Refrigeration unit

Abstract

The present invention provides a refrigeration device for cooling liquid contained in a target container. The refrigeration device includes a base, a semiconductor refrigeration plate, an inner cylinder, and a heat exchanger. The base defines a heat exchange chamber, a through hole is formed in the top of the base, and the semiconductor refrigeration plate is exposed at the through hole. The semiconductor refrigeration plate has a cooling surface facing upward and a heating surface facing away from the cooling surface. The inner cylinder is arranged above the base and defines a cooling chamber for fixing the target container. The bottom of the inner cylinder is removably inserted into the through hole, and at least a portion of its bottom surface contacts the cooling surface, so that the cold energy generated by the semiconductor refrigeration plate is transferred to the inner cylinder. The heat exchanger is arranged in the heat exchange chamber and is used to absorb the heat generated by the heating surface. The present invention specifically cools the liquid in the target container, solving the cooling needs of users in the absence of large refrigeration equipment such as refrigerators and freezers. It is highly practical and easy to promote.

Description

Technical Field

[0001] The present invention relates to the field of refrigeration, and in particular to a refrigeration device. Background Art

[0002] Currently, most beverages sold on the market are bottled or canned liquids, and consumers need to place them in refrigerators or freezers to cool them down. However, refrigerators or freezers are relatively large devices and are not convenient for users to use anytime and anywhere. Summary of the Invention

[0003] An object of the present invention is to overcome at least one drawback in the prior art and provide a refrigeration device.

[0004] A further object of the present invention is to cool the liquid in the target container in a targeted manner, thereby solving the cooling needs of users in the absence of large refrigeration equipment such as refrigerators and freezers.

[0005] Another further object of the present invention is to enable the heat generated by the heating surface of the semiconductor refrigeration plate to be absorbed in a timely manner to ensure the reliability of the semiconductor refrigeration plate.

[0006] In particular, the present invention provides a refrigeration device for cooling a liquid contained in a target container, comprising: a base, which defines a heat exchange cavity therein and has a through hole at the top; a semiconductor refrigeration plate exposed at the through hole, and the semiconductor refrigeration plate has a cooling surface facing upward and a heating surface facing away from the cooling surface; an inner cylinder, arranged above the base, which defines a cooling cavity for fixing the target container, the bottom of the inner cylinder being detachably extended into the through hole, and at least part of its bottom surface is in contact with the cooling surface, so that the cold energy generated by the semiconductor refrigeration plate is transferred to the inner cylinder; and a heat exchanger, arranged in the heat exchange cavity, for absorbing heat generated by the heating surface.

[0007] Optionally, the heat exchanger also includes: a rotating shaft, which is arranged along the height direction of the base, with its axis coinciding with the central axis of the through hole, and is configured to rotate around its axis, and a plurality of spaced heat sinks extend radially from the circumference of the rotating shaft; and an upper turntable, formed at the top end of the rotating shaft, the semiconductor refrigeration plate is fixed to the center of the upper turntable, so that the heat generated by the heating surface is transferred to the rotating shaft through the upper turntable, and then transferred to the plurality of heat sinks.

[0008] Optionally, the refrigeration device also includes: an outer cylinder, which is sleeved on the outside of the inner cylinder, and a plurality of vacuum heat exchange chambers extending axially are formed between the outer cylinder and the inner cylinder, and the vacuum heat exchange chambers are filled with heat exchange medium to utilize the heat exchange medium to transfer cold energy along the extension direction of the vacuum heat exchange chamber.

[0009] Optionally, a connecting hole is opened on the bottom surface of the outer cylinder to expose at least part of the bottom surface of the inner cylinder. When the bottom of the inner cylinder extends into the through hole, the semiconductor refrigeration plate is passed through the connecting hole so that the cooling surface contacts at least part of the bottom surface of the inner cylinder.

[0010] Optionally, the contour of the connecting hole matches the shape of the semiconductor refrigeration chip, so that when the semiconductor refrigeration chip is inserted into the connecting hole, the outer cylinder and the inner cylinder rotate together with the semiconductor refrigeration chip.

[0011] Optionally, the contours of the connecting hole and the semiconductor cooling plate are both square.

[0012] Optionally, the heat exchanger also includes: a lower turntable formed at the bottom end of the rotating shaft; and a driving mechanism for driving the rotating shaft to rotate, the driving mechanism including a motor, mutually meshing gears and a rack, the motor is installed on the base, the gear is installed on the motor, and the rack is formed on the periphery of the lower turntable.

