Display panel and display device

Abstract

Embodiments of the present application provide a display panel and a display device. The display panel comprises an array substrate and an encapsulation substrate arranged oppositely. The encapsulation substrate comprises a touch electrode and a plurality of first transfer pads arranged at intervals in a display area. The first transfer pads are electrically connected to the touch electrode. The array substrate comprises a plurality of second transfer pads arranged at intervals in the display area and a bonding pad in a non-display area. The second transfer pads are electrically connected to the bonding pad. The bonding pad is used for bonding a touch chip or a flexible circuit board. The first transfer pads and the second transfer pads are overlapped. The embodiments of the present application can reduce the size of the frame, realize narrow frame of the display panel, and improve the screen-to-body ratio of the display panel.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a display panel and a display device. BACKGROUND

[0002] With the development of display technology, the application of display panels is more and more extensive, and display panels with touch function have also been widely applied.

[0003] However, the frame of the existing display panel with touch function is wide, and the narrow frame effect cannot be achieved, which limits the further application of the display panel. SUMMARY

[0004] The display panel and the display device provided by the embodiments of the present application can reduce the frame of the display panel and improve the screen ratio of the display panel.

[0005] In a first aspect, the embodiments of the present application provide a display panel, which comprises an array substrate and an encapsulation substrate arranged oppositely; the encapsulation substrate comprises a touch electrode and a plurality of first conversion pads arranged at intervals in a display area, and the first conversion pads are electrically connected to the touch electrode; the array substrate comprises a plurality of second conversion pads arranged at intervals in the display area and a binding pad in a non-display area, the second conversion pads are electrically connected to the binding pad, and the binding pad is used for binding a touch chip or a flexible circuit board; and the first conversion pads are overlapped with the second conversion pads.

[0006] In a second aspect, the embodiments of the present application provide a display device, which comprises the display panel provided in the first aspect.

[0007] The display panel and the display device provided by the embodiments of the present application can reduce the frame of the display panel and improve the screen ratio of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced. Those drawings can help the ordinary skilled in the art to obtain other drawings without creative effort.

[0009] Figure 1 A structural schematic diagram of an array substrate in a display panel;

[0010] Figure 2 A top view schematic diagram of a display panel provided by the embodiments of the present application;

[0011] Figure 3 A partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0012] Figure 4 Another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0013] Figure 5 Still another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0014] Figure 6 Still another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0015] Figure 7 Still another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0016] Figure 8 Still another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0017] Figure 9 Still another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0018] Figure 10 Still another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0019] Figure 11 Another top view schematic diagram of a display panel provided by the embodiments of the present application;

[0020] Figure 12 Still another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0021] Figure 13 Still another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0022] Figure 14 Still another partial cross-sectional schematic diagram of a display panel provided by the embodiments of the present application;

[0023] Figure 15 Another partial cross-sectional schematic view of a display panel is provided in an embodiment of the present application.

[0024] Figure 16 Another top view schematic view of a display panel is provided in an embodiment of the present application.

[0025] Figure 17 Another partial cross-sectional schematic view of a display panel is provided in an embodiment of the present application.

[0026] Figure 18 A structure schematic view of a display device is provided in an embodiment of the present application. DETAILED DESCRIPTION

[0027] The features and exemplary embodiments of the various aspects of the present application will be described in detail below with reference to the drawings. To make the purpose, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. The present application can be implemented without some of the specific details by those skilled in the art. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0028] It should be noted that, in this document, the relative terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the elements defined by the statement "comprise" do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0029] It should be understood that the term "and / or" used herein is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this document generally represents that the front and rear associated objects have an "or" relationship.

[0030] In the embodiments of the present application, the term "electrically connected" can mean that two components are directly electrically connected, or that two components are electrically connected via one or more other components.

[0031] Various modifications and changes can be made to the present application in matters of form and detail without departing from the spirit and scope of the application. It is intended that the application cover all such modifications and changes as fall within the scope of the claims (the technical solutions claimed to be protected) and their equivalents. It should be noted that the embodiments provided by the present application can be combined with each other if not contradictory.

[0032] Before the technical solutions provided by the embodiments of the present application are described, the problems existing in the related art are first described in detail in order to facilitate the understanding of the embodiments of the present application:

[0033] As described above, the inventors of the present application have found that the display panel with touch function in the related art has a wide frame and cannot achieve narrow frame.

[0034] To solve the above technical problems, the inventors of the present application first studied and analyzed the root cause of the above technical problems, and the specific research and analysis process is as follows:

[0035] Figure 1 A structural diagram of an array substrate in a display panel. As shown in Figure 1 , the display panel can adopt an in-cell touch display panel. Compared with an out-cell touch display panel (i.e., the touch panel and the display panel are independently arranged and the touch panel is attached to the packaging layer of the display panel), the overall thickness of the in-cell touch display panel is thinner. In the in-cell touch display panel, since the array substrate and the packaging substrate share the same touch chip, the in-cell touch display panel usually adopts a transfer pad mode to electrically connect the touch electrode on the packaging substrate and the bonding pad in the bonding area on the array substrate, so as to drive the touch electrode by the touch chip.

