Conveying device

Abstract

The conveying device includes: a plate-shaped main body opposite to a plate-shaped component; a plurality of recesses formed in the main body opposite to the outer peripheral portion of the plate-shaped component; a plurality of ejection channels formed inside the main body; and a plurality of limiting portions contacting the plate-shaped component and formed in the main body to limit lateral movement of the plate-shaped component. The plurality of recesses are respectively connected to any one of the ejection channels, and a swirling flow is formed within the recess by fluid supplied from the connected ejection channels. Furthermore, a portion of the opening of each of the plurality of recesses, and a portion not covered by the plate-shaped component, is covered by any one of the limiting portions.

Description

Technical Field

[0001] This invention relates to a conveying device. Background Technology

[0002] Conventionally, devices for non-contact transport of semiconductor wafers have been used. For example, Patent Document 1 describes a device for non-contact transport of semiconductor wafers using Bernoulli's principle. In this device, a swirling flow is generated in a cylindrical chamber open on the lower surface of the device, and the semiconductor wafer is attracted by the negative pressure at the center of this swirling flow. Furthermore, by maintaining a certain distance between the fluid flowing out of the cylindrical chamber and the device and the semiconductor wafer, non-contact transport of the semiconductor wafer is possible.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-51260 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The present invention was made in view of the above-described technology, and its object is to reduce damage to the surface of the plate-shaped component that is being transported.

[0008] Methods for solving problems

[0009] To address the aforementioned issues, the present invention provides a conveying device for attracting and conveying a plate-shaped component. The conveying device comprises: a plate-shaped body opposite to the plate-shaped component; a plurality of recesses formed in the body opposite to the outer peripheral portion of the plate-shaped component; a plurality of ejection paths formed inside the body; and a plurality of limiting portions contacting the plate-shaped component and formed in the body to limit lateral movement of the plate-shaped component. Each of the plurality of recesses communicates with any one of the plurality of ejection paths, and a swirling flow is formed within the recess by fluid supplied from the communicating ejection paths. A portion of the opening of each of the plurality of recesses, and a portion not covered by the plate-shaped component, is covered by any one of the plurality of limiting portions.

[0010] In a preferred embodiment, the plurality of recesses are formed opposite to each other on one side and the other side of the body, and the plurality of ejection paths are respectively formed to allow fluid flowing out of the recesses communicating with the ejection paths to flow in a direction from the outside of the plate-shaped member toward the inside.

[0011] In a more preferred embodiment, each of the plurality of restricting portions forms a discharge path between itself and the body, the discharge path being used to discharge fluid flowing from the recess covered by the restricting portion in a direction from the inside to the outside of the plate-shaped member.

[0012] Invention Effects

[0013] According to the present invention, damage to the surface of the plate-shaped component that is being transported can be reduced. Attached Figure Description

[0014] Figure 1 This is a top view of the chip transporter 1.

[0015] Figure 2 This is a bottom view of the chip transporter 1.

[0016] Figure 3 This is a side view of the chip transporter 1.

[0017] Figure 4 This is a top view of blade 11.

[0018] Figure 5 This is a bottom view of blade 11.

[0019] Figure 6 This is a top view of the front end of arm 111A.

[0020] Figure 7 This is a bottom view of the front end of the arm 111A with the seal 12 installed.

[0021] Figure 8 yes Figure 7 The longitudinal sectional view of the recess 15 shown.

[0022] Figure 9 This is a top view of guide component 14.

[0023] Figure 10 This is a bottom view of guide component 14.

[0024] Figure 11 This is a side view of guide component 14.

[0025] Figure 12 This is a 3D view of guide component 14.

[0026] Figure 13 yes Figure 2 A bottom view of the front end of the arm 111A shown.

[0027] Figure 14 Observe in the direction indicated by arrow A2 Figure 13 Side view of the front end of the arm 111A shown.

[0028] Figure 15 Observe in the direction indicated by arrow A3. Figure 13 Side view of the front end of the arm 111A shown.

[0029] Figure 16 This is a diagram showing the flow of air exiting from the recess 15.

[0030] Figure 17 This is a top view of the chip transporter 2.

[0031] Figure 18 This is a bottom view of the chip transporter 2.

[0032] Figure 19 This is a side view of the chip transporter 2.

