Display panel and manufacturing method thereof

Abstract

The application provides a display panel and a manufacturing method thereof. The display panel comprises a driving backboard, a driving chip arranged on the driving backboard, a light-emitting chip and a reflective film layer. The light-emitting chip is electrically connected with the driving chip. The orthographic projection of the light-emitting chip and the driving chip on the driving backboard is not overlapped. The reflective film layer covers the driving chip. The reflective film layer comprises a first opening. The light-emitting chip is arranged in the first opening. The application sets the reflective film layer covering the driving chip on the driving backboard. The color of the driving chip can be covered by the reflective film layer. The color difference between the driving chip and the reflective film layer is improved. The problem of display brightness unevenness caused by the difficulty of white glue material to reach the same reflectivity level as the reflective layer material is further eliminated.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof. BACKGROUND

[0002] There are generally two driving modes for LED displays, one is an active driving mode (AM) and the other is a passive driving mode (PM). In the AM mode, some LED products replace the driving circuit on the traditional display backboard with a driving chip. In the manufacturing process, a reflective layer is first coated on the surface of the area of the display backboard except for the LED chip and the driving chip, and then the LED chip and the driving chip are transferred to the display backboard.

[0003] The appearance of the driving chip is black, and the color difference between the driving chip and the reflective layer is large. Therefore, white glue material is usually applied on the driving chip to reduce the color difference between the driving chip and the reflective layer. However, the white glue material is difficult to achieve the same reflectivity level as the reflective layer material, which can easily cause display brightness unevenness. SUMMARY

[0004] The present application provides a display panel and a manufacturing method thereof to improve the display brightness unevenness problem when the white glue material is used to shield the driving chip to eliminate the color difference between the driving chip and the reflective layer in the current display panel.

[0005] To solve the above technical problems, the technical solutions provided by the present application are as follows:

[0006] The present application provides a display panel comprising:

[0007] a driving backboard;

[0008] a driving chip disposed on the driving backboard;

[0009] a light emitting chip disposed on the driving backboard, the light emitting chip being electrically connected to the driving chip, and the light emitting chip and the driving chip not overlapping in orthographic projection on the driving backboard; and

[0010] a reflective film layer disposed on the driving backboard, the reflective film layer covering the driving chip;

[0011] wherein the reflective film layer comprises a first opening, and the light emitting chip is disposed in the first opening.

[0012] In the display panel of the present application, in the light output direction of the display panel, the distance from the surface of the light emitting chip away from the driving backboard side to the driving backboard is greater than or equal to the thickness of the reflective film layer.

[0013] In the display panel of the present application, the thickness of the reflective film layer is 50-60 microns in the light-out direction of the display panel.

[0014] In the display panel of the present application, the reflectivity of the surface of the reflective film layer away from the driving backplate is greater than or equal to 92%.

[0015] In the display panel of the present application, the reflective film layer comprises a first reflective layer disposed on the driving backplate and a second reflective layer disposed on the first reflective layer.

[0016] In the display panel of the present application, the thickness of the first reflective layer is greater than or equal to the thickness of the second reflective layer in the light-out direction of the display panel.

[0017] In the display panel of the present application, the hardness of the first reflective layer is greater than or equal to the hardness of the second reflective layer.

[0018] In the display panel of the present application, the included angle between the side surface of the reflective film layer and the surface of the driving backplate in the first opening is greater than or equal to 85° and less than or equal to 90°.

[0019] In the display panel of the present application, the first opening comprises a first end surface flush with the surface of the driving backplate and a second end surface flush with the surface of the reflective film layer away from the driving backplate.

[0020] In the display panel of the present application, the orthographic projection of the first end surface on the driving backplate is located in the second end surface, and the edge-to-edge spacing of the first end surface to the second end surface is less than or equal to 30 microns in the first direction, which is parallel to the driving backplate.

