Display device

Abstract

A display device includes: a first substrate; a second substrate; a liquid crystal layer located between the first substrate and the second substrate and containing a polymer and liquid crystal molecules; and a light-emitting element. The first substrate includes: a transparent substrate, a scanning line, a signal line intersecting with the scanning line, a switching element electrically connected to the scanning line and the signal line, an organic insulating film overlapping with the switching element, and a pixel electrode electrically connected to the switching element. The film thickness of the organic insulating film between the transparent substrate and the pixel electrode is smaller than that of the organic insulating film overlapping with the switching element.

Description

[0001] This application is a divisional application of the patent application with the application date of November 21, 2019, application number 201911149463.3, and invention title "display device", the entire content of which is incorporated herein by reference. Technical Field

[0002] Embodiments of the present invention relate to a display device. Background Art

[0003] In recent years, a display device using polymer-dispersed liquid crystal has been proposed, and this polymer-dispersed liquid crystal can switch between a scattering state in which incident light is scattered and a transmission state in which incident light is transmitted. For example, a display device in which a pixel switching circuit portion is covered with a reflective layer formed of aluminum, silver, or the like has been disclosed. Summary of the Invention

[0004] A display device according to an embodiment of the present invention includes: a first substrate; a second substrate; a liquid crystal layer located between the first substrate and the second substrate and containing a polymer and liquid crystal molecules; and a light-emitting element. The first substrate includes: a transparent substrate, a scan line, a signal line intersecting the scan line, a switching element electrically connected to the scan line and the signal line, an organic insulating film overlapping the switching element, and a pixel electrode electrically connected to the switching element. The film thickness of the organic insulating film between the transparent substrate and the pixel electrode is smaller than the film thickness of the organic insulating film overlapping the switching element.

[0005] A display device according to another embodiment of the present invention includes: a first substrate; a second substrate; a liquid crystal layer located between the first substrate and the second substrate and containing a polymer and liquid crystal molecules; and a light-emitting element. The first substrate includes: a transparent substrate, a scan line, a signal line intersecting the scan line, a switching element electrically connected to the scan line and the signal line, an organic insulating film overlapping the switching element, and a pixel electrode electrically connected to the switching element. The organic insulating film is not provided between the transparent substrate and the pixel electrode. Description of the Drawings

[0006] Figure 1 It is a top view showing an example of the display device DSP of the present embodiment.

[0007] Figure 2 It is a top view showing a first configuration example of the pixel PX in the first substrate SUB1.

[0008] Figure 3 It shows Figure 2 An enlarged top view of an example of the switching element SW shown.

[0009] Figure 4is a cross-sectional view of a display panel PNL along line A - B showing a switching element SW as shown Figure 3 below.

[0010] Figure 5 is a cross-sectional view of a display panel PNL along line C - D showing a scanning line G and a connection portion DEA as shown Figure 3 below.

[0011] Figure 6 is a cross-sectional view of a display panel PNL along line E - F showing a signal line S as shown Figure 3 below.

[0012] Figure 7 is a schematic diagram showing the display panel PNL of the present embodiment.

[0013] Figure 8 is a top view showing a second configuration example of a pixel PX in a first substrate SUB1.

[0014] Figure 9 is a top view showing a third configuration example of a pixel PX in a first substrate SUB1.

[0015] Figure 10 is a top view showing a fourth configuration example of a pixel PX in a first substrate SUB1.

[0016] Figure 11 is a top view showing a fifth configuration example of a pixel PX in a first substrate SUB1.

[0017] Figure 12 is a top view showing a sixth configuration example of a pixel PX in a first substrate SUB1.

[0018] Figure 13 is a top view showing a seventh configuration example of a pixel PX in a first substrate SUB1.

[0019] Figure 14 is a top view showing an eighth configuration example of a pixel PX in a first substrate SUB1.

[0020] Figure 15 is a diagram for explaining a measurement method for measuring the absorption rate of a sample.

[0021] Figure 16 is a diagram showing the measurement results of the absorption rate of the material forming the display panel PNL.

[0022] Figure 17 is a diagram for explaining the propagation of the emitted light from a light-emitting element LD in a display device DSP.

