Display module and manufacturing method thereof, and display device

Abstract

The present application discloses a display module and a preparation method thereof, and a display device, and relates to the field of display technology. The display module includes a display panel, a chip-on-chip film, and a first protective adhesive. The second gold finger in the chip-on-chip film can be bound and connected to the first gold finger in the display panel located in the binding area. The first protective adhesive wraps the first part of the chip-on-chip film including the second gold finger, so that the first protective adhesive can completely seal the second gold finger. Therefore, even if the chip-on-chip film is subjected to reaction stress, it will not cause a gap between the chip-on-chip film and the first substrate, which can prevent water vapor from invading the binding area, and prevent the first gold finger and the second gold finger bound and connected in the binding area from being corroded, thereby ensuring the binding effect of the second gold finger and the first gold finger and improving the yield of the display module.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a preparation method thereof, and a display device. Background Art

[0002] The display module includes a display panel and a chip on film (COF). The display panel has a display area and a binding area located on one side of the display area, and the display panel includes a first gold finger located in the binding area. The COF includes a second gold finger. The second gold finger of the COF and the first gold finger of the display panel can be connected by bonding with a conductive adhesive.

[0003] In the related art, water vapor or oxygen outside the display module is easily transmitted to the binding area of ​​the display panel through the gap between the cover chip film and the display panel, which may corrode the first gold finger and the second gold finger bound in the binding area, affecting the binding effect of the second gold finger and the first gold finger, and the yield of the display module is low. Summary of the invention

[0004] The present application provides a display module and a manufacturing method thereof, and a display device, which can solve the problem of low yield of display modules in related technologies. The technical solution is as follows:

[0005] In one aspect, a display module is provided, the display module comprising:

[0006] A display panel, the display panel having a display area and a binding area located on one side of the display area, the display panel comprising a first substrate and a first gold finger located on the first substrate and located in the binding area;

[0007] A chip-on-chip film, the chip-on-chip film comprising a substrate, and a second gold finger located on the substrate, the second gold finger being bound and connected to the first gold finger, the substrate and the second gold finger constituting a first part and a second part connected to the chip-on-chip film, the first part comprising the second gold finger and a part of the substrate, and the second part comprising another part of the substrate;

[0008] And a first protective glue, the first protective glue wraps the first part of the flip chip film, the first protective glue includes a first colloid and a second colloid connected to each other, the first colloid is located on a target surface of the first part away from the first substrate, and the first colloid is in contact with the target surface, the second colloid is at least located on the side wall of the first part, and the second colloid is in contact with the side wall of the first part and the first substrate.

[0009] Optionally, one end of the second part is connected to a surface of the first part away from the first substrate, and a surface of the first part provided with the second gold finger intersects with a bearing surface portion of the second part provided with the device.

[0010] Optionally, a surface of the first part used to set the second gold finger is perpendicular to a bearing surface portion of the second part used to bear a component.

[0011] Optionally, the second colloid includes a first target colloid located in the first portion away from the display area, and the first target colloid is in contact with a side wall of the first portion away from the display area and a surface of the first substrate facing the COF.

[0012] Optionally, the substrate includes a second substrate, a third substrate and a routing layer;

[0013] The second substrate comprises a first sub-substrate constituting a first portion of the substrate, and a second sub-substrate constituting a second portion of the substrate, wherein a bearing surface of the first sub-substrate and a bearing surface of the second sub-substrate at least partially intersect;

[0014] The third substrate includes a third sub-substrate constituting a first portion of the substrate, and a fourth sub-substrate constituting a second portion of the substrate, and a bearing surface of the third sub-substrate and a bearing surface of the fourth sub-substrate at least partially intersect each other;

[0015] Among them, the second sub-substrate and the fourth sub-substrate are arranged opposite to each other, and the routing layer is located between the second sub-substrate and the fourth sub-substrate; the surface of the first sub-substrate away from the second sub-substrate and the surface of the third sub-substrate away from the fourth sub-substrate are coplanar, and the second gold finger is located on the surface of the first sub-substrate away from the second sub-substrate and the surface of the third sub-substrate away from the fourth sub-substrate.

[0016] Optionally, one end of the second part is connected to one end of the first part, and the second part is far away from the display area relative to the first part, and the surface of the first part provided with the second gold finger is parallel to the bearing surface of the second part provided with the device; the first substrate has a groove where the first gold finger is far away from the display area, the base has a through hole corresponding to the groove, and the through hole can divide the chip-on-film into the first part and the second part;

[0017] The second colloid includes a second target colloid located in the through hole and the groove, and the second target colloid is in contact with an inner wall of the through hole and an inner wall of the groove.

[0018] Optionally, an orthographic projection of the through hole on the first substrate is at least partially within the groove, so that the through hole and the groove are connected.

[0019] Optionally, the length of the groove along the first direction is greater than the length of the second gold finger along the first direction, and the area where the second gold finger is located in the first direction is located within the area where the groove is located in the first direction;

[0020] The first direction is perpendicular to an arrangement direction of the first portion and the second portion.

[0021] Optionally, the length of the groove along the second direction is greater than 30 micrometers, and the depth of the groove is greater than one quarter of the thickness of the first substrate and less than one third of the thickness of the first substrate;

[0022] The second direction is parallel to an arrangement direction of the first portion and the second portion.

