An even heating and annealing device and method

Abstract

The present invention discloses a uniform heating and annealing device and method, which are used for heating and annealing a substrate, and include: a heating platform, having an exhaust port and an annular first sealing groove, and the first sealing groove is located on the outer ring of the exhaust port; a first sealing ring that can be deformed under pressure, the first sealing ring is arranged in the first sealing groove, and the first sealing ring protrudes from the first sealing groove for supporting the substrate, and the vertical projection of the substrate on the heating platform can completely cover the first sealing ring; an upper cavity cover, which is detachably and sealingly connected to the heating platform, and a heating cavity for accommodating the substrate is formed after the upper cavity cover is connected to the heating platform, and the pressure of the heating cavity is adjustable. By increasing the pressure difference between both sides of the substrate, the substrate presses the first sealing ring, and the first sealing ring is deformed under pressure until the substrate is in close contact with the heating platform, thereby forming good heat conduction and uniform heating, and avoiding the problems of warping strain and poor contact caused by uneven heating.

Description

Technical Field

[0001] The present invention relates to the technical field of annealing processes, and particularly to a uniform heating annealing device and method. Background Art

[0002] Solar thin-film battery: A solar thin-film battery, also known as a "solar chip" or "photovoltaic cell", is a photoelectric device that directly generates electricity using sunlight.

[0003] In the production of solar thin-film batteries, large-area glass substrates are required. During the processing of large-area glass substrates, in order to ensure their quality and further ensure the service life of power generation equipment, annealing processes need to be performed on the large-area glass substrates to reduce residual stress and reduce the tendency of deformation and cracking. Specifically, the heating annealing process for large-area glass substrates is widely used. For example, in the perovskite field, a large-area perovskite thin film is coated on a glass substrate, and then annealed at 100-150 °C to complete film crystallization; in the lithography field, after a photoresist is coated on a glass substrate, it needs to be thermally annealed to evaporate excess solvent, and so on.

[0004] Currently, existing annealing processes usually use a heating plate to heat a large-area glass substrate to complete annealing.

[0005] Specifically, when a large-area glass substrate is placed on a heating plate and the heating plate heats the large-area glass substrate, heat transfer occurs through contact between the heating plate and the glass substrate in a heat conduction manner to complete heating.

[0006] However, the above heating method has the following problems:

[0007] I. Deformation: When a large-area glass substrate is unevenly heated, warping strain will occur due to stress problems.

[0008] II. Cracking: When the surface of the glass substrate is uneven or warping occurs due to uneven heating, some areas cannot be in good contact with the heating plate, resulting in a change in the heat transfer method from contact heat conduction to air convection heat transfer. This will cause the temperature in this area to be much lower than that in the normal contact area, thereby forming a large temperature difference and resulting in a cracking phenomenon.

[0009] Therefore, how to ensure uniform heating of the substrate to ensure the annealing effect of the substrate is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0010] In view of this, the present invention provides a uniform heating annealing device to ensure uniform heating of the substrate to ensure the annealing effect of the substrate. In addition, the present invention also provides a uniform heating annealing method.

[0011] To achieve the above object, the present invention provides the following technical solutions:

[0012] A uniform heating and annealing device for heating and annealing a substrate, comprising:

[0013] A heating platform having an exhaust port and an annular first sealing groove located outside the exhaust port;

[0014] A first sealing ring that is deformable under pressure, the first sealing ring is disposed in the first sealing groove, and the first sealing ring protrudes from the first sealing groove to support the substrate, and the vertical projection of the substrate on the heating platform can completely cover the first sealing ring;

[0015] An upper cavity cover detachably and sealingly connected to the heating platform, and a heating cavity for accommodating the substrate is formed after the upper cavity cover is connected to the heating platform, and the pressure of the heating cavity is adjustable.

[0016] Preferably, in the above-mentioned uniform heating and annealing device, the shape of the first sealing groove is the same as the edge contour of the substrate.

[0017] Preferably, in the above-mentioned uniform heating and annealing device, the inner wall of the upper cavity cover is coated or pasted with a heat-insulating and reflective layer.

