zoom lens component is arranged in the middle of the split lens component and includes a zoom lens carrier part and zoom lenses arranged in the zoom lens carrier part. By arranging the zoom lens component in the middle of the split lens component and arranging the filter in the opening of the molding seat of the photosensitive component, miniaturization of the structure of the imaging module can be achieved while realizing the autofocus function of the imaging module.

Description

Technical Field

[0001] The present application relates to the field of optical imaging technology, and more particularly, to an imaging module and a method for manufacturing the imaging module. Background Art

[0002] With the popularization and development of mobile terminals with camera functions, the requirements for imaging modules applied to mobile terminals are also getting higher and higher.

[0003] Taking the front imaging module applied to a full-screen mobile phone as an example, in order to ensure the imaging quality of the front imaging module, it is necessary to set an opening on the screen (full screen) to ensure that the imaging module can receive sufficient light. In addition, in order to improve the imaging quality of the front imaging module, the front imaging module needs to have functions such as autofocus, anti-shake, and zoom.

[0004] However, with the increase of the above camera functions, the volume of the front imaging module will also increase accordingly. If it is applied to a full-screen mobile phone, the size of the opening on the screen will also increase accordingly.

[0005] Therefore, there is an urgent need for an imaging module and a manufacturing method that can solve the above problems to miniaturize the imaging module while optimizing the imaging function of the imaging module. Summary of the Invention

[0006] The present application provides an imaging module and a method for manufacturing the same, which can at least solve or partially solve at least one of the above disadvantages in the prior art or other deficiencies of the prior art.

[0007] On the one hand, the present application provides an imaging module, including: a photosensitive component, a filter, and a split lens assembly sequentially arranged along the photosensitive path of the photosensitive component, wherein the photosensitive component includes a photosensitive chip and a molding base with an opening disposed around the photosensitive chip, and the opening is located on the photosensitive path; the filter is disposed in the opening of the molding base; and the split lens assembly includes a zoom lens assembly, the zoom lens assembly is disposed in the middle of the split lens assembly, and includes a zoom lens carrier portion and zoom lenses disposed in the zoom lens carrier portion.

[0008] According to an embodiment of the present application, the zoom lens is an electro-wetting lens.

[0009] According to an embodiment of the present application, the projection of the upper end surface of the first lens carrier portion corresponding to the at least one lens on the photosensitive path is square, and the bottom surface of the zoom lens carrier portion opposite to the portion is also square.

[0010] According to an embodiment of the present application, the diameter of the zoom lens is smaller than the diameter of any lens of the first lens assembly.

[0011] According to an embodiment of the present application, the zoom lens carrier is provided with a first communication circuit connecting the zoom lens; and a second communication circuit is provided on the side wall of the first lens carrier, one end of the second communication circuit is electrically connected to the first communication circuit, and the other end of the second communication circuit is electrically connected to the circuit board of the photosensitive component.

[0012] According to an embodiment of the present application, the first communication circuit is molded on one side of the zoom lens carrier.

[0013] According to an embodiment of the present application, the second communication circuit is a conductive line or a conductive adhesive flexible circuit.

[0014] According to an embodiment of the present application, the conductive adhesive flexible circuit is prepared by laser direct structuring technology.

[0015] According to an embodiment of the present application, the photosensitive component further includes a circuit board provided with the photosensitive chip and the molding base, wherein an avoidance hole is provided on one side of the molding base to provide a line connection position for connecting the second communication circuit in the part of the circuit board located at the avoidance hole.

[0016] According to an embodiment of the present application, the photosensitive chip is electrically connected to the circuit board by a wire bonding process, and the metal wire used in the wire bonding process is molded inside the molding base.

[0017] According to an embodiment of the present application, the lower end of the first lens carrier in contact with the photosensitive component is square in the projection of the photosensitive path.

[0018] On the other hand, the present application also provides a method for manufacturing an imaging module, the method includes: disposing a photosensitive chip on the circuit board of the imaging module; disposing a molding base with an opening around the photosensitive chip on the circuit board, wherein the opening is disposed on the photosensitive path of the photosensitive chip; disposing a filter on the opening of the molding base; and disposing a split lens assembly above the filter, wherein the split lens assembly includes a zoom lens assembly, the zoom lens assembly is disposed in the middle of the split lens assembly, and includes a zoom lens carrier and a zoom lens disposed in the zoom lens carrier.

[0019] According to an embodiment of the present application, wherein the split lens assembly at least includes a first lens assembly, a second lens assembly, and a zoom lens assembly. The steps of disposing the split lens assembly above the filter include: disposing a zoom lens on a zoom lens carrier to form a zoom lens assembly; disposing at least one lens on a first lens carrier to form a first lens assembly; disposing the zoom lens assembly at a position corresponding to the at least one lens on the upper end surface of the first lens carrier; predetermining the position of the second lens assembly above the first lens assembly by using an adhesive material; adjusting the positional relationship between the first lens assembly and the second lens assembly by an active calibration method to align the optical axes of the first lens assembly and the second lens assembly; and curing the adhesive material to fix the first lens assembly and the second lens assembly at the positions determined by the active calibration.

