Test kit for testing the device under test

Abstract

This invention discloses a test kit for testing a device under test (DUT), comprising: a socket structure for accommodating the DUT; and a plunger assembly detachably connected to the socket structure, wherein the plunger assembly includes a multi-layer structure, the multi-layer structure including at least one interlayer substrate sandwiched between a top socket and a base. The test kit of this invention utilizes the interlayer substrate to connect to the DUT, so that signals emitted by the DUT can be looped back onto the interlayer substrate after transmission, and then down-converted to a test radio frequency (RF) signal. This allows for testing of high-frequency RF signals, resulting in a simpler test circuit structure, shorter signal path, lower loss, and higher accuracy of test results.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a test kit for testing devices under test. Background Technology

[0002] Millimeter wave (mmW) communication systems have generated significant interest in meeting the capacity requirements of 5G networks. Transmitting in the millimeter wave band places high demands on test electronics to ensure the proper functioning of both transmitting and receiving circuits. To check the electrical characteristics of the device under test (DUT), the DUT is stably electrically connected to the test equipment. Typically, test sockets are used as the tool to electrically connect the DUT and the test equipment.

[0003] Current test systems suffer from drawbacks including long test times and large physical dimensions. Furthermore, it is difficult to test device-under-the-machine (DUT) systems capable of transmitting mmW signals at both the bottom and top of the device because conventional plastic plungers designed for picking up and placing the DUT in the socket cannot capture or transmit mmW signals. Therefore, a reliable and cost-effective test system is needed for high-volume testing of millimeter-wave devices. Summary of the Invention

[0004] In view of this, the present invention provides a test kit for testing a device under test to solve the above problems.

[0005] According to a first aspect of the present invention, a test kit for testing a device under test is disclosed, comprising:

[0006] A socket structure for accommodating the device under test; and

[0007] A plunger assembly detachably connected to the socket structure, wherein the plunger assembly includes a multi-layer structure including at least one intermediate layer substrate sandwiched between a top socket and a seat.

[0008] According to a second aspect of the present invention, a test kit for testing a device under test is disclosed, comprising:

[0009] A socket structure for accommodating the device under test; and

[0010] A plunger assembly detachably coupled to the socket structure, wherein the plunger assembly includes a multi-layer structure including a top socket, an intermediate layer substrate mounted at least on the top socket, a seat, and a reflector disposed between the intermediate layer substrate and the seat.

[0011] The test kit for testing a device under test (DUT) of the present invention comprises: a receptacle structure for accommodating the DUT; and a plunger assembly detachably connected to the receptacle structure, wherein the plunger assembly includes a multilayer structure comprising at least one interlayer substrate sandwiched between a top receptacle and a base. The test kit of the present invention utilizes the interlayer substrate to connect to the DUT, allowing signals emitted by the DUT to be looped back onto the interlayer substrate after transmission, and then down-converted to a test radio frequency (RF) signal. This enables testing of high-frequency RF signals, resulting in a simpler test circuit structure, shorter signal path, lower loss, and higher accuracy of test results. Attached Figure Description

[0012] Figure 1 This is a cross-sectional schematic diagram of a test kit for testing a device under test (DUT) according to an embodiment of the present invention.

[0013] Figure 2 According to an embodiment of the present invention Figure 1 A schematic side view of the plunger assembly.

[0014] Figure 3 yes Figure 2 Exploded view of the center plunger assembly.

[0015] Figure 4 This is a partial layout of the pogo pin and a partial cross-sectional view of the top socket according to an embodiment of the present invention.

[0016] Figure 5 Various types of top sockets applicable to different types of DUTs are shown according to some embodiments of the present invention;

[0017] Figure 6 This is a schematic diagram of a test kit for testing a device under test, according to another embodiment of the present invention.

[0018] Figure 7 This is a schematic diagram of a test kit for testing a device under test (DUT) according to another embodiment of the present invention.

[0019] Figure 8 This is a schematic diagram of a test kit for testing a device under test (DUT) according to yet another embodiment of the present invention. Detailed Implementation

[0020] In the following detailed description of embodiments of the invention, reference is made to the accompanying drawings, which form part of the invention, and which illustrate specific preferred embodiments in which the invention can be practiced. These embodiments have been described in sufficient detail to enable those skilled in the art to practice them, and it should be understood that other embodiments may be utilized, and mechanical, structural, and procedural changes may be made, without departing from the spirit and scope of the invention. Therefore, the following detailed description should not be construed as limiting, and the scope of the embodiments of the invention is defined only by the appended claims.