[0018] Preferably, in the above-mentioned uniform heating and annealing device, the upper cavity cover has a gas passage communicating with the heating cavity and a control valve for controlling the on-off of the gas passage.

[0019] Preferably, in the above-mentioned uniform heating and annealing device, the upper cavity cover further has a pressure detection device for monitoring the pressure in the heating cavity, and the pressure detection device is signal-connected to the control valve;

[0020] During the inflation process, when the pressure detection device detects that the pressure in the heating cavity reaches a preset value, the control valve is closed.

[0021] Preferably, in the above-mentioned uniform heating and annealing device, the first sealing groove is an arc-shaped groove, the cross-section of the first sealing ring is circular, and the first sealing ring is clamped in the first sealing groove by the notch of the first sealing groove.

[0022] Preferably, in the above-mentioned uniform heating and annealing device, the relationship between the height h of the first sealing ring protruding from the heating platform when installed in the first sealing groove and the diameter D of the first sealing ring is:

[0023] 10% D ≤ h ≤ 50% D.

[0024] Preferably, in the above-mentioned uniform heating and annealing device, a second sealing groove is provided on the heating platform, the second sealing groove is located on the outer ring of the first sealing groove, and the upper cavity cover is hermetically connected to the heating platform through a second sealing ring provided in the second sealing groove.

[0025] Preferably, in the above-mentioned uniform heating and annealing device, the upper cavity cover includes: a top plate and a side wall arranged along the circumference of the top plate, and the side wall is used for hermetically contacting the second sealing ring;

[0026] A positioning component for positioning the upper cavity cover is provided on the side wall, and the positioning component includes positioning guide posts arranged on the heating platform and capable of being clamped on both sides of the side wall.

[0027] Preferably, in the above-mentioned uniform heating and annealing device, it further includes:

[0028] A driving transmission system for lifting the upper cavity cover;

[0029] A guiding member for guiding the lifting of the upper cavity cover.

[0030] A uniform heating and annealing method, which uses the uniform heating and annealing device described in any one of the above, includes the steps:

[0031] Place the substrate to be processed on the first sealing ring of the heating platform, and the first sealing ring is completely attached to the bottom surface of the substrate;

[0032] Move the upper cavity cover to make the upper cavity cover hermetically connected to the heating platform and form a heating cavity for accommodating the substrate;

[0033] Fill the heating cavity with an inert gas and increase the pressure in the heating cavity until the first sealing ring deforms until the substrate is completely attached to the heating platform;

[0034] Start the heating platform to heat the substrate;

[0035] Turn off the heating function of the heating platform, release the pressure in the heating cavity, open the upper cavity cover, and take out the substrate.

[0036] The present invention provides a uniform heating and annealing device. When in use, place the substrate to be processed on the first sealing ring and ensure that the first sealing ring is completely attached to the substrate; then, hermetically connect the above-mentioned upper cavity cover to the heating platform and ensure that the substrate and the first sealing ring are located in the heating cavity; adjust the pressure in the heating cavity to increase the pressure in the heating cavity, and the first sealing ring is deformed under pressure until the substrate supported by the first sealing ring is completely attached to the heating platform. During this process, the gas between the substrate and the heating platform is discharged through the exhaust port to increase the pressure difference on both sides of the substrate; stop pressurizing and start the heating platform for heating.

[0037] In this application, by increasing the pressure difference between both sides of the substrate, the substrate squeezes the first sealing ring, and the first sealing ring is deformed under pressure until the substrate is in close contact with the heating platform, thereby forming good heat conduction and uniform heating, avoiding the problems of warping strain and poor contact caused by uneven heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0039] Figure 1 It is a schematic structural diagram of a uniform heating and annealing device disclosed in an embodiment of the present invention;

[0040] Figure 2 It is a schematic structural diagram of the uniform heating and annealing device before pressure boosting disclosed in an embodiment of the present invention;

[0041] Figure 3 It is a schematic structural diagram of the uniform heating and annealing device after pressure boosting disclosed in an embodiment of the present invention;

[0042] Figure 4 It is a top view of the heating platform of the uniform heating and annealing device disclosed in an embodiment of the present invention;

