Photosensitive resin composition, cured film and color filter

Abstract

This invention discloses a photosensitive resin composition, a cured film, and a color filter. By weight percentage, the composition comprises 10-50% monomeric compound, 10-50% polymer, 0.01-2% thiol monomeric compound, 0.1-30% initiator, 20-30% colorant, 0.1-5% binder, and 0.01-1% surfactant. The photosensitive resin composition, through the combination of thiol monomeric compound containing multiple thiol groups with monomers and resin, can meet the requirements for crosslinking under low temperature conditions, and can meet the chemical properties required for EL or flexible non-glass substrate displays, while avoiding the defect of degassing.

Description

Technical Field

[0001] This invention relates to the field of photosensitive resin technology, and more specifically, to photosensitive resin compositions, cured films, and color filters. Background Technology

[0002] The market for color filters paired with EL or flexible non-glass substrate display devices is gradually opening up, but existing color filter photosensitive components have the following problems:

[0003] (1) The post-baking temperature of the cross-linking reaction needs to be above 150°C to ensure that the film of the color filter formed by the material has sufficient chemical resistance. All related process temperatures required for the new EL or flexible non-glass substrate display device mentioned above must be controlled as low as 85°C.

[0004] (2) When the cross-linking reaction temperature is too low, for example, if it does not meet 150°C, the decomposed or undecomposed material molecules in the color filter film formed by coating are prone to sublimation and outgassing.

[0005] In existing technologies, common photosensitive materials for color filters typically use polymeric monomer compounds and combinations of polymeric compounds derived from polysiloxanes, cardo resins, and methacrylic or acrylic resins as resins, along with added photopolymerization initiators, colorants, adhesives, surfactants, and solvents. The crosslinking reaction temperature of the photosensitive material mainly depends on the selection of polymeric monomers and their combination with the resin. Therefore, it is necessary to propose a new photosensitive resin composition that lowers the crosslinking reaction temperature while meeting performance requirements. Summary of the Invention

[0006] In view of this, the present invention provides a photosensitive resin composition to solve the defects of the prior art in terms of chemical resistance and degassing under low-temperature crosslinking reaction conditions.

[0007] Based on this, the technical solution of the present invention is as follows:

[0008] The photosensitive resin composition, by weight percentage, comprises the following components: 10-50% monomer compound, 10-50% polymer, 0.01-2% thiol monomer compound, 0.1-30% initiator, 20-30% colorant, 0.1-5% binder, and 0.01-1% surfactant;

[0009] Monomer compounds have the general structural formula of formula (1):

[0010]

[0011] Wherein, W is selected from hydrogen atom or methyl, X is selected from carbon or hydrogen atom, Y is selected from thiophene or tetrahydrofuran, and Z is selected from hydrogen atom, single carbon bond, ether group, ester group, lactone group with 1 to 12 carbons, carbonate group, amide group, carbamate group, alkyl or alkene or alkynyl group with 2 to 20 carbons.

[0012] The polymer contains several repeating units of polyacrylic acid, and the repeating units contain thiophene and / or tetrahydrofuran functional groups, with the molar percentage of repeating units containing thiophene or tetrahydrofuran functional groups being greater than 20%.

[0013] Thiol monomeric compounds include at least four thiol functional groups.

[0014] In embodiments of the present invention, the monomeric compound is selected from at least one of the structures of formulas (2) and (3):

[0015]

[0016] In embodiments of the present invention, the thiol monomer compound is selected from at least one of the structures of formulas (4-1) and (4-2):

[0017]

[0018]

[0019] In embodiments of the present invention, the polymer comprises repeating units containing at least one unsaturated acrylate carbon-carbon double bond as the terminal end.

[0020] In a preferred embodiment, the repeating unit in the polymer comprises at least one structure of formulas (5) to (9), and at least one structure of formulas (10) to (11):

[0021]

[0022] In embodiments of the present invention, the molecular weight of the polymer is between 2,000 and 100,000.

[0023] Another object of the present invention is to provide a photosensitive resin varnish comprising the above-described photosensitive resin composition and a solvent.