[0013] Optionally, the driving mechanism further includes: a motor cover, which is buckled over the motor to protect the motor and fixes the motor to the base through fasteners.

[0014] Optionally, a mounting opening is provided on a side wall of the base; and the refrigeration device further comprises:

[0015] The heat exchange fan is arranged at the installation port, and its air inlet faces the peripheral surface of the rotating shaft, and is configured to promote the formation of a heat exchange airflow that exchanges heat with a plurality of heat sinks and is discharged from the installation port.

[0016] Optionally, the heat exchange fan is an axial flow fan.

[0017] The refrigeration device of the present invention has a heat exchange chamber defined within the base, a through hole is provided at the top of the base, a semiconductor refrigeration plate is exposed at the through hole, the bottom of the inner cylinder can be removably inserted into the through hole, and at least a portion of its bottom surface is in contact with the cooling surface of the semiconductor refrigeration plate. The heat exchanger is arranged in the heat exchange chamber. Therefore, when in use, the user can place and fix the target container containing the liquid to be cooled in the cooling chamber of the inner cylinder as needed, and then power the semiconductor refrigeration plate. In this way, the cold energy generated by the semiconductor refrigeration plate can be transferred to the inner cylinder, and then transferred to the target container by heat conduction, and finally transferred to the liquid to be cooled by heat convection and heat conduction, so that the liquid is quickly cooled to meet the user's needs. In addition, because the overall structure of the refrigeration device is simple, easy to carry, and takes up little space, it can cool the liquid in the target container in a targeted manner, solving the user's refrigeration needs in the absence of large refrigeration equipment such as refrigerators and freezers.

[0018] Furthermore, in the refrigeration device of the present invention, since the rotating shaft can rotate around its axis, a plurality of heat sinks arranged at intervals are extended radially from the circumference of the rotating shaft, the upper turntable is formed at the top of the rotating shaft, and the semiconductor refrigeration fin is fixed to the center of the upper turntable. Therefore, the heat generated by the heating surface can be transferred by the upper turntable to the rotating shaft, and then transferred by the rotating shaft to the plurality of heat sinks. The plurality of heat sinks extend outward from the rotating shaft, thereby increasing the heat exchange area and improving the heat exchange efficiency. Moreover, the plurality of heat sinks can rotate with the rotating shaft, thereby improving the convective heat transfer coefficient between the plurality of heat sinks and the air, further optimizing the heat exchange, so that the heat generated by the heating surface can be absorbed in a timely manner, and the reliability of the semiconductor refrigeration fins is ensured.

[0019] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0021] Figure 1 is a schematic diagram of a refrigeration device according to an embodiment of the present invention;

[0022] Figure 2 is an exploded view of a refrigeration device according to one embodiment of the present invention;

[0023] Figure 3 is a longitudinal cross-sectional view of a refrigeration device according to one embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of a heat exchanger in a refrigeration device according to an embodiment of the present invention;

[0025] Figure 5 is a transverse cross-sectional view of an inner cylinder, an outer cylinder, and a target container in a refrigeration device according to one embodiment of the present invention;

[0026] Figure 6 yes Figure 3 Enlarged view of part A in the middle;

[0027] Figure 7 is a bottom view of a heat exchanger in a refrigeration device according to one embodiment of the present invention;

[0028] Figure 8 Schematic diagram of a first brush or a second brush in a refrigeration device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0029] Please attend Figures 1 to 3 , Figure 1 is a schematic diagram of a refrigeration device 1 according to an embodiment of the present invention, Figure 2 is an exploded view of a refrigeration device 1 according to an embodiment of the present invention, Figure 3 FIG2 is a longitudinal cross-sectional view of a refrigeration device 1 according to one embodiment of the present invention. The present invention provides a refrigeration device 1 that can be used to cool a liquid (e.g., a beverage) contained in a target container 10. The refrigeration device 1 may include a base 100, a semiconductor cooling plate 200, an inner cylinder 300, and a heat exchanger 500.

[0030] A heat exchange chamber 110 is defined in the base 100, a through hole 120 is provided at the top of the base 100, and the semiconductor refrigeration plate 200 is exposed at the through hole 120, and the semiconductor refrigeration plate 200 has a cooling surface facing upward and a heating surface facing away from the cooling surface. The inner cylinder 300 is arranged above the base 100, and the interior of the inner cylinder 300 defines a cooling chamber 310 for fixing the target container 10. The bottom of the inner cylinder 300 can be detachably extended into the through hole 120, and at least part of its bottom surface is in contact with the cooling surface, so that the cold energy generated by the semiconductor refrigeration plate 200 is transferred to the inner cylinder 300, and the heat exchanger 500 is arranged in the heat exchange chamber 110 for absorbing the heat generated by the heating surface.