[0021] It will be understood that although the terms “first,” “second,” “third,” “primary,” “secondary,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another. Therefore, without departing from the teachings of the inventive concept, the first or primary element, component, region, layer, or portion discussed below may be referred to as a second or secondary element, component, region, layer, or portion.

[0022] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “under,” “above,” and “above” may be used herein to describe the relationship of an element or feature to it. Another element or feature is shown in the figure. In addition to the orientation described in the figure, the spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly. Additionally, it will be understood that when a “layer” is referred to as being “between” two layers, it can be the only layer between the two layers, or there may be one or more intermediate layers.

[0023] The terms “about,” “roughly,” and “about” generally mean a range of ±20%, ±10%, ±5%, ±3%, ±2%, ±1%, or ±0.5% of a specified value. The specified values ​​in this invention are approximate. Unless otherwise specified, the specified values ​​include the meanings of “about,” “roughly,” and “about.” The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the singular terms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise.

[0024] It will be understood that when an “element” or “layer” is referred to as being “on,” “connected to,” “coupled to,” or “adjacent to” another element or layer, it can be directly on, connected to, coupled to, or adjacent to the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being “directly on,” “directly connected to,” “directly coupled to,” or “immediately adjacent to” another element or layer, there are no intermediate elements or layers.

[0025] Note: (i) the same features will be represented by the same reference numerals throughout the figures and will not necessarily be described in detail in every figure in which they appear, and (ii) a series of figures may show different aspects of a single item, each of which is associated with various reference labels that may appear throughout the series or only in selected figures of the series.

[0026] Wireless microelectronic devices typically undergo a variety of tests to ensure adequate performance and verify their radio frequency (RF) functionality. Some tests are mandated by standards, while others are performed as part of product development and validation. When an RF signal is transmitted from a transmitter to a receiver, it propagates along one or more paths in the radio channel, each with different angles of arrival, signal delay, polarization, and power. This results in fading signals of varying durations and intensities received. Furthermore, noise and interference from other transmitters can disrupt the radio connection.

[0027] This invention relates to a wireless test system for testing microelectronic devices or modules. Embodiments of the invention address improvements to test kits for holding and / or testing a device under test (DUT). For example, a method for testing a DUT may include setting the DUT to a simultaneous transmit and receive mode; receiving a lower frequency radio frequency (RF) signal from a test unit; up-converting the lower frequency RF signal to a higher frequency RF signal; transmitting the high-frequency RF signal from the DUT to circuitry on an interposer substrate via a top socket; receiving a higher frequency RF signal via the top socket and the DUT; down-converting the received higher frequency RF signal to a received test RF signal; and providing the received test RF signal to the test unit.

[0028] DUT is a term generally used to refer to any electronic device or module undergoing any test. In semiconductor testing, the DUT is typically inserted into a test socket connected to automatic test equipment (ATE). ATE is widely used in manufacturing to test various types of semiconductor devices, such as packaged or unpackaged integrated circuit (IC) devices, antenna-in modules (AIMs), printed circuit boards (PCBs), etc.

[0029] This invention is particularly applicable to radiation testing of radio frequency microelectronic devices or device-under-the-systems (DUTs) that can be driven and / or sensed by radio frequency transmitter and / or receiver circuitry, and can operate in, for example, the 20 GHz to 300 GHz (millimeter-wave frequency), such as in the frequency bands around 24 GHz, 60 GHz, 77 GHz, or 79 GHz, but is not limited thereto. Various circuits and components can be provided on the interposer substrate to achieve millimeter-wave signal loopback, depending on design requirements. This invention not only reduces transmission path length to avoid excessive loss but also achieves mmW signal loopback technology over a limited area.

