A waterproof USB Type-C connector

Abstract

The application discloses a waterproof USB Type-C connector, which comprises a shielding shell, a main plate part is inserted into the shielding shell, and a waterproof assembly is arranged on the inner side of the outer wall of the main plate part; a waterproof ring is sleeved in an annular groove, the connector is placed into a mold for high-temperature vulcanization, and then the vulcanized waterproof ring is solidified through the same mold, thereby completing the connection between the main plate part and the shielding shell; the main plate part, the annular groove, the waterproof ring, the annular groove, the upper row of terminal groups and the lower row of terminal groups are integrally formed and connected, water is effectively prevented from entering the rear end of the connector along the upper row of terminal groups and the lower row of terminal groups, compared with a traditional dispensing processing mode, the processing station is effectively reduced through the waterproof assembly, production cost is saved, the shielding shell does not need to be provided with a relief hole, thereby improving production efficiency, the metal shell and the shielding shell can be quickly and effectively connected through a positioning mechanism, the assembling speed is high, and the welding point failure can be eliminated.

Description

Technical Field

[0001] This invention relates to the field of USB connectors, and more specifically to a waterproof USB Type-C connector. Background Technology

[0002] With the rapid development of the electronics industry, electronic products are becoming increasingly thinner and smaller, which places higher demands on the structure and performance of electronic product components. Among them, the electrical connector industry is at the forefront. In order to improve the stability of electrical connectors, connectors with waterproof structures have been developed in the electrical connector industry to prevent moisture, dust and other contaminants from entering the internal parts of the electrical connector.

[0003] However, in existing technologies, most methods involve setting a dispensing groove at the rear end of the insulating body, then dispensing and curing the adhesive in the groove to form a waterproof sealant. This method requires two processing stations to produce the waterproof sealant, making the process somewhat complex and time-consuming. Furthermore, the shielding shell needs to have clearance holes to avoid the dispensing groove, adding an extra step and reducing production efficiency. Additionally, the metal shell is often welded to the shielding shell, making assembly cumbersome, and prolonged use can lead to solder joint failure. Moreover, the waterproof rings commonly used in connectors currently have poor wear and aging resistance, easily wearing down or aging during use, resulting in insufficient waterproofing and affecting the connector's waterproofing and other performance characteristics. Summary of the Invention

[0004] In view of the problems existing in the prior art, the purpose of this invention is to provide a waterproof USB Type-C connector.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A waterproof USB Type-C connector includes a shielding shell, a motherboard portion inserted inside the shielding shell, a waterproof component disposed on the inner side of the outer wall of the motherboard portion, an upper row of terminal blocks disposed at the upper end of the motherboard portion, a lower row of terminal blocks disposed at the lower end of the motherboard portion, one end of the lower row of terminal blocks penetrating through the shielding shell, a positioning mechanism disposed on the outer wall of the shielding shell, a metal shell being fitted and connected to the outside of the shielding shell through the positioning mechanism, and a locking component disposed on the outer side of the outer wall of the shielding shell, the locking component being movably connected to the metal shell.

[0007] Preferably, the waterproof component includes a waterproof ring and an annular groove. The waterproof ring is disposed on the inner side of the outer wall of the main board, and the annular groove is formed on the inner side of the inner wall of the shielding shell. The waterproof ring is inserted into the inside of the annular groove.

[0008] Preferably, the waterproof ring is made of rubber.

[0009] Preferably, the positioning mechanism includes a positioning groove, a through groove, a metal pin, and a sealing component. The positioning groove is formed on the outer wall of the shielding shell, the through groove is formed on the outer wall of the metal shell, the through groove is connected to the positioning groove, the metal pin is inserted into the inside of the through groove, one end of the metal pin extends into the inside of the positioning groove through the through groove, and the sealing component is disposed on the outer side of the inner wall of the through groove, and the sealing component is fitted and connected to the metal pin.

[0010] Preferably, a magnetic block is provided inside the positioning groove, and the magnetic block is magnetically connected to a metal pin.

[0011] Preferably, the sealing assembly includes a slot and a sealing plug, the slot being formed on the outer side of the inner wall of the through groove, the sealing plug being inserted into the inside of the slot, and the inner wall of the sealing plug being fitted and connected to a metal pin.

[0012] Preferably, the locking assembly includes a locking block and a locking slot. The locking block is disposed on the outer side of the outer wall of the shielding shell, and the locking slot is opened at one end of the metal shell. The locking block is inserted into the inside of the locking slot.

[0013] Preferably, the side wall of the metal shell is provided with an opening, and a first pin is provided at the upper end of the opening.