[0031] The semiconductor cooling chip 200 is a cooling module based on the Peltier effect. When DC current is applied, one surface of the cooling chip becomes a heating surface and the other becomes a cooling surface. In this embodiment, the direction of the DC current can be controlled to make the cooling surface face upward and the heating surface face downward.

[0032] The inner cylinder 300 can be made of a material with good thermal conductivity (such as metal). The cooling chamber 310 of the inner cylinder 300 can be fixed to the target container 10 through an interference fit or an overfit. During use, multiple inner cylinders 300 of different diameters can be configured to accommodate target containers 10 of varying diameters. Alternatively, the target container 10 can be used as a common container, allowing the liquid to be directly poured into the target container 10 without having to replace the target container 10, which is simple and convenient.

[0033] The bottom of the inner cylinder 300 can be removably extended into the through hole 120. Since the semiconductor refrigeration plate 200 is exposed in the through hole 120 and its cooling surface is facing upward, the bottom surface of the inner cylinder 300 can at least partially contact the cooling surface. The cold energy of the cooling surface can first be transferred along the bottom surface of the inner cylinder 300 and then transferred upward. The cold energy can be further transferred to the target container 10 fixed in the cooling cavity 310, and finally the cold energy can be transferred to the liquid.

[0034] Since the semiconductor refrigeration chip 200 is arranged on the top of the base 100, the heat exchanger 500 can also be arranged in the heat exchange cavity 110 in the base 100. Therefore, the heat exchanger 500 is arranged below the semiconductor refrigeration chip 200 and close to the side of the heating surface to absorb the heat generated by the heating surface, thereby reducing the temperature of the semiconductor refrigeration chip 200 and avoiding burning of the semiconductor refrigeration chip 200.

[0035] During use, the user can place and fix the target container 10 containing the liquid to be cooled in the cooling cavity 310 of the inner cylinder 300 as needed, and then power the semiconductor refrigeration chip 200. In this way, the cold energy generated by the semiconductor refrigeration chip 200 can be transferred to the inner cylinder 300, and then transferred to the target container 10 by heat conduction, and finally transferred to the liquid to be cooled by heat convection and heat conduction, so that the liquid can be cooled quickly to meet user needs.

[0036] In addition, since the refrigeration device 1 has a simple overall structure, is easy to carry, and occupies a small space, it can specifically cool the liquid in the target container 10, solving the user's refrigeration needs when there is no large refrigeration equipment such as a refrigerator or freezer.

[0037] See Figures 2 to 4 , Figure 4 Schematic diagram of a heat exchanger 500 in a refrigeration device 1 according to an embodiment of the present invention. In some embodiments, the heat exchanger 500 may further include a rotating shaft 520 and an upper turntable 510. The rotating shaft 520 is disposed along the height direction of the base 100, with its axis coinciding with the central axis of the through hole 120. The rotating shaft 520 is configured to rotate about its axis. A plurality of spaced-apart heat sinks 530 extend radially from the circumference of the rotating shaft 520. The upper turntable 510 is formed at the top of the rotating shaft 520, and the semiconductor cooling fin 200 is fixed to the center of the upper turntable 510, so that heat generated by the heating surface is transferred through the upper turntable 510 to the rotating shaft 520, and then to the plurality of heat sinks 530.

[0038] In this embodiment, a plurality of heat sinks 530 are formed on the rotating shaft 520. The plurality of heat sinks 530 can be spaced and evenly arranged along the circumference of the rotating shaft 520. The upper turntable 510 can be horizontally formed at the top of the rotating shaft 520. The heating surface of the semiconductor refrigeration plate 200 is in contact with the upper surface of the upper turntable 510. In this way, the heat generated by the heating surface can be transferred by the upper turntable 510 to the rotating shaft 520, and then transferred by the rotating shaft 520 to the plurality of heat sinks 530. The plurality of heat sinks 530 increase the heat exchange area and improve the heat exchange efficiency.

