Method for manufacturing a three-dimensional electrode

Abstract

The application relates to the technical field of micro-electro-mechanical systems, and provides a preparation method of a three-dimensional electrode, which comprises the following steps: preparing a first three-dimensional electrode pattern on a photoetching plate according to the shape of the orthographic projection of the three-dimensional electrode, wherein the first three-dimensional electrode pattern is a hollow pattern; spraying photoresist on the surface of a three-dimensional structural member to form a photoresist layer; aligning the three-dimensional structural member with the photoetching plate, taking the photoetching plate as an exposure mask, and exposing a first part of the photoresist layer opposite to the first three-dimensional electrode pattern; developing the first part to prepare a second three-dimensional electrode pattern on the photoresist layer; and preparing the three-dimensional electrode on the three-dimensional structural member based on the second three-dimensional electrode pattern. The preparation method of the three-dimensional electrode provided by the application prepares the three-dimensional electrode on the three-dimensional structural member by means of planar photoetching, the three-dimensional structural member is aligned with the photoetching plate by using the high alignment accuracy of a photoetching machine in the preparation process, and therefore the accuracy of the three-dimensional electrode preparation is improved.

Description

Technical Field

[0001] This invention relates to the field of microelectromechanical systems (MEMS) technology, and more particularly to a method for fabricating a three-dimensional electrode. Background Technology

[0002] Three-dimensional electrode fabrication has always been a complex and difficult-to-control process in microelectromechanical systems (MEMS). Since the side electrodes must be fabricated after quartz etching, they need to be reformulated within a three-dimensional structure, requiring a mask-and-deposit method. However, this method presents several problems: First, because the mask alignment is mechanical, the mask fabrication precision is poor, leading to poor alignment between the mask and the three-dimensional structure. Second, slippage is prone to occur when the mask is attached to the three-dimensional structure, causing electrode position deviations during deposition. Summary of the Invention

[0003] This invention provides a method for preparing a three-dimensional electrode, which solves the problem of poor precision in the preparation of three-dimensional electrodes in the prior art.

[0004] This invention provides a method for fabricating a three-dimensional electrode, comprising: fabricating a first three-dimensional electrode pattern on a photomask according to the shape of the orthographic projection of the three-dimensional electrode, wherein the first three-dimensional electrode pattern is a hollow pattern; spraying photoresist onto the surface of a three-dimensional structural component to form a photoresist layer; aligning the three-dimensional structural component with the photomask, using the photomask as an exposure mask, and exposing a first portion of the photoresist layer opposite to the first three-dimensional electrode pattern; developing the first portion to fabricate a second three-dimensional electrode pattern on the photoresist layer; and fabricating a three-dimensional electrode on the three-dimensional structural component based on the second three-dimensional electrode pattern.

[0005] According to a method for fabricating a three-dimensional electrode provided by the present invention, the step of fabricating a first three-dimensional electrode pattern on a photomask based on the shape of the orthographic projection of the three-dimensional electrode includes: when the three-dimensional structure has a sloping structure, fabricating the first three-dimensional electrode pattern on a photomask, wherein the first three-dimensional electrode pattern is the same as the orthographic projection pattern of the three-dimensional electrode.

[0006] According to a method for fabricating a three-dimensional electrode provided by the present invention, the step of fabricating a first three-dimensional electrode pattern on a photomask based on the shape of the orthographic projection of the three-dimensional electrode includes: when the three-dimensional structure has a sloping structure, fabricating a plurality of third three-dimensional electrode patterns on a plurality of photomasks respectively, wherein the position of each third three-dimensional electrode pattern is different, and the pattern formed by splicing the plurality of third three-dimensional electrode patterns is the same as the orthographic projection pattern of the three-dimensional electrode, and the first three-dimensional electrode pattern is formed by splicing the plurality of third three-dimensional electrode patterns.

[0007] According to a method for fabricating a three-dimensional electrode provided by the present invention, the step of fabricating a first three-dimensional electrode pattern on a photomask based on the shape of the orthographic projection of the three-dimensional electrode includes: when the three-dimensional structure has side edges, fabricating the first three-dimensional electrode pattern on two photomasks respectively, wherein each first three-dimensional electrode pattern is identical to the orthographic projection pattern of the three-dimensional electrode.

[0008] According to a method for fabricating a three-dimensional electrode provided by the present invention, the step of aligning the three-dimensional structure with a photomask, using the photomask as an exposure mask, and exposing the first part of the photoresist layer opposite to the first three-dimensional electrode pattern further includes: sequentially aligning a plurality of the third three-dimensional electrode patterns with a plurality of positions of the first part, and exposing the plurality of positions respectively, wherein the plurality of positions of the first part are spliced ​​together to form the first part.