[0043] Figure 5 It is a main view sectional view of the heating platform and the first sealing ring of the uniform heating and annealing device disclosed in an embodiment of the invention;

[0044] Figure 6 It is a flowchart of the uniform heating and annealing method disclosed in an embodiment of the present invention;

[0045] Among them,

[0046] 1 is the heating platform, 2 is the upper cavity cover, 3 is the substrate, 4 is the exhaust port, 5 is the first sealing ring, 6 is the second sealing ring, 7 is the gas channel, 8 is the control valve, 9 is the pressure detection device;

[0047] 11 is the first sealing groove, 12 is the second sealing groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0048] The present invention discloses a uniform heating and annealing device to ensure uniform heating of the substrate to ensure the annealing effect of the substrate. In addition, the present invention also discloses a uniform heating and annealing method.

[0049] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0050] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0051] As Figures 1 - 3 shown, the present invention discloses a uniform heating and annealing device for heating and annealing a substrate 3, which specifically includes: a heating platform 1, a first sealing ring 5, and an upper cavity cover 2. Among them, the heating platform 1 has an exhaust port 4 and an annular first sealing groove 11, and the first sealing groove 11 is located on the outer ring of the exhaust port 4; the above-mentioned first sealing ring 5 is a closed annular member, and the first sealing ring 5 can deform when pressed. During installation, the first sealing ring 5 is fixed in the first sealing ring 11. When in use, the substrate 3 is placed on the first sealing ring 5. It should be noted that the vertical projection of the substrate 3 on the heating platform 1 can completely cover the first sealing ring 5. In this way, it can be ensured that the first sealing ring 5 is completely attached to the substrate 3. At this time, the above-mentioned exhaust port 4 is located between the first sealing ring 5, the heating platform 1, and the substrate 3. The above-mentioned upper cavity cover 2 is detachably and sealingly connected to the heating platform 1, and a heating cavity for accommodating the substrate 3 is formed after the upper cavity cover 2 is connected to the heating platform 1. In practice, the pressure in this heating cavity is adjustable.

[0052] When in use, the substrate 3 to be processed is placed on the first sealing ring 5, and it is ensured that the first sealing ring 5 is completely attached to the substrate 3; then, the above-mentioned upper cavity cover 2 is sealingly connected to the heating platform 1, and it is ensured that the substrate 3 and the first sealing ring 5 are located in the heating cavity; the pressure in the heating cavity is adjusted to increase the pressure in the heating cavity. The first sealing ring 5 is deformed under pressure until the substrate 3 supported by the first sealing ring 5 is completely attached to the heating platform 1. During this process, the gas between the substrate 3 and the heating platform 1 is discharged through the exhaust port 4 to increase the pressure difference on both sides of the substrate 3; stop boosting the pressure and start the heating platform 1 for heating.

[0053] In this application, by increasing the pressure difference between both sides of the substrate 3, the substrate 3 presses the first sealing ring 5, and the first sealing ring 5 is deformed under pressure until the substrate 3 is in close contact with the heating platform 1, thereby forming good heat conduction and uniform heating, and avoiding the problems of warping strain and poor contact caused by uneven heating.

[0054] In a specific embodiment, the shape of the above-mentioned first sealing ring 5 is the same as the edge contour of the substrate 3. As Figure 4 shown, the first sealing ring 5 can be set as a rectangular ring, and correspondingly, the substrate 3 is a rectangular plate. Through the above setting, it is convenient for the substrate 3 to contact and receive force with the first sealing ring 5, and the substrate 3 can be prevented from tilting when being pressed. In practice, when the substrate 3 is a disc, the first sealing ring 5 can also be set as a circular ring. Those skilled in the art can understand that the shape of the first sealing ring 5 and the edge contour shape of the substrate 3 can be set according to different needs and are all within the protection scope.

[0055] Since the first sealing ring 5 is assembled in the first sealing groove 11, therefore, the shape of the first sealing ring 5 can be limited by limiting the shape of the first sealing groove 11. That is, the first sealing groove 11 can be set as a rectangular annular groove. Then, through the limiting effect of the first sealing groove 11, the flexible first sealing ring 5 can be snapped into the first sealing groove 11, and at the same time, the shape of the first sealing ring 5 is limited.