[0039] In addition, since the rotating shaft 520 can rotate in the heat exchange chamber 110, the multiple heat sinks 530 can rotate with the rotating shaft 520, thereby improving the convective heat transfer coefficient between the multiple heat sinks 530 and the air, further optimizing the heat exchange, and allowing the heat generated by the heating surface to be absorbed in a timely manner, thereby ensuring the reliability of the semiconductor refrigeration plate 200.

[0040] See Figure 2 、 Figure 3 and Figure 5 , Figure 5 FIG2 is a transverse cross-sectional view of an inner cylinder 300, an outer cylinder 400, and a target container 10 in a refrigeration device 1 according to one embodiment of the present invention. In some embodiments, the refrigeration device 1 may further include an outer cylinder 400, which is sleeved onto the outer cylinder 300. Multiple axially extending vacuum heat exchange chambers 320 are formed between the outer cylinder 400 and the inner cylinder 300. The vacuum heat exchange chambers 320 are filled with a heat exchange medium, which transfers cooling energy along the direction in which the vacuum heat exchange chambers 320 extend.

[0041] The outer cylinder 400 can be made of a heat-insulating material (such as heat-insulating plastic) to prevent the cooling energy of the inner cylinder 300 from escaping. A vacuum heat exchange chamber 320 can be formed axially around the outer periphery of the inner cylinder 300. When the outer cylinder 400 is sleeved onto the outer periphery of the inner cylinder 300, the vacuum heat exchange chamber 320 is sealed and filled with a heat exchange medium, which can be pure water.

[0042] Because the pressure within the vacuum heat exchange chamber 320 is relatively low (in a vacuum or near-vacuum state), the evaporation temperature of the heat exchange medium is lower than its normal evaporation temperature. When a certain area of ​​the inner cylinder 300 is heated, the heat exchange medium within the vacuum heat exchange chamber 320 evaporates in the vacuum environment, forming gaseous vapor and absorbing heat. When the gaseous vapor encounters a cooler area within the vacuum heat exchange chamber 320, it condenses into liquid, releasing heat, thereby transferring heat. Furthermore, capillary tubes can be pre-installed within the vacuum heat exchange chamber 320 of the vapor chamber. The condensed liquid heat exchange medium can then be adsorbed by the capillary tubes and returned to its original position, allowing the next heat transfer to begin.

[0043] During use, the target container 10, due to its high temperature, heats the inner cylinder 300, causing the heat exchange medium within the vacuum heat exchange chamber 320 to evaporate. The heat exchange medium then flows toward the cold end (i.e., the bottom of the inner cylinder 300) and condenses there. Furthermore, because the bottom of the inner cylinder 300 is cooled by the semiconductor refrigeration plate 200, the difference between the hot and cold ends is increased, facilitating efficient flow of the heat exchange medium between the hot and cold ends of the vacuum heat exchange chamber 320, further improving heat exchange efficiency.

[0044] In other embodiments, a heat pipe may be directly arranged between the outer cylinder 400 and the inner cylinder 300, and a vacuum heat exchange chamber 320 may be formed in the heat pipe, which can also achieve the above technical effects and is simple to manufacture and convenient for mass production.

[0045] See Figure 2 and Figure 3 In some embodiments, a connecting hole 410 is provided on the bottom surface of the outer cylinder 400 to expose at least a portion of the bottom surface of the inner cylinder 300. When the bottom of the inner cylinder 300 extends into the through hole 120, the semiconductor refrigeration plate 200 is passed through the connecting hole 410 so that the cooling surface contacts at least a portion of the bottom surface of the inner cylinder 300.

[0046] Furthermore, the contour of the connecting hole 410 matches the shape of the semiconductor refrigeration chip 200 , so that when the semiconductor refrigeration chip 200 is inserted into the connecting hole 410 , the outer cylinder 400 and the inner cylinder 300 rotate together with the semiconductor refrigeration chip 200 .

[0047] Because the semiconductor cooling chip 200 is fixed to the upper turntable 510, and the upper turntable 510 is formed on the rotating shaft 520, and the rotating shaft 520 can rotate within the heat exchange chamber 110, the semiconductor cooling chip 200 can rotate together with the rotating shaft 520. When the bottom of the inner cylinder 300 extends into the through hole 120, the semiconductor cooling chip 200 is inserted into the connecting hole 410 of the outer cylinder 400. The connecting hole 410 is shaped to match the semiconductor cooling chip 200. In this way, the semiconductor cooling chip 200 can drive the inner cylinder 300 and the outer cylinder 400 to rotate simultaneously, while the target container 10 is fixedly disposed in the cooling chamber 310 of the inner cylinder 300, thereby driving the target container 10 to rotate. In this way, when the target container 10 rotates, the liquid contained in the target container 10 can exchange heat with the target container 10 through thermal convection, further optimizing heat conversion.