[0023] Optionally, the display module further includes: a second protective glue;

[0024] The second protective glue contacts the surface of the COF facing the first substrate and the side wall of the first substrate away from the display area, and the orthographic projection of the second protective glue on the COF is located in the second portion.

[0025] Optionally, the display module further includes: conductive glue;

[0026] The conductive adhesive is located between the first gold finger and the second gold finger, and is used to connect the first gold finger and the second gold finger.

[0027] In another aspect, a method for preparing a display module is provided, the method comprising:

[0028] A display panel is provided, wherein the display panel has a display area and a binding area located on one side of the display area, and the display panel includes a first substrate and a first gold finger located on the first substrate and located in the binding area;

[0029] A chip-on-flip film is provided, the chip-on-flip film comprising a substrate and a second gold finger located on the substrate, the second gold finger is bound and connected to the first gold finger, the substrate and the second gold finger constitute a first part and a second part connected to the chip-on-flip film, the first part includes the second gold finger and a part of the substrate, and the second part includes another part of the substrate;

[0030] Bind and connect the second cheating finger and the first cheating finger;

[0031] A first protective glue is formed so that the first protective glue wraps the first part, the first protective glue includes a first colloid and a second colloid connected to each other, the first colloid is located on a target surface of the first part away from the first substrate, and the first colloid is in contact with the target surface, and the second colloid is located at least on a side wall of the first part, and the second colloid is in contact with the side wall of the first part and the first substrate.

[0032] Optionally, one end of the second part is connected to a surface of the first part away from the first substrate, and a surface of the first part provided with the second gold finger intersects with a bearing surface of the second part provided with a device;

[0033] The first golden finger and the second golden finger are bound and connected, including:

[0034] Sleeve a first pressing head outside the second part, and apply pressure from a side of the first part away from the display panel to bind and connect the first gold finger and the second gold finger, wherein the first pressing head has a pressing head through hole, and the pressing head through hole is used for the second part to pass through;

[0035] Alternatively, the first golden finger and the second golden finger are bound and connected, including:

[0036] At least a second pressing head and a third pressing head are used to apply pressure from a side of the first part away from the display panel in sequence to bind and connect the first gold finger and the second gold finger, and the pressing position of the third pressing head is different from the pressing position of the second pressing head.

[0037] Optionally, one end of the second part is connected to one end of the first part, and the second part is away from the display area relative to the first part, and the surface of the first part provided with the second gold finger is parallel to the bearing surface of the second part provided with the device; the first substrate has a groove where the first gold finger is away from the display area, the base has a through hole corresponding to the groove, and the through hole can divide the chip-on-film into the first part and the second part; the forming of the first protective glue includes:

[0038] Filling the groove with a first protective glue through the through hole, and coating the first protective glue on a side of the first portion away from the display panel;

[0039] The first protective glue is cured.

[0040] In yet another aspect, a display device is provided, the display device comprising: a power supply component and the display module as described in the above aspect;

[0041] The power supply component is used to supply power to the display module.

[0042] The beneficial effects of the technical solution provided by this application include at least:

[0043] The present application provides a display module and a preparation method thereof, and a display device, wherein the display module includes a display panel, a chip-on-chip film, and a first protective adhesive. The second gold finger in the chip-on-chip film can be bound and connected to the first gold finger in the binding area of ​​the display panel. The first protective adhesive wraps the first part of the chip-on-chip film including the second gold finger, so that the first protective adhesive can completely seal the second gold finger. Therefore, even if the chip-on-chip film is subjected to reaction stress, no gap will be generated between the chip-on-chip film and the first substrate, which can prevent water vapor from invading the binding area, prevent the first gold finger and the second gold finger bound and connected in the binding area from being corroded, ensure the binding effect of the second gold finger and the first gold finger, and improve the yield of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0045] Figure 1 It is a cross-sectional view of a display module in the related art when it is not subjected to reverse stress;

[0046] Figure 2 It is a back view of a display module in the related art when it is not subjected to reverse stress;

[0047] Figure 3 It is a cross-sectional view of a display module in the related art when it is subjected to reverse stress;

[0048] Figure 4 It is a back view of a display module in the related art when it is subjected to reverse stress;

[0049] Figure 5 is a structural schematic diagram of a display module provided in an embodiment of the present application;

[0050] Figure 6 It is a schematic structural diagram of a flip chip film provided in an embodiment of the present application;

[0051] Figure 7 is a schematic structural diagram of another flip chip film provided in an embodiment of the present application;

[0052] Figure 8 is a schematic diagram of the structure of another display module provided in an embodiment of the present application;

[0053] Fig. 9 is a back view of another display module provided in an embodiment of the present application;

[0054] Fig.10 is a top view of a display panel provided in an embodiment of the present application;

[0055] Fig.11 is a top view of a flip chip film provided in an embodiment of the present application;

[0056] Fig.12 is a top view of a display panel and a chip-on-film provided in an embodiment of the present application;

[0057] Fig.13 is a flow chart of a method for preparing a display module provided in an embodiment of the present application;

