A piezoelectric thin film stabilizing continuous annealing device

Abstract

The application discloses a kind of for piezoelectric film stable continuous annealing device, belong to annealing technical field, it includes bottom plate, the left and right sides of bottom plate upper surface are respectively provided with film roll and winding roll, the opposite side of film roll and winding roll is respectively fixedly connected with the left and right sides of annealing box.In the application, by setting controller, temperature sensor, heat pipe, flow guide pipe, thermostat and transition box, the temperature in transition box is lower than the temperature of left side in annealing box, then piezoelectric film continues to transmit right and is cooled by cooling roll, effectively play the purpose of step annealing cooling, avoid the influence on the crystalline structure of piezoelectric film due to water cooling, so that the tensile property of piezoelectric film is poor, prevent the surface stress of piezoelectric film from increasing due to annealing temperature decreasing too fast, realize stable continuous annealing of piezoelectric film, improve the use performance of piezoelectric film.

Description

Technical Field

[0001] This invention belongs to the field of annealing technology, specifically a device for stable continuous annealing of piezoelectric thin films. Background Technology

[0002] Piezoelectric thin films are a class of thin film materials with piezoelectric properties, produced through film-forming techniques such as evaporation, sputtering, chemical deposition, vapor phase epitaxy, casting, and rolling. They mainly include three categories: inorganic piezoelectric thin films (such as ZnO, AlN, and CdS), organic piezoelectric thin films (such as polyvinylidene fluoride PVF and polyvinylidene fluoride PVF2), and organic-inorganic composite piezoelectric thin films (such as PVF2-PZT and PVF2-BaTiO3). Polycrystalline inorganic piezoelectric thin films, especially ZnO and AlN films, have electromechanical coupling coefficients close to their single-crystal values. Their c-axis preferred orientation polycrystalline thin films have piezoelectricity similar to their single crystals. During the production and processing of piezoelectric thin films, a force called surface stress exists on the film surface, which can easily cause wrinkling or even cracking of the film. Therefore, reducing or eliminating the surface stress of the film is an effective way to prevent wrinkling and cracking. Thus, surface stress relief annealing must be performed using an annealing device.

[0003] Currently, in the annealing process based on piezoelectric thin films, the wound film is placed in a dedicated annealing furnace for annealing. The film is heated to a certain temperature, held for a sufficient time, and then cooled at an appropriate rate. To improve the overall annealing efficiency, natural cooling is achieved through water cooling or by directly using a cooling medium to cool the piezoelectric thin film. However, water cooling results in an imperfect crystal structure for the piezoelectric thin film, which can lead to poor tensile strength. Using a cooling medium causes the temperature of the piezoelectric thin film to drop too quickly, increasing the surface stress of the film and affecting its performance. Therefore, a stable and continuous annealing device for piezoelectric thin films is needed to solve these problems. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a device for stabilizing and continuously annealing piezoelectric films, which solves the problems of natural cooling by water cooling or direct cooling medium cooling of piezoelectric films, which result in an imperfect crystal structure of the piezoelectric film and poor tensile properties; and the problem that the temperature of the piezoelectric film drops too quickly when using cooling medium cooling, which increases the surface stress of the film and affects its performance.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the present invention provides the following technical solution: a device for stable continuous annealing of piezoelectric thin films, comprising a base plate, wherein a film feeding roller and a winding roller are respectively arranged on the left and right sides of the upper surface of the base plate, the opposite surfaces of the film feeding roller and the winding roller are fixedly connected to the left and right sides of the annealing box, the lower surface of the annealing box is fixedly connected to the upper surface of two support legs, the lower surface of the two support legs is fixedly connected to the upper surface of the base plate, guide wheels are arranged on the left and right sides of the upper surface of the annealing box, the outer walls of the two guide wheels are provided with the same piezoelectric thin film, the piezoelectric thin film is arranged inside the annealing box, an electric heating tube is arranged on the left side of the inner wall of the annealing box, one end of the back of the electric heating tube is connected to a heater, and the heater is snapped onto the back of the annealing box.