[0048] During use, the rotation speed of the rotating shaft 520 can be set to be relatively low, for example, less than 20 r / min, so as to prevent the liquid in the target container 10, which is a carbonated beverage (such as cola), from being excessively shaken and affecting the taste.

[0049] In some specific embodiments, the contours of the connecting hole 410 and the semiconductor cooling plate 200 are both square (square or rectangular), so that the contours of the connecting hole 410 and the semiconductor cooling plate 200 are matched.

[0050] Typically, the inner cylinder 300 is configured to be cylindrical, and the semiconductor refrigeration plate 200 is configured to be square, which is beneficial for it to occupy a larger area at the bottom of the inner cylinder 300, thereby increasing the heat exchange area between the cooling surface and the inner cylinder 300, and increasing the heat exchange area between the heating surface and the heat exchanger 500, while improving the cooling efficiency and heat dissipation efficiency.

[0051] In addition, the connecting hole 410 and the semiconductor refrigeration chip 200 are arranged in a square shape, which makes it convenient for the user to insert the connecting hole 410 of the outer cylinder 400 into the semiconductor refrigeration chip 200. Especially when the semiconductor refrigeration chip 200 is square, the user can align the outer cylinder 400 with the semiconductor refrigeration chip 200 once every 90° rotation.

[0052] Therefore, setting the contour of the connecting hole 410 and the semiconductor refrigeration plate 200 to be square not only enables the semiconductor refrigeration plate 200 to drive the inner cylinder 300 and the outer cylinder 400 to rotate simultaneously, thereby improving the heat exchange efficiency, but also makes it easier for the user to clamp the connecting hole 410 of the outer cylinder 400 on the semiconductor refrigeration plate 200.

[0053] Of course, those skilled in the art can also set the outline of the connecting hole 410 and the semiconductor cooling plate 200 to other shapes, such as triangle, D-shape, etc., by simple replacement according to the technical solution of the present disclosure, which are not listed here one by one.

[0054] See Figures 2 to 4 In some embodiments, the heat exchanger 500 may further include a lower turntable 540 and a driving mechanism. The lower turntable 540 is formed at the bottom end of the rotating shaft 520. The driving mechanism is used to drive the rotating shaft 520 to rotate. The driving mechanism includes a motor 550, a gear 560 and a rack 570 that are meshed with each other. The motor 550 is installed on the base 100, the gear 560 is installed on the motor 550, and the rack 570 is formed on the periphery of the lower turntable 540.

[0055] The lower turntable 540 can be horizontally arranged at the bottom end of the rotating shaft 520, and a motor 550 seat for mounting the motor 550 can also be provided on the base 100. The output shaft of the motor 550 is fixed to the gear 560 and drives the gear 560 to rotate. The gear 560 is engaged with the rack 570 formed on the lower turntable 540 to drive the lower turntable 540 to rotate, and the lower turntable 540 drives the rotating shaft 520 to rotate.

[0056] Furthermore, the driving mechanism may further include a motor cover 580 , which is buckled over the motor 550 to protect the motor 550 and fixes the motor 550 to the base 100 via fasteners.

[0057] See Figure 2 and Figure 3In some embodiments, a mounting opening 160 is provided on the side wall of the base 100, and the refrigeration device 1 further includes a fan mounting frame 710 and a heat exchange fan 720. The fan mounting frame 710 is mounted on the mounting opening 160, and the heat exchange fan 720 is disposed on the fan mounting frame 710. The air intake of the heat exchange fan 720 faces the circumference of the rotating shaft 520, and is configured to promote the formation of a heat exchange airflow that exchanges heat with the plurality of heat sinks 530 and is discharged from the mounting opening 160.

[0058] Since the mounting port 160 is located on the side wall of the base 100, the rotating shaft 520 extends along the height direction of the base 100, and multiple heat sinks 530 are formed on the circumference of the rotating shaft 520, the air intake of the heat exchange fan 720 can be directly opposite the circumference of the rotating shaft 520, thereby accelerating the heat exchange between the air in the heat exchange cavity 110 and the multiple heat sinks 530. Since the multiple heat sinks 530 rotate with the rotating shaft 520, each heat sink 530 can accelerate the heat dissipation speed when it rotates to face the heat exchange fan 720.

