Chip detection and cleaning equipment using dry ice and snow

Abstract

The present invention provides a chip detection and cleaning device using dry ice and snow, which includes a lower frame, and an upper frame is covered on the lower frame. The upper frame is provided with a human-machine interaction interface and an air purification device for inflating air into the interior of the upper frame; on the opposite sides of the lower frame, a feeding mechanism and a discharging mechanism are provided; on the upper surface of the lower frame, there is a gantry located inside the upper frame and a conveying mechanism. On the gantry, a camera, a preliminary inspection system, a dry ice and snow removal system, and a re-inspection system are sequentially installed from the feeding mechanism to the discharging mechanism direction. Both ends of the conveying mechanism are connected to the feeding mechanism and the discharging mechanism and are used for conveying the chip carrier. The camera, the preliminary inspection system, the dry ice and snow removal system, and the re-inspection system are located above the conveying mechanism. Compared with the existing surface particle removal solutions in the industry, the present invention has high efficiency, can thoroughly remove the particles on the chip surface, and has low failure rate and product damage rate.

Description

Technical Field

[0001] The present invention relates to the technical field of chip surface dust removal equipment, and specifically relates to a chip detection and cleaning equipment using dry ice and snow. Background Art

[0002] The development of semiconductors has increasingly high requirements for dust-free of silicon-based material products such as electronic chips and optical filters. Taking the mobile phone camera as an example, as the demand increases, the resolution is also getting higher and higher. Among them, surface defects of the image sensor (CMOS chip) will restrict the performance of the entire camera module. If there are minor defects (such as dust, dead pixels, etc.) in its image sensor, it will greatly affect the photographing function. For example, a 1um dust can affect the photographing effect of 4-9 pixels around it in some products with 64 million pixels. (Note: The abbreviation of "pixel" is "px", which is a pixel unit and also the basic unit for image display, translated from "pixel".)

[0003] Currently, for the detection of surface defects in the above forms: mainly rely on manual use of a microscope for detection before packaging, and then manual cleaning. However, this method has great difficulty in detecting defects at the um level, and it is necessary to use a magnifying glass with a magnification of 30-40 times to align the imaging to complete the detection work. The detection efficiency is low and the detection accuracy is low, which is difficult to meet the development needs of high-end production lines; currently, a single-station detection platform is used in the industry for detection, with low efficiency, and the equipment needs to return to the previous AOI station for re-inspection during re-inspection, seriously affecting the efficiency.

[0004] In the process of surface particle removal, there are basically the following methods in the industry: using the ion wind suction and blowing method, using a sticky dust rod for dust sticking, and using the red glue method for dust sticking. When using the ion wind suction and blowing, some particles attached to the chip surface cannot be removed. When performing dust sticking treatment, due to the position error between the sticky dust rod and the chip, the sticky dust rod is extremely likely to cause secondary damage and pollution to the chip when descending for dust sticking treatment. And the chip is extremely fragile, and once the surface is subjected to external force, it is easy to break, causing irreversible damage. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: to provide a chip cleaning and detection equipment, which solves the problems that the chip surface cleaning sometimes cannot be thoroughly cleaned, and sometimes is extremely likely to cause secondary damage and pollution to the chip, so as to be highly efficient and capable of thoroughly cleaning the chip surface.

[0006] The technical solution of the present invention to solve the above technical problems is as follows:

[0007] The present invention provides a chip detection and cleaning equipment using dry ice and snow, comprising a lower frame, an upper frame covered on the lower frame, the upper frame being provided with a human-machine interaction interface and an air purification device for inflating air into the upper frame; a loading mechanism and a unloading mechanism are provided on opposite sides of the lower frame; a gantry frame and a conveying mechanism located inside the upper frame are provided on the lower frame, a camera, an initial inspection system, a dry ice and snow removal system, and a re-inspection system are sequentially installed on the gantry frame from the loading mechanism to the unloading mechanism, two ends of the conveying mechanism are connected with the loading mechanism and the unloading mechanism and are used to convey chip carriers, and the camera, the initial inspection system, the dry ice and snow removal system, and the re-inspection system are located above the conveying mechanism.

