Method for manufacturing display device and display device

Abstract

The present application discloses a method for manufacturing a display device and a display device. The method comprises: providing a substrate; sequentially forming an auxiliary electrode and a pixel defining layer on the substrate, wherein the pixel defining layer is provided with a plurality of first openings, wherein the first openings expose the auxiliary electrode; forming a magnetic material layer within the first openings; forming an electron transport layer on the magnetic material layer, wherein the electron transport layer covers the magnetic material layer; using a magnetic element to adsorb the magnetic material layer, wherein the electron transport layer and the magnetic material layer located within the first openings are jointly detached from the first openings to expose the auxiliary electrode; and forming a cathode on the electron transport layer, wherein the portion of the cathode located within the first openings is connected to the auxiliary electrode. The present application reduces the IR drop of the display device and improves the brightness uniformity of the display device.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display device and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is becoming the mainstream of high-end flat panel displays due to its advantages such as self-luminescence, wide viewing angle, high contrast, low power consumption and extremely fast response speed.

[0003] In OLED display devices, an auxiliary electrode is usually provided on the substrate to reduce the resistance of the cathode. However, since the electron transport layer in OLED devices is evaporated using an open metal mask (open mask), the electron transport layer covers the entire display area of ​​the substrate. The electron transport layer between the cathode and the auxiliary electrode increases the resistance of the cathode, thereby increasing the voltage drop (IR-drop) of the display device. Summary of the Invention

[0004] The embodiments of the present application provide a method for manufacturing a display device and a display device, so as to reduce IR-drop of the display device in the prior art.

[0005] An embodiment of the present application provides a method for manufacturing a display device, the method comprising the following steps:

[0006] providing a substrate;

[0007] An auxiliary electrode and a pixel defining layer are sequentially formed on the substrate, wherein a plurality of first openings are formed on the pixel defining layer, and the first openings expose the auxiliary electrode;

[0008] forming a magnetic material layer in the first opening;

[0009] forming an electron transport layer on the magnetic material layer, wherein the electron transport layer covers the magnetic material layer;

[0010] Adsorbing the magnetic material layer using a magnetic element, the electron transport layer and the magnetic material layer located in the first opening are separated from the first opening together to expose the auxiliary electrode; and

[0011] A cathode is formed on the electron transport layer, and a portion of the cathode located in the first opening is connected to the auxiliary electrode.

[0012] Optionally, in some embodiments of the present application, after the step of forming an electron transport layer on the magnetic material layer, the substrate, the auxiliary electrode, the pixel defining layer, the magnetic material layer, and the electron transport layer constitute a substrate assembly, and the step of using a magnetic element to adsorb the magnetic material layer includes:

[0013] The side of the substrate assembly provided with the magnetic material layer is directed toward the magnetic element;

[0014] The distance between the magnetic element and the substrate assembly is adjusted so that the magnetic material layer is attracted to the magnetic element.

[0015] Optionally, in some embodiments of the present application, the step of aligning the side of the substrate assembly provided with the magnetic material layer toward the magnetic element includes:

[0016] Turning the substrate assembly upside down, placing the magnetic element below the substrate assembly, and making the side of the substrate assembly where the magnetic material layer is provided face the magnetic element; or

[0017] The position of the substrate assembly is kept unchanged, and the magnetic element is placed above the substrate assembly, with the magnetic element facing the side of the substrate assembly where the magnetic material layer is provided.

[0018] Optionally, in some embodiments of the present application, adjusting the distance between the magnetic element and the substrate assembly includes:

[0019] At least one of the magnetic element and the base plate assembly is moved to adjust the distance between the magnetic element and the base plate assembly in a horizontal direction and / or a vertical direction.

[0020] Optionally, in some embodiments of the present application, after the step of forming an electron transport layer on the magnetic material layer, the substrate, the auxiliary electrode, the pixel defining layer, the magnetic material layer, and the electron transport layer constitute a substrate assembly, and the step of using a magnetic element to adsorb the magnetic material layer includes:

[0021] Moving the magnetic element from one end of the substrate assembly to the other end of the substrate assembly, wherein during the movement of the magnetic element, a side of the magnetic element facing the first opening is used to adsorb the magnetic material layer;

[0022] When a side of the magnetic element facing the first one or more first openings is completely occupied by the magnetic material layer, rotating and continuing to move the magnetic element so that the side of the magnetic element adsorbed with the magnetic material layer faces away from the substrate assembly, and the side of the magnetic element not adsorbed with the magnetic material layer faces the next one or more first openings;

[0023] When the side of the magnetic element on which the magnetic material layer is adsorbed rotates to a side away from the substrate assembly, removing the magnetic material layer and the electron transport layer adsorbed on the magnetic element;

[0024] Repeat the above steps until all the magnetic material layers in the substrate assembly are separated from the first opening.

[0025] Optionally, in some embodiments of the present application, a scraping element is provided on a side of the magnetic element away from the substrate assembly, and when the side of the magnetic element on which the magnetic material layer is adsorbed rotates to a side away from the substrate assembly, the scraping element removes the magnetic material layer and the electron transport layer adsorbed on the magnetic element; or

[0026] When the side of the magnetic element on which the magnetic material layer is adsorbed is rotated to the side away from the substrate assembly, the side of the magnetic element on which the magnetic material layer is adsorbed is immersed in a receiving element containing a solvent, and the magnetic material layer and the electron transport layer adsorbed on the magnetic element are dissolved.

