Wafer container

Abstract

A wafer container includes a container body, support frames, a filter unit, an exhaust unit, and a vent passage. The support frames are arranged in parallel within the container body. The support frames are configured to hold wafers. The filter unit is disposed on a first one of the support frames and has a filter element. The exhaust unit is disposed on a second one of the support frames and has a gas flow passage. The vent passage is connected to the filter element of the filter unit and to the exhaust unit. The gas flow passage of the exhaust unit is disposed in the vent passage to inject gas from the corresponding exhaust passage or to exhaust gas from the corresponding vent passage. In this way, gas within the wafer container can flow, preventing wafers from being contaminated by the internal gas and affecting yield.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a wafer container. BACKGROUND

[0002] After a semiconductor wafer process is completed, the wafer is placed in a wafer container. The wafer container is a container used for semiconductor production or loading, such as a FOUP, a Reticle Pod, a FOSB, or other types of containers. However, the completed semiconductor wafer will generate airborne molecular contamination (AMC) due to outgassing, and the original oxygen and water vapor in the air will interact with each other in the wafer container, thereby generating defects on the semiconductor wafer, affecting the yield. If the cleaning frequency of the wafer container is increased, it will waste additional time in the FAB.

[0003] Therefore, how to improve the problem of wafer container and wafer residual airborne molecular contamination affecting wafer quality and yield is a very important key in current semiconductor manufacturing, and is one of the problems that technicians in the field urgently need to solve. SUMMARY

[0004] One aspect of the present disclosure relates to a wafer container.

[0005] According to an embodiment of the present disclosure, a wafer container includes a container body, support frames, a filter unit, an exhaust unit, and air passage channels. The support frames are arranged in parallel in the container body. The support frames are configured to hold wafers. The filter unit is disposed on a first one of the support frames and has a filter cartridge. The exhaust unit is disposed on a second one of the support frames and has a gas flow device. The air passage channels connect the filter cartridge of the filter unit and the exhaust unit. The gas flow device of the exhaust unit is disposed in the air passage channels to inject gas into or exhaust gas from the corresponding air passage channels.

[0006] In one or more embodiments of the present disclosure, the container body includes exhaust holes. The exhaust unit includes exhaust channels corresponding to the air passage channels. The exhaust channels connect the exhaust holes.

[0007] In one or more embodiments of the present disclosure, the filter unit further includes a support housing. The filter cartridge is disposed in the support housing. The support housing has a first side facing the wafers and a second side opposite the first side. The second side of the support housing is connected to the air passage channels.

[0008] In some embodiments of the present disclosure, the support housing, the air passage channels, and the exhaust unit are integrally formed to form a filter module assembly.

[0009] In some embodiments of the present disclosure, the connection between the ventilation passage and the exhaust unit is sealed by the support material.

[0010] In one or more embodiments of the present disclosure, the support frames are arranged in parallel along a first direction perpendicular to the container bottom of the container body. The first support frame and the second support frame are the two support frames closest to the container bottom.

[0011] In one or more embodiments of the present disclosure, the support frames are arranged in parallel along a first direction perpendicular to the container bottom of the container body. The first support frame and the second support frame are the two support frames farthest from the container bottom.

[0012] In one or more embodiments of the present disclosure, the ventilation passage is located on opposite sides of the exhaust unit or the filter unit. The exhaust unit or the filter unit has a clamping surface between the two ventilation passages.

[0013] In one or more embodiments of the present disclosure, the exhaust unit further comprises a detector. The detector is used to sense the gas in the container body.

[0014] In some embodiments of the present disclosure, the exhaust unit further comprises a transceiver unit. The transceiver unit is connected to the detector and the gas flow device, so as to remotely monitor the gas in the container body and remotely control the operation of the gas flow device.

[0015] In summary, the present disclosure provides a wafer container for accommodating semiconductor wafers. The wafer container further comprises an exhaust unit and a filter unit, so as to enable the gas in the wafer container to flow, thereby removing the airborne molecular contamination (AMC) from the stacked wafers.