[0030] Please see Figure 1 . Figure 1 This is a cross-sectional schematic diagram of a test kit for a device under test according to an embodiment of the present invention. Figure 1As shown, test kit 1a includes a receptacle structure 10 and a plunger assembly 20 detachably connected to the receptacle structure 10. According to an embodiment of the invention, the receptacle structure 10 may include a receptacle housing 100 fixed to a load board 30 (the load board 30 may include, for example, a printed circuit board or printed circuit board). The load board 30 may also be referred to as a test board. Although not explicitly depicted, it should be understood that the load board 30 typically includes a core (e.g., an FR4 copper-clad laminate core), multiple dielectric stack layers, and traces on opposite surfaces of the core. Traces on different layers of the load board 30 (printed circuit board) may be electrically connected to each other via plated vias or plated through-holes. Circuitry on the load board 30 may be electrically connected to a test unit (not shown) including a signal generator configured to generate test signals.

[0031] According to one embodiment of the invention, the load board 30 may contain custom (or custom-designed) circuitry specifically for testing a particular DUT. For example, the load board 30 may be a custom (or custom-designed) RF load board that has been specifically modified for the radiation, electrical, and physical characteristics of a particular DUT. According to embodiments of the invention, the load board 30 may, for example, be electrically connected to RF instrument circuitry via RF cables and / or connectors. It is understood that the load board 30 may also be connected to a DC power supply, ground, digital inputs / outputs, and / or a computer, which are not shown in the figures for simplicity. For example, in Figure 1 In this configuration, the load board includes a printed circuit board (PCB) with a DUT side 30a and a non-DUT side 30b. The DUT 130 can be inserted into a socket structure 10 on the DUT side 30a. One or more RF connectors 310 are accessible on the non-DUT side 30b, and an RF cable 320 can be connected to these RF connectors 310. Each RF connector 310 provides an RF connection to the tester.

[0032] According to an embodiment of the present invention, the socket housing 100 may be made of a monolithic anti-static material (monolithic anti-static material can refer to an integrally molded part), including but not limited to durable high-performance polyimide-based plastics, such as SP1+ (DuPont). TMThe dielectric constant (Dk) is approximately 3.5, but is not limited thereto. According to one embodiment of the invention, the socket housing 100 may include a plate-shaped base portion 101 integrated with a pin assembly PN, which includes, but is not limited to, spring pins P1, conductive pins P2, and conductive pins P3. Conductive pins P2 and P3 can extend from the socket housing 100 and pass through corresponding through-holes formed in the base portion 101 to transmit signals. According to an embodiment of the invention, the base portion 101 serves as an interface between the load board 30 and the DUT 130. According to an embodiment of the invention, the pin assembly PN may include at least two different types and lengths of spring pins. The socket housing 100 being a single, integrally formed part can improve the mechanical strength of the test kit structure and reduce signal leakage and loss.

[0033] According to an embodiment of the invention, the socket housing 100 may include an annular peripheral structure 102 surrounding the base portion 101, thereby forming a cavity 110 defined by the inner sidewall of the annular peripheral structure 102 and the upper surface of the base portion 101. According to one embodiment of the invention, the annular peripheral structure 102 is integrally formed with the base portion 101. According to one embodiment of the invention, the thickness of the annular peripheral structure 102 is greater than the thickness of the base portion 101. According to another embodiment of the invention, the socket housing 100 may be in direct contact with the load plate 30. However, when the socket housing 100 overlaps with any high-frequency signal traces on the load plate 30, the socket housing 100 may be partially removed, i.e., the socket housing 100 may be moved according to the wiring on the load plate 30. According to one embodiment of the invention, an electrically floating guide plate (or guide plate) 120 for guiding and adjusting the position and / or rotation angle of the DUT 130 may be suitably mounted within the cavity 110. The guide plate 120 may be in direct contact with the socket housing 100.

[0034] According to embodiments of the present invention, the conductor 120 may be made of a monolithic electrostatic discharge (ESD) control material or an electrostatic dissipation material to prevent the DUT 130 from being damaged under high electrostatic voltage during testing. For example, the aforementioned ESD control material or electrostatic dissipation material may include, but is not limited to, plastics based on polyetheretherketone (PEEK), such as EKH-SS11 with a dielectric constant of approximately 5.3. Electrostatic dissipative materials are defined as having a 1x10⁻⁶ ohm capacity as defined by the International Electrotechnical Commission (IEC) 61340-5-1. 5 Ohms to 1x10 11 Materials with ohmic surface resistance (SR). Static dissipative materials are difficult to charge and have low charge transfer rates, making them ideal for ESD-sensitive applications. The conductor 120 is a single, integrally molded component, which improves the mechanical strength of the test kit structure and reduces signal leakage and loss.