[0059] The heat exchange fan 720 can also be configured as an axial flow fan. The axial flow fan has the advantages of large air volume and low noise, and is suitable for the use environment of the refrigeration device 1.

[0060] See Figures 6 to 8 , Figure 6 yes Figure 3 A magnified view of the middle part, Figure 7 1 is a bottom view of a heat exchanger in a refrigeration device according to an embodiment of the present invention. Figure 8 Schematic diagram of a first brush or a second brush in a refrigeration device according to an embodiment of the present invention. In some embodiments, the rotating shaft 520 has a downwardly open mounting space 522. The refrigeration device may further include a first fixed electrode 610, a second fixed electrode 620, a first brush 630, and a second brush 640. The first fixed electrode 610 extends into the installation space 522, the second fixed electrode 620 extends into the installation space 522, the second fixed electrode 620 surrounds the first fixed electrode 610, the first fixed electrode 610, the second fixed electrode 620 and the rotating shaft 520 are coaxially arranged, and the first fixed electrode 610 and the second fixed electrode 620 are connected to an external power supply, one side of the first brush 630 is fixedly connected to the inner wall of the installation space 522, and the other side of the first brush 630 is rotatably connected to the first fixed electrode 610, one side of the second brush 640 is fixedly connected to the inner wall of the installation space 522, and the other side of the second brush 640 is rotatably connected to the second fixed electrode 620, and the first brush 630 and the second brush 640 respectively pass through the installation space 522 through wires to power the semiconductor refrigeration plate 200.

[0061] The first fixed electrode 610 and the second fixed electrode 620 are fixed relative to the rotation axis 520. The second fixed electrode 620 can be hollow, and the first fixed electrode 610 is disposed inside the second fixed electrode 620. Because the first fixed electrode 610, the second fixed electrode 620, and the rotation axis 520 are coaxially disposed, the first fixed electrode 610 and the second fixed electrode 620 are also located on the rotation axis 520 line of the rotation axis 520. In other words, the rotation axis 520 can rotate around the first fixed electrode 610 and the second fixed electrode 620.

[0062] The first fixed electrode 610 and the second fixed electrode 620 can be made of a highly conductive material such as metal or graphite. One of the first fixed electrode 610 and the second fixed electrode 620 can be connected to the positive terminal of an external power source, while the other can be connected to the negative terminal of the external power source. The first brush 630 and the second brush 640 can also be made of a conductive material (such as graphite).

[0063] Since the connection relationship between the first fixed electrode 610 and the first brush 630 and the second fixed electrode 620 and the second brush 640 is similar, the working principle thereof will be described below by taking the first fixed electrode 610 and the first brush 630 as an example.

[0064] One side of the first brush 630 is fixedly connected to the inner wall of the installation space 522, and the other side of the first brush 630 is rotatably connected to the first fixed electrode 610, so that the first brush 630 can be electrically connected to the first fixed electrode 610. When the rotating shaft 520 rotates, the first brush 630 can rotate around the first fixed electrode 610 with the rotating shaft 520 and always maintain an electrically connected state with the first fixed electrode 610. Moreover, since the first brush 630 is fixedly connected to the inner wall of the installation space 522, the first brush 630 and the rotating shaft 520 are relatively stationary. In this way, the wire connected to the first brush 630 can not only be electrically connected to the first fixed electrode 610, but also remain relatively stationary with the rotating shaft 520, so that it can avoid entanglement when passing through the installation space 522 to power the semiconductor refrigeration plate 200, thereby improving the aesthetics and safety of the power connection line.

[0065] A first mounting post 524 and a second mounting post 526 protrude from the inner wall of the mounting space 522. A buckle 524b is formed on the outer side of the first mounting post 524 and the second mounting post 526. The first brush 630 and the second brush 640 are respectively recessed inward toward one side of the inner wall of the mounting space 522 to form a first mounting groove 632 and a second mounting groove 642. A snap hole 632a is formed in the first mounting groove 632 and the second mounting groove 642. The first mounting post 524 and the second mounting post 526 extend into the first mounting groove 632 and the second mounting groove 642 respectively, and the buckle 524b and the snap hole 632a are matched to fix the first brush 630 and the second brush 640 to the inner wall of the mounting space 522.