[0033] Figure 20 This is a top view of blade 21.

[0034] Figure 21 This is a bottom view of blade 21.

[0035] Figure 22 This is a top view of the leading end of blade 21.

[0036] Figure 23 This is a bottom view of the front end of the blade 21 with the seal 22 installed.

[0037] Figure 24 yes Figure 23 The longitudinal sectional view of the recess 26 shown.

[0038] Figure 25 This is a top view of guide component 23.

[0039] Figure 26 This is a bottom view of guide component 23.

[0040] Figure 27 This is a side view of guide component 23.

[0041] Figure 28 This is a 3D view of guide component 23.

[0042] Figure 29 yes Figure 18 The top view of the front end of the blade 21 shown.

[0043] Figure 30 Observe in the direction indicated by arrow A5. Figure 29 Side view of the front end of the blade 21 shown.

[0044] Figure 31 Observe in the direction indicated by arrow A6. Figure 18 Side view of the front end of the blade 21 shown.

[0045] Figure 32 This is a diagram showing the flow of air exiting from the recess 26.

[0046] Figure 33 This is a top view of the chip transporter 3.

[0047] Figure 34 This is a bottom view of the chip transporter 3.

[0048] Figure 35 The figure shows a modified example of the through holes 113 and 211.

[0049] Figure 36 The figure shows a modified example of the through holes 113 and 211.

[0050] Figure 37 The figure shows a modified example of the through holes 113 and 211.

[0051] Figure 38 This is a bottom view of an example of buffer 41.

[0052] Figure 39 This is a side view of an example of buffer 41. Detailed Implementation

[0053] 1. First Implementation Method

[0054] The wafer transporter 1 of the first embodiment of the present invention will be described with reference to the accompanying drawings.

[0055] Figure 1 This is a top view of the chip transporter 1. Figure 2 This is a bottom view of the chip transporter 1. Figure 3 These are side views of the wafer conveyor 1. The wafer conveyor 1 shown in these figures is a device used to attract and convey TAIKO (registered trademark) wafers W using Bernoulli's principle. Here, TAIKO wafer W refers to a wafer obtained by grinding the wafer surface to thin it, leaving only the outer periphery (approximately 3 mm) of the wafer and grinding only the inner side. In the following description, this TAIKO wafer W will be simply referred to as "wafer W". The wafer conveyor 1 is fixed to the front end of a robotic arm for use.

[0056] The wafer transporter 1 has a paddle 11, a seal 12, a sensor 13, and four guides 14. The components are described below.

[0057] Figure 4 This is a top view of blade 11. Figure 5These are bottom views of the blade 11. The blade 11 shown in these figures is a bifurcated plate-like body. The blade 11 consists of a pair of arms 111A and 111B (hereinafter referred to as "arms 111" unless otherwise specified in the following description) and a connecting part 112.

[0058] A pair of arms 111A and 111B each have a generally rectangular shape, with the edges of their front and rear ends formed into arcs. Furthermore, each of the arms 111A and 111B has a circular through-hole 113 facing each other at its front and rear ends, separated by its central portion. The total of four through-holes 113 of the pair of arms 111A and 111B are arranged on the same circumference, facing the outer periphery of the wafer W to be transported. One opening of each through-hole 113 is blocked by a seal 12, thereby forming a recess 15, which will be described later.

[0059] A pair of ejection grooves 114 communicating with the through hole 113 are formed on the upper surface of the pair of arms 111A and 111B. Figure 6 This is a top view of the front end of the arm 111A. As illustrated in this figure, a pair of ejection grooves 114 extend tangentially relative to the circumference of the through hole 113. Furthermore, the pair of ejection grooves 114 are arranged symmetrically with respect to the center point of the through hole 113. These pair of ejection grooves 114 are covered by a seal 12, thereby forming a pair of ejection paths 16, which will be described later.

[0060] Next, as Figure 4 and Figure 5 As shown, the connecting part 112 has a generally T-shaped shape and connects a pair of arms 111A and 111B.

[0061] like Figure 4 As shown, a double-forked supply groove 115 is formed on the upper surface of the connecting portion 112 and the pair of arms 111A, 111B. This supply groove 115 is covered by a seal 12, thereby forming a supply path 17 (not shown). This supply path 17 allows the supply port 121 (described later) to be accessed. Figure 1 It is connected to each ejection path 16 and guides the air supplied via the supply port 121 to each ejection path 16.