[0008] Three heating rollers are provided on the left side of the inner wall of the annealing chamber. The piezoelectric film is wound on the three heating rollers. The middle part of the piezoelectric film is placed in the transition box. The lower surface of the transition box is fixedly connected to the upper surface of the annealing chamber. The bottom of the transition box is connected to the upper surface of the constant temperature box. The constant temperature box is snapped into the middle of the inner wall of the annealing chamber. The left side of the annealing chamber is connected to the left side of the inner wall of the annealing chamber through four first heat-conducting components. Four second heat-conducting components are snapped into the bottom of the transition box. All four second heat-conducting components are connected to the left side of the bottom of the annealing chamber.

[0009] As a further aspect of the present invention: three cooling rollers are provided on the right side of the inner wall of the annealing chamber, the piezoelectric film is wound around the outer wall of the three cooling rollers, and a semiconductor cooling chip is provided in the middle of the cooling rollers.

[0010] As a further embodiment of the present invention: guide rollers are fixedly connected to both the left and right sides of the constant temperature chamber, the piezoelectric film is located between the two guide rollers, and the middle part of the lower surface of the piezoelectric film overlaps with the top of the two support rollers.

[0011] As a further embodiment of the present invention: both ends of the support roller are provided with support plates, and the two support plates are snapped onto the outer wall of the same support component.

[0012] As a further aspect of the present invention: the support assembly includes two blocks, one side of which is fixedly connected to the left side of the constant temperature chamber, and a common connecting shaft is provided between the two blocks. The outer wall of the connecting shaft is engaged with two support plates, and two coil springs are sleeved on the outer surface of the connecting shaft. The two ends of the coil springs are fixedly connected to the opposite surfaces of the blocks and the support plates, respectively.

[0013] As a further aspect of the present invention: the first heat-conducting component includes a heat-conducting pipe, the left end of which is snapped into the left side of the transition box, the bottom of which is connected to the left side of the inner wall of the annealing box, and a first solenoid valve is provided on the outer wall of the heat-conducting pipe.

[0014] As a further aspect of the present invention: the second heat-conducting component includes a flow guide tube, the flow guide tube is U-shaped, and the right end of the flow guide tube is connected to the bottom of the constant temperature chamber, the left end of the flow guide tube is connected to the left side of the bottom of the annealing chamber, and the outer wall of the flow guide tube is provided with a second solenoid valve.

[0015] As a further aspect of the present invention: a temperature sensor is provided on the front of the transition box, and the temperature sensor is used to monitor the real-time temperature inside the transition box; a controller is provided on the front of the constant temperature box.

[0016] As a further aspect of the present invention: the output terminal of the temperature sensor is connected to the input terminal of the controller, and the output terminal of the controller is connected to the input terminals of four first solenoid valves and four second solenoid valves.

[0017] As a further aspect of the present invention: a plurality of ventilation holes are provided on the right side of the bottom of the annealing box, cover plates are provided on both the left and right sides of the upper surface of the annealing box, a top plate is provided on the top of the transition box, and observation windows are provided on both the left and right sides of the front of the annealing box.

[0018] (III) Beneficial Effects

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] 1. In this invention, by setting up a controller, temperature sensor, heat pipe, flow guide pipe, constant temperature chamber, and transition chamber, during the annealing process of the piezoelectric film, the piezoelectric film is wound around a guide wheel, an electric heating roller, a guide roller, and a cooling roller. First, the heater is controlled to operate so that the electric heating pipe releases heat to preheat the annealing chamber, improving the heating uniformity of the piezoelectric film. After preheating, the winding roller winds up the piezoelectric film, while the electric heating roller heats the piezoelectric film. When the piezoelectric film enters the transition chamber, the temperature sensor monitors the temperature inside the transition chamber. Once the temperature reaches the preset constant temperature value, the controller controls the first and second solenoid valves to open. The process involves opening the annealing chamber, allowing heat to enter the constant temperature chamber and transition chamber through heat pipes and flow pipes. The heat is dispersed from above and below the piezoelectric film, with the temperature in the transition chamber lower than the temperature on the left side of the annealing chamber. The piezoelectric film then continues to be transferred to the right and cooled by cooling rollers, effectively achieving the purpose of step-by-step annealing and cooling. This avoids the impact of water cooling on the crystal structure of the piezoelectric film, which could lead to a decrease in its tensile strength. It also prevents the surface stress of the piezoelectric film from increasing due to a rapid drop in annealing temperature, thus achieving stable and continuous annealing of the piezoelectric film and improving its performance.

