Load-aware multi-layer cooling system

Abstract

The disclosed implementations provide a cooling system having an auxiliary system that extends a primary system. The auxiliary system includes a vapor container that receives vapor from an IT load, an auxiliary condenser that receives vapor from the vapor container via a compressor or a vapor valve and condenses the vapor into a liquid for storage in a liquid container. The auxiliary system also includes a fluid pump on a cooling loop for cooling the auxiliary condenser, and a cooling controller that includes a machine learning model for regulating operation of the vapor valve, the fluid pump, and the compressor based on a pre-created profile of the IT load and real-time information from at least one of a number of sources including the vapor container and the liquid container. The auxiliary system includes a number of cooling tiers that can be partially or fully triggered based on a number of metrics from a number of sensors collected in the auxiliary system.

Description

Technical Field

[0001] The embodiments of this disclosure generally relate to cooling systems. More specifically, embodiments of this disclosure relate to server rack cooling systems with multi-stage cooling capabilities. Background Technology

[0002] Effective thermal management solutions can reduce cooling costs for server racks in data centers. For a thermal management solution to be effective, it should always meet rack power consumption with a minimum cooling capacity buffer, be self-adjusting as power consumption in the server rack changes, have sufficient flexibility to adapt to evolving IT needs in its hardware design, and support phase-change cooling systems.

[0003] However, with existing thermal management solutions, the IT load to be cooled is typically tightly coupled to the cooling layer. This type of system lacks flexibility because any change in the IT load requires a corresponding change in the cooling layer. Summary of the Invention

[0004] One aspect of this disclosure provides a cooling system, comprising:

[0005] A main system, located above an IT load, includes a main condenser for receiving at least a portion of vapor from the IT load, condensing the received vapor into a liquid, and distributing the liquid back to the IT load; and

[0006] An auxiliary system, located above the IT load, includes:

[0007] A steam container that receives at least a portion of the steam from the IT load.

[0008] An auxiliary condenser receives the vapor from the vapor container via a compressor or a vapor valve and condenses the vapor into a liquid for storage in a liquid container;

[0009] A fluid pump is installed in the cooling circuit for cooling the auxiliary condenser, and

[0010] The cooling controller adjusts the operation of the steam valve, the fluid pump, and the compressor based on the operating states of the steam container and the liquid container.

[0011] Another aspect of this disclosure provides a data center cooling system, comprising:

[0012] Multiple cooling systems, each corresponding to an IT load, wherein each cooling system includes:

[0013] A main system, located above a corresponding IT load, includes a main condenser for receiving at least a portion of vapor from the IT load, condensing the received vapor into a liquid, and distributing the liquid back to the IT load; and

[0014] An auxiliary system, located above the IT load, includes:

[0015] A steam container that receives at least a portion of the steam from the IT load.

[0016] An auxiliary condenser receives the vapor from the vapor container via a compressor or a vapor valve and condenses the vapor into a liquid for storage in a liquid container;

[0017] A fluid pump is installed in the cooling circuit for cooling the auxiliary condenser, and

[0018] The cooling controller adjusts the operation of the steam valve, the fluid pump, and the compressor based on the operating states of the steam container and the liquid container. Attached Figure Description

[0019] Embodiments of the invention are shown in the accompanying drawings by way of example rather than limitation, in which the same reference numerals denote similar elements.

[0020] Figure 1 A multi-layer cooling system according to one embodiment is shown.

[0021] Figure 2 Another implementation of the multi-layer cooling system is shown.

[0022] Figure 3 An inter-system connection and communication according to one implementation method was also presented.

[0023] Figure 4 This is a flowchart illustrating a process for cooling an IT load according to one embodiment. Detailed Implementation

[0024] Various embodiments and aspects of the invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and drawings are illustrative of the invention and do not constitute a limitation thereof. Numerous specific details are described to provide a thorough understanding of various embodiments of the invention. However, in some cases, well-known or conventional details have not been described in order to provide a concise discussion of embodiments of the invention.

[0025] The reference to "one embodiment" or "implementation" in the specification means that a particular feature, structure, or characteristic described in connection with that embodiment may be included in at least one embodiment of the invention. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0026] According to various embodiments, this disclosure describes a system for cooling information technology (IT) loads. The cooling system does not sense real-time changes in the IT load, but instead uses a machine learning model to adjust the operation of the cooling tier based on a pre-created profile of the IT load and real-time information collected from several sensors.