[0027] Optionally, in some embodiments of the present application, the magnetic element is an electromagnet, and the power supply state of the electromagnet is controlled by a control element;

[0028] When the control element is turned on, the electromagnet is in a power-on state, the electromagnet has magnetism, and the electromagnet is used to adsorb the magnetic material layer; when the control element is disconnected, the electromagnet is in a power-off state, the magnetism of the electromagnet disappears, and the magnetic material layer and the electron transport layer adsorbed on the electromagnet are detached from the electromagnet.

[0029] Optionally, in some embodiments of the present application, after the step of forming an electron transport layer on the magnetic material layer, the substrate, the auxiliary electrode, the pixel defining layer, the magnetic material layer, and the electron transport layer constitute a substrate assembly, and the step of using a magnetic element to adsorb the magnetic material layer includes:

[0030] The electromagnet is moved from one end of the substrate assembly to the other end of the substrate assembly. During the movement of the electromagnet, a side of the electromagnet facing the first opening is used to attract the magnetic material layer. When the electromagnet faces the first opening, the control element is turned on. The electromagnet is magnetic, and the magnetic material layer is attracted to the electromagnet.

[0031] When a side of the electromagnet facing the first one or more first openings is completely occupied by the magnetic material layer, rotating and continuing to move the electromagnet so that the side of the electromagnet adsorbed with the magnetic material layer faces away from the substrate assembly, and the side of the electromagnet not adsorbed with the magnetic material layer faces the next one or more first openings;

[0032] When the side of the electromagnet on which the magnetic material layer is adsorbed rotates to a side away from the substrate assembly, the control element is disconnected, the magnetism of the electromagnet disappears, and the magnetic material layer and the electron transport layer adsorbed on the electromagnet are detached from the electromagnet;

[0033] Repeat the above steps until all the magnetic material layers in the substrate assembly are separated from the first opening.

[0034] Optionally, in some embodiments of the present application, the step of forming a magnetic material layer in the first opening includes:

[0035] forming a magnetic ink layer in the first opening;

[0036] The magnetic ink layer is solidified to form a magnetic material layer.

[0037] An embodiment of the present application further provides a display device, comprising:

[0038] substrate;

[0039] an auxiliary electrode, the auxiliary electrode being disposed on the substrate;

[0040] a pixel defining layer, the pixel defining layer being disposed on a side of the auxiliary electrode away from the substrate, the pixel defining layer being provided with a plurality of first openings and a plurality of second openings, the first openings exposing the auxiliary electrode;

[0041] an electron transport layer, the electron transport layer being disposed in the second opening and covering a portion of the pixel defining layer between the first opening and the second opening; and

[0042] A cathode is disposed on a side of the electron transport layer away from the pixel defining layer, and a portion of the cathode located in the first opening is connected to the auxiliary electrode.

[0043] Compared with the preparation method of the display device in the prior art, the preparation method of the display device provided in the present application pre-forms a magnetic material layer on the auxiliary electrode, and after forming the electron transport layer, uses a magnetic element to adsorb the magnetic material layer on the auxiliary electrode. Since the electron transport layer is located on the side of the magnetic material layer close to the magnetic element, the part of the electron transport layer corresponding to the magnetic material layer will be detached from the first opening in the pixel defining layer together with the magnetic material layer. Then, after the cathode is formed on the electron transport layer, the cathode can be directly connected to the auxiliary electrode, so that the resistance of the cathode is reduced, thereby greatly improving the IR-drop phenomenon in the display device, improving the brightness uniformity of the display device, and thus improving the display effect of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0045] Figure 1 It is a schematic flow chart of the method for preparing a display device provided in this application.

[0046] Figures 2A to 2H It is a schematic diagram of the structures obtained in sequence at each stage in the method for preparing the display device provided in this application.

[0047] Figure 3 It is a schematic structural diagram of the display device provided in this application. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0049] The embodiments of the present application provide a method for manufacturing a display device and a display device, which are described in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.

[0050] Please refer to Figure 1 , an embodiment of the present application provides a method for manufacturing a display device, which includes the following steps:

[0051] Step B1: providing a substrate;

[0052] Step B2: forming an auxiliary electrode and a pixel defining layer on the substrate in sequence, wherein the pixel defining layer is provided with a plurality of first openings, wherein the first openings expose the auxiliary electrode;

[0053] Step B3: forming a magnetic material layer in the first opening;

[0054] Step B4: forming an electron transport layer on the magnetic material layer, wherein the electron transport layer covers the magnetic material layer;

[0055] Step B5: using a magnetic element to absorb the magnetic material layer, so that the electron transport layer and the magnetic material layer located in the first opening are separated from the first opening together, thereby exposing the auxiliary electrode;

[0056] Step B6: forming a cathode on the electron transport layer, wherein the portion of the cathode located in the first opening is connected to the auxiliary electrode.

[0057] Therefore, the preparation method of the display device provided in this embodiment pre-forms a magnetic material layer on the auxiliary electrode, and after forming the electron transport layer, uses a magnetic element to adsorb the magnetic material layer on the auxiliary electrode. Since the electron transport layer is located on the side of the magnetic material layer close to the magnetic element, the part of the electron transport layer corresponding to the magnetic material layer will be detached from the first opening in the pixel defining layer together with the magnetic material layer. Then, after the cathode is formed on the electron transport layer, the cathode can be directly connected to the auxiliary electrode, so that the resistance of the cathode is reduced, thereby greatly reducing the IR-drop in the display device, improving the brightness uniformity of the display device, and thus improving the display effect of the display device.

