A pin bending device for diode processing

Abstract

The present invention discloses a pin bending device for diode processing, which relates to the technical field of diode processing; in order to solve the problem that the pins of the diodes cannot be straightened quickly when being transported and loaded, resulting in the bending mechanism being unable to quickly and accurately bend the diode pins; the present device specifically includes a feed frame and a conveying plate, the bottom outer wall of the feed frame is plugged with a material guide frame, a material discharge hole is opened on one side outer wall of the material guide frame, a group of first pin shaping plates and second pin shaping plates are fixed on one side outer wall of the material guide frame, the first pin shaping plates and the second pin shaping plates are opened on the opposite side outer wall with shaping inclined surfaces, a guide frame and a tube shell guide plate are fixed on one side outer wall of the material guide frame, and a conveyor belt is arranged on the outer wall of the guide frame. The present invention neatly transports the diodes one by one to the bending mechanism, and straightens the pins on both sides of the diodes, thereby improving the processing efficiency of the bending device and the accuracy of bending the pins.

Description

Technical Field

[0001] The invention relates to the technical field of diode processing, and in particular to a pin bending device for diode processing. Background Art

[0002] A diode is an electronic component with two electrodes, which is often used in various electrical devices. When using some existing diodes, their pins need to be bent according to the environment and equipment used. Since the diode is relatively small, it generally includes a shell and two pins, which are fixed at both ends of the shell. The traditional bending process is to manually bend it with pliers, but due to the small size of the diode, manual operation is inconvenient, resulting in low efficiency.

[0003] To solve the above problems, after searching, a Chinese patent application with number CN202111227855.4 discloses a pin bending device for a silicon carbide diode, comprising a workbench, a fixing component, and a bending component; a transmission component for transmitting diodes is also provided on the workbench, and the transmission component includes a first conveyor, a first push plate, and a first linear drive. However, since the above technical scheme does not provide a corresponding mechanism that can automatically straighten the pins of the diodes that are about to enter the transmission surface, when the pins of the diodes are transported to the transmission surface for pin bending by a feeding mechanism such as a vibration plate feeder, the diode pins are prone to deformation. Therefore, the diode pins are prone to slight bending due to collision and extrusion during transportation and feeding. After slight bending, the diode pins are prone to errors in bending angle and direction when squeezed and bent by the bending mechanism. Therefore, there is still a problem that the pins of the diodes cannot be straightened quickly when being transported and fed, resulting in the bending mechanism being unable to quickly and accurately bend the diode pins. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to provide a pin bending device for diode processing.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A pin bending device for diode processing comprises a feed frame and a conveying plate, wherein a material guide frame is inserted into the outer wall at the bottom of the feed frame, a material discharge hole is opened on the outer wall on one side of the material guide frame, a group of first pin shaping plates and second pin shaping plates are fixed to the outer wall on one side of the material guide frame, and shaping slopes are opened on the outer walls on the opposite sides of the first pin shaping plates and the second pin shaping plates, a guide frame and a tube shell guide plate are fixed to the outer wall on one side of the material guide frame, a conveyor belt is arranged on the outer wall of the guide frame, a stepper motor is fixed to the outer wall on one side of the first pin shaping plate, the output shaft of the stepper motor passes through the outer wall on one side of the first pin shaping plate, and the conveyor belt is connected to the output shaft of the stepper motor through a transmission; a mounting frame is fixed to the outer wall on the top of the conveying plate, a material guide mechanism is arranged on the outer wall on one side of the mounting frame, and a bending mechanism is arranged on the outer wall on the top of the conveying plate.

[0007] Preferably, support frames are provided on the outer walls of both sides of the feed frame, a control panel is fixed to the outer wall of one side of the support frame, and the stepping motor and the conveying plate are electrically connected to the control panel respectively.

[0008] Further: the material guiding mechanism includes an L-shaped shielding plate, a material receiving plate and a group of guide blocks, the L-shaped shielding plate is fixed on one side outer wall of the mounting frame, the guide block is fixed on one side outer wall of the mounting frame, and the material receiving plate is fixed on one side outer wall of the tube shell guide plate.