[0008] The beneficial effects of the present invention are as follows: the present invention utilizes non-toxic and harmless CO2, and produces dry ice snow at low temperature when sprayed. The dry ice snow is flexible and inert, and will not react with the product and will not harm the product. Compared with the existing surface particle removal solutions in the industry, the present invention has high efficiency, can completely remove particles on the chip surface, and has low failure rate and product damage rate. The cleaning effect of the CO2 snow jet when it hits the surface is mainly based on four mechanisms: 1. Imbrittle impurities through rapid cooling (the sublimation point of CO2 snow at atmospheric pressure: 78.5°C); 2. Abrasion through momentum transfer (accelerated CO2 snow crystals transfer pressure and shear force when hitting the surface); 3. Chemical dissolution of impurities such as adsorbed compounds (in the process of CO2 snow crystals hitting the surface, CO2 can be transformed into a supercritical state; in this state, CO2 is a good chemical solvent); 4. When CO2 sublimates from the solid phase to the gas phase, the impurities are thrown away by increasing the volume (about 500 times).

[0009] Furthermore: the dry ice and snow removal system includes a mounting frame installed on the gantry, a nozzle arranged vertically downward and installed on the mounting frame, and a compressed air inlet and a carbon dioxide inlet are provided at the inlet of the nozzle.

[0010] The beneficial effect of adopting this further solution is that a uniform free dry ice snow jet is generated to clean the chip surface with high cleaning efficiency and without causing secondary damage and pollution.

[0011] Furthermore, a dust suction hood is provided around the nozzle, and a dust suction outlet is provided on the dust suction hood.

[0012] The beneficial effect of adopting this further solution is that it is easy to suck out the expanded dry ice snow, so that the gas with impurities can quickly leave the chip and avoid floating to other chips, thereby improving the cleaning efficiency. The dust suction outlet can be used to connect to the outside of the rack or the external fan, and the positive pressure in the rack can be used to quickly suck out the dry ice snow.

[0013] Further, it also includes a control cabinet for controlling the pressure of compressed air and carbon dioxide. The outlet ends of the control cabinet are respectively connected to the compressed air inlet and the carbon dioxide inlet.

[0014] The beneficial effect of adopting this further solution is: convenient centralized control.

[0015] Further: The conveying mechanism includes a first guide rail fixed on the lower frame and facing the feeding mechanism and the discharging mechanism. A first slider is slidably connected to the first guide rail. A second guide rail perpendicular to the first guide rail and horizontally arranged is provided on the first slider. A second slider is slidably connected to the second guide rail. The first slider is connected with a first driving mechanism for driving itself to move along the first guide rail. The second slider is connected with a second driving mechanism for driving itself to move along the second guide rail. A clamping assembly for clamping the chip carrier is provided on the second slider.

[0016] The beneficial effect of adopting this further solution is: realizing the full-plane movement of the chip carrier, being able to directly face the chip detection and defect cleaning, and having high cleaning efficiency.

[0017] Further, the first driving mechanism and the second driving mechanism are linear motors.

[0018] The beneficial effect of adopting this further solution is: small vibration, and the linear motor is provided with a dust-free chain-off for wire routing to prevent dust from being generated inside the frame, with internal cleanliness and avoiding chip contamination.

[0019] Further, the clamping assembly includes a plurality of support shafts and two covers. The support shafts can rotate around their own axes and the axes are perpendicular to the first guide rail. A plurality of support shafts arranged in a row along the extension direction of the first guide rail are provided on both side walls of the second slider parallel to the first guide rail. Covers are respectively provided on both side walls of the second slider parallel to the first guide rail. The upper surface of the second slider between the two covers is used for carrying the chip carrier. A gap for clamping the chip carrier is formed between the inner sides of the top plates of the two covers and the support shafts.

[0020] The beneficial effect of adopting this further solution is: The gap between the edge of the cover and the support shaft is used for placing the chip carrier. The chip carrier is easy to load and unload, and the chip carrier will not move under the action of air flow during dry ice and snow cleaning.

[0021] Further, the clamping assembly further includes a driving shaft and a driving motor. The driving shaft and the driving motor are both installed on the second slider. The driving shaft is perpendicular to the support shaft. The driving shaft is connected to the driving motor through a belt, and the driving shaft is linked with each support shaft.

[0022] The beneficial effect of adopting this further solution is: When the support shaft rotates, the chip carrier can be passed into the gap to assist in loading or passed out of the gap to assist in unloading, and the loading and unloading processes are convenient.

