Electronic tag production process and production device

Abstract

The application discloses an electronic tag production process method, at least comprising the following steps: processing rubber material: peeling off the film on two rubber materials, and cutting the rubber material into rubber sheets of preset specifications respectively; placing the rubber sheet: placing the rubber sheet on two bottom films respectively; placing the electronic chip: grabbing the electronic chip and placing a single electronic chip on the first side of a single rubber sheet; pressing the rubber sheet: laminating the two bottom films with the rubber sheet, keeping the rubber sheet one-to-one corresponding and pressing the two bottom films with the rubber sheet into a multi-layer structure, the structure layers are the bottom film, the rubber sheet, the electronic chip, the rubber sheet and the bottom film in sequence, and the pressed rubber sheet contains a single electronic chip inside. The application pre-processes the rubber material into rubber sheets of preset specifications, and presses the electronic chip using the rubber sheet to support the electronic tag, thereby reducing the waste of rubber material and lowering the production cost of the electronic tag. The application also discloses an electronic tag production device suitable for the process method.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic tag production, in particular to an electronic tag production process and production device. BACKGROUND

[0002] Under the background of global industrial intelligence and the vigorous development of China's intelligent manufacturing, RFID (Radio Frequency Identification) electronic tags for tires have been increasingly widely used in the tire industry. Embedding RFID electronic tags in tires and using them as relevant information of the tires is of great significance for the standardized production of the tire industry.

[0003] Before being implanted in tires, RFID electronic tags for tires need to be pre-processed to facilitate the implantation of the electronic tags. A common processing method is to package and press-fit the RFID electronic chip into the interior of two layers of rubber material with a special formula, and then press-fit it to cut and process the rubber material containing the RFID electronic chip into a style or specification that can be easily implanted in the tire. The existing technology produces electronic tags by packaging multiple electronic chips into two layers of rubber material, cutting the rubber material to obtain multiple two-layer rubber material structures with pressed electronic chips, and then performing subsequent implantation actions. On the one hand, after the cutting of the rubber material is completed, only the rubber material with pressed electronic chips is utilized, while the remaining rubber material frame becomes waste, causing serious waste. On the other hand, after the electronic chip is wrapped by two layers of rubber material, positioning and detection during the cutting process are difficult, and positioning deviation easily occurs, leading to the cutting of the electronic chip, resulting in production loss.

[0004] Therefore, how to reduce the production cost of electronic tags has become a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0005] Therefore, the purpose of the present application is to provide an electronic tag production process to reduce the production cost of electronic tags.

[0006] Another purpose of the present application is to provide an electronic tag production device suitable for the above-mentioned process for producing electronic tags.

[0007] To achieve the above-mentioned purposes, the present application provides the following technical solutions:

[0008] An electronic tag production process, at least comprising the following steps:

[0009] Processing rubber material: peeling off the film on two rubber materials, and cutting the rubber material after peeling off the film into rubber pieces of a predetermined specification;

[0010] Placing rubber pieces: placing the rubber pieces produced by the two rubber materials on two bottom films, respectively;

[0011] placing electronic chip: grabbing electronic chip and placing single said electronic chip on the first side of single said adhesive sheet;

[0012] pressing adhesive sheet: laminating two said bottom film layers with said adhesive sheet placed thereon, keeping said adhesive sheet one-to-one corresponding and pressing two said bottom film layers with said adhesive sheet placed thereon into one multi-layer structure, the structure layers of the multi-layer structure are bottom film, adhesive sheet, electronic chip, adhesive sheet, bottom film in turn, and the inside of the pair of pressed said adhesive sheet contains single said electronic chip.

[0013] Preferably, in the above-mentioned electronic tag production process, in the step of placing adhesive sheet, the two said bottom film layers have the side with said adhesive sheet placed thereon arranged oppositely.

[0014] Preferably, in the above-mentioned electronic tag production process, in the step of processing adhesive material, the said adhesive sheet formed by cutting two said adhesive material layers is of the same specification.

[0015] Preferably, in the above-mentioned electronic tag production process, in the step of placing electronic chip, said electronic chip is placed at the center of the first side of single said adhesive sheet.