[0056] In a further embodiment, a heat-insulating reflective layer is coated or pasted on the inner wall of the above-mentioned upper cavity cover 2. By setting the heat-insulating reflective layer, the energy utilization rate in the upper cavity cover 2 can be improved. The heat-insulating reflective layer can be a glass fiber layer or the like.

[0057] The upper cavity cover 2 disclosed in the present application has a gas passage 7 for communicating with the heating cavity and a control valve 8 for controlling the on-off of the gas passage 7. During use, the control valve 8 can be opened to conduct the gas passage 7, and gas is filled into the heating cavity through the gas passage 7, so that the pressure in the heating cavity rises and presses towards the heating platform 1. During this process, the first sealing ring 5 is deformed under pressure, and the air between the substrate 3 and the heating platform 1 is discharged through the exhaust port 4, so that a pressure difference appears on both sides of the substrate 3 and it is pressed on the heating platform 1, ensuring full contact between the substrate 3 and the heating platform 1.

[0058] After the heating is completed, the control valve 8 can be opened to conduct the gas passage 7, and then the heating cavity is communicated with the external atmospheric pressure to realize the pressure relief process; then the upper cavity cover 2 is separated from the heating platform 1, and the substrate 3 is taken out. During this process, due to the decrease in pressure, the first sealing ring 5 returns to its original size, which can lift the substrate 3, facilitating the removal of the substrate 3 and avoiding the influence of the residual temperature of the heating platform 1 on the substrate 3.

[0059] On the basis of the above technical solution, the upper cavity cover 2 further has a pressure detection device 9 for monitoring the pressure in the heating cavity, and the pressure detection device 9 is signal-connected to the control valve 8. Specifically, during the inflation process, when the pressure detection device 9 detects that the pressure in the heating cavity reaches the preset value, the control valve 8 is closed. By signal-connecting the pressure detection device 9 and the control valve 8, the automation of the entire control process is realized, the response speed of the control valve 8 can be improved, which is beneficial to improving the accuracy of pressure control and avoiding the problem that the substrate 3 is damaged due to excessive pressure.

[0060] In a specific embodiment, as Figure 5 shown, the above-mentioned first sealing groove 11 is an arc groove, and the cross-section of the first sealing ring 5 is circular. Specifically, the first sealing ring 5 is clamped in the first sealing groove 11 through the notch of the first sealing groove 11. A method of assembling the sealing groove and the sealing ring is disclosed here. In practice, in order to provide a margin for the deformation of the sealing ring, the arc groove of the first sealing groove 11 can be set as an elliptical arc groove, and the major axis of the ellipse is slightly larger than the diameter of the first sealing ring 5. The specific dimensions and shape of the first sealing groove 11 can be set according to the deformation of the first sealing ring 5 and the size inside the first sealing ring 5.

[0061] In practice, during pressurization, if the height of the first sealing ring 5 protruding from the heating platform 1 is too large, it cannot be completely deformed, resulting in poor contact between the substrate 3 and the heating platform 1; if the height of the first sealing ring 5 protruding from the heating platform 1 is too small, a good sealing effect cannot be formed. Therefore, the size of the first sealing ring 5 is specifically limited, and the relationship between the height h protruding from the heating platform and the diameter D of the first sealing ring is required: 10% D ≤ h ≤ 50% D, combined with Figure 5 content.

[0062] In a further embodiment, as Figure 4 shown, the above-mentioned heating platform 1 has a second sealing groove 12, and the second sealing groove 12 is located on the outer ring of the first sealing groove 11. The upper cavity cover 2 and the heating platform 1 are sealed and connected through a second sealing ring 6 arranged in the second sealing groove 12. The upper cavity cover 2 and the heating platform 1 are sealed and connected through the second sealing ring 6, which can effectively ensure the sealing performance of the heating cavity. In practice, both the first sealing groove 11 and the second sealing groove 12 can be set as rectangular annular grooves. Specifically, it only needs to match the shape of the substrate 3.

