Headphone assembly accuracy detection method and device

Abstract

The present invention discloses a method and device for detecting the assembly accuracy of headphones, which belongs to the technical field of headphone production. The headphone assembly accuracy detection method is used to detect the assembly accuracy of an integrated chip in the shell of the headphone, and includes the following steps: S1: capturing images through a 3D camera, identifying the outside of the opening of the shell in the captured image, and obtaining a reference surface; S2: capturing images through a 3D camera, identifying the surface of the integrated chip in the captured image, and obtaining multiple feature points; S3: obtaining a feature surface through each feature point, and obtaining the height difference between the feature surface and the reference surface; S4: capturing the minimum distance feature point and the maximum distance feature point between the reference surface and the surface of the integrated chip; a feature line is formed between the minimum distance feature point and the maximum distance feature point, and the angle between the feature line and the horizontal plane is obtained. The headphone assembly accuracy detection device of the present invention utilizes the above-mentioned headphone assembly accuracy detection method to detect headphones, which can improve the efficiency of headphone detection.

Description

Technical Field

[0001] The present invention relates to the technical field of earphone production, and in particular to a method and device for detecting earphone assembly accuracy. Background Art

[0002] With the development of Bluetooth headset technology, people's demand for headset stability is increasing. Bluetooth headset stability includes the stability of various functions of the headset in various environments. The installation accuracy of an integrated chip on the Bluetooth headset's circuit board has a significant impact on the stability of the Bluetooth headset.

[0003] During the Bluetooth headset assembly process, integrated chips are prone to assembly deviations, which are difficult to correct through design. Assembly techniques and jigs are the only way to mitigate these deviations. However, visually detecting deviations in integrated chip assembly is difficult, and existing inspection equipment takes a long time to complete.

[0004] Therefore, there is an urgent need for a headphone assembly accuracy detection method and device to solve the above problems. Summary of the Invention

[0005] An object of the present invention is to provide a method for detecting the assembly accuracy of earphones, which can improve the detection efficiency of earphones.

[0006] Another object of the present invention is to provide an earphone assembly accuracy detection device, which uses the above-mentioned earphone assembly accuracy detection method to detect the earphone, thereby improving the detection efficiency of the earphone.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A method for detecting the assembly accuracy of an earphone is provided, for detecting the assembly accuracy of an integrated chip in an earphone housing, comprising the following steps:

[0009] S1: Capturing an image through a 3D camera, identifying and capturing the outer side of the opening of the shell in the image to obtain a reference surface;

[0010] S2: Capturing an image through a 3D camera, identifying and capturing a surface of the integrated chip in the image, and obtaining a plurality of feature points;

[0011] S3: Acquire a characteristic surface through each of the characteristic points, and obtain a height difference between the characteristic surface and the reference surface;

[0012] S4: capturing a minimum distance feature point and a maximum distance feature point between the reference surface and the surface of the integrated chip; forming a feature line between the minimum distance feature point and the maximum distance feature point, and obtaining an angle between the feature line and a horizontal plane.

[0013] Optionally, the 3D camera captures the image by emitting laser lines toward the surfaces of the housing and the integrated chip.

[0014] Optionally, in S1, the 3D camera emits multiple rays toward the outside of the shell opening to obtain the reference surface, and feedback results from each ray need to be consistent.

[0015] Optionally, the results of the tests in S3 and S4 need to both meet the standards.

[0016] Optionally, the judgment result is determined by detecting OK products or a preset range threshold.

[0017] A device for detecting the assembly accuracy of headphones utilizes the above-mentioned detection method to detect the assembly accuracy of an integrated chip within the housing of the headphones. The device comprises a base, a 3D camera, a position adjustment mechanism, and a jig. The 3D camera is disposed above the base; the position adjustment mechanism is disposed on the base; a jig is detachably positioned on the position adjustment mechanism, the jig is capable of positioning the housing, and the position adjustment mechanism is configured to adjust the position of the jig so that the jig is located directly below the 3D camera.

