Server architecture for hybrid system integration and interface management

By isolating power and cooling components in the server architecture, and using standard interfaces and leak response mechanisms, the leakage problem of server liquid cooling systems is solved, enabling efficient and flexible server design, simplifying system design and improving reliability.

CN115494915BActive Publication Date: 2026-02-10BAIDU USA LLC
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202210630864.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-06-18
Filing Date
2022-06-06
Publication Date
2026-02-10
Estimated Expiration
2042-06-06

AI Technical Summary

Technical Problem

Existing server liquid cooling systems and rack-level liquid cooling systems may leak, causing damage to IT equipment. Furthermore, existing designs are not effective in responding to fluid leaks and are not flexible enough to accommodate different configurations and integrate new features and functions.

Method used

A server architecture is designed in which power and cooling components are isolated from the main electronic components, connected via standard interfaces including power and fluid interfaces, and equipped with a leak response mechanism that enables or disables interface connections via external and internal response mechanisms to ensure rapid response and isolation in the event of a failure.

Benefits of technology

It achieves an efficient and flexible server design, simplifies system design, improves interoperability and reliability, and can quickly cut off power and cooling fluid in case of failure to prevent equipment damage and adapt to different cooling needs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN115494915B_ABST
    Figure CN115494915B_ABST
Patent Text Reader

Abstract

Disclosed is an embodiment of an apparatus comprising a utility section adapted to be positioned in a server chassis and adapted to couple with an electronics section in the server chassis. The utility section comprises a power distribution panel, a fluid handling module, a fan module electrically coupled with the power distribution panel, or both the fluid handling module and the fan module. An external power interface is adapted to electrically couple the power distribution panel with a rack power supply, and an internal power interface is adapted to electrically couple the power distribution panel with one or more servers in the electronics section within the chassis. An external fluid interface is adapted to fluidly couple the fluid handling module with a rack fluid circulation loop, and an internal fluid interface is adapted to fluidly couple the fluid handling module with a server fluid inlet and a server fluid outlet of each of the one or more electronics sections.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The disclosed implementations generally relate to servers, and particularly, but not exclusively, to server architectures that can be used in the kind of information technology (IT) racks found in data centers. Background Technology

[0002] For example, modern data centers, such as cloud computing centers, house a large number of information technology (IT) devices, such as servers, blade servers, routers, edge servers, power supply units (PSUs), and battery backup units (BBUs). These individual IT devices are typically housed in racks within the computing center, with multiple IT devices per rack. Racks are usually grouped into clusters within the data center.

[0003] As IT equipment becomes increasingly powerful, it consumes more electricity and generates more heat. This heat must be removed from the IT equipment to maintain its proper operation. To keep up with this growing demand for heat removal, IT equipment has incorporated internal liquid cooling systems, and the IT racks housing the equipment also incorporate rack-level liquid cooling systems that interface with the internal liquid cooling systems of the IT equipment.

[0004] One problem with current server liquid cooling systems and rack-level liquid cooling systems is their potential for leakage, which can damage the system itself, the connected IT equipment, and other IT equipment housed within the rack. Designing rack-level liquid cooling systems that eliminate single points of failure is challenging; simple changes, such as adding fluid distribution components to the rack, may not function properly because such rack-level modifications often require corresponding changes to the IT equipment—changes that can only be effectively implemented through co-designing the rack and IT equipment. Existing solutions may not provide a mature solution to handle fluid leakage incidents. Summary of the Invention

[0005] The present invention aims to solve one of the aforementioned technical problems in the prior art.

[0006] This invention provides a device including a utility component portion adapted to be positioned within a server chassis having one or more electronic component portions housing server components, the utility component portion being adapted to be connected to the one or more electronic component portions. The utility component portion includes: a power distribution board; a fluid handling module, a fan module electrically connected to the power distribution board, or both the fluid handling module and the fan module; an external power interface and an internal power interface, the external power interface including a connection adapted to electrically connect the power distribution board to a rack power supply, the internal power interface including a connection adapted to electrically connect the power distribution board to electronic components in the one or more electronic component portions within the chassis; an external fluid interface and an internal fluid interface, the external fluid interface including a connection adapted to connect the fluid handling module to a rack fluid source and a rack fluid return fluid, the internal fluid interface including a connection adapted to fluidly connect the fluid handling module to liquid cooling components in the one or more electronic component portions.

[0007] In some embodiments, the device further includes: an external power response mechanism coupled to the external power interface and adapted to enable and disable the connection of the external power interface; and an internal flow response mechanism coupled to the internal fluid interface and adapted to enable and disable the connection of the internal fluid interface.

[0008] In some embodiments, the device further includes one or more utility device leakage detection sensors located in the utility device portion, the one or more utility device leakage detection sensors being communicatively coupled to at least the external power response mechanism.

[0009] In some embodiments, the external power response mechanism enables the external power interface by physically connecting it to the rack power supply, and disables it by physically disconnecting it from the rack power supply.

[0010] In some embodiments, the external power interface includes a pair of clips that, when in their connected position, are adapted to physically connect to a rack busbar.

[0011] In some embodiments, the internal flow response mechanism enables the internal fluid interface by physically connecting it to each server fluid inlet and server fluid outlet, and disables it by physically disconnecting it from the rack power supply.