[0058] The following is a detailed description of the method for preparing the display device provided in this embodiment.

[0059] Please refer to Figures 2A to 2H The manufacturing method of the display device 100 provided in this embodiment specifically includes the following steps:

[0060] Step B1: Provide a substrate 10.

[0061] like Figure 2A As shown, the substrate 10 includes a substrate 101 and a thin film transistor functional layer 102 disposed on the substrate 101 .

[0062] The substrate 101 may be a flexible substrate. The material of the flexible substrate may be one or more of polyethersulfone, polyacrylate, polyimide, polyethylene naphthalate, and polyethylene terephthalate. Alternatively, the substrate 101 may be a rigid substrate, and the material of the rigid substrate may be glass. This application does not limit the material of the substrate 101.

[0063] It should be noted that the thin film transistors in the thin film transistor functional layer 102 of the present application can be top-gate thin film transistors, bottom-gate thin film transistors, single-gate thin film transistors, or dual-gate thin film transistors, and this application does not limit this. The specific film structure of the thin film transistor functional layer 102 can refer to the existing technology and will not be described in detail here.

[0064] Step B2: forming an anode 11, an auxiliary electrode 12 and a pixel defining layer 13 on the substrate 10. The pixel defining layer 13 is provided with a plurality of first openings 131 and a plurality of second openings 132. The first openings 131 expose the auxiliary electrode 12. The second openings 132 expose the anode 11. Figure 2B shown.

[0065] Specifically, step B2 includes the following steps:

[0066] Step B21 : forming a patterned anode 11 and an auxiliary electrode 12 on the substrate 10 .

[0067] The anode 11 may be a three-layer conductive structure of ITO / Ag / ITO, or a double-layer conductive structure of Ag / ITO, Al / WOx, or Ag / IZO. Alternatively, the anode 11 may be a single-layer conductive structure. Specifically, the material of the anode 11 may include one or more conductive metals or alloys of conductive metals such as Mo, Al, Ti, Nd, or Cu, and may also include one or more conductive oxides such as indium gallium zinc oxide (IGZO), indium zinc tin oxide (IZTO), indium gallium zinc tin oxide (IGZTO), indium tin oxide (ITO), indium zinc oxide (IZO), indium aluminum zinc oxide (IAZO), indium gallium tin oxide (IGTO), or antimony tin oxide (ATO).

[0068] The auxiliary electrode 12 can have the same film structure as the anode 11. Specifically, the auxiliary electrode 12 can have a single-layer conductive structure, a double-layer conductive structure, or a triple-layer conductive structure. The auxiliary electrode 12 can be provided in the same layer as the anode 11, or in a different layer from the anode 11. When the auxiliary electrode 12 is provided in the same layer as the anode 11, the auxiliary electrode 12 and the anode 11 can be produced in the same process, thereby improving process efficiency and saving process costs.

[0069] In some embodiments, the auxiliary electrodes 12 may be spaced apart in different conductive film layers. It should be noted that the structure of the auxiliary electrodes 12 in this embodiment is merely illustrative and is used to facilitate description of this embodiment. The specific structure of the auxiliary electrodes 12 may refer to prior art and will not be described in detail here.

[0070] Step B22 : forming a pixel defining layer 13 on the anode 11 and the auxiliary electrode 12 .

[0071] In this embodiment, the pixel defining layer 13 can be made of an organic photoresist material to which a hydrophobic additive is added. Alternatively, after the pixel defining layer 13 is formed using the organic photoresist material, the surface of the pixel defining layer 13 is subjected to a hydrophobic treatment. For example, a fluorine-containing additive can be added to the organic photoresist material or the surface of the organic photoresist material can be subjected to a surface fluorination treatment to enhance the hydrophobicity of the organic photoresist material surface. Through such treatment, a pixel defining layer 13 with excellent hydrophobicity can be obtained.

[0072] The organic photoresist material used to prepare the pixel defining layer 13 may be one or more of polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyetherimide, polyethersulfone or benzocyclobutene.

[0073] Step B23 : performing patterning on the pixel definition layer 13 to form a plurality of first openings 131 and a plurality of second openings 132 on the pixel definition layer 13 .

[0074] The first opening 131 exposes the auxiliary electrode 12. The area where the first opening 131 is located is the non-luminescent area 10a. The second opening 132 exposes the anode 11. The area where the second opening 132 is located is the luminescent area 10b. The non-luminescent area 10a is located on the outer periphery of the luminescent area 10b.

[0075] Step B3: forming a magnetic ink layer 20 a in the first opening 131 .

[0076] Specifically, step B3 includes the following steps:

[0077] Step B31: Using inkjet printing technology to form a magnetic ink layer 20a in the first opening 131, as shown in FIG. Figure 2C shown.

[0078] Specifically, the magnetic ink layer 20a includes a magnetic material and a solvent that dissolves the magnetic material. The magnetic material may include metal particles that are attracted to a magnet, such as iron, nickel, or cobalt, or magnetic nanoparticles such as silicon dioxide or titanium dioxide. The solvent may be an inorganic solvent or an organic solvent that dissolves the magnetic material.

