Laser processing device

Abstract

The laser processing apparatus of the present application is a laser processing apparatus for forming a modified region along a line in an object provided with a plurality of lines extending along a first direction and arranged along a second direction intersecting the first direction, by irradiating laser light along the line, and includes: a support portion for supporting the object; a first laser processing head and a second laser processing head for irradiating the laser light to the object supported by the support portion; a first moving mechanism for moving the first laser processing head and the second laser processing head along the first direction and the second direction, respectively; and a control portion for controlling at least the irradiation of the laser light from the first laser processing head and the second laser processing head and the movement of the first laser processing head and the second laser processing head by the first moving mechanism.

Description

Technical Field

[0001] This invention relates to a laser processing apparatus. Background Technology

[0002] Patent Document 1 describes a laser processing apparatus comprising: a holding mechanism for holding a workpiece; and a laser irradiation mechanism for irradiating the workpiece held in the holding mechanism with a laser. In the laser processing apparatus described in Patent Document 1, the laser irradiation mechanism with a condenser lens is fixed to a base, and the movement of the workpiece along a direction perpendicular to the optical axis of the condenser lens is carried out by the holding mechanism.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 5456510 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] However, for laser processing apparatuses like those described above, increased efficiency is desired. To improve efficiency, for example, increasing the workpiece's movement speed via the holding mechanism is considered. However, even with increased workpiece movement speed, the acceleration time required for the workpiece to reach the target speed increases. Therefore, increasing the workpiece's movement speed alone is insufficient to achieve a significant improvement in efficiency.

[0008] As a result of the inventor's in-depth research into this problem, the following insight was obtained: Efficiency can be improved by allowing two laser processing heads, which can move independently of each other, to operate simultaneously at least for a portion of the time. In this case, it is considered that the laser processing head should be moved along a predetermined processing line set on the workpiece to irradiate the laser. However, this situation presents new problems as follows.

[0009] In other words, when there is only one laser processing head, the movement trajectory (movement line) of that laser processing head can be aligned by rotating the support portion of the object being supported. However, when there are two laser processing heads, and the movement lines of each head are not parallel, if the support portion of the object being supported is rotated to align its movement line with that of one laser processing head, the movement line of the other laser processing head will deviate from that line. This misalignment raises concerns about a potential reduction in processing quality.

[0010] Here, one aspect of the present invention is to provide a laser processing apparatus that can improve efficiency and suppress the reduction of processing quality.

[0011] Technical means to solve the problem

[0012] The laser processing apparatus of the present invention is used to irradiate an object having multiple lines extending along a first direction and arranged along a second direction intersecting the first direction with laser light, thereby forming a modified region on the object along the lines. The apparatus is characterized by comprising: a support for supporting the object; a first laser processing head and a second laser processing head for irradiating the object supported by the support with laser light; a first moving mechanism for moving the first laser processing head and the second laser processing head along the first direction and the second direction, respectively; and a control unit for controlling at least the irradiation of the first laser processing head and the second laser processing head by the first moving mechanism. The first moving mechanism includes: a first moving part extending along the first direction and on which the first laser processing head is mounted, for moving the first laser processing head along the first direction; a second moving part extending along the first direction and on which the first laser processing head is mounted, for moving the first laser processing head along the first direction; and a second moving part extending along the first direction. A first laser processing head extends in a first direction and is mounted thereon for moving the second laser processing head along the first direction; and a third moving part extends in a second direction and is mounted thereon with the first and second moving parts for moving the first and second moving parts along the second direction respectively. A control unit performs: an acquisition process, which acquires the offset of the second moving line from the reference line along the first direction in the second direction, the second moving line representing the movement of the second laser processing head along the first direction by the second moving part; and an irradiation process, which, after the acquisition process, controls the second moving part to move the second laser processing head along the first direction while at least laser is output from the second laser processing head, thereby irradiating the object with laser along the line. In the irradiation process, the control unit moves the second laser processing head in the second direction by the amount of offset controlled by the third moving part, and moves the second laser processing head in the first direction controlled by the second moving part.

[0013] This laser processing apparatus has two laser processing heads (a first laser processing head and a second laser processing head) for irradiating a workpiece with a laser. Furthermore, the first and second laser processing heads can move along a first direction extending from a line set on the workpiece via a first moving part and a second moving part of a first moving mechanism. Therefore, the first and second laser processing heads can operate simultaneously at least for a portion of the time, thereby improving efficiency.

[0014] Furthermore, in this laser processing apparatus, the control unit performs an acquisition process that acquires the offset of the second movement line from the reference line along the first direction in the second direction. This second movement line is the movement line of the second laser processing head along the first direction, executed by the second movement unit. The line set on the object is along the first direction. Thus, the offset of the second movement line from the reference line acquired here is equivalent to the offset of the distance line during irradiation. Moreover, during irradiation, the second laser processing head moves in the second direction and then in the first direction by this offset. Therefore, even if the line set on the object coincides with the movement line of the first laser processing head, it is possible to prevent the second movement line of the second laser processing head from deviating from that line, thereby suppressing a decrease in processing quality.

[0015] According to one aspect of the present invention, the laser processing apparatus, including the control unit, can also perform the following processing steps: a first forming process, in which, while the sample for offset acquisition is supported by a support unit, a laser is output from a first laser processing head, and the first laser processing head is moved along a first direction under the control of a first moving unit, thereby irradiating the sample with laser along the first direction, and forming a first moving line, i.e., a first processing line, representing the movement of the first laser processing head along the first direction, on the sample by laser processing marks; a second forming process, in which, while the sample is supported by a support unit, a laser is output from a second laser processing head, and the second laser processing head is moved along the first direction under the control of a second moving unit, thereby irradiating the sample with laser along the first direction, and forming a second moving line, i.e., a second processing line, on the sample by laser processing marks; and an offset acquisition process, in which an offset amount with the first processing line as a reference line is obtained based on a comparison between the first processing line and the second processing line. As described above, if the first and second processing lines formed by the actual processed sample are used as the first and second moving lines for calculating the offset, the offset can be calculated with higher accuracy.

[0016] One aspect of the laser processing apparatus of the present invention may further include a second moving mechanism for moving the support portion along a first direction and rotating the support portion about a rotation axis along a third direction intersecting the first and second directions. Before irradiation, the control unit, under the control of the second moving mechanism, performs alignment processing to align the support portion with the first moving line. During irradiation, while laser light is being output from the first and second laser processing heads, the control unit, under the control of the second moving mechanism, moves the support portion along the first direction, and under the control of the first and second moving units, moves the first and second laser processing heads along the first direction in the opposite direction to the support portion, thereby irradiating the object with laser light along the line. As described above, if both the support portion supporting the object and the laser processing head are moved, the speed at which the laser focuses on the object increases, and the processing speed increases.

[0017] Furthermore, in this situation, the movement speed of the target at the focusing point is shared by the support and the laser processing head. Therefore, compared to the case where only the support or the laser processing head moves, their respective movement speeds can be suppressed. As a result, the time and distance required for acceleration and deceleration of the support and the laser processing head can be reduced.

[0018] Here, the weight of the laser processing head is generally lighter than that of the support. Therefore, when moving the focusing point at the target moving speed, it is considered that the laser processing head should move faster than the support (i.e., the speed load on the laser processing head is relatively large).

[0019] In this regard, one aspect of the laser processing apparatus of the present invention may also include connecting optical fibers for guiding laser light output from a light source to the first and second laser processing heads. During irradiation processing, the control unit ensures that the speed of the first and second laser processing heads along the first direction is lower than the speed of the support unit along the first direction. As described above, when optical fibers for guiding laser light from the light source to the laser processing heads are connected, regardless of the weight relationship between the laser processing heads and the support unit, the laser processing heads are relatively slower (i.e., the speed burden on the laser processing heads is relatively smaller), thereby protecting the optical fibers.

[0020] In one aspect of the laser processing apparatus of the present invention, the first moving mechanism may also include a pair of third moving parts arranged opposite to each other in a first direction, with the first and second moving parts mounted on and supported by the pair of third moving parts. In this case, each of the first and second laser processing heads can be reliably supported.

[0021] Here, a laser processing apparatus according to one aspect of the present invention is used to irradiate an object with multiple lines extending along a first direction and arranged along a second direction intersecting the first direction, thereby forming a modified region on the object along the lines. The laser processing apparatus includes: a support for supporting the object; a first laser processing head and a second laser processing head for irradiating the object supported by the support with laser; an input receiving unit for displaying information and receiving input; and a control unit for controlling the input receiving unit. The control unit performs display processing and displays information for receiving input on the input receiving unit. The input is made by independently setting at least a portion of the processing conditions of the object from the laser from the first laser processing head and the processing conditions of the object from the laser from the second laser processing head.

[0022] This laser processing apparatus has two laser processing heads (a first laser processing head and a second laser processing head) for irradiating an object with a laser. Therefore, at least for a portion of the time, the first laser processing head and the second laser processing head operate simultaneously, thereby improving efficiency.

[0023] Furthermore, in this laser processing apparatus, the control unit displays information for receiving input at the input receiving unit. This input involves independently setting at least a portion of the processing conditions for the object from the laser from the first laser processing head and the processing conditions for the object from the laser from the second laser processing head. Thus, by setting the processing conditions for the first and second laser processing heads in a manner that the processing quality of laser processing on the object by both the first and second laser processing heads does not differ (due to mechanical errors in the laser processing heads), a decrease in processing quality can be suppressed.

[0024] In one aspect of the laser processing apparatus of the present invention, the control unit can also display information for receiving a correction amount on the input receiving unit during display processing. This correction amount is the correction amount by which the processing conditions of the second laser processing head deviate from the reference when the processing conditions of the first laser processing head are used as a reference. In this case, it becomes easier to input information for suppressing mechanical errors of the laser processing head.

[0025] A laser processing apparatus according to one aspect of the present invention may further include a first moving mechanism for moving a first laser processing head and a second laser processing head respectively along a first direction and a second direction, and a control unit for controlling the movement of the first laser processing head and the second laser processing head by the first moving mechanism. The first moving mechanism comprises: a first moving part extending along the first direction and mounting the first laser processing head thereon for moving the first laser processing head along the first direction; and a second moving part extending along the first direction and mounting the second laser processing head... The system includes a head for moving a second laser processing head along a first direction; and a third moving part extending along a second direction and equipped with the first and second moving parts, for moving each of the first and second moving parts along the second direction. A control unit, in display processing, displays information received regarding a correction amount for an offset on an input receiving unit. This offset amount represents the offset of a second movement line, representing the movement of the second laser processing head along the first direction by the second moving part, from a reference line along the first direction in the second direction. As described above, this offset amount can be used as an example of a correction amount for the mechanical error of the laser processing head.

[0026] The effects of the invention

[0027] According to the present invention, a laser processing apparatus can be provided that can improve efficiency and suppress the reduction of processing quality. Attached Figure Description

[0028] [ Figure 1 ] Figure 1 This is a top view of a laser processing apparatus according to one embodiment.

[0029] [ Figure 2 ] Figure 2 yes Figure 1 A side view of a portion of the laser processing apparatus shown.

[0030] [ Figure 3 ] Figure 3 yes Figure 1 The front view of the laser processing head of the laser processing device shown.

[0031] [ Figure 4 ] Figure 4 yes Figure 3 The image shows a side view of the laser processing head.

[0032] [ Figure 5 ] Figure 5 yes Figure 3 The diagram shows the construction of the optical system of the laser processing head.

[0033] [ Figure 6 ] Figure 6 This is a structural diagram of the optical system of a modified laser processing head.

[0034] [ Figure 7 ] Figure 7 This is a structural diagram of the optical system of a modified laser processing head.

[0035] [ Figure 8 ] Figure 8 This is a schematic top view illustrating the operation of the laser processing device.