[0020] According to an embodiment of the present application, disposing the zoom lens assembly at a position corresponding to the at least one lens on the upper end surface of the first lens carrier includes: electrically connecting a first connection circuit for conducting the zoom lens disposed on the zoom lens carrier to a second connection circuit disposed on the side wall of the first lens carrier.

[0021] According to an embodiment of the present application, the method further includes: integrally forming the first connection circuit and the zoom lens carrier by a molding process.

[0022] According to an embodiment of the present application, the method further includes: preparing the second connection circuit by a laser direct structuring process.

[0023] According to an embodiment of the present application, the method further includes: providing an avoidance hole on one side of the molding base to provide a line connection position for connecting the second connection circuit in a portion of the circuit board located at the avoidance hole, wherein the second connection circuit is disposed on the side wall of the first lens carrier.

[0024] According to an embodiment of the present application, the method further includes: integrally forming the avoidance hole and the molding base by a molding process.

[0025] According to an embodiment of the present application, the method further includes: providing a flexible connection band on one side of the circuit board to electrically connect the circuit board and a connector, wherein the connector is connected to an external power supply device.

[0026] According to at least one solution of the camera module provided above in the present application, at least one of the following beneficial effects can be achieved:

[0027] The camera module and its manufacturing method provided according to an embodiment of the present application can miniaturize the structure of the camera module while realizing the autofocus function of the camera module by arranging a zoom lens assembly in the middle of the split lens assembly and setting the filter in the opening of the molding seat of the photosensitive component.

[0028] Specifically, arranging the zoom lens assembly in the middle position of the lens assembly can effectively protect the zoom lens while reducing the size of the camera module and further reducing the actual installation space required after the camera module is applied to a mobile terminal. In addition, by setting the filter in the opening of the molding seat of the photosensitive component through processes such as molding, on the one hand, it can replace the traditional filter holder, reduce the height of the camera module, and is conducive to miniaturizing the structure of the camera module; on the other hand, the filter, circuit board, and molding seat can form a closed space for accommodating the photosensitive chip to protect the photosensitive chip and prevent dust or debris from entering the surface of the photosensitive chip and affecting its imaging effect.

[0029] In addition, according to the camera module and its manufacturing method provided by at least one embodiment of the present application, a part of the circuit structure for driving the deformation of the zoom lens can be injection-molded on the side wall of the sub-lens assembly accommodating the zoom lens assembly through Laser Direct Structuring (LDS) technology. Therefore, while reducing the manufacturing cost of the camera module and simplifying the manufacturing process of the camera module, the line width and line pitch of the above circuit structure can be effectively shortened, which is conducive to miniaturizing the structure of the camera module.

[0030] Furthermore, according to the camera module and its manufacturing method provided by at least one embodiment of the present application, an avoidance hole including a line connection position can also be set in the photosensitive component of the camera module as the connection part between the circuit structure for driving the deformation of the zoom lens and the circuit structure of the photosensitive component. The avoidance hole including the line connection position can provide a larger connection space between the circuit structure for driving the deformation of the zoom lens and the circuit board in the photosensitive component to ensure the stability of the entire line connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Other features, objects, and advantages of the present application will become more apparent by reading the detailed description of the non-limiting embodiments with reference to the following drawings:

[0032] Figure 1 is a schematic partial cross-sectional view of a camera module according to an embodiment of the present application;

[0033] Figure 2 is a schematic perspective view of a camera module according to an embodiment of the present application;

[0034] Figure 3Schematic exploded view of a lens assembly according to an embodiment of the present application;

[0035] Figure 4 Schematic perspective view of a lens assembly according to an embodiment of the present application;

[0036] Figure 5 Schematic exploded view of a zoom lens assembly according to an embodiment of the present application;

[0037] Figure 6 Schematic perspective view of a zoom lens assembly according to an embodiment of the present application;

[0038] Figure 7 Schematic cross-sectional view of an image sensor assembly according to an embodiment of the present application;

[0039] Figure 8 Schematic perspective view of an image sensor assembly according to an embodiment of the present application;

[0040] Figure 9 Flow chart for fabricating an imaging module according to an embodiment of the present application; and

[0041] Figure 10 Flow chart for fabricating a lens assembly according to an embodiment of the present application. Detailed Description of the Embodiments

[0042] For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application and do not limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0043] It should be noted that in this specification, the expressions such as first, second, third, etc. are only used to distinguish one feature from another feature and do not represent any limitation on the features. Therefore, without departing from the teachings of the present application, the first surface discussed below may also be referred to as the second surface. Vice versa.

[0044] In the accompanying drawings, for ease of illustration, the thickness, dimensions, and shapes of the components have been slightly adjusted. The drawings are only examples and are not drawn to an exact scale. As used herein, the terms "substantially", "about", and similar terms are used as terms indicating approximation and not as terms indicating degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by a person of ordinary skill in the art.

[0045] It should also be understood that expressions such as "comprising", "including", "having", "containing" and / or "including" are open-ended rather than closed-ended expressions in this specification, which means that the stated features, elements and / or components exist, but do not exclude the existence of one or more other features, elements, components and / or their combinations. In addition, when an expression such as "at least one of..." appears after a list of listed features, it modifies the entire list of features rather than just an individual element in the list. In addition, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application". And the term "exemplary" is intended to refer to an example or illustration.

