Display device, display substrate and manufacturing method thereof

Abstract

The present disclosure relates to the field of display technology, and provides a display device, a display substrate, and a method for manufacturing the same. The display substrate includes a display area and a frame area surrounding the display area, and includes: a driving circuit layer, which is arranged on a substrate; an insulating material structure, which is arranged on the driving circuit layer and is located in the display area and at least part of the frame area, and a step structure is provided at the edge of the insulating material structure; a light-emitting layer, which is arranged on the insulating material structure; an encapsulation layer, which covers the light-emitting layer; a first retaining wall, which is arranged on the driving circuit layer and surrounds the insulating material structure; the edge is the edge of the insulating material structure close to the first retaining wall; a conductive connection structure, which is arranged in the insulating material structure, and the conductive connection structure is electrically connected to the driving circuit layer. The present disclosure can avoid the problem of poor circuits.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display device, a display substrate and a method for preparing the same. Background Art

[0002] With the rapid development of society, display devices have attracted more and more attention.

[0003] At present, with the popularity of full-screen displays, display devices with under-screen cameras are gradually becoming mainstream. In order to improve the light transmittance of the area of ​​the display substrate corresponding to the under-screen camera in the display device, only the light-emitting device is retained in this area, and the driving circuit that controls the light-emitting device to emit light is arranged outside the display area of ​​the display substrate. However, this display device is prone to circuit failure. Summary of the invention

[0004] The purpose of the present disclosure is to provide a display device, a display substrate and a manufacturing method thereof, which can avoid the problem of circuit failure.

[0005] According to one aspect of the present disclosure, a display substrate is provided, comprising a display area and a frame area surrounding the display area, including:

[0006] substrate;

[0007] A driving circuit layer is provided on the substrate;

[0008] An insulating material structure is provided on a side of the driving circuit layer facing away from the substrate and is located in the display area and at least a portion of the frame area, and a step structure is provided at an edge of the insulating material structure;

[0009] A light-emitting layer, disposed on a side of the insulating material structure facing away from the driving circuit layer;

[0010] An encapsulation layer, covering the light-emitting layer;

[0011] a first retaining wall, which is disposed on a side of the driving circuit layer facing away from the substrate and surrounds the insulating material structure, and is used to block a portion of the encapsulation layer; the edge is an edge of the insulating material structure close to the first retaining wall;

[0012] A conductive connection structure is disposed in the insulating material structure, and the conductive connection structure is electrically connected to the driving circuit layer.

[0013] Furthermore, the insulating material structure includes a plurality of flat layers stacked together, and the conductive connection structure is coated between two adjacent flat layers; the plurality of flat layers are staggered in sequence to form a step structure, and the step height of the step structure gradually increases in the direction from the edge of the insulating material structure to the display area.

[0014] Furthermore, the display substrate further comprises:

[0015] The light-transmitting wire is disposed between at least partially adjacent two of the planar layers and is electrically connected to the light-emitting layer.

[0016] Further, the display area includes a first display area and a second display area; the light-emitting layer includes a first light-emitting structure located in the first display area and a second light-emitting structure located in the second display area, and the driving circuit layer includes a first driving circuit and a second driving circuit; at least part of the second driving circuit and at least part of the conductive connection structure are located outside the second display area, and the part of the second driving circuit located outside the second display area is electrically connected to the part of the conductive connection structure located outside the second display area; one end of the light-transmitting wire is electrically connected to the part of the conductive connection structure located outside the second display area, and the other end of the light-transmitting wire is electrically connected to the second light-emitting structure.

[0017] Furthermore, along the direction away from the substrate, the plurality of planar layers include a first planar layer, a second planar layer, a third planar layer, a fourth planar layer and a fifth planar layer stacked in sequence; the conductive connection structure is coated between the first planar layer and the second planar layer;

[0018] The light-transmitting wire includes a first light-transmitting wire, a second light-transmitting wire and a third light-transmitting wire, the first light-transmitting wire is arranged between the second flat layer and the third flat layer, the second light-transmitting wire is arranged between the third flat layer and the fourth flat layer, the third light-transmitting wire is arranged between the fourth flat layer and the fifth flat layer, and the first light-transmitting wire, the second light-transmitting wire and the third light-transmitting wire are respectively electrically connected to the second light-emitting structures of sub-pixels of different colors.

[0019] Further, the border area includes a binding area, and in a direction parallel to the substrate, the binding area is located on one side of the insulating material structure; the step structure is arranged at an edge of the insulating material structure close to the binding area; a power signal line is arranged in an area of ​​the border area between the binding area and the display area, and the power signal line includes a first part extending approximately along a first direction and a second part extending approximately along a second direction, the first direction is an extension direction of an edge of one side of the display area close to the binding area, and the second direction is substantially perpendicular to the first direction; the first part is electrically connected to the driving circuit layer, and a first end of the second part is connected to the first part; the conductive connection structure includes the first part.

[0020] Furthermore, an orthographic projection of an edge of the first portion of the power signal line close to one side of the binding region on the substrate is located within an orthographic projection of the step structure on the substrate.

[0021] Furthermore, an orthographic projection of an edge of the first portion of the power signal line close to one side of the binding region on the substrate is located within an orthographic projection of the second planar layer on the substrate.