[0021] The present application also provides a manufacturing method of a display panel for manufacturing the display panel, which comprises:

[0022] providing a driving backplate, a plurality of light-emitting chips and a plurality of driving chips;

[0023] forming a first reflective layer on the driving backplate;

[0024] forming a plurality of first openings and a plurality of second openings on the first reflective layer;

[0025] transferring a plurality of the light-emitting chips into the plurality of the first openings and a plurality of the driving chips into the plurality of the second openings;

[0026] forming a second reflective layer, which fills the second openings and covers the driving chips, and the first reflective layer and the second reflective layer constitute a reflective film layer.

[0027] In the method for manufacturing a display panel according to this application, the step of forming a first reflective layer on the driving backplane includes:

[0028] A reflective material layer is coated on the drive backplate;

[0029] The reflective material layer is pre-cured to form a pre-cured reflective material layer;

[0030] The pre-cured reflective material layer is etched using an exposure and development method to form the first opening and the second opening;

[0031] The pre-cured reflective material layer is then cured a second time to form the first reflective layer.

[0032] In the method for manufacturing a display panel according to this application, the step of etching the pre-cured reflective material layer using an exposure and development method to form the first opening and the second opening includes:

[0033] The pre-cured reflective material layer was exposed using mixed light with wavelengths of 365 nm, 405 nm and 425 nm.

[0034] Beneficial effects

[0035] This application improves the color difference between the driver chip and the reflective film layer by setting a reflective film layer covering the driver chip on the driver backplane. Moreover, the reflective film layer on the driver chip and the reflective film layers at other locations on the driver backplane are made of the same reflective material and have the same reflectivity. This can further eliminate the problem of uneven display brightness caused by the difficulty of the white glue material to achieve the same reflectivity level as the reflective layer material. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the first structure of the display panel described in this application;

[0038] Figure 2 This is a schematic diagram of a second structure of the display panel described in this application;

[0039] Figure 3 This is a schematic diagram of the structure of the first opening in this application;

[0040] Figure 4 is a third structural schematic diagram of the display panel described in the present application;

[0041] Figure 5 is a flow chart of a manufacturing method of the display panel described in the present application;

[0042] Figures 6 to 10 is a flow schematic diagram of the manufacturing method of the display panel described in the present application.

[0043] Legend of reference signs:

[0044] 100, driving backboard; 110, substrate; 120, circuit layer; 130, first pad; 140, second pad;

[0045] 200, driving chip;

[0046] 300, light emitting chip;

[0047] 400, reflective film layer; 401, first opening; 402, second opening; 403, first end surface; 404, second end surface; 410, first reflective layer; 420, second reflective layer. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, the orientation words such as "upper" and "lower" generally refer to the upper and lower of the device in the actual use or working state, and specifically refer to the direction of the drawing surface in the drawings; and "inner" and "outer" refer to the outline of the device.

[0049] There are usually two driving modes for LED display, one is active driving mode (Active Matrix, AM), and the other is passive driving mode (Passive Matrix, PM). In the AM mode, some LED products replace the driving circuit on the traditional display backboard with a driving chip, and the appearance of the driving chip is black, which has a large color difference with the reflective layer. Therefore, white glue material is usually needed on the driving chip to reduce the color difference between the driving chip and the reflective layer. However, the white glue material is difficult to reach the same reflectivity level as the reflective layer material, which is easy to cause the problem of uneven display brightness. The present application proposes the following solutions based on the above technical problems.

[0050] Please refer toFigures 1 to 4 The application provides a display panel, which comprises a driving backboard 100, a driving chip 200 arranged on the driving backboard 100, a light-emitting chip 300 and a reflective film layer 400. The light-emitting chip 300 is electrically connected with the driving chip 200. The light-emitting chip 300 and the driving chip 200 do not overlap in orthographic projection on the driving backboard 100. The reflective film layer 400 covers the driving chip 200, and the reflective film layer 400 comprises a first opening 401, and the light-emitting chip 300 is arranged in the first opening 401.