[0058] Fig.14 This is a schematic diagram of binding and connecting a second golden finger and a first golden finger provided in an embodiment of the present application;

[0059] Fig.15 It is a structural schematic diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0060] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0061] In the related art, reference Figure 1 and Figure 2 The display panel of the display module includes a first substrate and a first gold finger located on the first substrate. The chip-on-chip film of the display module includes a base and a second gold finger. After the second gold finger of the chip-on-chip film and the first gold finger of the display panel are bonded and connected by an anisotropic conductive film (ACF), a first protective adhesive can be applied on the side of the chip-on-chip film away from the display panel, and a second protective adhesive can be applied on the side of the chip-on-chip film close to the display panel to prevent water and oxygen from invading from the gap between the chip-on-chip film and the display panel. The conductive adhesive is used to bond and connect the first gold finger of the display panel and the second gold finger of the chip-on-chip film, and the binding particles in the conductive adhesive can make the first gold finger and the second gold finger conductive.

[0062] However, reference Figure 3 and Figure 4If the chip-on-chip film is subjected to reverse stress, the second protective adhesive is very likely to peel. In this case, there is a gap between the second protective adhesive and the edge of the display panel. Water and oxygen from the outside can easily invade from the gap, causing the indentation of the binding particles in the conductive adhesive to weaken under a microscope, or the binding particles cannot be seen. This may cause the first gold finger and the second gold finger to separate, the binding to fail, the electrical conduction of the display module to become abnormal, and the yield of the display module to be low.

[0063] Figure 5 Schematic diagram of a partial structure of a display module provided in an embodiment of the present application. Figure 5 It can be seen that the display module 10 may include: a display panel 101, a COF 102 and a first protective glue 103. The display panel 101 may have a display area 101a and a binding area 101b located on one side of the display area 101a. The display panel 101 includes a first substrate 1011 and a first gold finger 1012 located on the first substrate 1011 and located in the binding area 101b.

[0064] Figure 6 Schematic diagram of the structure of a flip chip film provided in an embodiment of the present application. Figure 5 and Figure 6 The COF film 102 may include a substrate 1021, and a second gold finger 1022 located on the substrate 1021. The second gold finger 1022 may be bound and connected to the first gold finger 1012. The substrate 1021 and the second gold finger 1022 may constitute a first portion a1 and a second portion a2 connected to the COF film 102. The first portion a1 includes the second gold finger 1022 and a portion of the substrate 1021, and the second portion a2 includes another portion of the substrate 1021.

[0065] refer to Figure 5 The first protective glue 103 may wrap the first portion a1 of the COF film 102, and the first protective glue 103 may include a first colloid 1031 and a second colloid 1032 connected to each other. The first colloid 1031 may be located on a target surface of the first portion a1 away from the first substrate 1011, and the first colloid 1031 is in contact with the target surface. The second colloid 1032 may be located at least on the sidewall of the first portion a1, and the second colloid 1032 is in contact with the sidewall of the first portion a1 and the first substrate 1011.

[0066] In the embodiment of the present application, since the first protective glue 103 wraps the first part a1 of the COF film 102, the first protective glue 103 can completely seal the gap between the COF film 102 and the first substrate 1011, and further can completely seal the second gold finger 1022 in the COF film 102. In the case where the COF film 102 is subjected to reverse stress, no gap will be generated between the COF film 102 and the first substrate 1011. This can prevent water vapor from invading the binding area 101b, and further prevent the first gold finger 1012 and the second gold finger 1022 bound and connected in the binding area 101b from being corroded, thereby ensuring the binding effect of the second gold finger 1022 and the first gold finger 1012, and further improving the yield of the display module 10.

[0067] In summary, an embodiment of the present application provides a display module, which includes a display panel, a chip-on-chip film, and a first protective adhesive. The second gold finger in the chip-on-chip film can be bound and connected to the first gold finger in the display panel located in the binding area. The first protective adhesive wraps the first part of the chip-on-chip film including the second gold finger, so that the first protective adhesive can completely seal the second gold finger. Therefore, even if the chip-on-chip film is subjected to reaction stress, it will not cause a gap between the chip-on-chip film and the first substrate, which can prevent water vapor from invading the binding area, and prevent the first gold finger and the second gold finger bound and connected in the binding area from being corroded, thereby ensuring the binding effect of the second gold finger and the first gold finger and improving the yield of the display module.

[0068] Optionally, the display module may be a display module in a wearable display device. The first protective glue may be an ultraviolet light curing glue (UV glue).

[0069] As an optional implementation, refer to Figure 5 and Figure 6 In the flip chip film 102, one end of the second part a2 can be connected to the surface of the first part a1 away from the first substrate 1011, and the surface of the first part a1 provided with the second gold finger 1022 intersects with the bearing surface of the second part a2 provided with the device (such as the driver chip 104). Optionally, the surface of the first part a1 provided with the second gold finger 1022 intersects with the bearing surface of the second part a2 provided with the device. For example, the first part a1 and the second part a2 of the flip chip film 102 can be T-shaped structures.