[0035] The socket structure 10 may further include an annular socket base 150 for precise plunger alignment (precise alignment with the plunger assembly 20). According to one embodiment of the invention, the socket base 150 is mounted and secured to the upper surface 102S of the annular peripheral structure 102 of the socket housing 100. According to one embodiment of the invention, the socket base 150 includes a central through-hole 150p allowing the DUT 130 to pass through, and a lower portion of the plunger assembly 20, which vacuum-clamps the DUT 130 and places it into a test position on the socket structure 10. According to an embodiment of the invention, the socket base 150 may include an inner portion 151 surrounding the upper surface 102S of the annular peripheral structure 102 of the socket housing 100. According to an embodiment of the invention, the socket base 150 may be made of a monolithic antistatic material, including but not limited to antistatic FR4 with a dielectric constant of approximately 4.37, but not limited thereto. According to an embodiment of the invention, the socket base 150 may include an absorbing material to avoid or mitigate signal coupling. The socket base 150 is a one-piece molded component, which improves the mechanical strength of the test kit structure and reduces signal leakage and loss.

[0036] Please also refer to Figure 2 and Figure 3 . Figure 2 This is one embodiment of the present invention. Figure 1 A side view of the plunger assembly. Figure 3 yes Figure 2 Exploded view of the center plunger assembly. (See diagram below.) Figure 2 and Figure 3 As shown, and briefly referenced. Figure 1 The plunger assembly 20 typically includes a multi-layered structure, including but not limited to a top socket 210, an insertion substrate (intermediate substrate) 220, a nest (seat) 230, and a pressing member 240. The insertion substrate (intermediate substrate) 220 is sandwiched between the top socket 210 and the nest 230.

[0037] The top socket 210 provides high-precision positioning capability when picking up the DUT 130. For example... Figure 1 As shown, the top socket 210 is embedded with multiple metal spring pins P4 for mechanically and electrically connecting the contact pads on the DUT 130 to the interposer substrate 220. The top socket 210 helps ensure that the contact pads on both sides of the DUT 130 make precise contact with the spring pins P1-P3 and P4, respectively. In this embodiment, the test kit is connected to the DUT 130 using the interposer substrate 220 and the spring pins P4. This allows the mmW signal emitted by the DUT 130 to be looped back onto the interposer substrate 220 after transmission, and then down-converted to a test RF signal. This enables testing of high-frequency RF signals, resulting in a simpler test circuit structure, shorter signal path, lower loss, and higher accuracy of test results.

[0038] Please also refer to Figure 4 . Figure 4 The partial layout of the spring pin P4 and a partial cross-sectional view of the top socket 210 are shown. At least one RF signal pin P4S is surrounded by multiple ground pins P4G. For example, in Figure 4 In this configuration, one RF signal pin P4S is surrounded by five ground pins P4G. The ground pins P4G can contact the ground plane GP of the DUT 130's circuit board or substrate, or be electrically connected to the corresponding solder ball SB of the ground plane GP. This configuration improves the isolation between two adjacent RF signal pins P4S. Furthermore, the size and position of the pogo pins P4 can be adjusted to achieve good impedance control without altering the package ball map. Please also refer to... Figure 5 . Figure 5 Various types of top sockets applicable to different types of DUTs are shown according to some embodiments of the present invention, wherein the same layers, elements, or areas are represented by the same numerical designation or label. Top socket 210 can be easily modified to accommodate different configurations of DUT 130, such as different types of antenna-in-package (AiP) operating at mmW frequencies. Furthermore, in the embodiments of the present invention, only the top socket needs to be modified accordingly for different types of DUTs; therefore, the test kits of the embodiments of the present invention offer high design flexibility and broad applicability.

[0039] According to one embodiment of the present invention, the interposer substrate (interposer substrate or insertion substrate) 220 may be a printed circuit board including signal traces or test circuitry, which provides mmW signal loopback during testing. The mmW signal loops back in a relatively short signal transmission path between the transmitter and receiver of the DUT 130 without needing to extend the signal to the test instrument or load board 30, thereby reducing transition losses, parasitic effects, and improving mmW signal performance. Depending on design requirements, different digital and / or analog and / or RF circuit layouts and different components may be provided on the interposer substrate 220. For example, the interposer substrate 220 may include coupler circuitry for coupling signals or changing the signal power ratio, attenuator circuitry for increasing isolation, voltage divider circuitry for reducing port counts, and / or terminator circuitry for reducing signal reflections, but is not limited thereto.