[0012] In some embodiments, at least one of the internal fluid interface connection and the external fluid interface connection includes a pair of drip-free blind fittings.

[0013] In some embodiments, the external power response mechanism is electrically connected to the internal flow response mechanism, wherein if the external power response mechanism disables the external power interface, the internal flow response mechanism immediately disables the internal fluid interface.

[0014] In some embodiments, the device further includes: an external flow response mechanism fluidly connected to the external fluid interface and communicatively connected to the sensor, the external flow response mechanism being adapted to enable and disable the external fluid interface; or an internal power response mechanism connected to the internal power interface and adapted to enable and disable the internal power interface.

[0015] In some embodiments, the utility device portion is physically isolated from the electronic device portion.

[0016] This invention also provides a system comprising: a server chassis; one or more electronic component portions located in the chassis, at least one of the one or more electronic component portions housing server components; and a device according to any one of the above embodiments, wherein the utility component portion of the device is physically isolated from the one or more electronic component portions, wherein the connection of the internal power interface of the utility component portion is adapted to electrically connect the power distribution board to one or more servers in the electronic component portions within the chassis, and the connection of the internal fluid interface of the utility component portion is adapted to fluidly connect the fluid processing module to a server fluid inlet and a server fluid outlet of each of the one or more servers.

[0017] In some embodiments, the device further includes: an external power response mechanism coupled to the external power interface and adapted to enable and disable the connection of the external power interface; and an internal flow response mechanism coupled to the internal fluid interface and adapted to enable and disable the connection of the internal fluid interface. The system further includes: one or more utility device leak detection sensors located within the utility device portion, the utility device leak detection sensors being at least communicatively coupled to the external power response mechanism; and one or more electronic device leak detection sensors located within the electronic device portion, the electronic device leak detection sensors being at least communicatively coupled to the internal flow response mechanism.

[0018] In some embodiments, the system further includes: an external flow response mechanism fluidly connected to the external fluid interface and adapted to enable and disable the external fluid interface; or an internal power response mechanism connected to the internal power interface and adapted to enable and disable the internal power interface.

[0019] In some embodiments, the one or more utility device leak detection sensors are communicatively coupled to the external flow response mechanism; and the one or more electronic leak detection sensors are communicatively coupled to the internal power response mechanism. Attached Figure Description

[0020] Non-limiting and non-exhaustive embodiments of the invention are described with reference to the following drawings, wherein similar reference numerals refer to similar parts in the various views unless otherwise stated.

[0021] Figure 1 This is a side view of an implementation of a liquid-cooled information technology (IT) rack housing various IT equipment.

[0022] Figures 2A to 2B This is a floor plan of the implementation of the server architecture.

[0023] Figure 3 It can be used Figures 2A to 2B A plan view of the implementation of the practical component part of the server architecture.

[0024] Figure 4 It is possible to be with Figures 2A to 2B A plan view of another implementation of another utility device used in the server architecture.

[0025] Figure 5 It is possible to be with Figures 2A to 2B A plan view of another implementation of another utility device used in the server architecture.

[0026] Figure 6 This is a floor plan of an implementation of a server architecture with practical components.

[0027] Figure 7 This is a floor plan of another implementation of a server architecture that uses a practical component portion.

[0028] Figure 8 This is a floor plan of another implementation of a server architecture with practical components.

[0029] Figure 9 It is used to operate such as Figures 6 to 8The flowchart illustrates an implementation method for the server architecture shown. Detailed Implementation

[0030] Implementations of server architectures that can be used in information technology (IT) racks are described. Specific details are described to provide an understanding of the implementations; however, those skilled in the art will recognize that the invention can be practiced without one or more of the described details or using other methods, components, materials, etc. In some cases, well-known structures, materials, or operations are not shown or described in detail but are still included within the scope of the invention.

[0031] The use of "one embodiment" or "implementation" in this specification means that a described feature, structure, or characteristic may be included in at least one described embodiment; therefore, the phrases "in one embodiment" and "in an embodiment" do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. As used herein, directional terms such as "front," "rear," "top," "bottom," "side," "lateral," and "longitudinal" refer to the orientation of the embodiments presented in the drawings, but no directional term should be construed as implying or requiring a specific orientation of the embodiments in actual use.

[0032] The described embodiments provide an efficient and flexible server design architecture for implementing hybrid systems (i.e., systems that simultaneously utilize air cooling and liquid cooling). The disclosed embodiments improve the design of high-power-density server systems with different cooling solutions and also aim to address the following challenges:

[0033] -Simplify server system design;

[0034] -Isolate the power and cooling solutions from the main electronic components;

[0035] -Integrated localized fluid management, including fluid shutdown in case of failure;

[0036] -Simplify system interfaces to improve interoperability;

[0037] -Integration with existing rack hardware systems means that the solution requires no rack-level modifications;

[0038] - Provides highly reliable solutions.

[0039] Existing solutions may not readily adapt to different configurations and integrate new features and functionalities. Furthermore, existing solutions are highly rack-based, meaning system design may lack flexibility. The disclosed implementation describes a server architecture that significantly improves efficiency, availability, and ease of implementation with new features and functionalities. This implementation uses a server architecture in which power and cooling components are isolated from the main electronic components, and the corresponding interfaces include integrated response mechanisms for power and cooling management.