[0051] The application sets the reflective film layer 400 covering the driving chip 200 on the driving backboard 100, so that the reflective film layer 400 can cover the color of the driving chip 200, thereby improving the color difference between the driving chip 200 and the reflective film layer 400. In addition, the reflective film layer 400 on the driving chip 200 and the reflective film layer 400 at other positions on the driving backboard 100 are made of the same reflective material, and the reflectivity of the two is consistent, thereby further eliminating the problem of uneven display brightness caused by the difficulty of white glue material to reach the same reflectivity level as the reflective layer material. In addition, the reflective film layer 400 described in the application is an integral film layer formed on the surface of the driving backboard 100. Compared with the conventional display panel, the dispensing process of dispensing white glue material on the driving chip 200 is omitted, thereby improving the production efficiency and improving the product yield.

[0052] The technical solutions of the application will be described in combination with specific embodiments. It should be noted that the description order of the following embodiments is not limited as the preferred order of the embodiments.

[0053] In the embodiment, the driving backboard 100 can comprise a substrate 110 and a circuit layer 120 arranged on the substrate 110, and the driving chip 200 is electrically connected with the circuit layer 120.

[0054] In the embodiment, the substrate 110 can be a glass substrate, a flexible polyimide substrate or the like.

[0055] In the embodiment, the circuit layer 120 can be at least one metal wiring layer arranged on the substrate 110, and the metal wiring layer can comprise a plurality of metal wires connected with the driving chip 200, so as to transmit the voltage signal in the display panel to the driving chip 200, and the driving chip 200 is used to control the light-emitting state of each light-emitting chip 300.

[0056] In the embodiment, the driving backboard 100 can further be provided with a first pad 130 for fixing the light emitting chip 300 and a second pad 140 for fixing the driving chip 200, and the first pad 130 and the second pad 140 are electrically connected with the circuit layer 120.

[0057] In the embodiment, the light emitting chip 300 can be an LED chip, a Mini-LED chip, a Micro-LED chip, or the like.

[0058] In the embodiment, the orthographic projection of the light emitting chip 300 and the driving chip 200 on the driving backboard 100 does not overlap, which can be understood as that, in the top view of the driving backboard 100, the orthographic projection of the light emitting chip 300 and the orthographic projection of the driving chip 200 do not overlap. Corresponding to the positions of the light emitting chip 300 and the driving chip 200, the positions of the first pad 130 and the second pad 140 on the driving backboard 100 are also different.

[0059] In the embodiment, the reflective film layer 400 can be a reflective material with high hardness and high reflectivity, which can serve as a protective layer to protect the circuit layer 120 on the driving backboard 100. During the welding of the light emitting chip 300 and the driving chip 200, the risk of circuit damage caused by the pressure of the steel mesh on the circuit layer 120 during the steel mesh printing of the tin paste is reduced.

[0060] In the embodiment, the number of the first openings 401 of the reflective film layer 400 corresponds to the number of the light emitting chips 300, that is, one light emitting chip 300 corresponds to one first opening 401. The light emitting chip 300 is not covered by the reflective film layer 400 in the first opening 401, and the light emitted by the light emitting chip 300 can directly exit to one side of the driving backboard 100.

[0061] Please refer to Figure 1 and Figure 2 In the display panel of the present application, the reflective film layer 400 can form the first opening 401 by an exposure and development method, and the angle θ formed by the side surface of the reflective film layer 400 and the surface of the driving backboard 100 in the first opening 401 is greater than or equal to 85° and less than or equal to 90°. It can be understood that the first opening 401 can be regarded as a notch, the side surface of the reflective film layer 400 in the first opening 401 can be regarded as the notch side surface, the surface of the driving backboard 100 can be regarded as the notch bottom surface, and the angle θ formed by the side surface of the reflective film layer 400 and the surface of the driving backboard 100 can be regarded as the angle between the notch side surface and the notch bottom surface.

[0062] The first opening 401 is formed by exposure and development in the embodiment, so that the angle θ between the reflective film layer 400 and the surface of the driving back plate 100 is between 85° and 90°, i.e. the side surface of the reflective film layer 400 around the light emitting chip 300 is close to vertical, which is advantageous to reduce the shielding degree of the side surface of the reflective film layer 400 to the light emission of the side surface of the light emitting chip 300, and further improve the light emission rate of the light emitting chip 300. Moreover, the reflective film layer 400 with vertical side surface has good thickness uniformity, so that it can be stably attached to the surface of the driving back plate 100, and reduce the problems of peeling of the reflective film layer 400 and reduction of reflectivity caused by non-uniform thickness of the reflective film layer 400.