[0036] [ Figure 9 ] Figure 9 This is a schematic top view illustrating the operation of the laser processing device.

[0037] [ Figure 10 ] Figure 10 This is a schematic top view illustrating the operation of the laser processing device.

[0038] [ Figure 11 ] Figure 11 This is a schematic top view used to illustrate eccentricity correction.

[0039] [ Figure 12 ] Figure 12 This is a schematic top view used to illustrate eccentricity correction.

[0040] [ Figure 13 ] Figure 13 This is a schematic top view used to illustrate eccentricity correction.

[0041] [ Figure 14 ] Figure 14 This is a schematic top view used to illustrate eccentricity correction.

[0042] [ Figure 15 ] Figure 15 This is a schematic top view used to illustrate eccentricity correction.

[0043] [ Figure 16 ] Figure 16 This is a schematic top view used to illustrate a variation of the eccentricity correction.

[0044] [ Figure 17 ] Figure 17 This is a diagram showing the processing results when processing is performed under the same conditions using two laser processing heads.

[0045] [ Figure 18 ] Figure 18 This is a diagram showing the processing results when processing is performed under the same conditions using two laser processing heads.

[0046] [ Figure 19 ] Figure 19 This is a table that represents specific examples of processing conditions.

[0047] [ Figure 20 ] Figure 20This is a diagram showing an example of the input screen displayed by the input receiving unit.

[0048] [ Figure 21 ] Figure 21 This is a diagram illustrating an example of information used to receive correction inputs.

[0049] [ Figure 22 ] Figure 22 This is a diagram illustrating an example of information used to receive correction inputs.

[0050] [ Figure 23 ] Figure 23 This is a table showing the processing conditions before and after mechanical error correction.

[0051] [ Figure 24 ] Figure 24 It is a cross-sectional photograph showing the actual processing result after mechanical error correction. Detailed Implementation

[0052] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the various figures, the same or equivalent parts will be given the same symbols, and repeated descriptions will be omitted. Furthermore, in the various figures, there are cases where an orthogonal coordinate system defined by the X-axis, Y-axis, and Z-axis is shown. The X-direction is an example of a first direction, a first horizontal direction. The Y-direction is an example of a second direction intersecting the first direction, a second horizontal direction. The Z-direction is an example of a third direction intersecting both the first and second directions, a vertical direction.

[0053] [Structure of laser processing equipment]

[0054] like Figure 1 and Figure 2 As shown, the laser processing apparatus 1 includes: a moving mechanism 5 (second moving mechanism), a moving mechanism 6 (first moving mechanism), a support 7, a light source unit 8, a control unit 9, a laser processing head 10A (first laser processing head), a laser processing head 10B (second laser processing head), and a pair of cameras AC.

[0055] The moving mechanism 5 includes a fixed part 51, a moving part 53, and a mounting part 55. The fixed part 51 is mounted on the device frame 1a. The moving part 53 is mounted on a track provided on the fixed part 51 and can move along the Y direction. The mounting part 55 is mounted on a track provided on the moving part 53 and can move along the X direction. The support part 7 is mounted on a rotation axis provided on the mounting part 55 and can rotate about an axis parallel to the Z direction. That is, the moving mechanism 5 has the function of moving the support part 7 along the X and Y directions and rotating about an axis along the Z direction.

[0056] The moving mechanism 6 includes: a Y-axis moving part (third moving part) 61; an X-axis moving part (first moving part) 62A; an X-axis moving part (second moving part) 62B; Z-axis moving parts 63 and 64; and mounting parts 65, 66, 67A, and 67B. A pair of Y-axis moving parts 61 are arranged opposite to each other in the X direction and extend along the Y direction (generally parallel). The X-axis moving part 62A extends along the X direction and is mounted at both ends in the X direction to a track provided on the Y-axis moving part 61 via the mounting parts 67A. That is, the X-axis moving part 62A is supported by a pair of Y-axis moving parts 61. Therefore, the X-axis moving part 62A can move along the Y direction via the Y-axis moving parts 61. In other words, the Y-axis moving part 61 has the function of moving the X-axis moving part 62A in the Y direction.

[0057] The Z-axis moving part 63 extends along the Z direction and is mounted on a track provided on the X-axis moving part 62A. Thus, the Z-axis moving part 63 can move along the X direction via the X-axis moving part 62A. A laser processing head 10A is mounted on the Z-axis moving part 63 via a mounting part 65. Therefore, the X-axis moving part 62A has the function of moving the entire Z-axis moving part 63 together with the laser processing head 10A along the X direction. The laser processing head 10A is mounted on a track provided on the Z-axis moving part 63 via the mounting part 65. Thus, the laser processing head 10A can move along the Z direction via the Z-axis moving part 63. That is, the Z-axis moving part 63 has the function of moving the laser processing head 10A along the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10A so that it can move three-dimensionally along the X, Y, and Z directions.

[0058] The X-axis moving part 62B extends along the X direction and is mounted on a track provided on the Y-axis moving part 61 via mounting parts 67B at both ends in the X direction. That is, the X-axis moving part 62B is supported by a pair of Y-axis moving parts 61. Therefore, the X-axis moving part 62B can move along the Y direction via the Y-axis moving parts 61. In other words, the Y-axis moving parts 61 have the function of moving the X-axis moving part 62B in the Y direction.

[0059] The Z-axis moving part 64 extends along the Z direction and is mounted on a track provided on the X-axis moving part 62B. Thus, the Z-axis moving part 64 can move along the X direction via the X-axis moving part 62B. A laser processing head 10B is mounted on the Z-axis moving part 64 via a mounting part 66. Therefore, the X-axis moving part 62B has the function of moving the entire Z-axis moving part 64 together with the laser processing head 10B along the X direction. The laser processing head 10B is mounted on a track provided on the Z-axis moving part 64 via the mounting part 66. Thus, the laser processing head 10B can move along the Z direction via the Z-axis moving part 64. That is, the Z-axis moving part 64 has the function of moving the laser processing head 10A along the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10B so that it can move three-dimensionally along the X, Y, and Z directions.

[0060] As described above, the support part 7 is mounted on the rotation axis of the mounting part 55 provided in the moving mechanism 5, and can rotate about an axis parallel to the Z direction as its center line. That is, the support part 7 can move along the X and Y directions respectively, and can rotate about an axis parallel to the Z direction as its center line. The support part 7 is used to support the object 100 along the X and Y directions. The object 100 is, for example, a wafer.

[0061] When the laser processing head 10A is facing the support portion 7 in the Z direction, it irradiates the object 100 supported on the support portion 7 with laser L1. When the laser processing head 10B is facing the support portion 7 in the Z direction, it irradiates the object 100 supported on the support portion 7 with laser L2.

[0062] A pair of cameras AC, each with a different magnification, capture images of the object 100 supported on the support 7 in the Z direction, opposite to each other. For example, the cameras AC are mounted on the Z-axis moving part 63 via the mounting part 65, together with the laser processing head 10A. The cameras AC can, for example, use light transmitted through the object 100 to capture images of the device pattern, modified areas, and the formation of cracks extending from the modified areas of the object 100. The images obtained by the cameras AC are then used, for example, to align the irradiation positions of lasers L1 and L2 on the object 100 and to adjust the irradiation conditions of lasers L1 and L2.

[0063] The light source unit 8 has a pair of light sources 81 and 82. Light source 81 outputs laser L1. Laser L1 is emitted from the emission section 81a of light source 81 and guided to laser processing head 10A via optical fiber 2. That is, optical fiber 2 for guiding the laser L1 output from light source 81 is connected to laser processing head 10A. Light source 82 outputs laser L2. Laser L2 is emitted from the emission section 82a of light source 82 and guided to laser processing head 10B via other optical fibers 2. That is, optical fiber 2 for guiding the laser L2 output from light source 82 is connected to laser processing head 10B.

[0064] The control unit 9 controls various parts of the laser processing apparatus 1 (multiple moving mechanisms 5, 6, laser processing heads 10A, 10B, camera AC, and light source unit 8, etc.). The control unit 9 includes a processing unit 91, a storage unit 92, and a receiving input unit 93. The processing unit 91 is a computer device configured to include a processor, memory, storage unit, and communication elements. In the processing unit 91, the processor executes software (programs) loaded into memory, reads and writes data to the memory and storage unit, and controls communication through the communication elements. The storage unit 92, such as a hard disk, stores various types of data. The receiving input unit 93 is an interface unit that displays various information and receives various information input from the user. In this embodiment, the receiving input unit 93 is configured as a GUI (Graphical User Interface).

[0065] This section describes an example of processing performed using the laser processing apparatus 1 configured as described above. This example involves cutting a wafer 100 into multiple chips and forming modified regions within the wafer 100 along multiple lines arranged in a lattice pattern.

[0066] First, the moving mechanism 5 moves the support 7 along the X and Y directions respectively, so that the support 7 supporting the object 100 is opposite to the pair of laser processing heads 10A and 10B in the Z direction. Next, the moving mechanism 5 rotates the support 7 about an axis parallel to the Z direction as its center line, so that multiple lines extending in one direction on the object 100 are aligned along the X direction. Thus, multiple lines extending along the X direction and arranged along the Y direction are provided on the object 100 (e.g., ...). Figure 1 Line C is shown.

[0067] Then, the moving mechanism 6 moves the laser processing head 10A along the Y direction, so that the focusing point of laser L1 is located on a line extending in one direction. Additionally, to position the focusing point of laser L2 on another line extending in one direction, the moving mechanism 6 moves the laser processing head 10B along the Y direction. Then, the moving mechanism 6 moves the laser processing head 10A along the Z direction, so that the focusing point of laser L1 is located inside the object 100. Additionally, the moving mechanism 6 moves the laser processing head 10B along the Z direction, so that the focusing point of laser L2 is located inside the object 100.

[0068] Next, light source 81 outputs laser L1, and laser processing head 10A irradiates object 100 with laser L1; light source 82 outputs laser L2, and laser processing head 10B irradiates object 100 with laser L2. Simultaneously, moving mechanism 5 moves support 7 along the X direction, and moving mechanism 6 moves laser processing heads 10A and 10B along the X direction in the opposite direction to support 7. This causes the focusing point of laser L1 to move relative to each other along a line extending in one direction (laser L1 is scanned), and the focusing point of laser L2 to move relative to each other along other lines extending in one direction (laser L2 is scanned). Thus, the laser processing apparatus 1 forms a modified region within object 100, at least within object 100, along multiple lines extending in one direction.

[0069] Next, the moving mechanism 5 rotates the support 7 about an axis parallel to the Z direction as its centerline, causing multiple lines extending on the object 100 in another direction orthogonal to one direction to follow the X direction. Thus, on the object 100, multiple other lines (such as...) extending along the X direction and arranged along the Y direction are provided. Figure 1 Line C is shown.

[0070] Then, the moving mechanism 6 moves the laser processing head 10A along the Y direction, so that the focusing point of laser L1 is located on a line extending in the opposite direction. Additionally, to position the focusing point of laser L2 on another line extending in the opposite direction, the moving mechanism 6 moves the laser processing head 10B along the Y direction. Then, the moving mechanism 6 moves the laser processing head 10A along the Z direction, so that the focusing point of laser L1 is located inside the object 100. Additionally, the moving mechanism 6 moves the laser processing head 10B along the Z direction, so that the focusing point of laser L2 is located inside the object 100.

[0071] Next, light source 81 outputs laser L1, and laser processing head 10A irradiates object 100 with laser L1; light source 82 outputs laser L2, and laser processing head 10B irradiates object 100 with laser L2. Simultaneously, moving mechanism 5 moves support 7 along the X direction, and moving mechanism 6 moves laser processing heads 10A and 10B along the X direction in the opposite direction to support 7. This causes the focusing point of laser L1 to move relative to each other along a line extending in the opposite direction (laser L1 is scanned), and the focusing point of laser L2 to move relative to each other along other lines extending in the opposite direction (laser L2 is scanned). Thus, the laser processing apparatus 1 forms a modified region within object 100, at least within object 100, along multiple lines extending in a direction orthogonal to one direction.