[0040] The implementation comprises two main parts: a utility component that provides at least power and cooling; and a main electronics component. These two parts are completely isolated from each other, and standard interfaces, including power and fluid interfaces, are used to connect them. Both parts are integrated into a server chassis and then mounted in a server rack. The power system also directly powers the leak response device of the liquid cooling system. This design implements complete system-level and module-level leak response for different scenarios. A system response process is described to enable high-level control and management of the power and fluid interfaces.

[0041] Figure 1 This is a block diagram showing a side view of an implementation of an information technology (IT) rack, a type of IT container commonly used in data centers. In one implementation, the electronic rack 100 includes a CDU 101, a rack management unit (RMU) 102, and one or more server blades 103A-103D (collectively referred to as server blades 103). The server blades 103 can be inserted from the front end 104 of the electronic rack 100 into an array of server slots. Note that although only four server blades 103A-103D are shown, the electronic rack 100 may hold more or fewer server blades. It should also be noted that the specific locations of the CDU 101, CMU 102, and server blades 103 shown are for illustrative purposes only, and other arrangements or configurations of the CDU 101, CMU 102, and server blades 103 may be implemented. Furthermore, a front door located on the front end 104 and a rear door located on the rear end 105 are optional. In some implementations, there may be no doors on the front end 104 and / or the rear end 105.

[0042] In one embodiment, CDU 101 includes a heat exchanger 111, a liquid pump 112, and a pump controller 110. The heat exchanger 111 may be a liquid-to-liquid heat exchanger. The heat exchanger 111 includes a first tube having a first pair of liquid connectors coupled to external liquid supply / return lines 131-132 to form a primary loop, wherein the connectors coupled to the external liquid supply / return lines 131-132 may be disposed on or mounted on the rear end 105 of the electronics rack 100. Furthermore, the heat exchanger 111 further includes a second tube having a second pair of liquid connectors coupled to a liquid manifold 125, which may include a supply manifold supplying coolant to the server blade 103 and a return manifold returning warmer liquid to the CDU 101. The processor may be mounted on a cold plate, wherein the cold plate includes embedded liquid distribution channels to receive coolant from the liquid manifold 125 and return coolant carrying heat exchanged from the processor to the liquid manifold 125. Rack 100 is an embodiment of an IT rack, in which various types of racks can be used. Figures 2A to 2B And the following implementation of the server architecture.

[0043] Each server blade 103 may include one or more IT components (e.g., CPU, GPU, memory, and / or storage devices). Each IT component may perform data processing tasks, and the IT component may include software installed on the storage device, loaded into memory, and executed by one or more processors to perform the data processing tasks. Server blade 103 may include a host server (referred to as a host node) connected to one or more compute servers (also referred to as compute nodes). The host server (having one or more CPUs) typically connects to a client interface via a network (e.g., the Internet) to receive requests for specific services such as storage services (e.g., cloud-based storage services such as backup and / or recovery), execute applications to perform certain operations (e.g., image processing, deep data learning algorithms, or modeling, etc., as part of a Software as a Service or SaaS platform). In response to a request, the host server assigns the task to one or more compute servers (having one or more GPUs) managed by the host server. The compute servers perform the actual tasks, which generate heat during operation.

[0044] The electronic rack 100 further includes an RMU 102 configured to provide and manage power supplied to the server blades 103 and CDU 101. The RMU 102 may be coupled to a power supply unit (not shown) to manage the power supply unit's power consumption and other thermal management features (e.g., cooling fans). The power supply unit may include necessary circuitry (e.g., AC-to-DC or DC-to-DC power converters, batteries, transformers, or voltage regulators) to provide power to the remaining components of the electronic rack 100.

[0045] In one implementation, RMU 102 includes optimal control logic 111 and rack management controller (RMC) 122. Optimal control logic 111 is coupled to at least some server blades 103 to receive the operating status of each server blade 103, such as processor temperature, current pump speed of liquid pump 112, and coolant temperature. Based on this information, optimal control logic 111 determines the optimal pump speed of liquid pump 112 by optimizing a predetermined objective function, such that the output of the objective function is maximized while satisfying a set of predetermined constraints. Based on the optimal pump speed, RMC 122 is configured to send a signal to pump controller 110 to control the pump speed of liquid pump 112 based on the optimal pump speed.

[0046] Figures 2A to 2B An implementation of the server architecture is shown. Figure 2A A server 200 is shown, which includes a utility component portion 204 and an electronic component portion 206 located within a server chassis 202. The server 200 can then be inserted as a complete unit into an IT rack, such as... Figure 1 The IT rack shown is an example. Except for the interfaces connecting to the rack and the electronics section, the utility component section 204 and the electronics section 206 are physically isolated. This minimizes or eliminates damage to the electronics section 206 should any fault occur within the utility component section 204 (such as a leak). This isolation also allows for easy customization of the utility component (i.e., power, air cooling, liquid cooling) to meet the requirements of the electronic components in the electronics section. For example, if the electronic components in the electronics section 206 are air-cooled, the utility component section can be adjusted to meet this requirement without any modification to the electronics. Similarly, if the electronic components within the electronics section are liquid-cooled, the utility component section can be adjusted to meet this requirement.