[0036] For example, in Figure 1 , the display panel can include a display area AA' and a non-display area NA' surrounding the display area. The non-display area NA' includes a frame area NA1' and a bonding area NA2'. The bonding area NA2' is located at the lower part of the array substrate and is used to arrange the bonding pad. The bonding pad can be electrically connected with the touch chip, and the bonding pad can be used to receive the touch driving signal provided by the touch chip. The frame area NA1' surrounds the display area AA', and the frame area NA1' can be provided with a transfer pad 101'. The transfer pad 101' is a pair of pads arranged oppositely, one of which is located on the array substrate and the other of which is located on the packaging substrate. Since the transfer pad 101' is located in the frame area NA1', and the size of the transfer pad 101' is generally several hundred microns, it greatly occupies the frame space of the display panel, and it is difficult to achieve narrow frame.

[0037] In view of the above research findings of the inventors, the embodiments of the present application provide a display panel and a display device, which can solve the technical problem of a wide frame of a touch display panel in the related art and cannot realize a narrow frame.

[0038] The technical concept of the embodiments of the present application is to arrange the adapter pads in the display area instead of the frame of the display panel, thereby reducing the occupation of the adapter pads to the frame, facilitating to reduce the size of the frame, realizing a narrow frame of the display panel, and improving the screen-to-body ratio of the display panel.

[0039] Firstly, the display panel provided by the embodiments of the present application is introduced.

[0040] Figure 2 A top view schematic diagram of the display panel provided by the embodiments of the present application. Figure 3 A partial cross-sectional view schematic diagram of the display panel provided by the embodiments of the present application. As shown in FIGS. 2 and 3, the display panel 20 provided by the embodiments of the present application can include an array substrate 210 and a packaging substrate 220 arranged oppositely, that is, the display panel 20 can be an in-cell touch display panel. Figure 2 and Figure 3 The array substrate 210 and the packaging substrate 220 can each include a display area AA and a non-display area NA. The packaging substrate 220 can include a touch electrode p and a plurality of first adapter pads 221 arranged at intervals in the display area AA, and the first adapter pads 221 can be electrically connected with the touch electrode p. Exemplarily, the material of the touch electrode p can be metal, or transparent metal oxide such as indium tin oxide (ITO), and the embodiments of the present application do not make any limitation in this regard.

[0041] The array substrate 210 can include a plurality of second adapter pads 211 arranged at intervals in the display area AA and a bonding pad 212 in the non-display area NA, and the second adapter pads 211 can be electrically connected with the bonding pad 212. The bonding pad 212 can be used to bind a touch chip or a flexible printed circuit (FPC), that is, the bonding pad 212 can be directly electrically connected with a pad on the touch chip, or indirectly electrically connected with the touch chip through the flexible printed circuit.

[0042] The first adapter pads 221 can be overlapped with the second adapter pads 211. For example, the first adapter pads 221 and the second adapter pads 211 can be electrically connected through a welding process, or the electrical connection between the first adapter pads 221 and the second adapter pads 211 can be realized through coating silver glue, and the embodiments of the present application do not make any limitation on the process of realizing the electrical connection between the first adapter pads 221 and the second adapter pads 211.

[0043] The touch driving signal provided by the touch chip can be transmitted to the touch electrode p in sequence through the bonding pad 212, the second adapter pad 211 and the first adapter pad 221, and can also receive the touch sensing signal generated by the touch electrode p.

[0044] The display panel of this embodiment includes an array substrate 210 and a packaging substrate 220 disposed opposite to each other. The packaging substrate 220 includes a touch electrode p and a plurality of first adapter pads 221 arranged at intervals in the display area. The first adapter pads 221 are electrically connected to the touch electrode p. The array substrate 210 includes a plurality of second adapter pads 211 arranged at intervals in the display area and a bonding pad located in the non-display area. The second adapter pads 211 are electrically connected to the bonding pads, and the bonding pads are used to bond touch chips or flexible circuit boards. The first adapter pads 221 and the second adapter pads 211 overlap. Since the first adapter pads 221 and the second adapter pads 211 are disposed in the display area and not in the bezel of the display panel, the occupation of the first adapter pads 221 and the second adapter pads 211 on the bezel can be reduced, which is beneficial to reduce the size of the bezel, realize a narrow bezel of the display panel, and improve the screen ratio of the display panel.

[0045] like Figure 1 As shown, when the adapter pad 101' is located in the bezel area NA1', the touch signal line TP' also needs to be located in the bezel area NA1' to connect the adapter pad 101' and the bonding pad. This increases the bezel size further, which is detrimental to narrow bezel designs, as the touch signal line TP' also needs to be located in the bezel area NA1'.

[0046] Continue as Figure 2 As shown, in some embodiments of this application, the array substrate 210 may further include a touch signal line TP, at least a portion of the traces of the touch signal line TP being located in the display area AA. The touch signal line TP can be used to connect the second adapter pad 211 and the bonding pad 212. That is, in the embodiments of this application, most of the traces of the touch signal line TP can be located in the display area AA, thereby reducing the occupancy of the touch signal line TP on the bezel, further reducing the size of the bezel, and achieving a narrow bezel for the display panel.

[0047] Figure 4 This is another partial cross-sectional view of the display panel provided in an embodiment of this application. (See attached diagram.) Figure 4As shown, according to some embodiments of the present application, the first surface B1 of the array substrate 210 can be opposite to the second surface B2 of the packaging substrate 220. The first transition pad 221 can include a first conductive part 221a, which can be electrically connected with the touch electrode p. It can be understood that the material of the first conductive part 221a is a material with conductive ability, such as a conductor material or a semiconductor material. For example, the material of the first conductive part 221a can be transparent metal oxide such as indium tin oxide (ITO) and the like.