[0016] An electronic tag production device suitable for electronic tag production by the electronic tag production process provided in any one of the above-mentioned embodiments, comprising:

[0017] at least two film stripping units, said film stripping units are used to strip the film on said adhesive material;

[0018] at least two bottom film supply units and at least two cutting and placing units, said bottom film supply units are used to supply said bottom film, said cutting and placing units are used to cut said adhesive material after the film is stripped to obtain said adhesive sheet of preset specification, and place said adhesive sheet of preset specification on at least two said bottom film layers in intervals;

[0019] pressing unit, said pressing unit is arranged downstream of said cutting and placing unit, two said bottom film layers with said adhesive sheet placed thereon are laminated at the position of said pressing unit, and said adhesive sheet on two said bottom film layers are one-to-one corresponding and pressed into one integrated structure by said pressing unit;

[0020] chip placing unit, said chip placing unit is arranged upstream of said pressing unit, said chip placing unit is used to grab electronic chip and place said electronic chip on the first side of said adhesive sheet on one of said bottom film layers, the first side of said adhesive sheet is the side of said adhesive sheet facing away from said bottom film.

[0021] Preferably, in the electronic tag production device, the two bottom films with the adhesive sheets are laminated at an acute angle at the position of the pressing unit and are pressed by the pressing unit.

[0022] Preferably, in the electronic tag production device, a chip supply unit is arranged upstream of the chip placement unit, and the chip supply unit is used to arrange and deliver the electronic chips at intervals to the grabbing position of the chip placement unit.

[0023] Preferably, in the electronic tag production device, a positioning sensor unit is further included, and the detection range of the positioning sensor unit at least includes the placement position of the chip placement unit, and the positioning sensor unit is used to position the center position of the adhesive sheet and guide the chip placement unit to place the electronic chip at the center position of the adhesive sheet.

[0024] Preferably, in the electronic tag production device, the positioning sensor unit is an industrial vision camera, an eddy current sensor or an optical sensor.

[0025] Preferably, in the electronic tag production device, the adhesive sheets on the two bottom films are of the same size or different sizes.

[0026] Preferably, in the electronic tag production device, the pressing unit includes a pair of first pressing rollers, a pair of second pressing rollers and a driving motor, the gap between the first pressing rollers and the second pressing rollers is in interference fit with the two adhesive sheets, and the driving motor is in driving connection with the first pressing rollers and the second pressing rollers to drive the first pressing rollers and the second pressing rollers to rotate.

[0027] Preferably, in the electronic tag production device, the cutting and placing unit places the adhesive sheets of a preset size on the bottom film at intervals.

[0028] It can be seen from the technical scheme that the electronic tag production process method provided by the application at least comprises the steps of: a processing adhesive step, a placing adhesive sheet step, a placing electronic chip step and a pressing adhesive sheet step, wherein in the processing adhesive step, the film on the two adhesives is peeled off, and the adhesives after the film is peeled off are cut into adhesive sheets of a preset specification respectively, that is, the adhesives are cut in the production process of the electronic tag instead of being cut in the use process of the electronic tag in the prior art, the adhesives are saved by pre-cutting the adhesives, and the electronic tag does not have the problem of mis-cutting in the subsequent use due to the pre-cutting of the adhesives, thereby saving the adhesives; in the placing adhesive sheet step, two bottom films are used to carry the adhesive sheets cut from the two adhesives, and in the placing electronic chip step, the electronic chip is placed on the first side of the adhesive sheet on any one of the bottom films, the first side of the adhesive sheet being the side of the adhesive sheet away from the bottom film, after the placement of the electronic chip is completed, the pressing adhesive sheet step laminates the two bottom films on which the adhesive sheets are placed, keeps the adhesive sheets one-to-one corresponding and presses the two bottom films on which the adhesive sheets are placed to form an integrated multi-layer structure, the structure layers of the multi-layer structure are the bottom film, the adhesive sheet, the electronic chip, the adhesive sheet and the bottom film in turn, and the adhesive sheets pressed in pairs contain a single electronic chip, so as to complete the preparation of the electronic tag.