[0024] Another objective of this invention is to provide a photosensitive resin curing film, which is obtained by coating a substrate with the aforementioned photosensitive resin varnish, and then pre-baking and exposing the substrate.

[0025] Another objective of this invention is to provide a color filter obtained by developing and baking the above-described photosensitive resin cured film.

[0026] In a preferred embodiment, the baking temperature is 85-250°C.

[0027] Compared with the prior art, the beneficial effects of the present invention include, but are not limited to:

[0028] The photosensitive resin composition provided by the present invention combines a thiol monomer compound containing multiple thiol groups with monomers and resins, which can meet the requirements for cross-linking under low temperature conditions, meet the chemical properties required for EL or flexible non-glass substrate displays, and avoid the defects of degassing. Detailed Implementation

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] The present invention provides a photosensitive resin composition with high photosensitivity, which solves the problems of chemical resistance and degassing under low-temperature crosslinking reaction conditions in the prior art.

[0031] Specifically, in the embodiments of the present invention, based on 100% of the total weight, the components include the following by weight percentage: monomer compound A 10-50%, polymer B 10-50%, thiol monomer compound C 0.01-2%, initiator D 0.1-30%, colorant E 20-30%, binder F 0.1-5%, and surfactant G 0.01-1%.

[0032] Among them: the monomeric compound A has the general structural formula of formula (1):

[0033]

[0034] In formula (1), W is selected from hydrogen atoms or methyl groups, X is selected from carbon or hydrogen atoms, Y is selected from thiophene or tetrahydrofuran, and Z is selected from hydrogen atoms, single carbon bonds, ether groups, ester groups, lactone groups with 1 to 12 carbon atoms, carbonate groups, amide groups, carbamate groups, and alkyl, alkene, or alkynyl groups with 2 to 20 carbon atoms of different structures, such as linear or branched forms; monomer compound A belongs to free radical polymerizable compounds, such as compounds containing vinyl unsaturated bond groups. Groups containing vinyl unsaturated bonds, such as vinyl, (meth)allyl, (meth)acryloyl, etc. Polymerizable monomer compounds can be in any chemical form, such as monomers, prepolymers, and oligomers. The molecular weight of polymerizable monomer compounds is usually 100 to 3000.

[0035] Polymer B: The polymer contains several repeating units of polyacrylic acid, and the repeating units contain thiophene and / or tetrahydrofuran functional groups. The molar ratio of repeating units containing thiophene or tetrahydrofuran functional groups to all repeating units is greater than 20%.

[0036] Thiol monomer compound C: includes at least four thiol functional groups, that is, compounds with four thiol groups at the end.

[0037] Initiator D: For compounds sensitive to light from the ultraviolet to the visible region, select common photoradical polymerization initiators. Examples include, but are not limited to, haloalkanes (e.g., compounds with a triazole skeleton, compounds with a diazole skeleton, compounds with an imidazole skeleton, etc.), phosphine compounds and hexaarylbisimidazoles, oxime compounds, organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, α-amino ketone compounds, etc.

[0038] Colorant E: An organic molecular colored pigment or dye, comprising 20-30% or more parts by weight of the non-volatile components of the photosensitive resin composition. For pigments, see Japanese Patent Application Publication No. 2013-077009, Japanese Patent Application Publication No. 2014-130338, and International Publication No. 2015 / 166779, etc. At least one of the following: diammonium compounds, squaric acid monium salts, anthocyanin compounds, phthalocyanine compounds, naphthyl phthalocyanine compounds, tetrachlorobenzene compounds, ammonium compounds, ammonium compounds, azo compounds, anthraquinone compounds, porphyrin compounds, pyrrolopyrrole compounds, oxacyanine compounds, ketone compounds, hexaporin compounds, metal dithiols, copper compounds, tungsten compounds, and metal borides. Colored dyes include pyrazole azo compounds, aniline azo compounds, triarylmethyl alkyl compounds, anthraquinone compounds, anthraquinone compounds, benzyl compounds, oxacyanine compounds, pyrazolotriazole azo compounds, pyridone azo compounds, anthocyanin compounds, phenanthrene compounds, pyrrolopyrazole azomethine compounds, phthalocyanine compounds, benzopiperanone compounds, indigo compounds, and pyrrole methylene compounds.