[0079] It should be noted that the magnetic material may also include other magnetic materials, as long as the magnetic material is magnetic, they are all within the scope of protection of this application. In addition, the type of the solvent can be selected according to the physical and chemical properties of the magnetic material, and this application does not limit this.

[0080] In this embodiment, the magnetic ink layer 20a extends beyond the first opening 131 in a direction perpendicular to the plane of the substrate 10. When the type and concentration of the magnetic material in the magnetic ink layer 20a are constant, the above arrangement can improve the magnetic properties of the magnetic ink layer 20a after subsequent curing.

[0081] Step B32: solidify the magnetic ink layer 20a to form a magnetic material layer 20, such as Figure 2D shown.

[0082] Specifically, after forming the magnetic ink layer 20a, the substrate 10 formed with the anode 11, the auxiliary electrode 12, the pixel defining layer 13 and the magnetic ink layer 20a is subjected to heat treatment, such as vacuum drying treatment, and then the substrate 10 is annealed and baked. At this time, the solvent in the magnetic ink layer 20a evaporates, and the magnetic ink layer 20a is solidified to form the magnetic material layer 20. The annealing temperature is less than 300 degrees Celsius. Specifically, the annealing temperature can be between 100 degrees Celsius and 250 degrees Celsius, such as 100 degrees Celsius, 150 degrees Celsius, 180 degrees Celsius, 200 degrees Celsius, 250 degrees Celsius or 300 degrees Celsius, etc. The specific annealing temperature can be selected according to the type of magnetic material and solvent in the magnetic ink layer 20a, and this application does not limit this.

[0083] In some embodiments, when the solvent in the magnetic ink layer 20a contains a photocuring agent, the substrate 10 formed with the anode 11, the auxiliary electrode 12, the pixel defining layer 13 and the magnetic ink layer 20a can also be treated by photocuring to achieve the curing of the magnetic ink layer 20a, which will not be repeated here.

[0084] In this embodiment, the thickness of the magnetic material layer 20 in a direction perpendicular to the plane of the substrate 10 is less than the depth of the first opening 131. When the type and concentration of the magnetic material in the magnetic ink layer 20a are constant, if the desired magnetic properties of the magnetic material layer 20 are high, the thickness of the magnetic material layer 20 can be reduced by reducing the thickness of the magnetic ink layer 20a; if the desired magnetic properties of the magnetic material layer 20 are low, the thickness of the magnetic material layer 20 can be increased by increasing the thickness of the magnetic ink layer 20a. The specific thickness of the magnetic material layer 20 can be selected based on the type of magnetic material in the magnetic material layer 20 and the desired magnetic properties of the magnetic material layer 20, and this application does not limit this.

[0085] Step B4: forming an electron transport layer 17 on the magnetic material layer 20 . The electron transport layer 17 covers the magnetic material layer 20 .

[0086] Specifically, step B4 includes the following steps:

[0087] Step B41 : sequentially forming a hole injection layer 14 , a hole transport layer 15 and a light emitting layer 16 on the anode 11 . The hole injection layer 14 , the hole transport layer 15 and the light emitting layer 16 are all located in the second opening 132 .

[0088] The hole injection layer 14, the hole transport layer 15 and the light emitting layer 16 can be prepared by inkjet printing, evaporation or solution processing. In this embodiment, the hole injection layer 14, the hole transport layer 15 and the light emitting layer 16 are prepared by inkjet printing.

[0089] Specifically, the hole injection layer 14 may be made of a conductive polymer material and its derivatives. The conductive polymer material may include polythiophene or polyaniline. The thickness of the hole injection layer 14 may be between 10 nanometers and 60 nanometers, such as 10 nanometers, 20 nanometers, 25 nanometers, 30 nanometers, 40 nanometers, 50 nanometers, or 60 nanometers.

[0090] The hole transport layer 15 may be made of an organic material, such as one or more of polytriphenylamine, 9,9-dioctylfluorene / N-(4-sec-butylphenyl)-diphenylamine alternating copolymer (TFB), or N,N′-di(1-naphthyl)-N,N′-diphenyl-(1,1′-biphenyl)-4,4′-diamine (NPB), or an inorganic material, such as copper oxide (Cu2O) or copper gallium oxide nanoparticles (CuxGa1-xO). The thickness of the hole transport layer 15 may be between 10 and 50 nanometers, such as 10, 15, 25, 30, 40, 45, or 50 nanometers.

[0091] In this embodiment, the light-emitting layer 16 can be a single-layer structure or a multi-layer structure consisting of two or more film layers. The material of the light-emitting layer 16 can be an organic material, such as an organic small molecule material or an organic polymer material. The material of the light-emitting layer 16 can also be a quantum dot material. Furthermore, the materials of the light-emitting layers 16 in different light-emitting regions 10b can also be different. For example, the material types of the light-emitting layers 16 of different colors can be different. For example, the material of the light-emitting layer 16 for emitting blue light can be an organic material, while the material of the light-emitting layer 16 for emitting red light and the light-emitting layer 16 for emitting yellow light can be quantum dot materials, and so on.

[0092] It should be noted that the specific material of the light-emitting layer 16 can be selected according to actual application requirements, and this application does not limit this.