[0022] Furthermore, the first barrier wall includes a plurality of first barrier layers stacked together, and some of the first barrier layers in the plurality of first barrier layers are arranged in the same layer as some of the planar layers in the plurality of planar layers.

[0023] Furthermore, the display substrate further comprises:

[0024] A pixel defining layer is provided on a side of the insulating material structure facing away from the driving circuit layer, and the encapsulation layer covers the pixel defining layer;

[0025] A first barrier layer among the plurality of first barrier layers which is farthest from the substrate is disposed in the same layer as the pixel defining layer.

[0026] Furthermore, the display substrate further comprises:

[0027] The second retaining wall is arranged on the side of the driving circuit layer facing away from the substrate and surrounds the first retaining wall. The second retaining wall includes a plurality of second barrier layers stacked together. Some of the second barrier layers in the plurality of second barrier layers are arranged on the same layer as some of the first barrier layers in the plurality of first barrier layers.

[0028] Furthermore, at least a portion of the first barrier layer of the first barrier wall and at least a portion of the second barrier layer of the second barrier wall are an integrated structure.

[0029] Furthermore, the display substrate further comprises:

[0030] The pixel defining layer is disposed on a side of the insulating material structure facing away from the driving circuit layer and covers the step structure.

[0031] Furthermore, the staggered distances between the plurality of planar layers are at least partially different.

[0032] According to one aspect of the present disclosure, a display device is provided, comprising the above-mentioned display substrate.

[0033] According to one aspect of the present disclosure, there is provided a display device, comprising:

[0034] The above-mentioned display substrate;

[0035] The photosensitive device is arranged on a side of the substrate facing away from the driving circuit layer and overlaps with the second display area.

[0036] According to one aspect of the present disclosure, there is provided a method for preparing a display substrate, comprising:

[0037] providing a substrate;

[0038] forming a driving circuit layer on the substrate;

[0039] An insulating material structure and a conductive connection structure are formed on a side of the driving circuit layer facing away from the substrate, a step structure is provided at an edge of the insulating material structure, and the insulating material structure is located in the display area and at least a portion of the frame area; the conductive connection structure is provided in the insulating material structure and is electrically connected to the driving circuit layer;

[0040] forming a light-emitting layer on a side of the insulating material structure facing away from the driving circuit layer, wherein the light-emitting layer is electrically connected to the conductive connection structure;

[0041] forming an encapsulation layer covering the light-emitting layer;

[0042] A first retaining wall is formed on the side of the driving circuit layer facing away from the substrate, the first retaining wall surrounds the insulating material structure, and is used to block a portion of the packaging layer; the edge is the edge of the insulating material structure close to the first retaining wall.

[0043] Furthermore, the insulating material structure includes a plurality of flat layers stacked in layers, and the insulating material structure and the conductive connection structure formed on the side of the driving circuit layer facing away from the substrate include:

[0044] forming a first planar layer on a side of the driving circuit layer facing away from the substrate;

[0045] forming the conductive connection structure on a side of the first planar layer facing away from the substrate;

[0046] The remaining flat layers among the plurality of flat layers are formed on the side of the first flat layer facing away from the substrate, the conductive connection structure is coated between the first flat layer and the flat layer adjacent to the first flat layer, the plurality of flat layers are staggered in sequence to form a step structure, and the step height of the step structure gradually increases in the direction from the edge of the insulating material structure to the display area.

[0047] In the display device, display substrate and preparation method of the embodiments of the present invention, the edge of the insulating material structure is provided with a step structure, so that the edge of the insulating material structure has a slope, which can reduce the risk of subsequent film layers covering the edge of the insulating material structure breaking; at the same time, because the conductive connection structure is arranged in the insulating material structure, the corrosive liquid used in the subsequent film layer formation process can be prevented from corroding the conductive connection structure, thereby preventing the conductive connection structure from warping, and further preventing the conductive connection structure from being electrically connected to the two electrodes of the light-emitting layer, thereby avoiding the problem of poor circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 1 is a schematic plan view of a display substrate according to an embodiment of the present disclosure.

[0049] Figure 2 2 is a schematic cross-sectional view of a display substrate according to an embodiment of the present disclosure.

[0050] Figure 3 yes Figure 1 A partial schematic diagram of the AA cross-section structure of the structure shown.

[0051] Figure 4 yes Figure 1 Another partial schematic diagram of the AA cross-section structure of the structure shown.

[0052] Figure 5 It is a schematic plan view of an embodiment of the present disclosure with light-transmitting wires.

[0053] Description of reference numerals: 1, substrate; 2, driving circuit layer; 21, active layer; 22, gate insulating layer; 23, gate electrode; 24, interlayer insulating layer; 25, source electrode; 26, drain electrode; 3, flat layer; 31, first flat layer; 32, second flat layer; 33, third flat layer; 34, fourth flat layer; 35, fifth flat layer; 4, conductive connection structure; 5, light-transmitting wire; 51, first light-transmitting wire; 52, second light-transmitting wire; 53, third light-transmitting wire; 6, light-emitting layer; 61, first electrode; 602 , light-emitting material layer; 63, second electrode; 7, pixel defining layer; 8, first retaining wall; 81, first blocking layer; 9, second retaining wall; 91, second blocking layer; 10, encapsulation layer; 11, first inorganic layer; 12, organic layer; 13, second inorganic layer; 14, power signal line; 141, first part; 142, second part; 100, insulating material structure; 101, step structure; 200, display area; 201, first display area; 202, second display area; 300, frame area; 400, binding area. DETAILED DESCRIPTION

[0054] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices consistent with some aspects of the present disclosure as detailed in the appended claims.