[0062] The above is an explanation of blade 11.

[0063] Next, the seal 12 will be described. For example... Figure 1As shown, the seal 12 is a double-forked plate. The seal 12 is overlapped and mounted on the upper surface of the blade 11. More specifically, the seal 12 is mounted to cover the through hole 113, ejection groove 114, and supply groove 115 of the blade 11. By covering the through hole 113, ejection groove 114, and supply groove 115 of the blade 11 with the seal 12, the aforementioned recess 15, ejection path 16, and supply path 17 are formed. The seal 12, together with the blade 11, forms the main body of the device.

[0064] Figure 7 This is a bottom view of the front end of the arm 111A on which the seal 12 is installed. Figure 8 yes Figure 7 The figure shows a longitudinal sectional view of the recess 15. As illustrated in these figures, the recess 15 communicates with a pair of ejection passages 16. The pair of ejection passages 16 extend tangentially with respect to the circumference of the recess 15. Furthermore, the pair of ejection passages 16 are arranged symmetrically with respect to the center point of the recess 15. The pair of ejection passages 16 are passages for discharging air into the recess 15.

[0065] When air is ejected into the recess 15 through the pair of ejection paths 16, the ejected air is guided by the inner wall of the recess 15 to form a swirling flow, and then flows out of the recess 15. At this time, if a wafer W is present at a position opposite to the recess 15, the inflow of external air into the recess 15 is restricted by the wafer W. In this state, centrifugal force and entrapment are generated in the swirling flow, thereby reducing the density of fluid molecules per unit volume in the center of the swirling flow. That is, a negative pressure is generated in the center of the swirling flow. As a result, the wafer W is pressed and attracted to the recess 15 side by the surrounding air. However, as the wafer W approaches the recess 15, the amount of air flowing out of the recess 15 is restricted. As a result, the negative pressure generated in the center of the swirling flow decreases. Therefore, the attracted wafer W is held at a certain distance from the recess 15.

[0066] like Figure 7 As illustrated, a pair of ejector paths 16 are configured to allow air flowing from the recess 15 (refer to arrow A1) to flow along the length of the arm 111. Specifically, the direction in which the pair of ejector paths 16 extend is configured to form an angle of approximately 45 degrees with the length direction of the arm 111. Furthermore, one of the pair of ejector paths 16 is configured to allow the outflowing air to flow toward the front end of the arm 111, and the other is configured to allow the outflowing air to flow toward the rear end of the arm 111.

[0067] in addition, Figure 7 The arrow A1 shown indicates the direction of the resultant vector of the velocity vectors of the fluid molecules that are ejected from one of the pair of ejection paths 16 and flow out of the recess 15.

[0068] Furthermore, the direction of the air flowing out of the recess 15 varies depending on the flow rate of the air ejected into the recess 15. Therefore, the direction of the pair of ejection paths 16 is adjusted according to the optimal flow rate of the air ejected into the recess 15 so that the outflowing air flows toward the front or rear end of the arm 111.

[0069] Return to the description of seal 12. (See below.) Figure 1 As shown, the seal 12 has a circular supply port 121. The supply port 121 is connected to a tube extending from an air pump (not shown), through which air is supplied from the air pump to the wafer transporter 1.

[0070] The above is a description of seal 12.

[0071] Next, sensor 13 will be described. For example... Figure 2 As shown, sensor 13 is mounted on the bottom surface of blade 11. Sensor 13 is a proximity sensor used to detect the presence or absence of wafer W.

[0072] Next, the four guide components 14 will be explained. Figure 9 This is a top view of guide component 14. Figure 10 This is a bottom view of guide component 14. Figure 11 This is a side view of guide component 14. Figure 12 These are perspective views of the guide 14. The guide 14 shown in these figures is a plate-like body bent into an arc shape. The guide 14 consists of a guide body 141, an inclined surface 142, two protrusions 143, and a discharge groove 144.

[0073] The guide body 141 is a plate-shaped body bent into an arc.

[0074] An inclined surface 142 is formed on the inner periphery of the guide body 141. The inclined surface 142 and the two protrusions 143 form a ramp with two steps.