[0009] Further preferred: the bending mechanism includes a shielding frame, a tube shell support seat, an insert plate, a pin guide plate, a mounting plate, a mounting frame and a bending push plate, the shielding frame is fixed on the top outer wall of the conveying plate in sequence, the insert plate is plugged into the inner walls on both sides of the shielding frame, the tube shell support seat is fixed on one side outer wall of the shielding frame, the pin guide plate is fixed on one side outer wall of the insert plate, the mounting plate is fixed on the outer walls on both sides of the conveying plate in sequence, the mounting frame is fixed on the top outer wall of the mounting plate, the bending push plate is plugged into the inner wall of the mounting frame, and the top outer wall of the shielding frame is slidably connected to the mounting frame and the bottom outer wall of the receiving plate.

[0010] As a preferred embodiment of the present invention: a connecting piece is fixed to the outer wall of one side of the first pin shaping plate, a fixing plate is fixed to the outer wall of one side of the connecting piece, a spring is fixed to the outer wall of the bottom of the fixing plate, a pressure plate is fixed to the outer wall of the bottom of the spring, and the pressure plate and the outer wall of one side of the fixing plate are respectively slidably connected to the inner wall of the conveyor belt.

[0011] As a further preferred embodiment of the present invention: a wear-resistant pad is fixed to an outer wall on one side of the shaping slope, and a buffer pad is fixed to an outer wall on one side of the mounting frame.

[0012] As a further solution of the present invention: the outer walls on both sides of the shielding frame are respectively provided with card slots, and the outer wall on one side of the plug board is provided with a card block, and the card block is plugged into the inner wall of the card slot.

[0013] On the basis of the above-mentioned solution: a bending block and a top block are respectively fixed to the inner wall on the opposite side of the pin guide.

[0014] Based on the above solution, it is preferred that: a photoelectric sensor is provided on an outer wall of one side of the receiving plate, and the photoelectric sensor is electrically connected to the control panel.

[0015] The beneficial effects of the present invention are:

[0016] 1. The present invention drives the diode to rotate and move forward at a uniform speed on the top of the tube shell guide plate through a conveyor belt, so that the rotating pins on both sides of the diode are squeezed and flattened through the continuously tightened shaping slopes on the opposite sides of the first pin shaping plate and the second pin shaping plate, so that while the diodes are neatly transported to the bending mechanism one by one, the pins on both sides of the diode are straightened, thereby improving the processing efficiency of the bending device and the accuracy of bending the pins.

[0017] 2. The shielding frame will block the gap between the connecting plate and the mounting frame, allowing the diode to temporarily stay between the guide block and the connecting plate. As the conveying plate continues to move forward, the shielding frame will no longer block the gap between the connecting plate and the mounting frame. At this time, the diode stuck between the guide block and the connecting plate will fall between the two shielding frames. The diode and the pins on both sides that fall to the top of the conveying plate are clamped and limited by the shielding frame, the tube shell support seat and the pin guide plate. Then the diode continues to move forward with the conveying plate, so that the bending push plates set on both sides of the conveying plate cooperate with the pin guide plate that clamps the pins to bend the pins.

[0018] 3. The L-shaped shielding plate can block and limit the rolling diode, so that the diode can only fall through the gap between the mounting frame and the receiving plate. At the same time, the gap between the guide block and the receiving plate can guide the pins on both sides of the diode, thereby guiding the direction and position of the diode's fall, so that the diode can fall into the bending mechanism on the top of the conveyor plate in the correct position.

[0019] 4. The fixed plate and the pressure plate can open the conveyor belt as a whole, so that one side of the conveyor belt can be squeezed on the outer wall of the diode entering the top of the tube shell guide plate. At the same time, the spring can buffer the pressure plate through its own elastic force, and at the same time, one side of the conveyor belt can be close to the diode tube shell, so that the outer wall of the conveyor belt drives the diode to roll forward on the tube shell guide plate through friction.

[0020] 5. After the staff inserts the plug-in board to the corresponding depth of the inner wall of the shielding frame, the card block on one side of the plug-in board will be inserted into the card slot on one side of the shielding frame, thereby limiting the position of the plug-in board. At the same time, the pin stuck on the inner wall of the pin guide will be clamped by the bending block and the top block. At the same time, the bending block can also cooperate with the bending push plate to bend the pin clamped between the bending block and the top block, thereby improving the accuracy of the pin bending. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1This is a schematic diagram of the main structure of a pin bending device for diode processing proposed by the present invention;

[0022] Figure 2 A schematic diagram of the structure of a pin shaping plate of a pin bending device for diode processing proposed by the present invention;

[0023] Figure 3 This is a schematic diagram of the exploded structure of a pin shaping plate of a pin bending device for diode processing proposed by the present invention;

[0024] Figure 4 A schematic diagram of the structure of a material guide mechanism of a pin bending device for diode processing proposed by the present invention;

[0025] Figure 5 A schematic diagram of the bending mechanism structure of a pin bending device for diode processing proposed by the present invention;

[0026] Figure 6 A schematic diagram of the structure of a plug-in board of a pin bending device for diode processing proposed by the present invention;

[0027] Figure 7 The present invention is a schematic diagram of a circuit flow of a pin bending device for diode processing.