[0023] Figure 18This is a diagram showing the measurement results of the brightness in the display device DSP of the present embodiment and the display device of the comparative example. Detailed implementation mode

[0024] Generally speaking, according to one embodiment, a display device is provided, which includes: a first substrate; a second substrate; a liquid crystal layer located between the first substrate and the second substrate and containing a polymer and liquid crystal molecules; and a light-emitting element. The first substrate includes: a transparent substrate, a scanning line, a signal line intersecting with the scanning line, a switching element electrically connected to the scanning line and the signal line, an organic insulating film overlapping with the switching element, and a pixel electrode electrically connected to the switching element. The film thickness of the organic insulating film between the transparent substrate and the pixel electrode is thinner than that of the organic insulating film overlapping with the switching element.

[0025] According to another embodiment, a display device is provided, which includes: a first substrate; a second substrate; a liquid crystal layer located between the first substrate and the second substrate and containing a polymer and liquid crystal molecules; and a light-emitting element. The first substrate includes: a transparent substrate, a scanning line, a signal line intersecting with the scanning line, a switching element electrically connected to the scanning line and the signal line, an organic insulating film overlapping with the switching element, and a pixel electrode electrically connected to the switching element. The organic insulating film is not provided between the transparent substrate and the pixel electrode.

[0026] Next, the present embodiment will be described with reference to the drawings. It should be noted that only an example is disclosed, and appropriate changes that can be easily conceived by those skilled in the art without departing from the gist of the present invention are of course included in the scope of the present invention. In addition, for the sake of clearer illustration, the widths, thicknesses, shapes, etc. of each part are sometimes schematically shown in the drawings compared with the actual manner, but these are only examples and do not limit the interpretation of the present invention. In addition, in this specification and each drawing, the same reference numerals are used to represent the components having the same or similar functions as those described for the components in the previous drawings, and the repeated detailed descriptions will be appropriately omitted.

[0027] [First configuration example]

[0028] Figure 1It is a top view showing an example of the display device DSP of the present embodiment. In one example, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but they may also intersect at an angle other than 90 degrees. The first direction X and the second direction Y correspond to the directions parallel to the main surface of the substrate constituting the display device DSP, and the third direction Z corresponds to the thickness direction of the display device DSP. In this specification, the direction from the first substrate SUB1 toward the second substrate SUB2 is referred to as "upper side" (or simply upper), and the direction from the second substrate SUB2 toward the first substrate SUB1 is referred to as "lower side" (or simply lower). When expressed as "the second component above the first component" and "the second component below the first component", the second component may be in contact with the first component or separated from the first component. In addition, it is assumed that the observation position of observing the display device DSP is on the front end side of the arrow indicating the third direction Z, and observing from this observation position toward the X-Y plane defined by the first direction X and the second direction Y is referred to as top view observation.

[0029] In the present embodiment, as an example of the display device DSP, a liquid crystal display device using polymer dispersed liquid crystal is described. The display device DSP includes a display panel PNL, a wiring substrate 1, an IC chip 2, and a light emitting element LD.

[0030] The display panel PNL includes a first substrate SUB1, a second substrate SUB2, a liquid crystal layer LC, and a seal SL. The first substrate SUB1 and the second substrate SUB2 are formed in a flat plate shape parallel to the X-Y plane. When observed from the top view, the first substrate SUB1 overlaps with the second substrate SUB2. The first substrate SUB1 and the second substrate SUB2 are bonded by the seal SL. The liquid crystal layer LC is held between the first substrate SUB1 and the second substrate SUB2 and sealed by the seal SL. Figure 1 In, the liquid crystal layer LC and the seal SL are represented by different slashes.

[0031] As Figure 1 As magnified and schematically shown in, the liquid crystal layer LC includes polymer dispersed liquid crystal containing a polymer 31 and liquid crystal molecules 32. In one example, the polymer 31 is a liquid crystalline polymer. The polymer 31 is formed in a striped shape extending in one direction. For example, the extending direction D1 of the polymer 31 is along the first direction X. The liquid crystal molecules 32 are dispersed in the gaps of the polymer 31, and their long axes are oriented along the first direction X. The polymer 31 and the liquid crystal molecules 32 each have optical anisotropy or refractive index anisotropy. The responsiveness of the polymer 31 to an electric field is lower than the responsiveness of the liquid crystal molecules 32 to an electric field.