[0075] The two protrusions 143 are generally rectangular plate-like bodies. These two protrusions 143 are formed to extend from the inner peripheral side of the guide body 141 along the short side of the guide body 141, and the thickness of each protrusion 143 gradually decreases as it moves away from the guide body 141. The two protrusions 143 are arranged with a certain interval between them.

[0076] The discharge groove 144 is a groove with a cross-section shaped like the character "コ". The discharge groove 144 is formed on the upper surface of the guide body 141 along the short side of the guide body 141.

[0077] like Figure 2 As shown, each guide 14 is mounted on the bottom surface of the front end and the bottom surface of the rear end of the arm 111. Figure 13 yes Figure 2A bottom view of the front end of the arm 111A shown. Figure 14 Observe in the direction indicated by arrow A2 Figure 13 Side view of the front end of the arm 111A shown. Figure 15 Observe in the direction indicated by arrow A3. Figure 13 Side view of the front end of the arm 111A shown.

[0078] As illustrated in these figures, the guide body 141 of the guide 14 mounted on the arm 111 covers a portion of the recess 15. Specifically, the guide body 141 covers the portion of the opening of the recess 15 that is not covered by the wafer W to be transported. Furthermore, the ramp formed by the inclined surface 142 of the guide 14 and the two protrusions 143 makes line contact with the outer periphery of the wafer W to be transported, restricting the horizontal movement of the wafer W. Additionally, the two protrusions 143 are positioned opposite each other across the recess 15, guiding a portion of the air flowing out of the recess 15 towards the center of the arm 111. Furthermore, the discharge groove 144 of the guide 14 forms a discharge path 18 between itself and the bottom surface of the arm 111. This discharge path 18 is a rectangular passage extending along the length of the arm 111. This discharge path 18 is a passage for releasing a portion of the air flowing out of the recess 15 to the outside of the device. In other words, the discharge path 18 is a passage for discharging a portion of the air flowing out of the recess 15 in a direction from the inside to the outside of the wafer W.

[0079] The above is an explanation of the four guide components 14.

[0080] In the chip transporter 1 described above, as follows Figure 2 As shown, the recess 15 is configured to face the outer peripheral portion of the wafer W, which is the object to be transported, and only attracts the outer peripheral portion of the wafer W. The rigidity of the outer peripheral portion of the wafer W attracted by the recess 15 is higher than that of its inner side. Therefore, damage to the wafer W caused by the attraction of the recess 15 can be reduced.

[0081] Additionally, in the chip transporter 1, such as Figure 2 As shown, the portion of the opening in the recess 15 that is not covered by the wafer W to be transported is covered by the guide 14. In this way, by covering the portion not covered by the wafer W with the guide 14, the inflow of external air into the recess 15 is restricted. As a result, the decrease in negative pressure within the recess 15 caused by the inflow of external air can be suppressed.

[0082] Additionally, in the chip transporter 1, such as Figure 13As illustrated, a discharge passage 18 is formed relative to the recess 15. As described above, the discharge passage 18 is a pathway for releasing a portion of the air flowing out of the recess 15 to the outside of the device. By releasing the air out of the device through the discharge passage 18, it is possible to prevent the air from stagnating near the recess 15, thereby suppressing the decrease in negative pressure.

[0083] Furthermore, in this wafer transporter 1, a portion of the air flowing out of the recess 15 flows toward the center of the arm 111 along its length. In other words, a portion of the air flowing out of the recess 15 flows in a direction from the outside of the wafer W toward the inside. Figure 16 This diagram illustrates the flow of air exiting the recess 15. The arrows in the diagram indicate the flow of air exiting the recess 15. More specifically, the arrows indicate the direction of the resultant vector of the velocity vectors of the fluid molecules ejected from the ejection path 16 and flowing out of the recess 15. As shown in the diagram, a portion of the air exiting the recess 15 flows towards the center of the arm 111. Furthermore, it collides with air flowing in the opposite direction, creating turbulence. This turbulence presses down on the wafer W, the object being transported, thereby preventing the wafer W from contacting the bottom surface of the arm 111.

[0084] 2. Second Implementation Method

[0085] The wafer transporter 2 of the second embodiment of the present invention will be described with reference to the accompanying drawings.