[0028] In the figure: 1 feed frame, 2 conveyor plate, 3 mounting plate, 4 mounting frame, 5 first pin shaping plate, 6 conveyor belt, 7 second pin shaping plate, 8 guide frame, 9 control panel, 10 support frame, 11 shaping slope, 12 connecting piece, 13 stepping motor, 14 tube shell guide plate, 15 spring, 16 pressure plate, 17 fixing plate, 18 guide frame, 19 feed hole, 20 L-type shielding plate, 21 buffer pad, 22 guide block, 23 receiving plate, 24 plug plate, 25 bending push plate, 26 mounting frame, 27 shielding frame, 28 tube shell support seat, 29 top block, 30 bending block, 31 pin guide plate, 32 card block, 33 card slot. DETAILED DESCRIPTION

[0029] The technical solution of this patent is further described in detail below in conjunction with specific implementation methods.

[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0031] Embodiment 1:

[0032] A pin bending device for diode processing, such as Figure 1-7As shown, it includes a feed frame 1 and a conveying plate 2, wherein a guide frame 8 is inserted into the outer wall at the bottom of the feed frame 1, a feed hole 19 is opened on one side of the outer wall of the guide frame 8, a group of first pin shaping plates 5 and second pin shaping plates 7 are fixed on one side of the outer wall of the guide frame 8, and a shaping slope 11 is opened on the outer wall of the first pin shaping plate 5 and the second pin shaping plate 7 on the opposite side, a guide frame 18 and a tube shell guide plate 14 are fixed to the outer wall of one side of the guide frame 8 by screws, a conveyor belt 6 is sleeved on the outer wall of the guide frame 18, and the outer wall of one side of the first pin shaping plate 5 is screwed A stepper motor 13 is fixed, and the output shaft of the stepper motor 13 passes through the outer wall of one side of the first pin shaping plate 5, and the conveyor belt 6 is transmission-connected to the output shaft of the stepper motor 13; a mounting frame 4 is fixed to the top outer wall of the conveyor plate 2 by screws, and a material guiding mechanism is provided on the outer wall of one side of the mounting frame 4, and a bending mechanism is provided on the top outer wall of the conveyor plate 2; support frames 10 are provided on the outer walls of both sides of the feed frame 1, and a control panel 9 is fixed to the outer wall of one side of the support frame 10 by screws, and the stepper motor 13 and the conveyor plate 2 are electrically connected to the control panel 9 respectively.

[0033] The present invention drives the diode to rotate and advance at a uniform speed on the top of the tube shell guide plate 14 through the conveyor belt 6, so that the rotating pins on both sides of the diode are squeezed and flattened through the continuously tightened shaping slopes 11 on the opposite sides of the first pin shaping plate 5 and the second pin shaping plate 7, so that while the diodes are neatly transported to the bending mechanism one by one, the pins on both sides of the diode are straightened, thereby improving the processing efficiency of the bending device and the accuracy of bending the pins.

[0034] like Figure 4 As shown, the material guiding mechanism includes an L-shaped baffle plate 20, a material receiving plate 23 and a group of guide blocks 22. The L-shaped baffle plate 20 is fixed to the outer wall of one side of the mounting frame 4 by screws, the guide block 22 is fixed to the outer wall of one side of the mounting frame 4, and the material receiving plate 23 is fixed to the outer wall of one side of the tube shell guide plate 14; the diode rolling down from the tube shell guide plate 14 will move between the material receiving plate 23 and the L-shaped baffle plate 20 through its own inertia, and the L-shaped baffle plate 20 can block and limit the rolled-down diode, so that the diode can only fall through the gap between the mounting frame 4 and the material receiving plate 23, and at the same time, the gap between the guide block 22 and the material receiving plate 23 can guide the pins on both sides of the diode, thereby guiding the direction and position of the diode falling, so that the diode can fall into the bending mechanism at the top of the conveying plate 2 in the correct position.