[0016] It should be understood that the general description above and the detailed description below are further explained by way of examples, and are intended to provide further explanation of the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0017] The advantages of the present disclosure and the figures will be better understood by the following embodiments, and reference will be made to the accompanying drawings. The description of the figures is only an example of the embodiments, and therefore should not be considered as limiting the individual embodiments or limiting the scope of the claims.

[0018] Figure 1 A cross-sectional view of a wafer container according to an embodiment of the present disclosure is schematically shown;

[0019] Figure 2 A bottom view of a wafer container according to an embodiment of the present disclosure is schematically shown;

[0020] Figure 3 A cross-sectional view of a filter unit according to an embodiment of the present disclosure is schematically shown;

[0021] Figure 4 schematically illustrates a bottom view of a filter unit according to an embodiment of the present disclosure;

[0022] Figure 5 schematically illustrates a cross-sectional view of an exhaust unit according to an embodiment of the present disclosure;

[0023] Figure 6 schematically illustrates a cross-sectional view of a filter module assembly according to an embodiment of the present disclosure; and

[0024] Figure 7 schematically illustrates a cross-sectional view of a wafer container according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0025] The following detailed description is provided to provide a better understanding of the present disclosure, and should not be considered as limiting the scope of the present disclosure. The description of the structure and operation of the present disclosure is not intended to limit the order of execution, and any structure recombined by elements, resulting in a device with equivalent efficiency, is within the scope of the present disclosure. In addition, the drawings are for illustration purposes only and are not drawn to scale. For ease of understanding, the same elements or similar elements will be denoted by the same reference signs in the following description.

[0026] Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meaning, which is understood by those skilled in the art. Further, the definitions of the aforementioned terms in the commonly used dictionaries shall be construed to be consistent with the meaning in the context of the present disclosure. Unless specifically defined otherwise, these terms are not to be interpreted in an idealized or overly formal sense.

[0027] As used herein, the terms "first", "second", etc. do not necessarily mean a specific order or sequence, nor are they intended to limit the present disclosure. They are merely used to distinguish elements or operations described by the same technical terms.

[0028] Secondly, as used herein, the words "comprise", "include", "have", "contain", and the like, are open-ended terms, i.e., meaning "including but not limited to".

[0029] Further, in this document, unless the context clearly requires otherwise, "a", "an", and "the" can be used generically to refer to one or more, i.e., to convey the idea of "one or more". It will be further understood that the terms "comprises", "comprising", "includes", "including", "has", "having", and the like, when used herein, mean "including but not limited to", and are intended to be interpreted as open-ended terms.

[0030] To improve the yield of semiconductor wafers from internal gas contamination during storage or transportation after process completion, a wafer container is provided to provide gas flow between semiconductor wafers to remove gas molecular contamination (AMC).

[0031] Please refer to Figure 1 . Figure 1 A cross-sectional view of a wafer container 100 according to an embodiment of the present disclosure is schematically shown.

[0032] As Figure 1 shown, in the present embodiment, the wafer container 100 includes a container body 110, a plurality of support frames 120, a filter unit 130, an exhaust unit 150, and a ventilation passage 140. One set of handles 118 of the wafer container 100 is disposed on a top surface 111 of the container body 110.

[0033] In the present embodiment, the wafer container 100 is exemplified as a front opening unified pod (FOUP), but the present disclosure is not limited thereto. In some embodiments, the wafer container 100 of the front opening unified pod can comply with SEMI E47.1 specifications, and the container body 110 of the wafer container 100 can be modified and designed based on SEMI E47.1 specifications.

[0034] In Figure 1 the present embodiment, the container body 110 of the wafer container 100 can be used to accommodate a plurality of wafers 200, which can be semiconductor wafers that have completed a process or semi-finished wafers that are transported between various workstations / stations.

[0035] Inside the container body 110, the plurality of wafers 200 are stacked along a direction D1. In detail, as Figure 1 shown, a plurality of support frames 120 are disposed inside the container body 110. The plurality of support frames 120 are arranged along the direction D1. The wafers 200 are respectively placed on the support frames 120 inside the container body 110.