[0048] The second transition pad 211 includes a first protruding part 211a and a second conductive part 211b covering at least part of the first protruding part 211a. It can be understood that the second conductive part 211b can completely cover the first protruding part 211a or only cover part of the first protruding part 211a. The second conductive part 211b protrudes from the first surface B1 and is electrically connected with the touch signal line TP. For example, the second conductive part 211b can protrude from the first surface B1 under the lifting of the first protruding part 211a.

[0049] In the direction Z perpendicular to the plane where the display panel is located, the first conductive part 221a can at least partially overlap with the second conductive part 211b, and the first conductive part 221a can be electrically connected with the second conductive part 211b. For example, the electrical connection between the first conductive part 221a and the second conductive part 211b can be achieved by welding process, or the electrical connection between the first conductive part 221a and the second conductive part 211b can be achieved by coating silver glue, so as to increase the connection strength and stability between the first conductive part 221a and the second conductive part 211b.

[0050] In this way, on the one hand, since the second conductive part 211b protrudes from the first surface B1, the electrical connection between the first conductive part 221a and the second conductive part 211b can be facilitated, that is, the lapping between the first transition pad 221 and the second transition pad 211 can be facilitated; on the other hand, since the second conductive part 211b protrudes from the first surface B1, the second transition pad 211 can serve as a support column and play a supporting role between the array substrate 210 and the packaging substrate 220, thereby replacing the original support column. In this way, by using the second transition pad 211 as a support column, there can be sufficient remaining space for arranging the second transition pad 211 in the limited space of the display area AA, so as to realize the reasonable use of wiring space.

[0051] Figure 5 Another partial cross-sectional view of a display panel is provided for embodiments of the present application. As shown in FIG. 6, the display panel can include an array substrate 210, a packaging substrate 220 and a display panel 200. The array substrate 210 can include a first surface B1 and a second surface B2 opposite to the first surface B1. The packaging substrate 220 can include a third surface B3 and a fourth surface B4 opposite to the third surface B3. The display panel 200 can be arranged between the array substrate 210 and the packaging substrate 220. Figure 5As shown, in some specific embodiments, optionally, the encapsulation substrate 220 may include a first substrate 501, a touch functional layer 502, a first insulating layer 503, and a first conductive layer 504 stacked together. The first substrate 501 mainly serves a supporting function. For example, the first substrate 501 can be a rigid substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP). The touch functional layer 502 can be used to set touch electrodes. The material of the first insulating layer 503 can be an inorganic material, such as silicon oxide or silicon nitride. The material of the first conductive layer 504 is a material with conductive properties, such as a conductor material or a semiconductor material. For example, the material of the first conductive layer 504 can specifically be a transparent metal oxide such as indium tin oxide (ITO).

[0052] Along the direction Z perpendicular to the plane where the display panel is located, the first conductive layer 504 can be located on the side of the first insulating layer 503 close to the array substrate 210.

[0053] The first conductive portion 221a of the first adapter pad can be located in the first conductive layer 504, and the touch electrode p can be located in the touch function layer 502. The first conductive portion 504 can be electrically connected to the touch electrode p through the first via k1 opened in the first insulating layer 503.

[0054] Depend on Figure 5 It can be seen that the first conductive part 221a can also protrude from the second surface B2, thereby facilitating the electrical connection between the first conductive part 221a and the second conductive part 211b. At the same time, the first conductive part 221a and the second conductive part 211b work together to achieve a supporting function, thereby replacing the original support column.

[0055] like Figure 5 As shown, further research by the inventors of this application revealed that, since thin-film transistors (TFTs) and other electronic devices are typically disposed in the array substrate 210, if the spacing between the touch electrodes in the touch functional layer 502 and the TFTs in the array substrate 210 is small along the direction Z perpendicular to the plane of the display panel, signal crosstalk may occur. Therefore, this application considers increasing the thickness of the first insulating layer 503 to increase the spacing between the touch electrodes in the touch functional layer 502 and the TFTs in the array substrate 210. However, the inventors of this application discovered that simply increasing the thickness of the first insulating layer 503 results in a thicker film layer, making it difficult to etch the first via k1 in the first insulating layer 503, thereby weakening the connection strength between the touch electrodes and the first conductive portion 221a.

[0056] In view of the above finding, the present application considers, on one hand, increasing the spacing between the touch electrodes in the touch function layer 502 and the TFTs in the array substrate 210 by adding a second insulating layer, to improve the signal crosstalk problem; on the other hand, by adding a second conductive layer between the first insulating layer and the second insulating layer, to reduce the thickness of the insulating layer, to facilitate etching of the via in the insulating layer.

[0057] Figure 6 Another partial cross-sectional schematic view of the display panel is provided for the embodiments of the present application. As shown in Figure 6 In some specific embodiments, the package substrate 220 can further include a second insulating layer 601 and a second conductive layer 602, optionally. Exemplarily, the material of the second insulating layer 601 can be an inorganic material, such as silicon oxide or silicon nitride. The material of the second conductive layer 602 can be a material with conductive ability, such as a conductor material or a semiconductor material. Exemplarily, the material of the second conductive layer 602 can be a transparent metal oxide such as indium tin oxide (ITO), for example.