[0027] In one embodiment, the cooling system includes an auxiliary system located above the IT load. The auxiliary system includes a steam container that receives steam from the IT load, an auxiliary condenser that receives steam from the steam container via a compressor or steam valve and condenses the steam into liquid for storage in a liquid container. The auxiliary system also includes a fluid pump in a cooling loop for cooling the auxiliary condenser, and a cooling controller incorporating a machine learning model for adjusting the operation of the steam valve, fluid pump, and compressor based on a pre-created profile of the IT load and real-time information from at least one of numerous sources and actual design data, including the steam container and the liquid container.

[0028] In one embodiment, the auxiliary system includes multiple cooling layers that can be partially or fully triggered based on several indicators, including pressure levels in the vapor container, liquid levels in the liquid container, ambient temperature, and / or the availability level of the renewable power source used to power the auxiliary condenser. The multiple cooling layers represent connections within the auxiliary system, including connections from the vapor container to the compressor and then to the auxiliary condenser; connections from the vapor container to the vapor valve and then to the auxiliary condenser; cooling loops with fluid pumps for cooling the auxiliary condenser; and inter-system connections connecting the auxiliary system to another auxiliary system.

[0029] In one implementation, the operation of critical equipment in the cooling layer can be adjusted. For example, the speed of the fluid pump can be increased to cool the auxiliary condenser more quickly, the frequency of the compressor can be increased to compress the vapor more efficiently, and the opening of the steam valve can be increased to allow more vapor to pass through.

[0030] In one implementation, the auxiliary system may include multiple sensors, such as pressure sensors in a vapor container, level sensors in a liquid container, and temperature and power sensors associated with the cooling controller. These sensors can provide real-time indicators that indirectly reflect the real-time heat load and cooling performance of the cooling system, natural conditions, and available resources. These real-time indicators, as a whole, can be taken into account by the cooling controller when adjusting the operation of multiple cooling layers.

[0031] For example, even if the cooling controller determines that the compressor needs to be started based on the pressure level of the vapor container and the liquid level of the liquid container, it may delay compressor start-up if the ambient temperature is too high, which is detrimental to vapor condensation. However, in another example, a high pressure level could directly trigger the compressor to condense the vapor back into the liquid. Since the vapor container may no longer be able to immediately maintain additional vapor if the vapor level is too high (e.g., above a threshold), condensation is necessary even if the ambient temperature is high.

[0032] In one implementation, the auxiliary system is agnostic to the IT load. However, the auxiliary system relies on a pre-created profile of the IT load, which can be generated based on the IT load's thermal load, the specifications of the hardware in the cooling system, and desired cooling performance metrics.

[0033] IT loads can be conventional liquid and air-cooled server racks or immersion cooling systems. Immersion cooling systems may include multiple immersion chambers, each containing electronic components at least partially immersed in a two-phase changing coolant, and server racks may be filled with multiple server chassis, each containing multiple servers.

[0034] Each server includes electronic devices, such as one or more processors, memory, storage devices, etc., which can generate heat during normal operation. In a conventional liquid cooling configuration, each of the main electronic devices (e.g., processors) can be attached to a cooling plate, such as a cold plate, which includes liquid distribution channels to allow coolant to flow through, which in turn exchange the heat generated from the electronic devices attached thereto. In an immersion cooling configuration, the electronic devices are at least partially immersed in a dielectric fluid contained in an immersion chamber. The coolant can be a two-phase coolant that can evaporate into vapor when the temperature of the liquid rises above a predetermined threshold.

[0035] In one implementation, the auxiliary system is connected to the main system via steam and liquid lines and can extend the cooling capacity of the main system. The main system is always open, but the auxiliary system is only opened when the steam pressure in the steam line reaches a threshold to trigger the opening of a valve on the steam line, allowing additional steam from the IT load to reach the steam container.

[0036] In one implementation, multiple such main systems can share an auxiliary system, with each main system designed to cool a separate IT load. Furthermore, the auxiliary system can be connected to another auxiliary system that extends the cooling capacity of one or more main systems. The connection between two auxiliary systems allows each auxiliary system to share a compressor and condenser with each other.

[0037] The above-described embodiments are not exhaustive of all aspects of the invention. The invention is intended to include all embodiments that can be practiced from all suitable combinations of the various embodiments outlined above, and also includes embodiments disclosed in the following detailed description.