[0009] According to a method for fabricating a three-dimensional electrode provided by the present invention, the method further includes: disposing a pair of photomasks on opposite sides of the three-dimensional structure; using the photomasks as exposure masks to expose the opposite surfaces and side edges of the three-dimensional structure.

[0010] According to a method for fabricating a three-dimensional electrode provided by the present invention, before the step of spraying photoresist onto the surface of the three-dimensional structure to form a photoresist layer, the fabrication method further includes: performing a three-dimensional coating on the three-dimensional structure.

[0011] According to a method for fabricating a three-dimensional electrode provided by the present invention, the method further includes: spraying positive photoresist onto the three-dimensional structure; after the step of fabricating a second three-dimensional electrode pattern on the photoresist layer, etching the metal on the three-dimensional structure other than the second portion opposite to the second three-dimensional electrode pattern to fabricate the three-dimensional electrode.

[0012] According to a method for fabricating a three-dimensional electrode provided by the present invention, the method further includes: spraying negative photoresist onto the three-dimensional structure.

[0013] According to a method for fabricating a three-dimensional electrode provided by the present invention, after the step of developing the first portion, the fabrication method further includes: developing the second three-dimensional electrode pattern on the photoresist layer to form a hollow pattern; using the photoresist layer as a mask, depositing the three-dimensional electrode at the second portion of the three-dimensional structure opposite to the second three-dimensional electrode pattern.

[0014] The method for fabricating a three-dimensional electrode provided by the present invention involves fabricating a first three-dimensional electrode pattern on a photolithography plate. The first three-dimensional electrode pattern has the same orthographic projection shape as the three-dimensional electrode. Thus, a three-dimensional electrode can be fabricated on a three-dimensional structure using planar photolithography. During the fabrication process, the high alignment accuracy of the photolithography machine is used to align the three-dimensional structure with the photolithography plate, thereby improving the accuracy of the three-dimensional electrode fabrication. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a flowchart of the method for preparing a three-dimensional electrode provided by the present invention;

[0017] Figure 2 This is one of the schematic diagrams of the method for preparing a three-dimensional electrode provided by the present invention;

[0018] Figure 3 This is a second schematic diagram of the method for preparing a three-dimensional electrode provided by the present invention;

[0019] Figure 4 This is the third schematic diagram of the method for preparing a three-dimensional electrode provided by the present invention;

[0020] Figure label:

[0021] 10: Photolithography plate; 11: First three-dimensional electrode pattern; 12: Third three-dimensional electrode pattern; 20: Three-dimensional structural component; 30: Three-dimensional electrode. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0023] The terms "first" and "second" in the specification and claims of this invention may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0024] The following is combined Figures 1-4The method for preparing the three-dimensional electrode of the present invention is described.

[0025] like Figure 1 As shown, in an embodiment of the present invention, the method for preparing a three-dimensional electrode specifically includes the following steps:

[0026] Step 101: Prepare a first three-dimensional electrode pattern 11 on the photomask 10 according to the shape of the orthographic projection of the three-dimensional electrode 30, wherein the first three-dimensional electrode pattern 11 is a hollow pattern; Step 102: Spray photoresist on the surface of the three-dimensional structure 20 to form a photoresist layer; Step 103: Align the three-dimensional structure 20 with the photomask 10, and use the photomask 10 as an exposure mask to expose the first part of the photoresist layer opposite to the first three-dimensional electrode 30; Step 104: Develop the first part to prepare a second three-dimensional electrode pattern on the photoresist layer; Step 105: Prepare a three-dimensional electrode on the three-dimensional structure 20 based on the second three-dimensional electrode pattern.

[0027] Specifically, in Figure 2 In the illustrated embodiment, the three-dimensional structure 20 has two planes and an inclined surface connected to these two planes. Electrodes fabricated on the planes and inclined surface of the three-dimensional structure 20 are located on different planes. Figure 4 In the illustrated embodiment, the three-dimensional structure 20 has opposing planes and opposing side edges, and the electrodes fabricated on the planes and side edges of the three-dimensional structure 20 are also located on different planes. In this application, the three-dimensional electrode 30 refers to the electrode located on different planes.

[0028] Furthermore, since the three-dimensional electrodes 30 are electrodes located on different planes, the first three-dimensional electrode pattern 11 should have the same shape as the orthographic projection of the three-dimensional electrode 30. During the fabrication of the three-dimensional electrode 30, photoresist is first sprayed onto the surface of the three-dimensional structure 20 to form a photoresist layer. Optionally, in embodiments of the present invention, the thickness of the photoresist layer is 3-5 micrometers.