[0032] In one example, regardless of the presence or absence of an electric field, the orientation direction of the polymer 31 hardly changes. On the other hand, in a state where a high voltage above the threshold is applied to the liquid crystal layer LC, the orientation direction of the liquid crystal molecules 32 changes according to the electric field. In a state where no voltage is applied to the liquid crystal layer LC, the optical axes of the polymer 31 and the liquid crystal molecules 32 are parallel to each other, and the light incident on the liquid crystal layer LC is transmitted through the liquid crystal layer LC with almost no scattering (transparent state). In a state where a voltage is applied to the liquid crystal layer LC, the optical axes of the polymer 31 and the liquid crystal molecules 32 cross each other, and the light incident on the liquid crystal layer LC is scattered within the liquid crystal layer LC (scattering state).

[0033] The display panel PNL includes a display section DA that displays an image and a frame-shaped non-display section NDA that surrounds the display section DA. The seal SL is located in the non-display section NDA. The display section DA includes pixels PX arranged in a matrix along a first direction X and a second direction Y.

[0034] As Figure 1 As enlarged in [ ], each pixel PX includes a switching element SW, a pixel electrode PE, a common electrode CE, a liquid crystal layer LC, etc. The switching element SW is formed of, for example, a thin film transistor (TFT) and is electrically connected to a scanning line G and a signal line S. The scanning line G is electrically connected to the switching elements SW in the respective pixels PX arranged in the first direction X. The signal line S is electrically connected to the switching elements SW in the respective pixels PX arranged in the second direction Y. The pixel electrode PE is electrically connected to the switching element SW. The pixel electrodes PE face the common electrode CE in a third direction Z, and drive the liquid crystal layer LC (particularly, the liquid crystal molecules 32) by an electric field generated between the pixel electrode PE and the common electrode CE. A capacitor CS is formed, for example, between an electrode having the same potential as the common electrode CE and an electrode having the same potential as the pixel electrode PE.

[0035] The wiring substrate 1 is electrically connected to an extension Ex of the first substrate SUB1. The wiring substrate 1 is a bendable flexible printed circuit board. The IC chip 2 is electrically connected to the wiring substrate 1. The IC chip 2 incorporates, for example, a display driver that outputs signals required for displaying an image. It should be noted that the IC chip 2 may also be electrically connected to the extension Ex. The wiring substrate 1 and the IC chip 2 sometimes read signals from the display panel PNL, but mainly function as a signal source that supplies signals to the display panel PNL.

[0036] The light-emitting elements LD overlap the extension Ex. A plurality of light-emitting elements LD are arranged at intervals along the first direction X. These light-emitting elements LD are arranged along an end portion E21 of the second substrate SUB2 and emit light toward the end portion E21.

[0037] Figure 2It is a top view showing a first configuration example of pixels PX in the first substrate SUB1. The first substrate SUB1 includes scan lines G, signal lines S, switching elements SW, organic insulating films O, metal wirings M, capacitive electrodes C, and pixel electrodes PE.

[0038] Two scan lines G extend along the first direction X respectively and are arranged at intervals in the second direction Y. Two signal lines S extend along the second direction Y respectively and are arranged at intervals in the first direction X. The pixel PX corresponds to the region defined by two signal lines S and two scan lines G.

[0039] The switching element SW is disposed at the intersection of the scan line G and the signal line S. The specific configuration of the switching element SW will be described later, but the switching element SW can be either a bottom-gate type with the gate electrode under the semiconductor layer or a top-gate type with the gate electrode over the semiconductor layer. The semiconductor layer is formed of amorphous silicon, for example, but can also be formed of polysilicon or oxide semiconductor.

[0040] The organic insulating film O is patterned and, in Figure 2 the first configuration example shown, is formed in a lattice shape when viewed from above. That is, the organic insulating film O overlaps with the scan line G, the signal line S, and the switching element SW respectively. The organic insulating film O includes a first part OX overlapping with the scan line G and a second part OY overlapping with the signal line S. The first part OX has a first side surface E1 close to the light-emitting element LD and a second side surface E2 opposite to the first side surface E1. The first side surface E1 and the second side surface E2 extend along the extending direction D1 of the polymer 31. The second part OY has a third side surface E3 and a fourth side surface E4 opposite to the third side surface E3.

[0041] It should be noted that in this specification, the region where the organic insulating film O is disposed is referred to as the first region A1 of the first substrate SUB1, and the region where the organic insulating film O is not disposed is referred to as the second region A2 of the first substrate SUB1. The second region A2 is located inside and surrounded by the first region A1.