[0072] Furthermore, in one example of the aforementioned processing, light source 81 outputs a transmissive laser L1 to the object 100 via, for example, pulse oscillation, and light source 82 outputs a transmissive laser L2 to the object 100 via, for example, pulse oscillation. If such laser light is focused inside the object 100, then in the portion corresponding to the laser's focal point, particularly where the laser is absorbed, a modified region is formed inside the object 100. The modified region's density, refractive index, mechanical strength, and other physical properties differ from the surrounding unmodified region. Modified regions may include, for example, melt-processed regions, cracked regions, insulation-damaged regions, and regions with refractive index changes.

[0073] When a laser output via pulse oscillation is applied to an object 100, and the laser's focusing point moves relative to the object 100 along a line set on the object 100, multiple modified particles are formed and arranged in a row along the line. Each modified particle is formed by the irradiation of a single laser pulse. A row of modified regions is a collection of multiple modified particles arranged in a row. The relative movement speed of adjacent modified particles relative to the object 100 via the laser's focusing point and the laser's repetition frequency exist even when they are connected or separated.

[0074] [Structure of laser processing head]

[0075] Next, the structure of the laser processing head will be explained in detail. For example... Figure 3 and Figure 4 As shown, the laser processing head 10A includes a frame 11, an incident section 12, a laser adjustment section 13, and a focusing section 14. The frame 11 has a first wall portion 21 and a second wall portion 22, a third wall portion 23 and a fourth wall portion 24, and a fifth wall portion 25 and a sixth wall portion 26. The first wall portion 21 and the second wall portion 22 are opposite to each other in the X direction. The third wall portion 23 and the fourth wall portion 24 are opposite to each other in the Y direction. The fifth wall portion 25 and the sixth wall portion 26 are opposite to each other in the Z direction.

[0076] The distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22. The distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26. Furthermore, the distance between the first wall portion 21 and the second wall portion 22 may be equal to or greater than the distance between the fifth wall portion 25 and the sixth wall portion 26.

[0077] In the laser processing head 10A, the first wall portion 21 is located on the opposite side of the Y-axis moving portion 61 of the moving mechanism 6, and the second wall portion 22 is located on the Y-axis moving portion 61 side. The third wall portion 23 is located on the mounting portion 65 side of the moving mechanism 6, and the fourth wall portion 24 is located on the opposite side of the mounting portion 65, i.e., on the laser processing head 10B side (see reference). Figure 2 That is, the fourth wall portion 24 is a opposing wall portion that is opposite to the frame (second frame) of the laser processing head 10B along the Y direction. The fifth wall portion 25 is located on the opposite side of the support portion 7, and the sixth wall portion 26 is located on the side of the support portion 7.

[0078] With the third wall portion 23 positioned on the mounting portion 65 side of the moving mechanism 6, the frame 11 is mounted on the mounting portion 65. Specifically, as described below, the mounting portion 65 has a base plate 65a and a mounting plate 65b. The base plate 65a is mounted on a track provided on the Z-axis moving portion 63 (see reference). Figure 2 Mounting plate 65b is erected at the end of the laser processing head 10B side of base plate 65a (see reference). Figure 2 With the frame 11 in contact with the mounting plate 65b at the third wall portion 23, bolts 28 are screwed onto the mounting plate 65b via the base 27, thereby mounting it onto the mounting portion 65. The base 27 is provided at the first wall portion 21 and the second wall portion 22 respectively. The frame 11 can be attached to and detached from the mounting portion 65.

[0079] The incident portion 12 is mounted on the fifth wall portion 25. The incident portion 12 directs laser L1 into the frame 11. The incident portion 12 is offset towards the first wall portion 21 in the X direction and towards the fourth wall portion 24 in the Y direction. That is, the distance between the incident portion 12 and the first wall portion 21 in the X direction is smaller than the distance between the incident portion 12 and the second wall portion 22 in the X direction, and the distance between the incident portion 12 and the fourth wall portion 24 in the Y direction is smaller than the distance between the incident portion 12 and the third wall portion 23 in the X direction.

[0080] The incident portion 12 is connected to the exiting end 2a of the optical fiber 2. Specifically, the incident portion 12 includes a hole 25a formed in the fifth wall portion 25. A mounting portion 25b is provided in the fifth wall portion 25. The body portion 2b of the exiting end 2a is mounted to the mounting portion 25b by bolts or the like. In this state, the front end portion 2c of the exiting end 2a is inserted into the hole 25a. Thus, the exiting end 2a of the optical fiber 2 can be attached to and detached from the incident portion 12. A cover 25c is disposed between the fifth wall portion 25 and the body portion 2b. The cover 25c covers the gap formed between the hole 25a and the front end portion 2c. As an example, in the exiting end 2a, an isolator that suppresses returning light is disposed within the body portion 2b, and a collimating lens that collimates the laser L1 is disposed within the front end portion 2c. Furthermore, the incident portion 12 may also be a connector that can be connected to the exiting end 2a of the optical fiber 2.

[0081] A laser adjustment unit 13 is disposed within a frame 11. The laser adjustment unit 13 is used to adjust the laser L1 incident from the incident section 12. Within the frame 11, the laser adjustment unit 13 is disposed on the side of the fourth wall 24, opposite to the partition wall 29. The laser adjustment unit 13 is mounted on the partition wall 29. The partition wall 29 is provided within the frame 11, dividing the area within the frame 11 into an area on the side of the third wall 23 and an area on the side of the fourth wall 24. The partition wall 29 is constituted as part of the frame 11. The various structures of the laser adjustment unit 13 are mounted on the partition wall 29 on the side of the fourth wall 24. The partition wall 29 functions as an optical base supporting the various structures of the laser adjustment unit 13.

[0082] A focusing unit 14 is mounted on the sixth wall portion 26. Specifically, the focusing unit 14 is disposed on the sixth wall portion 26 with its insertion through the hole 26a formed therein. The focusing unit 14 focuses the laser L1, which is adjusted by the laser adjustment unit 13, and emits it outward toward the frame 11. The focusing unit 14 is offset toward the second wall portion 22 (one of the wall portions) in the X direction and offset toward the fourth wall portion 24 in the Y direction. That is, when viewed from the Z direction, the focusing unit 14 is disposed toward the fourth wall portion (opposite wall portion) 24 of the frame 11. In other words, the distance between the focusing unit 14 and the second wall portion 22 in the X direction is smaller than the distance between the focusing unit 14 and the first wall portion 21 in the X direction, and the distance between the focusing unit 14 and the fourth wall portion 24 in the Y direction is smaller than the distance between the focusing unit 14 and the third wall portion 23 in the X direction.

[0083] like Figure 5As shown, the laser adjustment unit 13 includes a reflecting part (first reflecting part) 31, an attenuator 32, and an optical axis adjustment unit 33. The reflecting part 31, the attenuator 32, and the optical axis adjustment unit 33 are arranged on a first straight line A1 extending along the X direction. The reflecting part 31 is opposite to the incident part 12 in the Z direction. That is, the reflecting part 31 is opposite to the emitting end 2a of the optical fiber 2 in the Z direction. The reflecting part 31 is used to reflect the laser L1 incident from the incident part 12 toward the second wall 22 side. The reflecting part 31 is, for example, a mirror or a prism. The attenuator 32 is used to adjust the output of the laser L1 reflected by the reflecting part 31. The optical axis adjustment unit 33 reflects the laser L1 after its output is adjusted by the attenuator 32 toward the sixth wall 26 side.

[0084] The optical axis adjustment unit 33 is used to adjust the optical axis of the laser L1 incident from the incident unit 12. In this embodiment, the optical axis adjustment unit 33 includes a first steering mirror 331, a reflecting member 332, and a second steering mirror 333.

[0085] The first steering mirror 331 is disposed on the first straight line A1. The first steering mirror 331 is constituted by a reflector 331a and a base 331b. The reflector 331a is mounted on the base 331b. The base 331b is mounted on the partition wall 29. The base 331b holds the reflector 331a in a manner that allows the direction of the reflector 331a to be adjusted. The first steering mirror 331 reflects the laser L1, after its output is adjusted by the attenuator 32, toward the sixth wall 26.

[0086] The reflecting member 332 reflects the laser L1 reflected by the first turning mirror 331 toward the second wall portion 22. The reflecting member 332 is, for example, a mirror or a prism.

[0087] The second steering mirror 333 is disposed on the second straight line A2. The second steering mirror 333 is constructed by a reflector 333a and a base 333b. The reflector 333a is mounted on the base 333b. The base 333b is mounted on the partition wall 29. The base 333b holds the reflector 333a in a manner that allows adjustment of the direction of the reflector 333a. The second steering mirror 333 reflects the laser L1 reflected by the reflecting member 332 toward the sixth wall 26.

[0088] As an example, the bases 331b and 333b can be connected via a tool with a cover-shaped opening (not shown) formed in the second wall portion 22. Thus, by operating the tool while observing the image obtained by the observation unit 17 (described later), the orientation of each reflector 331a and 333a can be adjusted so that the optical axis of the laser L1 incident on the focusing unit 14 is aligned with the optical axis of the focusing unit 14.

[0089] The laser adjustment unit 13 also includes a beam expander 34 and a reflector (second reflector) 35. The optical axis adjustment unit 33, the beam expander 34, and the reflector 35 are arranged on a second straight line A2 extending along the Z direction. The beam expander 34 enlarges the diameter of the laser L1 reflected by the optical axis adjustment unit 33. The reflector 35 is used to reflect the laser L1, whose diameter has been enlarged by the beam expander 34, toward the first wall portion 21 and the fifth wall portion 25. The reflector 35 is, for example, a mirror or a prism.

[0090] The laser adjustment unit 13 also includes a reflective spatial light modulator 36 and an imaging optical system 37. The reflective spatial light modulator 36, the imaging optical system 37, and the focusing unit 14 are arranged on a third straight line A3 extending along the Z direction. The reflective spatial light modulator 36 modulates the laser L1 reflected by the reflective unit 35 and reflects it toward the sixth wall 26. The reflective spatial light modulator 36 is, for example, a spatial light modulator (SLM) of reflective liquid crystal on silicon (LCOS). The imaging optical system 37 constitutes a bilateral telecentric optical system in which the reflecting surface 36a of the reflective spatial light modulator 36 and the entrance pupil surface 14a of the focusing unit 14 are in imaging relationship. The imaging optical system 37 is composed of three or more lenses.

[0091] The first straight line A1, the second straight line A2, and the third straight line A3 are located on a plane perpendicular to the Y direction. The second straight line A2 is located on the side of the second wall portion 22 relative to the third straight line A3. In the laser processing head 10A, the laser L1, which enters the frame 11 from the incident portion 12 along the Z direction, is reflected by the reflecting portion 31 and travels along the first straight line A1. The laser L1 traveling along the first straight line A1 is reflected by the optical axis adjustment portion 33, so that it travels along the second straight line A2. The laser L1 traveling along the second straight line A2 is reflected sequentially by the reflecting portion 35 and the reflective spatial light modulator 36, so that it travels along the third straight line A3. The laser L1 traveling along the third straight line A3 is emitted from the focusing portion 14 out of the frame 11 along the Z direction.

[0092] The laser processing head 10A also includes a beam splitter 15, a measuring unit 16, an observation unit 17, a driving unit 18, and a circuit unit 19.