[0036] As Figure 1 shown, the support frame 120 further includes a first support frame 121 and a second support frame 122. The first support frame 121 and the second support frame 122 can be respectively used to support the filter unit 130 and the exhaust unit 150. In the present embodiment, the first support frame 121 is most adjacent to the second support frame 122, and the first support frame 121 and the second support frame 122 are adjacent to a bottom surface 112 of the container body 110.

[0037] In Figure 1In the embodiment, the distance H between the two nearest support frames 120 supporting the wafer 200 is provided. In the embodiment, the support frames 120 other than the first support frame 121 and the second support frame 122 are arranged at equal intervals H. The distance Hl is provided between the first support frame 121 supporting the filter unit 130 and the nearest support frame 120 supporting the wafer 200. The distance H2 is provided between the first support frame 121 and the second support frame 122. In the embodiment, the distance Hl and the distance H2 are both greater than the distance H, and two first support frames 121 and two second support frames 122 with wider intervals are provided on the bottom surface 112 of the container body 110 to accommodate the filter unit 130 and the exhaust unit 150, which occupy a larger volume in the container body 110 than the wafer 200.

[0038] In some embodiments, the distance H2 between the first support frame 121 and the second support frame 122 is greater than the distance H between other support frames 120. The greater distance H2 between the first support frame 121 and the second support frame 122 can be achieved by removing one of the support frames 120. For example, one support frame 120 can be originally provided between the first support frame 121 and the second support frame 122. After removing the support frame 120 between the first support frame 121 and the second support frame 122, the second support frame 122 is nearest to the first support frame 121. This corresponds to the distance H2 between the first support frame 121 and the second support frame 122 being twice the distance H. In some embodiments, the first support frame 121 and the second support frame 122 can be designed to have a greater distance H2 than other support frames 120. In some embodiments, the filter unit 130 and the exhaust unit 150 can be designed to have a smaller volume, so that the standard design does not need to be modified, and the distance Hl, the distance H2, and the distance H are equal to each other.

[0039] In the embodiment, the material of the container body 110 is selected to be non-absorbing, so that water vapor, gaseous molecular or particulate pollutants do not remain or accumulate in the container body 110. However, after the wafer 200 is processed, the wafer 200 in the container body 110 emits gaseous molecular pollutants. Since the container body 110 is made of non-absorbing material, the gaseous molecular pollutants subsequently contaminate the wafer 200 itself. At this time, the design of the filter unit 130 and the exhaust unit 150 enables gas flow between the wafers 200, thereby removing the gaseous molecular pollutants from between the wafers 200.

[0040] In some embodiments, filter element 136 is a consumable. The selection of filter element 136 primarily considers the AMCs that need to be filtered out; for example, to filter out NH3 (ammonia), activated carbon material can be used. In some embodiments, other lightweight materials that do not generate dust / particulate matter can also be selected as filter element 136.

[0041] like Figure 1 As shown, in this embodiment, the filtration unit 130 includes a support housing 132 and a filter element 136. The filter element 136 spatially divides the support housing 132 into two sections. The side of the filter element 136 facing the wafer 200 is exposed. On the side of the filter element 136 exposed relative to the wafer 200, the support housing 132 is provided with two ventilation channels 140 that are connected to the exhaust unit 150.

[0042] In some implementations, the shape of the filter unit 130 may be similar to that of the wafer 200.

[0043] In this embodiment, such as Figure 1 As shown, the exhaust unit 150 includes an exhaust module 153, an intake module 156, a control unit, and a battery 159. Both the exhaust module 153 and the intake module 156 are gas flow devices, and are respectively disposed on corresponding ventilation channels 140 to connect to the filter element 136. In this embodiment, the intake module 156, the exhaust module 153, and the corresponding ventilation channels 140 are sealed by support material 170.