[0040] By combining the insertion substrate (intermediate substrate) 220 between the top socket 210 and the nest (or seat) 230 of the plunger assembly 20, the tolerance of the circuit lines can be reduced, excessive loss at mmW frequency can be avoided (due to the shorter length of the signal transmission path), and the testing costs, including test instruments and test components, can be reduced.

[0041] According to embodiments of the present invention, the nest (or base) 230 may be made of ESD control material or electrostatic dissipative material, including but not limited to PEEK having a dielectric constant of approximately 3.3, but not limited thereto. According to one embodiment of the present invention, the base 230 has an upper side 230a and a lower side 230b. During testing, the lower side 230b of the base 230 engages with and directly contacts the inner portion 151 of the socket base 150. According to embodiments of the present invention, the base 230 may include an absorbing material to avoid or mitigate signal coupling.

[0042] According to an embodiment of the invention, the pressing member 240 may be coupled to the upper side 230a of the nest (or seat) 230. According to an embodiment of the invention, the pressing member 240 may be made of metal, but is not limited thereto. The pressing member 240 locks the seat 230 to accommodate the kit part. According to one embodiment of the invention, the pressing member 240 may be mechanically connected to a robotic arm or automated processor H. The automated processor H associated with the ATE system may move the DUT 130 from the shipping tray (not shown) to the socket structure 10 mounted on the load plate 30.

[0043] According to one embodiment of the invention, the housing 230 is coupled to at least one suction nozzle 250 for vacuum clamping and / or holding (retaining) the DUT 130 in a guide plate 120 mounted in the socket housing 100. For illustrative purposes, Figure 1 Two suction nozzles 250 are shown. The two suction nozzles 250 protrude from the bottom surface of the nest (or base) 230 and insert into corresponding holes in the lower insertion substrate (intermediate layer substrate) 220 and the top socket 210. The nest (or base) 230 is also coupled to two alignment pins PA, which protrude diagonally from the bottom surface of the base 230 and insert into corresponding holes in the lower intermediate layer substrate 220 and the top socket 210. During testing, as... Figure 1 As shown, the locating pin PA is inserted into the corresponding locating hole in the socket housing 100. According to one embodiment of the invention, for example, the nozzle 250 may be made of an ESD control material or an electrostatic dissipation material, including but not limited to, a dielectric constant of approximately 5.63ESD420, but not limited thereto. According to an embodiment of the invention, the nozzle 250 can be used to pick up the DUT 130 and place the DUT 130 in the socket structure 10. According to an embodiment of the invention, the nozzle 250 can be used to press the DUT 130 into place during testing. According to an embodiment of the invention, the nozzle 250 can be used to provide factor tuning with different shapes and sizes.

[0044] According to one embodiment of the invention, the nozzle 250 may communicate with a connecting cavity (or connecting chamber) 230c between the seat 230 and the pressing member 240, the connecting cavity 230c being further connected to the vacuum conduit 220c. According to an embodiment of the invention, for example, a vacuum seal 242, such as a rubber O-ring, may be disposed around the vacuum conduit 240c and a vacuum seal 232, such as a rubber O-ring, may be disposed around the connecting chamber 230c. According to an embodiment of the invention, for example, the vacuum seals 232 and 242 may be made of a heat-resistant material. During testing, the test housing TE is generally defined between the top socket 210 and the guide plate 120. The aforementioned test method for testing the DUT 130 can be implemented within the test housing TE.

[0045] Figure 6 This is a schematic diagram of a test kit for testing a device under test according to another embodiment of the present invention. Figure 6As shown, the plunger assembly 20 of test kit 1b may include multiple interposer substrates 210a to 210c. For example, the interposer substrates 210a to 210c may include different circuits, including coupler circuits for coupling signals or changing the signal power ratio, attenuator circuits for increasing isolation, voltage divider circuits for reducing port distortion, or termination circuits for reducing signal reflection. Therefore, interposer substrates with a multilayer structure (i.e., multiple interposer substrates 210a to 210c) can be used for a wider range of tests, and when different DUTs need to be tested, they can be connected to the appropriate interposer substrates as needed, or the interposer substrates can be freely replaced as required. Therefore, including multiple interposer substrates in the test kit increases the flexibility of the test kit and meets different testing needs.