[0086] Figure 17 This is a top view of the chip transporter 2. Figure 18 This is a bottom view of the chip transporter 2. Figure 19 These figures show a side view of the wafer conveyor 2. The wafer conveyor 2 shown is a device used to attract and transport wafers W using Bernoulli's principle. The wafer conveyor 2 is used by an operator holding the handle 25.

[0087] The wafer transporter 2 has a paddle 21, a seal 22, two guides 23, eight buffers 24, and a handle 25. The following describes each component.

[0088] Figure 20 This is a top view of blade 21. Figure 21 These are bottom views of the blade 21. The blade 21 shown in these figures is a generally rectangular plate-like body. The blade 21 has a pair of circular through holes 211 facing each other across its central portion at its front and rear ends. A total of four through holes 211 are arranged on the same circumference, facing the outer peripheral portion of the wafer W to be transported. One side of the opening of each through hole 211 is blocked by a seal 22, thereby forming the recess 26 described later.

[0089] A pair of ejection grooves 212 communicating with the through hole 211 are formed on the upper surface of the blade 21. Figure 22 This is a top view of the leading end of the blade 21. As illustrated in this figure, a pair of ejection grooves 212 extend tangentially relative to the circumference of the through hole 211. Furthermore, the pair of ejection grooves 212 are arranged symmetrically with respect to the center point of the through hole 211. These pair of ejection grooves 212 are covered by a seal 22, thereby forming a pair of ejection paths 27, which will be described later.

[0090] In addition, such as Figure 20 As shown, a supply groove 213 is formed on the upper surface of the blade 21. The supply groove 213 is covered by a seal 22, thereby forming a supply path 28 (not shown). The supply path 28 connects the supply port 221 (not shown) described later with each ejection path 27, guiding the air supplied via the supply port 221 to each ejection path 27.

[0091] The above is an explanation of blade 21.

[0092] Next, the seal 22 will be described. For example... Figure 17 As shown, the seal 22 is a generally rectangular plate. The seal 22 is overlapped and mounted on the upper surface of the blade 21. More specifically, the seal 22 is mounted to cover the through hole 211, ejection groove 212, and supply groove 213 of the blade 21. By covering the through hole 211, ejection groove 212, and supply groove 213 of the blade 21 with the seal 22, the aforementioned recess 26, ejection path 27, and supply path 28 are formed. The seal 22, together with the blade 21, forms the main body of the device.

[0093] Figure 23 This is a bottom view of the front end of the blade 21 on which the seal 22 is installed. Figure 24 yes Figure 23 The figure shows a longitudinal sectional view of the recess 26. As illustrated in these figures, the recess 26 communicates with a pair of ejection passages 27. The pair of ejection passages 27 extend tangentially with respect to the circumference of the recess 26. Furthermore, the pair of ejection passages 27 are arranged symmetrically with respect to the center point of the recess 26. The pair of ejection passages 27 are pathways for ejecting air into the recess 26.

[0094] When air is ejected into the recess 26 through the pair of ejection paths 27, the ejected air is guided by the inner wall of the recess 26 to form a swirling flow, and then flows out of the recess 26. At this time, if a wafer W is present at a position opposite to the recess 26, the inflow of external air into the recess 26 is restricted by the wafer W. In this state, centrifugal force and entrapment are generated in the swirling flow, thereby reducing the density of fluid molecules per unit volume in the center of the swirling flow. That is, a negative pressure is generated in the center of the swirling flow. As a result, the wafer W is pressed and attracted to the recess 26 by the surrounding air. However, as the wafer W approaches the recess 26, the amount of air flowing out of the recess 26 is restricted. As a result, the negative pressure generated in the center of the swirling flow weakens. Therefore, the attracted wafer W is held at a certain distance from the recess 26.

[0095] like Figure 23 As illustrated, a pair of ejector paths 27 are configured to allow air exiting from the recess 26 (refer to arrow A4) to flow along the length of the blade 21. Specifically, the direction in which the pair of ejector paths 27 extend is configured to form an angle of approximately 45 degrees with the length of the blade 21. Furthermore, one of the pair of ejector paths 27 is configured to allow the outgoing air to flow toward the leading edge of the blade 21, while the other is configured to allow the outgoing air to flow toward the trailing edge of the blade 21.

[0096] in addition, Figure 23 Arrow A4 indicates the direction of the resultant vector of the velocity vectors of fluid molecules ejected from one of the pair of ejection paths 27 and flowing out of the recess 26.