[0029] Alignment marks on the substrate where the three-dimensional structure 20 is located are used to align with corresponding alignment marks on the photomask 10. The photomask 10 is used as a mask to expose and develop the first part of the photoresist layer opposite to the first three-dimensional electrode pattern 11, thereby fabricating a second three-dimensional electrode pattern on the photoresist layer. The second three-dimensional electrode pattern has the same shape as the three-dimensional electrode 30, and the position of the second three-dimensional electrode pattern on the photoresist layer is the same as the target position of the three-dimensional electrode 30 on the three-dimensional structure 20.

[0030] After the second three-dimensional electrode pattern is fabricated on the photoresist layer, the area on the three-dimensional structure 20 opposite to the second three-dimensional electrode pattern can be retained, while other parts can be etched away to fabricate the three-dimensional electrode 30; or the second three-dimensional electrode pattern on the photoresist layer can be cut out, and then the three-dimensional electrode 30 can be deposited on the three-dimensional structure 20 at the position opposite to the second three-dimensional electrode pattern using the photoresist layer as a mask.

[0031] The method for fabricating a three-dimensional electrode provided in this embodiment of the invention involves fabricating a first three-dimensional electrode pattern on a photolithography plate. The first three-dimensional electrode pattern has the same orthographic projection shape as the three-dimensional electrode. Thus, a three-dimensional electrode can be fabricated on a three-dimensional structure using planar photolithography. During the fabrication process, the high alignment accuracy of the photolithography machine is used to align the three-dimensional structure with the photolithography plate, thereby improving the accuracy of the three-dimensional electrode fabrication.

[0032] Optionally, in an embodiment of the present invention, the step of preparing a first three-dimensional electrode pattern 11 on a photomask 10 according to the shape of the orthographic projection of the three-dimensional electrode 30 includes: preparing a first three-dimensional electrode pattern 11 on a photomask 10 when the three-dimensional structure 20 has a sloped structure, wherein the first three-dimensional electrode pattern 11 is the same as the orthographic projection pattern of the three-dimensional electrode 30.

[0033] Specifically, such as Figure 2 As shown, when the three-dimensional structure 20 has two planes and an inclined plane connected to the two planes, to fabricate a three-dimensional electrode 30 at the two planes and the inclined plane, a first three-dimensional electrode pattern 11 can be fabricated on a photomask 10. The first three-dimensional electrode pattern 11 is the same as the orthographic projection pattern of the three-dimensional electrode 30. When the photomask 10 is used as a mask, the first three-dimensional electrode pattern 11 is opposite to the two planes and the inclined plane of the three-dimensional structure 20, and then a second three-dimensional electrode pattern is formed on the photoresist layer opposite the two planes and the inclined plane. The second three-dimensional electrode pattern has the same shape as the three-dimensional electrode 30.

[0034] Optionally, in one embodiment of the present invention, the step of preparing a first three-dimensional electrode pattern 11 on a photomask 10 according to the shape of the orthographic projection of the three-dimensional electrode 30 includes: when the three-dimensional structural member 20 has a sloping structure, preparing a plurality of third three-dimensional electrode patterns 12 on a plurality of photomasks 10 respectively, wherein the positions of each third three-dimensional electrode pattern 12 are different, and the pattern formed by splicing the plurality of third three-dimensional electrode patterns 12 is the same as the orthographic projection pattern of the three-dimensional electrode 30, and the first three-dimensional electrode pattern 11 is formed by splicing the plurality of third three-dimensional electrode patterns 12.

[0035] Specifically, such as Figure 3As shown, when the three-dimensional structure 20 has two planes and an inclined plane connected to these two planes, multiple third three-dimensional electrode patterns 12 can be fabricated on multiple photomasks 10 respectively. Each third three-dimensional electrode pattern 12 is positioned differently on its respective photomask 10, and each third three-dimensional electrode pattern 12 has the same width, but its length may be the same or different. In the case of... Figure 3 In the illustrated embodiment, the length of each third three-dimensional electrode pattern 12 is different. Specifically, in... Figure 3 In the embodiment shown, there are three photomasks 10. The length of the third three-dimensional electrode pattern 12 on the first photomask 10 is the same as the length of the three-dimensional electrode on the first plane of the three-dimensional structure 20. The length of the third three-dimensional electrode pattern 12 on the second photomask 10 is the same as the orthographic projection length of the three-dimensional electrode on the inclined surface of the three-dimensional structure 20. The length of the third three-dimensional electrode pattern 12 on the third photomask 10 is the same as the length of the three-dimensional electrode on the second plane of the three-dimensional structure 20.