[0046] Figure 7 This is a schematic diagram of a test kit for testing a device under test according to yet another embodiment of the present invention. Figure 7 As shown, the interposer substrate 220 of the test kit 1c can be electrically connected to the signal analyzer 50 to measure signal performance. Therefore, the test kit of the present invention uses the interposer substrate to receive high-frequency signals and transmits them to the signal analyzer 50 after conversion, thereby realizing the test kit to test high-frequency signals (mmW signals), solving the problem of difficulty in testing the mmW signals of the DUT in the prior art. Furthermore, the test kit of the present invention has a simple design, short signal path, less interference, less signal loss, and more stable and accurate test results.

[0047] Figure 8 This is a schematic diagram illustrating a test kit for testing a DUT according to yet another embodiment of the present invention, wherein the same layers, elements, or areas are represented by the same numerical designations or labels. For example... Figure 8 As shown, similarly, test kit 1d includes a receptacle structure 10 and a plunger assembly 20 detachably coupled to the receptacle structure 10. According to an embodiment of the invention, the receptacle structure 10 may include a receptacle housing 100 fixed to a load board 30, such as a printed circuit board or printed circuit board. The load board may include a PCB having a DUT side 30a and a non-DUT side 30b. The DUT 130 can be inserted into the receptacle structure 10 on the DUT side 30a.

[0048] According to an embodiment of the invention, the socket housing 100 may be made of a single piece of antistatic material, including but not limited to, durable high-performance polyimide-based plastics, such as SP1+(DuPont) having a dielectric constant (Dk) of approximately 3.5. TMHowever, this is not the only possibility. According to one embodiment of the invention, the socket housing 100 may include a plate-shaped base portion 101 integrated with a pin assembly PN, which includes, but is not limited to, spring pins P1, conductive pins P2, and conductive pins P3. Conductive pins P2 and P3 may extend from the socket housing 100 and pass through corresponding through-holes formed in the base portion 101 to transmit signals. According to an embodiment of the invention, the base portion 101 serves as an interface or interface between the load board 30 and the DUT 130. According to an embodiment of the invention, the pin assembly PN may include at least two different types and lengths of spring pins.

[0049] According to an embodiment of the invention, the socket housing 100 may include an annular peripheral structure 102 surrounding the base portion 101, thereby forming a cavity 110 defined by the inner sidewall of the annular peripheral structure 102 and the upper surface of the base portion. According to one embodiment of the invention, the annular peripheral structure 102 is integrally formed with the base portion 101. According to one embodiment of the invention, the thickness of the annular peripheral structure 102 is greater than the thickness of the base portion 101. According to another embodiment of the invention, the socket housing 100 may be in direct contact with the load plate 30. However, when the socket housing 100 overlaps with any high-frequency signal trace, the socket housing 100 may be partially removed from the load plate 30. According to one embodiment of the invention, an electrically floating guide plate 120 for guiding and adjusting the position and / or rotation angle of the DUT 130 may be suitably mounted within the cavity 110. The guide plate 120 may be in direct contact with the socket housing 100.

[0050] According to one embodiment of the invention, the guide plate 120 may be made of a single piece of ESD control material or static dissipation material to prevent damage to the DUT 130 under high electrostatic voltage during testing. For example, the aforementioned ESD control material or static dissipation material may include, but is not limited to, PEEK-based plastics, such as EKH-SS11 with a dielectric constant of approximately 5.3. Electrostatic dissipative materials are defined as 1x10⁻¹⁰ as defined by the International Electrotechnical Commission (IEC) 61340-5-1. 5 Ohms to 1x10 11 Materials with ohmic surface resistance (SR). Static dissipative materials are difficult to charge and have low charge transfer rates, making them ideal for ESD-sensitive applications.