[0093] Beam splitter 15 is disposed on the third straight line A3, between imaging optical system 37 and focusing section 14. That is, beam splitter 15 is disposed within frame 11, between laser adjustment section 13 and focusing section 14. Beam splitter 15 is mounted on partition wall section 29 on the fourth wall section 24 side. Beam splitter 15 allows laser L1 to pass through. From the viewpoint of suppressing astigmatism, beam splitter 15 can be, for example, cubic in shape, or it can be a two-plate type configured with a twisted relationship.

[0094] The measuring unit 16 is located within the frame 11, positioned on the side of the first wall portion 21, opposite to the third straight line A3. That is, the measuring unit 16 is positioned on the side of the first wall portion 21, opposite to the focusing unit 14 in the X direction. The measuring unit 16 is mounted on the partition wall portion 29 on the side of the fourth wall portion 24. The measuring unit 16 outputs measuring light L10 to measure the distance between the surface of the object 100 (e.g., the surface on the side where laser L1 is incident) and the focusing unit 14. The measuring light L10 reflected by the surface of the object 100 is detected via the focusing unit 14. In other words, the measuring light L10 output from the measuring unit 16 is irradiated onto the surface of the object 100 via the focusing unit 14, and the measuring light L10 reflected by the surface of the object 100 is detected by the measuring unit 16 via the focusing unit 14.

[0095] More specifically, the measurement light L10 output from the measurement unit 16 is reflected sequentially by the beam splitter 20 and the beam splitter 15 mounted on the partition wall 29 on the fourth wall 24 side, and then exits from the focusing unit 14 to the outside of the frame 11. The measurement light L10 reflected by the surface of the object 100 enters the frame 11 from the focusing unit 14, is then reflected sequentially by the beam splitter 15 and the beam splitter 20, and then enters the measurement unit 16 for detection.

[0096] The observation unit 17 is located within the frame 11, positioned on the side of the first wall portion 21, opposite to the third straight line A3. That is, the observation unit 17 is positioned on the side of the first wall portion 21, opposite to the focusing unit 14 in the X direction. The observation unit 17 is mounted on the partition wall portion 29 on the side of the fourth wall portion 24. The observation unit 17 outputs observation light L20 for observing the surface of the object 100 (e.g., the surface on the side where laser L1 is incident), and detects the measurement light L20 reflected by the surface of the object 100 via the focusing unit 14. In other words, the observation light L20 output from the observation unit 17 is irradiated onto the surface of the object 100 via the focusing unit 14, and the observation light L20 reflected by the surface of the object 100 is detected by the observation unit 17 via the focusing unit 14.

[0097] More specifically, the observation light L20 output from the observation unit 17 is reflected by the beam splitter 15 after passing through the beam splitter 20, and then exits from the focusing unit 14 to the outside of the frame 11. The observation light L20 reflected by the surface of the object 100 enters the frame 11 from the focusing unit 14, is reflected by the beam splitter 15, and then enters the observation unit 17 through the beam splitter 20 for detection. Furthermore, the wavelengths of the laser L1, the measuring light L10, and the observation light L20 are different from each other (at least their center wavelengths are offset from each other).

[0098] The drive unit 18 is mounted on the partition wall 29 on the side of the fourth wall 24. The drive unit 18 moves the focusing part 14 disposed on the sixth wall 26 along the Z direction by driving force, for example, a piezoelectric element.

[0099] The circuit section 19 is located within the frame 11, positioned on the side of the third wall 23 opposite to the partition wall 29. Specifically, the circuit section 19 is located within the frame 11 on the side of the third wall 23 opposite to the laser adjustment section 13, the measurement section 16, and the observation section 17. The circuit section 19 is separated from the partition wall 29. The circuit section 19 can be, for example, multiple circuit boards. The circuit section 19 processes signals output from the measurement section 16 and signals input to the reflective spatial light modulator 36. The circuit section 19 controls the drive section 18 based on the signals output from the measurement section 16. As an example, the circuit section 19 controls the drive section 18 based on the signals output from the measurement section 16 to maintain a constant distance between the surface of the object 100 and the focusing section 14 (i.e., the distance between the surface of the object 100 and the focusing point of the laser L1 is maintained constant).

[0100] Furthermore, the partition wall 29 has notches and holes (not shown) for wiring to pass through, allowing electrical connections between the respective measuring unit 16, observing unit 17, driving unit 18, and reflective spatial light modulator 36 and the circuit unit 19. Additionally, the frame 11 is provided with a connection for the control unit 9 of the circuit unit 19 (see reference). Figure 1 Connectors (not shown) for electrical wiring, etc.

[0101] Like the laser processing head 10A, the laser processing head 10B includes a frame 11, an incident section 12, a laser adjustment section 13, a focusing section 14, a beam splitter 15, a measuring section 16, an observation section 17, a driving section 18, and a circuit section 19. However, the structures of the laser processing head 10B are as follows: Figure 2 As shown, a virtual plane passing through the center point between a pair of mounting parts 65 and 66 and perpendicular to the Y direction is configured to have a face-symmetric relationship with each structure of the laser processing head 10A.

[0102] For example, the frame 11 of the laser processing head 10A is mounted on the mounting portion 65 with the fourth wall portion 24 and the third wall portion 23 located on the side of the laser processing head 10B, and the sixth wall portion 26 and the fifth wall portion 25 located on the side of the support portion 7. In contrast, the frame 11 of the laser processing head 10B is mounted on the mounting portion 66 with the fourth wall portion 24 and the third wall portion 23 located on the side of the laser processing head 10A, and the sixth wall portion 26 and the fifth wall portion 25 located on the side of the support portion 7.

[0103] The frame 11 of the laser processing head 10B is configured such that, with the third wall portion 23 positioned on the mounting portion 66 side, the frame 11 is mounted on the mounting portion 66. Specifically, as described below, the mounting portion 66 has a base plate 66a and a mounting plate 66b. The base plate 66a is mounted on a track provided on the Z-axis moving portion 63. The mounting plate 66b is erected at the end of the base plate 66a on the laser processing head 10A side. The frame 11 of the laser processing head 10B is mounted on the mounting portion 66 with the third wall portion 23 in contact with the mounting plate 66b. The frame 11 of the laser processing head 10B can be attached to and detached from the mounting portion 66.

[0104] [The function and effects of laser processing heads]

[0105] In the laser processing head 10A, an optical axis adjustment section 33 is provided on the optical path of the laser L1 from the incident section 12 to the focusing section 14 for adjusting the optical axis of the laser L1 incident from the incident section 12. Therefore, for example, when the emitting end 2a of the optical fiber 2 is removed from the frame 11 for maintenance or other purposes, and then reconnected to the incident section 12, the optical axis of the laser L1 incident on the focusing section 14 can be aligned with the optical axis of the focusing section 14. Furthermore, the incident section 12 is offset in the X direction towards the first wall portion 21 of the frame 11, and the focusing section 14 is offset in the X direction towards the second wall portion 22 of the frame 11. This suppresses the lengthening of the optical path of the laser L1 from the incident section 12 to the optical axis adjustment section 33, and consequently, it suppresses the offset of the optical axis of the laser L1 incident on the focusing section 14 from the optical axis of the focusing section 14. Therefore, if the laser processing head 10A is used, the laser L1 can be focused with good precision.

[0106] Furthermore, in the laser processing head 10A, the incident portion 12 is disposed on the fifth wall portion 25 of the frame 11, and in the laser adjustment portion 13, the optical axis adjustment portion 33 is disposed at the rear section (downstream side of the travel direction of the laser L1) of the reflector 31 and the attenuator 32, and at the front section (upstream side of the travel direction of the laser L1) of the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37. Therefore, since the optical axis of the laser L1 incident on the structure [beam expander 34, reflector 35, reflective spatial light modulator 36, imaging optical system 37, and focusing portion 14] that shapes the laser L1 can be adjusted, the laser L1 can be focused more accurately. Furthermore, the incident portion 12 is disposed on the fifth wall portion 25, and the attenuator 32 is disposed between the reflecting portion 31 and the optical axis adjusting portion 33 in the laser adjustment portion 13. Thus, the frame 11 can be enlarged due to the application of the attenuator 32.

[0107] Furthermore, in the laser processing head 10A, since the light source for outputting the laser L1 is not located within the frame 11, the frame 11 can be miniaturized. Moreover, in the frame 11, the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, and the focusing portion 14 disposed on the sixth wall portion 26 is offset towards the fourth wall portion 24 in the Y direction. Therefore, when the frame 11 is moved along the Y direction opposite to the third wall portion 23 and the fourth wall portion 24, even if other components (such as the laser processing head 10B) are present on the fourth wall portion 24 side, the focusing portion 14 can be brought closer to those other components. Furthermore, since the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, the space occupied by the frame 11 can be reduced when the frame 11 is moved along the Y direction, which is opposite to the third wall portion 23 and the fourth wall portion 24. Moreover, since the incident portion 12 and the focusing portion 14 are offset towards the fourth wall portion 24 in the Y direction, other components (such as the circuit portion 19) can be arranged in the area of ​​the laser adjustment portion 13 closer to the third wall portion 23 within the frame 11, and this area can be utilized effectively.

[0108] Furthermore, in the laser processing head 10A, the circuit section 19 is located within the frame 11, and the laser adjustment section 13 is disposed on the side of the third wall section 23. This allows for efficient utilization of the area within the frame 11 where the laser adjustment section 13 is located closer to the third wall section 23.

[0109] Furthermore, in the laser processing head 10A, the laser adjustment section 13 is located within the frame 11, with the partition wall 29 disposed on the side of the fourth wall 24, and the circuit section 19 is located within the frame 11, with the partition wall 29 disposed on the side of the third wall 23. Therefore, since the heat generated in the circuit section 19 is less likely to propagate to the laser adjustment section 13, strain in the laser adjustment section 13 caused by the heat generated in the circuit section 19 can be suppressed, and the laser L1 can be accurately adjusted. Moreover, by means of, air cooling or water cooling, the circuit section 19 can be efficiently cooled in the region within the frame 11 near the third wall 23.

[0110] Furthermore, in the laser processing head 10A, the laser adjustment section 13 is mounted on the partition wall section 29. Thus, the laser adjustment section 13 can be reliably and stably supported within the frame 11.

[0111] Furthermore, in the laser processing head 10A, the circuit section 19 is separated from the partition wall section 29. This allows for more reliable suppression of heat generated in the circuit section 19 from propagating to the laser adjustment section 13 via the partition wall section 29.

[0112] Furthermore, in the laser processing head 10A, the measuring unit 16 and the observing unit 17 are located in the region of the frame 11 near the first wall 21 of the focusing unit 14. The circuit unit 19 is located in the region of the frame 11 near the third wall 23 of the laser adjustment unit 13. The beam splitter 15 is located in the frame 11 between the laser adjustment unit 13 and the focusing unit 14. Thus, the region within the frame 11 can be utilized effectively. Moreover, in the laser processing apparatus 1, processing can be performed based on the measurement results of the distance between the surface of the object 100 and the focusing unit 14. Furthermore, in the laser processing apparatus 1, processing can be performed based on the observation results of the surface of the object 100.

[0113] Furthermore, in the laser processing head 10A, the circuit unit 19 controls the drive unit 18 based on the signal output by the self-measurement unit 16. Thus, the position of the focusing point of the laser L1 can be adjusted based on the measurement results of the distance between the surface of the object 100 and the focusing unit 14.

[0114] The same effects and functions can be achieved using the laser processing head 10B.

[0115] Furthermore, in the laser processing apparatus 1, since the laser L1 is well focused by the laser processing heads 10A and 10B, the object 100 can be processed efficiently and with good precision.

[0116] Furthermore, in the laser processing apparatus 1, a pair of mounting parts 65 and 66 can move along the Y and Z directions, respectively. This allows for more efficient processing of the object 100.