[0035] like Figure 5-6As shown, the bending mechanism includes a shielding frame 27, a tube shell support seat 28, an insert plate 24, a pin guide plate 31, a mounting plate 3, a mounting frame 26 and a bending push plate 25, the shielding frame 27 is fixed on the top outer wall of the conveying plate 2 in sequence, the insert plate 24 is plugged into the inner walls on both sides of the shielding frame 27, the tube shell support seat 28 is fixed on one side of the outer wall of the shielding frame 27, the pin guide plate 31 is fixed on one side of the outer wall of the insert plate 24, the mounting plate 3 is fixed on the outer walls on both sides of the conveying plate 2 in sequence, and the mounting frame 26 is fixed to the inner walls of the mounting plate 3. On the top outer wall, the bent push plate 25 is plugged into the inner wall of the mounting frame 26, and the top outer wall of the shielding frame 27 is slidably connected to the bottom outer wall of the mounting frame 4 and the receiving plate 23; the control panel 9 controls the conveying plate 2 to drive the top shielding frame 27 to move forward, and when the top of the shielding frame 27 moves to the bottom outer wall of the mounting frame 4 and the receiving plate 23, the gap between the receiving plate 23 and the mounting frame 4 will be blocked, so that the diodes that fall between the receiving plate 23 and the mounting frame 4 will temporarily stay between the guide block 22 and the receiving plate 23 As the transmission plate 2 continuously drives the shielding frame 27 to move forward, the shielding frame 27 will no longer shield the gap between the butt plate 23 and the mounting frame 4. At this time, the diode stuck between the guide block 22 and the butt plate 23 will fall down by its own gravity, and just fall on the tube shell support seat 28 between the two shielding frames 27. At the same time, the pin guide plate 31 will limit and guide the pins as the diode falls, and the tube shell support seat 28 will support the tube shell of the diode, so that the shielding frame 27 and the tube shell support seat 28 can be used to block the diode. The pin guide plate 31 clamps and limits the diode and the pins on both sides that fall to the top of the conveying plate 2. Then the diode moves forward continuously with the conveying plate 2, so that the bending push plates 25 set on both sides of the conveying plate 2 cooperate with the pin guide plates 31 that clamp the pins to bend the pins. The staff can adjust the depth of the insertion of the plug plate 24 into the shielding frame 27 according to the actual length of the pin, and adjust the depth of the bending push plate 25 into the installation frame 26 at the same time, so that the bending mechanism can accurately bend the diode pins of different lengths.

[0036] like Figure 3 As shown, a connecting piece 12 is fixed to an outer wall of one side of the first pin shaping plate 5 by screws, a fixing plate 17 is fixed to an outer wall of one side of the connecting piece 12, a spring 15 is fixed to an outer wall of the bottom of the fixing plate 17 by screws, a pressing plate 16 is fixed to an outer wall of the bottom of the spring 15 by screws, and the pressing plate 16 and the outer wall of one side of the fixing plate 17 are respectively slidably connected to the inner wall of the conveyor belt 6; the fixing plate 17 and the pressing plate 16 can open the conveyor belt 6 as a whole, so that one side of the conveyor belt 6 can be squeezed on the outer wall of the diode entering the top of the tube shell guide plate 14, and at the same time, the spring 15 can buffer the pressing plate 16 through its own elastic force, and at the same time, allow one side of the conveyor belt 6 to be close to the diode tube shell, so that the outer wall of the conveyor belt 6 drives the diode to roll forward on the tube shell guide plate 14 through friction.

[0037] like Figure 3-6 As shown, a wear-resistant pad is bonded to the outer wall of one side of the shaping slope 11, and a buffer pad 21 is bonded to the outer wall of one side of the mounting frame 4; the outer walls of both sides of the shielding frame 27 are respectively provided with card grooves 33, and the outer wall of one side of the plug plate 24 is provided with a card block 32, and the card block 32 is plugged into the inner wall of the card groove 33; the inner wall of the opposite side of the pin guide plate 31 is respectively fixed with a bending block 30 and a top block 29; after the staff inserts the plug plate 24 into the corresponding depth of the inner wall of the shielding frame 27, the card block 32 on one side of the plug plate 24 will be stuck in the card groove 33 on one side of the shielding frame 27, thereby limiting the position of the plug plate 24, and at the same time, the pin stuck in the inner wall of the pin guide plate 31 will be clamped by the bending block 30 and the top block 29, and at the same time, the bending block 30 can also cooperate well with the bending push plate 25 to bend the pin clamped between the bending block 30 and the top block 29, thereby improving the accuracy of the pin bending.