[0063] Based on the above technical solution, in order to realize the relative movement between the upper cavity cover 2 and the heating platform 1, a drive transmission system for driving the lifting of the upper cavity cover 2 and a guiding member for guiding the lifting of the upper cavity cover 2 are also provided in this application. Among them, the drive transmission system may include a motor and a ball screw structure, that is, the lifting of the upper cavity cover 2 is realized by the rotation of the ball screw. In practice, if a ball screw is used, the guiding of the lifting of the upper cavity cover 2 can be completed simultaneously. In practice, the drive transmission system can also be set as a cylinder, that is, the lifting drive of the upper cavity cover 2 is realized by the telescopic movement of the cylinder rod. At the same time, the above guiding member can be the cooperation of a guiding column and a guiding sleeve.

[0064] As Figure 2 and Figure 3 shown, the upper cavity cover 2 in this application includes a top plate and a side wall arranged along the circumference of the top plate. Specifically, the top plate and the side wall can be an integral structure, that is, the upper cavity cover 2 is a cylindrical structure with an opening, and the side wall is used for sealing contact with the second sealing ring 6 to realize the sealed connection between the upper cavity cover 2 and the heating platform 1. Preferably, the side wall is provided with a positioning component for positioning with the heating platform 1, and the positioning component includes positioning guide columns arranged on the heating platform 1 and capable of being clamped on both sides of the side wall. A positioning method of the upper cavity cover 2 and the heating platform 1 is disclosed here. Specifically, it is the positioning of the side wall and the second sealing ring 6 to ensure the accurate position of the second sealing ring 6 and the upper cavity cover 2 and avoid deviation, which affects the sealing effect.

[0065] Combined with the above content, the heating platform 1 disclosed in this application can be a microcrystalline glass heating plate. By using a microcrystalline glass heating plate, the temperature on the surface can be guaranteed to be uniform and the heating efficiency is high.

[0066] In addition, this application also discloses a uniform heating and annealing method. As Figure 6 shown, it mainly applies the heating and annealing device disclosed in the above embodiment, and specifically includes the following steps:

[0067] Step S1: Assemble the substrate;

[0068] Place the substrate to be processed on the first sealing ring of the heating platform. By making the first sealing ring fit with the bottom surface of the substrate, the substrate is lifted off the heating platform. During this process, the first sealing ring is a complete closed-loop structure and can completely fit with the bottom surface of the substrate, so that a sealed chamber is formed between the substrate, inside the first sealing ring and the heating platform.

[0069] Step S2: Seal the chamber;

[0070] Move the upper cavity cover so that there is a sealed connection between the upper cavity cover and the heating platform, and a heating cavity for accommodating the substrate is formed. The upper cavity cover and the heating platform can be sealed by a second sealing ring provided on the heating platform. To ensure that the substrate is covered in the heating cavity, the second sealing ring needs to be located outside the first sealing ring. For the specific position, it can be set according to the size of the substrate. A sealed heating cavity is formed through the sealing between the upper cavity cover and the heating platform to avoid waste of energy.

[0071] Step S3: Boost the pressure;

[0072] Fill the heating cavity with an inert gas to increase the pressure in the heating cavity until the first sealing ring deforms and the substrate fits completely with the heating platform. During this process, the gas in the sealed chamber between the first sealing ring, the substrate and the heating platform is discharged through the exhaust port on the heating platform, so that a pressure difference is formed between the upper and lower sides of the substrate. Under the action of the pressure difference, the substrate presses the first sealing ring until the substrate fits completely with the heating platform.

[0073] Step S4: Heat;

[0074] After the substrate fits completely with the heating platform, start the heating platform to heat the substrate until the heating requirement is met. The heating temperature of the heating platform can be set according to different needs and is within the protection range.

[0075] Step S5: Sort and pick up the parts.

[0076] Turn off the heating function of the heating platform, complete the annealing process, release the pressure in the heating cavity, open the upper cavity cover, and take out the substrate.