[0023] Furthermore, magnetic wheels that fit each other are provided at the positions on each support shaft that face the drive shaft, and the drive wheel and each support shaft are linked by the magnetic wheels.

[0024] The beneficial effect of adopting this further solution is that: by using magnetic wheels, there is little vibration during transmission and no dust is generated.

[0025] Furthermore, an air extraction pipe is also provided on the second slider. The air extraction pipe communicates with the internal space of the cover from below the cover, and the other end of the air extraction pipe communicates with the outside of the upper frame.

[0026] The beneficial effect of adopting this further solution is that: by utilizing the positive pressure environment inside the frame, the gas inside the cover can be directly introduced outside the frame to prevent dust from being generated by the rotation of the drive motor, drive shaft, etc., keep the internal environment of the frame clean, and prevent secondary pollution to the chip. The air extraction pipe can also be connected to an external air extraction pump to improve the air extraction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of the overall structure of the present invention.

[0028] Figure 2 is the overall layout diagram of the equipment structure of the present invention.

[0029] Figure 3 is an installation schematic diagram of the dry ice and snow removal system.

[0030] Figure 4 is a schematic diagram of the structure of the dry ice and snow removal system.

[0031] Figure 5 is a top view schematic diagram of the conveying mechanism.

[0032] Figure 6 is a front view schematic diagram of the conveying mechanism.

[0033] Figure 7 is a schematic diagram of the structure of the second slider.

[0034] Figure 8 is a schematic diagram of the structure of the clamping assembly.

[0035] In the drawings, the technical features represented by the reference numerals are as follows:

[0036] 1 - Lower frame; 2 - Upper frame; 3 - Loading mechanism; 4 - Unloading mechanism; 5 - Air purification device; 6 - Human - machine interaction interface; 7 - Gantry; 8 - Conveying mechanism; 801 - First guide rail; 802 - First slider; 803 - Second guide rail; 804 - Second slider; 805 - First driving mechanism; 806 - Second driving mechanism; 807 - Clamping assembly; 808 - Support shaft; 809 - Driving shaft; 810 - Driving motor; 811 - Cover; 812 - Magnetic wheel; 813 - Exhaust pipe; 9 - CCD camera; 10 - Initial inspection AOI system; 11 - Dry ice and snow removal system; 111 - Nozzle; 112 - Mounting frame; 113 - Compressed air inlet; 114 - Carbon dioxide inlet; 115 - Dust suction hood; 116 - Dust suction outlet; 117 - Control cabinet; 12 - Re - inspection AOI system; 20 - Chip carrier board. Detailed implementation mode

[0037] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not intended to limit the scope of the present invention.

[0038] Refer to the present invention Figure 1-8 .

[0039] In the first embodiment, as Figure 1-2 shown:

[0040] The present invention provides a chip detection and cleaning device using dry ice and snow, including a lower frame 1, an upper frame 2 is covered on the lower frame 1, the upper frame 2 is provided with a human - machine interaction interface 6 and an air purification device 5 for inflating air into the upper frame 2; on the opposite sides of the lower frame 1, a loading mechanism 3 and an unloading mechanism 4 are provided; on the upper surface of the lower frame 1, there is a gantry 7 located inside the upper frame and a conveying mechanism 8. On the gantry 7, a camera 9, an initial inspection system 10, a dry ice and snow removal system 11, and a re - inspection system 12 are sequentially installed from the direction of the loading mechanism 3 to the unloading mechanism 4. The two ends of the conveying mechanism 8 are connected to the loading mechanism 3 and the unloading mechanism 4 and are used for conveying the chip carrier board 20. The camera 9, the initial inspection system 10, the dry ice and snow removal system 11, and the re - inspection system 12 are located above the conveying mechanism 8.