[0055] The terms used in this disclosure are only for the purpose of describing specific embodiments and are not intended to limit the disclosure. Unless otherwise defined, the technical terms or scientific terms used in this disclosure should be understood by people with ordinary skills in the field to which the disclosure belongs. "First", "second" and similar words used in this disclosure specification and claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, "one" or "one" and other similar words do not indicate quantity restrictions, but indicate that there is at least one. "Multiple" or "several" means two and more than two. "Including" or "including" and other similar words mean that the elements or objects appearing in front of "including" or "including" include the elements or objects listed after "including" or "including" and their equivalents, and do not exclude other elements or objects. "Connected" or "connected" and other similar words are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect. The singular forms of "one", "said" and "the" used in this disclosure specification and the attached claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0056] In the related art, for a display substrate provided with an under-screen camera, in order to improve the light transmittance of the area of ​​the display substrate corresponding to the under-screen camera, only the light-emitting device is retained in the area, and the driving circuit that controls the light emission of the light-emitting device is arranged outside the display area of ​​the display substrate. Among them, the driving circuit arranged outside the display area is electrically connected to the light-emitting device through a light-transmitting wire. When the size of the under-screen camera is large, multiple light-transmitting wires are required, and the multiple light-transmitting wires are arranged in layers. Based on this, the preparation method of the display substrate includes: forming a driving circuit layer on a substrate; forming an insulating material structure on the driving circuit layer, and a conductive connection structure electrically connected to the driving circuit layer and multiple light-transmitting wires are provided in the insulating material structure, and the conductive connection structure is a stacked structure of Ti / Al / Ti; a first electrode, a light-emitting material layer and a second electrode are formed in sequence on the side of the insulating material structure facing away from the substrate. Among them, the light-transmitting wire is electrically connected between the first electrode and the conductive connection structure. The multiple light-transmitting wires arranged in the insulating material structure are arranged in layers, resulting in a large thickness of the insulating material structure. In order to make the edge of the insulating material structure have a slope, a step structure is often formed at the edge of the insulating material structure, which causes the conductive connection structure arranged in the insulating material structure to be exposed. The etching liquid used in the process of forming the light-transmitting wire and the first electrode is easy to corrode the exposed conductive connection structure, causing the Ti layer in the conductive connection structure to be lifted, resulting in the Ti layer being electrically connected to the second electrode of the light-emitting layer. Since the conductive connection structure is electrically connected to the first electrode of the light-emitting layer, the first electrode and the second electrode of the light-emitting layer are short-circuited, resulting in a circuit defect, and it is also easy to cause aging defects. Among them, the process of forming the light-transmitting wire and the first electrode can be a photolithography process, and the etching liquid can be a developer in the photolithography process, such as sulfuric acid.

[0057] In order to solve the above problems, the present disclosure provides a display substrate. Figure 1-Figure 3 As shown, the display substrate may include a display area 200 and a frame area 300 surrounding the display area 200. The display substrate may include a substrate 1, a driving circuit layer 2, an insulating material structure 100, a conductive connection structure 4, an encapsulation layer 10, a first barrier wall 8 and a light-emitting layer 6, wherein:

[0058] The driving circuit layer 2 is arranged on the substrate 1. The insulating material structure 100 is arranged on the side of the driving circuit layer 2 facing away from the substrate 1, and is located in the display area 200 and at least part of the frame area 300. A step structure 101 is provided at the edge of the insulating material structure 100. The conductive connection structure 4 is arranged in the insulating material structure 100. The conductive connection structure 4 is electrically connected to the driving circuit layer 2. The light-emitting layer 6 is arranged on the side of the insulating material structure 100 facing away from the driving circuit layer 2. The encapsulation layer 10 covers the light-emitting layer 6. The first retaining wall 8 is arranged on the side of the driving circuit layer 2 facing away from the substrate 1. The first retaining wall 8 can surround the insulating material structure 100. The first retaining wall 8 is used to block a part of the encapsulation layer 10. The edge of the insulating material structure 100 provided with the step structure 101 is the edge of the insulating material structure 100 close to the first retaining wall 8.

[0059] In the display substrate of the embodiment of the present disclosure, the edge of the insulating material structure 100 is provided with a step structure 101, so that the edge of the insulating material structure 100 has a slope, which can reduce the risk of subsequent film layers covering the edge of the insulating material structure 100 breaking; at the same time, since the conductive connection structure 4 is arranged in the insulating material structure 100, it can prevent the etching liquid used in the subsequent film layer formation process from corroding the conductive connection structure 4, avoid the conductive connection structure 4 from warping, and further prevent the conductive connection structure 4 from being electrically connected to the two electrodes of the light-emitting layer 6, which can avoid the problem of circuit failure and the defect of aging burning.