[0046] Unless otherwise defined, all terms used herein (including engineering terms and scientific and technical terms) shall have the same meaning as commonly understood by those of ordinary skill in the art to which this application pertains. It should also be understood that unless there is a clear statement in this application, words defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense.

[0047] It should be noted that, without conflict, the embodiments and features in the embodiments of the present application may be combined with each other. In addition, unless clearly defined or in contradiction with the context, the specific steps included in the imaging module described in the present application do not have to be limited to the recorded order, but may be executed in any order or executed in parallel. The present application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0048] Figure 1 is a schematic partial cross-sectional view of an imaging module 1000 according to an embodiment of the present application. Figure 2 is a schematic perspective view of an imaging module 1000 according to an embodiment of the present application.

[0049] As Figure 1 and Figure 2As shown in the figure, the camera module 1000 may include an image sensor assembly 1100, a filter 1500, and a split lens assembly 1001. The image sensor assembly 1100 may include an image sensor chip 1120 and a molding base 1130 disposed around the image sensor chip 1120 and having an opening 12 located on the light sensing path (Z direction). The filter 1500 is disposed in the opening 12 of the molding base 1130. The split lens assembly 1001 may include an independent object-side lens assembly group constituting the free end of the split lens assembly, at least one independent image-side lens assembly group arranged in sequence and fixedly connected to the object-side lens assembly group, and a zoom lens assembly 1300. The image-side lens assembly group may be disposed close to the image sensor assembly 1100 and may include at least one lens assembly, such as a first lens assembly 1200. The object-side lens assembly group may be disposed away from the image sensor assembly 1100 and may include at least one lens assembly, such as a second lens assembly 1400. The zoom lens assembly 1300 is disposed in the middle of the split lens assembly 1001. In other words, the zoom lens assembly 1300 may be disposed between the object-side lens assembly group and the image-side lens assembly group of the split lens assembly 1001.

[0050] According to the camera module provided by the present application, by disposing a zoom lens assembly in the middle of the split lens assembly and disposing the filter in the opening of the molding base of the image sensor assembly, the miniaturization of the structure of the camera module can be achieved while realizing the autofocus function of the camera module.

[0051] Specifically, disposing the zoom lens assembly in the middle position of the lens assembly can effectively protect the zoom lens while reducing the size of the camera module and further reducing the actual required installation space after the camera module is applied to a mobile terminal. In addition, by disposing the filter in the opening of the molding base of the image sensor assembly through processes such as molding, on the one hand, it can replace the traditional filter holder, reduce the height of the camera module, and is conducive to realizing the miniaturization of the structure of the camera module. On the other hand, the filter, the circuit board, and the molding base can form a closed space for accommodating the image sensor chip to protect the image sensor chip and prevent dust or debris from entering the surface of the image sensor chip and affecting its imaging effect.

[0052] Lens assembly

[0053] In one embodiment of the present application, the camera module 1000 may include a first lens assembly 1200, a zoom lens assembly 1300, and a second lens assembly 1400, wherein the first lens assembly 1200 is an image side lens assembly group of the camera module 1000, the second lens assembly 1400 is an object side lens assembly group of the camera module 1000, and the zoom lens assembly 1300 is disposed between the first lens assembly 1200 and the second lens assembly 1400. Those skilled in the art should understand that the present application does not limit the number of lens assemblies included in the object side lens assembly group and the image side lens assembly group, and the number and material of lenses included in each lens assembly.

[0054] Specifically, refer again to Figure 1 and Figure 2 , the photosensitive component 1100 may be arranged at the bottom of the camera module 1000, and the first lens assembly 1200, the zoom lens assembly 1300 and the second lens assembly 1400 may be arranged in sequence above the photosensitive component 1100 along the light sensing path (Z direction) of the photosensitive component 1100. The first lens assembly 1200 may include a first lens bearing portion 1210 and at least one lens 1220 disposed in the first lens bearing portion 1210, wherein the first lens bearing portion 1210 also includes an upper end surface 1211 away from the photosensitive component 1100. The zoom lens assembly 1300 includes a zoom lens bearing portion 1310 and a zoom lens 1320 disposed in the zoom lens bearing portion 1310, and the zoom lens assembly 1300 may be disposed in the upper end surface 1211 of the first lens bearing portion 1210 and corresponds to the at least one lens 1220.

[0055] Figure 3 It is a schematic diagram of an exploded view of a lens assembly according to one embodiment of the present application. Figure 4 It is a schematic perspective view of a lens assembly according to one embodiment of the present application.

[0056] As an option, Figure 3 and Figure 4 As shown, an installation opening 11 can be provided in the upper end surface 1211 of the first lens bearing part 1210 for accommodating the zoom lens assembly 1300. Furthermore, a receiving structure 110 can be provided at the edge of the installation opening 11, and the zoom lens assembly 1300 can be installed on the receiving structure 110, so that the zoom lens assembly 1300 can be stably accommodated in the installation opening 11 after installation. In addition, in order to protect the zoom lens assembly 1300, the upper surface of the zoom lens bearing part 1310 can also be set to be lower than the upper end surface 1211 (such as Figure 1 As shown in FIG. 1 , the zoom lens assembly 1300 is recessed in the mounting opening 11 .