[0041] Principle: The loading mechanism 3 is used to supply the chip carrier 20 to the conveying mechanism 8. After detection and cleaning, the conveying mechanism 8 transports the chip carrier 20 to the connection with the unloading mechanism 4, and the unloading structure is used to unload the chip carrier 20 on the conveying mechanism 8. When the conveying mechanism 8 obtains the chip carrier 20, first, it passes through the CCD camera 9. The CCD camera 9 takes pictures to determine the position and coordinates of the chips. Secondly, the conveying mechanism 8 passes through the preliminary inspection AOI system 10, and each chip is successively placed under the preliminary inspection AOI system 10 to detect defects such as dust, stains, fingerprints and their positions. Thirdly, the conveying mechanism 8 passes through the dry ice and snow cleaning system 11. The dry ice and snow cleaning system 11 cleans the chip surface through the snow jet generated when carbon dioxide is ejected. Finally, the conveying mechanism 8 passes through the re-inspection AOI system 12. After detecting that the defects have been cleaned, the conveying mechanism 8 transports the chip carrier 20 to the connection with the unloading mechanism 4.

[0042] Explanation of the above technical features:

[0043] The air purification device 5. In this embodiment, the air purification device 5 is an FFU fan filter unit, which is arranged on the top of the upper frame 2. Its function is to continuously supply clean air to the internal space of the frame, maintain positive pressure inside the frame, prevent external dusty air from entering, and maintain a clean internal environment.

[0044] The camera 9. In this embodiment, a CCD camera 9 is adopted. CCD is the abbreviation of charge coupled device. It can convert light into charge, store and transfer the charge, and can also take out the stored charge to change the voltage. Therefore, it is an ideal CCD camera 9 component. The CCD camera 9 composed of it is widely used because of its small size, light weight, not affected by magnetic field, and characteristics of anti-vibration and impact. Therefore, in the present invention, it can take pictures and obtain the position and coordinates of the chips through software processing.

[0045] The preliminary inspection system 10 and the re-inspection system 12. In this embodiment, they are the same AOI detection system / equipment. The principle of the AOI detection equipment: When automatically detecting, the AOI detection equipment machine automatically scans the product through a CCD high-definition camera, collects images, compares the detected points with the qualified parameters in the database, and through image processing, checks out the defects on the target product and displays / marks the defects through a display or an automatic sign. The general process of the AOI detection equipment is the same, mostly through the pattern recognition method. That is, the standard digital image stored in the AOI system is compared with the actually detected image to obtain the detection result.

[0046] The dry ice snow cleaning system 11, a device for generating a CO2 snow jet, a CO2 dry ice snow system, such a device has been proven in practice to be useful for gently cleaning surfaces before a painting or coating process, such as the surface of a workpiece or a functional surface in the semiconductor industry and medical technology. In particular, surface cleaning by means of a CO2 snow jet (so-called "CO2 snow beam") enables the dry (water-free), solvent-free and residue-free removal of film or particulate contaminants (such as dust, ablation residues, cutting emulsion residues, fingerprints, etc.).

[0047] Loading mechanism 3, unloading mechanism 4: The patent document authorized and announced on September 8, 2020: CN211443926U - a pipeline transfer device that can realize online and offline switching, which can be used as the loading mechanism 3 and unloading mechanism 4 of the present application. Those skilled in the art can understand its specific combination method through the content recorded in the present application and this patent document. It should be noted that the technical problem to be solved by the present application is to achieve thorough cleaning during chip surface cleaning without causing secondary damage and pollution. Therefore, the specific loading and unloading methods are not necessary to be described in the present application. Those skilled in the art can easily understand that other existing methods can also be used for loading and unloading, such as manual loading and unloading.

[0048] The beneficial effects of adopting the present invention are as follows: The present invention utilizes the non-toxic and harmless property of CO2. When it is ejected, it generates dry ice snow at a low temperature. The dry ice snow is flexible and inert, and will not react with the product and will not damage the product. Compared with the existing surface particle removal solutions in the industry, the present invention has high efficiency, can thoroughly remove the particles on the chip surface, and has a low failure rate and product damage rate. The cleaning effect of the CO2 snow jet when hitting the surface is mainly based on four action mechanisms: 1. Brittle the impurities by rapid cooling (the sublimation point of CO2 snow at atmospheric pressure: 78.5 °C); 2. Abrasion through momentum transfer (the accelerated CO2 snow crystals transfer pressure and shear force when hitting the surface); 3. Chemical dissolution of impurities such as adsorbed compounds (during the process of CO2 snow crystals hitting the surface, CO2 can be transformed into a supercritical state; in this state, CO2 is a good chemical solvent); 4. When CO2 sublimes from the solid phase to the gas phase, the impurities are thrown off by the volume increase (about 500 times).