[0093] Step B42: Use an open mask to form an electron transport layer 17 on the magnetic material layer 20. The electron transport layer 17 covers the entire surface of the light emitting area 10b and the non-light emitting area 10a. Specifically, the electron transport layer 17 covers the magnetic material layer 20, the pixel definition layer 13 and the light emitting layer 16. Figure 2E shown.

[0094] The electron transport layer 17 has high electron transport performance. The material of the electron transport layer 17 can be selected according to the type of light-emitting device in the display device 100. For example, when the light-emitting device is an organic light-emitting diode, the material of the electron transport layer 17 can be octahydroxyquinoline aluminum. When the light-emitting device is a quantum dot light-emitting diode, the material of the electron transport layer 17 can be a composite material doped with a nano-precious metal core-shell structure, such as zinc oxide, zinc magnesium oxide, zinc aluminum oxide, or zinc magnesium lithium oxide. The thickness of the electron transport layer 17 can be between 20 nanometers and 100 nanometers, such as 20 nanometers, 25 nanometers, 40 nanometers, 60 nanometers, 80 nanometers, 90 nanometers, 95 nanometers, or 100 nanometers.

[0095] It should be noted that, in some embodiments, the display device 100 further includes an electron injection layer, which is located on a side of the electron transport layer 17 away from the light-emitting layer 16 and will not be described in detail here.

[0096] In this embodiment, a substrate assembly 10A is formed by the substrate 10 , the anode 11 , the auxiliary electrode 12 , the pixel defining layer 13 , the hole injection layer 14 , the hole transport layer 15 , the light emitting layer 16 , the electron transport layer 17 and the magnetic material layer 20 .

[0097] Step B5: using the magnetic element 30 to absorb the magnetic material layer 20 , the electron transport layer 17 and the magnetic material layer 20 located in the first opening 131 are separated from the first opening 131 to expose the auxiliary electrode 12 .

[0098] The magnetic element 30 is a magnet. For the production of small and medium-sized display devices 100, a single magnet can be used to attract the entire magnetic material layer 20 in the substrate assembly 10A, or multiple magnets can be used to simultaneously attract the magnetic material layer 20. For the production of large-sized display devices 100, when the available magnet size is limited, the substrate assembly 10A can be partitioned, with a magnet placed in each partition. Both of these arrangements can simultaneously attract the magnetic material layer 20 in the substrate assembly 10A, thereby improving the operating efficiency of the magnetic element 30.

[0099] When multiple magnets are used to simultaneously attract all magnetic material layers 20 in the substrate assembly 10A, it is generally necessary to splice the multiple magnets. For relatively large display devices, when magnet size is limited, due to cost factors caused by using too many magnets, in some embodiments, only a single small magnet can be used to attract the entire substrate assembly 10A, thereby achieving magnet reuse and reducing process costs.

[0100] The following is a detailed description of step B5:

[0101] Please refer to Figure 2F and Figure 2G Specifically, step B5 includes the following steps:

[0102] Step B51 : Orient the side of the substrate assembly 10A where the magnetic material layer 20 is disposed toward the magnetic element 30 .

[0103] In this embodiment, the substrate assembly 10A is inverted and the magnetic element 30 is placed below the substrate assembly 10A so that the side of the substrate assembly 10A provided with the magnetic material layer 20 faces the magnetic element 30. The above arrangement, by inverting the substrate assembly 10A, can prevent foreign matter above the substrate assembly 10A from falling onto the side of the substrate assembly 10A provided with the electron transport layer 17 during the adsorption process of the magnetic element 30, thereby affecting the luminous efficiency of the light-emitting device.

[0104] In some embodiments, the position of the substrate assembly 10A can be maintained unchanged, and the magnetic element 30 can be placed above the substrate assembly 10A, with the magnetic element 30 facing the side of the substrate assembly 10A where the magnetic material layer 20 is provided. This arrangement can prevent the adhesion between different film layers on the substrate 10 from being reduced due to the inversion of the substrate assembly 10A, thereby improving the stability between the film layers in the substrate assembly 10A.

[0105] like Figure 2F As shown in FIG. 5( a ), in the first embodiment of step B51 , the magnetic element 30 can simultaneously adsorb the magnetic material layer 20 in the substrate assembly 10A during the subsequent adsorption process.

[0106] It should be noted that FIG. (a) only illustrates a partial structure of the substrate assembly 10A and only illustrates the case where the number of magnets is one, but the present invention is not limited thereto.

[0107] like Figure 2FAs shown in FIG. 2( b ), in the second embodiment of step B51, a scraping element 40 is provided on the side of the magnetic element 30 away from the substrate assembly 10A. When the magnetic element 30 is in operation, the magnetic element 30 is moved from one end of the substrate assembly 10A to the other end under the action of the transmission force. In combination with the scraping element 40, it is possible to achieve the adsorption of all magnetic material layers 20 in the entire substrate assembly 10A by a single magnet when using a small-sized magnet.