[0042] The metal wiring M is disposed in the first region A1 and, in Figure 2 the first configuration example shown, is formed in a lattice shape when viewed from above. That is, the metal wiring M overlaps with the scan line G, the signal line S, and the switching element SW respectively. The metal wiring M includes a first wiring part MX overlapping with the scan line G and the first part OX and a second wiring part MY overlapping with the signal line S and the second part OY.

[0043] As shown by the single-dot chain line, the capacitive electrode C is disposed across a plurality of pixels PX, and is further configured to extend substantially across the entire area of the first substrate SUB1. That is, the capacitive electrode C is respectively disposed in the first region A1 and the second region A2. In the first region A1, the capacitive electrode C overlaps with the switching element SW, the scanning line G, the signal line S, and the organic insulating film O respectively.

[0044] In the second region A2, the pixel electrode PE overlaps with the capacitive electrode C. In Figure 2 the example shown, the pixel electrode PE is disposed inside the region where the organic insulating film O is disposed. It should be noted that the pixel electrode PE can also be configured to overlap with the first part OX and the second part OY respectively.

[0045] In Figure 2 the example shown, the spacer SP overlaps with the switching element SW, and a predetermined cell gap is formed between the first substrate SUB1 and the second substrate SUB2.

[0046] Figure 3 is an enlarged top view showing an example of the Figure 2 shown switching element SW. The switching element SW includes a semiconductor layer SC, a gate electrode GE, a source electrode SE, and a drain electrode DE. The gate electrode GE is integrally formed with the scanning line G. The semiconductor layer SC overlaps with the gate electrode GE. The two source electrodes SE are integrally formed with the signal line S and are respectively connected to the semiconductor layer SC. The drain electrode DE is located between the two source electrodes SE and is connected to the semiconductor layer SC. The drain electrode DE has a connection portion DEA. The connection portion DEA is electrically connected to the pixel electrode PE through an opening CA formed in the capacitive electrode C and a contact hole CH.

[0047] Figure 4 is a cross-sectional view of the display panel PNL along the line A-B including the Figure 3 shown switching element SW. The first substrate SUB1 further includes a transparent substrate 10, insulating films 11 to 13, and an alignment film AL1. The transparent substrate 10 has a main surface (lower surface) 10A and a main surface (upper surface) 10B on the side opposite to the main surface 10A. The main surfaces 10A and 10B are surfaces substantially parallel to the X-Y plane. The gate electrode GE integrated with the scanning line G is disposed on the main surface 10B side. The insulating film 11 covers the gate electrode GE and the scanning line G and is in contact with the main surface 10B. The semiconductor layer SC is located above the insulating film 11 directly above the gate electrode GE. The two source electrodes SE integrated with the signal line S are respectively connected to the semiconductor layer SC, and a part of them is located above the insulating film 11. The drain electrode DE is connected to the semiconductor layer SC. The insulating film 12 covers the semiconductor layer SC, the source electrode SE, and the drain electrode DE constituting the switching element SW respectively, and covers the insulating film 11.

[0048] The first part OX of the organic insulating film O is in contact with the upper surface 12B of the insulating film 12 directly above the gate electrode GE and the scanning line G or directly above the switching element SW. The first wiring portion MX of the metal wiring M is located above the first part OX directly above the gate electrode GE and the scanning line G or directly above the switching element SW.

[0049] The capacitive electrode C covers the first wiring portion MX and the first part OX in the first region A1. That is, the first side surface E1 and the second side surface E2 of the first part OX are covered by the capacitive electrode C. The first wiring portion MX is in contact with and electrically connected to the capacitive electrode C. In addition, the capacitive electrode C is in contact with the upper surface 12B of the insulating film 12 in the second region A2.

[0050] The insulating film 13 is disposed in the first region A1 and the second region A2 and covers the capacitive electrode C. Each pixel electrode PE is located above the insulating film 13 in the second region A2. The pixel electrode PE and the capacitive electrode C face each other with the insulating film 13 therebetween, and a storage capacitor required for image display is formed in the pixel PX. The switching element SW is located between pixel electrodes PE adjacent in the second direction Y. The first side surface E1 and the second side surface E2 are each located between the switching element SW and the pixel electrode PE along the second direction Y. The alignment film AL1 covers the pixel electrode PE and the insulating film 13.