[0049] Example 2, as Figure 3-4 shown:

[0050] In the above embodiments, further:

[0051] The dry ice snow cleaning system 11 includes a mounting frame 112 installed on the gantry 7, and a nozzle 111 vertically arranged and installed on the mounting frame 112. A compressed air inlet 113 and a carbon dioxide inlet 114 are provided at the inlet of the nozzle 111.

[0052] Principle: Liquid CO2 is converted into compact solid CO2 snow particles with a diameter of 1 to 100 μm through a thermodynamic process. The temperature of these CO2 snow particles from dry ice is -78.5 °C. The carbon dioxide snow particles are added to the compressed air, and the particles are accelerated by the compressed air flow in the nozzle 111. Under the conditions of constant flow rate, temperature and pressure, a uniform free jet can be generated. Depending on the nozzle 111, a circular jet with cleaning ability (circular nozzle 111) or a flat jet with a width of up to 45 mm and uniform cleaning performance (flat nozzle 111) can be generated. This free jet can be used for cleaning and pre-treating the surface of workpieces.

[0053] The beneficial effect of adopting this further solution is that a uniform free dry ice snow jet is generated for cleaning the surface of the chip, with high cleaning efficiency and no secondary damage and pollution.

[0054] Further, a dust suction hood 115 is also provided around the nozzle 111, and a dust suction outlet 116 is provided on the dust suction hood 115.

[0055] The beneficial effect of adopting this further solution is that it is convenient to suck out the expanded dry ice snow, enabling the gas with attached impurities to quickly leave the chip and preventing it from floating onto other chips, improving the cleaning efficiency. The dust suction outlet 116 can be used to connect to the outside of the frame or an external fan, and the positive pressure inside the frame is used to quickly suck out the dry ice snow.

[0056] Further, it also includes a control cabinet 117 for controlling the pressure of compressed air and carbon dioxide. The outlet ends of the control cabinet 117 are respectively connected to the compressed air inlet 113 and the carbon dioxide inlet 114.

[0057] Note: The control cabinet 117 is used to control the pressure of compressed air and carbon dioxide, which is equivalent to concentrating the valves on two pipelines on a cabinet body. In this embodiment, a commercially available valve control cabinet can be used. There must be corresponding inlets and outlets on the control cabinet, and the outlet ends are easily understood by those skilled in the art.

[0058] The beneficial effect of adopting this further solution is that it is convenient for centralized control.

[0059] Embodiment 3, as Figure 5-8 shown:

[0060] In the above embodiments, further:

[0061] The conveying mechanism 8 includes a first guide rail 801 fixed to the lower frame 1 and facing the feeding mechanism 3 and the discharging mechanism 4. A first slider 802 is slidably connected to the first guide rail 801. A second guide rail 803 perpendicular to the first guide rail 801 and horizontally arranged is provided on the first slider 802. A second slider 804 is slidably connected to the second guide rail 803. The first slider 802 is connected to a first driving mechanism 805 that drives itself to move along the first guide rail 801. The second slider 804 is connected to a second driving mechanism 806 that drives itself to move along the second guide rail 803. A clamping assembly 807 for clamping the chip carrier 20 is provided on the second slider 804.

[0062] Principle: Through the first guide rail 801 and the second guide rail 803, the lateral and longitudinal movement of the chip carrier 20 is realized, and each chip can be moved to the lower part of the AOI system for detection respectively, and the defect is directly opposite to the dry ice and snow cleaning system 11. In addition, between the lower frame 1 and the first slider 802, and between the first slider 802 and the second slider 804, a motor screw drive can also be adopted.

[0063] The beneficial effect of adopting this further solution is that the full-plane movement of the chip carrier 20 is realized, the chip detection and defect cleaning can be carried out directly, and the cleaning efficiency is high.

[0064] Further, the first driving mechanism 805 and the second driving mechanism 806 are linear motors.

[0065] The beneficial effect of adopting this further solution is that the vibration is small, and the linear motor is provided with a dust-free chain-off for wire routing to prevent dust from being generated inside the frame, the inside is clean, and the chips are avoided from being polluted.