[0058] In the direction Z perpendicular to the plane where the display panel is located, the second insulating layer 601 can be located between the touch function layer 502 and the first insulating layer 503, and the second conductive layer 602 can be located between the first insulating layer 503 and the second insulating layer 601. The second insulating layer 601 can be provided with a second via k2, and the first conductive part 221a can be electrically connected with the touch electrode p through the first via k1, the second conductive layer 602 and the second via k2 in sequence.

[0059] In this way, since the second insulating layer 601 and the second conductive layer 602 are added between the touch electrodes in the touch function layer 502 and the TFTs in the array substrate 210, the spacing between the touch electrodes in the touch function layer 502 and the TFTs in the array substrate 210 is increased, and the signal crosstalk problem between the touch electrodes and the TFTs is improved. On the other hand, by adding the second conductive layer 602 between the first insulating layer 503 and the second insulating layer 601, the thickness of the single-layer insulating layer is reduced, and the via can be easily prepared on the first insulating layer 503 and the second insulating layer 601, thereby increasing the connection strength between the touch electrodes and the first conductive part 221a.

[0060] Figure 7 Another partial cross-sectional schematic view of the display panel is provided for the embodiments of the present application. As shown in Figure 7As shown, in some specific embodiments, the array substrate 210 may optionally include a second substrate 701, a driving device layer 702, a planarization layer 703, and an anode layer RE stacked together. The anode layer RE may partially cover the planarization layer 703. Along the direction Z perpendicular to the plane of the display panel, the anode layer RE may be located on the side of the planarization layer 703 closer to the encapsulation substrate 220. The second substrate 701 mainly serves a supporting function. For example, the second substrate 701 can be a rigid substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP). The driving device layer 702 can be used to mount electronic devices such as thin-film transistors. The planarization layer 703 is made of materials including, but not limited to, organic materials such as acrylic, polyimide (PI), or benzocyclobutene (BCB), and has a planarization effect. The anode layer RE is made of materials including, but not limited to, metals such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), or chromium (Cr), or mixtures thereof, or metal oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium oxide (In2O3).

[0061] The first protrusion 211a can be located in the planarization layer 703, that is, the first protrusion 211a can be made of organic materials such as acrylic, polyimide (PI) or benzocyclobutene (BCB) listed above. Figure 7 As shown, the thickness of the planarization layer 703 at the second transition pad 211 can be greater than the thickness of other areas in the display panel 20 besides the second transition pad 211, thereby forming the first protrusion 211a. The thickness is the minimum distance along the direction Z perpendicular to the plane of the display panel.

[0062] like Figure 7 As shown, in some examples, in the area where the second transition pad 211 is located, the planarization layer 703 may include multiple film layers, such as a first planarization layer 7031 and a second planarization layer 7032 stacked together. In other areas of the display panel 20 besides the second transition pad 211, the planarization layer 703 may, for example, only include the first planarization layer 7031, without the second planarization layer 7032. In this way, the first protrusion 211a is formed by stacking multiple planarization layers, and since the first protrusion 211a can be prepared together with the planarization layer, it is beneficial to simplify the manufacturing process and reduce production costs.

[0063] See alsoFigure 7 According to some embodiments of this application, optionally, the second conductive portion 211b may be located in the anode layer RE. That is, the second conductive portion 211b can be prepared together with the anode layer RE, which is beneficial to simplifying the production process and reducing production costs.

[0064] It should be noted that the second conductive part 211b can also be made of materials other than the material of the anode layer RE, and this application embodiment does not limit this.

[0065] Figure 8 This is another partial cross-sectional schematic diagram of the display panel provided in an embodiment of this application. For example... Figure 8 As shown, with Figure 7 Unlike the illustrated embodiment, in some other specific embodiments, the first protrusion may optionally reuse the support layer. Specifically, the array substrate 210 may include a second substrate 701, a driving device layer 702, a planarization layer 703, a pixel definition layer 704, and a support layer 705 stacked together. The pixel definition layer 704, the support layer 705, and the planarization layer 703 may be made of the same material, all of which are organic materials, and their names may be based on their respective functions. The support layer includes a plurality of spaced-apart support pillars PS, which provide support.

[0066] Along the direction Z, perpendicular to the plane of the display panel, the support layer 705 can be located on the side of the pixel definition layer 704 closest to the encapsulation substrate 220. Figure 8 In the illustrated embodiment, the first protrusion 211a can reuse the support post PS. A second conductive part 211b can be provided on the support post PS to form a second transition pad 211.

[0067] In this way, the first protrusion 211a reuses the support post PS and has a second conductive part 211b on the support post PS. This not only enables the support post PS to provide support, but also allows it to function as a connector with the second conductive part 211b. Furthermore, since the first protrusion 211a reuses the support post PS, there is no need for an additional process to form the first protrusion 211a, which simplifies the manufacturing process and reduces production costs.

[0068] For ease of understanding, the following is an example illustrating the film structure of the display panel provided in the embodiments of this application.