[0039] The red pigment contains CIPigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, and 15. 0, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 270, 272, 279, 291, 294, 295, 296, 297, etc. Green pigments include CIPigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, 66, etc. Purple pigment contains CIPigmentViolet 1, 19, 23, 27, 32, 37, 42, 60:6, etc. Blue pigment contains CIPigmentBlue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, 88, etc. Yellow pigment contains (CI)PigmentYellow. 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 12 5, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236, etc.

[0040] Adhesive F: A component used to improve the adhesion between the film-forming object, such as a substrate, and the infrared shielding film. Adhesive aids are particularly useful for improving the adhesion between inorganic substrates and infrared shielding films. Functional silane coupling agents are generally chosen as adhesive aids. Silane coupling agents refer to silane compounds having hydrolyzable groups and other functional groups. Furthermore, hydrolyzable groups refer to substituents that directly bond with silicon atoms and form siloxane bonds through at least one of hydrolysis and condensation reactions. Examples of hydrolyzable groups include halogen atoms, alkoxy groups, acyloxy groups, etc., with alkoxy groups being preferred. Examples of functional groups other than hydrolyzable groups include vinyl, (meth)allyl, (meth)acrylic, mercapto, epoxy, oxetyl, amino, and urea groups. Among these, amino, (meth)acryloyl, and epoxy groups are preferred, and one or more of the above components may be selected.

[0041] Surfactant G: Selectable surfactants include fluorinated surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, polysiloxane surfactants, etc., or as described in International Publication No. 2015 / 166779, paragraphs 0238-0245 and International Publication No. 2016 / 158818, paragraphs 0166-0167. The recommended fluorine content in fluorinated surfactants is 7-25 parts by weight. Fluorinated surfactants with fluorine content ratios within this range are effective in terms of coating thickness uniformity and liquid-saving properties, and also exhibit good solubility in the composition.

[0042] In existing photosensitive resin compositions, free radicals are generated after photoreaction. Due to the high energy required for cross-linking of the functional groups in the composition, cross-linking is difficult to complete at lower temperatures. Incompletely cross-linked materials at low temperatures, when coated into color filter films, easily result in sublimation and degassing of decomposed or unreacted molecules. This invention combines a thiol compound C containing four or more functional groups with monomer compound A and polymer B for cross-linking, effectively reducing the energy required for the cross-linking reaction and significantly increasing the degree of cross-linking, thereby improving the density and hardness of the resulting material. Specifically, monomer compound A, containing thiophene or tetrahydrofuran functional groups, reacts with photoexcited initiator D free radicals. Due to its high electron density donation capability, it enhances the polymerization ability of the acrylate double bonds on the other side with the free radicals. Meanwhile, the thiol monomer compound C provided by this invention readily forms covalent bonds with the free radical of initiator D or the free radical of the monomer compound after the initiator-induced reaction, thereby reducing the chemical activation energy of the crosslinking reaction of the resin composition. The monomer repeating unit of polymer B contains thiophene and / or tetrahydrofuran functional groups, and its structural and chemical properties are similar to those of monomer compound A, which can increase the polar compatibility of polymer B and the aforementioned monomer compound A, providing the required mixing uniformity, mechanical properties and effective adhesion to the substrate of the overall resin composition. The interaction of the above resin composition components solves the technical problem of this invention.

[0043] In a preferred embodiment, the monomer compound A in the above-mentioned photosensitive resin composition may be selected from at least one of the structures of formulas (2) and (3):

[0044]

[0045] In a preferred embodiment, the average molecular weight (Mw) of the total polymer B in the above-described photosensitive resin composition is preferably between 2,000 and 100,000. The upper limit is preferably 50,000 or less, more preferably 30,000 or less, and the lower limit is preferably 3,000 or more, further preferably 4,000 or more, thus further improving pattern developability. The resin used in this invention may contain acid groups. Examples of acid groups include carboxyl groups, phosphate groups, sulfonyl groups, and phenolic hydroxyl groups. These acid groups may be only one type or two or more types combined. Resins containing acid groups can also be used as alkali-soluble resins. The acid value of the resin containing acid groups is preferably 30-300 mg KOH / g, more preferably 180 mg KOH / g or less, and most preferably 120 mg KOH / g or less. The lower limit is more preferably 50 mg KOH / g or more, and further preferably 80 mg KOH / g or more.