[0097] Furthermore, the direction of the air flowing out of the recess 26 varies depending on the flow rate of the air ejected into the recess 26. Therefore, the direction of the pair of ejection paths 27 is adjusted according to the optimal flow rate of the air ejected into the recess 26 so that the outflowing air flows toward the front or rear end of the blade 21.

[0098] Returning to the description of seal 22. Seal 22 has a circular outlet 221 (not shown) at its rear end. This outlet 221 communicates with a fluid passage (not shown) formed inside the handle 25.

[0099] The above is a description of seal 22.

[0100] Next, the two guide components 23 will be explained. Figure 25 This is a top view of guide component 23. Figure 26 This is a bottom view of guide component 23. Figure 27 This is a side view of guide component 23. Figure 28These are perspective views of guide 23. The guide 23 shown in these figures is a plate-like body bent into an arc shape. The guide 23 consists of a guide body 231, an inclined surface 232, and two discharge grooves 233.

[0101] The guide body 231 is a plate-shaped body bent into an arc.

[0102] Inclined surface 232 is formed on the inner periphery of guide body 231.

[0103] The two discharge grooves 233 are grooves with a cross-section in the shape of the character "コ". These two discharge grooves 233 are formed on the upper surface of the guide body 231 along the short side of the guide body 231.

[0104] like Figure 18 As shown, each guide 23 is installed on the bottom surface of the front end and the bottom surface of the rear end of the blade 21. Figure 29 yes Figure 18 The top view of the front end of the blade 21 shown. Figure 30 Observe in the direction indicated by arrow A5. Figure 29 Side view of the front end of the blade 21 shown. Figure 31 Observe in the direction indicated by arrow A6. Figure 18 Side view of the front end of the blade 21 shown.

[0105] As illustrated in these figures, the guide body 231 of the guide 23 mounted on the blade 21 covers a portion of the recess 26. Specifically, the guide body 231 covers the portion of the opening of the recess 26 that is not covered by the wafer W to be transported. Furthermore, the inner peripheral side of the guide body 231 contacts the outer peripheral portion of the wafer W to be transported, restricting the horizontal movement of the wafer W. Additionally, the two discharge grooves 233 of the guide 23 form two discharge paths 29 between them and the bottom surface of the blade 21. These two discharge paths 29 are rectangular passages extending along the length of the blade 21. These two discharge paths 29 are passages for releasing a portion of the air flowing from the recess 26 to the outside of the device. In other words, these two discharge paths 29 are passages for discharging a portion of the air flowing from the recess 26 in a direction from the inside to the outside of the wafer W.

[0106] The above is an explanation of the two guide components 23.

[0107] Next, the eight cushioning elements 24 will be described. Each of the eight cushioning elements 24 is a roughly rectangular resin plate-like body. (Example...) Figure 29As illustrated, four buffers 24 are mounted along the inner side of one guide member 23. These four buffers 24 are arranged with two buffers 24 facing each other across a recess 26, guiding a portion of the air flowing from the recess 26 toward the center of the blade 21. Additionally, as... Figure 30 As illustrated, the four buffers 24 contact the outer periphery of the wafer W, using friction to restrict the horizontal movement of the wafer W.

[0108] Next, the handle 25 will be described. The handle 25 is a cylindrical rod. One end of the handle 25 is connected to the upper surface of the rear end of the blade 21, and the other end of the handle 25 is connected to a pipe extending from an air pump (not shown). Air is supplied from the air pump to the supply path 28 via the handle 25 and the aforementioned supply port 221.

[0109] In the chip transporter 2 described above, as follows Figure 18 As shown, the recess 26 is configured to face the outer peripheral portion of the wafer W, which is the object to be transported, and only attracts the outer peripheral portion of the wafer W. The rigidity of the outer peripheral portion of the wafer W attracted by the recess 26 is higher than that of its inner side. Therefore, damage to the wafer W caused by the attraction of the recess 26 can be reduced.

[0110] Additionally, in the chip conveyor 2, such as Figure 18 As shown, the portion of the opening of the recess 26 that is not covered by the wafer W to be transported is covered by the guide 23. In this way, by covering the portion not covered by the wafer W with the guide 23, the inflow of external air into the recess 26 is restricted. As a result, the decrease in negative pressure within the recess 26 caused by the inflow of external air can be suppressed.