[0038] Various embodiments of this disclosure provide a control architecture for cooling systems with multiple cooling layers, which does not affect the operation of the IT load or has real-time awareness of changes in the IT load. Advantages of these embodiments include efficient use of phase change technology, adaptability to high variations in heat load generation and cooling capacity, adaptation to imbalances between heat load and cooling capacity, reduced overall infrastructure costs, simplified design, and improved operational efficiency.

[0039] Figure 1 A multi-layer cooling system 100 according to one embodiment is shown. This cooling system includes a main system 102 and an auxiliary system 105, which together cool an IT load 119. Although only one main system and one IT load are shown, more IT loads and main systems can be applied.

[0040] IT load 119 may represent one or more server chassis or one or more immersion tanks of a server rack. The IT load includes a phase change liquid coolant that can be converted into vapor due to the temperature rise of the coolant caused by heat extracted from the electronic components in the IT load 119.

[0041] The main system 102 includes a condenser 103, which is a heat exchanger for condensing vapor from IT load 119 into liquid by cooling (e.g., as shown in the image). Figure 1 The liquid-cooled condenser shown can be an air-cooled condenser. Cooling circuit 106 can be attached to condenser 103 to cool condenser 103 using an external coolant. Main system 102 is the default cooling system for IT load 119 and is always activated as long as IT load 119 is running. In one embodiment, condenser 103 is located above and near IT load 119, which may be housed in a conventional server chassis or an immersion chamber.

[0042] A condenser is designed to transfer heat from the working fluid to the secondary fluid or the surrounding air. The condenser relies on efficient heat transfer that occurs during a phase change (i.e., in this case, during the condensation of vapor into liquid). Vapor typically enters the condenser at a temperature higher than that of the secondary fluid. As the vapor cools, it reaches its saturation temperature, condenses into a liquid, and releases a significant amount of latent heat. As this process occurs along the condenser, the amount of vapor decreases and the amount of liquid increases; at the condenser outlet, only liquid remains.

[0043] However, the auxiliary system 105 is not always operational. Instead, the auxiliary system 105 is used to extend the cooling capacity of the main system 102. Thus, the auxiliary system 105 only opens when the steam pressure from the IT load 119 reaches a predetermined threshold. When the threshold is reached, valve 115 on the steam line connecting the main system 102 and the auxiliary system 105 can be opened to allow steam to rise from the IT load 119 to the steam container 113 for buffering, thereby extending the cooling capacity of the cooling system 100.

[0044] In one embodiment, the auxiliary system 105 may include multiple cooling layers. A first cooling layer includes a steam container 113, a valve 118, and a condenser 112 forming a direct steam condensation path. The valve 118 controls the rate or volume of steam released from the steam container 113 to the condenser 112. A second cooling layer is a cooling circuit 110 with a fluid pump 108. A third cooling layer includes a steam container 113, a compressor 111, and a condenser 112 forming an indirect steam condensation path. In this path, steam released from the steam container 113 is conveyed to the compressor 111, which compresses the steam to increase its temperature and pressure before delivery to the condenser.

[0045] Condenser 112 can condense vapor released from vapor container 113 directly or indirectly into liquid, which is stored in liquid container 109. Due to gravity, the liquid in liquid container 109 can be distributed back to IT load 119 via valve 117, which can regulate the flow rate of the liquid distributed back to IT load 119. In one embodiment, a pump may be required when the liquid has a high viscosity.

[0046] In one embodiment, the cooling controller 107 may obtain the pressure level of the vapor container 113 via the pressure sensor 104 and the liquid level of the liquid container 109 via the liquid level sensor 114. The cooling controller 107 may control the operation of the three cooling layers based solely on the liquid level in the liquid container 109 and / or the pressure level in the vapor container 113.

[0047] For example, when the vapor pressure in vapor container 113 reaches a predetermined threshold, cooling controller 107 may increase the opening of valve 118 to allow more vapor to be released into condenser 112. Alternatively, or additionally, cooling controller 107 may adjust the frequency of compressor 111 to improve compression performance, for example, by increasing cubic feet per minute (CFM) or pounds per square inch (PSI) as the cycle time of compressor 111 increases. Cooling controller 107 may also adjust the speed of fluid pump 108 to increase the cooling capacity of condenser 112. Cooling controller 107 may adjust the operation of valve 118, fluid pump 108, and compressor 111 based solely on the pressure level in vapor container 118, regardless of the liquid level in liquid container 109.