[0014] Preferably, the other end of the metal shell is provided with an extension plate, and the side wall of the extension plate is provided with a second pin.

[0015] Preferably, the waterproof ring comprises, by weight, the following components:

[0016] The ingredients are: 50-80 parts butyl rubber, 25-35 parts silica, 6-15 parts modified cerium nitride@zirconium selenide powder, 1.1-1.5 parts stearic acid, 0.8-1.6 parts sulfur, and 0.3-0.7 parts TMTD vulcanization accelerator.

[0017] Preferably, the butyl rubber is of type IIR1751 (Yanshan Petrochemical).

[0018] Preferably, the preparation method of the modified cerium nitride@zirconium selenide is as follows:

[0019] Step 1: Weigh cerium nitrate and deionized water, mix and stir until completely dissolved, add zirconium selenide nanoparticles, mix evenly, and then add 10% oxalic acid solution dropwise while stirring until the pH of the reaction solution is 2.0. Stop adding oxalic acid solution dropwise and continue stirring at 20-30℃ for 1-3 hours. Pour the reaction solution onto the filter paper of a vacuum filtration device, filter to remove the liquid, wash with water until neutral, and dry at 80-100℃ to obtain the composite precursor.

[0020] Step 2: After grinding the composite precursor into powder, spread it evenly in a crucible, place the crucible in a high-temperature reactor, introduce ammonia gas to replace the air, control the high-temperature reactor to first raise the temperature to 450-500℃ at a rate of 2-4℃ / min, hold for 1-3h, then raise the temperature to 1100-1200℃ at a rate of 4-6℃ / min, hold for 2-4h, and after natural cooling, obtain cerium nitride@zirconium selenide powder;

[0021] Step 3: Cerium nitride@zirconium selenide powder is mixed with vinyltriethoxysilane in deionized water. After sonication at room temperature for 1-3 hours, it is stirred in a water bath at 40-50°C for 4-6 hours. Then, the water bath is removed, and the mixture is allowed to stand for 6-10 hours. The solid product is then collected by filtration to obtain vinyl cerium nitride@zirconium selenide powder.

[0022] Step 4: Mix the vinyl cerium nitride@zirconium selenide powder into deionized water, add sulfonated succinate and ammonium persulfate, and stir in a water bath at 70-80°C. After the system temperature rises to 70°C, add an acrylic acid solution containing ammonium persulfate dropwise. After all the solution has been added, raise the water bath temperature to 80-90°C and continue stirring for 1-2 hours. Then cool down to room temperature and pour the reaction solution into ammonia water. After discharge, wash with deionized water at least three times, dry, and grind into powder to obtain modified cerium nitride@zirconium selenide powder.

[0023] Preferably, in step 1, the mass ratio of cerium nitrate, zirconium selenide nanopowder to deionized water is 1:2.2-2.8:10-15.

[0024] Preferably, in step 3, the mass ratio of cerium nitride@zirconium selenide powder, vinyltriethoxysilane, and deionized water is 1:0.05-0.1:10-20.

[0025] Preferably, in step 4, the mass ratio of vinyl cerium nitride@zirconium selenide powder, sulfonated succinate, ammonium persulfate and deionized water is 1:0.03-0.08:0.01-0.03:6-10.

[0026] Preferably, in step 4, the mass ratio of the acrylic acid solution containing the second ammonium persulfate to deionized water is 1:4-6; the acrylic acid containing the second ammonium persulfate is prepared by mixing the second ammonium persulfate and acrylic acid in a mass ratio of 0.01-0.03:10.

[0027] Preferably, the preparation process of the waterproof ring is as follows:

[0028] Butyl rubber, silica, modified cerium nitride@zirconium selenide powder and stearic acid are mixed in a mixer, heated to 55-75℃ and mixed for 5-10 minutes. The resulting mixture is then mixed with sulfur and vulcanization accelerator TMTD and mixed at 35-55℃ for 2-5 minutes. The mixture is then injection molded to obtain a waterproof ring.

[0029] Preferably, after the waterproof ring is prepared, it is fitted into the annular groove, and then the connector is placed in a mold for high-temperature vulcanization. During the vulcanization process, the butyl rubber will adhere to the annular groove.

[0030] Preferably, the vulcanization temperature of the waterproof ring is 155-165℃, the vulcanization pressure is 10-15MPa, and the vulcanization time is 5-10min.