[0066] Further, the clamping assembly 807 includes a plurality of support shafts 808 and two covers 811. The support shafts 808 can rotate around their own axes and the axes are perpendicular to the first guide rail 801. A plurality of support shafts 808 arranged in a row along the extending direction of the first guide rail 801 are provided on both side walls of the second slider 804 parallel to the first guide rail 801. Covers 811 are respectively provided on both side walls of the second slider 804 parallel to the first guide rail 801. The upper surface of the second slider 804 between the two covers 811 is used to carry the chip carrier 20. A gap for clamping the chip carrier 20 is formed between the inner sides of the top plates of the two covers 811 and the support shafts 808.

[0067] The beneficial effect of adopting this further solution is that the gap between the edge of the cover 811 and the support shaft 808 is used to place the chip carrier 20. The chip carrier 20 is easy to be loaded and unloaded, and the chip carrier 20 will not move under the action of the air flow during the dry ice and snow cleaning.

[0068] Further, the clamping assembly 807 further includes a drive shaft 809 and a drive motor 810. Both the drive shaft 809 and the drive motor 810 are installed on the second slider 804. The drive shaft 809 is perpendicular to the support shaft 808. The drive shaft 809 is connected to the drive motor 810 by a belt, and the drive shaft 809 is linked with each support shaft 808.

[0069] The beneficial effect of adopting this further solution is that when the support shaft 808 rotates, the chip carrier 20 can be introduced into the gap to assist in feeding or withdrawn from the gap to assist in discharging, and the feeding and discharging processes are convenient.

[0070] Further, magnetic wheels 812 that fit each other are provided at the parts of each support shaft 808 facing the drive shaft 809. The drive wheel is linked with each support shaft 808 through the magnetic wheels 812.

[0071] The beneficial effect of adopting this further solution is that by using the magnetic wheels 812, there is little vibration during transmission and no dust is generated.

[0072] Further, an air extraction pipe 813 is also provided on the second slider 804. The air extraction pipe 813 communicates with the internal space of the cover 811 below the cover 811, and the other end of the air extraction pipe 813 communicates with the outside of the upper frame 2.

[0073] The beneficial effect of adopting this further solution is that by utilizing the positive pressure environment inside the frame, the gas in the cover 811 can be directly introduced outside the frame, preventing the rotation of the drive motor 810, the drive shaft 809, etc. from generating dust, keeping the internal environment of the frame clean, and preventing secondary pollution to the chips. The air extraction pipe 813 can also be connected to an external air extraction pump to improve the air extraction efficiency.

[0074] In the description of the present invention, it should be understood that if descriptive terms indicating orientation, direction or positional relationship appear, such as: "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated in this specification is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of understanding the present invention and simplifying the description, rather than indicating or implying that the part, component or whole referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0075] In addition, if ordinal description terms such as "first", "second", etc. appear, their use in this specification is for the convenience of understanding or simplifying the description. For example, in order to distinguish multiple technical features of the same type or function and when it is necessary to mention them separately, this specification may use the method of prefixing or suffixing ordinal description terms to distinguish them. Therefore, it should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0076] In the present invention, if relative structure-function relationship description terms such as "installed", "connected", "joined", "fixed", etc. are used, unless otherwise clearly specified and defined, they should be understood in a broad sense. For example, "installed", "connected", "joined", etc. can be a fixed connection, a detachable connection, or integrated; can be a mechanical connection, an electrical connection; can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components; "fixed" can be a fixed connection formed integrally, or a detachable fixation through fasteners; can be directly fixed, or fixed through an intermediate medium. For those of ordinary skill in the art, the specific meaning of the above description terms in the present invention can be understood according to the specific circumstances, the context, the coherence of the context before and after, etc.

[0077] In the present invention, if description terms with an affiliated or connecting meaning appear, for example, the first feature is "on" or "under" the second feature, unless otherwise clearly specified and defined, it should not be understood in a restrictive sense. For example, "on" or "under" can be that the first and second features are in direct contact, or the first feature and the second feature are in indirect contact through an intermediate medium. For those of ordinary skill in the art, the specific meaning of the above description terms in the present invention can be understood according to the specific circumstances, the context, the coherence of the context before and after, etc.

[0078] Furthermore, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature is at a higher level than the second feature in terms of horizontal height. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature is at a lower level than the second feature in terms of horizontal height.

[0079] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments, examples, and the features of different embodiments and examples described in this specification, and these combinations or combinations should fall within the scope summarized by the present invention.

[0080] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of information available through their public channels and in combination with the technical revelations given in this application document.