[0060] The following is a detailed description of each part of the display substrate according to the embodiment of the present disclosure:

[0061] like Figure 2 and Figure 3 As shown, the substrate 1 can be a rigid substrate. The rigid substrate can be a glass substrate or a PMMA (Polymethyl methacrylate) substrate. Of course, the substrate 1 can also be a flexible substrate. The flexible substrate can be a PET (Polyethylene terephthalate) substrate, a PEN (Polyethylene naphthalate two formic acid glycol ester) substrate or a PI (Polyimide) substrate.

[0062] like Figure 2 and Figure 3As shown, the driving circuit layer 2 is arranged on the substrate 1. The driving circuit layer 2 may include a plurality of driving transistors. The driving transistor may be a thin film transistor, but the embodiments of the present disclosure are not limited thereto. The thin film transistor may be a top-gate thin film transistor, and of course, the thin film transistor may also be a bottom-gate thin film transistor. Taking the thin film transistor as a top-gate thin film transistor as an example, the driving circuit layer 2 may include an active layer 21, a gate insulating layer 22, a gate electrode 23, an interlayer insulating layer 24, a source 25 and a drain 26. The active layer 21 may be arranged on the substrate 1. The gate insulating layer 22 may be arranged on the substrate 1 and cover the active layer 21. The gate electrode 23 may be arranged on the side of the gate insulating layer 22 away from the flexible substrate 1. The interlayer insulating layer 24 may be arranged on the gate insulating layer 22 and cover the gate electrode 23. The source 25 and the drain 26 may be arranged on the interlayer insulating layer 24 and connected to the active layer 21 via a via passing through the interlayer insulating layer 24 and the gate insulating layer 22.

[0063] like Figure 2 , Figure 3 as well as Figure 4 As shown, the insulating material structure 100 is arranged on the side of the driving circuit layer 2 facing away from the substrate 1. Among them, the insulating material structure 100 can be arranged on the side of the above-mentioned interlayer insulating layer 24 facing away from the substrate 1, and covers the source 25 and the drain 26 of the thin film transistor. The insulating material structure 100 may include a plurality of flat layers 3 stacked. The thicknesses of the plurality of flat layers 3 may be the same, or of course, they may be different. The materials of the plurality of flat layers 3 may be the same, or of course, they may be different. Specifically, the plurality of flat layers 3 may include a first flat layer 31, a second flat layer 32, a second flat layer 33, a fourth flat layer 34, and a fifth flat layer 35 stacked. The first flat layer 31 may be arranged on the side of the above-mentioned interlayer insulating layer 24 facing away from the substrate 1, and covers the source 25 and the drain 26 of the thin film transistor. The first flat layer 31, the second flat layer 32, the second flat layer 33, the fourth flat layer 34, and the fifth flat layer 35 are stacked in sequence along the direction away from the substrate 1.

[0064] like Figure 3 and Figure 4As shown, the edge of the insulating material structure 100 is provided with a step structure 101, so that the edge of the insulating material structure 100 has a slope, so as to avoid the subsequent deposited film layer from breaking at the edge of the insulating material structure 100 when the thickness of the insulating material structure 100 is large. Taking the insulating material structure 100 including four side edges connected in sequence as an example, the edge of the insulating material structure 100 located at one side can be provided with a step structure 101. Taking the insulating material structure 100 including a plurality of flat layers 3 stacked and arranged as an example, the plurality of flat layers 3 are staggered in sequence to form a step structure 101. In the direction from the edge of the insulating material structure 100 to the display area 200, the step height of the step structure 101 gradually increases. Among them, the staggered distances of any two adjacent flat layers 3 are at least partially different, for example, the staggered distance between the first flat layer 31 and the second flat layer 32 can be less than the staggered distance between the second flat layer 32 and the third flat layer 33, and the staggered distance between the second flat layer 32 and the third flat layer 33 can be equal to the staggered distance between the third flat layer 33 and the fourth flat layer 34.

[0065] like Figure 2 , Figure 3 as well as Figure 4 As shown, the conductive connection structure 4 can be a film structure and is parallel to the substrate 1. The conductive connection structure 4 can be a laminated structure, such as Ti / Al / Ti. Of course, it can also be a single-layer structure, and its material can be Mo, but the embodiments of the present disclosure are not limited to this. The conductive connection structure 4 is arranged in the insulating material structure 100, so as to avoid the corrosion of the conductive connection structure 4 by the developer used in the subsequent photolithography process. Taking the insulating material structure 100 as an example including a plurality of flat layers 3, the conductive connection structure 4 can be coated between two adjacent flat layers 3. Further, the conductive connection structure 4 can be coated between two adjacent flat layers 3 closest to the substrate 1. Specifically, taking the plurality of flat layers 3 including a first flat layer 31, a second flat layer 32, a second flat layer 33, a fourth flat layer 34 and a fifth flat layer 35 stacked in sequence as an example, the conductive connection structure 4 can be coated between the first flat layer 31 and the second flat layer 32. The conductive connection structure 4 is electrically connected to the drive circuit layer 2. Specifically, the conductive connection structure 4 can be electrically connected to the source 25 or drain 26 of the thin film transistor in the driving circuit layer 2. The conductive connection structure 4 can be electrically connected to the source 25 or drain 26 of the thin film transistor via a via hole passing through the first planar layer 31.