[0108] like Figure 2F As shown in Figure (c) in step B51, in the third embodiment, the magnetic element 30 is an electromagnet 30. The power-on state of the electromagnet 30 can be controlled by the control element 50. For example, when the control element 50 is turned on, the electromagnet 30 is in a power-on state, the electromagnet 30 has magnetism, and can be used to adsorb the magnetic material layer 20, and by changing the magnitude of the current passed into the electromagnet 30 by the control element 50, the magnetic force of the electromagnet 30 is changed; when the control element 50 is disconnected, the electromagnet 30 is in a power-off state, the magnetism of the electromagnet 30 disappears, and the magnetic material layer 20 and the electron transport layer 17 attached to the electromagnet 30 can be detached from the electromagnet 30. The above method does not require post-processing of the magnetic material layer 20 attached to the electromagnet 30, thereby greatly reducing the process cost.

[0109] Step B52: Adjust the distance between the magnetic element 30 and the substrate assembly 10A so that the magnetic material layer 20 is adsorbed onto the magnetic element 30 , and the electron transport layer 17 and the magnetic material layer 20 located in the first opening 131 are detached from the first opening 131 together.

[0110] By moving at least one of the magnetic element 30 and the substrate assembly 10A, the distance between the magnetic element 30 and the substrate assembly 10A in the horizontal direction and / or the vertical direction can be adjusted.

[0111] When the distance between the magnetic element 30 and the substrate assembly 10A is reduced to a point where the magnetic element 30 can attract the magnetic material layer 20 in the substrate assembly 10A, the substrate assembly 10A and the magnetic element 30 are fixed. At this time, under the action of the magnetic field, the magnetic material layer 20 gradually separates from the first opening 131 and moves toward the magnetic element 30. As the magnetic material layer 20 moves, the electron transport layer 17 located in the first opening 131 is attracted to the magnetic element 30, thereby forming an adhesion layer 171 between the magnetic material layer 20 and the magnetic element 30. At this time, the auxiliary electrode 12 in the substrate assembly 10A is exposed.

[0112] like Figure 2GAs shown in FIG. 1A , in the first embodiment of step B52 , all magnetic material layers 20 in the substrate assembly 10A are simultaneously adsorbed onto the magnetic element 30 . Accordingly, the electron transport layer 17 located within the first opening 131 is also adsorbed onto the magnetic element 30 along with the magnetic material layer 20 to form an adhesion layer 171 .

[0113] After all of the magnetic material layer 20 in the substrate assembly 10A has been adsorbed, the magnetic material layer 20 and the adhesive layer 171 attached to the magnetic element 30 can be post-processed by physical or chemical treatment. For example, when using physical treatment, the magnetic material layer 20 and the adhesive layer 171 attached to the magnetic element 30 can be directly scraped off; when using chemical treatment, the side of the magnetic element 30 to which the magnetic material layer 20 and the adhesive layer 171 are attached can be immersed in a chemical solvent to dissolve the solvent and remove the magnetic material layer 20 and the adhesive layer 171. Thus, the above arrangement can achieve the reuse of the magnetic element 30, which is beneficial to saving process costs.

[0114] like Figure 2G As shown in (b) of FIG5 , in the second embodiment of step B52, the magnetic element 30 may correspond to one first opening 131, two first openings 131, or even more first openings 131 (less than the total number of first openings 131). In this embodiment, the magnetic element 30 is described as corresponding to one first opening 131, but the invention is not limited thereto.

[0115] Specifically, the working process of the magnetic element 30 in this embodiment is as follows:

[0116] Step B521 : Move the magnetic element 30 from one end of the substrate assembly 10A to the other end of the substrate assembly 10A. During the movement of the magnetic element 30 , the side of the magnetic element 30 facing the first opening 131 is used to attract the magnetic material layer 20 .

[0117] Step B522: When the side of the magnetic element 30 facing the previous first opening 131 is completely occupied by the magnetic material layer 20, rotate and continue to move the magnetic element 30 so that the side of the magnetic element 30 adsorbed with the magnetic material layer 20 is away from the substrate assembly 10A, and the side of the magnetic element 30 not adsorbed with the magnetic material layer 20 faces the next first opening 131.

[0118] Step B523 : When the side of the magnetic element 30 on which the magnetic material layer 20 and the adhesion layer 171 are adsorbed rotates to the side away from the substrate assembly 10A, the magnetic material layer 20 and the adhesion layer 171 adsorbed on the magnetic element 30 are removed.

[0119] Among them, when the side of the magnetic element 30 on which the magnetic material layer 20 and the adhesion layer 171 are adsorbed rotates to face the scraping element 40, the scraping element 40 immediately removes the adsorbed magnetic material layer 20 and the adhesion layer 171 at the same time to achieve the reuse of the magnetic element 30.

[0120] It should be noted that the scraping element 40 can be a plate-like structure, a strip-like structure, etc. This application does not specifically limit the structure of the scraping element 40. As long as it can ensure that the magnetic material layer 20 and the adhesion layer 171 adsorbed on the magnetic element 30 can be scraped off, it is within the protection scope of this application.

[0121] In some embodiments, when the side of the magnetic element 30 on which the magnetic material layer 20 and the adhesion layer 171 are adsorbed is rotated to the side away from the substrate assembly 10A, a chemical treatment method can be used to remove the adsorbed magnetic material layer 20 and the adhesion layer 171, such as immersing the side of the magnetic element 30 on which the magnetic material layer 20 and the adhesion layer 171 are adsorbed into a receiving element containing a chemical solvent to dissolve the magnetic material layer 20 and the adhesion layer 171 adsorbed on the magnet, thereby achieving the reuse of the magnet. The type of chemical solvent can be selected according to the type of material selected for the magnetic material layer 20 and the electron transport layer 17, and will not be repeated here.