[0031] The beneficial effects of this invention are as follows:

[0032] (1) This solution can provide waterproofing at the connection between the main board and the shielding shell through a waterproof component. By fitting a waterproof ring in the annular groove, placing the connector in the mold for high-temperature vulcanization, and then curing the vulcanized waterproof ring through the same mold, the connection between the main board and the shielding shell is completed. The main board is integrally formed with the annular groove, the waterproof ring, the annular groove, the upper terminal group, and the lower terminal group, which effectively prevents water from extending into the rear end of the connector along the upper and lower terminal groups. Compared with the traditional waterproof adhesive processing method, the waterproof component can effectively reduce the number of processing stations, and the shielding shell does not need to be opened with clearance holes, thereby improving production efficiency. The positioning mechanism can quickly and effectively connect the metal shell and the shielding shell, which not only makes the assembly faster but also makes the assembly position more stable, avoiding the situation of solder joint failure.

[0033] (2) When assembling the metal shell and the shielding shell, the metal shell is fitted onto the outside of the shielding shell, so that the inner wall of the metal shell abuts against the outer wall of the shielding shell. The movement of the metal shell is restricted by the locking component, so that the through slot can be moved to the position of the positioning slot. Then, the metal pin is inserted into the through slot, so that the magnetic block inside the positioning slot can pull the metal pin into the inside of the positioning slot. Then, the through slot is sealed by the sealing component to prevent the metal pin from falling off. The positioning mechanism can fix the metal shell to the outside of the shielding shell, which not only makes the position of the metal shell more stable, but also avoids the problem of solder joint failure caused by long-term pull-out use.

[0034] (3) This invention prepares a waterproof ring to address the shortcomings of commercially available waterproof rings in terms of wear resistance and aging resistance. Butyl rubber is used as the main material; however, butyl rubber has a slow vulcanization rate, poor processability, poor adhesion, and poor compatibility with other materials, resulting in insufficient mechanical properties and tear strength. Compared to conventional rubber materials, this invention reduces the amount of silica added and instead adds a small amount of modified cerium nitride@zirconium selenide powder. This not only improves its compatibility, thereby significantly enhancing its mechanical properties, but also subsequently showed improvements in vulcanization rate and aging resistance.

[0035] (4) In this invention, the modified cerium nitride@zirconia selenide powder is obtained by using zirconium selenide nanoparticles with a particle size of 200-300 nm to participate in the synthesis process of cerium nitride. The specific process is as follows: ① Cerium salt is dissolved in water, zirconium selenide nanoparticles are added and mixed, and then oxalic acid solution is added dropwise to precipitate cerium oxalate gel particles bound with zirconium selenide nanoparticles, i.e., composite precursor; ② The composite precursor is then sintered at high temperature under ammonia conditions, and cerium oxalate gradually decomposes and generates cerium nitride. During this process, zirconium selenide is bound in it, and finally cerium nitride@zirconia selenide powder is obtained; ③ The surface of cerium nitride@zirconia selenide powder is then vinylized with a coupling agent and participates in the polymerization process of acrylic acid to obtain a copolymer with acrylic acid - modified cerium nitride@zirconia selenide powder. Attached Figure Description

[0036] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of the USB Type-C connector according to Embodiment 1 of the present invention;

[0038] Figure 2 This is a cross-sectional view of Embodiment 1 of the present invention;

[0039] Figure 3 This is a schematic diagram of the waterproof component structure according to Embodiment 1 of the present invention;

[0040] Figure 4 For the present invention Figure 2 Enlarged view of part A;

[0041] Figure 5 For the present invention Figure 2 Enlarged view of part B.

[0042] Figure label:

[0043] 1. Shielding shell; 2. Main board section; 21. Upper terminal block; 22. Lower terminal block; 3. Waterproof component; 31. Waterproof ring; 32. Annular groove; 4. Metal shell; 5. Positioning mechanism; 51. Positioning groove; 52. Through groove; 53. Metal pin; 54. Magnetic block; 55. Sealing component; 551. Slot; 552. Sealing plug; 6. Locking component; 61. Locking block; 62. Locking slot; 7. Opening; 71. First pin; 8. Extension plate; 81. Second pin. Detailed Implementation

[0044] To more clearly illustrate the present invention and to gain a clearer understanding of its technical features, objectives, and beneficial effects, the technical solution of the present invention will now be described in detail below, but this should not be construed as limiting the scope of the present invention.

[0045] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0046] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0047] Unless otherwise specified, the raw materials, reagents or devices used in the following examples are available from conventional commercial sources or can be obtained by existing known methods.

[0048] The present invention will be further described in conjunction with the following embodiments.