[0069] Figure 9 This is another partial cross-sectional schematic diagram of the display panel provided in an embodiment of this application. For example... Figure 9As shown, according to some embodiments of the present application, optionally, in the array substrate 210, the driving device layer 702 can include the active layer 901, the multi-layer metal layers M1-Mn and the insulating layers interposed between any two adjacent film layers. The touch signal line TP can be located in any one of the multi-layer metal layers M1-Mn. For example, the driving device layer 702 can include the active layer 901, the second metal layer M1, the third metal layer M2, the fourth metal layer M3 and the insulating layers interposed between any two adjacent film layers. The active layer 901 can include the source region and the drain region formed by doping N-type impurity ions or P-type impurity ions, and the channel region formed between the source region and the drain region. For example, the material of the active layer 901 includes but is not limited to amorphous silicon material, polycrystalline silicon material or metal oxide material, etc. For example, the gate insulating layer GI is provided between the second metal layer M1 and the active layer 901, the capacitor insulating layer IMD is provided between the third metal layer M2 and the second metal layer M1, and the interlayer dielectric layer ILD is provided between the fourth metal layer M3 and the third metal layer M2.

[0070] The touch signal line TP can be located in any one of the second metal layer M1, the third metal layer M2 and the fourth metal layer M3. The touch signal line TP and the second conductive part 211b can be electrically connected through the via. It is easy to understand that the display panel 20 is provided with electronic devices such as thin film transistors and capacitors. In some examples, for example, the gate of the thin film transistor and the first plate of the capacitor can be located in the second metal layer M1, the second plate of the capacitor can be located in the third metal layer M2, and the source and the drain of the thin film transistor can be located in the fourth metal layer M3.

[0071] It should be noted that in other embodiments, the driving device layer 702 can also include only two metal layers or more than three metal layers, and the number of metal layers in the driving device layer 702 is not limited in the embodiments of the present application.

[0072] Figure 10 Another partial cross-sectional schematic view of the display panel provided by the embodiments of the present application is shown. As shown, unlike the embodiments shown in Figure 10 Figure 9 According to some embodiments of the present application, optionally, the driving device layer 702 can also include the first metal layer M0 located between the second substrate 701 and the active layer 901. The touch signal line TP can also be located in the first metal layer M0.

[0073] That is, the touch signal line TP is arranged by additionally providing the first metal layer M0 below the active layer 901. Since the first metal layer M0 is far away from the TFT above, the signal crosstalk between the touch signal line TP and the TFT can be weakened, and the display panel has a better display effect.​

[0074] As shown in Figure 9 Alternatively Figure 10 According to some embodiments of the present application, as shown in

[0075] For example, if the touch signal line TP is located in the second metal layer M1, the second conductive part 211b is separated from the second metal layer M1 by the fourth metal layer M3. The second conductive part 211b can be electrically connected to the wire in the fourth metal layer M3 through the third via k3, and the wire in the fourth metal layer M3 is electrically connected to the touch signal line TP through the fourth via k4, thereby realizing the electrical connection between the second conductive part 211b and the touch signal line TP.

[0076] For example, if the touch signal line TP is located in the first metal layer M0, the second conductive part 211b is separated from the first metal layer M0 by at least the fourth metal layer M3. The second conductive part 211b can be electrically connected to the wire in the fourth metal layer M3 through the third via k3, and the wire in the fourth metal layer M3 is electrically connected to the touch signal line TP through the fourth via k4, thereby realizing the electrical connection between the second conductive part 211b and the touch signal line TP.

[0077] When the second adapter pad 211 is far away from the film layer where the touch signal line TP is located in the direction Z perpendicular to the plane where the display panel is located, the insulating layer between the second adapter pad 211 and the film layer where the touch signal line TP is located is relatively thick, which is not conducive to the preparation of the via. First, the second conductive part 211b is connected to at least one metal layer through the third via k3, and then at least one metal layer is connected to the touch signal line TP through the fourth via k4, which is conducive to the preparation of the via, and increases the connection strength and stability between the second conductive part 211b and the touch signal line TP.

[0078] Figure 11 Another top view schematic diagram of the display panel provided by the embodiments of the present application. Figure 12 Another partial cross-sectional schematic diagram of the display panel provided by the embodiments of the present application. Combined with Figure 11 and Figure 12As shown, according to some embodiments of the present application, optionally, the first surface B1 of the array substrate 210 is opposite to the second surface B2 of the package substrate 220. The array substrate 210 can further include a plurality of first support pads 110 arranged in the display area AA and spaced apart. The first support pad 110 can include a second protruding portion 110a protruding from the first surface B1. Exemplarily, the material of the second protruding portion 110a can be the same as that of the first protruding portion, and the second protruding portion 110a can be prepared in the same layer as the first protruding portion, so as to simplify the production process.

[0079] In this way, since the second protruding portion 110a protrudes from the first surface B1, the support between the array substrate 210 and the package substrate 220 can be enhanced by arranging the first support pad 110.

[0080] In some examples, the first support pad 110 can be uniformly distributed around the second transition pad 211, so as to ensure uniformity of the support.

[0081] Figure 13 Another partial cross-sectional view of the display panel according to some embodiments of the present application is provided. As shown in Figure 11 and Figure 13 As shown, according to some embodiments of the present application, optionally, the package substrate 220 can further include a plurality of second support pads 120 arranged in the display area AA and spaced apart, and the second support pad 120 can include a third conductive portion 120a electrically connected with the touch electrode p. Exemplarily, the material of the third conductive portion 120a can be the same as that of the first conductive portion 221a, and the third conductive portion 120a can be prepared in the same layer as the first conductive portion 221a, so as to simplify the production process.