[0046] In a preferred embodiment, the thiol monomer compound C in the above-mentioned photosensitive resin composition is selected from at least one of the structures of formulas (4-1) and (4-2):

[0047]

[0048]

[0049] The thiol monomer compounds with the above-mentioned structure can be purchased from Mitsubishi Chemical Corporation or obtained according to the patent document CN109073972A.

[0050] In a preferred embodiment, the polymer comprises repeating units containing at least one unsaturated acrylate carbon-carbon double bond as an end; more preferably, the repeating units in the polymer comprise at least one structure of formulas (5) to (9), and at least one structure of formulas (10) to (11):

[0051] Here, as a common identifier in the field, p, q, r, s, t, u, and w represent the degree of aggregation of a single repeating unit.

[0052] In another embodiment of the present invention, a photosensitive resin varnish is provided, comprising the above-described resin composition and the necessary solvent H.

[0053] The organic solvent H can be a compound listed in Japanese Patent Application Publication No. 2011-232632 or at least one compound from the following group. A composition containing 500 parts by weight or less of organic solvent per 100 parts by weight of the photosensitive resin composition is preferred, because an appropriate proportion of solvent can reduce the viscosity of the photosensitive resin composition, but an excessive proportion will make it difficult to control the film thickness.

[0054] In another embodiment of the present invention, a method for forming a cured film comprising the above-described photosensitive resin composition and a filter is provided:

[0055] The photosensitive resin composition made of the above materials is coated on the substrate, and then exposed using a photomask and a radiation light source. Before development, it is heated or baked again to obtain a cured film. Then, development and subsequent baking are performed to promote the curing reaction of the polymer, thus obtaining the filter.

[0056] As an embodiment of the present invention, the method for preparing the cured film or filter is specifically as follows:

[0057] The photosensitive resin composition of the present invention can be applied to substrates (Si, SiO2, SiN, TiN, WSi, BPSG, SOG, organic antireflective films, etc.) or treated layers on substrates (Cr, CrO, CrON, MoSi, SiO2, etc.) using suitable coating methods, such as spin coating, roller coating, flow coating, dip coating, spray coating, and blade coating, to obtain a coating with a film thickness of 0.1 to 10.0 μm. Next, pre-baking is performed. The pre-baking conditions depend on the type and mixing ratio of each component, but are typically performed on a hot plate at 60-150°C for 10 seconds to 30 minutes, or preferably at 80-120°C for 30 seconds to 20 minutes, to remove any solvents still present in the photosensitive resin composition. Next, the target pattern is obtained by exposing a photomask with a predetermined pattern to high-energy radiation, such as visible light, ultraviolet light, far ultraviolet light, extreme ultraviolet light, electron beams (e.g., electron beams and alpha rays), electromagnetic waves (X-rays, gamma rays, and soft X-rays), excimer lasers, or synchrotron radiation. The exposure device can be a mirror projection aligner, stepper, scanner, proximity sensor, contact sensor, microlens array, lens scanner, laser exposure, or other types of exposure equipment. Alternatively, exposure using super-resolution techniques can be performed, such as multiple exposures, phase-transfer shielding, or annular illumination. Using this super-resolution technique, even finer patterns can be formed. Regarding the wavelength and energy of the light source, the optimal exposure conditions are: a wavelength in the range of 190 nm to 450 nm, and an exposure dose of approximately 10 to 300 mJ / cm². 2 The preferred value is 100 to 200 mJ / cm. 2 .