[0047] Utility component section 204, as its name suggests, provides utility functions, such as power, air cooling, liquid cooling, etc., for one or more IT devices (e.g., a server in one embodiment) located in electronics component section 206. In the illustrated embodiment, utility component section 204 is located at the rear of chassis 202, but in other embodiments, utility component section 204 may be located elsewhere within the server chassis. Utility component section 204 is physically isolated from electronics component section 206 and includes: several external interfaces or links allowing the utility component section to connect to components outside of server 200; and several internal interfaces allowing the utility component section 204 to connect to components inside server 200 (e.g., electronics component section 206). In the illustrated embodiment, the external interfaces allow the utility component section to connect to the rack housing server 200, and the internal interfaces allow the utility component section 204 to connect to electronics component section 206. In the illustrated embodiment, the external interfaces include external power interface 208 and external fluid interface 210. External power interface 208 electrically connects the utility component section to the rack's power delivery system (typically an electrical busbar located at the rear of the rack). External fluid interface 210 fluidly connects the fluid handling components within the utility component section 204 to the fluid supply and return lines in the rack.

[0048] The internal interfaces of the utility device portion include: an internal power interface 212, which electrically connects the utility device portion to the electronic device portion or to electronic components within the electronic device portion; and an internal fluid interface 214, which fluidly connects the fluid handling components within the utility device portion 204 to the fluid inlet and fluid outlet in the electronic device portion. Of course, other embodiments may have more or fewer interfaces than shown; for example, an embodiment of the utility device portion 204 serving only air-cooled electronic devices does not require fluid interfaces 210 and 214. In some embodiments, mechanical connections may be used to assist in connecting the interfaces. The following will combine... Figures 3 to 5 The details of the implementation of the practical device part are discussed.

[0049] Electronics section 206 is designed to house the electronic and cooling components that utilities section 204 provides services to. Although primarily described as a "server," the electronics in electronics section 206 are not limited to electronic components associated with a server, but can be electronic components associated with other types of IT equipment. Therefore, the term "server" as used herein should be interpreted to include all types of IT equipment, including but not limited to actual servers.

[0050] Figure 2BServer 250 is illustrated and is similar to server 200 in most respects: it includes a utility component 204 with external and internal interfaces. However, the utility component 204 is not limited to serving a single electronic component, and the main difference between server architecture 250 and 200 is that in server architecture 250, the utility component 204 serves multiple electronic components 206. In other words, server 200 has a one-to-one correspondence between utility components and electronic components, while server 250 has a one-to-many correspondence. Other embodiments (not shown) may have a many-to-one correspondence between utility components and electronic components. The illustrated embodiment has two electronic components 206a and 206b connected to a single utility component 204, but other embodiments may include more than two electronic components connected to the utility component 204.

[0051] In some embodiments of server 250, the grouped internal interfaces may be identical for each of the multiple electronic components, but this is not necessary; the number and type of external and internal interfaces in utility component 204 can be customized according to the number of electronic components and the type of IT equipment in each electronic component. In other words, in a utility component supporting multiple electronic components, the internal interfaces of the utility component do not need to be identical for each electronic component. For example, in the illustrated embodiment, both electronic components 206 have corresponding internal power interfaces 212: electronic component 206a has an internal power interface 212a, and electronic component 206b has an internal power interface 212. However, if electronic component 206a only includes air-cooled electronics, while electronic component 206b only requires liquid cooling, then only electronic component 206b needs an internal fluid interface 214, and not electronic component 206a.

[0052] Figure 3 An embodiment of a utility component portion 300, which can be used as a utility component portion 204 in system 200 or 250, is shown. The utility component portion 300 includes three main components: a power distribution board 302, a fan module 304, and a fluid handling module 306, but not all embodiments require the same components. For example, other embodiments may omit the fan module or the fluid handling module. The positioning of the power distribution board, fan module, and fluid handling module within the utility component portion 300 is generally determined by the requirements of the electronics within the electronics portion and the rack configuration; therefore, other embodiments of the utility component portion 300 do not require the power distribution board, fan module, and fluid handling module to be arranged as shown.

[0053] Power distribution board 302, as its name suggests, provides power to components within the utility component section 300 and to components within the electronics section that will be connected to the utility component section. Power distribution board 302 can be electrically connected to a power source (e.g., a rack busbar) using an external power interface 308, which includes a pair of clips: a positive clip 308+ and a negative clip 308-. Power distribution board 302 also uses an internal power interface 309 to be electrically connected to the electronics section, which in one embodiment may be an orientationless connector, but in other embodiments may be other types of connectors. Power distribution board 302 can also be electrically connected to other components within the utility component section 300 (e.g., fan modules, fluid handling modules, response mechanisms, sensors, etc.) to provide power to these components.

[0054] Fan module 304 is designed and positioned to provide forced convection to electronic components that are cooled by air. Module 304 includes one or more individual fans; in the illustrated embodiment, fan module 304 has four individual fans 304a-304d, but other embodiments of fan module 304 may include more or fewer individual fans (including a single fan) than illustrated. Fan module 304 is electrically connected to power distribution board 302 to provide power to the individual fans. The internal interface (not shown) of the fan module may be a grille that allows air from the fans to enter the relevant electronic component, but in other embodiments, the internal interface of the fan module may be a duct that directs air from the fan module into the electronic component.