[0117] Furthermore, in the laser processing apparatus 1, the support 7 can move along the X and Y directions respectively, and rotate around an axis parallel to the Z direction as its centerline. This allows for more efficient processing of the object 100.

[0118] [Example of a modified laser processing head]

[0119] It is also possible to Figure 6 As shown, the incident part 12 is disposed on the first wall part 21 of the frame 11, and the laser adjustment part 13 and the optical axis adjustment part 33 are disposed at the rear section of the attenuator 32 and at the front section of the beam expander 34, the reflector 35, the reflective spatial light modulator 36 and the imaging optical system 37. Figure 6 The laser processing head 10A shown has an incident section 12, an attenuator 32, and an optical axis adjustment section 33 (specifically, the first steering mirror 331 of the optical axis adjustment section 33) arranged on the first straight line A1 (other structures are the same as those shown). Figure 5 (The laser processing head 10A shown is the same). In such... Figure 6The laser processing head 10A shown includes an attenuator 32 for adjusting the output of the laser L1 incident from the incident section 12. Therefore, since the optical axis of the laser L1 incident on the structure [beam expander 34, reflector 35, reflective spatial light modulator 36, imaging optics system 37, and focusing section 14] that shapes the laser L1 can be adjusted, the laser L1 can be focused more precisely. Furthermore, since the attenuator 32 is positioned between the incident section 12 and the optical axis adjustment section 33, the frame 11 can be enlarged due to the application of the attenuator 32. Moreover, miniaturization of the laser processing apparatus 1 is possible. The above structure can also be applied to the laser processing head 10B.

[0120] In addition, the laser processing head 10A can also be used as follows: Figure 7 As shown, the incident part 12 is disposed on the fifth wall portion 25 of the frame 11, and the laser adjustment part 13 and the optical axis adjustment part 33 are disposed in front of the attenuator 32, the reflector 31, the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37. Figure 7 The laser processing head 10A shown has an optical axis adjustment section 33 (specifically, the second steering mirror 333 of the optical axis adjustment section 33), an attenuator 32, and a reflector 31 arranged on the first straight line A1. The optical axis adjustment section 33 (specifically, the first steering mirror 331 of the optical axis adjustment section 33) is opposite to the incident section 12 in the Z direction, and the reflector 31 is opposite to the beam expander 34 in the Z direction (other structures are the same as those shown). Figure 5 (The laser processing head 10A shown is the same). In such... Figure 7 In the laser processing head 10A shown, the optical axis adjustment section 33 reflects the laser L1 incident from the incident section 12 toward the second wall portion 22 of the frame 11. The attenuator 32 adjusts the output of the laser L1 reflected by the optical axis adjustment section 33. The reflecting section 31 reflects the laser L1, after its output is adjusted by the attenuator 32, toward the sixth wall portion 26 of the frame 11. The beam expander 34 enlarges the diameter of the laser L1 reflected by the reflecting section 31. Therefore, since the optical axis of the laser L1 incident on the structure [beam expander 34, reflecting section 35, reflective spatial light modulator 36, imaging optical system 37, and focusing section 14] that shapes the laser L1 can be adjusted, the laser L1 can be focused more accurately. Furthermore, since the attenuator 32 is disposed between the optical axis adjustment section 33 and the reflecting section 31, the frame 11 can be enlarged due to the application of the attenuator 32. The above structure can also be applied to the laser processing head 10B.

[0121] In addition, Figure 5 and Figure 6 In each of the laser processing heads 10A shown, the attenuator 32 can also be configured between the optical axis adjustment section 33 and the beam expander 34. Furthermore, in Figure 7The laser processing head 10A shown may also have an attenuator 32 positioned between the reflector 31 and the beam expander 34. Furthermore, in... Figure 5 , Figure 6 and Figure 7 In the respective laser processing head 10A, the attenuator 32 can also be configured at the rear of the beam expander 34 (e.g., between the reflector 35 and the reflective spatial light modulator 36). The above-described structures can also be applied to the laser processing head 10B.

[0122] Furthermore, the optical axis adjustment unit 33 is not limited to having a first steering mirror 331, a reflecting member 332, and a second steering mirror 333. The optical axis adjustment unit 33 may simply have a structure for adjusting the optical axis of the laser L1 incident from the incident unit 12. As an example, the optical axis adjustment unit 33 may also have: a first steering mirror 331 that reflects the laser L1 incident from the first wall portion 21 side toward the first wall portion 21 side and toward the fifth wall portion 25 side along the X direction; and a second steering mirror 333 that reflects the laser L1 reflected by the first steering mirror 331 toward the sixth wall portion 26 side along the Z direction. In addition, the first steering mirror 331 and the second steering mirror 333 may be electrically operated reflectors. In this case, the first steering mirror 331 and the second steering mirror 333 may also be reflectors that automatically adjust the direction of each of the reflectors 331a and 333a according to the image obtained through the observation unit 17.

[0123] Furthermore, with the frame 11 configured such that at least one of the first wall portion 21, the second wall portion 22, the third wall portion 23, and the fifth wall portion 25 is disposed on the mounting portion 65 (or mounting portion 66) side of the laser processing apparatus 1, the frame 11 can be mounted on the mounting portion 65 (or mounting portion 66).

[0124] Furthermore, the circuit section 19 is not limited to processing signals output from the measurement section 16 and / or signals input to the reflective spatial light modulator 36; it is sufficient to process some signals in the laser processing head.

[0125] Alternatively, the light source unit 8 may have only one light source. In this case, the light source unit 8 is configured to emit a portion of the laser light output from the single light source from the emission section 81a and emit the remaining portion of the laser light from the emission section 82a.

[0126] [The operation of the laser processing equipment, etc.]

[0127] Next, the operation of the laser processing device 1 will be explained. Figure 8 The diagram above illustrates the operation of a laser processing device. Figure 1 The following figures show a schematic internal view of the laser processing heads 10A and 10B. (As shown in the figures below...) Figure 1 , 8As shown, the object 100 is supported in the support part 7. Furthermore, the reference numeral S in the figure, such as the measuring part 16 and the observation part 17 described above, represents an optical system other than the optical system used to display the irradiation of lasers L1 and L2 for forming the modified region.

[0128] As described above, object 100 has multiple lines C extending along the X direction and arranged along the Y direction. Lines C are imaginary lines, but can also be actually drawn lines. Furthermore, object 100 also has multiple lines extending along the Y direction and arranged along the X direction, but their illustrations are omitted.

[0129] Under the control of the control unit 9, the laser processing apparatus 1 performs irradiation processing along each line C. During the irradiation processing, the control unit 9 controls at least the movement of the support 7 via the moving mechanism 5, the movement of the laser processing heads 10A and 10B via the moving mechanism 6, and the irradiation by lasers L1 and L2 from the laser processing heads 10A and 10B. In the laser processing apparatus 1, the control unit 9 executes a first process and a second process as the irradiation process (the irradiation process includes both the first and second processes).

[0130] The first process involves scanning one of the multiple lines C with laser L1 from laser processing head 10A in the X direction. The second process involves scanning the other lines C with laser L2 from laser processing head 10B in the X direction.

[0131] The control unit 9 moves the focusing points of lasers L1 and L2 in the X direction by the following actions: First, the laser processing heads 10A and 10B are moved in the Y and Z directions by the Y-axis moving part 61 and the Z-axis moving parts 63 and 64 of the moving mechanism 6, so that the focusing points of lasers L1 and L2 are located on their respective lines C and inside the object 100. Furthermore, in this state, the support part is moved in the X direction by the moving mechanism 5, and the laser processing heads 10A and 10B are moved in the opposite direction to the support part 7 in the X direction by the X-axis moving parts 62A and 62B, thereby moving the focusing points of lasers L1 and L2 in the X direction along line C within the object 100.

[0132] In particular, the control unit 9 performs the first and second processes repeatedly for at least a portion of the time. That is, the control unit 9 simultaneously achieves a state where laser L1 is scanned along one line C and a state where laser L2 is scanned along other lines C. In other words, the control unit 9 causes laser processing head 10A and laser processing head 10B to operate simultaneously. As a result, compared to processing using a single laser processing head, a significant increase in output can be achieved.

[0133] If the control unit 9 completes the scanning of lasers L1 and L2 along one line C, it independently moves the laser processing heads 10A and 10B in the Y direction (or the Z direction if necessary) by a distance equivalent to the interval of line C, and then continues to scan along the next line C (i.e., the first process and the second process). The control unit 9 forms the modified region M along all lines C by continuously performing this operation, based on approximately the number of lines C.

[0134] At this time, the control unit 9 sequentially performs the first process from the line C located at one end of the object 100 in the Y direction towards the line C inside in the Y direction. Simultaneously, the control unit 9 sequentially performs the second process (referred to as the main processing) from the line C located at the other end of the object 100 in the Y direction towards the line C inside in the Y direction. The line C located at one end in the Y direction and the line C located at the other end in the Y direction have the same length relative to the X direction.

[0135] To explain this in more detail: In the main machining process, firstly, the control unit 9 moves the laser processing head 10A in the Y and Z directions by controlling the Y-axis movement unit 61 and the Z-axis movement unit 63. This positions the focusing point of laser L1 on line C, located at one end of the object 100 in the Y direction, and within the object 100. Simultaneously, the control unit 9 moves the laser processing head 10B in the Y and Z directions by controlling the Y-axis movement unit 61 and the Z-axis movement unit 64. This positions the focusing point of laser L2 on line C, located at the other end of the object 100 in the Y direction, and within the object 100. At this time, the X-direction position of the focusing point of laser L1 coincides, for example, with the X-direction position of the focusing point of laser L2.

[0136] In this state, the control unit 9 moves the support 7 along the X direction by controlling the moving part 53 of the moving mechanism 5. Furthermore, in this state, the control unit 9 moves the laser processing head 10A along the X direction in the opposite direction to the support 7 via the X-axis moving part 62A. Moreover, in this state, the control unit 9 moves the laser processing head 10B along the X direction in the opposite direction to the support 7 via the X-axis moving part 62B. Thus, within the object 100, the focusing points of lasers L1 and L2 are moved along their respective lines C in the X direction.

[0137] That is, the control unit 9, when outputting lasers L1 and L2 from the laser processing heads 10A and 10B, controls the moving mechanisms 5 and 6 to move the support unit 7 and the laser processing heads 10A and 10B in opposite directions along the X direction, and then irradiates the object 100 with lasers L1 and L2 along their respective lines C (performs irradiation processing).

[0138] Specifically, the control unit 9, as the first process, controls the moving mechanisms 5 and 6 (X-axis moving unit 62A) to move the support unit 7 and the laser processing head 10A in opposite directions along the X direction. As the second process, at the same time point as the first process, it controls the moving mechanisms 5 and 6 (X-axis moving unit 62B) to move the support unit 7 and the laser processing head 10B in opposite directions along the X direction. Thus, the first and second processes for their respective lines C begin and end simultaneously. That is, the first and second processes are repeated in their entirety. Consequently, along line C, a modified region M is formed inside the object 100.

[0139] Furthermore, the relationship between the speed at which the support 7 moves along the X direction and the speed at which the laser processing heads 10A and 10B move along the X direction can be arbitrarily set by the control unit 9 within a range that the sum of the speeds reaches the target value of the speed at which the focusing point moves. For example, here, the control unit 9 sets the speed of the laser processing heads 10A and 10B along the X direction to be smaller than the speed of the support 7 along the X direction. Furthermore, the speeds of the laser processing heads 10A and 10B can be made the same when the lengths of the opposing lines C irradiated by lasers L1 and L2 are the same. However, for example, when the lengths of the lines C irradiated by laser L1 and L2 are different, the speeds of the laser processing heads 10A and 10B can be made different.