[0049] Example 1

[0050] A waterproof USB Type-C connector, such as Figure 1-5As shown, the system includes a shielding shell 1, a main board 2 inserted inside the shielding shell 1, a waterproof component 3 disposed on the inner side of the outer wall of the main board 2, an upper terminal group 21 disposed at the upper end of the main board 2, a lower terminal group 22 disposed at the lower end of the main board 2, one end of the lower terminal group 22 penetrating the shielding shell 1, a positioning mechanism 5 disposed on the outer wall of the shielding shell 1, a metal shell 4 attached to the outside of the shielding shell 1 through the positioning mechanism 5, and a locking component 6 disposed on the outer side of the outer wall of the shielding shell 1, the locking component 6 being movably connected to the metal shell 4; the waterproof component 3 is used to... The waterproof component 3 can provide waterproofing at the connection between the main board 2 and the shielding shell 1, effectively preventing water from extending into the rear end of the connector along the upper terminal group 21 and the lower terminal group 22. Compared with the traditional waterproof adhesive dispensing method, the waterproof component 3 can effectively reduce the number of processing stations, save production costs, and eliminate the need for clearance holes in the shielding shell 1, thereby improving production efficiency. The positioning mechanism 5 can quickly and effectively connect the metal shell 4 and the shielding shell 1, making assembly faster and more stable, and preventing solder joint failure.

[0051] like Figure 3 As shown, the waterproof component 3 includes a waterproof ring 31 and an annular groove 32. The waterproof ring 31 is disposed on the inner side of the outer wall of the main board 2, and the annular groove 32 is formed on the inner side of the inner wall of the shielding shell 1. The waterproof ring 31 is inserted into the inside of the annular groove 32. The waterproof ring 31 is made of rubber. By using the waterproof ring 31 made of rubber, the main board 2 and the annular groove 32 can be connected by high-temperature vulcanization, so that the waterproof ring 31 can play a waterproof role. Thus, the waterproof component 3 can effectively prevent water from extending into the rear end of the connector along the upper terminal group 21 and the lower terminal group 22.

[0052] like Figure 4As shown, the positioning mechanism 5 includes a positioning groove 51, a through groove 52, a metal pin 53, and a sealing component 55. The positioning groove 51 is formed on the outer wall of the shielding shell 1, and the through groove 52 is formed on the outer wall of the metal shell 4, communicating with the positioning groove 51. The metal pin 53 is inserted into the inside of the through groove 52, with one end of the metal pin 53 extending into the inside of the positioning groove 51 through the through groove 52. The sealing component 55 is disposed on the outer side of the inner wall of the through groove 52, and is fitted and connected to the metal pin 53. A magnetic block 54 is disposed inside the positioning groove 51, and the magnetic block 54 is magnetically connected to the metal pin 53. During the assembly of the metal shell 4 and the shielding shell 1, the metal shell is... The metal shell 4 is fitted onto the outside of the shielding shell 1, so that the inner wall of the metal shell 4 abuts against the outer wall of the shielding shell 1. The movement of the metal shell 4 is restricted by the locking component 6, so that the through groove 52 can be moved to the position of the positioning groove 51. Then, the metal pin 53 is inserted into the through groove 52, so that the magnetic block 54 inside the positioning groove 51 can pull the metal pin 53 into the interior of the positioning groove 51. Then, the through groove 52 is sealed by the sealing component 55 to prevent the metal pin 53 from falling off. The positioning mechanism 5 can fix the metal shell 4 to the outside of the shielding shell 1. This not only makes the position of the metal shell 4 more stable, but also avoids the problem of solder joint failure caused by long-term pull-out use.

[0053] like Figure 4 As shown, the sealing component 55 includes a slot 551 and a sealing plug 552. The slot 551 is opened on the outer side of the inner wall of the through groove 52, and the sealing plug 552 is inserted into the inside of the slot 551. The inner wall of the sealing plug 552 is fitted and connected to the metal pin 53. By inserting the sealing plug 552 into the inside of the slot 551 and making the inner wall of the sealing plug 552 fit and connected to the metal pin 53, the sealing component 55 can secure the position of the metal pin 53 while sealing the through groove 52.

[0054] like Figure 5 As shown, the positioning component 6 includes a locking block 61 and a locking groove 62. The locking block 61 is disposed on the outer side of the outer wall of the shielding shell 1, and the locking groove 62 is opened at one end of the metal shell 4. The locking block 61 is inserted into the inside of the locking groove 62. By inserting the locking block 61 into the inside of the locking groove 62, the positioning component 6 can restrict the position of the metal shell 4 and prevent the metal shell 4 from moving too much, which would cause the through groove 52 and the positioning groove 51 to misalign.

[0055] like Figure 1 As shown, the metal shell 4 has an opening 7 on its side wall, and a first pin 71 is provided at the upper end of the opening 7; the other end of the metal shell 4 has an extension plate 8, and a second pin 81 is provided on the side wall of the extension plate 8; the first pin 71 provided inside the opening 7 and the second pin 81 on the side wall of the extension plate 8 can facilitate the connection of the metal shell 4 with external equipment, so that the metal shell 4 can play the role of fixing the position of the shielding shell 1.

