Detection film and method for manufacturing the same, and chip bonding detection method
By covering the mini LED chip with an ordered colloidal crystal microsphere detection film, the chip tilt can be detected by Bragg reflection, which solves the problem of tilt detection of mini LED chips during high-temperature reflow soldering, improves the yield of display products and reduces costs.
CN115566006BActive Publication Date: 2026-07-24CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
- Filing Date
- 2021-07-01
- Publication Date
- 2026-07-24
AI Technical Summary
Technical Problem
There is a lack of effective means in the current technology to detect whether mini LED chips tilt during high-temperature reflow soldering, which can lead to poor display effects.
Method used
A detection film containing orderly arranged colloidal crystal microspheres is used to detect the tilt angle of the chip by utilizing Bragg reflection. The detection film is applied to the chip bonded to the circuit board, and the characteristics of the reflected light are analyzed to determine whether the chip is tilted.
Benefits of technology
It enables accurate detection of mini LED chip tilt, improves the yield rate of display products, reduces costs, and the detection method is simple, convenient, and environmentally friendly.
✦ Generated by Eureka AI based on patent content.
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Figure CN115566006B_ABST
Abstract
The present application relates to a kind of detection film and its manufacturing method, chip bonding detection method, detection film is covered on the chip of completion bonding, there are colloidal crystal microspheres in orderly arrangement in detection film, based on the Bragg reflection of colloidal crystal microspheres, according to the light reflected by colloidal crystal microspheres on each chip to determine whether the chip is tilted.
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