[0018] The position adjustment mechanism of the fixture includes a Y-direction adjustment platform, a Y-direction drive assembly, an X-direction adjustment platform and an X-direction drive assembly. The Y-direction adjustment platform is slidably arranged on the base along the Y-direction, and the Y-direction drive assembly is respectively connected to the base and the Y-direction adjustment platform, and the Y-direction drive assembly is used to drive the Y-direction adjustment platform to move along the Y-direction; the X-direction adjustment platform is slidably arranged on the Y-direction adjustment platform along the X-direction, and the X-direction drive assembly is respectively connected to the base and the X-direction adjustment platform, and the X-direction drive assembly is used to drive the X-direction adjustment platform to move along the X-direction.

[0019] Optionally, the position adjustment mechanism further includes a positioning component, and the positioning component is arranged on the top of the X-direction adjustment platform to position the fixture in the X-direction and the Y-direction.

[0020] Optionally, the positioning assembly includes positioning blocks arranged on two adjacent sides of the top of the X-direction adjustment platform, and the positioning blocks have a first positioning surface perpendicular to the X-direction and a second positioning surface perpendicular to the Y-direction.

[0021] Optionally, the jig includes a first positioning seat, a second positioning seat and a clamping assembly, the first positioning seat can be detachably positioned on the position adjustment mechanism, a positioning groove is provided on the top of the first positioning seat; the second positioning seat is positioned in the positioning groove, and a positioning hole is provided on the second positioning seat that passes through along the Z direction; the clamping assembly is arranged on the second positioning seat, and the clamping assembly is used to clamp and position the shell located in the positioning hole.

[0022] The beneficial effects of the present invention are:

[0023] The headphone assembly accuracy detection method of the present invention captures images through a 3D camera to select the outside of the opening of the inner shell of the image to obtain a reference surface, identifies the surface of the integrated chip in the captured image to obtain multiple feature points, obtains the feature surface through the feature points, calculates the height difference between the feature surface and the reference surface, and judges the installation accuracy of the integrated chip based on the angle between the feature line between the minimum distance feature point and the maximum distance feature point on the integrated chip from the reference surface and the horizontal plane. The method can quickly detect the assembly accuracy of the integrated chip and improve the detection efficiency of the headphone.

[0024] Another object of the present invention is an earphone assembly accuracy detection device, which uses the above-mentioned earphone assembly accuracy detection method to detect the assembly accuracy of the integrated chip in the earphone, thereby improving the detection efficiency of the earphone. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a flow chart of a headphone assembly accuracy detection method provided by a specific embodiment of the present invention;

[0026] Figure 2 is a perspective view of an earphone assembly accuracy detection device provided by a specific embodiment of the present invention;

[0027] Figure 3 is a three-dimensional diagram of the headphone assembly accuracy detection device provided by a specific embodiment of the present invention after the jig is removed;

[0028] Figure 4 It is a three-dimensional diagram of a fixture provided by a specific embodiment of the present invention;

[0029] Figure 5 is a top view of a fixture provided in a specific embodiment of the present invention;

[0030] Figure 6 yes Figure 5 Cross-section view at AA in the middle.

[0031] In the picture:

[0032] 1. Base;

[0033] 2. 3D camera;

[0034] 3. Position adjustment mechanism; 31. Y-axis adjustment platform; 311. Bump; 32. Y-axis drive assembly; 321. Y-axis drive member; 33. X-axis adjustment platform; 331. Slide; 34. X-axis drive assembly; 341. X-axis drive member; 35. Positioning assembly;

[0035] 4. Fixture; 41. First positioning seat; 411. Positioning groove; 42. Second positioning seat; 421. Positioning hole; 422. Groove; 423. Boss; 424. Limiting groove; 43. Clamping assembly; 431. First positioning structure; 4311. First positioning member; 43111. Guide groove; 4312. Second positioning member; 432. Second positioning structure; 4321. Block; 4322. Connecting member; 43221. Guide rod; 43221. Press block; 43223. Second bolt; 44. Cavity. DETAILED DESCRIPTION

[0036] In the description of the present invention, it should be noted that the terms "center," "up," "down," "left," "right," "vertical," "horizontal," "inside," and "outside" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0037] Unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," and "fixed" should be interpreted broadly. For example, they may refer to fixed or removable connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0038] Unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in contact with the second feature through another feature between them instead of being in direct contact. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0039] The following is combined with Figures 1-6 The technical solution of the present invention is further illustrated through specific implementation methods.