[0051] In such a first substrate SUB1, the film thickness of the organic insulating film O between the transparent substrate 10 and the pixel electrode PE in the third direction Z is smaller (thinner) than the film thickness T0 of the organic insulating film O overlapping with the switching element SW in the third direction Z. In Figure 4 the first configuration example shown, the organic insulating film O is not provided between the transparent substrate 10 and the pixel electrode PE. That is, the film thickness of the organic insulating film O between the transparent substrate 10 and the pixel electrode PE is zero.

[0052] In addition, the film thickness T11 of the organic insulating film O between the transparent substrate 10 and the metal wiring M in the third direction Z is greater than the film thickness T12 of the organic insulating film O between the transparent substrate 10 and the pixel electrode PE in the third direction Z. In other words, the pixel electrode PE is located lower than the metal wiring M in the third direction Z. That is, the pixel electrode PE is closer to the transparent substrate 10 than the metal wiring M.

[0053] The second substrate SUB2 includes a transparent substrate 20, a light-shielding layer BM, a common electrode CE, spacers SP, and an alignment layer AL2. The transparent substrate 20 includes a main surface (lower surface) 20A and a main surface (upper surface) 20B opposite to the main surface 20A. The main surfaces 20A and 20B are surfaces substantially parallel to the X-Y plane. The main surface 20A faces the main surface 10B. The light-shielding layer BM and the common electrode CE are disposed on the main surface 20A. The light-shielding layer BM is located directly above the first side surface E1 and the second side surface E2 of the first portion OX, directly above the switching element SW, and directly above the gate electrode GE. The common electrode CE is disposed over a plurality of pixels PX and covers the light-shielding layer BM. The common electrode CE is electrically connected to the capacitive electrode C and has the same potential as the capacitive electrode C. The spacers SP are provided under the common electrode CE and are in contact with the alignment layer AL1. The spacers SP are located between the organic insulating film O and the light-shielding layer BM. The alignment layer AL2 covers the common electrode CE.

[0054] The liquid crystal layer LC is located between the first substrate SUB1 and the second substrate SUB2 and is in contact with the alignment layers AL1 and AL2, respectively. The liquid crystal layer LC has cell gaps CG1 and CG2. The cell gap CG1 corresponds to the length in the third direction Z from the alignment layer AL1 to the alignment layer AL2 in the first region A1. The cell gap CG2 corresponds to the length in the third direction Z from the alignment layer AL1 to the alignment layer AL2 in the second region A2. The cell gap CG1 is smaller than the cell gap CG2. The cell gap CG1 is, for example, about 1.5 μm. The cell gap CG2 is, for example, about 3.0 μm.

[0055] It should be noted that by adjusting the balance between the height H of the spacers SP in the third direction Z and the film thickness T0 of the organic insulating film O, it is possible to obtain a desired effect while maintaining the cell gap CG2. For example, by making the film thickness T0 of the organic insulating film O thinner than that shown in Figure 4 the example and increasing the height H of the spacers SP, the cell gap CG1 is enlarged. Therefore, during the manufacturing process of the liquid crystal layer LC, the liquid crystal material easily spreads. In addition, by making the height of the spacers SP smaller than that shown in Figure 4 the example and increasing the film thickness T0 of the organic insulating film O, it is possible to increase the interval in the third direction Z between the switching element SW or the scanning line G and the metal wiring M. Therefore, the undesired capacitance between the switching element SW or the scanning line G and the metal wiring M can be reduced.

[0056] The transparent substrates 10 and 20 are insulating substrates such as glass substrates and plastic substrates. The insulating films 11 to 13 are formed of transparent inorganic insulating materials such as silicon nitride and silicon oxide, for example. The organic insulating film O is formed of a transparent organic insulating material such as an acrylic resin, for example. The scanning line G, the signal line S, and the metal wiring M are, for example, laminates obtained by laminating a plurality of conductive layers. In one example, a laminate obtained by sequentially laminating a conductive layer containing molybdenum (Mo), a conductive layer containing aluminum (Al), and a conductive layer containing molybdenum (Mo), but is not limited thereto, and may also be a laminate obtained by sequentially laminating a conductive layer containing titanium (Ti), a conductive layer containing aluminum (Al), and a conductive layer containing titanium (Ti). It should be noted that the scanning line G may also be a laminate of a conductive layer containing molybdenum (Mo) and a conductive layer containing aluminum (Al), and preferably, the conductive layer containing aluminum (Al) is in contact with the main surface 10B. Since aluminum (Al) has a higher light reflectivity than molybdenum (Mo), light absorption by the scanning line G from the transparent substrate 10 can be suppressed as compared with the case where the conductive layer containing molybdenum (Mo) of the scanning line G is in contact with the main surface 10B. The capacitive electrode C, the pixel electrode PE, and the common electrode CE are transparent electrodes formed of a transparent conductive material such as indium tin oxide (ITO) and indium zinc oxide (IZO). The light-shielding layer BM is, for example, a conductive layer having a lower resistance than the common electrode CE. In one example, the light-shielding layer BM is formed of an opaque metal material such as molybdenum, aluminum, tungsten, titanium, and silver. Since the common electrode CE is in contact with the light-shielding layer BM, it is electrically connected to the light-shielding layer BM. Thereby, the common electrode CE is made to have a low resistance. The alignment films AL1 and AL2 are horizontal alignment films having an alignment restricting force substantially parallel to the X-Y plane. In one example, the alignment films AL1 and AL2 are aligned in the first direction X. It should be noted that the alignment process may be a rubbing process or a photo-alignment process.