[0029] The electronic tag production process method provided by the application pre-cuts the adhesives into adhesive sheets of a preset specification, uses the adhesive sheets of the preset specification after cutting as the carrier of the subsequent electronic tag to produce the electronic tag, compared with the technical means that a large amount of adhesive is wasted when the whole adhesive sheet is pressed to make the electronic tag in the prior art, the adhesives are cut and used immediately in the production stage and the use stage of the electronic tag, the adhesive sheets formed after the cutting of the adhesives are completely used, and the production cost of the electronic tag is reduced; at the same time, after the pressing adhesive sheet step is completed, in the electronic tag made, the multi-layer structure of the electronic tag is the bottom film, the adhesive sheet, the electronic chip, the adhesive sheet and the bottom film in turn, when the electronic tag needs to be used, only the bottom films at both ends of a single electronic tag need to be cut to obtain a single usable electronic tag, the cutting process is simple and transparent, and no adhesive waste is generated after cutting, the production loss is avoided, and the production cost of the electronic tag is further reduced. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical schemes in the embodiments of the application or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creating labor.

[0031] Figure 1 The electronic tag production process method provided by the embodiment of the application is shown in the flowchart.

[0032] Figure 2 The electronic tag production process method provided by the embodiment of the present application is shown in the flowchart.

[0033] Figure 3 The electronic tag production device structure provided by the embodiment of the present application is shown in the schematic diagram.

[0034] In the schematic diagram, 10 is a film stripping unit, 20 is a bottom film supply unit, 210 is a bottom film, 30 is a cutting and placing unit, 40 is a chip placing unit, 50 is a pressing unit, 510 is a first pressing roller, 520 is a second pressing roller, 60 is a chip supply unit, 710 is a glue, 720 is a glue sheet, 810 is an electronic chip, and 820 is an electronic tag. DETAILED DESCRIPTION

[0035] The core of the present application is to disclose an electronic tag production process method to reduce the production cost of electronic tags.

[0036] Another purpose of the present application is to provide an electronic tag production device suitable for the above process method for producing electronic tags.

[0037] In order for those skilled in the art to better understand the present application, the embodiments of the present application will be described below with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the content of the invention described in the claims in any way. In addition, the entire content of the embodiments shown below is not limited to what is necessary for the solution of the invention described in the claims.

[0038] As shown in Figure 1 and Figure 2 The electronic tag production process method provided by the embodiment of the present application at least includes the following steps:

[0039] S01: Process glue: strip the film on the two pieces of glue 710, and cut the glue 710 after stripping the film into glue sheets 720 of a predetermined size;

[0040] S02: Place the glue sheet: place the glue sheets 720 produced by the two pieces of glue 710 on two bottom films 210 respectively;

[0041] S03: Place the electronic chip: grab the electronic chip 810 and place a single electronic chip 810 on the first side of a single glue sheet 720;

[0042] S04: laminating the two pieces of the bottom film 210 with the film 720 placed thereon, keeping the film 720 one-to-one corresponding and laminating the two pieces of the bottom film 210 with the film 720 placed thereon into a multi-layer structure, the multi-layer structure having the structure layers in the order of the bottom film 210, the film 720, the electronic chip 810, the film 720, and the bottom film 210, and the pair of laminated films 720 containing the single electronic chip 810.

[0043] It should be noted that the cutting of the film 710 in step S01 is in the production process of the electronic tag 820, rather than in the use process of the electronic tag 820 in the prior art. The present application realizes the saving of the film 710 by pre-cutting the film 710, and at the same time, the pre-cutting of the film 710 avoids the problem of mis-cutting of the electronic tag 820 in the subsequent use, thereby saving the film 710.

[0044] It should be further noted that in step S03, the electronic chip 810 is placed on the first side of the film 720 on any one of the bottom films 210, where the first side of the film 720 is the side of the film 720 facing away from the bottom film 210.

[0045] The electronic tag production process method provided by the embodiment of the present application pre-cuts the film 710 into a film 720 of a preset specification, and uses the pre-cut film 720 of the preset specification as a carrier for the subsequent production of the electronic tag 820. Compared with the prior art of using a whole film 720 to laminate to produce the electronic tag 820, which results in a large amount of waste of the film 710, the present application realizes the cutting-for-use of the film 710 in both the production stage and the use stage of the electronic tag 820. The film 720 formed after the cutting of the film 710 is completely used, thereby reducing the production cost of the electronic tag 820.