[0111] Additionally, in the chip conveyor 2, such as Figure 29 As illustrated, a discharge passage 29 is formed relative to each recess 26. As described above, the discharge passage 29 is a passage for releasing a portion of the air flowing out of the recess 26 to the outside of the device. By releasing the air out of the device through the discharge passage 29, it is possible to prevent the air from stagnating near the recess 26, thereby suppressing the decrease in negative pressure.

[0112] Furthermore, in this wafer conveyor 2, a portion of the air flowing out of the recess 26 flows toward the center of the blade 21 along its length. In other words, a portion of the air flowing out of the recess 26 flows in a direction from the outside of the wafer W toward the inside. Figure 32This diagram illustrates the flow of air exiting the recess 26. The arrows in the diagram indicate the flow of air exiting the recess 26. More specifically, the arrows indicate the direction of the resultant vector of the velocity vectors of the fluid molecules ejected from the ejection path 27 and flowing out of the recess 26. As shown in the diagram, a portion of the air exiting the recess 26 flows towards the center of the blade 21. Furthermore, it collides with air flowing in the opposite direction, creating turbulence. This turbulence presses down on the wafer W, the object being transported, thereby preventing the wafer W from contacting the bottom surface of the blade 21.

[0113] 3. Variations

[0114] The above-described embodiments can also be modified as follows. Furthermore, the following modifications can be combined with each other.

[0115] 3-1. Variation Example 1

[0116] The wafer transporter 2 of the second embodiment described above has I-shaped blades 21 and seals 22, but the shape of these blades 21 and seals 22 can also be modified to a cross shape. Figure 33 This is a top view of a wafer transporter 3 with cross-shaped blades 31 and seals 32 instead of I-shaped blades 21 and seals 22. Figure 34 This is a bottom view of the wafer transporter 3. As shown in these figures, with the main body of the device in a cross shape, there is a pair of recesses 26, four ejection paths 27 (not shown), a guide 23, and four buffers 24 at the ends of the main body.

[0117] 3-2. Variation Example 2

[0118] The shapes of the through holes 113 and 211 in the above embodiments are not limited to circles, such as... Figure 35 As shown, it can also be oblong. Or, as... Figure 36 and Figure 37 As shown, it can also be a rhombus shape.

[0119] 3-3. Variation Example 3

[0120] The number of guides 14, recesses 15, ejection paths 16, and discharge paths 18 in the wafer transporter 1 of the first embodiment described above can be appropriately varied according to the size of the wafer W to be transported. Similarly, the number of guides 23, recesses 26, ejection paths 27, and discharge paths 29 in the wafer transporter 2 of the second embodiment described above can also be appropriately varied according to the size of the wafer W to be transported.

[0121] 3-4. Variation Example 4

[0122] The blade 11, seal 12, and four guides 14 of the wafer transporter 1 of the first embodiment described above can also be integrally formed. Similarly, the blade 21, seal 22, two guides 23, and eight buffers 24 of the wafer transporter 2 of the second embodiment described above can also be integrally formed.

[0123] 3-5. Variation Example 5

[0124] The objects transported by the wafer transporters 1 and 2 in the above embodiments are not limited to TAIKO wafers W, but can also be other plate-shaped components.

[0125] 3-6. Variation Example 6

[0126] In the above embodiments, the fluid used to transport the wafer W is not limited to gas, but can also be a liquid.

[0127] 3-7. Variation Example 7

[0128] In the wafer transporter 2 of the second embodiment described above, the eight buffers 24 can be omitted and only two guides 23 can be used to restrict the horizontal movement of the wafer W.

[0129] 3-8. Variation Example 8

[0130] In the wafer transporter 2 of the second embodiment described above, a guide 23 covers a portion of the opening of the recess 26. Alternatively, in this wafer transporter 2, a buffer 41 for restricting the horizontal movement of the wafer W may be used to cover a portion of the opening of the recess 26 instead of the guide 23. Figure 38 This is a bottom view of an example of the buffer 41. Figure 39 This is a side view of an example of the buffer 41. The buffer 41 shown in these figures is a resin plate-shaped body bent into an arc. The buffer 41 consists of a buffer body 411, two protrusions 412, and a discharge groove 413.