[0057] Figure 5 is a cross-sectional view of the display panel PNL along the C-D line showing the scanning line G and the connection portion DEA including Figure 3 shown.

[0058] In the first substrate SUB1, the connection portion DEA is located above the insulating film 11 and covered with the insulating film 12. The pixel electrode PE is in contact with the connection portion DEA through the contact hole CH penetrating the insulating film 12 and the insulating film 13 and the opening CA of the capacitive electrode C. The first wiring portion MX of the metal wiring M is located directly above the scanning line G. The first portion OX of the organic insulating film O is located between the scanning line G and the first wiring portion MX.

[0059] In the second substrate SUB2, the light-shielding layer BM is located directly above the first side surface E1 of the first portion OX, directly above the scanning line G, directly above the second side surface E2 (between the scanning line G and the connection portion DEA) of the first portion OX, and directly above the connection portion DEA.

[0060] Figure 6 is a cross-sectional view of a display panel PNL along line E-F showing a signal line S as shown below. Figure 3 In the first substrate SUB1, the signal line S is located above the insulating film 11 and covered by the insulating film 12. It should be noted that other conductive layers (light-shielding layer or reflective layer) formed of the same material as the scan line G can also be provided between the insulating film 11 and the transparent substrate 10. The signal line S is located between pixel electrodes PE adjacent in the first direction X. The second part OY of the organic insulating film O is located directly above the signal line S and between pixel electrodes PE adjacent in the first direction X. The third side E3 and the fourth side E4 of the second part OY are covered by the capacitive electrode C. The third side E3 and the fourth side E4 are respectively located between the signal line S and the pixel electrode PE along the first direction X. The second wiring part MY of the metal wiring M is located directly above the signal line S. In addition, the second wiring part MY is in contact with the capacitive electrode C and electrically connected to each other. The second part OY is located between the signal line S and the second wiring part MY.

[0061] In the second substrate SUB2, the light-shielding layer BM is located directly above the third side E3 and the fourth side E4 of the second part OY and directly above the signal line S.

[0062] is a schematic diagram of the display panel PNL of the present embodiment. Here, attention is paid to the spacer SP and the organic insulating film O. The organic insulating film O is provided not only in the above-mentioned display part DA but also in the non-display part NDA. The organic insulating film O has the same film thickness T0 in the non-display part NDA as in the display part DA. It should be noted that from the perspective of reducing the volume of the organic insulating film O, the organic insulating film O is not provided throughout the non-display part NDA, but it is preferably patterned to overlap with the spacer SP of the non-display part NDA. That is, in the display part DA and the non-display part NDA, the spacer SP overlaps with the organic insulating film O. When the organic insulating film O is not provided throughout the non-display part NDA, spacers with a height higher than that of the spacer SP in the display part DA need to be provided in the non-display part NDA on the basis of making the cell gap uniform. In the present embodiment, since the organic insulating film O has a film thickness T0 in both the display part DA and the non-display part NDA, by providing spacers SP with substantially the same height H in the display part DA and the non-display part NDA, the cell gap can be made uniform. That is, there is no need to provide spacers SP with different heights in the display part DA and the non-display part NDA, simplifying the manufacturing process.