[0058] Next, a quaternary ammonium salt or other alkaline aqueous solution developer, such as tetramethylammonium hydroxide (TMAH), choline hydroxide, tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH), tetrabutylammonium hydroxide (TBAH), benzyltrimethylammonium hydroxide, benzyltriethylammonium hydroxide, etc., or preferably alkali metal hydroxides such as lithium hydroxide, sodium hydroxide, potassium hydroxide, etc.; alkali metal carbonates such as sodium carbonate, potassium carbonate, cesium carbonate, etc.; and alkali metal bicarbonates such as sodium bicarbonate, potassium bicarbonate, etc., are used at a weight percentage of 0.1% to 5%, preferably 2% to 3%. The developer is then rinsed for 3 seconds to 3 minutes, preferably 5 seconds to 2 minutes, using conventional methods such as liquid filling, immersion, shaking immersion, and spraying, to dissolve the exposed layer in the developer solution while leaving the unexposed areas undissolved and preventing the substrate from dissolving. Following the development process, for example, after washing with ultrapure water for 30 seconds or longer and 90 seconds or less, the desired pattern can be formed by air drying, for example, using compressed air or compressed nitrogen. This process can form negative patterns.

[0059] Organic solvents can also be used as developing solutions, including 2-octanone, 2-nonanone, 2-heptanone, 3-heptanone, 4-heptanone, 2-hexanone, 3-hexanone, diisobutyl ketone and methylcyclohexanone, acetophenone, methyl acetophenone, propyl acetate, butyl acetate, isobutyl acetate, amyl acetate, butyl acetate, isoamyl acetate, propyl formate, butyl formate, isopropyl formate, butyl formate, amyl formate, methyl valerate, methyl pentenoate, methyl crotonate. Esters, ethyl crotonate, methyl propionate, ethyl propionate, ethyl 3-ethoxypropionate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, isobutyl lactate, amyl lactate, isoamyl lactate, methyl 2-hydroxyisobutyrate, ethyl 2-hydroxyisobutyrate, methyl benzoate, ethyl benzoate, phenyl acetate, benzyl acetate, methyl acetate, benzyl formate, ethyl formate, methyl 3-phenylpropionate, benzyl propionate, ethyl acetate, 2-phenylethyl acetate, etc. These solvents can be used alone or in combination of two or more.

[0060] After development, the rinsing should be performed using a solvent that is miscible with the developer but does not dissolve the cured film. Such solvents are preferably alcohols with 3 to 10 carbons, ether compounds with 8 to 12 carbons, alkanes, alkenes, alkynes, or aromatic solvents with 6 to 12 carbons.

[0061] Finally, the cured film after heating and developing is further cured by heating the patterned film using a heating device (such as a hot plate or oven), which promotes the curing reaction of the polymer. For example, the heating temperature can be above 85°C or below 250°C, and the heating time depends on the type of heating equipment; for example, a hot plate can be set to 5 to 30 minutes, while an oven can be set to 30 to 90 minutes.

[0062] The following examples and comparative examples illustrate the composition of each photosensitive resin. The physical properties of each example and comparative example were tested after being cured into a film in the experimental examples to verify the effectiveness of the present invention.

[0063] Table 1: Composition of photosensitive resins in the examples and comparative examples

[0064]

[0065]

[0066] In Table 1 above: the structure of free radical polymerizable monomer compound A1 is formula (2), and the structure of A2 is formula (3). Compounds of formula (2) and formula (3) are commercially available products, such as Sartome SR203; the Red, Green and Blue colorants E are respectively represented as red pigment 254 (CIPigment Red 254), green pigment G36 (CIPigment Green 36) and blue pigment 15:6 (CIPigment Blue). 15:6); Polymers B1, B2, B3 and B4 are selected from combinations of compounds with structures of formula (5) to formula (11). B1 is composed of formulas (5) to (10) in a molar ratio of 2:1:1:1:2:3. B2 is composed of formulas (5) to (9) and formula (11) in a molar ratio of 2:1:1:1:3:2. B3 is composed of formulas (5) to (11) in a molar ratio of 2:1:1:1:2:2:1. B4 is composed of formulas (5) to (9) in a molar ratio of 2:1:2:2:3 (excluding repeating units with thiophene or tetrahydrofuran functional groups). (All functional repeating units are commercially available or obtained by polymeric acrylate synthesis methods). The molecular weight (Mw) of the above polymers B1, B2, B3 and B4 resins is between 15,000 and 16,000 g / mol. Thiol monomers C1 and C2 are shown in formulas (4-1) and (4-2), respectively; the structure of BASF PAG103 is shown in formula (12):

[0067]

[0068] In each embodiment and comparative example, the numbers in parentheses indicate the proportion of each component material in the total non-solvent components of the overall formulation. The solvent used is five times the mass of the non-volatile component.