[0066] like Figure 2 and Figure 3As shown, the light-emitting layer 6 is arranged on the side of the insulating material structure 100 facing away from the driving circuit layer 2. The light-emitting layer 6 may include a first electrode 61, a light-emitting material layer 602 and a second electrode 63. The first electrode 61 may be an anode, and the second electrode 63 may be a cathode. The anode may be arranged on the side of the insulating material structure 100 facing away from the driving circuit layer 2, the cathode may be arranged on the side of the anode facing away from the insulating material structure 100, and the light-emitting material layer 602 may be arranged between the anode and the cathode. Taking the insulating material structure 100 including a plurality of flat layers 3 as an example, the anode may be arranged on the side of the flat layer 3 farthest from the substrate 1 facing away from the substrate 1, that is, the anode may be arranged on the side of the fifth flat layer 35 facing away from the substrate 1. The light-emitting layer 6 may be electrically connected to the conductive connection structure 4, and because the conductive connection structure 4 is electrically connected to the driving circuit layer 2, the light-emitting layer 6 is electrically connected to the driving circuit layer 2, so that the driving circuit layer 2 can drive the light-emitting layer 6 to emit light. Among them, the anode of the light-emitting layer 6 may be electrically connected to the conductive connection structure 4. In addition, the light emitting layer 6 may include a red light emitting unit, a green light emitting unit and a blue light emitting unit.

[0067] like Figure 1 , Figure 2 , Figure 3 as well as Figure 5 As shown, the display substrate of the embodiment of the present disclosure may further include a light-transmitting wire 5. Taking the insulating material structure 100 including a plurality of flat layers 3 as an example, the light-transmitting wire 5 may be disposed between at least two adjacent flat layers 3 and electrically connected to the light-emitting layer 6, so that the conductive connection structure 4 is electrically connected to the light-emitting layer 6. The display area 200 may include a first display area 201 and a second display area 202. The light-emitting layer 6 may include a first light-emitting structure located in the first display area 201 and a second light-emitting structure located in the second display area 202. The driving circuit layer 2 may include a first driving circuit and a second driving circuit. At least part of the second driving circuit and at least part of the conductive connection structure 4 are located outside the second display area 202. For example, at least part of the second driving circuit and at least part of the conductive connection structure 4 are located in the frame area 300. The portion of the second driving circuit located outside the second display area 202 is electrically connected to the portion of the conductive connection structure 4 located outside the second display area 202. One end of the light-transmitting wire 5 is electrically connected to the portion of the conductive connection structure 4 located outside the second display area 202, and the other end of the light-transmitting wire 5 is electrically connected to the second light-emitting structure, so that the second light-emitting structure is electrically connected to the portion of the second driving circuit located outside the second display area 202. The display substrate of the present disclosure may also be provided with a photosensitive device. The photosensitive device may be provided on the side of the substrate 1 facing away from the light-emitting layer 6 and overlapped with the second display area 202.

[0068] like Figure 3As shown, the material of the light-transmitting wire 5 may be indium tin oxide (ITO), but the present disclosure does not specifically limit this. The number of the light-transmitting wire 5 may be multiple. Taking the case where the multiple flat layers 3 include a first flat layer 31, a second flat layer 32, a second flat layer 33, a fourth flat layer 34 and a fifth flat layer 35 stacked in sequence and the conductive connection structure 4 is coated between the first flat layer 31 and the second flat layer 32 as an example, the light-transmitting wire 5 may include a first light-transmitting wire 51, a second light-transmitting wire 52 and a third light-transmitting wire 53. The first light-transmitting wire 51 may be disposed between the second flat layer 32 and the second flat layer 33, the second light-transmitting wire 52 may be disposed between the second flat layer 33 and the fourth flat layer 34, and the third light-transmitting wire 53 may be disposed between the fourth flat layer 34 and the fifth flat layer 35. In addition, the first light-transmitting wire 51, the second light-transmitting wire 52 and the third light-transmitting wire 53 are electrically connected to the second light-emitting structures of sub-pixels of different colors, respectively. For example, the first light-transmitting wire 51 can be electrically connected to the second light-emitting structure of the red sub-pixel, the second light-transmitting wire 52 can be electrically connected to the second light-emitting structure of the green sub-pixel, and the third light-transmitting wire 53 can be electrically connected to the second light-emitting structure of the blue sub-pixel. The light-transmitting wire 5 can be prepared by a photolithography process, and the developer used in the photolithography process can be nitric acid or the like.

[0069] like Figure 1 and Figure 3As shown, the border area 300 has a binding area 400. In a direction parallel to the substrate 1, the binding area 400 is located on one side of the insulating material structure 100. The above-mentioned step structure 101 can be provided at the edge of the insulating material structure 100 close to the binding area 400. The area of ​​the border area 300 between the binding area 400 and the display area 200 can be provided with a power signal line 14. The power signal line 14 can receive a VDD power signal. The power signal line 14 can include a first portion 141 extending approximately along a first direction and a second portion 142 extending approximately along a second direction. The first direction is the extension direction of the edge of one side of the display area 200 close to the binding area 400. The second direction is substantially perpendicular to the first direction. The first portion 141 is electrically connected to the driving circuit layer 2, the first end of the second portion 142 is connected to the first portion 141, and the second end extends to the binding area 400. The above-mentioned conductive connection structure 4 includes the first portion 141 of the power signal line 14. The orthographic projection of the edge of the first portion 141 of the power signal line 14 close to the binding area 400 on the substrate 1 is located within the orthographic projection of the step structure 101 on the substrate 1. The orthographic projection of the edge of the first portion 141 of the power signal line 14 close to the binding area 400 on the substrate 1 is located within the orthographic projection of the second flat layer 32 on the substrate 1. The source 25 or the drain 26 of the thin film transistor electrically connected to the conductive connection structure 4 is connected in parallel with the conductive connection structure 4 to form the first portion 141 of the power signal line 14.