[0036] Optionally, in an embodiment of the present invention, the step of preparing a first three-dimensional electrode pattern 11 on a photomask 10 according to the shape of the orthographic projection of the three-dimensional electrode 30 includes: preparing a first three-dimensional electrode pattern 11 on two photomasks 10 respectively when the three-dimensional structure 20 has side edges, wherein each first three-dimensional electrode pattern 11 is the same as the orthographic projection pattern of the three-dimensional electrode 30.

[0037] Specifically, such as Figure 4 As shown, when the three-dimensional structure 20 has side edges, three-dimensional electrodes 30 need to be fabricated on the plane and side edges of the three-dimensional structure 20. First three-dimensional electrode patterns 11 can be fabricated on two photomasks 10 respectively, and the length of each first three-dimensional electrode pattern 11 is the same as the length of the three-dimensional electrode on the plane of the three-dimensional structure 20 and the length of the orthographic projection of the three-dimensional electrode on the side edge.

[0038] In an embodiment of the present invention, the step of aligning the three-dimensional structure 20 with the photomask 10 and using the photomask 10 as an exposure mask to expose the first part of the photoresist layer opposite to the first three-dimensional electrode pattern 11 further includes: sequentially aligning a plurality of third three-dimensional electrode patterns 12 with a plurality of positions of the first part, and exposing the plurality of positions respectively, wherein the plurality of positions of the first part are spliced ​​together to form the first part.

[0039] Specifically, when multiple photomasks 10 are used to fabricate the second three-dimensional electrode pattern on the photoresist layer, the third three-dimensional electrode pattern 12 of each photomask 10 can be sequentially aligned with a position on the photoresist layer of the three-dimensional structure 20. Specifically, for example... Figure 3Taking the illustrated embodiment as an example, the third three-dimensional electrode pattern 12 on the first photomask 10 can be aligned with the photoresist layer on the first plane of the three-dimensional structure 20 for exposure. Then, the third three-dimensional electrode pattern 12 on the second photomask 10 can be aligned with the photoresist layer on the inclined surface of the three-dimensional structure 20 for exposure. Finally, the third three-dimensional electrode pattern 12 on the third photomask 10 can be aligned with the photoresist layer on the second plane of the three-dimensional structure 20 for exposure, thereby obtaining a second three-dimensional electrode pattern on the photoresist layer of the three-dimensional structure 20. The second three-dimensional electrode pattern has the same shape as the three-dimensional electrode 30.

[0040] In an embodiment of the present invention, the method for preparing the three-dimensional electrode 30 further includes: placing a pair of photomasks 10 on opposite sides of the three-dimensional structure 20; using the photomasks 10 as exposure masks to expose the opposite surfaces and side edges of the three-dimensional structure 20.

[0041] Specifically, when fabricating three-dimensional electrodes 30 on a three-dimensional structural component 20 with side edges, photomasks 10 can be set on opposite sides of the three-dimensional structural component 20 respectively, so that the first three-dimensional electrode pattern 11 on the photomask 10 is aligned with the plane of the three-dimensional structural component 20 and the photoresist layer on the side edges for exposure, so that double-sided three-dimensional electrodes 30 can be fabricated on opposite sides of the three-dimensional structural component 20, and the three-dimensional electrodes 30 on opposite sides can be made conductive.

[0042] Furthermore, in the above-described embodiments, when the number of photomasks 10 is one, the photomasks 10 compensate for the different distances between different parts of the three-dimensional structure 20 and the photomasks 10 during exposure, and expose the three-dimensional structure 20 once and develop it once, with the exposure amount, developer concentration and development time being consistent.

[0043] When there are multiple photomasks 10, multiple exposures and multiple developments can be performed according to the different angles of different parts of the three-dimensional structure 20 or the different distances between the three-dimensional structure 20 and the photomask 10 during exposure. The exposure amount, the concentration of the developer and the development time are adjusted according to the different compensation amounts of the first three-dimensional electrode pattern 11 of the photomask 10.