[0051] The receptacle structure 10 may further include an annular receptacle base 150 for precise plunger alignment. According to one embodiment of the invention, the receptacle base 150 is mounted and secured to the upper surface 102S of the annular peripheral structure 102 of the receptacle housing 100. According to one embodiment of the invention, the receptacle base 150 includes a central through-hole 150p allowing the DUT 130 to pass through and a lower portion of a plunger assembly 20 for vacuum clamping the DUT 130 and placing the DUT 130 at a test position on the receptacle structure 10. According to an embodiment of the invention, the receptacle base 150 may include an inner portion 151 surrounding the upper surface 102S of the annular peripheral structure 102 of the receptacle housing 100. According to an embodiment of the invention, the receptacle base 150 may be made of a monolithic antistatic material, including but not limited to, antistatic FR4 with a dielectric constant of approximately 4.37. According to an embodiment of the invention, the receptacle base 150 may include absorber material to avoid or mitigate signal coupling.

[0052] According to one embodiment of the present invention, the plunger assembly 20 typically includes a multi-layer structure, including but not limited to a top socket 210, an adapter substrate (intermediate substrate, intermediate substrate or insert substrate) 220, a nest (or seat) 230, a pressing member 240 and a reflector 270 (disposed between the intermediate substrate 220 and the nest 230).

[0053] According to an embodiment of the present invention, the top socket 210 has high-precision positioning capability when picking up the DUT 130. The top socket 210 embeds a plurality of metal spring pins P4 for mechanical and electrical connection of the contact pads 130 on the DUT to the interposer substrate 220. The top socket 210 helps ensure that the contact pads on both sides of the DUT 130 make precise contact with the spring pins P1-P3 and P4, respectively.

[0054] According to one embodiment of the present invention, the interposer substrate 220 may be a printed circuit board including signal lines or test circuitry. Depending on design requirements, different digital and / or analog and / or RF circuit layouts and different components may be provided on the interposer substrate 220. For example, the interposer substrate 220 may include coupler circuitry for coupling signals or changing the signal power ratio, attenuator circuitry for increasing isolation, voltage divider circuitry for reducing port width, and / or termination circuitry for reducing signal reflection, but is not limited thereto. According to one embodiment of the present invention, the interposer substrate 220 also includes an antenna structure AS on its top side directly facing the reflector 270.

[0055] According to one embodiment of the invention, reflector 270 is fixed to the bottom surface 230b of nest (or base) 230. According to one embodiment of the invention, reflector 270 may be made of metal, metal alloy, or any suitable conductive material. According to one embodiment of the invention, reflector 270 is spaced from interposer substrate 220 by a predetermined distance d. The reflection distance d between the lower surface 270b of reflector 270 and the antenna structure AS of adapter substrate 220 can be adjusted to control received energy and maintain impedance matching. According to one embodiment of the invention, for example, the reflection distance d may preferably be in the range of approximately 0.25λ and multiples of that length (e.g., positive integer multiples), where λ is the wavelength (mm) of the RF signal with the lowest frequency in the operating frequency band. For example, for an RF signal with a frequency of 24.5 GHz, λ is 12.4 mm, so the reflection distance D is between 3.1 mm and 9.3 mm. RF signals can be transmitted from one antenna to an adjacent antenna via reflection from reflector 270, thereby enabling non-conductive loopback testing in plunger assembly 20. Therefore, the test kit in this embodiment uses the antenna structure AS on the interposer substrate 220 to emit and receive signals. This allows RF signals to be tested within the test kit, resulting in a simpler test circuit structure, shorter signal path, lower loss, and higher accuracy of test results.

[0056] According to an embodiment of the invention, similarly, the nest (or seat) 230 may be made of ESD control material or electrostatic dissipative material, including but not limited to PEEK having a dielectric constant of about 3.3, but not limited thereto. According to an embodiment of the invention, the nest (or seat) 230 may include an absorbing material to avoid or mitigate signal coupling. According to an embodiment of the invention, the pressing member 240 may be coupled to the seat 230 using methods known in the art. According to an embodiment of the invention, the pressing member 240 may be made of metal, but is not limited thereto. The pressing member 240 locks the seat 230 to accommodate the kit portion. According to one embodiment of the invention, the seat 230 is connected to at least one nozzle 250 for vacuum clamping and / or holding the DUT 130. The seat 230 is also coupled to two locating pins PA that protrude diagonally from the bottom surface of the seat 230 and insert into corresponding holes in the underlying reflector 270, the interposer substrate 220, and the top socket 210. During testing, as... Figure 1As shown, the locating pin PA is inserted into the corresponding locating hole 100 in the socket housing. According to one embodiment of the invention, for example, the nozzle 250 may be made of ESD control material or static dissipative material, including but not limited to ESD420 having a dielectric constant of approximately 5.63, but not limited thereto. According to one embodiment of the invention, the nozzle 250 can be used to pick up and place the DUT 130 in the socket structure 10. According to one embodiment of the invention, the nozzle 250 can be used to press the DUT 130 into place during testing. According to an embodiment of the invention, the nozzle 250 can be used to provide coupling factor tuning with different shapes and sizes.