[0122] Step B524 : Repeat steps B521 to B523 until all the magnetic material layers 20 in the substrate assembly 10A are separated from the first openings 131 .

[0123] like Figure 2G As shown in (c), in the third embodiment of step B52, the working process of the electromagnet 30 is as follows:

[0124] Step B521': Move the electromagnet 30 from one end of the substrate assembly 10A to the other end of the substrate assembly 10A. During the movement of the electromagnet 30, the side of the electromagnet 30 facing the first opening 131 is used to adsorb the magnetic material layer 20. When the electromagnet 30 faces the first opening 131, the control element 50 is turned on, and the electromagnet 30 becomes magnetic. At this time, the magnetic material layer 20 and the adhesion layer 171 are adsorbed onto the electromagnet 30.

[0125] Step B522': When the side of the electromagnet 30 facing the previous first opening 131 is completely occupied by the magnetic material layer 20, rotate and continue to move the electromagnet 30 so that the side of the electromagnet 30 adsorbed with the magnetic material layer 20 faces away from the substrate assembly 10A, and the side of the electromagnet 30 not adsorbed with the magnetic material layer 20 faces the next first opening 131.

[0126] Step B523': When the side of the electromagnet 30 on which the magnetic material layer 20 and the adhesion layer 171 are adsorbed rotates to the side facing away from the substrate assembly 10A, the control element 50 is disconnected, the magnetism of the electromagnet 30 disappears, and the magnetic material layer 20 and the adhesion layer 171 adsorbed on the electromagnet 30 are directly detached from the electromagnet 30.

[0127] Since no additional equipment is required to remove the magnetic material layer 20 and the adhesive layer 171 adsorbed on the electromagnet 30, the above method can further reduce process costs. Furthermore, the above embodiment can also avoid the residue on the electromagnet 30 caused by incomplete removal due to physical or chemical treatment, thereby improving the utilization efficiency of the electromagnet 30.

[0128] Step B524 ′: repeat steps B521 ′ to B523 ′ until all the magnetic material layers 20 in the substrate assembly 10A are separated from the first openings 131 .

[0129] Step B6: forming a cathode 18 on the electron transport layer 17. The portion of the cathode 18 located in the first opening 131 is connected to the auxiliary electrode 12, as shown in FIG. Figure 2H shown.

[0130] Specifically, the cathode 18 is formed by an evaporation process. The portion of the cathode 18 located in the first opening 131 is connected to the auxiliary electrode 12 and covers the wall of the first opening 131 .

[0131] The cathode 18 is made of a material with high conductivity, such as one or more of Ag, Al, or Mg / Ag.

[0132] It should be noted that after forming the cathode 18, a packaging layer and a protective cover plate and other film layer structures can also be formed on the cathode 18, wherein the packaging layer and the protective cover plate and other film layer structures can refer to the existing technology and will not be repeated here.

[0133] Thus, the method for manufacturing the display device 100 of this embodiment is completed.

[0134] Please refer to Figure 3 The present invention also provides a display device 200, which includes a substrate 10, an anode 11, an auxiliary electrode 12, a pixel defining layer 13, a hole injection layer 14, a hole transport layer 15, a light-emitting layer 16, an electron transport layer 17, and a cathode 18. The display device 200 has a light-emitting region 10b and a non-light-emitting region 10a disposed around the light-emitting region 10b.

[0135] The substrate 10 includes a substrate 101 and a thin film transistor functional layer 102 disposed on the substrate 101. The anode 11 is disposed on the substrate 10 and is located in the light-emitting area 10b. The auxiliary electrode 12 is disposed on the substrate 10. The pixel defining layer 13 is disposed on the auxiliary electrode 12 and the anode 11. A plurality of first openings 131 and a plurality of second openings 132 are provided on the pixel defining layer 13. The first opening 131 exposes the auxiliary electrode 12. The first opening 131 is located in the non-light-emitting area 10a. The second opening 132 exposes the anode 11. The second opening 132 is located in the light-emitting area 10b. The hole injection layer 14, the hole transport layer 15, and the light-emitting layer 16 are sequentially disposed on the side of the anode 11 away from the substrate 10 and are located in the second opening 132. The electron transport layer 17 is disposed on the side of the light-emitting layer 16 away from the substrate 10. The electron transport layer 17 is prepared using an open mask. The electron transport layer 17 is disposed within the second opening 132 and covers the portion of the pixel defining layer 13 between the first opening 131 and the second opening 132. The cathode 18 is disposed on the side of the electron transport layer 17 away from the substrate 10. The portion of the cathode 18 located within the first opening 131 is connected to the auxiliary electrode 12 and covers the wall of the first opening 131.

[0136] It should be noted that, in some embodiments, the display device 200 further includes an electron injection layer, which is located on a side of the electron transport layer 17 away from the light-emitting layer 16 and will not be described in detail here.

[0137] It should be noted that the structure, materials and preparation methods of each film layer in the display device 200 in this embodiment can refer to the description of the preparation method of the display device 100 in the above embodiment, and will not be repeated here.

[0138] In this embodiment, since the electron transport layer 17 is prepared using an open mask, the electron transport layer 17 located in the first opening 131 is removed, so that the cathode 18 is directly connected to the auxiliary electrode 12, thereby reducing the resistance of the cathode 18 and reducing the IR-drop in the display device, thereby improving the display effect of the display device.