[0048] Similarly, the cooling controller 107 can regulate the operation of the valve 118, fluid pump 108, and compressor 111 based solely on the liquid level in the liquid container.

[0049] In one embodiment, the cooling controller 107 may also obtain the ambient temperature via an ambient temperature sensor 120 and the level of the regenerative power supply via a power sensor 116. The ambient temperature can be used to determine the opening degree of valve 118. For example, when the ambient temperature is low, the opening degree of valve 118 can be increased to allow more vapor to be released into condenser 112. Condenser 112 may have better performance when the ambient temperature is low.

[0050] The level of the regenerative power supply can be used to determine the frequency of the compressor 111 powered by the regenerative power supply. When the level of the regenerative power supply is above a threshold, the cooling controller 107 can increase the frequency of the compressor 111. When the level of the regenerative power supply is below the threshold, the frequency of the compressor 111 can be decreased. This configuration ensures that the auxiliary system 105 does not lose the power required for the normal operation of the compressor 111. In one embodiment, the cooling controller 107 can also adjust the opening of the vapor line valve 115 and / or the liquid line valve 117 based on the profile of the IT load 119.

[0051] In this way, the cooling controller 107 obtains an overall view of the entire system, including the main system 102 and the auxiliary system 105, to optimize the cooling performance of the multi-layer cooling system 100.

[0052] In one implementation, a machine learning model, such as a neural network model, may be trained based on data collected from the various components of the auxiliary system 105, as well as the steam line valve 115, the liquid line valve 117, and the IT load 119.

[0053] In one implementation, data collected from IT load 119 can be used to generate a profile of IT load 119. This data may include information about the hardware to be cooled, electronic components, and the performance expected by the user. Examples of IT load profiles may include the generated heat load and the required cooling capacity. However, IT load profiles may not reflect real-time output (vapor) and input (liquid) demands, but rather are calculated over a period of time based on data from IT load 119.

[0054] The machine learning model can be used in real time to regulate the operation of auxiliary systems, including valve 118, compressor 111, fluid pump 108, vapor line valve 115, and liquid line valve 117, based on IT load profiles and real-time data collected by multiple sensors 104, 106, 116, and 114.

[0055] In one embodiment, condenser 103 may be located within the electronics rack where IT load 119 is located. Alternatively, condenser 103 may be located outside the electronics rack, with IT load 119 fluidly connected to condenser 103 via a vapor supply line and a liquid return line. In one embodiment, condenser 103 is positioned elevated relative to IT load 119, such that vapor generated from IT load 119 can move upstream via the vapor supply line due to gravity. Similarly, liquid generated from condenser 103 by condensing vapor flows downstream to IT load 119 via the liquid return line due to gravity. When valve 115 is open, either controlled by controller 107 or due to vapor pressure on the vapor line, vapor from IT load 119 can flow upstream into vapor container 113 of auxiliary system 105. Similarly, when valve 117 is open, either controlled by controller 107 or due to liquid level in IT load 119, liquid can flow downstream from liquid container to IT load 119. The auxiliary system 105 can be located outside the electronic rack and can be connected to similar systems. Figure 1 Another shared electronic rack is shown.

[0056] Figure 2 Another embodiment of the multi-layer cooling system 100 is shown. For example... Figure 2 As shown, multiple multi-layer cooling systems can be connected together to achieve redundancy and resilience. Figure 2 The technical details of this embodiment are illustrated using a first multi-layer cooling system (left) and a second multi-layer cooling system (right).

[0057] In the first multi-layer cooling system, the two main systems 102 and 202 share an auxiliary system 105. Vapor generated by IT load 219 can be condensed back to liquid via condenser 203 in main system 202, and can also be raised to auxiliary system 105 via vapor line valve 115. Liquid from auxiliary system 105 can be distributed to IT load 119 and IT load 219 via liquid line valve 117.

[0058] In similar Figure 1 In the second multi-layer cooling system of the cooling system 100 described herein, the vapor generated by the IT load 223 is condensed back to liquid via the condenser 220 in the main system 225. The auxiliary system 205 is connected to the main system 225 via a vapor line valve 215 and a liquid line valve 217. The condenser 220 can be cooled via the cooling circuit 204. Furthermore, the cooling controller 207 can implement a machine learning model to regulate the operation of various components in the auxiliary system 205, thereby achieving optimal cooling efficiency.