[0055] Fluid handling module 306 may include various fluid handling elements, such as pumps, manifolds, etc. The fluid handling module is positioned within utility component section 300 so that external fluid interface 310 can be connected to a corresponding fluid interface in the rack. External fluid interface 310 is fluidly coupled to fluid handling module 306 and includes an external supply connector RS and an external return connector RR; the external supply connector RS is fluidly coupled to the rack fluid supply, while the external return connector RR is fluidly coupled to the rack fluid return. In one embodiment, the fluid connection between connectors RS and RR and their corresponding connectors in the rack may be a drip-free blind-mating connection, but in other embodiments, it may be another type of connection, such as a manual connection. Similarly, fluid handling module 306 is fluidly coupled to internal fluid interface 312, which includes an internal supply connector SS and an internal return connector SR; the internal supply connector SS is fluidly coupled to the inlet of the server's liquid cooling system, while the internal return connector SR is fluidly coupled to the outlet of the server's liquid cooling system. In one implementation, the fluid connection between connectors SS and SR and their corresponding connectors in the server can be a dropless blind-mating connection, but in other implementations, it can be a different type of connection, such as a manual connection. In one implementation, external fluid interface 310 and internal fluid interface 312 can use the same type of connector, but in other implementations, they do not need to use the same type of connector.

[0056] In addition to its main components, the utility component section 300 includes one or more response mechanisms that allow the utility component section to respond to faults such as leakage. Generally, the response mechanisms can be used with any external or internal interface in the utility component section 300 to enable or disable external and internal interfaces that connect the utility component section to one or more electronic component sections. Additional response mechanisms may also be located in the electronic component section, not in the utility component section, or in addition to being located in the utility component section (see, for example...). Figure 8 In the utility component 300, the external flow response mechanism 314 is electrically connected to the distribution board 302 and fluidly connected to the external fluid interface 310, and is adapted to enable and disable the external fluid interface 310 in the event of a leak. The internal flow response mechanism 316 is electrically connected to the distribution board 302 and fluidly connected to the internal fluid interface 312, and is adapted to enable and disable the internal fluid interface 312 in the event of a leak. If fluid can flow through the fluid interface, the fluid interface is enabled. If no fluid can flow through the fluid interface, the fluid interface is disabled.

[0057] In one embodiment, the external flow response mechanism 314 may be a mechanism that physically engages and disengages the external supply connector RS and the external return connector RR with their corresponding connectors in the rack. In one embodiment, the external flow response mechanism 314 may be an electromagnetic mechanism that physically engages the connectors RS and RR when energized and physically disengages them when de-energized. For example, in one embodiment, the external flow response mechanism 314 may be an electromagnetic mechanism that works in conjunction with a resilient member such as a spring. The resilient member may bias the connectors RS and RR toward their disconnected positions. When activated, the electromagnetic mechanism applies a force to the connectors RS and RR that overcomes the biasing force of the resilient member, forcing the connectors into their engaged positions; when deactivated, the electromagnetic mechanism applies no force, and the resilient member forces the connectors RS and RR into their disconnected positions. Of course, other embodiments may use different response mechanisms; for example, one embodiment may use a spring valve to enable and disable flow through the connectors RS and RR.

[0058] The internal flow response mechanism 316 can be any mechanism described above for the external flow response mechanism 314, or it can be another mechanism not described herein. The operation of the internal flow response mechanism 316 is similar to that of the external flow response mechanism 314: it enables and disables the internal connectors SS and SR in the internal fluid interface 312. In one embodiment, the internal flow response mechanism 316 can be the same as or similar to the external flow response mechanism 314; however, in other embodiments, the response mechanisms 314 and 316 need not be of the same type.

[0059] Figure 4 Another embodiment of the utility component section 400 is shown. The utility component section 400 is similar to or analogous to the utility component section 300 in most respects and includes the same main components: the power distribution board 302, the fan module 304, and the fluid handling module 306. The utility component section 400 also includes the same or similar external and internal interfaces: an external power interface 308, an external fluid interface 310, an internal power interface 309, and an internal fluid interface 312.

[0060] The main difference between utility component sections 400 and 300 is that utility component section 400 omits the external flow response mechanism 314 but adds an external power response mechanism 402, which is electrically connected to the distribution board 302 and to the external power interface 308. The external power response mechanism 402 is adapted to enable and disable the external power interface 308 upon detection of a fault such as a leak. If power can flow through the external power interface 308, the external power interface 308 is enabled. If power cannot flow through the external power interface 308, the external power interface 308 is disabled. In one embodiment, the external power response mechanism 402 may be a mechanism that physically engages and disengages clips 308+ and 308- from the rack busbar. For example, in one embodiment, the external power response mechanism 402 may be an electromagnetic mechanism that physically engages clips 308+ and 308- when energized and physically disengages clips 308+ and 308- when de-energized. For example, the external power response mechanism 402 can be an electromagnetic mechanism that works with an elastic member such as a spring. The elastic member can bias the clips 308+ and 308- toward their disconnected positions. When activated, the electromagnetic mechanism applies a force to the clips 308+ and 308- that overcomes the biasing force of the elastic member, forcing the clips into their engaged positions; when deactivated, the electromagnetic mechanism applies no force, so the biasing force of the elastic member forces the clips 308+ and 308- into their disconnected positions. Of course, other embodiments can use different response mechanisms to engage and disengage the clips 308+ and 308-.