[0070] Optionally, the second colloid 1032 includes a first target colloid 1032a located in the first portion a1 away from the display area 101a, and the first target colloid 1032a can contact the side wall of the first portion a1 away from the display area 101a and the surface of the first substrate 1011 facing the COF 102. That is, the first target colloid 1032a can seal the side wall of the first portion a1 away from the display area 101a and the surface of the first substrate 1011 facing the COF 102, thereby preventing water and oxygen from invading the binding area 101b from the gap between the side wall of the first portion a1 away from the display area 101a and the surface of the first substrate 1011 facing the COF 102. Thus, the first gold finger 1012 and the second gold finger 1022 bound and connected in the binding area 101b can be prevented from being corroded, thereby ensuring the yield of the display module 10.

[0071] Of course, the second colloid 1032 may also include other target colloids located on other side walls of the first portion a1 , so as to completely wrap the first portion a1 and ensure the sealing effect of the second gold finger 1022 .

[0072] refer to Figure 7 It can be seen that the substrate 1021 may include a second substrate 10211, a third substrate 10212 and a routing layer 10213. The second substrate 10211 includes a first sub-substrate b1 constituting a first portion a1 of the substrate 1021, and a second sub-substrate b2 constituting a second portion a2 of the substrate 1021, and the bearing surface of the first sub-substrate b1 and the bearing surface of the second sub-substrate b2 at least partially intersect. The third substrate 10212 includes a third sub-substrate c1 constituting a first portion a1 of the substrate 1021, and a fourth sub-substrate c2 constituting a second portion a2 of the substrate 1021, and the bearing surface of the third sub-substrate c1 and the bearing surface of the fourth sub-substrate c2 at least partially intersect.

[0073] The second sub-substrate b2 and the fourth sub-substrate c2 are arranged opposite to each other, and the routing layer 10213 is located between the second sub-substrate b2 and the fourth sub-substrate c2. The surface of the first sub-substrate b1 away from the second sub-substrate b2 and the surface of the third sub-substrate c1 away from the fourth sub-substrate c2 are coplanar, and the second gold finger 1022 is located on the surface of the first sub-substrate b1 away from the second sub-substrate b2 and the surface of the third sub-substrate c1 away from the fourth sub-substrate c2.

[0074] Optionally, the routing layer 10213 may include a plurality of signal routing lines. The material of the signal routing line may be a metal material. For example, if the material of the signal routing line is copper (Cu), the signal routing line may be called a copper routing line.

[0075] In this implementation, the first sub-substrate b1 , the third sub-substrate c1 and the second gold finger 1022 may constitute a first portion a1 of the substrate 1021 , and the second sub-substrate b2 and the fourth sub-substrate c2 may constitute a second portion a2 of the substrate 1021 .

[0076] As another optional implementation, refer to Figure 8 and Fig. 9 One end of the second part a2 can be connected to one end of the first part a1, and the second part a2 is farther away from the display area 101a than the first part a1. The surface of the first part a1 provided with the second gold finger 1022 is parallel to the bearing surface of the second part a2 provided with the device.

[0077] refer to Fig.10 The first substrate 1011 has a groove 1011a with a first gold finger 1012 away from the display area 101a. Fig.11 The substrate 1021 has a through hole 1021 a corresponding to the groove 1011 a , and the through hole 1021 a can divide the COF film 102 into a first portion a1 and a second portion a2 .

[0078] The second colloid 1032 may include a second target colloid 1032b located in the through hole 1021a and the groove 1011a, and the second target colloid 1032b contacts the inner wall of the through hole 1021a and the inner wall of the groove 1011a. Thus, the second target colloid 1032b located in the through hole 1021a and the groove 1011a can form a barrier wall to block water and oxygen. The barrier wall is located on the side of the binding area 101b away from the display area 101a, so as to prevent water and oxygen from invading the binding area and the second gold finger 1022 from being corroded from the gap between the COF film 102 and the first substrate 1011, thereby ensuring the yield of the display module 10.

[0079] Optional, reference Fig.12 The orthographic projection of the through hole 1021a on the first substrate 1011 is at least partially located in the groove 1011a, so that the through hole 1021a and the groove 1011a are connected, thereby facilitating the first protective glue 103 to be filled into the groove 1011a through the through hole 1021a.

[0080] In the embodiment of the present application, the length of the groove 1011a along the first direction X (the length of the groove 1011a) may be greater than the length of the second gold finger 1022 along the first direction X, and the region where the second gold finger 1022 is located in the first direction X is within the region where the groove 1011a is located in the first direction X. The first direction X is perpendicular to the arrangement direction of the first part a1 and the second part a2. Since the length of the groove 1011a is greater than the length of the second gold finger 1022, the barrier wall formed by the first protective glue 103 filled into the groove 1011a can completely block water and oxygen, avoiding the corrosion of the second gold finger 1022.

[0081] Optionally, the length of the groove 1011a along the second direction Y (the width of the groove 1011a) may be greater than 30 μm (micrometers). Of course, the length of the groove 1011a along the second direction Y can be appropriately widened according to the actual frame width, and the embodiment of the present application does not specifically limit the width of the groove 1011a. The second direction Y is parallel to the arrangement direction of the first part a1 and the second part a2.