[0059] As shown in the figure, auxiliary systems 105 and 205 can be connected via inter-system connection 240, allowing the two auxiliary systems to share the compressor and condenser. Inter-system connection 240 can serve as a fourth cooling layer. Figure 1 As shown, the first cooling layer includes a vapor container 113, a valve 118, and a condenser 112. The second cooling layer includes a cooling circuit 110 with a fluid pump 108; and the third cooling layer includes a vapor container 113, a compressor 111, and a condenser 112.

[0060] In one implementation, each of IT loads 119, 219, and 223 may be associated with one of load controllers 201, 224, and 221. Cooling controllers 107 and 207 may obtain real-time information about IT loads 119, 219, and 223 via load controllers 201, 204, and 221. Cooling controllers 107 and 207 may only consider real-time IT load information when the fourth cooling layer (i.e., inter-system connection 240) is activated.

[0061] When the fourth cooling layer is off, each multi-layer cooling system uses only a pre-created profile of the corresponding IT load and some real-time metrics to regulate the operation of the various components in the corresponding auxiliary system. In an alternative implementation, when the fourth cooling layer is off, cooling controllers 107 and 207 may stop collecting real-time IT load information from load controllers 201, 204, and 221.

[0062] Figure 3 An inter-system connection 240 according to one embodiment is also shown. More specifically, Figure 3 An example of an embodiment of the inter-system connection 240 is shown.

[0063] As shown in the figure, interconnection 240 can be implemented by two system connections 330 and 333. System connection A 330 connects two steam line segments in auxiliary systems 105 and 205, wherein the first steam line segment is between steam container 113 and compressor 111 in auxiliary system 105, and the second steam line segment is between steam container 313 and compressor 310 in auxiliary system 205. System connection A 330 allows steam released from each of steam containers 113 and 313 to be compressed by both compressors 111 and 310. Valve 335 can be used by both cooling controllers 107 and 207 to control the volume of steam passing between auxiliary systems 105 and 205.

[0064] Intersystem connection B 333 connects two liquid line segments in auxiliary systems 105 and 205, wherein a first liquid line segment is between condenser 112 and liquid container 109, and a second liquid line segment is between condenser 312 and liquid container 309. Intersystem connection B 333 allows liquid from each condenser 112 and 312 to be stored in liquid containers 109 and 309. Valve 337 can be used by both cooling controllers 107 and 207 to control the volume or flow rate of liquid passing between the two auxiliary systems 105 and 205.

[0065] Therefore, even if the steam containers 113 and 313 and the liquid containers 109 and 309 are not directly connected, the above configuration can improve the operating efficiency of the multi-layer cooling system by providing redundancy, flexibility and sharing of cooling resources.

[0066] In one implementation, since each of the valves 335 and 337 on the inter-system connections 330 and 333 is directly controlled by the cooling controllers 107 and 207, each inter-system connection requires bidirectional system startup, which means that each of the auxiliary systems 105 and 205 is configured to support resource sharing with the other auxiliary system.

[0067] In one implementation, the two inter-system connections 330 and 333 can be controlled and operated separately, meaning that the operation of each inter-system connection is independent of each other.

[0068] In one implementation, cooling controllers 107 and 207 may be combined into one that can regulate the operation of three cooling layers in each of the auxiliary systems 105 and 205, as well as a shared fourth cooling layer (i.e., inter-system connections 330 and 333), based on data obtained from various sensors of both auxiliary systems 105 and 205.

[0069] Figure 4 This is a flowchart illustrating a process 400 for cooling an IT load according to one embodiment. The flowchart shows a process in an auxiliary system that extends the cooling capacity of the main system used to cool the IT load. The auxiliary system includes a vapor controller, vapor valves, a compressor, a condenser, and a liquid controller. The auxiliary system also includes a cooling controller implemented as a machine learning model for adjusting various cooling layers based on the IT load profile and real-time information collected from various sensors.

[0070] Figure 4 The process shown occurs in a single auxiliary system, which extends the cooling capacity of the main system used to cool IT loads.

[0071] like Figure 4As shown, at block 401, the cooling controller opens the steam valve to allow the steam stored in the steam container to be released directly to the condenser, which condenses the steam into liquid for storage in the liquid container.