[0082] In Figure 13 the embodiment shown, the material of the second protruding portion 110a can be an insulating material. In the direction Z perpendicular to the plane on which the display panel is located, the second protruding portion 110a can at least partially overlap the third conductive portion 120a of the second support pad 120. The second protruding portion 110a can be overlapped with the third conductive portion 120a, i.e., the second protruding portion 110a can be in contact with the third conductive portion 120a.

[0083] Since the second protruding portion 110a is an insulating material, even if the second protruding portion 110a is in contact with the third conductive portion 120a, the touch driving signal on the array substrate 210 cannot be transmitted to the touch electrode p on the package substrate 220.

[0084] Figure 14 Another partial cross-sectional view of the display panel according to some embodiments of the present application is provided. As shown in Figure 14 as shown,Figure 13 Unlike the illustrated embodiment, according to some other embodiments of this application, optionally, a fourth conductive portion 110b may be provided on the second protrusion 110a, except that the fourth conductive portion 110b is in contact with the insulating layer of the encapsulation substrate 220.

[0085] Specifically, the packaging substrate 220 may include a first insulating layer 503, which includes a first region A1 and a second region A2. The first region A1 is provided with a conductive part (such as a first conductive part 221a or a third conductive part 120a), and the second region A2 is not provided with a conductive part. The conductive part is located on the side of the first insulating layer 503 near the array substrate 210.

[0086] The first support pad 110 may further include a fourth conductive portion 110b, which may cover at least a portion of the second protrusion 110a, such as completely covering the second protrusion 110a or only covering a portion of the second protrusion 110a. Along the direction Z perpendicular to the plane of the display panel, the fourth conductive portion 110b may overlap with the second region A2. Exemplarily, the material of the fourth conductive portion 110b may be the same as the material of the second conductive portion 211b, and the fourth conductive portion 110b may be fabricated in the same layer as the second conductive portion 211b to simplify the manufacturing process.

[0087] Since the second region A2 does not have a conductive part (such as the first conductive part 221a or the third conductive part 120a), even if the fourth conductive part 110b contacts the first insulating layer 503, the touch driving signal on the array substrate 210 cannot be transmitted to the touch electrode p on the packaging substrate 220.

[0088] Figure 15 This is another partial cross-sectional schematic diagram of the display panel provided in an embodiment of this application. For example... Figure 15 As shown, according to some other embodiments of this application, optionally, the first support pad 110 may further include a fourth conductive portion 110b, which may cover at least a portion of the second protrusion 110a. The second support pad 120 may include a third conductive portion 120a. The third conductive portion 120a overlaps with the fourth conductive portion 110b. Figure 15 In the illustrated embodiment, the third conductive portion 120a may not be electrically connected to the touch electrode p. And / or, the fourth conductive portion 110b may not be electrically connected to the bonding pad, for example, the fourth conductive portion 110b may not be electrically connected to the touch signal line TP.

[0089] In this way, although the third conductive part 120a is overlapped with the fourth conductive part 110b, since the third conductive part 120a is not electrically connected with the touch electrode p and / or the fourth conductive part 110b is not electrically connected with the binding pad, the touch driving signal on the array substrate 210 cannot be transmitted to the touch electrode p on the packaging substrate 220.

[0090] Figure 16 Another top view of the display panel is provided in an embodiment of the present application. As shown in Figure 16 According to some embodiments of the present application, optionally, one touch electrode p can be a touch channel. One touch electrode p (or one touch channel) can be electrically connected with m first transfer pads 221, and the m first transfer pads 221 are one-to-one overlapped with m second transfer pads 211, where m is an integer greater than 1.

[0091] In this way, since one touch electrode p can be connected with multiple first transfer pads 221 and multiple second transfer pads 211, it is equivalent to connecting the multiple first transfer pads 221 corresponding to one touch electrode p together, connecting the multiple second transfer pads 211 corresponding to one touch electrode p together, or increasing the conductive area of the first transfer pad 221 and the conductive area of the second transfer pad 211 corresponding to one touch electrode p, thereby reducing the conductive resistance of the first transfer pad 221 on the packaging substrate and the conductive resistance of the second transfer pad 211 on the array substrate.

[0092] It should be noted that in other embodiments, m can also be equal to 1, i.e., one touch electrode p can be electrically connected with only one first transfer pad 221, which is not limited in the embodiments of the present application.

[0093] Continuing to refer to Figure 16 According to some embodiments of the present application, optionally, the m second transfer pads 211 in series can be electrically connected with the binding pad 212 through at least one touch signal line TP. For example, in some embodiments, m is greater than 1, i.e., multiple second transfer pads 211 in series can be electrically connected with the binding pad 212 through the same touch signal line TP, thereby reducing the number of binding pads 212 and touch chip output ports, and reducing production costs.

[0094] Of course, in another embodiment, multiple second transfer pads 211 in series can be electrically connected with the binding pad 212 through multiple touch signal lines TP, which is not limited in the embodiments of the present application.