[0044] like Figure 1 As shown, in this embodiment, the bottom surface 112 of the container body 110 includes two vent holes 115. The venting module 153 can guide gas from the wafer 200 placement area to the corresponding ventilation channel 140, and discharge gas from the container body 110 through the vent holes 115 in a direction opposite to direction D1. To compensate for the venting of the venting module 153, the intake module 156 can introduce gas into the container body 110 in direction D1 through the corresponding vent holes 115. The gas introduced into the container body 110 will enter the corresponding ventilation channel 140, and then pass through the filter element 136 of the filter unit 130, and be injected into the wafer 200 placement area. With the flow of gas, AMC or other particles can be adsorbed by the filter element 136 of the filter unit 130, thereby removing contaminated gas from inside the container body 110.

[0045] The control unit and the battery 159 are connected to the exhaust module 153 and the intake module 156, so as to provide power and control the operation of the exhaust module 153 and the intake module 156. In some embodiments, the battery of the control unit and the battery 159 can be designed to be wirelessly charged, so as to be wirelessly charged at a fixed position or at an arranged position. In some embodiments, the exhaust module 153 to be charged can also be directly replaced by using an automatic device.

[0046] In the present embodiment, the exhaust module 153 and the intake module 156 are respectively arranged at two ends of the control unit and the battery 159. The purpose of arranging the exhaust module 153 and the intake module 156 is to generate a small air flow in the container body 110 of the wafer container 100, so that the gas in the container body 110 can be brought into the filter unit 130 by the air flow, and the contaminants such as AMC are filtered out.

[0047] For the purpose of simple description, only the relative positions between the elements of the exhaust module 150 are schematically shown in Figure 1 , and the specific structures of the exhaust module 153, the intake module 156, and the control unit and the battery 159 are omitted. In some embodiments, the exhaust module 153 and the intake module 156 are, for example, gas flow devices including a motor and a fan, so as to guide the gas to be introduced or exhausted.

[0048] In some embodiments, the exhaust module 153 and the intake module 156 can also use a pump for pressurized active intake or passive intake. For example, the intake module 156 is a module for allowing external air or clean gas to enter, which includes an intake filter and a pump for intake. When the pump pressurizes the exhaust, an intake end of the intake module 156 enters through the intake filter. The intake filter is mainly used to filter the particles of the gas entering the intake. In some embodiments, the exhaust module 153 is a module for allowing the gas filtered by the filter unit 130 to be exhausted, which can include an exhaust pump.

[0049] As shown in Figure 1 , in the present embodiment, the container body 110 includes two exhaust holes 115. The exhaust module 153 and the intake module 156 are respectively connected to the exhaust holes 115 and form sealed channels by the support material 172. In this way, after the exhaust module 153 and the intake module 156 make the gas in the container body 110 flow, the gas in the container body 110 can be circulated through the exhaust holes 115, which is beneficial to the overall cleaning efficiency.

[0050] In some embodiments, the container body 110 can also not be provided with external exhaust holes 115. The gas in the container body 110 is circulated by the exhaust module 153 and the intake module 156, and after the gas flow passes through the filter element 136 of the filter unit 130, the effect of cleaning the contaminants can still be achieved.

[0051] In some embodiments, the exhaust unit 150 can also include only either the exhaust module 153 or the intake module 156.

[0052] For example, in some embodiments, the exhaust unit 150 is provided with only the exhaust module 153, but still maintains two separate and communicating air passages 140 with the filter unit 130. In this way, when the exhaust module 153 draws gas at the location of the wafer 200 through one air passage 140, due to the pressure of the gas, the other air passage 140 will be able to replenish the gas. In this way, the circulation of the gas within the container body 110 through the filter element 136 of the filter unit 130 can still be achieved, thereby cleaning the gas within the container body 110.

[0053] Referring to Figure 2 . Figure 2 A bottom view of a wafer container 100 according to an embodiment of the present disclosure is schematically illustrated. According to the SEMI E47.1 specification, the bottom surface 112 of the container body 110 of the FOUP wafer container 100 can be provided with a plurality of conductive pads (not illustrated for simplicity of illustration) and cleaning holes 181, 182, 183 and 184. The cleaning holes 181, 182, 183 and 184 communicate with the interior of the container body 110. The projection of the wafer 200 received by the container body 110 on the bottom surface 112 is indicated by dashed lines. Another pair of handles 119 of the wafer container 100 is provided on the side surface of the container body 110.