[0040] This embodiment provides a method for detecting the assembly accuracy of earphones. Figure 1As shown, the headphone assembly accuracy detection method includes the following steps:

[0041] S1, capturing an image through a 3D camera, identifying the outer side of the shell opening in the captured image, and obtaining a reference surface.

[0042] Specifically, the 3D camera emits 100 rays toward the outside of the shell opening to obtain a reference surface; further, if there is a large difference between the 100 rays, it is determined that the position of the earphone installed on the jig is inaccurate.

[0043] S2, collects images through a 3D camera, identifies the surface of the integrated chip in the captured image, and obtains multiple feature points.

[0044] In one embodiment of the present application, the image captured by the 3D camera is a depth image. The distance between the 3D camera 2 and each point varies, resulting in each point appearing in a different color in the captured image. This allows for the recognition and capture of the reference point and the surface of the integrated chip. The reference point and the surface of the integrated chip can be captured simultaneously or sequentially, with no limitation on the order of recognition and capture.

[0045] Specifically, the housing with the integrated chip mounted thereon is positioned below the 3D camera, with the housing providing no obstruction to the integrated chip, and the 3D camera then acquires a top-view image. Optionally, the 3D camera is a line laser 3D camera that captures images by emitting a laser line toward the surface of the housing and the integrated chip.

[0046] S3, constructing a feature surface through each feature point, and obtaining the height difference between the feature surface and the reference surface.

[0047] S4: Capture the minimum distance feature point between the reference surface and the integrated chip surface, and the maximum distance feature point between the reference surface and the integrated chip surface; construct a feature line between the minimum distance feature point and the maximum distance feature point, and obtain the angle between the feature line and the horizontal plane.

[0048] Specifically, the above steps are first performed on the OK product to obtain the standard height difference (H0) between the characteristic surface of the integrated chip in the OK product and the reference surface, and the standard angle between the reference line and the horizontal plane;

[0049] Then the above standard height difference (H0) and standard angle are entered into the control system;

[0050] The above steps are then performed on the test product to obtain the test height difference (H1) and the test angle of the test product. The control system can determine whether the integrated chip in the test product is qualified by comparing the test height difference (H1) with the standard height difference (H0) and comparing the test angle with the standard angle.

[0051] Furthermore, if the detection height difference (H1) is within the standard height difference (H0) range, the detected product is qualified, otherwise, the product is judged as defective; if the detection angle is within the standard angle range, the product is qualified, otherwise, the product is judged as defective;

[0052] Furthermore, the inspected product must meet both the qualified height difference and qualified angle tests to be judged as a good product. Conversely, if one of the items does not meet the requirements, the product will be judged as a defective product.

[0053] By capturing images with a 3D camera and obtaining detection height difference and detection angle information based on the captured images, the installation accuracy of the integrated chip can be judged. This can quickly detect the assembly progress of the integrated chip and improve the detection efficiency of the headphones.

[0054] Specifically, if the difference between the maximum distance feature point and the minimum distance feature point is large, and the angle between the characteristic line formed by the two feature points and the horizontal plane is greater than or less than the standard value, it indicates that the integrated chip is installed tilted, indicating that the integrated chip installation is unqualified; if the difference between the maximum distance feature point and the minimum distance feature point is small, and the angle between the characteristic line formed by the two feature points and the horizontal plane meets the standard value, but both the maximum distance and the minimum distance are less than the standard value, it also indicates that the integrated chip installation is unqualified. If the difference between the maximum distance and the minimum distance is small, the angle meets the standard value, and the difference between the maximum distance and the minimum distance is small, it indicates that the integrated chip installation is qualified.

[0055] Specifically, the maximum and minimum distance determination results are determined by inspecting approved products or by using preset distance range thresholds. The distance range thresholds are the upper and lower limits of the distance between the surface of the integrated chip and the reference surface. The maximum and minimum distances are compared and analyzed with the upper and lower limits to determine if the maximum and minimum distances meet the requirements.