[0077] In this application, by increasing the pressure difference between the two sides of the substrate, the substrate presses the first sealing ring, and the first sealing ring is deformed under pressure until the substrate is in close contact with the heating platform, thereby forming good heat conduction and uniform heating, and avoiding the problems of warping strain and poor contact caused by uneven heating.

[0078] As shown in the present invention and the claims, unless the context clearly indicates an exceptional situation, words such as "a", "one", "a kind of" and / or "the" are not specifically singular and may also include plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. An element defined by the statement "comprising one..." does not exclude the existence of another identical element in the process, method, commodity or device including the element.

[0079] In this specification, the various embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0080] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A uniform heating and annealing device, characterized in that, For heating and annealing a substrate (3), comprising: A heating platform (1), on which there are an exhaust port (4) and an annular first sealing groove (11), and the first sealing groove (11) is located on the outer ring of the exhaust port (4); A first sealing ring (5) that can be deformed under pressure, the first sealing ring (5) is arranged in the first sealing groove (11), and the first sealing ring (5) protrudes from the first sealing groove (11) for supporting the substrate (3), and the vertical projection of the substrate (3) on the heating platform (1) can completely cover the first sealing ring (5); An upper cavity cover (2), the upper cavity cover (2) is detachably and sealingly connected to the heating platform (1), and after the upper cavity cover (2) is connected to the heating platform (1), a heating cavity for accommodating the substrate (3) is formed, and the pressure of the heating cavity is adjustable; The shape of the first sealing groove (11) is the same as the edge contour of the substrate (3); the first sealing groove (11) is an arc-shaped groove, the cross-section of the first sealing ring (5) is circular, and the first sealing ring (5) is snap-fitted in the first sealing groove (11) through the notch of the first sealing groove (11); the relationship between the height h of the first sealing ring (5) protruding from the heating platform (1) when installed in the first sealing groove (11) and the diameter D of the first sealing ring (5) is: 10% D ≤ h ≤ 50% D; The upper cavity cover (2) has a gas channel (7) for communicating with the heating cavity and a control valve (8) for controlling the on-off of the gas channel (7); the upper cavity cover (2) also has a pressure detection device (9) for monitoring the pressure in the heating cavity, and the pressure detection device (9) is signal-connected to the control valve (8); During the inflation process, when the pressure detection device (9) detects that the pressure in the heating cavity reaches a preset value, the control valve (8) is closed.

2. The uniform heating and annealing device according to claim 1, wherein The inner wall of the upper cavity cover (2) is coated or pasted with a heat-insulating and reflective layer.

3. The uniform heating and annealing device according to claim 1 or 2, characterized in that, The heating platform (1) has a second sealing groove (12), the second sealing groove (12) is located on the outer ring of the first sealing groove (11), and the upper cavity cover (2) and the heating platform (1) are sealingly connected through a second sealing ring (6) arranged in the second sealing groove (12).

4. The uniform heating and annealing device according to claim 3, characterized in that, The upper cavity cover (2) includes: a top plate and a side wall arranged along the circumference of the top plate, and the side wall is used for sealing contact with the second sealing ring (6); The side wall has a positioning component for positioning with the heating platform (1), and the positioning component includes positioning guide posts arranged on the heating platform (1) and capable of being clamped on both sides of the side wall.

5. The uniform heating and annealing device according to claim 4, characterized in that, Further comprising: A driving and transmission system for lifting the upper cavity cover (2); A guiding member for guiding the lifting of the upper cavity cover (2).

6. A uniform heating and annealing method, characterized in that, Applying the uniform heating and annealing device according to any one of claims 1-5, comprising the steps of: Placing the substrate to be processed, the substrate is placed on the first sealing ring of the heating platform, and the first sealing ring is completely attached to the bottom surface of the substrate; Move the upper cavity cover to make the upper cavity cover be hermetically connected to the heating platform and form a heating cavity for accommodating the substrate; Fill the heating cavity with inert gas, increase the pressure in the heating cavity until the first sealing ring deforms until the substrate is completely attached to the heating platform; Start the heating platform to heat the substrate; Turn off the heating function of the heating platform, release the pressure in the heating cavity, open the upper cavity cover, and take out the substrate.

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