[0069] Experimental Example

[0070] Table 2 shows the evaluation results of the physical properties of the above embodiments and comparative examples. The chemical resistance test and degassing characteristics mentioned in the background section will be based on the N-methylpyrrolidone (NMP) immersion test in Table 2. The NMP immersion test involves immersing the cured film in unheated NMP solvent for 30 minutes, measuring the change in optical colorimetry (CIE.1976Wxy) before and after the test, calculating the deltaEab parameter, and then evaluating it according to the following standards. The degassing characteristics were analyzed using a thermal desorption atmospheric pressure free mass spectrometer (TDS-APIMS) to determine the concentration of desorbed gases, and were also evaluated according to the following standards.

[0071] The evaluation criteria are as follows:

[0072] 3: deltaEab < 3.0;

[0073] 2:3.0 < deltaEab < 5.0;

[0074] 1:5.0 < deltaEab < 10.0.

[0075] A: Outgassing concentration less than 100 ppm;

[0076] B: Outgassing concentration is between 100 and 500 ppm;

[0077] C: Outgassing concentration greater than 500 ppm.

[0078] Table 2: Performance Test Results

[0079]

[0080]

[0081] Combining the photosensitive resin composition of the examples and comparative examples in Table 1 and the performance test results in Table 2, it is easy to see that Examples 1-7 not only meet the requirement of completing the crosslinking reaction at low temperature, but also effectively solve the problems of chemical resistance and degassing. In Comparative Example 1, the repeated units with thiophene or tetrahydrofuran functional groups were not used, and the problems of chemical resistance and degassing were still not solved; in Comparative Example 2, when the free radical polymerizable monomer compound of formula (2) or (3) was not used, the performance was also poor; similarly, the performance of Comparative Examples 3-5 was even worse.

[0082] Finally, it should be noted that although the present invention has been described in detail above with general descriptions and specific embodiments, the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A photosensitive resin composition, characterized by comprising: The composition comprises the following components by weight: monomer compound 10-50%, polymer 10-50%, thiol monomer compound 0.01-2%, initiator 0.1-30%, colorant 20-30%, adhesive 0.1-5%, surfactant 0.01-1%; The monomer compound has a general structure of formula (1): ， Wherein, W is selected from hydrogen atom or methyl, X is selected from carbon, Y is selected from thiophene group or tetrahydrofuran group, and Z is selected from hydrogen atom; The polymer contains a plurality of polyacrylic repeating units, and the repeating units contain thiophene and / or tetrahydrofuran functional groups, and the molar proportion of the repeating units containing thiophene or tetrahydrofuran functional groups is greater than 20%; The thiol monomer compound contains at least four mercapto functional groups, and is selected from at least one of the structures of formula (4-1) and (4-2): 、 。 2. The photosensitive resin composition according to claim 1, characterized by The monomer compound is selected from at least one of the structures of formula (2) and (3): 、 。 3. The photosensitive resin composition according to claim 1, characterized by The polymer contains at least one unsaturated acrylic ester carbon-carbon double bond as a terminal repeating unit.

4. The photosensitive resin composition according to claim 1 or 3, characterized by The repeating units in the polymer include at least one of the structures of formula (5) to (9), and at least one of the structures of formula (10) to (11): 、 、 、 、 、 、 。 5. The photosensitive resin composition according to claim 1, characterized by The weight average molecular weight of the polymer is 2000 to 100000.

6. A photosensitive resin varnish, characterized by The application relates to a photosensitive resin composition and a solvent.

7. A photosensitive resin cured film, characterized by The application relates to a photosensitive resin varnish.

8. A color filter characterized by The application relates to a photosensitive resin cured film.

9. The color filter according to claim 8, wherein The baking temperature is 85-250 DEG C.

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