[0063] In the embodiment, the first opening 401 can include a first end surface 403 flush with the surface of the driving back plate 100 and a second end surface 404 flush with the surface of the driving back plate 100 away from the reflective film layer 400. The area of the first end surface 403 is less than or equal to the area of the second end surface 404, and the orthographic projection of the first end surface 403 on the driving back plate 100 is located in the second end surface 404.

[0064] It can be understood that when the angle θ between the reflective film layer 400 and the surface of the driving back plate 100 is 90°, the areas of the first end surface 403 and the second end surface 404 are the same, at this time, the three-dimensional shape of the first opening 401 is a cuboid or a cylinder, as shown in Figure 1 When the angle θ between the reflective film layer 400 and the surface of the driving back plate 100 is less than 90°, the reflective film layer 400 forms an undercut structure at the first opening 401, as shown in Figure 2 and Figure 3 At this time, the area of the first end surface 403 is less than the area of the second end surface 404, and the three-dimensional shape of the first opening 401 is a circular truncated cone or a prismatic truncated cone with "wide top and narrow bottom", wherein "top" refers to the side of the reflective film layer 400 away from the driving back plate 100, and "bottom" refers to the side of the reflective film layer 400 close to the driving back plate 100.

[0065] Please refer to Figure 3 In the embodiment, in the first direction X, the edge-to-edge distance between the first end surface 403 and the second end surface 404 is less than or equal to 30 microns, and the first direction can be any direction parallel to the plane where the driving back plate 100 is located.

[0066] It should be noted that the first direction X passes through the edge position of the first end surface 403 twice, which are assumed to be point A and point B, wherein point A is closer to the first direction X than point B. The first direction X also passes through the edge position of the second end surface 404 twice, which are assumed to be point C and point D, wherein point C is closer to the first direction X than point D. Then, the "distance between the edge of the first end surface 403 and the edge of the second end surface 404 in the first direction X" can be understood as the projection L of the distance between point A and point C in the first direction X. In other words, in this embodiment, L is greater than or equal to 0 and less than or equal to 30 microns.

[0067] Through the above arrangement, the undercut structure in this embodiment has a smaller undercut degree, and the undercut structure has less effect on the light emission of the light emitting chip 300. In addition, the undercut structure is beneficial to maintaining the stability of the bonding between the reflective film layer 400 and the driving backboard 100, and the reflective film layer 400 is less likely to be separated from the driving backboard 100, thereby reducing the problems of reduced reflectivity and interface corrosion caused by the separation of the reflective film layer 400.

[0068] Please refer to Figure 3 In the display panel of the present application, in the light emission direction of the display panel, the distance h between the surface of the light emitting chip 300 away from the driving backboard 100 and the driving backboard 100 is greater than or equal to the thickness d of the reflective film layer 400. In other words, the surface of the light emitting chip 300 away from the driving backboard 100 is arranged protruding from the surface of the reflective film layer 400 away from the driving backboard 100, so that the side light emission of the light emitting chip 300 can be fully reflected by the reflective film layer 400 to the light emission side of the display panel, improving the light emission efficiency of the light emitting chip 300, and further improving the display brightness of the display panel.

[0069] In this embodiment, in the light emission direction of the display panel, the thickness of the reflective film layer 400 can be 50 microns to 60 microns, which is greater than the thickness of the reflective layer in a conventional display panel, so that the thicker reflective film layer 400 can provide better protection for the circuit layer 120 of the driving backboard 100.

[0070] In this embodiment, the surface of the reflective film layer 400 away from the driving backboard 100 is a flat surface, and the reflectivity of the surface of the reflective film layer 400 away from the driving backboard 100 is greater than or equal to 92%, so as to ensure that the reflective film layer 400 can fully reflect the emitted light of the light emitting chip 300, thereby improving the display brightness.