Claims

1. A chip detection and cleaning device using dry ice and snow, characterized in that: It includes a lower frame (1), and an upper frame (2) covers the lower frame (1). The upper frame (2) is provided with a human-machine interaction interface (6) and an air purification device (5) for inflating air into the interior of the upper frame (2). Opposite sides of the lower frame (1) are provided with a loading mechanism (3) and a unloading mechanism (4). On the upper surface of the lower frame (1), there is a gantry (7) located inside the upper frame and a conveying mechanism (8). On the gantry (7), a camera (9), a preliminary inspection system (10), a dry ice and snow removal system (11), and a re-inspection system (12) are sequentially installed in the direction from the loading mechanism (3) to the unloading mechanism (4). Both ends of the conveying mechanism (8) are connected to the loading mechanism (3) and the unloading mechanism (4) and are used for conveying the chip carrier (20). The camera (9), the preliminary inspection system (10), the dry ice and snow removal system (11), and the re-inspection system (12) are located above the conveying mechanism (8). The conveying mechanism (8) includes a first guide rail (801) fixed to the lower frame (1) and facing the loading mechanism (3) and the unloading mechanism (4). A first slider (802) is slidably connected to the first guide rail (801). A second guide rail (803) perpendicular to the first guide rail (801) and horizontally arranged is provided on the first slider (802). A second slider (804) is slidably connected to the second guide rail (803). The first slider (802) is connected to a first driving mechanism (805) for driving itself to move along the first guide rail (801). The second slider (804) is connected to a second driving mechanism (806) for driving itself to move along the second guide rail (803). A clamping assembly (807) for clamping the chip carrier (20) is provided on the second slider (804). The first driving mechanism (805) and the second driving mechanism (806) are linear motors. The clamping assembly (807) includes a plurality of support shafts (808) and two covers (811). The support shafts (808) can rotate around their own axes and the axes are arranged perpendicular to the first guide rail (801). A plurality of support shafts (808) arranged in a row along the extending direction of the first guide rail (801) are provided on both side walls of the second slider (804) parallel to the first guide rail (801). Covers (811) are respectively provided on both side walls of the second slider (804) parallel to the first guide rail (801). The upper surface of the second slider (804) between the two covers (811) is used for carrying the chip carrier (20). A gap for clamping the chip carrier (20) is formed between the inner sides of the top plates of the two covers (811) and the support shafts (808).

2. The chip detection and cleaning device using dry ice snow according to claim 1, characterized in that: The dry ice and snow removal system (11) includes a mounting bracket (112) mounted on the gantry (7), and a nozzle (111) vertically arranged and mounted on the mounting bracket (112). A compressed air inlet (113) and a carbon dioxide inlet (114) are provided at the inlet of the nozzle (111).

3. The chip detection and cleaning device using dry ice snow according to claim 2, characterized in that: A dust suction hood (115) is further provided around the nozzle (111), and a dust suction outlet (116) is provided on the dust suction hood (115).

4. The chip detection and cleaning device using dry ice snow according to claim 2, characterized in that: It further includes a control cabinet (117) for controlling the compressed air pressure and the carbon dioxide pressure. The outlet ends of the control cabinet (117) are respectively connected to the compressed air inlet (113) and the carbon dioxide inlet (114).

5. The chip detection and cleaning device using dry ice snow according to claim 1, characterized in that: The clamping assembly (807) further includes a drive shaft (809) and a drive motor (810). Both the drive shaft (809) and the drive motor (810) are installed on the second slider (804). The drive shaft (809) is perpendicular to the support shaft (808). The drive shaft (809) is connected to the drive motor (810) by a belt, and the drive shaft (809) is linked with each support shaft (808).

6. The chip detection and cleaning equipment using dry ice snow according to claim 5, characterized in that: Each support shaft (808) is provided with magnetic wheels (812) at the parts facing the drive shaft (809) that fit with each other. The drive wheel is linked with each support shaft (808) through the magnetic wheels (812).

7. The chip detection and cleaning device using dry ice snow according to claim 1, characterized in that: An air extraction pipe (813) is further provided on the second slider (804). The air extraction pipe (813) communicates with the internal space of the cover (811) from below the cover (811), and the other end of the air extraction pipe (813) communicates with the outside of the upper frame (2).

Images