[0056] The angle determination result is determined by inspecting approved products or by using a preset angle range threshold. The angle range threshold is the upper and lower limits of the angle between the surface of the integrated chip and the reference line. The angle between the reference line and the characteristic line is compared with the upper and lower limits to determine if the angle is acceptable. Furthermore, the angle range threshold is ±5°.

[0057] Furthermore, the headphone assembly accuracy detection method in this embodiment also includes displaying the detection results on a display screen so that the detection personnel can intuitively judge the detection results.

[0058] This embodiment also provides an earphone assembly accuracy detection device, which uses the above detection method to detect the assembly accuracy of the integrated chip in the earphone shell, such as Figure 2 As shown, the headphone assembly accuracy inspection device includes a base 1, a 3D camera 2, a position adjustment mechanism 3, and a jig 4. The 3D camera 2 is disposed above the base 1. The position adjustment mechanism 3 is disposed on the base 1. The jig 4 is detachably positioned on the position adjustment mechanism 3. The jig 4 is capable of positioning the housing. The position adjustment mechanism 3 is configured to adjust the position of the jig 4 so that the jig 4 is directly below the 3D camera 2.

[0059] When testing the assembly accuracy of the integrated chip, the shell is positioned on the jig 4, and the jig 4 is positioned on the position adjustment mechanism 3. The position of the jig 4 is adjusted by the position adjustment mechanism 3 so that the shell is located directly below the 3D camera 2, so that the image of the shell and the integrated chip is obtained by the 3D camera 2. The above-mentioned headphone assembly accuracy detection method is used to realize the detection of the assembly accuracy of the integrated chip. After the detection is completed, the jig 4 is removed from the position adjustment mechanism 3 to facilitate the detection of the next integrated chip.

[0060] like Figure 1 and Figure 2 As shown, the position adjustment mechanism 3 includes a Y-axis adjustment platform 31, a Y-axis drive assembly 32, an X-axis adjustment platform 33, and an X-axis drive assembly 34. The Y-axis adjustment platform 31 is slidably mounted on the base 1 in the Y direction. The Y-axis drive assembly 32 is connected to the base 1 and the Y-axis adjustment platform 31, respectively. The Y-axis drive assembly 32 is used to drive the Y-axis adjustment platform 31 to move in the Y direction. The X-axis adjustment platform 33 is slidably mounted on the Y-axis adjustment platform 31 in the X direction. The X-axis drive assembly 34 is connected to the base 1 and the X-axis adjustment platform 33, respectively. The X-axis drive assembly 34 is used to drive the X-axis adjustment platform 33 to move in the X direction. It will be understood that the Y-axis drive assembly 32 can drive the Y-axis adjustment platform 31 to move the X-axis adjustment platform 33 in the X direction, and the X-axis drive assembly 34 can drive the X-axis adjustment platform 33 to move the jig 4 in the X direction. This allows the jig 4 to be adjusted in both the X and Y directions.

[0061] Optionally, the Y-direction adjustment platform 31 is provided with protrusions 311 at both ends along the Y direction, and the X-direction adjustment platform 33 is provided with sliding grooves 331 on both sides corresponding to the protrusions 311, and each protrusion is located in a sliding groove 331, so that the X-direction adjustment platform 33 can be guided and limited by the protrusions 311.

[0062] In order to facilitate the positioning of the fixture 4, as shown in FIG. Figure 2 As shown, the position adjustment mechanism 3 further includes a positioning component 35 , which is disposed on top of the X-direction adjustment platform 33 to position the fixture 4 in the X-direction and the Y-direction.

[0063] Furthermore, the positioning assembly 35 includes positioning blocks disposed on two adjacent sides of the top of the X-axis adjustment platform 33. The positioning blocks have a first positioning surface perpendicular to the X-axis and a second positioning surface perpendicular to the Y-axis. In this embodiment, preferably, two positioning blocks are provided, one at each of two adjacent corners of the X-axis adjustment platform 33. Optionally, the positioning blocks are L-shaped.

[0064] Optionally, the Y-axis drive assembly 32 includes a Y-axis drive member 321 and a first elastic member (not shown). The Y-axis drive member 321 is disposed on a first mounting seat mounted on the base 1, and its actuator end can abut against the Y-axis drive member 321. One end of the first elastic member abuts against the Y-axis adjustment platform 31, and the other end abuts against the base 1. The first elastic member can drive the Y-axis adjustment platform 31 to reset. Optionally, the Y-axis drive member 321 is a thousandths knob.