[0057] Figure 5Schematic exploded view of a zoom lens assembly 1300 according to an embodiment of the present application. Figure 6 Schematic perspective view of a zoom lens assembly 1300 according to an embodiment of the present application.

[0058] Specifically, as Figure 5 and Figure 6 shown, the zoom lens 1320 can generally be disposed at an intermediate mounting position inside the zoom lens carrier 1310. At the same time, an appropriate amount of remaining space can be reserved inside the zoom lens carrier 1310. As an option, the zoom lens carrier 1310 can be a cube structure of appropriate size.

[0059] Referring again to Figure 3 , in an embodiment of the present application, the portion (e.g., the mounting opening 11) in the upper end face 1211 of the first lens carrier 1210 where the zoom lens assembly 1300 is disposed may be square in the projection along the photosensitive path (Z direction), and the bottom surface of the zoom lens carrier 1310 opposite to the above-mentioned portion may also be square. The shape and size of the mounting opening 11 can be selected based on the shape and size of the zoom lens carrier 1310. For example, the mounting opening 11 can also be square, and its size can be larger than the size of the zoom lens carrier 1310. In this embodiment, the portion in the upper end face of the first lens carrier where the zoom lens assembly is disposed is arranged in this way. On the one hand, it can ensure the stability of the installation of the zoom lens assembly, and on the other hand, it can provide space for the deformation of the zoom lens, thereby ensuring the accuracy of the operation of the imaging module.

[0060] In the conventional technology, for the imaging module to achieve the function of shooting from far to near, the lens usually needs to move in the optical axis direction for focusing so that a clear imaging effect can always be obtained on the photosensitive chip. However, the distance that the lens moves in its optical axis direction needs to reach several hundred micrometers (effective focusing stroke), and since the driving component for driving the lens to move requires a larger non-fully linear stroke, the actual movable stroke of the lens in the driving component is much larger than the effective focusing stroke, thus resulting in the inability of the above-mentioned imaging module to achieve thinness and miniaturization.

[0061] Compared with the above traditional focusing methods, the camera module provided in this application can achieve the focusing function of the camera module by changing the curvature of the zoom lens disposed in the middle of the split lens assembly during the focusing process. Specifically, in an embodiment of this application, the zoom lens 1320 can be an electro-wetting lens. An electro-wetting lens is a lens based on the electro-wetting effect, where the electro-wetting effect refers to changing the wettability of the droplet on the substrate by changing the voltage between the droplet and the insulating substrate in the lens. In other words, by changing the voltage applied to the electro-wetting lens, the contact angle between the droplet and the insulating substrate can be changed, causing the droplet to deform and displace. Specifically, when no voltage is applied to the electro-wetting lens, the electro-wetting lens can be equivalent to a light-transmitting flat plate; when a voltage is applied to the electro-wetting lens, the curvature of the electro-wetting lens can be changed by the voltage, and then the electro-wetting lens can be equivalent to a lens. Therefore, the camera module provided in this application can achieve the automatic focusing function of the camera module by setting a zoom lens assembly in the middle of the split lens assembly and using the deformation of the zoom lens itself. In addition, setting the zoom lens assembly recessed on the top of a lens assembly can reduce the height of the camera module, which is beneficial to the miniaturization of the structure of the camera module. Further, setting the zoom lens assembly in the middle position of the split lens assembly can also effectively protect the zoom lens while further reducing the actual installation space required after the camera module is applied to a mobile terminal.

[0062] In practical applications, the camera module provided in this application can be used as a front camera module of a mobile terminal such as a full-screen mobile phone. Specifically, the screen of the mobile terminal is provided with an opening to ensure that the front camera module can receive sufficient light. The camera module provided in this application can be disposed on the main board of the mobile terminal and correspond to the above opening. Since the zoom lens assembly of the camera module provided in this application is disposed in the middle position of the split lens assembly, at least a part of the lens assembly close to the object side can be located in the opening. In other words, at least a part of the lens assembly close to the object side can penetrate into the backlight layer of the screen of the mobile terminal. Therefore, setting the zoom lens assembly in the middle position of the split lens assembly can not only effectively protect the zoom lens, but also further reduce the actual installation space required after the camera module is applied to a mobile terminal.

[0063] In an embodiment of this application, the second lens assembly 1400 may include, for example, 1 lens 1420, and as an option, the material of the lens 1420 may be plastic. In addition, the material of the lens 1420 may be glass or plastic, and this application does not make any limitations in this regard.

[0064] In an embodiment of this application, the first lens assembly 1200 may include 5 lenses 1220, and as an option, the material of the lenses 1220 may be plastic or glass, and this application does not make any limitations in this regard. As Figure 3As shown, affected by the optical path, the diameters of multiple lenses 1220 in the first lens assembly 1200 can gradually increase from the upper end surface 1211 of the first lens carrier 1210 downward. Therefore, the diameter of the zoom lens 1320 located in the upper end surface 1211 of the first lens assembly 1200 is smaller than the diameter of any lens 1220 in the first lens assembly 1200.