[0066] The first mounting post 524 and the second mounting post 526 are formed with a third mounting groove 524a and a fourth mounting groove 526a which are open toward the first mounting groove 632 and the second mounting groove 642, respectively. The heat exchange assembly may further include two springs 650, which are respectively arranged in the third mounting groove 524a and the fourth mounting groove 526a, and are configured to be compressed when the first mounting post 524 and the second mounting post 526 are respectively extended into the first mounting groove 632 and the second mounting groove 642, so as to provide an elastic pre-tightening force for the first brush 630 and the second brush 640 toward the first fixed electrode 610 and the second fixed electrode 620, respectively.

[0067] Since the first mounting post 524 and the second mounting post 526 are respectively formed directly on the inner wall of the mounting space 522, when the first mounting post 524 and the second mounting post 526 are respectively extended into the first mounting groove 632 and the second mounting groove 642, the two springs 650 are respectively compressed, generating elastic pre-tightening forces for the first brush 630 and the second brush 640 toward the first fixed electrode 610 and the second fixed electrode 620, respectively, to ensure that the first brush 630 and the second brush 640 maintain good connectivity with the first fixed electrode 610 and the second fixed electrode 620, respectively, and to make the buckle 524b and the snap-on hole 632a fit more firmly.

[0068] See Figure 2 、 Figure 3 and Figure 6 The bottom wall of the heat exchange chamber 110 is also formed with a first fixing ring 130 and a second fixing ring 140 surrounding the outside of the first fixing ring 130. The first fixed electrode 610 is fixedly arranged in the first fixing ring 130, and the second fixed electrode 620 is fixedly arranged between the first fixing ring 130 and the second fixing ring 140. The second fixed electrode 620 can be fixed to the second fixing ring 140 by fasteners.

[0069] Since the first fixed electrode 610 is fixedly arranged in the first fixed ring 130, and the second fixed electrode 620 is fixedly arranged between the first fixed ring 130 and the second fixed ring 140, that is, the first fixed ring 130 is arranged between the first fixed electrode 610 and the second fixed electrode 620, the first fixed ring 130 can be made of an insulating material (or the base 100 as a whole can be made of an insulating material), which can prevent the first fixed electrode 610 and the second fixed electrode 620 from short-circuiting and causing a malfunction.

[0070] See Figure 2 Furthermore, a wiring groove 150 is provided on the bottom wall of the heat exchange chamber 110. The wires connected to the positive and negative poles of the external power supply can be passed through the wiring groove 150 and connected to the first fixed electrode 610 and the second fixed electrode 620 respectively, so that the first fixed electrode 610 and the second fixed electrode 620 are connected to the external power supply through the wires.

[0071] The refrigeration device 1 of the present invention defines a heat exchange chamber 110 within the base 100, and a through hole 120 is provided on the top of the base 100. The semiconductor refrigeration plate 200 is exposed at the through hole 120. The bottom of the inner cylinder 300 is detachably inserted into the through hole 120, and at least part of its bottom surface is in contact with the cooling surface of the semiconductor refrigeration plate 200. The heat exchanger 500 is arranged in the heat exchange chamber 110. Therefore, when in use, the user can place and fix the target container 10 containing the liquid to be cooled in the cooling chamber 310 of the inner cylinder 300 as needed, and then power the semiconductor refrigeration plate 200. In this way, the cold energy generated by the semiconductor refrigeration plate 200 can be transferred to the inner cylinder 300, and then transferred to the target container 10 by heat conduction, and finally transferred to the liquid to be cooled by heat convection and heat conduction, so that the liquid is quickly cooled to meet user needs. In addition, since the refrigeration device 1 has a simple overall structure, is easy to carry, and occupies a small space, it can specifically cool the liquid in the target container 10, solving the user's refrigeration needs when there is no large refrigeration equipment such as a refrigerator or freezer.

[0072] Furthermore, in the refrigeration device 1 of the present invention, since the rotating shaft 520 can rotate around its axis, a plurality of heat sinks 530 arranged at intervals are extended radially from the circumference of the rotating shaft 520, the upper turntable 510 is formed at the top of the rotating shaft 520, and the semiconductor refrigeration plate 200 is fixed to the center of the upper turntable 510. Therefore, the heat generated by the heating surface can be transferred from the upper turntable 510 to the rotating shaft 520, and then transferred from the rotating shaft 520 to the plurality of heat sinks 530. The plurality of heat sinks 530 extend outward from the rotating shaft 520, thereby increasing the heat exchange area and improving the heat exchange efficiency. Moreover, the plurality of heat sinks 530 can rotate with the rotating shaft 520, thereby improving the convective heat transfer coefficient between the plurality of heat sinks 530 and the air, further optimizing the heat exchange, so that the heat generated by the heating surface can be absorbed in time, and the reliability of the semiconductor refrigeration plate 200 is ensured.