[0046] At the same time, after the step of laminating the film 720 is completed, the electronic tag 820 is produced. Since the multi-layer structure of the electronic tag 820 is in the order of the bottom film 210, the film 720, the electronic chip 810, the film 720, and the bottom film 210, only the bottom film 210 at both ends of a single electronic tag 820 needs to be cut when the electronic tag 820 is used, so that a single usable electronic tag 820 can be obtained. The cutting process is simple and transparent, and no waste of the film 710 after cutting is generated, thereby avoiding production loss and further reducing the production cost of the electronic tag 820.

[0047] Further, in step S02, the two sides of the bottom film 210 with the film 720 placed thereon are arranged opposite to each other, so that in the subsequent step S04, the bottom film 210 does not need to be rotated, but can be directly laminated.

[0048] Furthermore, in step S01, the two adhesive materials 710 can be cut into film sheets 720 of different preset specifications, or they can be cut into film sheets 720 of the same preset specifications. In a preferred embodiment of the present invention, the two adhesive materials 710 are cut into film sheets 720 of the same preset specifications so that the film sheets 720 on both sides are the same specification when the electronic tag 820 is used, which facilitates cutting and implantation.

[0049] Furthermore, in step S03, the electronic chip 810 is preferably placed at the center of the first side of the single film 720, so that the electronic chip 810 is located at the center of the film 720 when the electronic tag 820 is formed, so that the electronic chip 810 can be easily identified when the electronic chip 810 is well implanted, and at the same time, the electronic chip 810 is avoided from being accidentally cut when the electronic tag 820 is cut.

[0050] like Figure 3 As shown, this embodiment of the invention also provides an electronic tag production apparatus for producing electronic tags using the process method provided in any of the above embodiments, including a film peeling unit 10, a base film supply unit 20, a cutting and placing unit 30, a pressing unit 50, and a chip placing unit 40.

[0051] It should be noted that the structure of the electronic tag 820 is a single electronic chip 810 sandwiched between two layers of adhesive material 710, and the sides of the two layers of adhesive material 710 that do not contact each other are respectively wrapped with a base film 210. In the electronic tag production device provided in the embodiment of the present invention, the film peeling unit 10 is used to peel off the film on the adhesive material 710 to obtain adhesive material 710 without film covering for use. At the same time, in order to meet the use of at least two layers of adhesive material 710 in the subsequent process, at least two film peeling units 10 are provided so that at least two layers of adhesive material 710 can be peeled off simultaneously.

[0052] It should be noted that, in a specific embodiment of the present invention, the peeling unit 10 uses a motor to drive the peeling roller to peel off the film of the adhesive 710. Before peeling, the operator manually wraps part of the film of the adhesive 710 around the peeling roller, and then turns on the motor to peel off the film of the adhesive 710 by rotating the peeling roller and drive the peeled adhesive 710 to move.

[0053] After the adhesive 710 completes the stripping of the film, the cutting and placing unit 30 cuts the adhesive 710 to obtain an adhesive sheet 720 of a preset specification, and places the adhesive sheet 720 on the bottom film 210 supplied by the bottom film supply unit 20, and it should be noted that the preset specification is the structural specification required by the corresponding batch of electronic tags 820, and the bottom film 210 is used for the convenience of collecting and storing multiple adhesive sheets 720. The adhesive sheet 720 is placed on the bottom film 210 to facilitate the subsequent separate cutting and use of the adhesive sheet 720, so the distance between the adjacent adhesive sheets 720 on the bottom film 210 is convenient for cutting a single adhesive sheet 720.

[0054] In addition, the cutting and placing unit 30 cuts by a cutting knife, and the motor drives the cutting and placing unit 30 to move in a preset path and perform a placing action, the principle and structure of which are common to those skilled in the art, so it will not be described here.