[0057] Those skilled in the art will readily observe that many modifications and alterations can be made to the apparatus and method while maintaining the teachings of this invention. Therefore, the foregoing disclosure should be interpreted as being limited only by the scope and limits of the appended claims.

Claims

1. A test kit for testing a device under test, characterized in that, include: A socket structure for accommodating the device under test; as well as A plunger assembly detachably connected to the socket structure, wherein the plunger assembly includes a multi-layer structure including at least one intermediate layer substrate sandwiched between a top socket and a seat. A load plate is mounted on the socket housing of the socket structure, wherein the socket housing is located between the at least one intermediate layer substrate and the load plate, and the location for accommodating the device under test is located between the load plate and the at least one intermediate layer substrate; Multiple first pins are disposed between the load board and the location where the device under test is accommodated, and are directly connected between the load board and the location where the device under test is accommodated; Multiple second pins are disposed between the at least one interposer substrate and the location where the device under test is accommodated, and directly connect the at least one interposer substrate and the location where the device under test is accommodated.

2. The test kit as described in claim 1, characterized in that, The plunger assembly also includes a pressing member connected to the upper side of the seat.

3. The test kit as described in claim 2, characterized in that, The pressing component is made of metal.

4. The test kit as described in claim 1, characterized in that, The socket structure includes a socket housing and a socket base fixed to the socket housing.

5. The test kit as described in claim 4, characterized in that, The socket base includes a central through-hole that allows the device under test (DUT) to pass through and a lower portion of a plunger assembly that vacuum-clamps the DUT and places it into a test position on the socket structure.

6. The test kit as described in claim 5, characterized in that, The socket base includes an inner portion surrounding the upper surface of the socket housing, and wherein the lower portion of the base engages with and is in direct contact with the inner portion of the socket base.

7. The test kit as claimed in claim 1, characterized in that, The base is made of electrostatic discharge control material or electrostatic dissipation material.

8. The test kit as claimed in claim 1, characterized in that, Also includes: At least one suction nozzle is provided for vacuum clamping or holding the device under test, wherein the at least one suction nozzle extends through the base, the intermediate substrate and the top socket.

9. The test kit as described in claim 8, characterized in that, The at least one suction nozzle communicates with the connecting chamber disposed between the seat and the pressing member.

10. A test kit for testing a device under test, characterized in that, include: A socket structure for accommodating the device under test; as well as A plunger assembly detachably coupled to the socket structure, wherein the plunger assembly includes a multi-layer structure including a top socket, an intermediate layer substrate mounted at least on the top socket, a seat, and a reflector disposed between the intermediate layer substrate and the seat; A load plate is mounted on the socket housing of the socket structure, wherein the socket housing is located between the at least one intermediate layer substrate and the load plate, and the location for accommodating the device under test is located between the load plate and the at least one intermediate layer substrate; Multiple first pins are disposed between the load board and the location where the device under test is accommodated, and are directly connected between the load board and the location where the device under test is accommodated; Multiple second pins are disposed between the at least one interposer substrate and the location where the device under test is accommodated, and directly connect the at least one interposer substrate and the location where the device under test is accommodated.

11. The test kit as claimed in claim 10, characterized in that, The interposer substrate includes an antenna structure on its top side that directly faces the reflector.

12. The test kit as claimed in claim 11, characterized in that, The reflector is spaced apart from the intermediate substrate by a distance d.

13. The test kit as claimed in claim 11, characterized in that, Radio frequency signals are transmitted from one antenna of the antenna structure to an adjacent antenna through reflection by the reflector, thereby enabling non-conductive loopback testing in the plunger assembly.

14. The test kit as claimed in claim 10, characterized in that, The reflector is made of conductive material.

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