[0038] When the present embodiment is in use, the diodes are transported one by one into the feed frame 1 through a feeding device such as a vibration plate feeder, and then the unloading hole 19 on the inner wall of the guide frame 8 slides into the frame structure composed of the first pin shaping plate 5, the second pin shaping plate 7, the conveyor belt 6 and the tube shell guide plate 14. The size of the unloading hole 19 should be larger than the size of the diode, so that the diodes with slightly bent pins can still slide smoothly through the unloading hole 19 into between the first pin shaping plate 5 and the second pin shaping plate 7. The tube shell guide plate 14 can guide and support the tube shell of the diode, and the first pin shaping plate 5 and the second pin shaping plate 7 can guide and clamp the pins on both sides of the diode. At the same time, the control panel 9 will control the stepping motor 13 to drive the conveyor belt 6 to rotate at a uniform speed, thereby driving the tube shell in the tube shell through the friction between the outer wall of the conveyor belt 6 and the diode tube shell. The guide plate 14 moves downward at a uniform speed, so that the pins on both sides of the diode can roll at a uniform speed between the first pin shaping plate 5 and the second pin shaping plate 7. Since the first pin shaping plate 5 and the second pin shaping plate 7 have inclined shaping slopes 11 on opposite sides, the pins will rotate between the continuously tightening shaping slopes 11 as the tube shell continues to move forward, so that the slightly bent pins will be continuously squeezed and flattened by the continuously tightening shaping slopes 11. When the pins pass through the shaping slopes 11 and move between the first pin shaping plate 5 and the second pin shaping plate 7, the rotating pins have become flat under the squeezing of the continuously tightening shaping slopes 11. Then the diode continues to roll downward through the conveyor belt 6, and falls through the material guide structure on one side of the mounting frame 4 to the bending mechanism on the top of the conveyor plate 2 for pin bending processing.

[0039] The control panel 9 controls the conveying plate 2 to drive the top shielding frame 27 to move forward. When the top of the shielding frame 27 moves to the outer wall of the bottom of the mounting frame 4 and the receiving plate 23, the gap between the receiving plate 23 and the mounting frame 4 will be blocked. As the conveying plate 2 continuously drives the shielding frame 27 to move forward, the diode stuck between the guide block 22 and the receiving plate 23 will fall by its own gravity and fall on the tube shell support seat 28 between the two shielding frames 27. Then the diode continues to move forward with the conveying plate 2, allowing the bending push plates 25 set on both sides of the conveying plate 2 to cooperate with the pin guide plate 31 that clamps the pin to bend the pin.

[0040] Embodiment 2:

[0041] A pin bending device for diode processing, such as Figure 4 As shown; this embodiment makes the following improvements on the basis of embodiment 1: a photoelectric sensor is provided on the outer wall of one side of the receiving plate 23, and the photoelectric sensor is electrically connected to the control panel 9; when the shielding frame 27 on the top of the conveying plate 2 moves to the bottom of the mounting frame 4 and the receiving plate 23, the diode sandwiched between the mounting frame 4 and the receiving plate 23 will be temporarily unable to fall due to the obstruction of the bottom shielding frame 27. At this time, the photoelectric sensor on one side of the receiving plate 23 will be blocked by the diode all the time, thereby sending an electrical signal to the control panel 9, and the control panel 9 will control the conveyor belt 6 to stop running. The stopped conveyor belt 6 will cooperate with the tube shell guide plate 14 to clamp and fix the diode on the tube shell guide plate 14 to prevent the diode from continuing to move downward and causing the gap between the mounting frame 4 and the receiving plate 23 to be blocked, and at the same time, the diodes on the top of the tube shell guide plate 14 can fall regularly one by one between the shielding frames 27. The model of the photoelectric sensor is QL7070.