[0140] Next, the control unit 9 moves the laser processing head 10A in the Y and Z directions by controlling the Y-axis movement unit 61. This positions the focusing point of laser L1 on a line C inside the object 100, extending from one end in the Y direction, and thus within the object 100. Simultaneously, the control unit 9 moves the laser processing head 10B by controlling the Y-axis movement unit 61. This positions the focusing point of laser L2 on a line C inside the object 100, extending from the other end in the Y direction, and thus within the object 100. At this time, the X-direction position of the focusing point of laser L1 coincides, for example, with the X-direction position of the focusing point of laser L2.

[0141] In this state, the control unit 9 controls the moving mechanisms 5 and 6 to move the support unit 7 and the laser processing heads 10A and 10B in opposite directions along the X direction. This causes the focusing points of lasers L1 and L2 to move along their respective lines C in the X direction within the object 100. Consequently, the first and second processing steps for each line C begin and end simultaneously. That is, the first and second processing steps are essentially repeated. By repeatedly performing this operation of the control unit 9 until reaching the innermost line C of the object 100, the laser processing heads 10A and 10B can operate simultaneously to perform laser processing without waste.

[0142] Furthermore, in each figure, the modified region M is shown as a solid line for illustrative purposes; however, it is not actually necessary for the modified region M to be visible from the surface of the object 100.

[0143] Here, as Figure 9 As shown, during the repeated execution of the above actions, in a region further inside the object 100, the positional relationship between the laser processing heads 10A and 10B may become such that the distance between them in the Y direction cannot be further reduced (e.g., they are about to touch), and in the area of ​​the object 100 corresponding to the distance D between their respective focusing sections 14, unprocessed lines C may remain. In this case, as described above, it is not easy to perform the first process and the second process simultaneously. Therefore, in this case, the control unit 9 performs the following post-processing.

[0144] That is, such as Figure 10 As shown, when the laser processing head 10A and laser processing head 10B are closest to each other in the Y direction as a result of the main processing, and a portion of line C remains in the area between the respective focusing sections 14 of the object 100, the control unit 9 performs processing after scanning the portion of line C in the X direction with laser L2 from the laser processing head 10B while simultaneously causing the laser processing head 10A to avoid that area of ​​the object 100 (performing the second processing). Furthermore, the laser processing heads 10A and 10B can also be reversed.

[0145] Thus, laser processing is completed for all lines C. Then, as needed, the lines intersecting with line C can be set along the X direction by rotating the support 7, and the above actions can be repeated.

[0146] [Implementation of Eccentricity Correction]

[0147] Next, the control of eccentricity correction in laser processing apparatus 1 will be explained. For example... Figure 11As shown, in the laser processing apparatus 1, when viewed from the Z direction, the X-axis moving part 62A, which moves the laser processing head 10A along the X direction, and the X-axis moving part 62B, which moves the laser processing head 10B along the X direction, are not parallel to each other (eccentricity occurs). Here, as an example, the X-axis moving part 62A is parallel to the X direction, and the X-axis moving part 62B is tilted in the Y direction relative to the X direction.

[0148] In this situation, for example, if the support 7 is rotated so that the movement line (first movement line) of the laser processing head 10A is aligned with line C when viewed from the Z direction, the movement line (second movement line) of the laser processing head 10B will be tilted relative to line C. Therefore, if irradiation is performed in this state, and the laser processing heads 10A and 10B each move along line C, the modified region MA processed by the laser processing head 10A will be aligned with line C, but the modified region MB processed by the laser processing head 10B will be offset by Δy from line C.

[0149] Therefore, in the laser processing apparatus 1, before irradiation, control (eccentricity correction) is implemented to correct this offset Δy. Furthermore, the movement lines of the laser processing heads 10A and 10B, as an example, are defined by the extension direction of the X-axis moving parts 62A and 62B when viewed from the Z direction, that is, the movement trajectory of the laser processing heads 10A and 10B (focusing part 14) when viewed from the Z direction. Next, the control of this eccentricity correction will be explained in detail.

[0150] In eccentricity correction, firstly, as Figure 12 As shown, the sample 100T is supported on the support 7. The sample 100T is, for example, a bare wafer. Next, the control unit 9, under the control of the Y-axis movement unit 61, moves the laser processing head 10A in the Y direction so that the position of the focal point of the laser L1 in the Y direction is located at the center of the sample 100T. Subsequently, the control unit 9 aligns the position of the focal point of the laser L1 in the Z direction with the surface of the sample 100T. Therefore, the control unit 9, for example, controls the Z-axis movement unit 63, thereby enabling the laser processing head 10A to move in the Z direction.

[0151] Next, the control unit 9 performs the first forming process. With the sample 100T supported by the support unit 7, it outputs laser L1 from the laser processing head 10A and moves the laser processing head 10A along the X-direction under the control of the X-axis moving unit 62A. Through this first forming process, the sample 100T is irradiated with laser L1 along the X-direction, and a processing line (first processing line) DA is formed by the processing mark of laser L1. The processing line DA corresponds to the movement line (first movement line) of the laser processing head 10A.

[0152] Next, as Figure 13 As shown, the control unit 9, under the control of the Y-axis movement unit 61, retracts the laser processing head 10A from the area on the sample 100T and moves the laser processing head 10A in the Y direction such that the Y-direction position of the focusing point of the laser L2 is located at the center of the sample 100T. Subsequently, the control unit 9 aligns the Z-direction position of the focusing point of the laser L2 with the surface of the sample 100T. Therefore, the control unit 9, for example, controls the Z-axis movement unit 64, thereby enabling the laser processing head 10B to move in the Z direction.

[0153] Next, the control unit 9 performs a second forming process. With the sample 100T supported by the support unit 7, it outputs laser L2 from the laser processing head 10B and moves the laser processing head 10B along the X-direction under the control of the X-axis moving unit 62B. Through this second forming process, the sample 100T is irradiated with laser L2 along the X-direction, and a processing line (second processing line) DB is formed by the processing mark of laser L2. The processing line DB corresponds to the movement line (second movement line) of the laser processing head 10B.

[0154] Next, the control unit 9, through the control of the moving mechanism 6 and the camera AC, captures an image of the sample 100T, and obtains information on the formation status of the processing lines DA and DB based on the acquired image. Then, based on the comparison between processing line DA and processing line DB, the control unit 9 obtains the offset of processing line DB from processing line DA (reference line) in the Y direction (offset acquisition processing). Here, as... Figure 14 As shown, the offset of the starting point (X=0) of the machining line DB from the machining line DA is defined as b, the offset of the ending point (X=300) of the machining line DB from the machining line DA is defined as a, and the overall offset ΔY of the machining line DB is defined as ΔY = ((ab) / 300)x + b (x is the coordinate in the X direction). As described above, in the eccentricity correction, the control unit 9 performs the acquisition process, which acquires the offset ΔY of the moving line (machining line DB) in the Y direction from the reference line (machining line DA) along the X direction. This moving line shows the movement of the laser processing head 10B along the X direction by the X-axis moving unit 62B.

[0155] The formula for the offset ΔY is the formula for the straight line of the machining line DB in the XY plane. Therefore, in the above irradiation process, when the laser machining head 10B moves in the X direction, it also moves in the Y direction in a manner that corresponds to the Y coordinate of the offset ΔY formula, thereby correcting the eccentricity.

[0156] That is, such as Figure 15As shown, in the irradiation process (second process), the control unit 9 moves the laser processing head 10B in the Y direction by an offset amount ΔY (in a way that cancels out the offset ΔY) under the control of the Y-axis movement unit 61 (arrow AA in the figure), and moves the laser processing head 10B in the X direction under the control of the X-axis movement unit 62B (arrow AB in the figure). This corrects the eccentricity of the laser processing head 10B in the Y direction, causing the laser processing head 10B to form a modified region MB aligned with line C. Furthermore, prior to this irradiation process, the control unit 9 performs a alignment process by rotating the support unit 7 under the control of the movement mechanism 5, ensuring that line C aligns with the movement line of the laser processing head 10A. Thus, even the laser processing head 10A forms a modified region MA aligned with line C.

[0157] [First variation of eccentricity correction]

[0158] Furthermore, in the above example of eccentric correction, although an example of an object 100 being supported by a support 7 is given, but as... Figure 16 As shown, this method can also be applied to situations where multiple (in this case, two) objects 100A and 100B are supported by the support 7 and processed simultaneously. Next, this modified example will be described. Furthermore, the eccentricity correction in the former case is caused by the offset of the X-axis moving parts 62A and 62B used to move the laser processing heads 10A and 10B along the X direction, and is therefore referred to as axis offset correction. Moreover, the correction for the offset caused by the offset of the relative postures of the objects 100A and 100B is referred to as wafer offset correction.

[0159] In this example, the X-axis moving parts 62A and 62B are parallel to the X-direction. Although no mechanical error occurs in the laser processing heads 10A and 10B, due to the relative posture shifts of the objects 100A and 100B, the lines C set on the objects 100A and 100B will not be parallel to each other. Therefore, for example, if the support 7 is rotated so that the line C of the object 100A aligns with the moving line of the laser processing head 10A, the moving line of the laser processing head 10B will become tilted relative to the line C of the object 100B. Thus, if irradiation is performed in this state, although the modification area MA operated by the laser processing head 10A aligns with the line C of the object 100A, a shift Δy will occur in the modification area MB operated by the laser processing head 10B from the line C of the object 100B.

[0160] The eccentricity correction used to correct the offset Δy is performed using the following process. Furthermore, the alignment process described above has been performed to ensure that line C of the object 100A is aligned with the movement line of the laser processing head 10A. First, the control unit 9 controls the movement mechanism 6 and the camera AC to capture an image of the object 100B. Next, based on the obtained image, the control unit 9 obtains the offset between the direction of the set line C of the object 100B and the movement line of the laser processing head 10B (which is synonymous with the X-direction) moved by the X-axis movement unit 62B. Here, as an example, the area where the set line C is located is defined as the direction of the edge extension of the element area in the image, or the direction of the extension of the blank area between the edges of the element areas, and compared with the movement line (X-direction) of the laser processing head 10B to obtain this offset.

[0161] That is, in this example, the control unit 9 performs an acquisition process, which acquires the offset of the movement line (the second movement line) from the reference line (line C set on the object 100B) along the X direction in the Y direction. This movement line shows the movement of the laser processing head 10B along the X direction by the X-axis movement unit 62B. Moreover, during the irradiation process (the second process), the control unit 9 moves the laser processing head 10B in the Y direction by the amount of this offset (in a way that cancels out the offset) under the control of the Y-axis movement unit 61, and moves the laser processing head 10B in the X direction under the control of the X-axis movement unit 62B. Thus, even the laser processing head 10B forms a modified region MB that coincides with line C of the object 100B.

[0162] [Second variation of eccentricity correction]

[0163] Furthermore, the example described above illustrates how the offset of the movement line of one of the laser processing heads 10A and 10B is corrected when it aligns with line C. However, eccentricity correction can also be applied to correct the offset of the movement lines of both laser processing heads 10A and 10B. In this example, the laser processing apparatus 1 includes another X-axis moving part (with the same structure as X-axis moving parts 62A and 62B) that is different from the X-axis moving parts 62A and 62B, and the camera AC is mounted on this other X-axis moving part. Then, in eccentricity correction, the control unit 9 uses the extension direction of this other X-axis moving part as a reference line to obtain the offset of the respective movement lines of the laser processing heads 10A and 10B from this reference line in the Y direction.

[0164] Furthermore, during the irradiation process (first and second processes), the control unit 9 moves the laser processing heads 10A and 10B in the Y direction by the amount of offset (in a way that cancels out the offset) under the control of the Y-axis movement unit 61, and moves the laser processing heads 10A and 10B in the X direction under the control of the X-axis movement units 62A and 62B. That is, here, the control unit 9 performs eccentricity correction on both sides of the laser processing heads 10A and 10B.