[0054] In the present embodiment, the exhaust hole 115 on the bottom surface 112 of the container body 110 is located within the projection of the wafer 200 and is separated from the cleaning holes 181, 182, 183 and 184 located at the four corners of the bottom surface 112. Therefore, Figure 1 The cross-sectional view illustrated does not show the cleaning holes 181, 182, 183 and 184.

[0055] For the container body 110, the cleaning holes 181, 182, 183 and 184 communicating with the interior can be used to inject cleaning liquid / gas, so as to clean the interior of the container body 110. In some embodiments, when cleaning the interior of the container body 110, two of the cleaning holes 181, 182, 183 and 184 can be used as inlets to inject cleaning liquid / gas, and the other two can be used as outlets for the cleaning liquid / gas.

[0056] In this embodiment, an exhaust port 115 connected to the internal exhaust unit 150 is further provided. In this way, when the wafer container 100 is used to store or transport the wafer 200, the exhaust unit 150 will be able to keep the gas inside the container body 110 flowing, so that the filter element 136 of the filtration unit 130 can adsorb contaminants.

[0057] When the cleaning liquid / gas is to be injected into the container body 110, the filter unit 130, the exhaust unit 150 and all the wafers 200 are removed from the container body 110. At this time, the two exhaust holes 115 can be regarded as two cleaning holes for injecting or discharging the cleaning liquid / gas.

[0058] To further illustrate the structure of filter unit 130, please also refer to... Figure 3 and Figure 4 . Figure 3 A cross-sectional view of the filtering unit 130 is schematically illustrated according to one embodiment of the present disclosure. Figure 4 A bottom view of the filtering unit 130 is schematically illustrated according to one embodiment of the present disclosure.

[0059] like Figure 3 As indicated, in this embodiment, the filter unit 130 includes a first side 133 and a second side 134. Please also refer to... Figure 1 and Figure 3 The first side 133 of the filter unit 130 faces the wafer 200, and the support housing 132 of the filter unit 130 provides an opening so that the filter element 136 is exposed from the support housing 132 to the wafer 200. Two ventilation channels 140 are designed to extend from the second side 134 of the support housing 132.

[0060] exist Figure 4 The second side 134 of the filter unit 130 is illustrated. The filter unit 130 can be designed to have the shape of a wafer 200. Two ventilation channels 140 correspond to the design of the bottom surface 112 of the container body 110, and the ventilation channels 140 are arranged at opposite ends in the horizontal direction of the circular filter unit 130. Thus, a clamping surface 135 can be provided on the second side 134 of the filter unit 130 for automated gripping by instruments such as robotic arms.

[0061] For example, when the filter unit 130 is to be replaced, the clamping fixture can clamp the clamping surface 135 of the filter core 136 exposed on the first side 133 and the second side 134, so as to take out the filter unit 130. The filter core 136 is to be replaced, and such clamping manner can not damage the support housing 132. In some embodiments, after the filter unit 130 is taken out from the container body 110, the filter core 136 in the support housing 132 can be replaced, and then the filter unit 130 can be placed back into the container body 110.

[0062] By reserving the clamping surface 135 suitable for robot automatic grabbing (for example, by a robot arm) or similar clamping space, it will be beneficial to introduce automation equipment to realize automatic replacement of the filter unit 130 or the filter core 136 in the filter unit 130.

[0063] In some embodiments, the shape of the filter unit 130 can also be designed as other shapes that can be placed into the container body 110, and the ventilation passage 140 of the filter unit 130 can avoid the existing cleaning holes (such as Figure 2 cleaning holes 181, cleaning holes 182, cleaning holes 183, and cleaning holes 184) of the container body 110, for example, the existing cleaning gas inlet and outlet, the conduit cleaning gas inlet. The position of the ventilation passage 140 of the filter unit 130 can also be designed to have a functional position under the SEMI E47.1 specification standard. For example, under the SEMI E47.1 specification standard, the bottom of the container body 110 is provided with an information conductive pad (info pad), and the position of the ventilation passage 140 is designed to avoid the information conductive pad. In some embodiments, the connection and integration of the position of the ventilation passage 140 of the container body 110 and the position of other cleaning holes can also be considered, which will be discussed later.