[0055] Similarly, the cutting and placing unit 30 and the bottom film supply unit 20 both process the adhesive 710 after being stripped by the film stripping unit 10, so the bottom film supply unit 20 and the cutting and placing unit 30 are also provided with at least two sets to process at least two adhesives 710 simultaneously with the film stripping unit 10.

[0056] The pressing unit 50 is arranged downstream of the cutting and placing unit 30, and is used to press two bottom films 210 on which the adhesive sheets 720 are placed. The two bottom films 210 on which the adhesive sheets 720 are placed are laminated at the position of the pressing unit 50, and the positions of the adhesive sheets 720 on the two bottom films 210 correspond one by one.

[0057] It should be noted that the sides of the two bottom films 210 on which the adhesive sheets 720 are arranged are opposite, so that the two adhesive sheets 720 are pressed into an integrated structure by the pressing unit 50. Meanwhile, a chip placing unit 40 is arranged upstream of the pressing unit 50, and the chip placing unit 40 is used to grab an electronic chip 810 and place the electronic chip 810 on the first side of a single adhesive sheet 720 on the bottom film 210. The first side of the adhesive sheet 720 is the side of the adhesive sheet 720 facing away from the bottom film 210. It should be noted that the chip placing unit 40 only places the electronic chip 810 on the adhesive sheet 720 on a single bottom film 210. On this basis, the two bottom films 210 form an integrated structure after being pressed by the pressing unit 50, in which two adhesive sheets 720 are sandwiched by the two bottom films 210, and a single electronic chip 810 is sandwiched by the two adhesive sheets 720.

[0058] The above-mentioned integrated structure is cut into a single electronic tag 820 for implantation after cutting, and since the films 720 are arranged at intervals on the bottom film 210, the electronic chips 810 on the bottom film 210 are also arranged at intervals after the pressing unit 50 completes the pressing of the films 720 to be collected and wound. The material produced by this processing method only needs to cut the bottom film 210 between adjacent films 720 on the bottom film 210 to obtain the electronic tag 820 to be used.

[0059] The production of the electronic tag 820 using the above-mentioned production device does not produce waste of the film 710, saving production costs, compared to the prior art which arranges multiple electronic chips 810 between two complete films 710 and cuts the area containing the electronic chip 810 in the two-layer film 710 when the electronic tag 820 needs to be implanted.

[0060] It should be further noted that since the material obtained by the electronic tag production device provided by the embodiment of the present application is cut when the electronic tag 820 is implanted, the cutting requirement only needs to ensure that the cutting knife does not contact the films 720 between the bottom film 210, the cutting positioning process is clear and convenient, and the prior art needs to cut the opaque film 710, which is prone to the problem of cutting the electronic chip 810 in the film 710, thereby causing the electronic tag 820 to be invalid. Therefore, the electronic tag production device provided by the embodiment of the present application has significant significance for the accurate cutting of the electronic tag 820 and can improve the yield of the electronic tag 820.

[0061] The electronic tag production device provided by the application can realize the function of processing two rubber materials 710 simultaneously, after the placement of the rubber sheet 720 on the bottom film 210 is completed, the chip placement unit 40 is used to place the electronic chip 810 on the side of the single rubber sheet 720 away from the bottom film 210, and the two bottom films 210 carrying the rubber material 710 are laminated at the position of the pressing unit 50 and pass through the pressing unit 50, the pressing unit 50 presses the two opposite rubber sheets 720 to encapsulate the electronic chip 810 and provide subsequent use, when the implantation of the electronic tag 820 is required, only the cutting tool is used to cut the bottom film 210 between the adjacent two rubber sheets 720 on the bottom film 210, and the electronic tag 820 can be obtained, which is convenient and quick and will not produce waste rubber material 710, thereby saving the production cost in the production process of the electronic tag 820.

[0062] Further, in order to avoid the existence of air between the two rubber sheets 720 in the electronic tag 820, which causes the electronic tag 820 to be invalid, in an embodiment of the application, the two bottom films 210 on which the rubber sheets 720 are placed are overlapped and pressed at an angle at the position of the pressing unit 50 and are pressed by the pressing unit 50.