[0165] [Other variations of eccentricity correction]

[0166] In the example of eccentricity correction described above, the focusing points of lasers L1 and L2 are focused onto the surface of sample 100T to irradiate lasers L1 and L2, thereby forming processing lines DA and DB on the surface of sample 100T for obtaining offset. However, processing lines DA and DB can also be formed inside sample 100T. In this case, control unit 9 focuses the focusing points of lasers L1 and L2 onto the interior of sample 100T to irradiate lasers L1 and L2, thereby forming processing lines DA and DB formed by the modified region inside sample 100T. Then, control unit 9 uses camera AC to photograph the interior of sample 100T using light that penetrates sample 100T, obtaining information showing the formation state of processing lines DA and DB.

[0167] [The Function and Effects of Laser Processing Equipment]

[0168] As described above, the laser processing apparatus 1 has two laser processing heads 10A and 10B for irradiating the object 100 with lasers L1 and L2. Furthermore, the laser processing heads 10A and 10B can be moved along the X-direction extending from the line C set on the object 100 via the X-axis moving parts 62A and 62B of the moving mechanism 6. Thus, the laser processing heads 10A and 10B operate simultaneously for at least a portion of the time, thereby improving efficiency.

[0169] Furthermore, in the laser processing apparatus 1, the control unit 9 performs an acquisition process, which acquires the offset ΔY of the movement line from the reference line along the X direction. This movement line is the movement line of the laser processing head 10B along the X direction, which is moved by the X-axis movement unit 62B. The line C set on the object 100 is along the X direction. Therefore, the offset ΔY of the movement line from the reference line acquired here is the offset of the distance line C of the irradiation process. Moreover, during the irradiation process, the laser processing head 10B moves in the Y direction and then in the X direction by the amount of this offset ΔY. Thus, even if the line C set on the object 100 coincides with the movement line of the laser processing head 10A, it is possible to prevent the movement line of the laser processing head 10B from deviating from the line C, thereby suppressing the reduction of processing quality.

[0170] Next, in the laser processing apparatus 1, the control unit 9 performs the first forming process during the acquisition process. While the sample 100T for acquiring the offset amount ΔY is supported by the support unit 7, the laser processing head 10A outputs laser L1 while the laser processing head 10A is moved along the X direction under the control of the X-axis moving unit 62A. The laser L1 is then used to irradiate the sample 100T along the X direction, and the processing line DA, which serves as the moving line, is formed on the sample 100T through the processing mark of the laser L1.

[0171] Next, the control unit 9 performs the second forming process. While the sample 100T is supported by the support unit 7, it outputs laser L2 from the laser processing head 10B and moves the laser processing head 10B along the X direction under the control of the Y-axis movement unit 61. This irradiates the sample 100T with laser L2 along the X direction, forming a processing line DB on the sample 100T as a moving line through the processing mark of laser L2. Then, the control unit 9 performs an offset acquisition process, obtaining an offset ΔY based on a comparison between the processing line DA and the processing line DB, with the processing line DA as the reference line. As described above, by using the processing lines DA and DB formed from the actual processing of the sample 100T as moving lines for calculating the offset ΔY, the offset can be calculated with higher accuracy.

[0172] Next, in the laser processing apparatus 1, before the irradiation process, the control unit 9, under the control of the moving mechanism 5, performs a positioning process to rotate the support 7 so that line C is aligned with the moving line of the laser processing head 10A. Furthermore, during the irradiation process, while lasers L1 and L2 are output from the laser processing heads 10A and 10B, the control unit 9, under the control of the moving mechanism 5, moves the support 7 along the X-direction, and under the control of the X-axis moving units 62A and 62B, moves the laser processing heads 10A and 10B along the X-direction in the opposite direction to the support 7, thereby irradiating the object 100 with lasers L1 and L2 along line C.

[0173] As described above, if both the support portion 7 supporting the object 100 and the laser processing heads 10A and 10B are moved, the moving speed of the focusing point of lasers L1 and L2 relative to the object 100 will increase, and the processing speed will also increase. Furthermore, in this case, the moving speed of the focusing point is shared by the support portion 7 and the laser processing heads 10A and 10B. Therefore, compared to the case where only one of the support portion 7 and the laser processing heads 10A and 10B is moved, their respective moving speeds can be suppressed. As a result, the time and distance required for acceleration and deceleration of the support portion 7 and the laser processing heads 10A and 10B can be reduced.

[0174] Here, the weight of the laser processing heads 10A and 10B is generally lighter than that of the support 7. Therefore, when moving the focusing point at the target moving speed, it is considered that the laser processing heads 10A and 10B move faster than the support 7 (that is, the speed burden of the laser processing heads 10A and 10B is relatively large).

[0175] In response, the laser processing apparatus 1 has optical fibers 2 connected to the laser processing heads 10A and 10B for guiding the lasers L1 and L2 output from the light source 81. Furthermore, the control unit 9, during irradiation, ensures that the speed of the laser processing heads 10A and 10B along the X direction is lower than the speed of the support unit 7 along the X direction. As described above, when the laser processing heads 10A and 10B are connected to the optical fibers 2, regardless of the weight relationship between the laser processing heads 10A and 10B and the support unit 7, the laser processing heads 10A and 10B are relatively slower (i.e., the speed burden on the laser processing heads 10A and 10B is relatively smaller), thereby protecting the optical fibers 2.

[0176] Furthermore, in the laser processing apparatus 1, the moving mechanism 6 includes a pair of Y-axis moving parts 61 and X-axis moving parts 62A and 62B arranged opposite to each other in the X direction, which are mounted on and supported by the pair of Y-axis moving parts 61. Therefore, each of the laser processing heads 10A and 10B is reliably supported.

[0177] [Implementation Methods for Mechanical Error Correction]

[0178] In the above embodiment, an example of eccentricity correction was described as a mechanical error correction for laser processing heads 10A and 10B. However, other mechanical error corrections can also be performed in the laser processing apparatus 1. Next, an example of mechanical error correction will be described.

[0179] Figure 17 and Figure 18 This is a diagram showing the processing results when two laser processing heads are used under the same processing conditions. Figure 17 This indicates the processing result performed by the laser processing head 10A. Figure 18 This indicates the processing result performed by the laser processing head 10B. Figure 17 (a) and Figure 18 (a) is a photograph of the cross section of object 100 along line C, showing the exposed cross section of the modified region M. Figure 17 (b) and Figure 18 (b) is a schematic diagram showing the cross section of object 100 intersecting with line C.

[0180] The processing conditions here, as an example, are... Figure 19 The conditions are shown in the table. Figure 19In the table, the number of channels recorded on the horizontal axis (channel one, channel two, etc.) corresponds to the number of scans of lasers L1 and L2. That is, for a line C, lasers L1 and L2 are scanned four times. Furthermore, as shown on the vertical axis (number of focal points), lasers L1 and L2 split into two in only one channel, becoming two focal points. Thus, for a line C, five modified regions M1, M2, M3, M4, and M5 are formed.

[0181] Figure 19 The vertical axis ZH (μm) of the table corresponds to the Z-direction position of the focusing points of lasers L1 and L2 within the object 100. VD (μm) is the interval between adjacent modified regions when lasers L1 and L2 are branched into multiple branches, making the focal number 2 or more. Furthermore, the focusing state parameter is a parameter used to vary the laser focusing state to mitigate spherical aberrations, astigmatism, etc. Here, the object 100 has a thickness of 400 μm.

[0182] like Figure 17 , 18 As shown, even in the common laser processing heads 10A and 10B... Figure 19 The processing conditions shown may still result in variations in the final processing results. More specifically, using... Figure 18 The case of the laser processing head 10B shown is similar to that of the laser processing head 10B used in... Figure 17 Compared to the case of laser processing head 10A shown, the extension of cracks FA from each modified region M1 to M5 is less. As a result, Figure 18 For example, a black stripe BA occurs between modified regions M3 and M4. The black stripe BA is a dark stripe that occurs at the position of the cross section corresponding to the area where there is no connection between the cracks FA extending from each of the adjacent modified regions M.

[0183] The laser processing apparatus 1 has a function for correcting the difference in processing results, i.e., mechanical error, between the two laser processing heads 10A and 10B. Specifically, in the laser processing apparatus 1, the control unit 9 performs display processing, and displays the information received from the input receiver 93. Figure 20 The input screen (G, etc.) is used to independently set at least a portion of the processing conditions of the object 100 from the laser L1 of the laser processing head 10A and the processing conditions of the object 100 from the laser L2 of the laser processing head 10B.

[0184] Figure 20 This is an example diagram showing the input screen displayed by the input receiving unit. For example... Figure 20As shown, the input screen G includes a basic condition receiving unit G1, which receives selections of basic processing conditions (basic conditions). The control unit 9, for example, if the basic condition receiving unit G1 receives a selection of a basic condition corresponding to the thickness of the object 100 (in the illustrated example, "T400μm basic condition"), sets the processing condition that should be selected (e.g., Figure 19 (Processing conditions as shown).

[0185] In addition, the input screen G includes a correction item receiving unit G2, which is used to select the item for mechanical error correction (correction item). The correction item receiving unit G2 receives the selected correction item, which, in the example of the icon, is eccentricity correction G21, machining correction G22, AF correction G23, and laser ON / OFF correction G24. Eccentricity correction G21 is the aforementioned eccentricity correction.

[0186] If the control unit 9 receives the selection of the eccentricity correction G21, such as Figure 21 As shown in (a), information on the specific correction amount input for receiving the eccentricity correction G21 (correction amount input screen G21p) is displayed on the input receiving unit 93. Here, as an example, although the correction amount input screen G21p for the laser processing head 10B is shown, it can also be displayed similarly for the laser processing head 10A. On the correction amount input screen G21p, the movement line (e.g., processing line DA) representing the movement of the laser processing head 10A along the X direction by the X-axis movement unit 62A is used as a reference line, and the input of the correction amount for the offset is received. This offset represents the offset in the Y direction of the movement line (e.g., processing line DB) of the laser processing head 10B along the X direction by the X-axis movement unit 62B from this reference line. "X coordinate 1" is the X coordinate of the beginning of the movement line of the laser processing head 10B, and "X coordinate 2" is the X coordinate of the end of the movement line of the laser processing head 10B.

[0187] As described above, during display processing, the control unit 9 displays information (correction amount input screen G21p) for receiving the input of the correction amount on the input receiving unit 93. This correction amount is the amount by which the processing conditions of the laser processing head 10B are distanced from the processing conditions of the laser processing head 10A as a reference. More specifically, as described above, the control unit 9 uses a movement line (e.g., processing line DA) representing the movement of the laser processing head 10A along the X direction by the X-axis movement unit 62A as a reference line, and displays information (correction amount input screen G21p) for receiving the input of the correction amount for the offset on the input receiving unit 93. This offset amount represents the amount by which the movement line (e.g., processing line DB) representing the movement of the laser processing head 10B along the X direction by the X-axis movement unit 62B is offset from the reference line in the Y direction.

[0188] In the control unit 9, when the correction item receiving unit G2 of the input screen G selects to receive other correction items, the information of the correction amount input screen G21p mentioned above is also displayed on the input receiving unit 93. Figure 21 (b) is the correction amount input screen G22p when the receiving unit G2 displays the selection of receiving processing correction G22. Furthermore, the "Z height correction" on the correction amount input screen G22p indicates that... Figure 19 The correction amount is based on the "ZH (μm)" of the laser processing head 10A for processing conditions. Furthermore, the "focusing correction" on the correction amount input screen G22p indicates the correction amount based on... Figure 19 The correction amount is based on the "focusing parameters" of the laser processing head 10A, which are used as a reference for the processing conditions.