[0071] It should be noted that the reflectivity of the surface of the reflective film layer 400 away from the side of the driving backboard 100 can be the same as or different from the internal reflectivity of the reflective film layer 400. When the reflective film layer 400 is a uniform film layer of the same material, the surface reflectivity of the reflective film layer 400 is the same as the internal reflectivity. When the reflective film layer 400 is a film layer stack of at least two different materials, the reflectivity of the film layers of different materials can be different, as long as the reflectivity of the surface film layer away from the side of the driving backboard 100 is greater than or equal to 92%.

[0072] Please refer to Figure 4 In the display panel of the present application, the reflective film layer 400 can include a first reflective layer 410 disposed on the driving backboard 100 and a second reflective layer 420 disposed on the first reflective layer 410. The first reflective layer 410 and the second reflective layer 420 are both continuous film layers formed on the driving backboard 100, and the first reflective layer 410 and the second reflective layer 420 are disposed in close contact.

[0073] In the present embodiment, the materials of the first reflective layer 410 and the second reflective layer 420 can be the same or different.

[0074] In the present embodiment, when the materials of the first reflective layer 410 and the second reflective layer 420 are the same, the first reflective layer 410 and the second reflective layer 420 appear as one integral film layer in the final display panel product, and there can be no "critical surface" between them. At this time, the first reflective layer 410 and the second reflective layer 420 can both use white oil material. After forming the first reflective layer 410 using white oil material, the driving chip 200 and the light-emitting chip 300 can be transferred to the driving backboard 100 first, and then the second reflective layer 420 is disposed thereon to cover the driving chip 200. After curing treatment, the first reflective layer 410 and the second reflective layer 420 are cured into an integral structure of the reflective film layer 400.

[0075] In the present embodiment, when the materials of the first reflective layer 410 and the second reflective layer 420 are different, the hardness of the first reflective layer 410 can be greater than or equal to the hardness of the second reflective layer 420, so that the first reflective layer 410 directly disposed on the driving backboard 100 has high strength, thereby playing a good anti-pressure effect on the circuit layer 120 on the driving backboard 100.

[0076] In the embodiment, when the first reflective layer 410 and the second reflective layer 420 are made of different materials, the reflectivity of the two layers can be different. Specifically, the reflectivity of the second reflective layer 420 can be greater than or equal to the reflectivity of the first reflective layer 410, and the reflectivity of the second reflective layer 420 also needs to be greater than or equal to 92% to ensure that the second reflective layer 420 on the surface can reflect the light emitted by the light-emitting chip 300 efficiently and improve the display brightness.

[0077] In the embodiment, in the light-emitting direction of the display panel, the thickness of the first reflective layer 410 can be greater than or equal to the thickness of the second reflective layer 420, so that the first reflective layer 410 mainly serving the protection function has a greater thickness and thus has a better protection effect.

[0078] In the embodiment, the first reflective layer 410 can be made of white glue material, and the second reflective layer 420 can be made of white oil material, etc. The white glue material can be a mixed material of silica gel, epoxy resin, and titanium dioxide reflective particles, and the white oil material can be a mixed material of acrylic resin, epoxy resin, and titanium dioxide reflective particles.

[0079] It should be noted that the embodiment only exemplifies the materials of the first reflective layer 410 and the second reflective layer 420, but is not a specific limitation on the specific materials of the first reflective layer 410 and the second reflective layer 420. Other materials that meet the conditions that the hardness of the first reflective layer 410 is greater than or equal to the hardness of the second reflective layer 420 and the reflectivity of the second reflective layer 420 is greater than or equal to the reflectivity of the first reflective layer 410 should be considered within the protection scope of the embodiment.

[0080] The embodiment improves the color difference between the driving chip 200 and the reflective film layer 400 by arranging the reflective film layer 400 on the driving backboard 100 to cover the driving chip 200, and the reflective film layer 400 on the driving chip 200 and the reflective film layer 400 at other positions on the driving backboard 100 are made of the same reflective material and have the same reflectivity, thereby further eliminating the problem of uneven display brightness caused by the difficulty of white glue material to reach the same reflectivity level as the reflective layer material.