[0021] 2. In this invention, by setting up support rollers, support plates, coil springs, connecting shafts, and stops, the piezoelectric film is conveyed through the guide rollers and contacts the two support rollers. The piezoelectric film is subjected to a rightward traction force. When the traction force is too large, it will squeeze the two support rollers, causing the angle of the two support rollers to deflect. Then, the two support rollers are rotated in opposite directions by the support of the two coil springs. The piezoelectric film squeezes the support rollers, causing them to sway up and down synchronously in a small manner, which effectively supports and buffers the piezoelectric film, preventing the piezoelectric film from being torn due to excessive traction force, and further improving the annealing stability.

[0022] 3. In this invention, by setting up a first solenoid valve, a second solenoid valve, ventilation holes, and a cooling roller, and through the mutual cooperation between multiple first and second solenoid valves, the controller controls one or more of the first and second solenoid valves to open and regulate the heat in the transition box, which is beneficial for the step-by-step annealing and cooling of the piezoelectric film. The cooling roller is equipped with a semiconductor cooling chip, which effectively achieves the purpose of heat exchange and cooling of the piezoelectric film. In addition, in conjunction with the ventilation holes at the bottom of the annealing box, the air circulation in the annealing box is improved, thereby achieving the purpose of rapid annealing of the piezoelectric film. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0024] Figure 2 This is a rear-view three-dimensional structural diagram of the present invention;

[0025] Figure 3 This is a schematic diagram of the internal structure of the annealing chamber of the present invention;

[0026] Figure 4 This is a three-dimensional structural diagram of the constant temperature chamber of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of the support component of the present invention;

[0028] Figure 6 for Figure 5 Enlarged diagram of Part B;

[0029] Figure 7 for Figure 1 and Figure 3 Enlarged schematic diagram of guide wheel No. 6;

[0030] In the diagram: 1. Base plate; 2. Film feeding roller; 3. Rewinding roller; 4. Support leg; 5. Annealing chamber; 6. Guide wheel; 7. Piezoelectric film; 8. Heating roller; 9. Heating tube; 10. Heater; 11. Transition chamber; 12. First heat conduction assembly; 121. First solenoid valve; 122. Heat conduction tube; 13. Temperature sensor; 14. Second heat conduction assembly; 141. Second solenoid valve; 142. Flow guide tube; 15. Constant temperature chamber; 16. Guide roller; 17. Support plate; 18. Support roller; 19. Support assembly; 191. Coil spring; 192. Connecting shaft; 193. Stop block; 20. Controller; 21. Cooling roller; 22. Ventilation hole; 23. Cover plate; 24. Top plate. Detailed Implementation

[0031] The technical solution of this patent will be further described in detail below with reference to specific embodiments.

[0032] like Figures 1-5 As shown, the present invention provides a technical solution: a device for stable continuous annealing of piezoelectric thin films, comprising a base plate 1, with a film feeding roller 2 and a winding roller 3 respectively arranged on the left and right sides of the upper surface of the base plate 1, the opposite surfaces of the film feeding roller 2 and the winding roller 3 being fixedly connected to the left and right sides of the annealing box 5, the lower surface of the annealing box 5 being fixedly connected to the upper surface of two support legs 4, the lower surface of both support legs 4 being fixedly connected to the upper surface of the base plate 1, guide wheels 6 being arranged on the left and right sides of the upper surface of the annealing box 5, the outer walls of the two guide wheels 6 being provided with the same piezoelectric thin film 7, the piezoelectric thin film 7 being arranged inside the annealing box 5, an electric heating tube 9 being arranged on the left side of the inner wall of the annealing box 5, one end of the back of the electric heating tube 9 being connected to a heater 10, the heater 10 being snapped onto the back of the annealing box 5.