[0042] When this embodiment is in use, when the shielding frame 27 on the top of the conveying plate 2 moves to the bottom of the mounting frame 4 and the receiving plate 23, the diode clamped between the mounting frame 4 and the receiving plate 23 will be temporarily unable to fall due to the obstruction of the bottom shielding frame 27. At this time, the photoelectric sensor on one side of the receiving plate 23 will be blocked by the diode, thereby sending an electrical signal to the control panel 9. At this time, the control panel 9 will control the conveyor belt 6 to stop running, and the stopped conveyor belt 6 will cooperate with the tube shell guide plate 14 to clamp and fix the diode on the tube shell guide plate 14.

[0043] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A pin bending device for diode processing, comprising a feed frame (1) and a conveying plate (2), characterized in that: The bottom outer wall of the feed frame (1) is plugged with a material guide frame (8), one side outer wall of the material guide frame (8) is provided with a material discharge hole (19), one side outer wall of the material guide frame (8) is fixed with a group of first pin shaping plates (5) and second pin shaping plates (7), the outer walls of the first pin shaping plates (5) and the second pin shaping plates (7) on the opposite side are provided with shaping inclined surfaces (11), one side outer wall of the material guide frame (8) is fixed with a guide frame (18) and a tube shell guide plate (14), and the guide frame ( 18) A conveyor belt (6) is arranged on the outer wall, a stepper motor (13) is fixed on the outer wall of one side of the first pin shaping plate (5), the output shaft of the stepper motor (13) passes through the outer wall of one side of the first pin shaping plate (5), and the conveyor belt (6) is connected to the output shaft of the stepper motor (13) in a transmission manner; a mounting frame (4) is fixed on the outer wall of the top of the conveyor plate (2), a material guide mechanism is arranged on the outer wall of one side of the mounting frame (4), and a bending mechanism is arranged on the outer wall of the top of the conveyor plate (2); The outer walls of both sides of the feed frame (1) are provided with support frames (10), a control panel (9) is fixed to the outer wall of one side of the support frame (10), and the stepping motor (13) and the conveying plate (2) are electrically connected to the control panel (9) respectively; The material guiding mechanism comprises an L-shaped shielding plate (20), a material receiving plate (23) and a group of guide blocks (22); the L-shaped shielding plate (20) is fixed on one side outer wall of the mounting frame (4); the guide block (22) is fixed on one side outer wall of the mounting frame (4); and the material receiving plate (23) is fixed on one side outer wall of the tube shell guide plate (14); The bending mechanism comprises a shielding frame (27), a tube shell support seat (28), an insert plate (24), a pin guide plate (31), a mounting plate (3), a mounting frame (26) and a bending push plate (25); the shielding frame (27) is fixed on the top outer wall of the conveying plate (2) in sequence; the insert plate (24) is plugged into the inner walls on both sides of the shielding frame (27); the tube shell support seat (28) is fixed on one side outer wall of the shielding frame (27); the pin guide plate (31) is fixed on one side outer wall of the insert plate (24); the mounting plate (3) is fixed on the outer walls on both sides of the conveying plate (2) in sequence; the mounting frame (26) is fixed on the top outer wall of the mounting plate (3); the bending push plate (25) is plugged into the inner wall of the mounting frame (26); the top outer wall of the shielding frame (27) is slidably connected to the mounting frame (4) and the bottom outer wall of the receiving plate (23); A connecting piece (12) is fixed to an outer wall of one side of the first pin shaping plate (5), a fixing plate (17) is fixed to an outer wall of one side of the connecting piece (12), a spring (15) is fixed to an outer wall at the bottom of the fixing plate (17), a pressing plate (16) is fixed to an outer wall at the bottom of the spring (15), and the outer wall of one side of the pressing plate (16) and the fixing plate (17) are respectively slidably connected to the inner wall of the conveyor belt (6); The outer walls of both sides of the shielding frame (27) are respectively provided with card slots (33), and the outer wall of one side of the plug plate (24) is provided with a card block (32), and the card block (32) is plugged into the inner wall of the card slot (33); A bending block (30) and a top block (29) are respectively fixed to the inner wall on one side opposite to the pin guide plate (31).

2. The pin bending device for diode processing according to claim 1, characterized in that: A wear-resistant pad is fixed to the outer wall of one side of the shaping slope (11), and a buffer pad (21) is fixed to the outer wall of one side of the mounting frame (4).

3. The pin bending device for diode processing according to claim 1, characterized in that: A photoelectric sensor is provided on an outer wall of one side of the material receiving plate (23), and the photoelectric sensor is electrically connected to the control panel (9).

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