[0064] Figure 5 According to an embodiment of the present disclosure, a cross-sectional view of the exhaust unit 150 is schematically shown. It is simultaneously referred to Figure 3 and Figure 5 It can be seen that, in order to reserve the clamping surface 135 between the ventilation passages 140, the exhaust module 153 and the inlet module 156 are arranged on opposite sides in the horizontal direction. For the exhaust unit 150, in this way, the space for arranging the control unit and the battery 159 can be reserved between the exhaust module 153 and the inlet module 156.

[0065] In some embodiments, the control unit and the battery 159 of the exhaust unit 150 include a detector. The detector can be used to sense the gas in the container body 110, including the composition, humidity, temperature, and the like of the gas in the container body 110, and can thereby control the exhaust module 153 and the inlet module 156 to regulate the gas flow.

[0066] Further, in some embodiments, the exhaust unit 150 further comprises a transceiver unit. The transceiver unit is connected to the detector and the gas flow device including the exhaust module 153 and the intake module 156 to transmit or receive information. In this way, through the transceiver unit, the information of the gases inside the container body 110 monitored by the detector can be transmitted in real time, and the exhaust module 153 and the intake module 156 can be remotely controlled according to the information of the gases.

[0067] In this way, the control unit and the battery 159 can be connected to the 5G network architecture and the like, so that the status of each wafer container 100 can be controlled in detail.

[0068] In some embodiments, the transceiver unit can wirelessly transmit control information, or can be arranged at a fixed position or at a scheduled position to control the operation program and time of the exhaust module 153 and the intake module 156 in the wafer container 100. For example, at the load port or the purge stage, the exhaust module 153 and the intake module 156 have different operation requirements.

[0069] In some embodiments, through the information monitored by the detector and the remote control realized by the transceiver unit, the cleaning inside the wafer container 100 can be more intelligently managed by artificial intelligence or according to big data.

[0070] Referring to Figure 1 and Figure 5 , the support material 170 provided by the exhaust unit 150 can be used to seal with the ventilation channel 140. The support material 172 provided by the exhaust unit 150 can be used to seal with the exhaust hole 115 of the container body 110. The support material 172 can be regarded as the exhaust channel of the exhaust unit 150 being connected to the exhaust hole 115 respectively, so that the exhaust module 153 and the intake module 156 are separated from each other and can normally operate.

[0071] Figure 6 According to an embodiment of the present disclosure, a cross-sectional view of the filter module assembly 160 is schematically shown. In some embodiments, the filter unit 130 and the exhaust unit 150 can be directly together to form the filter module assembly 160. In Figure 6 the embodiment, the ventilation channel 140 extended by the support housing 132 is directly connected to the exhaust module 153 and the intake module 156 respectively, so that the support material 172 for sealing is not needed.

[0072] In this way, Figure 6The filter module assembly 160 can still be placed inside the container body 110 and occupy two most adjacent support frames 120 (e.g. the first support frame 121 and the second support frame 122). In this way, the filter module assembly 160 can be designed to be as small and light as possible, and when it needs to be replaced, it can be directly grabbed by the automated equipment from inside the container body 110.

[0073] Figure 7 A cross-sectional view of a wafer container 100' according to another embodiment of the present disclosure is schematically illustrated. Figure 7 The wafer container 100' and Figure 1 The wafer container 100' differs from the wafer container 100 in that the exhaust unit 150 and the filter unit 130 are disposed adjacent to the top surface 111 of the container body 110. The exposed direction of the filter element 136 of the filter unit 130 is also modified to correspond to the position of the wafer 200. In this way, the conductive pads disposed on the bottom surface 112 of the wafer container 100' can be designed according to the original SEMI E47.1 standard.