[0033] Three heating rollers 8 are provided on the left side of the inner wall of the annealing chamber 5. A piezoelectric film 7 is wound on the three heating rollers 8. The middle part of the piezoelectric film 7 is set in the transition box 11. The lower surface of the transition box 11 is fixedly connected to the upper surface of the annealing chamber 5. The bottom of the transition box 11 is connected to the upper surface of the constant temperature box 15. The constant temperature box 15 is snapped into the middle of the inner wall of the annealing chamber 5. The left side of the annealing chamber 5 is connected to the left side of the inner wall of the annealing chamber 5 through four first heat conduction components 12. Four second heat conduction components 14 are snapped into the bottom of the transition box 11. All four second heat conduction components 14 are connected to the left side of the bottom of the annealing chamber 5.

[0034] Specifically, such as Figure 3 , Figure 4 and Figure 5As shown, three cooling rollers 21 are provided on the right side of the inner wall of the annealing chamber 5. A piezoelectric film 7 is wound around the outer wall of the three cooling rollers 21. A semiconductor cooling chip is provided in the middle of the cooling rollers 21. Guide rollers 16 are fixedly connected to both sides of the constant temperature chamber 15. The piezoelectric film 7 is located between two guide rollers 16. The middle of the lower surface of the piezoelectric film 7 overlaps with the top of two support rollers 18. Support plates 17 are provided at both ends of the support rollers 18. The two support plates 17 are snapped onto the outer wall of the same support assembly 19. The support assembly 19 includes two stops 193. One side of the two stops 193 is fixedly connected to the left side of the constant temperature chamber 15. A common connecting shaft 192 is provided between the two stops 193. The outer wall of the connecting shaft 192 is engaged with two support plates 17. Two coil springs 191 are sleeved on the outer surface of the connecting shaft 192. Through the cooperation between the coil springs 191 and the support rollers 18, when the traction force on the piezoelectric film 7 is too large, it will squeeze the two support rollers 18, causing the angle of the two support rollers 18 to deflect. Secondly, the two support rollers 18 are rotated in opposite directions by the support of the two coil springs 191. The piezoelectric film 7 squeezes the support rollers 18, causing them to swing up and down synchronously in a small manner, which effectively supports and buffers the piezoelectric film 7, preventing the piezoelectric film 7 from being torn due to excessive traction force. The two ends of the coil springs 191 are fixedly connected to the opposite surfaces of the stop block 193 and the support plate 17, respectively.

[0035] Specifically, such as Figure 1 , Figure 2 and Figure 3As shown, the first heat-conducting component 12 includes a heat-conducting pipe 122. The left end of the heat-conducting pipe 122 is snapped into the left side of the transition box 11. The bottom of the heat-conducting pipe 122 is connected to the left side of the inner wall of the annealing box 5. A first solenoid valve 121 is provided on the outer wall of the heat-conducting pipe 122. Through the cooperation between the first heat-conducting component 12 and the second heat-conducting component 14, the controller 20 controls the first solenoid valve 121 and the second solenoid valve 141 to open, so that the heat inside the annealing box 5 enters the constant temperature box 15 and the transition box 11 through the heat-conducting pipe 122 and the guide pipe 142. The heat is dispersed from the top and bottom of the piezoelectric film 7, respectively. The temperature inside the transition box 11 is lower than the temperature on the left side inside the annealing box 5. Then, the piezoelectric film 7 continues to be transferred to the right and cooled by the cooling roller 21, which effectively achieves the purpose of step-by-step annealing and cooling, avoiding the impact of water cooling on the crystal structure of the piezoelectric film 7, thereby reducing the tensile strength of the piezoelectric film 7. The heat-conducting component 14 includes a flow guide tube 142, which is U-shaped. The right end of the flow guide tube 142 is connected to the bottom of the constant temperature chamber 15, and the left end is connected to the left side of the bottom of the annealing chamber 5. A second solenoid valve 141 is provided on the outer wall of the flow guide tube 142. Through the cooperation between multiple first solenoid valves 121 and second solenoid valves 141, the controller 20 controls one or more of the first solenoid valves 121 and second solenoid valves 141 to open and regulate the heat in the transition chamber 11, which is beneficial for the step-by-step annealing and cooling of the piezoelectric film 7. A temperature sensor 13 is provided on the front of the transition chamber 11, and the temperature sensor 13 is used to monitor the real-time temperature in the transition chamber 11. A controller 20 is provided on the front of the constant temperature chamber 15. The output end of the temperature sensor 13 is connected to the input end of the controller 20. The output end of the controller 20 is connected to the input ends of the four first solenoid valves 121 and the four second solenoid valves 141.