[0131] The main body of the buffer component 411 is a plate-shaped body bent into an arc.

[0132] The two protrusions 412 are generally rectangular plate-shaped bodies. The two protrusions 412 are formed to extend from the inner peripheral side of the buffer body 411 along the short side of the buffer body 411.

[0133] The discharge groove 413 is a groove with a cross-section shaped like the character "コ". The discharge groove 413 is formed on the upper surface of the buffer body 411 along the short side of the buffer body 411.

[0134] The buffer body 411 of the buffer member 41 mounted on the blade 21 covers a portion of the recess 26. Specifically, the buffer body 411 covers the portion of the opening of the recess 26 that is not covered by the wafer W, which is being transported. Furthermore, two protrusions 412 of the buffer member 41 contact the outer periphery of the wafer W, using friction to restrict the horizontal movement of the wafer W. Moreover, the two protrusions 412 are positioned opposite each other across the recess 26, guiding a portion of the air flowing from the recess 26 towards the center of the blade 21. Additionally, a discharge groove 413 of the buffer member 41 forms a discharge path 42 between itself and the bottom surface of the blade 21. This discharge path 42 is a rectangular passage extending along the length of the blade 21. This discharge path 42 is a passage for releasing a portion of the air flowing from the recess 26 to the outside of the device.

[0135] 3-9. Variation Example 9

[0136] The shapes of the aforementioned guide bodies 141 and 231 are not limited to curved arc shapes, but can be appropriately changed according to the shape of the plate-shaped component being transported.

[0137] 3-10. Variation Example 10

[0138] Alternatively, one or more grooves may be formed on the bottom surface of the arm portion 111 in the first embodiment described above to guide a portion of the air flowing out of the recess 15 toward the center of the arm portion 111 in the length direction. The air guided by the one or more grooves flows between the arm portion 111 and the wafer W, causing the wafer W to separate from the arm portion 111.

[0139] Alternatively, one or more grooves may be formed on the bottom surface of the blade 31 in the second embodiment described above to guide a portion of the air flowing out of the recess 26 toward the center of the blade 31 in the longitudinal direction. The air guided by the one or more grooves flows between the blade 31 and the wafer W, causing the wafer W to separate from the blade 31.

[0140] Label Explanation

[0141] 1, 2, 3: Wafer transporter; 11, 21, 31: Blades; 12, 22, 32: Seals; 13: Sensor; 14, 23: Guides; 15, 26: Recesses; 16, 27: Ejection paths; 17, 28: Supply paths; 18, 29, 42: Discharge paths; 24, 41: Buffers; 25: Handles; 111A, 111B: Arms; 112: Connectors; 113, 211: Through holes; 114, 212: Ejection slots; 115, 213: Supply slots; 121, 221: Supply ports; 141, 231: Guide body; 142, 232: Inclined surfaces; 143, 412: Protrusions; 144, 233, 413: Discharge slots; 411: Buffer body; W: Wafer.

Claims

1. A conveying device for attracting and conveying plate-shaped components, characterized in that, The conveying device has the following features: A plate-shaped main body, which is opposite to the plate-shaped component; Multiple recesses are formed in the body in a manner that opposes the outer peripheral portion of the plate-shaped member; Multiple ejection paths are formed inside the main body; as well as Multiple limiting portions are formed on the body in a manner that contacts the plate-shaped member to limit lateral movement of the plate-shaped member. The plurality of recesses are each connected to any one of the plurality of ejection paths, and a swirling flow is formed within the recess by the fluid supplied from the connected ejection path. A portion of the opening of each of the plurality of recesses, and a portion not covered by the plate-like member, is covered by any of the plurality of limiting portions.

2. The conveying device according to claim 1, characterized in that, The plurality of recesses are formed in such a manner that they are opposite each other on one side and the other side of the main body. The plurality of ejection paths are respectively configured to allow fluid flowing out of the recess connected to the ejection path to flow in a direction from the outside of the plate-shaped member toward the inside.

3. The conveying device according to claim 1 or 2, characterized in that, The plurality of restrictive portions each form a discharge path between themselves and the main body, the discharge path being used to allow fluid flowing out from the recess covered by the restrictive portion to be discharged in a direction from the inside to the outside of the plate-shaped member.

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