[0139] In some embodiments, a photolithography process may be used to remove the electron transport layer 17 in the first opening 131 to achieve connection between the cathode 18 and the auxiliary electrode 12 , thereby reducing the resistance of the cathode 18 . Details will not be given here.

[0140] The present application also provides a display device, which can be a display device such as a mobile phone, tablet computer, laptop computer, or television. The display device includes a display device, which can be the display device 200 described in the aforementioned embodiment. The specific structure of the display device can be found in the description of the display device 200 in the aforementioned embodiment and will not be repeated here.

[0141] Compared with the preparation method of the display device in the prior art, the preparation method of the display device provided in the present application pre-forms a magnetic material layer on the auxiliary electrode, and after forming the electron transport layer, uses a magnetic element to adsorb the magnetic material layer on the auxiliary electrode. Since the electron transport layer is located on the side of the magnetic material layer close to the magnetic element, the part of the electron transport layer corresponding to the magnetic material layer will be separated from the first opening in the pixel defining layer together with the magnetic material layer. Then, after the cathode is formed on the electron transport layer, the cathode can be directly connected to the auxiliary electrode, so that the resistance of the cathode is reduced, thereby greatly reducing the IR-drop in the display device, improving the brightness uniformity of the display device, and thus improving the display effect of the display device.

[0142] The above is a detailed introduction to a method for preparing a display device and a display device provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, based on the ideas of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing a display device, characterized in that: The following steps are involved: providing a substrate; An auxiliary electrode and a pixel defining layer are sequentially formed on the substrate, wherein a plurality of first openings are formed on the pixel defining layer, and the first openings expose the auxiliary electrode; forming a magnetic material layer in the first opening; forming an electron transport layer on the magnetic material layer, wherein the electron transport layer covers the magnetic material layer, and the substrate, the auxiliary electrode, the pixel defining layer, the magnetic material layer, and the electron transport layer constitute a substrate assembly; The magnetic material layer is attracted by a magnetic element, and the electron transport layer and the magnetic material layer located in the first opening are separated from the first opening to expose the auxiliary electrode. The magnetic element is an electromagnet, and the power supply state of the electromagnet is controlled by a control element. as well as forming a cathode on the electron transport layer, wherein a portion of the cathode located in the first opening is connected to the auxiliary electrode; The step of using a magnetic element to absorb the magnetic material layer includes: The electromagnet is moved from one end of the substrate assembly to the other end of the substrate assembly. During the movement of the electromagnet, a side of the electromagnet facing the first opening is used to attract the magnetic material layer. When the electromagnet faces the first opening, the control element is turned on. The electromagnet is magnetic, and the magnetic material layer is attracted to the electromagnet. When a side of the electromagnet facing the first one or more first openings is completely occupied by the magnetic material layer, rotating and continuing to move the electromagnet so that the side of the electromagnet adsorbed with the magnetic material layer faces away from the substrate assembly, and the side of the electromagnet not adsorbed with the magnetic material layer faces the next one or more first openings; When the side of the electromagnet on which the magnetic material layer is adsorbed rotates to a side away from the substrate assembly, the control element is disconnected, the magnetism of the electromagnet disappears, and the magnetic material layer and the electron transport layer adsorbed on the electromagnet are detached from the electromagnet; Repeat the above steps until all the magnetic material layers in the substrate assembly are separated from the first opening.

2. The method for manufacturing a display device according to claim 1, wherein: The step of using a magnetic element to absorb the magnetic material layer includes: The side of the substrate assembly provided with the magnetic material layer is directed toward the magnetic element; The distance between the magnetic element and the substrate assembly is adjusted so that the magnetic material layer is attracted to the magnetic element.

3. The method for manufacturing a display device according to claim 2, wherein: The step of placing the side of the substrate assembly provided with the magnetic material layer toward the magnetic element comprises: Turning the substrate assembly upside down, placing the magnetic element below the substrate assembly, and making the side of the substrate assembly where the magnetic material layer is provided face the magnetic element; or The position of the substrate assembly is kept unchanged, and the magnetic element is placed above the substrate assembly, with the magnetic element facing the side of the substrate assembly where the magnetic material layer is provided.

4. The method for manufacturing a display device according to claim 2, wherein: The adjusting the distance between the magnetic element and the substrate assembly comprises: At least one of the magnetic element and the base plate assembly is moved to adjust the distance between the magnetic element and the base plate assembly in a horizontal direction and / or a vertical direction.

5. The method for manufacturing a display device according to claim 1, wherein: When the control element is turned on, the electromagnet is in a power-on state, the electromagnet has magnetism, and the electromagnet is used to adsorb the magnetic material layer; when the control element is disconnected, the electromagnet is in a power-off state, the magnetism of the electromagnet disappears, and the magnetic material layer and the electron transport layer adsorbed on the electromagnet are detached from the electromagnet.

6. The method for manufacturing a display device according to claim 1, wherein: The step of forming a magnetic material layer in the first opening includes: forming a magnetic ink layer in the first opening; The magnetic ink layer is solidified to form a magnetic material layer.

7. A display device, characterized in that: The display device is prepared by the method for preparing a display device according to any one of claims 1 to 6.

Images