[0065] X-axis drive assembly 34 includes an X-axis drive member 341 and a second elastic member (not shown). X-axis drive member 341 is mounted on a second mounting base mounted on base 1. Its actuator end can abut against X-axis drive member 341. One end of the second elastic member abuts against X-axis adjustment platform 33, and the other end abuts against base 1 or Y-axis adjustment platform 31. The second elastic member can drive X-axis adjustment platform 33 to reset. Optionally, X-axis drive member 341 is a thousandths knob.

[0066] like Figure 2 and Figure 4-Figure 6 As shown, the jig 4 includes a first positioning seat 41, a second positioning seat 42, and a clamping assembly 43. The first positioning seat 41 is removably positioned on the position adjustment mechanism 3. A positioning groove 411 is defined at the top of the first positioning seat 41. The second positioning seat 42 is positioned within the positioning groove 411. The second positioning seat 42 is defined by a positioning hole 421 extending along the Z direction. The clamping assembly 43 is disposed on the second positioning seat 42 and is used to clamp and position the housing within the positioning hole 421. When positioning the housing using the jig 4, the housing is placed within the positioning hole 421, and the clamping assembly 43 is used to clamp the positioning hole 421.

[0067] Furthermore, the clamping assembly 43 includes a first positioning structure 431 and a second positioning structure 432. The first positioning structure 431 is movably arranged on the second positioning seat 42 and is located on one side of the positioning hole 421. The positioning portion of the second positioning structure 432 can abut against the main body of the shell located in the positioning hole 421. The second positioning structure 432 is arranged on the second positioning seat 42, and its execution portion is located below the positioning hole 421 to cooperate with the second positioning seat 42 to clamp the handle of the shell.

[0068] Specifically, a boss 423 is formed on the top of the second positioning seat 42, a positioning hole 421 is formed above the boss 423, a groove 422 is formed on the second positioning seat 42 at a position corresponding to the positioning hole 421, and a limiting groove 424 is formed on the second positioning seat 42. The limiting groove 424 is located on one side of the boss 423. The first positioning structure 431 includes a first positioning member 4311 and a second positioning member 4312 connected to the first positioning member 4311. The first positioning member 4311 is movably disposed in the limiting groove 424. The first positioning member 4311 can drive the second positioning member 4312 to be pressed against the top of the housing located in the positioning hole 421. Specifically, a guide groove 43111 is formed on the first positioning member 4311, and the first positioning member 4311 is fixed by a first bolt that passes through the guide groove 43111 and is threadedly connected to the first positioning seat 41. When the first bolt is loosened, the first positioning member 4311 can move along the bolt, so that the first positioning member 4311 can drive the first positioning member 4311 to approach or move away from the positioning hole 421 .

[0069] The second positioning structure 432 includes a clamping block 4321, the top of which is located below the boss 423, and a cavity 44 for the housing handle to be penetrated is formed between the top of the clamping block 4321 and the bottom of the boss 423. The clamping block 4321 is detachably connected to the second positioning seat 42 via a connecting member 4322. Optionally, the connecting member 4322 includes a guide rod 43221, a pressure block 43221 having a countersunk hole, and a second bolt 43223. The second positioning seat 42 is provided with a stepped hole, the top diameter of the stepped hole being larger than the bottom diameter. The pressure block 43221 is at least partially penetrated through the top of the stepped hole. The clamping block 4321 is provided with a perforation corresponding to the stepped hole. The guide rod 43221 sequentially passes through the perforation and the stepped hole, and then is penetrated into the countersunk hole. The second bolt 43223 is penetrated into the countersunk hole and is threadedly connected to the top of the guide rod 43221. Rotating the guide rod 43221 can move the clamping block 4321 toward or away from the boss 423. When the clamping block 4321 is away from the boss 423, the handle of the housing can be easily inserted into the cavity 44. When the clamping block 4321 is close to the boss 423, the handle of the housing can be clamped in the cavity 44. In detail, the two opposite sides of the clamping block 4321 are respectively connected to the second positioning seat 42 via a connecting member 4322, so that the clamping block 4321 is securely connected to the second positioning seat 42.