[0082] In addition, the depth of the groove 1011a may be greater than 1 / 4 of the thickness of the first substrate 1011 and less than 1 / 3 of the thickness of the first substrate 1011. Assuming the thickness of the first substrate 1011 is h, the depth m of the groove 1011a may satisfy: 1 / 4h < m < 1 / 3h. By designing the depth of the groove 1011a, on the premise of ensuring that the first protective glue 103 filled into the groove 1011a effectively blocks water and oxygen, the mechanical strength of the first substrate 1011 can be avoided from being affected.

[0083] In the embodiment of the present application, referring to Fig.11 , the shape of the positive projection of the through hole 1021a on the first substrate 1011 may be circular. Of course, the shape of the positive projection of the through hole 1021a on the first substrate 1011 may be other shapes, such as rectangular. The embodiment of the present application does not limit the shape of the positive projection of the through hole 1021a on the first substrate 1011.

[0084] Optionally, taking the shape of the positive projection of the through hole 1021a on the first substrate 1011 as an example, the diameter of the through hole 1021a may be smaller than the gap between the interfaces (pins) in the flip chip film 102. For example, the range of the diameter of the through hole 1021a may be 30 μm to 50 μm. Of course, if the gap between the interfaces is too narrow to set the through hole 1021a, a small number of through holes 1021a may be reserved separately at fixed positions, and the interfaces may be avoided at the fixed positions.

[0085] Optionally, the number of through holes 1021a provided on the substrate 1021 of the COF 102 can be set based on the state of the first protective glue 103 filled in the groove 1011a, and is related to the size of the groove 1011a and the size of the through hole 1021a, and is not specifically limited.

[0086] Optional, reference Fig.11 The multiple through holes 1021a arranged on the base 1021 of the flip chip film 102 can be arranged in a row, or can be arranged in multiple rows. The embodiment of the present application is not limited to this. It is only necessary that the orthographic projection of each through hole 1021a on the first substrate 1011 is at least partially located within the orthographic projection of the groove 1011a on the first substrate 1011.

[0087] refer to Figure 8 The display module 10 may further include a second protective glue 105. The second protective glue 105 may contact the surface of the COF film 102 facing the first substrate 1011 and the side wall of the first substrate 1011 away from the display area 101a. The orthographic projection of the second protective glue 105 on the COF film 102 is located in the second portion a2. By coating the second protective glue 105 on the back of the COF film 102, the COF film 102 can be further protected and sealed, ensuring that the first gold finger 1012 and the second gold finger 1022 are not corroded, thereby ensuring the yield of the display module 10.

[0088] Optionally, the display module 10 may further include a conductive adhesive. The conductive adhesive may be located between the first gold finger 1012 and the second gold finger 1022 to connect the first gold finger 1012 and the second gold finger 1022 .

[0089] Optionally, the display module 10 may further include an encapsulation layer 106. The encapsulation layer 106 may be located in the display area 101a of the display panel 101, and is used to encapsulate pixel units designed in the display area 101a of the display panel.

[0090] In summary, an embodiment of the present application provides a display module, which includes a display panel, a chip-on-chip film, and a first protective adhesive. The second gold finger in the chip-on-chip film can be bound and connected to the first gold finger in the display panel located in the binding area. The first protective adhesive wraps the first part of the chip-on-chip film including the second gold finger, so that the first protective adhesive can completely seal the second gold finger. Therefore, even if the chip-on-chip film is subjected to reaction stress, it will not cause a gap between the chip-on-chip film and the first substrate, which can prevent water vapor from invading the binding area, and prevent the first gold finger and the second gold finger bound and connected in the binding area from being corroded, thereby ensuring the binding effect of the second gold finger and the first gold finger and improving the yield of the display module.

[0091] Fig.13is a flow chart of a method for preparing a display module provided in an embodiment of the present application. The method can be used to prepare the display module provided in the above embodiment. Fig.13 , the method may include:

[0092] Step S101: provide a display panel.

[0093] In an embodiment of the present application, the display panel may have a display area and a binding area located on one side of the display area. The display panel may include a first substrate and a first gold finger located on the first substrate and located in the binding area.

[0094] In a first optional implementation, no groove is provided on the first substrate of the display panel. In a second optional implementation, a groove is provided on the first substrate of the display panel, where the first gold finger is away from the display area.

[0095] Step S102: providing a flip chip film.

[0096] In an embodiment of the present application, the flip chip film may include a substrate and a second gold finger located on the substrate. The substrate and the second gold finger constitute a first part and a second part connected to the flip chip film, the first part includes the second gold finger and a part of the substrate, and the second part includes another part of the substrate.

[0097] In a first optional implementation, one end of the second part can be connected to a surface of the first part away from the first substrate, and a surface of the first part provided with the second gold finger can intersect, for example, be perpendicular to, a bearing surface of the second part provided with the device.

[0098] In a second optional implementation, the substrate has a through hole corresponding to the groove. The through hole on the substrate can divide the COF film into a first part and a second part. One end of the second part of the COF film can be connected to one end of the first part, and the second part is away from the display area relative to the first part. The surface of the first part where the second gold finger is provided is parallel to the bearing surface of the second part where the device is provided.

[0099] Step S103: Bind and connect the first golden finger and the second golden finger.