[0070] like Figure 2 As shown, the encapsulation layer 10 may include: a first inorganic layer 11, an organic layer 12 arranged on the side of the first inorganic layer 11 away from the substrate 1, and a second inorganic layer 13 arranged on the side of the organic layer 12 away from the substrate 1. The first retaining wall 8 may be arranged on the side of the above-mentioned interlayer insulating layer 24 facing away from the substrate 1. The first inorganic layer 11 may cover the first retaining wall 8 to form a better encapsulation effect. The above-mentioned organic layer 12 may be located within the range defined by the first retaining wall 8, that is, the orthographic projection of the organic layer 12 on the substrate 1 is located within the orthographic projection range of the first retaining wall 8 on the substrate 1, which means that the first retaining wall 8 can block the organic layer 12 in the encapsulation layer 10 to ensure a good encapsulation effect.

[0071] like Figure 1 , Figure 3 and Figure 4As shown, the first retaining wall 8 may include a plurality of first barrier layers 81 stacked. Some of the barrier layers in the plurality of first barrier layers 81 are respectively arranged in the same layer as some of the flat layers 3 in the plurality of flat layers 3. Taking the plurality of flat layers 3 as an example, which include a first flat layer 31, a second flat layer 32, a second flat layer 33, a fourth flat layer 34 and a fifth flat layer 35 stacked in sequence, the first retaining wall 8 may include five stacked first barrier layers 81, and four of the five first barrier layers 81 close to the substrate 1 are respectively arranged in the same layer as the first to fourth flat layers 34.

[0072] like Figure 2 , Figure 3 as well as Figure 4 As shown, the display substrate of the present disclosure may further include a pixel defining layer 7. The pixel defining layer 7 may be disposed on the side of the insulating material structure 100 facing away from the driving circuit layer 2. The pixel defining layer 7 is provided with a plurality of openings, and the light-emitting layer 6 may be disposed in the opening of the pixel defining layer 7. The pixel defining layer 7 may cover the above-mentioned step structure 101. Compared with the conventional pixel defining layer 7, the present disclosure may increase the thickness of the pixel defining layer 7. The above-mentioned encapsulation layer 10 covers the pixel defining layer 7. Taking the example that the first barrier wall 8 may include five first barrier layers 81 arranged in a stacked manner, the first barrier layer 81 farthest from the substrate 1 among the five first barrier layers 81 may be arranged in the same layer as the pixel defining layer 7.

[0073] like Figure 1 and Figure 4 As shown, the display substrate of the present disclosure may further include a second retaining wall 9. The second retaining wall 9 may be provided on the side of the driving circuit layer 2 facing away from the substrate 1. The second retaining wall 9 may be provided on the side of the above-mentioned interlayer insulating layer 24 facing away from the substrate 1. The second retaining wall 9 surrounds the first retaining wall 8. The second retaining wall 9 may include a plurality of second barrier layers 91 stacked. Part of the second barrier layers 91 in the plurality of second barrier layers 91 are respectively provided in the same layer as part of the first barrier layers 81 in the plurality of first barrier layers 81. Further, at least part of the first barrier layer 81 of the first retaining wall 8 and at least part of the second barrier layer 91 of the second retaining wall 9 are an integral structure. Taking the first retaining wall 8 including five first barrier layers 81 as an example, the second retaining wall 9 may include six second barrier layers 91. The four second barrier layers 91 of the second retaining wall 9 close to the substrate 1 are respectively arranged on the same layer as the four first barrier layers 81 of the first retaining wall 8 close to the substrate 1 and are an integrated structure. The second barrier layer 91 farthest from the substrate 1 among the six second barrier layers 91 is arranged on the same layer as the pixel defining layer 7, and the remaining second barrier layer 91 of the six second barrier layers 91 is arranged on the same layer as the fifth planarization layer 35.

[0074] It should be noted that the above-mentioned "same layer" refers to a layer structure formed by using the same film-forming process to form a film layer for forming a specific pattern, and then using the same mask to form a layer structure through a single patterning process. Depending on the specific pattern, a single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses.