[0074] In summary, the present disclosure provides a wafer container provided with a filter unit and an exhaust unit. The filter unit and the exhaust unit can be directly disposed on the support frame inside the wafer container for placing the wafer, and thereby actively clean the container body of the wafer container. In this way, the damage to the wafer caused by the contaminated gas can be improved, thereby avoiding affecting the yield of the wafer when the wafer container is used for storing or transporting the wafer. In addition, this can also avoid arranging an additional cleaning schedule for the wafer container. In this way, the microenvironment inside the container body of the wafer container can be controlled. Based on the size of the wafer and the container body of the wafer container, only a small amount of power can be used to achieve the benefits of reducing the cleaning frequency or not needing to replace the wafer container for cleaning during product manufacturing.

[0075] Although the present disclosure has been disclosed with examples as above, it is not intended to limit the present disclosure, and any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the appended claims.

[0076] It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the present disclosure cover modifications and variations of the disclosed embodiments provided they fall within the scope of the appended claims.

[0077] [Symbolic explanation]

[0078] 100: wafer container

[0079] 110: container body

[0080] 111: top surface

[0081] 112: bottom surface

[0082] 115: vent hole

[0083] 118: handle

[0084] 119: handle

[0085] 120: support frame

[0086] 121: first support frame

[0087] 122: second support frame

[0088] 130: filter unit

[0089] 132: support housing

[0090] 133: first side

[0091] 134: second side

[0092] 135: clamping surface

[0093] 136: filter cartridge

[0094] 140: air passage

[0095] 150: exhaust unit

[0096] 153: exhaust module

[0097] 156: intake module

[0098] 159: control unit and battery

[0099] 160: filter module assembly

[0100] 170, 172: support material

[0101] 181, 182, 183, 184: cleaning hole

[0102] 200: wafer

[0103] D1: direction

[0104] H: interval

[0105] H1: interval

[0106] H2: interval

Claims

1. A wafer container, characterized in that, include: Container body; A plurality of support frames are arranged in parallel within the container body, wherein the support frames are configured to hold a plurality of wafers; A filter unit is disposed on the first support frame among the support frames and has a filter element; An exhaust unit, mounted on the second support frame of the support frames, and having a gas flow device; and Two ventilation channels are connected to the filter element of the filter unit and the exhaust unit to the outside of the container body, respectively. The gas flow device of the exhaust unit is provided in one of the two ventilation channels to inject gas into the corresponding ventilation channel or to discharge the gas from the corresponding ventilation channel.

2. The wafer container according to claim 1, characterized in that, The container body includes two exhaust ports, and the exhaust unit includes two exhaust channels corresponding to the two ventilation channels, which are connected to the two exhaust ports.

3. The wafer container according to claim 1, characterized in that, The filtration unit also includes a support housing, the filter element is disposed inside the support housing, the support housing has a first side facing the wafers, and a second side of the support housing opposite the first side is connected to the two ventilation channels.

4. The wafer container according to claim 3, characterized in that, The support housing, the two ventilation channels, and the exhaust unit are integrally formed to create the filter module assembly.

5. The wafer container according to claim 3, characterized in that, The two connections between the two ventilation channels and the exhaust unit are sealed by two supporting materials.

6. The wafer container according to claim 1, characterized in that, The support frames are arranged parallel to each other along a first direction perpendicular to the bottom of the container body, and the first support frame and the second support frame are the two support frames closest to the bottom of the container.

7. The wafer container according to claim 1, characterized in that, The support frames are arranged parallel to each other along a first direction perpendicular to the bottom of the container body, and the first support frame and the second support frame are the two support frames furthest from the bottom of the container.

8. The wafer container according to claim 1, characterized in that, The two ventilation channels are located on opposite sides of the exhaust unit or the filter unit, and there is a clamping surface between the exhaust unit or the filter unit and the two ventilation channels.

9. The wafer container according to claim 1, characterized in that, The exhaust unit further includes a detector for sensing the gas inside the container body.

10. The wafer container according to claim 9, characterized in that, The exhaust unit further includes a transceiver unit that connects the detector and the gas flow device to remotely monitor the gas inside the container body and remotely control the operation of the gas flow device.

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