[0100] In the embodiment of the present application, the second gold finger of the chip-on-chip film and the first gold finger of the display panel can be bound and connected by using conductive glue, wherein the binding particles in the conductive glue can connect the second gold finger and the first gold finger.

[0101] In a first optional implementation, the process of binding the second golden finger to the first golden finger may include: referring to Fig.14, the first pressure head can be sleeved on the outside of the second part, and pressure can be applied from the side of the first part away from the display panel to bind and connect the first gold finger and the second gold finger. Among them, the first pressure head can have a pressure head through hole, and the pressure head through hole is used for the second part to pass through. That is, the first pressure head can be an integrated structure with a pressure head through hole. Alternatively, the process of binding and connecting the second gold finger and the first gold finger can include: at least using the second pressure head and the third pressure head to apply pressure from the side of the first part away from the display panel in batches to bind and connect the first gold finger and the second gold finger. The pressurizing position of the third pressure head is different from the pressurizing position of the second pressure head. Of course, more pressure heads can be used to apply pressure in batches to ensure the binding effect of the binding connection between the first gold finger and the second gold finger.

[0102] In the embodiment of the present application, since the pressure head cannot pressurize the position where the second part is connected to the first part, the second golden finger at the corresponding position may not be connected to the first golden finger. Therefore, in order to ensure the reliable connection between the second golden finger and the first golden finger, the size of the second golden finger and the first golden finger can be appropriately increased to meet the minimum conduction area of ​​the second golden finger and the first golden finger.

[0103] Optionally, assuming that the diameter of the indenter through hole in the first indenter is 150 μm, it means that there will be a 150 μm range in the second gold finger and the first gold finger that cannot be conductive. Therefore, the size of the second gold finger and the first gold finger can be increased by 150 μm to meet the minimum conductive area of ​​the second gold finger and the first gold finger.

[0104] In a second optional implementation, the process of binding the second gold finger to the first gold finger may include: applying pressure to the side of the first portion away from the display panel using a fourth pressure head to bind the first gold finger to the second gold finger. The fourth pressure head may be an integral structure without a pressure head through hole.

[0105] Step S104 , forming a first protective adhesive so that the first protective adhesive wraps the first portion of the chip on film.

[0106] In a first optional implementation, after the second gold finger is bound and connected to the first gold finger, a first protective glue can be coated on the first part of the flip chip film so that the first protective glue wraps the first part. The first protective glue includes a first colloid and a second colloid connected to each other. The first colloid is located on a target surface of the first part away from the first substrate, and the first colloid is in contact with the target surface. The second colloid is at least located on the side wall of the first part, and the second colloid is in contact with the side wall of the first part and the first substrate.

[0107] The second colloid being at least located on the sidewall of the first portion may mean that the first target colloid in the second colloid located in the first portion away from the display area may contact the sidewall of the first portion away from the display area and the surface of the first substrate facing the COF.

[0108] Since the first protective adhesive in the prepared display module wraps the first part of the chip-on-chip film, the first protective adhesive can completely seal the gap between the chip-on-chip film and the first substrate, and then completely seal the first gold finger in the display panel and the second gold finger in the chip-on-chip film. In the case where the chip-on-chip film is subjected to reverse stress, no gap will be generated between the chip-on-chip film and the first substrate. This can prevent water vapor from invading the binding area, and then the first gold finger and the second gold finger bound and connected in the binding area are corroded, thereby ensuring the binding effect of the second gold finger and the first gold finger, and the yield of the display module is high.

[0109] In a second optional implementation, the process of forming the first protective glue may include: filling the first protective glue into the groove through the through hole on the substrate of the COF film, and coating the first protective glue on a side of the first portion away from the display panel. Thereafter, curing the first protective glue.

[0110] The first protective glue after curing may include a first colloid and a second colloid connected to each other. The first colloid may be located on a target surface of the first part away from the first substrate and in contact with the target surface. The second colloid is at least located on a side wall of the first part and in contact with the side wall of the first part and the first substrate.

[0111] The second colloid being located on the side wall of the first part may mean that the second target colloid in the second colloid is located in the through hole and the groove. Thus, the second target colloid can form a barrier wall to block water and oxygen, thereby preventing water and oxygen from invading the binding area from the gap between the COF film and the first substrate. Further, the first gold finger and the second gold finger connected in the binding area can be prevented from being corroded, thereby ensuring the yield of the display module.

[0112] In summary, an embodiment of the present application provides a method for preparing a display module, and the display module prepared by the method includes a display panel, a chip-on-chip film, and a first protective adhesive. The second gold finger in the chip-on-chip film can be bound and connected to the first gold finger in the binding area of ​​the display panel. The first protective adhesive wraps the first part of the chip-on-chip film including the second gold finger, so that the first protective adhesive can completely seal the second gold finger. Therefore, even if the chip-on-chip film is subjected to reaction stress, it will not cause a gap between the chip-on-chip film and the first substrate, which can prevent water vapor from invading the binding area, and prevent the first gold finger and the second gold finger bound and connected in the binding area from being corroded, thereby ensuring the binding effect of the second gold finger and the first gold finger and improving the yield of the display module.