[0065] Further, referring again to Figure 3 and Figure 4 , in an embodiment of the present application, the imaging module 1000 may further include a circuit structure for driving the zoom lens 1320 to deform. Specifically, the circuit structure may include a first connection circuit disposed in the zoom lens carrier 1310 and connected to the zoom lens 1320; and a second connection circuit 12 disposed on the side wall 1212 of the first lens carrier 1210, one end of the second connection circuit 12 is electrically connected to the first connection circuit, and the other end of the second connection circuit 12 is electrically connected to the circuit board of the photosensitive component 1300.

[0066] As an option, the first connection circuit can be molded on one side of the zoom lens carrier 1310 to ensure the stability of the circuit structure, and accordingly save the installation space of the circuit structure to further reduce the volume of the imaging module. In addition, the second connection circuit 12 can be a conductive line or a conductive adhesive flexible circuit. For example, the second connection circuit 12 (conductive adhesive flexible circuit) can be injection molded on the outer surface of the side wall 1212 of the first lens carrier 1210 through Laser Direct Structuring (LDS) technology. Injecting a part of the circuit structure for driving the zoom lens to deform on the side wall of the sub-lens assembly that houses the zoom lens assembly can effectively shorten the line width and line pitch of the circuit structure for driving the zoom lens to deform while reducing the manufacturing cost of the imaging module and simplifying the manufacturing process of the imaging module, which is beneficial to realizing the miniaturization of the imaging module structure.

[0067] Photosensitive component

[0068] Figure 7 is a schematic cross-sectional view of the photosensitive component 1100 according to an embodiment of the present application. Figure 8 is a schematic perspective view of the photosensitive component 1100 according to an embodiment of the present application.

[0069] As Figure 7 and Figure 8As shown, in an embodiment of the present application, the photosensitive component 1100 may include: a circuit board 1110, a photosensitive chip 1120, and a molding base 1130. The photosensitive chip 1120 may be disposed on the first surface 1111 of the circuit board 1110. The molding base 1130 may be similarly disposed on the first surface 1111 and surround the photosensitive chip 1120. An opening 12 facing the photosensitive chip 1120 may be further disposed on the end face 1131 of the molding base 1130 away from the first surface 1111. The opening 12 may be used to accommodate the filter 1500 of the camera module 1000. The filter 1500 may be disposed in the opening 12 of the molding base 1130 of the photosensitive component 1100 through, for example, a molding process. The filter 1500, the circuit board 1110, and the molding base 1130 may form a closed space for accommodating the photosensitive chip 1120. Thus, while protecting the photosensitive chip, it is possible to prevent dust or debris from entering the surface of the photosensitive chip and affecting its imaging effect. In addition, disposing the filter in the opening of the molding base of the photosensitive component can replace the traditional filter holder for placing the filter, thereby effectively reducing the height of the camera module and facilitating the miniaturization of the structure of the camera module.

[0070] Further, in an embodiment of the present application, an avoidance hole 1132 may be disposed on one side of the molding base 1130 to expose a portion of the circuit board 1110 facing the avoidance hole 1132. Further, a line connection position 1113 for connecting a second communication circuit (as Figure 4 shown) may be disposed in the exposed portion of the circuit board 1110. The second communication circuit for driving the zoom lens to deform may be connected to an external power supply through the circuit board and via the line connection position (connection portion) disposed in the avoidance hole, thereby driving the zoom lens to deform. Therefore, disposing an avoidance hole including a line connection position in the camera module can provide a relatively large connection space between the circuit structure for driving the zoom lens to deform and the circuit board, so as to ensure the stability of the entire line connection for driving the zoom lens to deform.

[0071] In addition, after the above line is conducted, in order to ensure the stability of the above connection portion, corresponding protection measures may be set at the connection portion, such as sealing with glue or filling the avoidance hole 1132 with other substances. As an option, the avoidance hole 1132 may be integrally formed with the molding base 1130. Specifically, when designing the molding base 1130, the position of the avoidance hole 1132 may be directly set on the mold, so that the avoidance hole 1132 and the molding base 1130 are integrally formed, saving the manufacturing process of the camera module; as another option, the molding base 1130 may also be formed separately first, and then the avoidance hole 1132 is formed in subsequent steps of manufacturing the camera module. On one side of the already formed molding base 1132, a part of the structure is removed to form the avoidance hole 1132.

[0072] In addition, in an embodiment of the present application, the circuit structure 1101 of the photosensitive component 1100 may include a circuit board 1110, a flexible connection band 1140, and a connector 1150. The circuit board 1110 may be electrically connected to the connector 1150 through the flexible connection band 1140 provided on one side thereof, and the external power supply device is connected by the connector 1150 to supply power to the imaging module 1000. As an option, the photosensitive chip 1120 may be electrically connected to the circuit board 1110 through a wire bonding process to supply power to the photosensitive chip. The metal wires (for example, gold wires, silver wires, and copper wires, etc.) used in the wire bonding process may be formed inside the molding base 1130 through a molding process. Further, the molding base 1130 may also mold other components of the imaging module 1000, such as Hall elements, driving elements, etc. in its structure through a molding process to further reduce the volume of the imaging module.