[0081] Please refer to Figures 5 to 10 The embodiment also provides a manufacturing method of a display panel for manufacturing the display panel in the above embodiments.

[0082] In the embodiment, the manufacturing method of the display panel can include:

[0083] S100, providing a driving backboard 100, a plurality of light emitting chips 300 and a plurality of driving chips 200, as shown in Figure 6 .

[0084] S200, forming a first reflection layer 410 on the driving backboard 100, as shown in Figure 7 .

[0085] S300, forming a plurality of first openings 401 and a plurality of second openings 402 on the first reflection layer 410, as shown in Figure 8 .

[0086] S400, transferring a plurality of the light emitting chips 300 into the plurality of the first openings 401 and transferring a plurality of the driving chips 200 into the plurality of the second openings 402, as shown in Figure 9 .

[0087] S500, forming a second reflection layer 420, and making the second reflection layer 420 fill the second openings 402 and cover the driving chips 200, the first reflection layer 410 and the second reflection layer 420 constituting a reflection film layer 400, as shown in Figure 10 .

[0088] The embodiment divides the reflection film layer 400 into the first reflection layer 410 and the second reflection layer 420 for step-by-step manufacturing, and transfers the light emitting chips 300 and the driving chips 200 onto the driving backboard 100 between manufacturing the first reflection layer 410 and the second reflection layer 420, so that the second reflection layer 420 can cover the driving chips 200 to eliminate the white glue process on the driving chips 200, eliminate the problem of display brightness unevenness caused by the difficulty of white glue material to reach the same reflectivity level as the reflection layer material, and improve production efficiency and product yield.

[0089] Please refer to Figure 7 , in the manufacturing method of the display panel, the S200 step can include:

[0090] S210, coating a reflection material layer on the driving backboard 100.

[0091] In the embodiment, the reflection material layer can be white oil material, and the white oil material can be a mixture material of acrylic resin and epoxy resin, titanium dioxide reflection particles, etc.

[0092] S220, pre-solidifying the reflection material layer to form a pre-solidified reflection material layer.

[0093] In the embodiment, the pre-curing can be achieved by cross-linking reaction between the epoxy resin and the acrylic resin in the reflective material layer through a thermal curing process. At this time, the reflective material layer is preliminarily cured from liquid state to solid film layer with stable shape.

[0094] S230, etching the pre-cured reflective material layer by using exposure and development method to form the first opening 401 and the second opening 402.

[0095] In the embodiment, the first opening 401 and the second opening 402 need to be subjected to light shielding treatment, the exposed part of the reflective material layer is reserved, and the unexposed part is dissolved after development.

[0096] In the embodiment, the first opening 401 corresponds to the first pad 130 on the driving back plate 100 for fixing the light emitting chip 300, and the second opening 402 corresponds to the second pad 140 on the driving back plate 100 for fixing the driving chip 200.

[0097] In the embodiment, the pre-cured reflective material layer is exposed by using mixed light of three wave bands of 365 nm, 405 nm and 425 nm in the exposure and development process.

[0098] In the embodiment, the reflective film layer 400 needs to have high hardness, so that its thickness is thick. The penetration ability of short wavelength light is weak, and part of the wavelength below 400 nm can be absorbed by titanium dioxide in the pre-cured reflective material layer, and the wavelength above 450 nm is reflected by titanium dioxide. If the reflective film layer 400 is thick and far away from the light source, it is easy to react incompletely by using 365 nm ultraviolet light in the conventional exposure means, which leads to incomplete curing and easy to be developed and thus causes serious undercut phenomenon. The embodiment can effectively reduce or alleviate the undercut phenomenon by using light of three wave bands of 365 nm, 405 nm and 425 nm for exposure treatment, so as to improve the problems of interface corrosion and reflectivity reduction caused by undercut.