[0113] Fig.15 is a schematic diagram of the structure of a display device provided in an embodiment of the present application. Fig.15 The display device may include: a power supply component 20 and a display module 10 as provided in the above embodiment. The power supply component 20 may be used to supply power to the display module 10.

[0114] In the embodiment of the present application, the display device can be an active-matrix organic light-emitting diode (AMOLED) display device, a passive-matrix organic light-emitting diode (PMOLED) display device, a quantum dot light emitting diode (QLED) display device, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame or a navigator, or any other product or component with a display function.

[0115] Since the display device can have substantially the same technical effects as the display panel described in the previous embodiment, the technical effects of the display device will not be repeatedly described here for the purpose of brevity.

[0116] The terms used in the implementation mode of the present application are only used to explain the embodiments of the present application, and are not intended to limit the present application. Unless otherwise defined, the technical terms or scientific terms used in the implementation mode of the present application should be the common meanings understood by people with ordinary skills in the field to which the present application belongs. The words "first", "second", "third" and similar words used in the patent application specification and claims of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantity limit, but indicate that there is at least one. Words such as "include" or "include" and similar words mean that the elements or objects appearing in front of "include" or "include" include the elements or objects listed after "include" or "include" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0117] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A display module, characterized in that: The display module (10) comprises: A display panel (101), the display panel (101) having a display area (101a) and a binding area (101b) located on one side of the display area (101a), the display panel (101) comprising a first substrate (1011) and a first gold finger (1012) located on the first substrate (1011) and located in the binding area (101b); A chip-on-chip film (102), the chip-on-chip film (102) comprising a substrate (1021), and a second gold finger (1022) located on the substrate (1021), the second gold finger (1022) being bound and connected to the first gold finger (1012), the substrate (1021) and the second gold finger (1022) constituting a first part (a1) and a second part (a2) of the chip-on-chip film (102) being connected, the first part (a1) comprising the second gold finger (1022) and a part of the substrate (1021), and the second part (a2) comprising another part of the substrate (1021); and a first protective glue (103), wherein the first protective glue (103) wraps the first part (a1) of the chip-on-film (102), the first protective glue (103) comprises a first colloid (1031) and a second colloid (1032) connected to each other, the first colloid (1031) is located on a target surface of the first part (a1) away from the first substrate (1011), and the first colloid (1031) is in contact with the target surface, the second colloid (1032) is at least located on a side wall of the first part (a1), and the second colloid (1032) is in contact with the side wall of the first part (a1) and the first substrate (1011), and the side wall comprises a side wall of the first part (a1) away from the display area (101a).

2. The display module according to claim 1, characterized in that: One end of the second part (a2) is connected to a surface of the first part (a1) away from the first substrate (1011), and a surface of the first part (a1) provided with the second gold finger (1022) intersects with a bearing surface of the second part (a2) provided with a device.

3. The display module according to claim 2, characterized in that: The first part (a1) is used to set the surface of the second gold finger (1022) to be perpendicular to the bearing surface of the second part (a2) for bearing the device.

4. The display module according to claim 2, characterized in that: The second colloid (1032) includes a first target colloid (1032a) located in the first portion (a1) away from the display area (101a), and the first target colloid (1032a) is in contact with the side wall of the first portion (a1) away from the display area (101a) and the surface of the first substrate (1011) facing the chip-on-film (102).

5. The display module according to claim 2, characterized in that: The base (1021) includes a second substrate (10211), a third substrate (10212) and a wiring layer (10213); The second substrate (10211) comprises a first sub-substrate (b1) constituting a first portion (a1) of the substrate (1021), and a second sub-substrate (b2) constituting a second portion (a2) of the substrate (1021), wherein a bearing surface of the first sub-substrate (b1) and a bearing surface of the second sub-substrate (b2) at least partially intersect each other; The third substrate (10212) comprises a third sub-substrate (c1) constituting a first portion (a1) of the substrate (1021), and a fourth sub-substrate (c2) constituting a second portion (a2) of the substrate (1021), wherein a bearing surface of the third sub-substrate (c1) and a bearing surface of the fourth sub-substrate (c2) at least partially intersect; The second sub-substrate (b2) and the fourth sub-substrate (c2) are arranged opposite to each other, and the routing layer (10213) is located between the second sub-substrate (b2) and the fourth sub-substrate (c2); the surface of the first sub-substrate (b1) away from the second sub-substrate (b2) and the surface of the third sub-substrate (c1) away from the fourth sub-substrate (c2) are coplanar, and the second gold finger (1022) is located on the surface of the first sub-substrate (b1) away from the second sub-substrate (b2) and the surface of the third sub-substrate (c1) away from the fourth sub-substrate (c2).

6. The display module according to claim 1, characterized in that: One end of the second part (a2) is connected to one end of the first part (a1), and the second part (a2) is away from the display area (101a) relative to the first part (a1), and the surface of the first part (a1) provided with the second gold finger (1022) is parallel to the bearing surface of the second part (a2) provided with the device; the first substrate (1011) has a groove (1011a) in which the first gold finger (1012) is away from the display area (101a), and the base (1021) has a through hole (1021a) corresponding to the groove (1011a), and the through hole (1021a) can divide the chip-on-film (102) into the first part (a1) and the second part (a2); The second colloid (1032) includes a second target colloid (1032b) located in the through hole (1021a) and the groove (1011a), and the second target colloid (1032b) is in contact with the inner wall of the through hole (1021a) and the inner wall of the groove (1011a).