[0075] The display substrate of the embodiment of the present disclosure may also include a touch structure and a touch chip. The touch structure may be on the above-mentioned encapsulation layer 10. Specifically, the touch structure may be provided on the above-mentioned second inorganic layer 13. The touch structure may be located in the display area 200 of the display substrate. The touch chip may be provided in the above-mentioned binding area 400 and is located on the same side of the substrate 1 as the touch structure. The present disclosure may also include a signal transmission line connecting the touch structure and the touch chip, so that the touch chip can transmit a touch drive signal to the touch structure, and can also receive a touch sensing signal transmitted by the touch structure. The display transmission line may be provided on the above-mentioned encapsulation layer 10. One end of the signal transmission line extends into the display area 200 and is electrically connected to the touch structure, and the other end extends into the binding area 400 and is electrically connected to the touch chip. Since a step structure 101 is provided at the edge of the side of the insulating material structure 100 close to the binding area 400, the edge of the insulating material structure 100 has a slope, so that the pixel defining layer 7 covering the step structure 101 has a slope, and then the encapsulation layer 10 covering the pixel defining layer 7 has a slope, which can avoid the signal transmission line arranged on the pixel defining layer 7 from breaking.

[0076] The embodiment of the present disclosure also provides a display device. The display device may include the display substrate described in any of the above embodiments. The display device may be a mobile phone, a computer, a television, a camera, a wearable display, a navigator, a car display, etc., but the embodiment of the present disclosure does not specifically limit this. In addition, the display device may also include a photosensitive device. The photosensitive device may be arranged on the side of the substrate 1 facing away from the driving circuit layer 2 and overlap with the above-mentioned second display area 202. Since the display panel in the display device of the embodiment of the present disclosure is the same as the display panel in the embodiment of the above-mentioned display panel, it has the same beneficial effects and will not be repeated here.

[0077] The present disclosure also provides a method for preparing a display substrate, which is used to prepare the display substrate described in any of the above embodiments. The display substrate includes a display area and a frame area surrounding the display area. The method for preparing the display substrate may include steps S100 to S150, wherein:

[0078] Step S100: providing a substrate.

[0079] Step S110: forming a driving circuit layer on the substrate.

[0080] Step S120, forming an insulating material structure and a conductive connection structure on the side of the driving circuit layer facing away from the substrate, wherein a step structure is provided at the edge of the insulating material structure; the conductive connection structure is provided in the insulating material structure and electrically connected to the driving circuit layer.

[0081] Step S130: forming a light-emitting layer on a side of the insulating material structure facing away from the driving circuit layer.

[0082] Step S140: forming an encapsulation layer covering the light-emitting layer.

[0083] Step S150, forming a first retaining wall on the side of the driving circuit layer facing away from the substrate, the first retaining wall surrounds the insulating material structure, and the first retaining wall is used to block a portion of the packaging layer; the edge of the insulating material structure having a step structure is the edge of the insulating material structure close to the first retaining wall.

[0084] The insulating material structure includes a plurality of flat layers stacked in layers, and the insulating material structure and the conductive connection structure are formed on the side of the driving circuit layer facing away from the substrate, including: forming a first flat layer on the side of the driving circuit layer facing away from the substrate; forming a conductive connection structure on the side of the first flat layer facing away from the substrate; forming the remaining flat layers of the plurality of flat layers on the side of the first flat layer facing away from the substrate, the conductive connection structure is coated between the first flat layer and the flat layer adjacent to the first flat layer, and the plurality of flat layers are staggered in sequence to form a step structure. In the direction from the edge of the insulating material structure to the display area, the step height of the step structure gradually increases.

[0085] The method for preparing the display substrate provided in the embodiment of the present disclosure and the display substrate belong to the same inventive concept, and the description of the relevant details and beneficial effects can be referred to each other and will not be repeated here.

[0086] The above is only a preferred embodiment of the present disclosure and does not limit the present disclosure in any form. Although the present disclosure has been disclosed as a preferred embodiment as above, it is not used to limit the present disclosure. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present disclosure. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure are still within the scope of the technical solution of the present disclosure.

Claims

1. A display substrate, comprising a display area and a frame area surrounding the display area, characterized in that: include: substrate; A driving circuit layer is provided on the substrate; an insulating material structure, arranged on a side of the driving circuit layer facing away from the substrate, and located in the display area and at least a portion of the frame area, wherein a step structure is arranged at an edge of the insulating material structure; the insulating material structure comprises a plurality of flat layers stacked in a stack; the plurality of flat layers are staggered in sequence to form a step structure, and a step height of the step structure gradually increases in a direction from the edge of the insulating material structure to the display area; A light-emitting layer, disposed on a side of the insulating material structure facing away from the driving circuit layer; An encapsulation layer, covering the light-emitting layer; a first blocking wall, which is disposed on a side of the driving circuit layer facing away from the substrate and surrounds the insulating material structure, and is used to block a portion of the encapsulation layer; The edge is the edge of the insulating material structure close to the first retaining wall; A conductive connection structure is disposed in the insulating material structure, and the conductive connection structure is coated between two adjacent flat layers; the conductive connection structure is electrically connected to the driving circuit layer.

2. The display substrate according to claim 1, characterized in that: The display substrate further comprises: The light-transmitting wire is disposed between at least partially adjacent two of the planar layers and is electrically connected to the light-emitting layer.

3. The display substrate according to claim 2, characterized in that: The display area includes a first display area and a second display area; the light-emitting layer includes a first light-emitting structure located in the first display area and a second light-emitting structure located in the second display area, and the driving circuit layer includes a first driving circuit and a second driving circuit; at least part of the second driving circuit and at least part of the conductive connection structure are located outside the second display area, and the part of the second driving circuit located outside the second display area is electrically connected to the part of the conductive connection structure located outside the second display area; one end of the light-transmitting wire is electrically connected to the part of the conductive connection structure located outside the second display area, and the other end of the light-transmitting wire is electrically connected to the second light-emitting structure.