[0063] On this basis, preferably, the two bottom films 210 on which the rubber sheets 720 are placed are overlapped and pressed at an acute angle at the position of the pressing unit 50 and are pressed by the pressing unit 50, so that the pair of rubber sheets 720 on the two bottom films 210 gradually change from single-sided contact to double-sided contact at the entrance of the pressing unit 50, so that the air between the two rubber sheets 720 can be smoothly discharged.

[0064] Further, in an embodiment of the application, the electronic tag production device further comprises a chip supply unit 60 for supplying chips, the chip supply unit 60 is arranged upstream of the chip placement unit 40, the chip supply unit 60 is used to arrange the electronic chips 810 at intervals and convey the electronic chips 810 to the grabbing position of the chip placement unit 40 through the conveying member such as a conveying belt or a conveying chain, through the pre-arrangement of the electronic chips 810 by the chip supply unit 60, the chip placement unit 40 only needs to reciprocate between the grabbing position and the placement position of the electronic chip 810, without the need for self-detection and then grabbing the electronic chip 810, thereby simplifying the structure of the chip placement unit 40.

[0065] In order to ensure that the electronic chip 810 is accurately and perfectly placed on the single piece of adhesive tape 720 by the chip placement unit 40, in an embodiment of the electronic tag production device provided by the application, a positioning sensor unit is further included, the detection range of the positioning sensor unit at least includes the placement position of the electronic chip 810 prevented by the chip placement unit 40, the positioning sensor unit is used to detect the center position of the positioning adhesive tape 720, and feedback the controller to control the chip placement unit 40 to guide the chip placement unit 40 to place the electronic chip 810 on the center position of the adhesive tape 720. By placing the electronic chip 810 on the center position of the adhesive tape 720, the electronic chip 810 can be better protected by the two layers of adhesive tape 720 during use of the electronic tag 820.

[0066] It should be noted that the positioning sensor unit is an industrial vision camera, an eddy current sensor or an optical sensor. In a preferred embodiment of the application, the positioning sensor unit is an industrial vision camera.

[0067] Further, the electronic tag production device provided by the embodiment of the application uses at least two sets of film stripping units 10, bottom film supply units 20 and cutting and placing units 30 to realize the function of simultaneously processing at least two pieces of adhesive 710. The processed adhesive tapes 720 are placed on two bottom films 210 and are subjected to pressing.

[0068] It should be noted that the specifications of the adhesive tapes 720 on the two bottom films 210 can be the same or different. The adhesive tapes 720 of the same specification can make the appearance structure of the electronic tags 820 produced uniform and unnecessary to distinguish between the front and back surfaces during implantation. The adhesive tapes 720 of different specifications can make the side with a larger area face the tire during implantation, so that the electronic tag 820 is better combined with the tire after implantation, thereby ensuring the quality of the electronic tag 820 after implantation.

[0069] Further, in an embodiment of the application, the pressing unit 50 includes a first pressing roller 510, a second pressing roller 520 and a driving motor. The first pressing roller 510 and the second pressing roller 520 are a pair of pressing rollers arranged in pairs and used in cooperation to press the two layers of adhesive tapes 720 passing between the first pressing roller 510 and the second pressing roller 520. One or more driving motors can be provided, and the driving motor is in transmission connection with the first pressing roller 510 and the second pressing roller 520, so as to drive the first pressing roller 510 and the second pressing roller 520 to rotate by the driving motor. At the same time, the gap between the first pressing roller 510 and the second pressing roller 520 is in interference fit with the two layers of adhesive tapes 720, so that the two layers of adhesive tapes 720 on the two bottom films 210 are tightly pressed into an integrated structure when passing through the pressing unit 50. By arranging the first pressing roller 510 and the second pressing roller 520, the two layers of adhesive tapes 720 can be pressed while being driven to move to the next process for winding and material collection.

[0070] In order to further optimize the above technical solutions, in a specific embodiment of the present application, the cutting placement unit 30 places the cut film 720 of the preset specification on the bottom film 210 at equal intervals after cutting, so as to facilitate the corresponding of the film 720 when two bottom films 210 are positioned at the pressing unit 50, and the subsequent cutting and implantation process after material collection is more uniform and the error is smaller.