[0072] At box 403, the cooling controller receives information from a pressure sensor in the steam container indicating the pressure level in the steam container.

[0073] At box 407, the cooling controller determines whether the pressure level is below a first threshold. If the pressure sensor reading is below the first threshold, the cooling controller will continue to monitor the pressure level of the steam container via the pressure sensor.

[0074] In parallel with collecting information from the pressure sensor and determining whether the pressure level is below a first threshold, the cooling controller collects information indicating the liquid level in the liquid container from a level sensor in the liquid container (box 405) and determines whether the liquid level is below a second threshold (box 409). If the liquid level is not below the second threshold, the cooling controller will continue to monitor the liquid level in the liquid container via the level sensor.

[0075] At box 411, when the pressure level is determined to be no lower than a first threshold and the liquid level is lower than a second threshold, the cooling controller closes the vapor valve and starts the compressor. This is because, with such a pressure level and liquid level, the heat load from the IT load has accumulated to a level that needs to be handled by the second cooling layer, which includes the vapor container, compressor, and condenser. In this embodiment, the speed of the fluid pump used for the condenser can also be increased. Therefore, the second and third cooling layers can be adjusted for different situations.

[0076] At box 413, using the cooling operation described in box 411, it is expected that the heat load to be addressed will be reduced. Therefore, if the vapor pressure in the vapor container has dropped below a first threshold and the liquid level has risen above a second threshold, the auxiliary system can determine that the heat load has been reduced and that the auxiliary system has additional cooling capacity. Therefore, as shown in box 413, in this case, the auxiliary system can repeat the operation at box 401 – opening the vapor valve to release vapor from the vapor container to the compressor. However, if, using the cooling operation described in box 411, the vapor pressure in the vapor container remains above the first threshold and the liquid level in the liquid container remains above the second threshold, the auxiliary system can determine that those operations are insufficient to handle the heat load. Therefore, additional operations need to be triggered.

[0077] At box 415, the cooling controller uses an optimizer (e.g., a trained machine learning model) to optimize cooling operations, including adjusting the fluid pump at box 417 to maximize its speed and / or increasing the compressor frequency, and / or activating one or more peer system condensers at box 419. Furthermore, the optimized operations may also include a combination of operations of cooling layer 2 and cooling layer 3.

[0078] At box 421, if the cooling performance is still unsatisfactory after all four cooling layers have been activated, additional operating strategies can be used.

[0079] In the foregoing description, embodiments of the present disclosure have been described with reference to exemplary embodiments of its features. It will be apparent that various modifications may be made thereto without departing from the broader spirit and scope of the present disclosure as set forth in the appended claims. Therefore, the description and drawings are to be considered illustrative rather than restrictive.

[0080] As previously described, embodiments of this disclosure may be (or include) a non-transitory machine-readable medium (such as a microelectronic memory) having instructions stored thereon that program one or more data processing components (collectively referred to herein as "processors") to perform airflow management operations, such as controlling the fan speed of one or more fans of a battery module (and / or BBU rack). In other embodiments, some of these operations may be performed by specific hardware components containing hard-wired logic. Alternatively, these operations may be performed by any combination of a programmable data processing component and a fixed hard-wired circuit component of any of the battery modules described herein.

[0081] Although certain aspects have been described and illustrated in the accompanying drawings, it should be understood that these aspects are merely illustrative and not intended to limit the broad disclosure, and that this disclosure is not limited to the specific structures and arrangements shown and described, as various other modifications will be apparent to those skilled in the art. Therefore, this specification is to be considered illustrative rather than restrictive.

Claims

1. A cooling system, comprising: A main system, located above an IT load, includes a main condenser for receiving at least a portion of vapor from the IT load, condensing the received vapor into a liquid, and distributing the liquid back to the IT load; and An auxiliary system, located above the IT load, includes: A steam container that receives at least a portion of the steam from the IT load. An auxiliary condenser receives the vapor from the vapor container via a compressor or a vapor valve and condenses the vapor into a liquid for storage in a liquid container; A fluid pump is installed in the cooling circuit for cooling the auxiliary condenser, and A cooling controller includes a machine learning model for adjusting the operation of the steam valve, the operation of the fluid pump, and the operation of the compressor based on a pre-created profile of the IT load and real-time information from at least one of a plurality of sources including the steam container and the liquid container, wherein the IT load profile includes the heat load generated by the IT load and the required cooling capacity.