[0056] The waterproof component 3 in this embodiment serves a waterproof function. A waterproof ring 31 is fitted into the annular groove 32, and the connector is placed in a mold for high-temperature vulcanization. The vulcanized waterproof ring 31 is then cured using the same mold, thus completing the connection between the main board 2 and the shielding shell 1. The main board 2 is integrally formed with the annular groove 32, the waterproof ring 31, the annular groove 32, the upper terminal group 21, and the lower terminal group 22, effectively preventing water from entering the rear end of the connector along the upper and lower terminal groups 21 and 22. Compared to traditional adhesive application methods, the waterproof component 3 effectively reduces processing steps, saving production costs. Furthermore, the shielding shell 1 does not require clearance holes, thus improving production efficiency. When assembling the metal shell 4 and the shielding shell 1, the metal shell 4 is fitted onto the outside of the shielding shell 1, so that the inner wall of the metal shell 4 abuts against the outer wall of the shielding shell 1. This allows the through groove 52 to move to the position of the positioning groove 51 and into the slot 62. After moving to the position of the locking block 61, the locking component 6 restricts the movement of the metal shell 4, preventing the metal shell 4 from moving too much and causing the positions of the positioning groove 51 and the through groove 52 to shift. Then, the metal pin 53 is inserted into the inside of the through groove 52, so that the magnetic block 54 inside the positioning groove 51 can pull the metal pin 53 into the inside of the positioning groove 51, so that the metal pin 53 can play a positioning role for the metal shell 4. Then, the sealing plug 552 is inserted into the inside of the slot 551, so that the sealing component 55 can close the through groove 52 and prevent the metal pin 53 from falling off. Then, the positioning mechanism 5 can fix the metal shell 4 to the outside of the shielding shell 1, which not only makes the position of the metal shell 4 more stable, but also eliminates the problem of solder joint failure caused by long-term pull-out use. Then, the first pin 71 inside the opening 7 and the second pin 81 on the side wall of the extension plate 8 can be used to easily connect the metal shell 4 to the external equipment, so that the metal shell 4 can play a role in fixing the position of the shielding shell 1.

[0057] Example 2

[0058] The composition of the waterproof ring 31 material described in Example 1, calculated by weight, includes:

[0059] The composition includes 68 parts butyl rubber, 32 parts silica, 11 parts modified cerium nitride@zirconium selenide powder, 1.2 parts stearic acid, 1.3 parts sulfur, and 0.5 parts TMTD vulcanization accelerator.

[0060] The butyl rubber is model IIR1751 (Yanshan Petrochemical).

[0061] The preparation method of the modified cerium nitride@zirconium selenide is as follows:

[0062] Step 1: Weigh cerium nitrate and mix with deionized water. Stir until completely dissolved, then add zirconium selenide nanoparticles and mix evenly. While stirring, add 10% oxalic acid solution dropwise until the pH of the reaction solution reaches 2.0. Stop adding oxalic acid solution and continue stirring at 25°C for 2 hours. Pour the reaction solution onto filter paper of a vacuum filtration device, filter to remove the liquid, wash with water until neutral, and dry at 90°C to obtain the composite precursor. The mass ratio of cerium nitrate, zirconium selenide nanoparticles, and deionized water is 1:2.5:12.

[0063] Step 2: After grinding the composite precursor into powder, spread it evenly in a crucible, place the crucible in a high-temperature reactor, introduce ammonia gas to replace the air, control the high-temperature reactor to first heat up to 500℃ at a rate of 3℃ / min, hold for 2h, then heat up to 1200℃ at a rate of 5℃ / min, hold for 3h, and after natural cooling, obtain cerium nitride@zirconium selenide powder.

[0064] Step 3: Cerium nitride@zirconium selenide powder and vinyltriethoxysilane are mixed in deionized water, sonicated at room temperature for 2 hours, and then stirred in a water bath at 45°C for 5 hours. After removing the water bath and letting it stand for 8 hours, the solid product is collected by filtration to obtain vinyl cerium nitride@zirconium selenide powder. The mass ratio of cerium nitride@zirconium selenide powder, vinyltriethoxysilane and deionized water is 1:0.08:15.