[0070] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A method for detecting the assembly accuracy of an earphone, for detecting the assembly accuracy of an integrated chip in an earphone housing, characterized in that: The steps include: S1: Capturing an image through a 3D camera, identifying the outer side of the opening of the shell captured in the image, and obtaining a reference surface; S2: Capturing an image through a 3D camera, identifying and capturing a surface of the integrated chip in the image, and obtaining a plurality of feature points; S3: Acquire a characteristic surface through each of the characteristic points, and obtain a height difference between the characteristic surface and the reference surface; S4: capturing a minimum distance feature point and a maximum distance feature point between the reference surface and the surface of the integrated chip; forming a feature line between the minimum distance feature point and the maximum distance feature point, and obtaining an angle between the feature line and a horizontal plane; The 3D camera collects the image by emitting laser lines toward the surfaces of the housing and the integrated chip; In S1, the 3D camera emits multiple rays toward the outside of the housing opening to obtain the reference surface, and feedback results from each ray must be consistent to determine that the position of the earphone installed on the jig is accurate; If the test results in S3 and S4 both meet the standards, the product is judged to be good. The inspection result of the product is compared with the preset range threshold to determine whether the product is a good product. The range threshold includes a distance range threshold and an angle range threshold. The distance range threshold is the upper limit and lower limit of the distance between the surface of the integrated chip and the reference surface. The angle range threshold is the upper limit and lower limit of the angle between the surface of the integrated chip and the reference line.

2. The headphone assembly accuracy detection method according to claim 1, characterized in that: The invention also includes an earphone assembly accuracy detection device, which includes: Base (1); A 3D camera (2) is arranged above the base (1); A position adjustment mechanism (3), the position adjustment mechanism (3) being arranged on the base (1); and A jig (4) is detachably positioned on the position adjustment mechanism (3), the jig (4) being capable of positioning the housing, and the position adjustment mechanism (3) being configured to adjust the position of the jig (4) so as to position the jig (4) directly below the 3D camera (2).

3. The headphone assembly accuracy detection method according to claim 2, characterized in that: The position adjustment mechanism (3) comprises: A Y-direction adjustment platform (31) and a Y-direction drive assembly (32), wherein the Y-direction adjustment platform (31) is slidably arranged on the base (1) along the Y-direction, and the Y-direction drive assembly (32) is connected to the base (1) and the Y-direction adjustment platform (31) respectively, and the Y-direction drive assembly (32) is used to drive the Y-direction adjustment platform (31) to move along the Y-direction; and An X-direction adjustment platform (33) and an X-direction drive assembly (34), wherein the X-direction adjustment platform (33) is slidably arranged on the Y-direction adjustment platform (31) along the X-direction, and the X-direction drive assembly (34) is respectively connected to the base (1) and the X-direction adjustment platform (33), and the X-direction drive assembly (34) is used to drive the X-direction adjustment platform (33) to move along the X-direction.

4. The headphone assembly accuracy detection method according to claim 3, characterized in that: The position adjustment mechanism (3) further includes a positioning component (35), and the positioning component (35) is arranged on the top of the X-direction adjustment platform (33) to position the fixture (4) in the X-direction and the Y-direction.

5. The headphone assembly accuracy detection method according to claim 4, characterized in that: The positioning assembly (35) comprises positioning blocks arranged on two adjacent sides of the top of the X-direction adjustment platform (33), and the positioning blocks have a first positioning surface perpendicular to the X-direction and a second positioning surface perpendicular to the Y-direction.

6. The headphone assembly accuracy detection method according to claim 2, characterized in that: The fixture (4) includes: A first positioning seat (41) is detachably positioned on the position adjustment mechanism (3), and a positioning groove (411) is provided on the top of the first positioning seat (41); A second positioning seat (42) is positioned in the positioning groove (411), and a positioning hole (421) is formed on the second positioning seat (42) and extends through the second positioning seat (42) in the Z direction; and A clamping assembly (43), the clamping assembly (43) being arranged on the second positioning seat (42), the clamping assembly (43) being used to clamp and position the shell located in the positioning hole (421).

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