2. The cooling system according to claim 1, wherein, The machine learning model is used to adjust at least one of the speed of the fluid pump, the frequency of the compressor, or the opening degree of the steam valve.

3. The cooling system according to claim 1, wherein, The steam container includes a pressure sensor for measuring the pressure level of the steam contained in the steam container, wherein the cooling controller is configured to control the steam valve, the fluid pump, and the compressor based on the pressure level of the steam container.

4. The cooling system according to claim 1, wherein, The liquid container includes a level sensor for measuring the liquid level in the liquid container, wherein the cooling controller is configured to control the vapor valve, the fluid pump, and the compressor based on the liquid level in the liquid container.

5. The cooling system according to claim 1, wherein, The cooling controller also uses a power sensor to determine the available power level of the renewable power source used to power the cooling controller.

6. The cooling system according to claim 1, wherein, The cooling controller also determines the ambient temperature via a temperature sensor, wherein the cooling controller starts the compressor when the ambient temperature drops below a threshold.

7. The cooling system according to claim 1, wherein, The IT load is designed with an immersion-based cooling system having multiple immersion chambers in which electronic equipment is at least partially immersed in a two-phase immersion fluid.

8. The cooling system according to claim 1, wherein, The steam container and the liquid container in the auxiliary system operate asynchronously.

9. The cooling system according to claim 1, wherein, The auxiliary system and the main system are connected via steam lines and liquid lines.

10. The cooling system according to claim 9, wherein, The steam line is regulated by a steam line valve to control the volume of steam transferred from the IT load to the steam container, and the liquid line is regulated by a liquid line valve to control the volume of liquid distributed from the liquid container to the IT load.

11. The cooling system according to claim 10, wherein, The steam line valve opens when the pressure level in the steam line reaches a threshold.

12. The cooling system according to claim 1, wherein, The main system is a first main system, and the IT load is a first IT load, wherein the cooling system further includes a second main system connected to the auxiliary system, and the second main system is configured to provide cooling to the second IT load.

13. The cooling system according to claim 12, wherein, The auxiliary system is shared by the first main system and the second main system.

14. A data center cooling system, comprising: Multiple cooling systems, each corresponding to an information technology (IT) load, wherein each of the cooling systems includes: A main system, located above a corresponding IT load, includes a main condenser for receiving at least a portion of vapor from the IT load, condensing the received vapor into a liquid, and distributing the liquid back to the IT load; and An auxiliary system, located above the IT load, includes: A steam container that receives at least a portion of the steam from the IT load. An auxiliary condenser receives the vapor from the vapor container via a compressor or a vapor valve and condenses the vapor into a liquid for storage in a liquid container; A fluid pump is installed in the cooling circuit for cooling the auxiliary condenser, and A cooling controller includes a machine learning model for adjusting the operation of the steam valve, the operation of the fluid pump, and the operation of the compressor based on a pre-created profile of the IT load and real-time information from at least one of a plurality of sources including the steam container and the liquid container, wherein the IT load profile includes the heat load generated by the IT load and the required cooling capacity.

15. The data center cooling system according to claim 14, wherein, At least two cooling controllers of the cooling systems are connected in communication with each other.

16. The data center cooling system according to claim 14, wherein, The auxiliary condenser of the auxiliary system of the first cooling system in the cooling system is shared by the auxiliary system of the second cooling system in the cooling system.

17. The data center cooling system according to claim 14, wherein, The steam container includes a pressure sensor for measuring the pressure level of the steam contained in the steam container, wherein the cooling controller is configured to control the steam valve, the fluid pump, and the compressor based on the pressure level of the steam container.

18. The data center cooling system according to claim 14, wherein, The liquid container includes a level sensor for measuring the liquid level in the liquid container, wherein the cooling controller is configured to control the vapor valve, the fluid pump, and the compressor based on the liquid level in the liquid container.

19. The data center cooling system according to claim 14, wherein, The cooling controller also uses a power sensor to determine the available power level of the renewable power source used to power the cooling controller.

20. The data center cooling system according to claim 14, wherein, The cooling controller also determines the ambient temperature via a temperature sensor, wherein the cooling controller starts the compressor when the ambient temperature drops below a threshold.

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