[0073] The imaging module provided by the present application can miniaturize the structure of the imaging module while realizing the autofocus function of the imaging module by arranging a zoom lens assembly in the middle of the split lens assembly and arranging the filter in the opening of the molding base of the photosensitive component. In addition, arranging the zoom lens assembly in the middle position of the lens assembly can effectively protect the zoom lens and further reduce the actual installation space required after the imaging module is applied to the mobile terminal.

[0074] Figure 9 is a flowchart of the preparation of an imaging module according to an embodiment of the present application. As Figure 9 shown, on the other hand, the present application also provides a method 2000 for preparing an imaging module. The method 2000 mainly includes:

[0075] S1, arranging a photosensitive chip on the circuit board of the imaging module;

[0076] S2, arranging a molding base with an opening around the photosensitive chip on the circuit board, wherein the opening is arranged on the photosensitive path of the photosensitive chip.

[0077] S3, arranging a filter in the opening of the molding base.

[0078] S4, arranging a split lens assembly above the filter, wherein the split lens assembly includes a zoom lens assembly, the zoom lens assembly is arranged in the middle of the split lens assembly, and includes a zoom lens carrier part and a zoom lens arranged in the zoom lens carrier part.

[0079] Specifically, in combination with Figure 1 , Figure 7 , Figure 8 and Figure 9, a photosensitive chip 1120 can be disposed on the first surface 1111 of the circuit board 1110 of the camera module 1000, and a molding base 1130 can be disposed around the photosensitive chip 1120 on the first surface 1111. An opening is formed on the end face 1131 of the molding base 1130 away from the first surface 111, and the opening is directly opposite to the photosensitive chip 1120. A filter 1500 can be disposed in the opening. The filter 1500 can be disposed in the opening of the molding base 1130 of the photosensitive component 1100 through processes such as molding. The filter 1500, the circuit board 1110, and the molding base 1130 can form a closed space for accommodating the photosensitive chip 1120. Therefore, while protecting the photosensitive chip, it can prevent dust or debris from entering the surface of the photosensitive chip and affecting its imaging effect. In addition, disposing the filter in the opening of the molding base of the photosensitive component can replace the traditional filter holder for placing the filter, thus effectively reducing the height of the camera module and facilitating the miniaturization of the structure of the camera module.

[0080] Figure 10 is a flowchart of the preparation of a lens assembly according to an embodiment of the present application.

[0081] Further, in combination with Figure 3 , Figure 4 and Figure 10 , in an embodiment of the present application, the split lens assembly may at least include a first lens assembly, a second lens assembly, and a zoom lens assembly. Disposing the split lens assembly above the filter may include:

[0082] S41, disposing a zoom lens on a zoom lens carrier to form a zoom lens assembly;

[0083] S42, disposing at least one lens on a first lens carrier to form a first lens assembly;

[0084] S43, disposing the zoom lens assembly at a position corresponding to the at least one lens on the upper end face of the first lens carrier;

[0085] S44, pre-positioning the second lens assembly above the first lens assembly using an adhesive;

[0086] S45, adjusting the positional relationship between the first lens assembly and the second lens assembly through an active calibration method to align the optical axes of the first lens assembly and the second lens assembly.

[0087] S46, curing the adhesive to fix the first lens assembly and the second lens assembly at the positions determined by the active calibration.

[0088] The zoom lens 1320 may be first arranged on the zoom lens carrying part 1310 to form the zoom lens assembly 1300, and at least one lens 1220 may be arranged on the first lens carrying part 1210 to form the first lens assembly 1200. Then, the zoom lens assembly 1310 may be arranged in the upper end surface 1211 of the first lens carrying part 1210, and correspond to the at least one lens 1220. As an option, a mounting opening 11 may be provided in the upper end surface 1211 of the first lens carrying part 1210 for accommodating the zoom lens assembly 1300, and further, a receiving structure 110 may be provided at the edge of the mounting opening 11, and the zoom lens assembly 1300 may be mounted on the receiving structure 110, so that the zoom lens assembly 1300 after installation can be stably accommodated in the mounting opening 11.

[0089] In one embodiment of the present application, after the zoom lens assembly 1310 is set on the upper end surface 1211 of the first lens supporting portion 1210, the first connecting circuit set on the zoom lens supporting portion 1310 and used to conduct the zoom lens 1320 can be electrically connected to the second connecting circuit 11 set on the side wall 1211 of the first lens supporting portion 1210.

[0090] As an option, the first connecting circuit can be molded on one side of the zoom lens supporting portion 1310 to ensure the stability of the circuit structure and correspondingly save the installation space of the circuit structure to further reduce the volume of the camera module.

[0091] In addition, the second connecting circuit 12 can be a conductive circuit or a conductive adhesive flexible circuit. For example, the second connecting circuit 12 (conductive adhesive flexible circuit) can be injection molded on the outer surface of the side wall 1212 of the first lens bearing part 1210 by laser direct structuring (LDS) technology. The laser direct structuring technology is used to inject a part of the circuit structure that drives the zoom lens to deform on the side wall of the sub-lens assembly that accommodates the zoom lens assembly. While reducing the production cost of the camera module and simplifying the camera module manufacturing process, the line width and line spacing of the circuit structure that drives the zoom lens to deform can be effectively shortened, which is conducive to miniaturization of the camera module structure.