[0061] Figure 5 Another embodiment of the utility component section 500 is shown. The utility component section 500 is similar to or analogous to utility components 300 and 400 in most respects and includes the same or similar main components: a power distribution board 302, a fan module 304, and a fluid handling module 306. The utility component section 500 also includes the same or similar external and internal fluid interfaces: an external power interface 308, an external fluid interface 310, an internal power interface 309, and an internal fluid interface 312.

[0062] The main difference between practical device section 500 and practical device sections 400 and 300 is that practical device section 500 includes all three response mechanisms described above for sections 300 and 400. That is, it includes external flow response mechanism 314, internal flow response mechanism 316, and external power response mechanism 402. The functions of the three response mechanisms in practical device section 500 are the same as those described above for practical device sections 300 and 400.

[0063] Figure 6An implementation of server architecture 600 is shown. Server 600 uses a utility component section 602 that is basically corresponding to utility component section 400, but includes several more components, particularly sensors and switches. For clarity, not all components of the utility component section are shown in this figure.

[0064] In server 600, server electronics in electronics section 604 are connected to utility section 602 via internal power interface 309 and internal fluid interface 312. Utility section 602 includes a leak detection sensor X1, which is communicatively connected to switch S1. Switch S1 controls the power supply from distribution board 302 to external power response mechanism 402. In this embodiment, external power response mechanism 402 is an electromagnetic mechanism that engages and disengages external power interface 308 with rack busbars, as described above. Similarly, electronics section 604 includes sensor X2, which is communicatively connected to switch S2. Switch S2 controls the power supply from distribution board 302 to internal fluid interface 316, which in this embodiment is also an electromagnetic mechanism that engages and disengages external fluid interface 312 with the inlet and outlet of electronics section 604, as described above.

[0065] Architecture 600 can operate in at least two modes, primarily depending on where a fault, such as a leak, is detected. The first operating mode occurs if sensor X1 detects a fault, indicating a leak in the utility component section 602. When sensor X1 detects a leak, it signals switch S1 to cut off power to the external power response mechanism 402, thereby de-energizing the mechanism, retracting the external power interface 308 from the rack busbar, and disabling the external power interface. Disabling the external power interface cuts off power to the entire power distribution board 302, thus also cutting off power to the internal power interface 309 and the internal flow response mechanism 316. Cutting off power to the internal flow response mechanism 316, in turn, disables the internal fluid interface 312, thereby cutting off the flow of cooling fluid to and from the electronics component section 604. The leak detected by sensor X1 then shuts down the entire architecture.

[0066] If sensor X2 detects a fault such as a fluid leak, but sensor X1 does not, indicating a leak in the electronics section, a second operating mode occurs. Sensor X2 signals switch S2 to cut off power to the internal flow response mechanism 316, thereby de-energizing the mechanism, disabling the internal fluid interface 312, and cutting off the cooling fluid flow to IT device 706. However, since the external power response mechanism 402 is not de-energized, the external power interface 308 remains electrically connected to the rack busbar, allowing the power distribution board 302 to continue supplying power to other parts of the utility component section 602, IT device 604, and any other IT devices connected to the utility component section.

[0067] Figure 7 An implementation of server architecture 700 is illustrated. Server 700 uses a utility component section 702 similar to utility component sections 300 to 500. Like the utility component sections described above, utility component section 702 includes an external power response mechanism 402 at external power interface 308, but it also includes an internal power response mechanism 704 at internal power interface 309. The internal power response mechanism 704 is electrically connected to the power distribution board 302, as well as sensors and switches. For clarity, not all components of the utility component section are necessarily shown in this figure.

[0068] In server 700, server electronics in electronics section 706 are connected to utility section 702 via internal power interface 309 and internal fluid interface 312. Utility section 702 includes a leak detection sensor X1 communicatively connected to switch S1, which controls the power supply from distribution board 302 to external power response mechanism 402. In this case, external power response mechanism 402 is an electromagnetic mechanism that engages and disengages external power interface 308 with rack busbars, as described above for embodiments of utility sections 300 to 500. Similarly, electronics section 706 includes a sensor X2 communicatively connected to switch S2, which controls the power supply from distribution board 302 to internal power response mechanism 704. In this embodiment, internal power response mechanism 704 is also an electromagnetic mechanism that engages and disengages external power interface 309 with IT equipment 706.

[0069] Architecture 700 can operate in at least two modes, primarily depending on where a fault, such as a leak, is detected. The first operating mode occurs if sensor X1 detects a fault, indicating a leak in the utility component section. When sensor X1 detects a leak, it signals switch S1 to cut off power to the external power response mechanism 402, thereby de-energizing the mechanism, retracting the external power interface 308 from the rack busbar, and disabling the external power interface. Disabling the external power interface cuts off power to the entire power distribution board 302, thus also cutting off power to the internal power response mechanism 704 and disabling the internal power interface 309. Disabling the internal power interface 309 then cuts off power to the electronics section 706, but because the internal fluid interface 312 is not shut off, cooling fluid can continue to circulate through the liquid cooling components of the IT equipment 706.