[0065] Step 4: Mix vinyl cerium nitride@zirconium selenide powder into deionized water, add sulfonated succinate and ammonium persulfate, and stir in a water bath at 75°C. After the system temperature rises to 70°C, add an acrylic acid solution containing ammonium persulfate dropwise. After all the solution has been added, raise the water bath temperature to 85°C and continue stirring for 1.5 hours. Then cool to room temperature and pour the reaction solution into ammonia water. After discharge, wash with deionized water at least three times, dry, and grind into powder to obtain modified cerium nitride@zirconium selenide powder. The mass ratio of vinyl cerium nitride@zirconium selenide powder, sulfonated succinate, ammonium persulfate, and deionized water is 1:0.05:0.02:8; the mass ratio of acrylic acid solution containing ammonium persulfate to deionized water is 1:5; the acrylic acid solution containing ammonium persulfate is a mixture of ammonium persulfate and acrylic acid at a mass ratio of 0.02:10.

[0066] The preparation process of the aforementioned waterproof ring 31 is as follows:

[0067] Butyl rubber, silica, modified cerium nitride@zirconium selenide powder and stearic acid were mixed in a mixer, heated to 65°C and mixed for 8 minutes. The resulting mixture was then mixed with sulfur and vulcanization accelerator TMTD and mixed at 45°C for 3 minutes. The mixture was then injection molded to obtain waterproof ring 31.

[0068] After the waterproof ring 31 is prepared, it is fitted into the annular groove 32, and then the connector is placed in the mold for high-temperature vulcanization. During the vulcanization process, the butyl rubber will adhere to the annular groove 32.

[0069] The waterproof ring 31 has a vulcanization temperature of 160℃, a vulcanization pressure of 12MPa, and a vulcanization time of 8min.

[0070] Example 3

[0071] The composition of the waterproof ring 31 material described in Example 1, calculated by weight, includes:

[0072] The ingredients are: 50 parts butyl rubber, 25 parts silica, 6 parts modified cerium nitride@zirconium selenide powder, 1.1 parts stearic acid, 0.8 parts sulfur, and 0.3 parts TMTD vulcanization accelerator.

[0073] The butyl rubber is model IIR1751 (Yanshan Petrochemical).

[0074] The preparation method of the modified cerium nitride@zirconium selenide is as follows:

[0075] Step 1: Weigh cerium nitrate and mix with deionized water. Stir until completely dissolved, then add zirconium selenide nanoparticles and mix evenly. While stirring, add 10% oxalic acid solution dropwise until the pH of the reaction solution reaches 2.0. Stop adding oxalic acid solution and continue stirring at 20°C for 1 hour. Pour the reaction solution onto filter paper of a vacuum filtration device, filter to remove the liquid, wash with water until neutral, and dry at 80°C to obtain the composite precursor. The mass ratio of cerium nitrate, zirconium selenide nanoparticles, and deionized water is 1:2.2:10.

[0076] Step 2: After grinding the composite precursor into powder, spread it evenly in a crucible, place the crucible in a high-temperature reactor, introduce ammonia gas to replace the air, control the high-temperature reactor to first heat up to 450℃ at a rate of 2℃ / min, hold for 1h, then heat up to 1100℃ at a rate of 4℃ / min, hold for 2h, and after natural cooling, obtain cerium nitride@zirconium selenide powder.

[0077] Step 3: Cerium nitride@zirconium selenide powder and vinyltriethoxysilane are mixed in deionized water, sonicated at room temperature for 1 hour, and then stirred in a water bath at 40°C for 4 hours. After removing the water bath and letting it stand for 6 hours, the solid product is collected by filtration to obtain vinyl cerium nitride@zirconium selenide powder. The mass ratio of cerium nitride@zirconium selenide powder, vinyltriethoxysilane and deionized water is 1:0.05:10.

[0078] Step 4: Mix vinyl cerium nitride@zirconium selenide powder into deionized water, add sulfonated succinate and ammonium persulfate, and stir in a water bath at 70°C. After the system temperature reaches 70°C, add an acrylic acid solution containing ammonium persulfate dropwise. After all the solution has been added, raise the water bath temperature to 80°C and continue stirring for 1 hour. Then cool to room temperature and pour the reaction solution into ammonia water. After discharge, wash with deionized water at least three times, dry, and grind into powder to obtain modified cerium nitride@zirconium selenide powder. The mass ratio of vinyl cerium nitride@zirconium selenide powder, sulfonated succinate, ammonium persulfate, and deionized water is 1:0.03:0.01:6; the mass ratio of acrylic acid solution containing ammonium persulfate to deionized water is 1:4; the acrylic acid solution containing ammonium persulfate is a mixture of ammonium persulfate and acrylic acid at a mass ratio of 0.01:10.