[0092] Afterwards, the second lens assembly 1400 can be positioned above the first lens assembly 1200 by using adhesive, and the positional relationship between the first lens assembly 1200 and the second lens assembly 1400 in the horizontal direction, vertical direction, tilt direction and circumferential direction can be adjusted by active calibration. After active calibration, the optical axes of the first lens assembly 1200 and the second lens assembly 1400 can be adjusted to be consistent to form the total optical axis of the lens assembly of the camera module 1000 (e.g. Figure 3The dashed line A) shown. Then, the above-mentioned adhesive material can be cured to fix the first lens assembly and the second lens assembly at the positions determined in the active calibration process. In the above assembly method, the lens assembly close to the photosensitive component is installed first, and other lens assemblies are assembled in sequence from bottom to top. This not only improves the accuracy of the assembly process, but also automates this assembly sequence, enabling automatic assembly using mechanical equipment and improving the assembly efficiency of the lens assembly. Further, by using the existing preparation method of the split lens assembly, the purpose of fully utilizing the existing process to save the production cost of the camera module can be achieved.

[0093] In addition, in an embodiment of the present application, the circuit structure 1101 of the photosensitive component 1100 may include a circuit board 1110, a flexible connection band 1140, and a connector 1150. The circuit board 1110 can be electrically connected to the connector 1150 through the flexible connection band 1140 provided on one side thereof, and the external power supply device is connected by the connector 1150 to supply power to the camera module 1000. As an option, the photosensitive chip 1120 can be electrically connected to the circuit board 1110 through a wire bonding process to supply power to the photosensitive chip. The metal wires (such as gold wires, silver wires, and copper wires, etc.) used in the wire bonding process can be formed inside the molding base 1130 through a molding process. Further, the molding base 1130 can also mold other components of the camera module 1000 in its structure through a molding process to further reduce the volume of the camera module.

[0094] In an embodiment of the present application, an avoidance hole 1132 can be provided on one side of the molding base 1130 to expose a part of the circuit board 1110 facing the avoidance hole 1132. Further, a circuit connection position 1113 for connecting the second communication circuit (as shown) can be provided in the exposed part of the circuit board 1110. The second communication circuit for driving the zoom lens to deform can be connected to an external power supply through the circuit board and via the circuit connection position (connection point) provided in the avoidance hole, thereby driving the zoom lens to deform. Therefore, setting an avoidance hole including a circuit connection position in the camera module can provide a larger connection space between the circuit structure for driving the zoom lens to deform and the circuit board to ensure the stability of the entire circuit connection for driving the zoom lens to deform. Figure 4 shown) to drive the zoom lens to deform. The second communication circuit for driving the zoom lens to deform can be connected to an external power supply through the circuit board and via the circuit connection position (connection point) provided in the avoidance hole, thereby driving the zoom lens to deform. Therefore, setting an avoidance hole including a circuit connection position in the camera module can provide a larger connection space between the circuit structure for driving the zoom lens to deform and the circuit board to ensure the stability of the entire circuit connection for driving the zoom lens to deform.

[0095] As an option, the avoidance hole 1132 and the molding seat 1130 can be integrally formed by, for example, a molding process. Specifically, when designing the molding seat 1130, the position of the avoidance hole 1132 can be directly set on the mold, so that the avoidance hole 1132 and the molding seat 1130 are integrally formed, reducing the manufacturing process of the camera module. As another option, the molding seat 1130 can be separately formed first, and then the avoidance hole 1132 can be formed in the subsequent steps of manufacturing the camera module. On one side of the already formed molding seat 1132, a part of the structure is removed to form the avoidance hole 1132. Those skilled in the art should understand that without departing from the technical solution claimed in this application, the manufacturing process and the specific position of the avoidance hole can be changed to obtain the various results and advantages described in this specification. Further, after the above circuit is conducted, in order to ensure the stability of the above connection, corresponding protection measures can be set at the connection, such as sealing with glue or filling the avoidance hole 1132 with other substances.

[0096] The method for manufacturing a lens assembly and the method for manufacturing a camera module provided in this application can miniaturize the structure of the camera module while realizing the autofocus function of the camera module by arranging a zoom lens assembly in the middle of the split lens assembly. Further, arranging the zoom lens assembly in the middle of the lens assembly can effectively protect the zoom lens and further reduce the actual installation space required after the camera module is applied to a mobile terminal.