[0036] Specifically, such as Figure 1 and Figure 3 As shown, several ventilation holes 22 are provided on the right side of the bottom of the annealing chamber 5. Through the cooperation between the cooling roller 21 and the ventilation holes 22, and the semiconductor cooling chip inside the cooling roller 21, the purpose of heat exchange and cooling of the piezoelectric film 7 is effectively achieved. In addition, in conjunction with the ventilation holes 22 at the bottom of the annealing chamber 5, the air circulation inside the annealing chamber 5 is improved, thereby achieving the purpose of rapid annealing of the piezoelectric film 7. Cover plates 23 are provided on both the left and right sides of the upper surface of the annealing chamber 5, and a top plate 24 is provided on the top of the transition box 11. Observation windows are provided on both the left and right sides of the front of the annealing chamber 5.

[0037] The working principle of this invention is as follows:

[0038] When the piezoelectric film 7 needs to be annealed, it is wound around the guide roller 6, the heating roller 8, the guide roller 16, and the cooling roller 21. First, the heater 10 is controlled to operate, causing the heating tube 9 to release heat to preheat the annealing chamber 5. After preheating, the winding roller 3 winds up the piezoelectric film 7, while the heating roller 8 heats the film. When the piezoelectric film 7 enters the transition chamber 11, the temperature sensor 13 monitors the temperature inside. Once the temperature reaches the preset constant temperature value, the controller 20 controls the first solenoid valve 121 and the second solenoid valve 141 to open, allowing heat from the annealing chamber 5 to enter the constant temperature chamber 15 and the transition chamber 11 through the heat pipe 122 and the guide pipe 142. The heat is drawn from the top of the piezoelectric film 7. The piezoelectric film 7 is dispersed to the right and below, and the temperature inside the transition box 11 is lower than the temperature on the left side inside the annealing box 5. Then, the piezoelectric film 7 continues to be transported to the right and cooled by the cooling roller 21, which effectively achieves the purpose of step-by-step annealing and cooling. The piezoelectric film 7 is subjected to a rightward traction force. When the traction force is too large, it will squeeze the two support rollers 18, causing the angle of the two support rollers 18 to deflect. The deflection angle range includes but is not limited to ±90°, and the deflection method includes but is not limited to opposite rotation. Then, the two support rollers 18 are rotated in opposite directions by the support of the two coil springs 191. The piezoelectric film 7 squeezes the support rollers 18 to make them swing up and down synchronously, which effectively supports and buffers the piezoelectric film 7.