[0189] Figure 22 (a) is the correction amount input screen G23p, which displays the selection of receiving AF correction G23 on the correction item receiving unit G2. As described above, in the laser processing apparatus 1, automatic focus control (AF control) is implemented, which controls the drive unit 18 based on the signal output from the measuring unit 16 to maintain a constant distance between the surface of the object 100 and the focusing unit 14 (i.e., to maintain a constant distance between the surface of the object 100 and the focusing points of lasers L1 and L2). The correction amount input screen G23p receives the correction amounts for various conditions of this AF control.

[0190] Specifically, the "AF Follow Start Position" on the correction input screen G23p indicates the correction amount for the position in the X direction controlled by the AF of the laser processing head 10B when the laser processing head 10A is used as a reference. The "AF Fixed Distance" on the correction input screen G23p indicates the correction amount for maintaining a constant distance (distance from the edge of the object 100) between the surface of the object 100 and the focusing point of the laser L2 when the laser processing head 10A is used as a reference. Furthermore, the "AF Light Quantity" on the correction input screen G23p indicates the correction amount for the light quantity of the measurement light L10 of the measurement unit 16 of the laser processing head 10B when the laser processing head 10A is used as a reference. Additionally, the "AF Gain" on the correction input screen G23p indicates the correction amount for the intensity of the control signal used to activate the focusing unit 14 to follow the surface displacement of the object 100. More specifically, "AF gain" is a parameter that divides the strength of the gain of feedback control (e.g., the proportional gain, integral gain, and derivative gain of PID control) into multiple stages (e.g., 10 stages) for correction. This feedback control is used to control, for example, a piezoelectric element that actuates the drive unit 18.

[0191] Figure 22(b) is the correction amount input screen G24p, which displays the selection of the received laser ON / OFF correction G24 on the correction project receiving unit G2. The "Edge OFF Distance" on the correction amount input screen G24p is a correction amount for the length of the edge OFF interval. The edge OFF interval is the interval from the edge of the object 100 to a predetermined position, which is the interval where the laser is turned OFF without forming a modified region. This is used to correct errors such as deviations that occur after the laser is turned ON until the pulse actually oscillates at a certain output. Furthermore, the "ON / OFF Position" on the correction amount input screen G24p indicates the correction amount for the offset of the position where a modified region is formed during processing. This processing involves turning the laser OFF in a predetermined area within the object 100, creating an area where no modified region is formed.

[0192] As described above, for example, the "T400μm basic condition" is received by the basic condition receiving unit G1 of the input screen G, the selection of the processing correction G22 is received by the correction item receiving unit G2, and the correction amount is received by the correction amount input screen G22p. Figure 21 (b) In the case of inputting the correction amount shown, the control unit 9 first sets the value for the laser processing head 10A. Figure 19 The machining conditions shown are the same as the machining conditions based on the same datum. Figure 23 (a)), and for the laser processing head 10B, set for Figure 19 The processing conditions shown plus Figure 21 (b) The conditions for each correction amount shown ( Figure 23 (b) ) Thus, mechanical error correction is performed.

[0193] In this state, the control unit 9 performs irradiation treatment. Figure 24 A cross-sectional photograph shows the actual processing result after mechanical error correction. Figure 24 (a) represents the processing result performed by the laser processing head 10A. Figure 24 (b) represents the processing result performed by the laser processing head 10B. For example... Figure 24 As shown, in Figure 18 The occurrence of black streaks (BF) in the example was suppressed, and a uniform processing state was obtained for laser processing heads 10A and 10B.

[0194] As described above, in the laser processing apparatus 1, the control unit 9 displays information (such as an input screen G) for receiving input on the input receiving unit 93. This input is used to independently set at least a portion of the processing conditions of the object 100 from the laser L1 of the laser processing head 10A and the processing conditions of the object 100 from the laser L2 of the laser processing head 10B. Therefore, the processing conditions of the laser processing heads 10A and 10B are set in a way that the processing quality of the laser processing of the object 100 by the laser processing heads 10A and 10B will not differ (due to mechanical errors of the laser processing heads 10A and 10B), thereby suppressing a decrease in processing quality.

[0195] Furthermore, in the laser processing apparatus 1, the control unit 9 displays information (such as the correction input screen G21p) for receiving correction input on the input receiving unit 93 during display processing. This correction input is the amount by which the processing conditions of the laser processing head 10B deviate from the reference when the processing conditions of the laser processing head 10A are used as a reference. Therefore, it is easier to input information to suppress mechanical errors of the laser processing heads 10A and 10B.

[0196] The above-described embodiment is an embodiment of a laser processing apparatus according to a viewpoint of the present invention. Therefore, the laser processing apparatus 1 described above can be arbitrarily modified. For example, in the above example, the X-axis moving parts 62A and 62B are shown as being supported by a pair of Y-axis moving parts 61. However, the moving mechanism 6 may include a single Y-axis moving part 61, and the X-axis moving parts 62A and 62B may be supported with the single Y-axis moving part 61 held on one side.

[0197] [Industry availability]

[0198] We provide laser processing equipment that can improve efficiency and prevent a decline in processing quality.

[0199] [Symbol Explanation]

[0200] 1…Laser processing device; 5…Moving mechanism (second moving mechanism); 6…Moving mechanism (first moving mechanism); 7…Support unit; 9…Control unit; 10A…Laser processing head (first laser processing head); 10B…Laser processing head (second laser processing head); 61…Y-axis moving part (third moving part); 62A…X-axis moving part (first moving part); 62B…X-axis moving part (second moving part); 93…Input receiving unit; 100…Object; 100T…Sample; AC…Camera.

Claims

1. A laser processing apparatus, wherein is a laser processing apparatus for forming a modified region along a line in an object provided with a plurality of lines extending along a first direction and arranged along a second direction intersecting the first direction by irradiating a laser along the line to the object, comprising: a support portion for supporting the object; a first laser processing head and a second laser processing head for irradiating the laser to the object supported by the support portion; a first moving mechanism for moving the first laser processing head and the second laser processing head along the first direction and the second direction, respectively; and a control portion for controlling at least irradiation of the laser from the first laser processing head and the second laser processing head and movement of the first laser processing head and the second laser processing head by the first moving mechanism, the first moving mechanism includes: a first moving portion extending along the first direction and having the first laser processing head mounted thereon for moving the first laser processing head along the first direction; a second moving portion extending along the first direction and having the second laser processing head mounted thereon for moving the second laser processing head along the first direction; and a third moving portion extending along the second direction and having the first moving portion and the second moving portion mounted thereon for moving the first moving portion and the second moving portion along the second direction, respectively, the control portion performs: an acquisition process of acquiring an offset amount from a reference line along the first direction to the second direction of a second moving line indicating movement of the second laser processing head along the first direction by the second moving mechanism; and an irradiation process of irradiating the laser along the line to the object by controlling the second moving portion so as to move the second laser processing head along the first direction after the acquisition process in a state where the laser is at least output from the second laser processing head, in the irradiation process, the control portion moves the second laser processing head to the second direction by the offset amount by control of the third moving portion and moves the second laser processing head to the first direction by control of the second moving portion.

2. The laser processing apparatus according to claim 1, wherein in the acquisition process, the control portion performs: a first formation process of forming a first processing line as a first moving line indicating movement of the first laser processing head along the first direction by the first moving portion by outputting the laser from the first laser processing head while moving the first laser processing head along the first direction by control of the first moving portion to the sample supported by the support portion in a state where a sample for acquiring the offset amount is supported by the support portion, and irradiating the laser along the first direction to the sample, and the first processing line is formed on the sample by processing traces of the laser. ​ a second forming process in which, while the sample is supported by the support section, a second laser beam is output from the second laser processing head, the second laser processing head is moved along the first direction by the control of the second moving section, and the sample is irradiated with the laser beam along the first direction, thereby forming a second processed line as the second movement line in the sample by a processed trace of the laser beam; an offset amount acquisition process in which, based on a comparison between the first processed line and the second processed line, the offset amount is acquired in which the first processed line is the reference line.

3. The laser processing apparatus according to claim 1, wherein a second moving mechanism for moving the support section along the first direction and rotating the support section around a rotation axis along a third direction intersecting the first direction and the second direction is further provided, the control section, before the irradiation process, performs an alignment process in which the support section is rotated so as to coincide with a first movement line by the control of the second moving mechanism, the first movement line indicating movement of the first laser processing head along the first direction by the first moving section, in the irradiation process, the control section moves the support section along the first direction by the control of the second moving mechanism and moves the first laser processing head and the second laser processing head along the first direction in a direction opposite to the support section by the control of the first moving section and the second moving section, thereby irradiating the object with the laser beam along the line, while the laser beam is output from the first laser processing head and the second laser processing head.

4. The laser processing apparatus according to claim 2, wherein a second moving mechanism for moving the support section along the first direction and rotating the support section around a rotation axis along a third direction intersecting the first direction and the second direction is further provided, the control section, before the irradiation process, performs an alignment process in which the support section is rotated so as to coincide with a first movement line by the control of the second moving mechanism, the first movement line indicating movement of the first laser processing head along the first direction by the first moving section, in the irradiation process, the control section moves the support section along the first direction by the control of the second moving mechanism and moves the first laser processing head and the second laser processing head along the first direction in a direction opposite to the support section by the control of the first moving section and the second moving section, thereby irradiating the object with the laser beam along the line, while the laser beam is output from the first laser processing head and the second laser processing head.

5. The laser processing apparatus according to claim 3, wherein in the first laser processing head and the second laser processing head, an optical fiber for introducing the laser beam output from a light source is connected, The control section causes the speed of the first laser processing head and the second laser processing head in the first direction to be slower than the speed of the support section in the first direction during the irradiation process.

6. The laser processing apparatus according to claim 4, wherein The first laser processing head and the second laser processing head are connected with optical fibers for guiding the laser light output from a light source, The control section causes the speed of the first laser processing head and the second laser processing head in the first direction to be slower than the speed of the support section in the first direction during the irradiation process.

7. The laser processing apparatus according to any one of claims 1 to 6, wherein The first moving mechanism includes a pair of third moving sections arranged opposite to each other in the first direction, The first moving section and the second moving section are supported by the pair of third moving sections.

8. A laser processing apparatus, wherein is a laser processing apparatus for forming a modified region in an object along a plurality of lines arranged in a first direction and a second direction intersecting the first direction by irradiating laser light along the lines, the laser processing apparatus comprising: a support section for supporting the object; a first laser processing head and a second laser processing head for irradiating the laser light to the object supported by the support section; an input receiving section for displaying information and receiving input; and a control section for controlling the input receiving section, The control section performs a display process of displaying information for accepting input for setting at least a part of a processing condition of the object for the laser light from the first laser processing head and a processing condition of the object for the laser light from the second laser processing head independently of each other in the input receiving section, The control section displays information for receiving input of a correction amount of a processing condition of the second laser processing head with respect to a reference when a processing condition of the first laser processing head is the reference in the input receiving section in the display process, Further comprising a first moving mechanism for moving the first laser processing head and the second laser processing head in the first direction and the second direction, respectively, The control section controls movement of the first laser processing head and the second laser processing head by the first moving mechanism, The first moving mechanism includes: a first moving section extending in the first direction and having the first laser processing head mounted thereon for moving the first laser processing head in the first direction; a second moving section extending in the first direction and having the second laser processing head mounted thereon for moving the second laser processing head in the first direction; and a third moving section extending in the second direction and having the first moving section and the second moving section mounted thereon for moving the first moving section and the second moving section in the second direction, respectively, ​ The control section displays, in the display processing, information for receiving input of the correction amount of the offset amount of the second movement line in the second direction from a reference line in the first direction, the second movement line indicating movement of the second laser processing head in the first direction by the second movement section.

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