[0070] If sensor X2 detects a fault but sensor X1 does not, indicating a leak in the electronics section, a second operating mode occurs. When sensor X2 detects a fluid leak, it signals switch S2 to cut off power to the internal power response mechanism 704, disable the internal power interface 309, and cut off power to the electronics section 706. However, power continues to be supplied to the external power response mechanism 402; because the external power response mechanism 402 is not de-energized, the external power interface 308 remains electrically connected to the rack busbar, and the power distribution board 302 can continue to supply power to other parts of the utility section 702 and any other IT equipment connected to the utility section. Moreover, since the external fluid interface 310 and internal fluid interface 312 do not have response mechanisms, they are not cut off, meaning that cooling fluid can continue to circulate through the liquid cooling components in the electronics section 706 and other electronics sections that can be connected to the utility section 702. Figure 7 The design of the granularity of power connection and disconnection for each part (the utility part and one or more electronic parts) is shown.

[0071] Figure 8 One embodiment of server architecture 800 is shown. Server 800 uses a utility component section 802 that is similar to but slightly different from utility component sections 300 to 500. Like the previously described utility component sections, utility component section 802 includes an external power response mechanism 402 at an external power interface 308 and an external flow response mechanism 314 at an external fluid interface 310. In architecture 800, the response mechanism 806 is located in the electronics component section 804 to disable flow between the utility component section and the electronics component section; this differs from previous architectures where an internal flow response mechanism 316 performing a similar function was placed in the utility component section instead of the electronics component section.

[0072] In server 800, server electronics in electronics section 804 are connected to utility section 802 via internal power interface 309 and internal fluid interface 312. Utility section 802 includes a leak detection sensor X1 communicatively connected to switches S1 and S3. Switch S1 controls the power supply from distribution board 302 to external power response mechanism 402, and switch S3 controls the power supply from distribution board 302 to external flow response mechanism 314. Similarly, electronics section 804 includes a sensor X2 communicatively connected to switch S2, which controls the power supply from distribution board 302 to response mechanism 806, which in this embodiment is also an electromagnetic mechanism that engages and disengages internal fluid interface 312.

[0073] Architecture 800 can operate in at least two modes, depending primarily on where a fault, such as a leak, is detected. The first operating mode occurs if sensor X1 detects a fault, meaning a leak exists in the utility part 802.

[0074] When sensor X1 detects a fault, it signals switch S1 to cut off power to the external power response mechanism 402 and to switch S3 to cut off power to the response mechanism 806, thereby disabling the external power interface 308 and the external fluid interface 310. Disabling the external power interface 308 cuts off power to the entire distribution board 302, which in turn cuts off power to the response mechanism 806 and disables the internal fluid interface 312. If sensor X1 detects a leak, the entire architecture is shut down.

[0075] If sensor X2 detects a fault such as a fluid leak, but sensor X1 does not, indicating a leak in the electronic component, a second operating mode will occur. If sensor X2 detects a fault such as a fluid leak, it signals switch S2 to cut off power to response mechanism 806, thereby disabling internal fluid interface 312. Disabling the internal fluid interface cuts off the flow of cooling fluid to electronic component 804, but since response mechanisms 402 and 314 are not de-energized, power distribution board 302 can continue to supply power to other electronic components, and fluid handling module 306 can continue to supply cooling fluid to other electronic components.

[0076] Figure 9 It is shown in the form of a flowchart Figures 6 to 8The implementation of the server operation shown is illustrated. The process is discussed below with reference to architecture 600, but can be applied to architectures 700 and 800. The process begins at block 902. At block 904, utility component 602 is configured to meet the requirements of the electronic component 604 to which it will be paired; as described above, utility component 602 may include a power distribution board, fan module, fluid handling module, and other modules not listed herein, which may serve the IT equipment within electronic component 604. At block 906, the configured utility component 602 is combined with its corresponding electronic component 604 and placed within chassis 202.

[0077] At block 908, the system begins normal operation. Response mechanisms 316 and 402 (both electromagnetic mechanisms and system 600) are energized or powered on so that their respective interfaces are engaged: the internal fluid interface 312 for the internal flow response mechanism 316 and the external power interface 308 for the external power response mechanism 402. Power is then supplied to the utility device section 602 via the external power interface 308, and fluid flows into and out of the electronics section 604 through the fluid interface 312.

[0078] At block 910, the process checks whether the leak detection sensor X2 detects any leak in the electronic component. If no leak is detected at block 910, the system continues normal operation as described at block 908. However, if the leak detection sensor X2 detects a leak at block 910, the sensor X2 signals the switch S2 to cut off power to the internal flow response mechanism 316, thereby disabling the internal fluid interface 312 and cutting off fluid flow to and from the electronic component 604. Power can also be cut off to the internal power interface 309, thereby cutting off power to the electronic component 604. If other electronic components besides the electronic component 604 are connected to the utility component 602, the other electronic components 604 can continue to operate; that is, the utility component 602 can continue to supply power and fluid flow to other electronic components that can be connected to it.