[0039] In summary:

[0040] By configuring a controller 20, a temperature sensor 13, a heat pipe 122, a guide pipe 142, a constant temperature chamber 15, and a transition chamber 11, during the annealing process of the piezoelectric film 7, the piezoelectric film 7 is wound around the guide wheel 6, the heating roller 8, the guide roller 16, and the cooling roller 21. First, the heater 10 is controlled to operate, causing the heating pipe 9 to release heat to preheat the annealing chamber 5, improving the heating uniformity of the piezoelectric film 7. After preheating, the winding roller 3 winds up the piezoelectric film 7, while the heating roller 8 heats the piezoelectric film 7. When the piezoelectric film 7 enters the transition chamber 11, the temperature sensor 13 monitors the temperature inside the transition chamber 11. Once the temperature reaches the preset constant temperature value, the controller 20 controls the first solenoid valve 121 and the second solenoid valve 142. The two solenoid valves 141 are opened, allowing the heat inside the annealing chamber 5 to enter the constant temperature chamber 15 and the transition chamber 11 through the heat pipe 122 and the flow pipe 142. The heat is dispersed from the top and bottom of the piezoelectric film 7, respectively. The temperature inside the transition chamber 11 is lower than the temperature on the left side inside the annealing chamber 5. Then, the piezoelectric film 7 continues to be transferred to the right and cooled by the cooling roller 21, which effectively achieves the purpose of annealing and cooling in stages. This avoids the impact of water cooling on the crystal structure of the piezoelectric film 7, which would reduce the tensile strength of the piezoelectric film 7. At the same time, it prevents the surface stress of the piezoelectric film 7 from increasing due to the rapid decrease in annealing temperature, so as to achieve stable and continuous annealing of the piezoelectric film 7 and improve the performance of the piezoelectric film 7.

[0041] By setting up support rollers 18, support plates 17, coil springs 191, connecting shafts 192, and stop blocks 193, during the conveying process of the piezoelectric film 7, it passes through the guide rollers 16 and contacts the two support rollers 18. The piezoelectric film 7 is subjected to a rightward traction force. When the traction force is too large, it will squeeze the two support rollers 18, causing the angle of the two support rollers 18 to deflect. The deflection angle range includes, but is not limited to, ±90°, and the deflection method includes, but is not limited to, rotation towards each other. Secondly, the two support rollers 18 are rotated towards each other by the support of the two coil springs 191. The piezoelectric film 7 squeezes the support rollers 18, causing them to sway up and down synchronously in a small manner, which effectively supports and buffers the piezoelectric film 7, preventing the piezoelectric film 7 from being torn due to excessive traction force, and further improving the annealing stability.

[0042] By setting up a first solenoid valve 121, a second solenoid valve 141, a ventilation hole 22, and a cooling roller 21, and through the mutual cooperation between multiple first solenoid valves 121 and second solenoid valves 141, the controller 20 controls one or more of the first solenoid valves 121 and second solenoid valves 141 to open and regulate the heat in the transition box 11. This is beneficial for the step-by-step annealing and cooling of the piezoelectric film 7. The cooling roller 21 is equipped with a semiconductor cooling chip, which effectively achieves the purpose of heat exchange and cooling of the piezoelectric film 7. In addition, in conjunction with the ventilation hole 22 at the bottom of the annealing box 5, the air circulation in the annealing box 5 is improved, thereby achieving the purpose of rapid annealing of the piezoelectric film 7.

[0043] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0044] The preferred embodiments of this patent have been described in detail above. However, this patent is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this patent.

Claims

1. A device for stabilizing and continuously annealing piezoelectric thin films, comprising a base plate (1), characterized in that: The upper surface of the base plate (1) is provided with a film feeding roller (2) and a winding roller (3) on the left and right sides respectively. The opposite sides of the film feeding roller (2) and the winding roller (3) are fixedly connected to the left and right sides of the annealing box (5) respectively. The lower surface of the annealing box (5) is fixedly connected to the upper surface of the two support legs (4). The lower surfaces of the two support legs (4) are fixedly connected to the upper surface of the base plate (1). The upper surface of the annealing box (5) is provided with guide wheels (6) on the left and right sides respectively. The outer walls of the two guide wheels (6) are provided with the same piezoelectric film (7). The piezoelectric film (7) is provided inside the annealing box (5). The inner wall of the annealing box (5) is provided with an electric heating tube (9). One end of the back of the electric heating tube (9) is connected to a heater (10). The heater (10) is snapped onto the back of the annealing box (5). Three heating rollers (8) are provided on the left side of the inner wall of the annealing box (5). The piezoelectric film (7) is wound on the three heating rollers (8). The middle part of the piezoelectric film (7) is set in the transition box (11). The lower surface of the transition box (11) is fixedly connected to the upper surface of the annealing box (5). The bottom of the transition box (11) is connected to the upper surface of the constant temperature box (15). The constant temperature box (15) is snapped into the middle of the inner wall of the annealing box (5). The left side of the annealing box (5) is connected to the left side of the inner wall of the annealing box (5) through four first heat conduction components (12). The bottom of the transition box (11) is snapped with four second heat conduction components (14). All four second heat conduction components (14) are connected to the left side of the bottom of the annealing box (5).