7. The display module according to claim 6, characterized in that: The orthographic projection of the through hole (1021a) on the first substrate (1011) is at least partially located in the groove (1011a), so that the through hole (1021a) and the groove (1011a) are connected.

8. The display module according to claim 6, characterized in that: The length of the groove (1011a) along the first direction (X) is greater than the length of the second gold finger (1022) along the first direction (X), and the area where the second gold finger (1022) is located in the first direction (X) is located within the area where the groove (1011a) is located in the first direction (X); The first direction (X) is perpendicular to the arrangement direction of the first part (a1) and the second part (a2).

9. The display module according to claim 6, characterized in that: The length of the groove (1011a) along the second direction (Y) is greater than 30 micrometers, and the depth of the groove (1011a) is greater than one quarter of the thickness of the first substrate (1011) and less than one third of the thickness of the first substrate (1011); The second direction (Y) is parallel to the arrangement direction of the first part (a1) and the second part (a2).

10. The display module according to any one of claims 6 to 9, characterized in that: The display module further comprises: a second protective glue (105); The second protective glue (105) is in contact with the surface of the chip-on-chip film (102) facing the first substrate (1011) and the side wall of the first substrate (1011) away from the display area (101a), and the orthographic projection of the second protective glue (105) on the chip-on-chip film (102) is located in the second part (a2).

11. The display module according to any one of claims 1 to 9, characterized in that: The display module (10) further comprises: conductive glue; The conductive adhesive is located between the first gold finger (1012) and the second gold finger (1022), and is used to connect the first gold finger (1012) and the second gold finger (1022).

12. A method for preparing a display module, characterized in that: The method comprises: A display panel (101) is provided, the display panel (101) having a display area (101a) and a binding area (101b) located on one side of the display area (101a), the display panel (101) comprising a first substrate (1011) and a first gold finger (1012) located on the first substrate (1011) and located in the binding area (101b); A chip-on-cover film (102) is provided, the chip-on-cover film (102) comprising a substrate (1021) and a second gold finger (1022) located on the substrate (1021), the second gold finger (1022) being bound and connected to the first gold finger (1012), the substrate (1021) and the second gold finger (1022) constituting a first part (a1) and a second part (a2) of the chip-on-cover film (102) being connected, the first part (a1) comprising the second gold finger (1022) and a part of the substrate (1021), and the second part (a2) comprising another part of the substrate (1021); Binding and connecting the second golden finger (1022) and the first golden finger (1012); A first protective glue (103) is formed so that the first protective glue (103) wraps the first part (a1), the first protective glue (103) comprises a first colloid (1031) and a second colloid (1032) connected to each other, the first colloid (1031) is located on a target surface of the first part (a1) away from the first substrate (1011), and the first colloid (1031) is in contact with the target surface, the second colloid (1032) is at least located on a side wall of the first part (a1), and the second colloid (1032) is in contact with the side wall of the first part (a1) and the first substrate (1011), and the side wall comprises a side wall of the first part (a1) away from the display area (101a).

13. The method according to claim 12, characterized in that One end of the second part (a2) is connected to a surface of the first part (a1) away from the first substrate (1011), and a surface of the first part (a1) provided with the second gold finger (1022) intersects with a bearing surface of the second part (a2) provided with a device; The first golden finger (1012) and the second golden finger (1022) are bound and connected, including: The first pressing head is sleeved on the outside of the second part (a2), and pressure is applied from the side of the first part (a1) away from the display panel (101) to bind and connect the first gold finger (1012) and the second gold finger (1022), wherein the first pressing head has a pressing head through hole, and the pressing head through hole is used for the second part (a2) to pass through; Alternatively, the first golden finger (1012) and the second golden finger (1022) are bound and connected, including: At least a second pressing head and a third pressing head are used to apply pressure from the side of the first part (a1) away from the display panel (101) in sequence to bind and connect the first gold finger (1012) and the second gold finger (1022), and the pressing position of the third pressing head is different from the pressing position of the second pressing head.

14. The preparation method according to claim 12, characterized in that: One end of the second part (a2) is connected to one end of the first part (a1), and the second part (a2) is far away from the display area (101a) relative to the first part (a1), and the surface of the first part (a1) provided with the second gold finger (1022) is parallel to the bearing surface of the second part (a2) provided with the device; the first substrate (1011) has a groove (1011a) in which the first gold finger (1012) is far away from the display area (101a), the base (1021) has a through hole (1021a) corresponding to the groove (1011a), and the through hole (1021a) can divide the chip-on-film (102) into the first part (a1) and the second part (a2); the forming of the first protective glue (103) comprises: Filling the first protective glue (103) into the groove (1011a) through the through hole (1021a), and coating the first protective glue (103) on a side of the first part (a1) away from the display panel (101); The first protective glue (103) is cured.

15. A display device, characterized in that: The display device comprises: a power supply component (20) and a display module (10) according to any one of claims 1 to 11; The power supply component (20) is used to supply power to the display module (10).

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