4. The display substrate according to claim 2 or 3, characterized in that: Along the direction away from the substrate, the plurality of planar layers include a first planar layer, a second planar layer, a third planar layer, a fourth planar layer and a fifth planar layer which are stacked in sequence; the conductive connection structure is coated between the first planar layer and the second planar layer; The light-transmitting wire includes a first light-transmitting wire, a second light-transmitting wire and a third light-transmitting wire, the first light-transmitting wire is arranged between the second flat layer and the third flat layer, the second light-transmitting wire is arranged between the third flat layer and the fourth flat layer, the third light-transmitting wire is arranged between the fourth flat layer and the fifth flat layer, and the first light-transmitting wire, the second light-transmitting wire and the third light-transmitting wire are respectively electrically connected to the second light-emitting structures of sub-pixels of different colors.

5. The display substrate according to claim 4, characterized in that: The border area includes a binding area, and the binding area is located on one side of the insulating material structure in a direction parallel to the substrate; the step structure is arranged at an edge of the insulating material structure close to the binding area; a power signal line is arranged in an area of ​​the border area between the binding area and the display area, and the power signal line includes a first part extending approximately along a first direction and a second part extending approximately along a second direction, the first direction is an extension direction of an edge of a side of the display area close to the binding area, and the second direction is substantially perpendicular to the first direction; the first part is electrically connected to the driving circuit layer, and a first end of the second part is connected to the first part; the conductive connection structure includes the first part.

6. The display substrate according to claim 5, characterized in that: The orthographic projection of an edge of the first portion of the power signal line close to one side of the binding region on the substrate is located within the orthographic projection of the step structure on the substrate.

7. The display substrate according to claim 5, characterized in that: The orthographic projection of an edge of the first portion of the power signal line close to the binding region on the substrate is located within the orthographic projection of the second planar layer on the substrate.

8. The display substrate according to claim 1, characterized in that: The first barrier wall includes a plurality of first barrier layers stacked together, and some of the first barrier layers are arranged on the same layer as some of the planar layers.

9. The display substrate according to claim 8, characterized in that: The display substrate further comprises: A pixel defining layer is provided on a side of the insulating material structure facing away from the driving circuit layer, and the encapsulation layer covers the pixel defining layer; A first barrier layer among the plurality of first barrier layers which is farthest from the substrate is disposed in the same layer as the pixel defining layer.

10. The display substrate according to claim 8, characterized in that: The display substrate further comprises: The second retaining wall is arranged on the side of the driving circuit layer facing away from the substrate and surrounds the first retaining wall. The second retaining wall includes a plurality of second barrier layers stacked together. Some of the second barrier layers in the plurality of second barrier layers are arranged on the same layer as some of the first barrier layers in the plurality of first barrier layers.

11. The display substrate according to claim 10, characterized in that: At least a portion of the first barrier layer of the first barrier wall and at least a portion of the second barrier layer of the second barrier wall are an integral structure.

12. The display substrate according to claim 1, characterized in that: The display substrate further comprises: The pixel defining layer is disposed on a side of the insulating material structure facing away from the driving circuit layer and covers the step structure.

13. The display substrate according to claim 1, characterized in that: The staggered distances between the plurality of planar layers are at least partially different.

14. A display device, characterized in that: A display substrate comprising any one of claims 1-13.

15. A display device, characterized in that: include: The display substrate according to claim 3; The photosensitive device is arranged on a side of the substrate facing away from the driving circuit layer and overlaps with the second display area.

16. A method for preparing a display substrate, characterized in that: The display substrate comprises a display area and a frame area surrounding the display area, and the preparation method comprises: providing a substrate; forming a driving circuit layer on the substrate; An insulating material structure and a conductive connection structure are formed on the side of the driving circuit layer facing away from the substrate, the edge of the insulating material structure is provided with a step structure, the insulating material structure is located in the display area and at least a part of the frame area; the conductive connection structure is arranged in the insulating material structure and is electrically connected to the driving circuit layer; the insulating material structure includes a plurality of flat layers stacked; forming a light-emitting layer on a side of the insulating material structure facing away from the driving circuit layer; forming an encapsulation layer covering the light-emitting layer; A first retaining wall is formed on a side of the driving circuit layer facing away from the substrate, the first retaining wall surrounds the insulating material structure, and the first retaining wall is used to block a portion of the encapsulation layer; the edge is an edge of the insulating material structure close to the first retaining wall; Forming an insulating material structure and a conductive connection structure on a side of the driving circuit layer facing away from the substrate includes: forming a first planar layer on a side of the driving circuit layer facing away from the substrate; forming the conductive connection structure on a side of the first planar layer facing away from the substrate; The remaining flat layers among the plurality of flat layers are formed on the side of the first flat layer facing away from the substrate, the conductive connection structure is coated between the first flat layer and the flat layer adjacent to the first flat layer, the plurality of flat layers are staggered in sequence to form a step structure, and the step height of the step structure gradually increases in the direction from the edge of the insulating material structure to the display area.

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