[0079] At block 912, the process checks whether the leak detection sensor X1 detects any leak in the utility component section 602. If no leak is detected at block 912, the system continues normal operation as described at block 908. However, if the leak detection sensor X1 detects a leak in the utility component section at block 912, sensor X1 signals switch S1 to cut off power to the external power response mechanism 402, thereby disabling the external power interface 308 and cutting off power to the distribution board 302. When the power to the distribution board 302 is cut off, the power to the internal flow response mechanism 316 is also immediately cut off, disabling the external fluid interface 312 and stopping the flow of fluid into and out of the electronic component section 604. With the power to the distribution board 302 cut off, other electronic components (if any) connected to the utility component section 602 cannot continue to operate because the entire utility component section 602 is shut down. The process ends at block 914.

[0080] In addition to the implementation methods described above, other implementation methods are also possible. For example:

[0081] - Server chassis can be designed with different form factors to accommodate different rack configurations;

[0082] - Additional cooling or other auxiliary components can be integrated into the functional parts;

[0083] - The structural design and mechanical mechanism of a leak response device can be different;

[0084] - Multiple fluid interfaces can be used individually with the integrated response mechanism;

[0085] - This architecture can be used for different chassis form factors, such as different U-heights.

[0086] The above description of the embodiments is not intended to be exhaustive or to limit the invention to the described forms. Specific embodiments and examples of the invention are described herein for illustrative purposes, but various modifications are possible.

Claims

1. An apparatus comprising: A utility component portion, adapted to be positioned within a server chassis having one or more electronic component portions accommodating server components, the utility component portion being adapted to be coupled to the one or more electronic component portions, the utility component portion comprising: Distribution board; A fluid processing module, a fan module electrically connected to the power distribution board, or both the fluid processing module and the fan module; An external power interface and an internal power interface, the external power interface including a connection adapted to electrically connect the power distribution board to a rack power supply, and the internal power interface including a connection adapted to electrically connect the power distribution board to electronic components in one or more electronic device sections within the chassis; An external fluid interface and an internal fluid interface, the external fluid interface including a connection adapted to connect the fluid processing module to a rack fluid source and a rack fluid return fluid, and the internal fluid interface including a connection adapted to connect the fluid processing module to a liquid cooling component in one or more electronic device sections; An internal flow response mechanism is coupled to the internal fluid interface and adapted to enable and disable the connection of the internal fluid interface.

2. The device according to claim 1, further comprising: An external power response mechanism is connected to the external power interface and is adapted to enable and disable the connection of the external power interface.

3. The device of claim 2, further comprising one or more utility device leakage detection sensors located in the utility device portion, the one or more utility device leakage detection sensors being communicatively connected to at least the external power response mechanism.

4. The device according to claim 2, wherein, The external power response mechanism enables the external power interface by physically connecting it to the rack power supply, and disables it by physically disconnecting it from the rack power supply.

5. The device according to claim 4, wherein, The external power interface includes a pair of clips that, when in their connected position, are adapted to physically connect to the rack busbar.

6. The device according to claim 2, wherein, The internal flow response mechanism enables the internal fluid interface by physically connecting it to each server fluid inlet and server fluid outlet, and disables it by physically disconnecting it from the rack power supply.

7. The device according to claim 6, wherein, At least one of the internal fluid interface connection and the external fluid interface connection includes a pair of drip-free blind fittings.

8. The device according to claim 2, wherein, The external power response mechanism is electrically connected to the internal flow response mechanism, wherein if the external power response mechanism disables the external power interface, the internal flow response mechanism immediately disables the internal fluid interface.

9. The device according to claim 3, further comprising: An external flow response mechanism, fluidly connected to the external fluid interface and communicatively connected to the sensor, the external flow response mechanism being adapted to enable and disable the external fluid interface; or An internal power response mechanism is coupled to the internal power interface and is adapted to enable and disable the internal power interface.

10. The device according to claim 1, wherein, The practical device portion is physically isolated from the electronic device portion.

11. A system comprising: Server chassis; Positioned in one or more electronic components in the chassis, at least one of the one or more electronic components housing a server component; The device according to any one of claims 1-10, wherein the utility component portion of the device is physically isolated from the one or more electronic component portions, wherein the connection of the internal power interface of the utility component portion is adapted to electrically connect the power distribution board to one or more servers in the electronic component portions within the chassis, and the connection of the internal fluid interface of the utility component portion is adapted to fluidly connect the fluid processing module to the server fluid inlet and server fluid outlet of each of the one or more servers.

12. The system according to claim 11, wherein, The device is the device according to claim 2, and the system further includes: One or more utility device leakage detection sensors, said one or more utility device leakage detection sensors being positioned within said utility device portion, said one or more utility device leakage detection sensors being communicatively coupled to said external power response mechanism; and One or more electronic device leakage detection sensors, said one or more electronic device leakage detection sensors being located in said electronic device portion, said one or more electronic device leakage detection sensors being communicatively coupled to at least said internal flow response mechanism.

13. The system of claim 12, further comprising: An external flow response mechanism is fluidly connected to the external fluid interface and is adapted to enable and disable the external fluid interface. or An internal power response mechanism is coupled to the internal power interface and is adapted to enable and disable the internal power interface.

14. The system according to claim 13, wherein, The one or more practical device leak detection sensors are communicatively connected to the external flow response mechanism; and The one or more electronic leakage detection sensors are communicatively connected to the internal power response mechanism.

Citation Information

Patent Citations

  • Cooling module

    CN109688761A

  • System and method for flowing fluids through electronic chassis modules

    US20110313576A1