[0097] The above description is only for the implementation mode of this application and the explanation of the technical principles applied. Those skilled in the art should understand that the protection scope involved in this application is not limited to the technical solution formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the technical concept. For example, the technical solution formed by mutually replacing the above features with the (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. An imaging module, characterized in that, it includes: a photosensitive component, a filter, and a split lens assembly sequentially arranged along the photosensitive path of the photosensitive component, wherein, the photosensitive component includes a photosensitive chip and a molding seat with an opening arranged around the photosensitive chip, and the opening is located on the photosensitive path; the filter is arranged in the opening of the molding seat; and the split lens assembly includes a first lens assembly, a zoom lens assembly, and a second lens assembly sequentially arranged along the photosensitive path. The zoom lens assembly is arranged between the first lens assembly and the second lens assembly and includes a zoom lens carrier and a zoom lens arranged in the zoom lens carrier. Among them, the first lens assembly is close to the photosensitive component and includes a first lens carrier and at least one lens arranged in the first lens carrier. An installation opening is arranged on the upper end surface of the first lens carrier; the zoom lens assembly is arranged in the installation opening and corresponds to the at least one lens, and the upper surface of the zoom lens carrier is lower than the upper end surface of the first lens carrier.

2. The imaging module according to claim 1, characterized in that, the zoom lens is an electro-wetting lens.

3. The imaging module according to claim 1, characterized in that, the zoom lens carrier is provided with a first connection circuit connecting the zoom lens; and a second connection circuit is arranged on the side wall of the first lens carrier. One end of the second connection circuit is electrically connected to the first connection circuit, and the other end of the second connection circuit is electrically connected to the circuit board of the photosensitive component.

4. The imaging module according to claim 3, characterized in that, the first connection circuit is molded on one side of the zoom lens carrier.

5. The imaging module according to claim 3, characterized in that, the second connection circuit is a conductive line or a conductive adhesive flexible circuit.

6. The imaging module according to claim 5, characterized in that, the conductive adhesive flexible circuit is prepared by a laser direct structuring technology.

7. The imaging module according to claim 3, characterized in that, the photosensitive component further includes a circuit board provided with the photosensitive chip and the molding seat, wherein, an avoidance hole is arranged on one side of the molding seat to set a line connection position for connecting the second connection circuit in the part of the circuit board located at the avoidance hole.

8. The imaging module according to claim 7, characterized in that, the photosensitive chip is electrically connected to the circuit board by a wire bonding process, and the metal wire used in the wire bonding process is molded inside the molding seat.

9. The imaging module according to claim 1, characterized in that, the projection of the part of the upper end surface of the first lens carrier corresponding to the at least one lens on the photosensitive path is square, and the bottom surface of the zoom lens carrier corresponding to the part is also square.

10. The imaging module according to claim 1, characterized in that, the diameter of the zoom lens is smaller than the diameter of any lens of the first lens assembly.

11. The camera module according to claim 1, wherein, the projection of the lower end of the first lens carrier in contact with the photosensitive component on the photosensitive path is square.

12. A method for manufacturing a camera module, wherein, the method includes: arranging a photosensitive chip on the circuit board of the camera module; arranging a molding base with an opening around the photosensitive chip on the circuit board, wherein the opening is arranged on the photosensitive path of the photosensitive chip; arranging a filter in the opening of the molding base; and arranging a split lens assembly above the filter, wherein, the split lens assembly includes a first lens assembly, a zoom lens assembly, and a second lens assembly arranged in sequence along the photosensitive path, the zoom lens assembly is arranged between the first lens assembly and the second lens assembly, and includes a zoom lens carrier and a zoom lens arranged in the zoom lens carrier; arranging a split lens assembly above the filter includes: arranging the zoom lens in the zoom lens carrier to form the zoom lens assembly; arranging at least one lens in the first lens carrier to form the first lens assembly, wherein an installation opening is arranged on the upper end surface of the first lens carrier; arranging the zoom lens assembly in the installation opening and corresponding to the at least one lens, wherein the upper surface of the zoom lens carrier is lower than the upper end surface of the first lens carrier.

13. The method according to claim 12, wherein, the step of arranging a split lens assembly above the filter further includes: predetermining the second lens assembly above the first lens assembly by using an adhesive; adjusting the positional relationship between the first lens assembly and the second lens assembly by an active calibration method to align the optical axes of the first lens assembly and the second lens assembly; and curing the adhesive to fix the first lens assembly and the second lens assembly at the positions determined by the active calibration.

14. The method according to claim 13, wherein, arranging the zoom lens assembly at a position corresponding to the at least one lens on the upper end surface of the first lens carrier includes: electrically connecting a first connection circuit for conducting the zoom lens arranged on the zoom lens carrier to a second connection circuit arranged on the side wall of the first lens carrier.

15. The method according to claim 14, wherein, the method further includes: integrally forming the first connection circuit and the zoom lens carrier by a molding process.

16. The method according to claim 14, wherein, the method further includes: preparing the second connection circuit by a laser direct structuring process.

17. The method according to claim 14, wherein, the method further includes: arranging an avoidance hole on one side of the molding base to arrange a line connection position for connecting the second connection circuit in a part of the circuit board located at the avoidance hole, wherein the second connection circuit is arranged on the side wall of the first lens carrier.

18. The method according to claim 17, wherein, the method further comprises: forming the avoidance hole and the molding base integrally by a molding process.

19. The method according to claim 12, wherein, the method further comprises: providing a flexible connection band on one side of the circuit board to electrically connect the circuit board and a connector, wherein the connector is connected to an external power supply device.

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