[0099] S240, secondary curing the pre-cured reflective material layer to form the first reflective layer 410.

[0100] In the embodiment, the secondary curing can be achieved by further cross-linking reaction between the epoxy resin and the acrylic resin in the reflective material layer through a thermal curing process, so as to form the first reflective layer 410 with high hardness.

[0101] The display panel and the manufacturing method thereof provided by the embodiments of the present application are described in detail above, and the principles and implementation manners of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea; meanwhile, for those skilled in the art, the specific implementation manners and application ranges will be changed according to the idea of the present application. In conclusion, the content of the present description should not be understood as a limitation of the present application.

Claims

1. A display panel, characterized by, The display panel comprises: a driving backboard; a driving chip disposed on the driving backboard; a light emitting chip disposed on the driving backboard, the light emitting chip being electrically connected with the driving chip, and the light emitting chip and the driving chip not overlapping in orthographic projection on the driving backboard; a reflective film layer disposed on the driving backboard, the reflective film layer covering the driving chip, the reflective film layer on the driving chip and the reflective film layer at other positions on the driving backboard being made of the same reflective material; wherein the reflective film layer comprises a first opening, and the light emitting chip is disposed in the first opening. In the light emitting direction of the display panel, the distance from the surface of the light emitting chip away from the driving backboard to the driving backboard is greater than or equal to the thickness of the reflective film layer.

2. The display panel of claim 1, wherein, In the light emitting direction of the display panel, the thickness of the reflective film layer is 50 microns to 60 microns.

3. The display panel of claim 2, wherein, The reflectivity of the surface of the reflective film layer away from the driving backboard is greater than or equal to 92%.

4. The display panel of claim 3, wherein, The reflective film layer comprises a first reflective layer disposed on the driving backboard and a second reflective layer disposed on the first reflective layer; 5. The display panel of claim 1, wherein, wherein in the light emitting direction of the display panel, the thickness of the first reflective layer is greater than or equal to the thickness of the second reflective layer. The hardness of the first reflective layer is greater than or equal to the hardness of the second reflective layer.

6. The display panel of claim 5, wherein, In the first opening, the included angle between the side surface of the reflective film layer and the surface of the driving backboard is greater than or equal to 85° and less than or equal to 90°.

7. The display panel of claim 1, wherein, The first opening comprises a first end surface flush with the surface of the driving backboard and a second end surface flush with the surface of the reflective film layer away from the driving backboard; 8. The display panel of claim 7, wherein, wherein the orthographic projection of the first end surface on the driving backboard is located in the second end surface, and in a first direction parallel to the driving backboard, the edge-to-edge distance of the first end surface to the second end surface is less than or equal to 30 microns. The display panel comprises:

9. A manufacturing method of a display panel, for manufacturing the display panel according to any one of claims 1 to 8, characterized by, providing a driving backboard, a plurality of light emitting chips and a plurality of driving chips; forming a first reflective layer on the driving backboard; forming a plurality of first openings and a plurality of second openings on the first reflective layer; transferring a plurality of the light emitting chips into the plurality of the first openings and a plurality of the driving chips into the plurality of the second openings; forming a second reflective layer, and the second reflective layer fills the second openings and covers the driving chips, and the first reflective layer and the second reflective layer constitute a reflective film layer. The step of forming a first reflective layer on the driving backboard comprises:

10. The manufacturing method of a display panel according to claim 9, wherein, coating a reflective material layer on the driving backboard; pre-curing the reflective material layer to form a pre-cured reflective material layer; etching the pre-cured reflective material layer by exposure and development to form the first openings and the second openings; secondary curing the pre-cured reflective material layer to form the first reflective layer. The step of etching the pre-cured reflective material layer by exposure and development to form the first openings and the second openings comprises:

11. The manufacturing method of a display panel according to claim 10, wherein, ​ The pre-cured reflective material layer is exposed to mixed light having three wavelength bands of 365 nm, 405 nm, and 425 nm. The pre-cured reflective material layer is exposed to mixed light having three wavelength bands of 365 nm, 405 nm, and 425 nm.

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