[0095] Figure 17 Another partial cross-sectional view of the display panel is provided in an embodiment of the present application. As shown in Figure 17As shown, according to some embodiments of this application, optionally, the array substrate 210 may include a second substrate 701, a driving device layer 702, and a cathode layer 160 stacked together. Exemplarily, the material of the cathode layer 160 includes, but is not limited to, lithium (Li), calcium (Ca), lithium fluoride / calcium (LiF / Ca), lithium fluoride / aluminum (LiF / Al), aluminum (Al), or magnesium (Mg). The cathode layer 160 has a plurality of spaced openings H1, and the second transition pad 211 may be located within the openings H1, and the second transition pad 211 may be insulated from the cathode layer 160.

[0096] In this way, by exposing the second transition pad 211 through the opening H1 in the cathode layer 160, a short circuit caused by the electrical connection between the second transition pad 211 and the cathode layer 160 can be avoided.

[0097] See also Figure 17 In some embodiments, the array substrate 210 may further include a pixel definition layer 704, which may be located between the driving device layer 702 and the cathode layer 160 along a direction Z perpendicular to the plane of the display panel. Similar to the cathode layer 160, the pixel definition layer 704 has a plurality of spaced openings H2, which may overlap with openings H1 to expose the second transition pad 211, facilitating the bonding of the second transition pad 211 with the first transition pad 221.

[0098] like Figure 2 As shown, according to some embodiments of this application, optionally, the first transition pad 221 can be uniformly distributed on the packaging substrate 220, and the second transition pad 211 can be uniformly distributed on the array substrate 210. In this way, uniformity of support can be achieved. Similarly, the first support pad 110 can be uniformly distributed on the array substrate 210, and the second support pad 120 can be uniformly distributed on the packaging substrate 220.

[0099] According to some embodiments of this application, optionally, the display panel 20 may specifically be a self-capacitive touch display panel. Specifically, as... Figure 9 As shown, each touch electrode p can be electrically connected to a corresponding touch signal line TP via the first adapter pad 221 and the second adapter pad 211. The touch electrode p can be connected to the touch chip via the corresponding touch signal line TP. The touch signal line TP can be used to send the touch driving signal from the touch chip to the corresponding touch electrode p, and to transmit the touch sensing signal generated by the corresponding touch electrode p back to the touch chip.

[0100] Of course, in other embodiments, the display panel 20 can also be a mutual capacitance touch display panel, and the embodiments of the present application are not limited thereto. For example, for the mutual capacitance touch display panel, the touch electrode can include a touch driving electrode and a touch sensing electrode, and the touch signal line can include a first touch signal line and a second touch signal line. Each touch driving electrode can be electrically connected to a first touch signal line through the first and second adapter pads, and the first touch signal line is used to transmit the touch driving signal output by the touch chip to the touch driving electrode. Each touch sensing electrode can be electrically connected to a second touch signal line through the first and second adapter pads, and the second touch signal line is used to transmit the touch sensing signal generated by the touch sensing electrode to the touch chip.

[0101] Based on the display panel 20 provided in the above embodiments, correspondingly, the present application also provides a display device comprising the display panel provided by the present application. Please refer to Figure 18 , Figure 18 A structural schematic diagram of the display device provided in the embodiments of the present application is shown in FIG. 10. Figure 18 The display device 1000 provided in the present application comprises the display panel 20 provided in any of the above embodiments of the present application. Figure 18 The display device 20 is described by taking a wearable device (such as a watch) as an example in the embodiments of the present application. It can be understood that the display device provided in the embodiments of the present application can be a mobile phone, a computer, a television, a vehicle-mounted display device, or other display devices having a display function, and the present application does not make specific limitations thereon. The display device provided in the embodiments of the present application has the beneficial effects of the array substrate provided in the embodiments of the present application, and specific descriptions can be made with reference to the specific descriptions of the array substrate in the above embodiments, which will not be described herein again.

[0102] It should be understood that the top view structure of the display panel and the cross-sectional structure of the display panel provided in the drawings of the embodiments of the present application are only some examples, and are not used to limit the present application. In addition, the above embodiments provided in the present application can be combined with each other without contradiction.

[0103] According to the above embodiments of the present application, these embodiments do not describe all the details, and the present application is not limited to the specific embodiments described. Obviously, many modifications and changes can be made according to the above description. The embodiments are selected and described in the specification in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well utilize the present application and make modifications and uses on the basis of the present application. The present application is limited by the claims and their entire scope and equivalents.

Claims

1. A display panel, characterized by, The display panel comprises an array substrate and an encapsulation substrate arranged oppositely; The encapsulation substrate comprises a touch electrode and a plurality of first transfer pads arranged in the display area at intervals, the first transfer pads being electrically connected with the touch electrode; The array substrate comprises a plurality of second transfer pads arranged in the display area at intervals and a binding pad in a non-display area, the second transfer pads being electrically connected with the binding pad, and the binding pad being used for binding a touch chip or a flexible circuit board; The first transfer pads are overlapped with the second transfer pads; A first surface of the array substrate is opposite to a second surface of the encapsulation substrate; The array substrate further comprises a plurality of first support pads arranged in the display area at intervals, the first support pads comprising second protruding portions protruding from the first surface; The encapsulation substrate further comprises a plurality of second support pads arranged in the display area at intervals, the second support pads comprising third conductive portions electrically connected with the touch electrode; The second protruding portions are made of insulating materials, and the second protruding portions are overlapped with the third conductive portions of the second support pads.

2. The display panel of claim 1, wherein, The array substrate further comprises a touch signal line, at least part of a wire segment of the touch signal line being located in the display area, and the touch signal line being used for connecting the second transfer pads and the binding pad.