[0079] The preparation process of the aforementioned waterproof ring 31 is as follows:

[0080] Butyl rubber, silica, modified cerium nitride@zirconium selenide powder and stearic acid are mixed in a mixer, heated to 55°C and mixed for 5 minutes. The resulting mixture is then mixed with sulfur and vulcanization accelerator TMTD and mixed at 35°C for 2 minutes. The mixture is then injection molded to obtain waterproof ring 31.

[0081] After the waterproof ring 31 is prepared, it is fitted into the annular groove 32, and then the connector is placed in the mold for high-temperature vulcanization. During the vulcanization process, the butyl rubber will adhere to the annular groove 32.

[0082] The waterproof ring 31 has a vulcanization temperature of 155℃, a vulcanization pressure of 10MPa, and a vulcanization time of 5min.

[0083] Example 4

[0084] The composition of the waterproof ring 31 material described in Example 1, calculated by weight, includes:

[0085] The composition includes 80 parts butyl rubber, 35 parts silica, 15 parts modified cerium nitride@zirconium selenide powder, 1.5 parts stearic acid, 1.6 parts sulfur, and 0.7 parts TMTD vulcanization accelerator.

[0086] The butyl rubber is model IIR1751 (Yanshan Petrochemical).

[0087] The preparation method of the modified cerium nitride@zirconium selenide is as follows:

[0088] Step 1: Weigh cerium nitrate and mix with deionized water. Stir until completely dissolved, then add zirconium selenide nanoparticles and mix evenly. While stirring, add 10% oxalic acid solution dropwise until the pH of the reaction solution reaches 2.0. Stop adding oxalic acid solution and continue stirring at 30°C for 3 hours. Pour the reaction solution onto filter paper of a vacuum filtration device, filter to remove the liquid, wash with water until neutral, and dry at 100°C to obtain the composite precursor. The mass ratio of cerium nitrate, zirconium selenide nanoparticles, and deionized water is 1:2.8:15.

[0089] Step 2: After grinding the composite precursor into powder, spread it evenly in a crucible, place the crucible in a high-temperature reactor, introduce ammonia gas to replace the air, control the high-temperature reactor to first heat up to 500℃ at a rate of 4℃ / min, hold for 3h, then heat up to 1200℃ at a rate of 6℃ / min, hold for 4h, and after natural cooling, obtain cerium nitride@zirconium selenide powder.

[0090] Step 3: Cerium nitride@zirconium selenide powder and vinyltriethoxysilane are mixed in deionized water, sonicated at room temperature for 3 hours, and then stirred in a water bath at 50°C for 6 hours. After removing the water bath and letting it stand for 10 hours, the solid product is collected by filtration to obtain vinyl cerium nitride@zirconium selenide powder. The mass ratio of cerium nitride@zirconium selenide powder, vinyltriethoxysilane and deionized water is 1:0.1:20.

[0091] Step 4: Mix vinyl cerium nitride@zirconium selenide powder into deionized water, add sulfonated succinate and ammonium persulfate, and stir in a water bath at 80°C. After the system temperature rises to 70°C, add an acrylic acid solution containing ammonium persulfate dropwise. After all the solution has been added, raise the water bath temperature to 90°C and continue stirring for 2 hours. Then cool to room temperature and pour the reaction solution into ammonia water. After discharge, wash with deionized water at least three times, dry, and grind into powder to obtain modified cerium nitride@zirconium selenide powder. The mass ratio of vinyl cerium nitride@zirconium selenide powder, sulfonated succinate, ammonium persulfate, and deionized water is 1:0.08:0.03:10; the mass ratio of acrylic acid solution containing ammonium persulfate to deionized water is 1:6; the acrylic acid solution containing ammonium persulfate is a mixture of ammonium persulfate and acrylic acid at a mass ratio of 0.03:10.

[0092] The preparation process of the aforementioned waterproof ring 31 is as follows:

[0093] Butyl rubber, silica, modified cerium nitride@zirconium selenide powder and stearic acid are mixed in a mixer, heated to 75°C and mixed for 10 minutes. The resulting mixture is then mixed with sulfur and vulcanization accelerator TMTD and mixed at 55°C for 5 minutes. The mixture is then injection molded to obtain waterproof ring 31.

[0094] After the waterproof ring 31 is prepared, it is fitted into the annular groove 32, and then the connector is placed in the mold for high-temperature vulcanization. During the vulcanization process, the butyl rubber will adhere to the annular groove 32.

[0095] The vulcanization temperature of the waterproof ring 31 is 165℃, the vulcanization pressure is 15MPa, and the vulcanization time is 10min.

[0096] Comparative Example 1

[0097] A waterproof ring material, which differs from Example 2 in that the modified cerium nitride@zirconium selenide powder is replaced with cerium nitride.