[0071] The terms "first", "second", "left", "right", and the like as used in the description and the claims of the present application and the above drawings are used to distinguish different objects, and are not intended to describe a particular order. In addition, the terms "comprise" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can include steps or units not listed.

[0072] The above description of the disclosed embodiments enables a person skilled in the art to implement or use the present application. Various modifications to the embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method of an electronic tag production process, characterized by, At least comprising the following steps: Processing rubber: stripping the film on both rubber (710), and cutting the rubber (710) after stripping the film into a predetermined size of rubber sheet (720), and the rubber sheet (720) cut from the two rubber (710) is the same size; Place the rubber sheet: the rubber sheet (720) produced by the two rubber (710) is placed on two bottom film (210), and the side of the two bottom film (210) on which the rubber sheet (720) is placed is oppositely arranged; Place the electronic chip: grab the electronic chip (810) and place a single electronic chip (810) on the first side of a single rubber sheet (720); Press the rubber sheet: laminate the two bottom film (210) on which the rubber sheet (720) is placed, keep the rubber sheet (720) one-to-one corresponding and press the two bottom film (210) on which the rubber sheet (720) is placed into a multi-layer structure, the structure layer of the multi-layer structure is bottom film, rubber sheet, electronic chip, rubber sheet, bottom film in turn, and the rubber sheet (720) pressed in pairs contains a single electronic chip (810) inside; The two bottom film (210) on which the rubber sheet (720) is placed is laminated at an acute angle at the position of the pressing unit (50) and is pressed by the pressing unit (50).

2. The electronic tag production process method of claim 1, wherein, In the step of placing the electronic chip, the electronic chip (810) is placed at the center position of the first side of a single rubber sheet (720).

3. An electronic label production apparatus suitable for carrying out the process according to any one of claims 1 to 2, characterized in that Comprise: At least two film stripping units (10) for stripping the film on the rubber (710); At least two bottom film supply units (20) and at least two cutting and placing units (30), the bottom film supply unit (20) is used to supply the bottom film (210), and the cutting and placing unit (30) is used to cut the rubber (710) after stripping the film to obtain the rubber sheet (720) of a predetermined size, and the rubber sheet (720) of a predetermined size is placed on at least two bottom film (210) with interval; Pressing unit (50), the pressing unit (50) is arranged downstream of the cutting and placing unit (30), the two bottom film (210) on which the rubber sheet (720) is placed is laminated at the position of the pressing unit (50), and the rubber sheet (720) on the two bottom film (210) corresponds one-to-one and is pressed into an integrated structure by the pressing unit (50); Chip placing unit (40), the chip placing unit (40) is arranged upstream of the pressing unit (50), the chip placing unit (40) is used to grab the electronic chip (810) and place the electronic chip (810) on the first side of the rubber sheet (720) on one of the bottom film (210), the first side of the rubber sheet (720) is the side of the rubber sheet (720) facing away from the bottom film (210).

4. The electronic label production apparatus according to claim 3, wherein The chip supply unit (60) is arranged upstream of the chip placing unit (40), and is used for arranging and conveying the electronic chips (810) at equal intervals to the grabbing position of the chip placing unit (40).

5. The electronic label production apparatus according to claim 3, wherein The positioning sensor unit is used for positioning the center position of the film (720) and guiding the chip placing unit (40) to place the electronic chip (810) at the center position of the film (720).

6. The electronic label production apparatus according to claim 5, wherein The positioning sensor unit is an industrial vision camera, an eddy current sensor or an optical sensor.

7. The electronic label production apparatus according to claim 3, wherein The films (720) on the two bottom films (210) have the same or different specifications.

8. The electronic label production apparatus according to claim 3, wherein The pressing unit (50) comprises a first pressing roller (510) and a second pressing roller (520) arranged in pairs, and a driving motor. The gap between the first pressing roller (510) and the second pressing roller (520) is in interference fit with the two films (720), and the driving motor is in driving connection with the first pressing roller (510) and the second pressing roller (520) to drive the first pressing roller (510) and the second pressing roller (520) to rotate.

9. An electronic label production apparatus according to any one of claims 3 to 8, characterized in that, The cutting and placing unit (30) places the films (720) of a preset specification on the bottom film (210) at equal intervals.

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