2. The apparatus for stabilizing and continuously annealing piezoelectric thin films according to claim 1, characterized in that: Three cooling rollers (21) are provided on the right side of the inner wall of the annealing box (5). The piezoelectric film (7) is wrapped around the outer wall of the three cooling rollers (21). A semiconductor cooling chip is provided in the middle of the cooling rollers (21).

3. The apparatus for stabilizing and continuously annealing piezoelectric thin films according to claim 1, characterized in that: Guide rollers (16) are fixedly connected to both sides of the constant temperature chamber (15). The piezoelectric film (7) is located between the two guide rollers (16). The middle part of the lower surface of the piezoelectric film (7) overlaps with the top of the two support rollers (18).

4. The apparatus for stabilizing and continuously annealing piezoelectric thin films according to claim 3, characterized in that: Both ends of the support roller (18) are provided with support plates (17), and the two support plates (17) are snapped onto the outer wall of the same support component (19).

5. The apparatus for stabilizing and continuously annealing piezoelectric thin films according to claim 4, characterized in that: The support assembly (19) includes two blocks (193), one side of which is fixedly connected to the left side of the constant temperature chamber (15). A common connecting shaft (192) is provided between the two blocks (193). The outer wall of the connecting shaft (192) is engaged with two support plates (17). Two coil springs (191) are sleeved on the outer surface of the connecting shaft (192). The two ends of the coil springs (191) are fixedly connected to the opposite sides of the blocks (193) and the support plates (17), respectively.

6. The apparatus for stabilizing and continuously annealing piezoelectric thin films according to claim 1, characterized in that: The first heat-conducting component (12) includes a heat-conducting pipe (122), the left end of which is snapped into the left side of the transition box (11), the bottom of which is connected to the left side of the inner wall of the annealing box (5), and a first solenoid valve (121) is provided on the outer wall of the heat-conducting pipe (122).

7. The apparatus for stabilizing and continuously annealing piezoelectric thin films according to claim 6, characterized in that: The second heat-conducting component (14) includes a flow guide tube (142), which is U-shaped and the right end of the flow guide tube (142) is connected to the bottom of the constant temperature chamber (15). The left end of the flow guide tube (142) is connected to the left side of the bottom of the annealing chamber (5). The outer wall of the flow guide tube (142) is provided with a second solenoid valve (141).

8. The apparatus for stabilizing and continuously annealing piezoelectric thin films according to claim 7, characterized in that: The front of the transition box (11) is provided with a temperature sensor (13), and the temperature sensor (13) is used to monitor the real-time temperature inside the transition box (11). The front of the constant temperature box (15) is provided with a controller (20).

9. The apparatus for stabilizing and continuously annealing piezoelectric thin films according to claim 8, characterized in that: The output of the temperature sensor (13) is connected to the input of the controller (20), and the output of the controller (20) is connected to the input of the four first solenoid valves (121) and the four second solenoid valves (141).

10. The apparatus for stabilizing and continuously annealing piezoelectric thin films according to claim 1, characterized in that: The annealing chamber (5) has several ventilation holes (22) on the right side of its bottom. The annealing chamber (5) has cover plates (23) on both sides of its upper surface. The transition chamber (11) has a top plate (24) on its top. The annealing chamber (5) has observation windows on both sides of its front.

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