3. The display panel of claim 2, wherein, A first surface of the array substrate is opposite to a second surface of the encapsulation substrate; The first transfer pads comprise first conductive portions electrically connected with the touch electrode; The second transfer pads comprise first protruding portions and second conductive portions covering at least part of the first protruding portions, the second conductive portions protruding from the first surface, and the second conductive portions being electrically connected with the touch signal line; The first conductive portions are electrically connected with the second conductive portions.

4. The display panel of claim 3, wherein, The encapsulation substrate comprises a first substrate, a touch function layer, a first insulating layer and a first conductive layer arranged in layers, along a direction perpendicular to a plane where the display panel is located, the first conductive layer being located on a side of the first insulating layer close to the array substrate; The first conductive portions are located in the first conductive layer, the touch electrode is located in the touch function layer, and the first conductive portions are electrically connected with the touch electrode through first vias formed in the first insulating layer.

5. The display panel of claim 4, wherein, The encapsulation substrate further comprises a second insulating layer and a second conductive layer, along a direction perpendicular to a plane where the display panel is located, the second insulating layer being located between the touch function layer and the first insulating layer, and the second conductive layer being located between the first insulating layer and the second insulating layer; The second insulating layer is provided with second vias, and the first conductive portions are electrically connected with the touch electrode through the first vias, the second conductive layer and the second vias in sequence.

6. The display panel of claim 3, wherein, The array substrate comprises a second substrate, a driver device layer, a planarization layer and an anode layer arranged in layers, the anode layer covering part of the planarization layer, along a direction perpendicular to a plane where the display panel is located, the anode layer being located on a side of the planarization layer close to the encapsulation substrate; The first protruding part is located on the planarization layer, and a thickness of the planarization layer at the second transition pad is greater than a thickness of other areas in the display panel except the second transition pad, the thickness being a minimum distance in a direction perpendicular to a plane where the display panel is located.

7. The display panel of claim 6, wherein, The second conductive part is located on the anode layer.

8. The display panel of claim 3, wherein, The array substrate comprises a second substrate, a driving device layer, a planarization layer, a pixel definition layer and a support layer which are stacked, the support layer comprises a plurality of support columns which are arranged at intervals, and the support layer is located on a side of the pixel definition layer close to the package substrate in a direction perpendicular to a plane where the display panel is located. The first protruding part multiplexes the support columns.

9. The display panel of claim 2, wherein, The array substrate comprises a second substrate and a driving device layer which are stacked, and the driving device layer comprises an active layer, a plurality of metal layers and an insulating layer which are stacked. The touch signal line is located in any one of the plurality of metal layers.

10. The display panel of claim 9, wherein, The driving device layer further comprises a first metal layer located between the second substrate and the active layer. The touch signal line is located in the first metal layer or any one of the plurality of metal layers.

11. The display panel of claim 9 or 10, wherein, In a direction perpendicular to a plane where the display panel is located, the second conductive part of the second transition pad is separated from a layer where the touch signal line is located by at least one metal layer; The second conductive part is electrically connected to the at least one metal layer through a third via, and the at least one metal layer is electrically connected to the touch signal line through a fourth via.

12. The display panel of claim 1, wherein, The package substrate comprises a first insulating layer, the first insulating layer comprises a first area and a second area, the first area is provided with a conductive part, the second area is not provided with the conductive part, and the conductive part is located on a side of the first insulating layer close to the array substrate; The first support pad further comprises a fourth conductive part, the fourth conductive part covers at least part of the second protruding part, and the fourth conductive part overlaps with the second area in a direction perpendicular to a plane where the display panel is located.

13. The display panel of claim 1, wherein, The first support pad further comprises a fourth conductive part, the fourth conductive part covers at least part of the second protruding part; The package substrate further comprises a plurality of second support pads arranged at intervals in the display area, and the second support pads comprise third conductive parts; The third conductive part is not electrically connected to the touch electrode, and / or the fourth conductive part is not electrically connected to the binding pad; The third conductive part overlaps with the fourth conductive part.

14. The display panel of claim 1, wherein, One of the touch electrodes is electrically connected to m first transition pads, m second transition pads overlap with the m first transition pads one by one, and m is an integer greater than 1.

15. The display panel of claim 14, wherein, The array substrate further comprises a touch signal line, and the touch signal line is used to connect the second transition pad and the binding pad. The m second transition pads are electrically connected to the binding pad through at least one touch signal line after being connected in series.

16. The display panel of claim 1, wherein, The array substrate comprises a second substrate, a driving device layer and a cathode layer which are stacked, the cathode layer is provided with a plurality of openings arranged at intervals, the second transfer pad is located in the opening and is insulated from the cathode layer.

17. The display panel of claim 1, wherein, The first transfer pads are uniformly distributed on the package substrate, and the second transfer pads are uniformly distributed on the array substrate.

18. The display panel of claim 1, wherein, Each touch electrode is electrically connected to a touch signal line through the first transfer pad and the second transfer pad, the touch electrode is connected to a touch chip through the corresponding touch signal line, the touch signal line is used for transmitting a touch driving signal emitted by the touch chip to the corresponding touch electrode and transmitting a touch sensing signal generated by the corresponding touch electrode back to the touch chip.

19. A display device comprising: A display panel comprising any one of claims 1 to 18.

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