[0044] Optionally, in one embodiment of the present invention, before the step of spraying photoresist onto the surface of the three-dimensional structure 20 to form a photoresist layer, the method for fabricating the three-dimensional electrode further includes: performing a three-dimensional deposition on the three-dimensional structure 20 as an electrode metal layer. After the three-dimensional deposition, positive photoresist is sprayed onto the three-dimensional structure 20. After a second three-dimensional electrode pattern is fabricated on the photoresist layer, the metal on the three-dimensional structure 20 other than the second portion opposite to the second three-dimensional electrode pattern is etched to remove the positive photoresist, thereby fabricating the three-dimensional electrode 30.

[0045] Optionally, in one embodiment of the present invention, the method for fabricating the three-dimensional electrode further includes spraying negative photoresist onto the three-dimensional structure 20. After developing the first portion, the second three-dimensional electrode pattern is developed away on the photoresist layer to form a cutout. Using the photoresist layer as a mask, a film is deposited on the second portion of the three-dimensional structure 20 opposite to the second three-dimensional electrode pattern as an electrode metal layer. The three-dimensional electrode 30 is then deposited on the electrode metal layer. Finally, the photoresist in the area outside the second portion on the three-dimensional structure 20 is peeled off to obtain the three-dimensional electrode 30.

[0046] The method for fabricating a three-dimensional electrode provided in this invention achieves integral molding of the three-dimensional electrode by using planar photolithography, avoiding the impact of step-by-step fabrication of the three-dimensional electrode on the performance of the three-dimensional structure, saving the time and metal consumption of step-by-step fabrication of the three-dimensional electrode, improving product performance while also increasing efficiency and reducing costs.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for fabricating a three-dimensional electrode, characterized in that, include: A first three-dimensional electrode pattern is prepared on a photolithography plate according to the shape of the orthographic projection of the three-dimensional electrode, wherein the first three-dimensional electrode pattern is a hollow pattern, and the three-dimensional electrode refers to an electrode located on different planes. Photoresist is sprayed onto the surface of a three-dimensional structural component to form a photoresist layer; Align the three-dimensional structural component with the photomask, use the photomask as an exposure mask, and expose the first part of the photoresist layer that is opposite to the first three-dimensional electrode pattern. The first portion is developed to prepare a second three-dimensional electrode pattern on the photoresist layer; A three-dimensional electrode is fabricated on the three-dimensional structural component based on the second three-dimensional electrode pattern; The step of preparing the first three-dimensional electrode pattern on a photomask based on the shape of the orthographic projection of the three-dimensional electrode includes: When the three-dimensional structure has a sloping structure, multiple third three-dimensional electrode patterns are prepared on multiple photomasks respectively. The positions of each third three-dimensional electrode pattern are different. The pattern formed by splicing multiple third three-dimensional electrode patterns is the same as the orthographic projection pattern of the three-dimensional electrode. The first three-dimensional electrode pattern is formed by splicing multiple third three-dimensional electrode patterns. The multiple third three-dimensional electrode patterns are sequentially aligned with multiple positions of the first part, and the multiple positions are exposed respectively. The first part is formed by splicing multiple positions of the first part. When the three-dimensional structure has side edges, the first three-dimensional electrode pattern is prepared on two photomasks respectively, and each first three-dimensional electrode pattern is the same as the orthographic projection pattern of the three-dimensional electrode.

2. The method for preparing a three-dimensional electrode according to claim 1, characterized in that, When the three-dimensional structural component has side edges, the manufacturing method further includes: The pair of photomasks are respectively disposed on opposite sides of the three-dimensional structure; The photomask is used as an exposure mask to expose the relative surfaces and side edges of the three-dimensional structure.

3. The method for preparing a three-dimensional electrode according to claim 1, characterized in that, Prior to the step of spraying photoresist onto the surface of the three-dimensional structure to form a photoresist layer, the preparation method further includes: The three-dimensional structural component is subjected to three-dimensional coating.

4. The method for preparing a three-dimensional electrode according to claim 3, characterized in that, The preparation method further includes: Positive photoresist is sprayed onto the three-dimensional structural component; After the step of fabricating the second three-dimensional electrode pattern on the photoresist layer, the metal on the three-dimensional structure other than the second part opposite to the second three-dimensional electrode pattern is etched to fabricate the three-dimensional electrode.

5. The method for preparing a three-dimensional electrode according to claim 1, characterized in that, The preparation method further includes: Negative photoresist is sprayed onto the three-dimensional structural component.

6. The method for preparing a three-dimensional electrode according to claim 5, characterized in that, After the step of developing the first region, the preparation method further includes: The second three-dimensional electrode pattern is developed away on the photoresist layer to form a hollow pattern; Using the photoresist layer as a mask, the three-dimensional electrode is deposited at the second location of the three-dimensional structure opposite to the second three-dimensional electrode pattern.

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