[0073] At this point, those skilled in the art will recognize that, although a number of exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications consistent with the principles of the present invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A refrigeration device for cooling a liquid contained in a target container, comprising: A base defines a heat exchange cavity therein and has a through hole formed on the top; a semiconductor refrigeration chip exposed at the through hole, wherein the semiconductor refrigeration chip has a cooling surface facing upward and a heating surface facing away from the cooling surface; an inner cylinder disposed above the base, defining a cooling cavity for securing the target container therein, wherein the bottom of the inner cylinder is detachably inserted into the through hole, with at least a portion of its bottom surface in contact with the refrigeration surface, so that the cooling energy generated by the semiconductor refrigeration sheet is transferred to the inner cylinder; and a heat exchanger, disposed in the heat exchange cavity, for absorbing heat generated by the heating surface; The heat exchanger comprises: A rotating shaft is arranged along the height direction of the base, with its axis coinciding with the central axis of the through hole, and is configured to rotate about its axis, and a plurality of spaced heat sinks are radially extended from the circumference of the rotating shaft; the rotating shaft has a downwardly open installation space; An upper turntable is formed at the top end of the rotating shaft, and the semiconductor refrigeration fin is fixed to the center of the upper turntable, so that the heat generated by the heating surface is transferred to the rotating shaft through the upper turntable and further transferred to the plurality of heat sinks; The refrigeration device further comprises: a first fixed electrode extending into the installation space; a second fixed electrode extending into the installation space, the second fixed electrode surrounding the first fixed electrode, the first fixed electrode, the second fixed electrode and the rotating shaft being coaxially arranged, and the first fixed electrode and the second fixed electrode being connected to an external power source; a first brush, one side of which is fixedly connected to the inner wall of the installation space, and the other side of which is rotatably connected to the first fixed electrode; and The second brush has one side fixedly connected to the inner wall of the installation space and the other side rotatably connected to the second fixed electrode, and the first brush and the second brush respectively pass through the installation space through wires to power the semiconductor refrigeration plate.

2. The refrigeration device according to claim 1, further comprising: The outer cylinder is sleeved on the outside of the inner cylinder, and a plurality of vacuum heat exchange chambers extending in the axial direction are formed between the outer cylinder and the inner cylinder. The vacuum heat exchange chambers are filled with heat exchange medium so that the heat exchange medium can be used to transfer cold energy along the extension direction of the vacuum heat exchange chambers.

3. The refrigeration device according to claim 2, wherein A connecting hole is provided on the bottom surface of the outer cylinder to expose at least part of the bottom surface of the inner cylinder. When the bottom of the inner cylinder extends into the through hole, the semiconductor refrigeration plate is passed through the connecting hole so that the refrigeration surface contacts at least part of the bottom surface of the inner cylinder.

4. The refrigeration device according to claim 3, wherein The contour of the connecting hole matches the shape of the semiconductor refrigeration chip, so that when the semiconductor refrigeration chip is inserted into the connecting hole, the outer cylinder and the inner cylinder rotate together with the semiconductor refrigeration chip.

5. The refrigeration device according to claim 4, wherein The outlines of the connecting hole and the semiconductor refrigeration plate are both square.

6. The refrigeration device according to claim 1, wherein the heat exchanger further comprises: a lower turntable formed at the bottom end of the rotating shaft; and The driving mechanism is used to drive the rotating shaft to rotate. The driving mechanism includes a motor, a gear and a rack that mesh with each other. The motor is installed on the base, the gear is installed on the motor, and the rack is formed on the periphery of the lower turntable.

7. The refrigeration device according to claim 6, wherein the driving mechanism further comprises: The motor cover is buckled on the top of the motor to protect the motor, and the motor is fixed to the base through fasteners.

8. The refrigeration device according to claim 1, wherein The side wall of the base is provided with a mounting opening; and the refrigeration device further comprises: A heat exchange fan is provided at the installation port, with its air intake facing the peripheral surface of the rotating shaft, and is configured to promote the formation of a heat exchange airflow that exchanges heat with the plurality of heat sinks and is discharged from the installation port.

9. The refrigeration device according to claim 8, wherein The heat exchange fan is an axial flow fan.

Images