[0098] Calculated by weight, including:

[0099] The composition includes 68 parts butyl rubber, 32 parts silica, 11 parts cerium nitride powder, 1.2 parts stearic acid, 1.3 parts sulfur, and 0.5 parts TMTD vulcanization accelerator.

[0100] Comparative Example 2

[0101] A waterproof ring material, differing from Example 2 in that the modified cerium nitride@zirconium selenide powder is replaced with zirconium selenide.

[0102] Calculated by weight, including:

[0103] The composition includes 68 parts butyl rubber, 32 parts silica, 11 parts zirconium selenide powder, 1.2 parts stearic acid, 1.3 parts sulfur, and 0.5 parts TMTD vulcanization accelerator.

[0104] Comparative Example 3

[0105] A waterproof ring material, which differs from Example 2 in that it does not contain modified cerium nitride@zirconium selenide powder, but is replaced with silica.

[0106] Calculated by weight, including:

[0107] The composition includes 68 parts butyl rubber, 43 parts silica, 1.2 parts stearic acid, 1.3 parts sulfur, and 0.5 parts TMTD vulcanization accelerator.

[0108] To more clearly illustrate the present invention, the waterproof ring materials prepared in Example 2 and Comparative Examples 1-3 of the present invention were compared and tested in terms of performance. The testing standards were GB / T 528-2009, GB / T 531-1999, and GB / T 3512-2014, wherein the heat aging conditions were 110℃ for 24h.

[0109] The results are shown in Table 1:

[0110] Table 1 Performance characteristics of different rubber materials

[0111]

[0112] As can be seen from Table 1 above, the rubber material prepared in Example 2 of the present invention has better mechanical strength and tear strength, higher hardness, better wear resistance, better tensile strength after heat aging, and better water impermeability.

[0113] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A waterproof USB Type-C connector, comprising a shielding shell (1), characterized in that: The shielding shell (1) is internally connected to a main board (2). A waterproof component (3) is provided on the inner side of the outer wall of the main board (2). An upper terminal group (21) is provided at the upper end of the main board (2). A lower terminal group (22) is provided at the lower end of the main board (2). One end of the lower terminal group (22) penetrates through the shielding shell (1). A positioning mechanism (5) is provided on the outer wall of the shielding shell (1). A metal shell (4) is attached to the outside of the shielding shell (1) through the positioning mechanism (5). A locking component (6) is provided on the outer side of the outer wall of the shielding shell (1). The locking component (6) is movably connected to the metal shell (4). The waterproof component (3) includes a waterproof ring (31) and an annular groove (32). The waterproof ring (31) is disposed on the inner side of the outer wall of the main board part (2), and the annular groove (32) is opened on the inner side of the inner wall of the shielding shell (1). The waterproof ring (31) is inserted into the inside of the annular groove (32). By fitting a waterproof ring in the annular groove, placing the connector in a mold for high-temperature vulcanization, and then curing the vulcanized waterproof ring with the same mold, the connection between the main board and the shielding shell is completed. The positioning mechanism (5) includes a positioning groove (51), a through groove (52), a metal pin (53), and a sealing component (55). The positioning groove (51) is opened on the outer wall of the shielding shell (1), and the through groove (52) is opened on the outer wall of the metal shell (4). The through groove (52) is connected to the positioning groove (51). The metal pin (53) is inserted into the inside of the through groove (52). One end of the metal pin (53) extends into the inside of the positioning groove (51) through the through groove (52). The sealing component (55) is set on the outer side of the inner wall of the through groove (52). The sealing component (55) is fitted and connected to the metal pin (53). The positioning groove (51) is provided with a magnetic block (54), which is magnetically connected to the metal pin (53); The sealing component (55) includes a slot (551) and a sealing plug (552). The slot (551) is opened on the outer side of the inner wall of the through groove (52). The sealing plug (552) is inserted into the inside of the slot (551). The inner wall of the sealing plug (552) is fitted and connected to the metal pin (53). The locking assembly (6) includes a locking block (61) and a locking slot (62). The locking block (61) is located on the outer side of the outer wall of the shielding shell (1), and the locking slot (62) is opened at one end of the metal shell (4). The locking block (61) is inserted into the inside of the locking slot (62).

2. The waterproof USB Type-C connector according to claim 1, characterized in that: The waterproof ring (31) is made of rubber.

3. A waterproof USB Type-C connector according to claim 1, characterized in that: The side wall of the metal shell (4) is provided with an opening (7), and the upper end of the opening (7) is provided with a first pin (71).

4. A waterproof USB Type-C connector according to claim 1, characterized in that: An extension plate (8) is provided at the other end of the metal shell (4), and a second pin (81) is provided on the side wall of the extension plate (8).

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