[0063] Figure 7

[0064] ​The DSP of the display device according to this embodiment is configured such that the emitted light from the light-emitting element LD enters from the end portion E21 of the second substrate SUB2 and propagates in the display panel PNL. There is a tendency that the brightness decreases as the distance from the light-emitting element LD increases. One of the reasons for such a decrease in brightness is the light absorption by the organic insulating film O. That is, the organic insulating film O absorbs a part of the light propagating in the display panel PNL. Therefore, each time the light that propagates by repeating total reflection many times (100 times or more) inside the display panel PNL passes through the organic insulating film O, a part of it is absorbed, so the farther the distance from the light-emitting element LD, the lower the brightness.

[0065] According to this embodiment, the organic insulating film O overlaps with the switching element SW, and on the other hand, it is not provided between the transparent substrate 10 and the pixel electrode PE. Or, the film thickness of the organic insulating film O provided between the transparent substrate 10 and the pixel electrode PE is extremely thin. Therefore, compared with the case where the organic insulating film O is provided throughout the area between the transparent substrate 10 and the pixel electrode PE (or the entire area of the display portion DA), the total volume of the organic insulating film O is smaller. Thereby, the probability that the light propagating in the display panel PNL enters the organic insulating film O is reduced, and thus the light absorption by the organic insulating film O can be suppressed. Therefore, a decrease in display quality can be suppressed.

[0066] In addition, the organic insulating film O overlaps with the switching element SW, the scanning line G, and the signal line S. The organic insulating film O is located between the switching element SW and the metal wiring M (or the capacitive electrode C), between the scanning line G and the metal wiring M (or the capacitive electrode C), and between the signal line S and the metal wiring M (or the capacitive electrode C). Therefore, the unwanted capacitance between the overlapping wirings can be reduced.

[0067] In addition, when the light from the light-emitting element LD enters the organic insulating film O, even if unwanted scattering occurs on the second side surface E2 of the organic insulating film O, the scattered light is blocked by the light-shielding layer BM disposed directly above the second side surface E2. Therefore, a decrease in display quality can be suppressed.

[0068] In addition, the third side surface E3 and the fourth side surface E4 of the organic insulating film O cross the alignment treatment direction (the first direction X) of the alignment films AL1 and AL2. Even if alignment defects of the liquid crystal molecules 32 occur at the third side surface E3 and the fourth side surface E4, the unwanted light is blocked by the light-shielding layer BM disposed directly above the third side surface E3 and the fourth side surface E4. Therefore, a decrease in display quality can be suppressed.

[0069] However, even if the light-shielding layer BM is provided, it is preferable to have less alignment defects. Therefore, in order to suppress alignment defects at the third side surface E3 and the fourth side surface E4, reciprocating rubbing, increasing the rubbing strength, using a long-hair rubbing cloth, etc. can be performed.

[0070] The light-shielding layer BM is configured to block the reflected light or scattered light on the side surface of the organic insulating film O. In addition, in the driving method of changing the potential of the common electrode CE, it is preferable that the light-shielding layer BM is made of a conductive material. As a specific example of the light-shielding layer BM, a laminate of molybdenum / aluminum / molybdenum, a laminate of molybdenum / aluminum, or a laminate of a copper compound and other metals can be applied. When the light-shielding layer BM is a laminate of molybdenum / aluminum, the molybdenum layer is disposed on the side facing the liquid crystal layer LC, and the aluminum layer is disposed on the side facing the transparent substrate 20. Thereby, the absorption of light conducted in the transparent substrate 20 can be suppressed, and the reflected light or scattered light on the side surface of the organic insulating film O can be effectively blocked. On the other hand, in a driving method such as maintaining the potential of the common electrode CE at a certain potential, the light-shielding layer BM does not need to be made of a conductive material, but can also be made of a conductive material. When the light-shielding layer BM is made of a non-conductive material, for the purpose of preventing unnecessary scattering, it is preferable that its film thickness is as thin as possible. In addition, in the light-shielding layer BM made of a non-conductive material, preferably, a material with a high reflectivity is disposed on the side facing the transparent substrate 20, and a material with a low reflectivity is disposed on the side facing the organic insulating film O.

[0071] In the first configuration example, the transparent substrate 10 corresponds to the first transparent substrate, the transparent substrate 20 corresponds to the second transparent substrate, and the insulating film 12 corresponds to the inorganic insulating film.

[0072] Next, refer to Figures 8 to 14 to describe other configuration examples. It should be noted that Figures 8 to 14 the illustrations of the capacitor electrode C and the pixel electrode PE are omitted.

[0073] [Second Configuration Example]

[0074] Figure 8 is a cross-sectional view showing a second configuration example of the display panel PNL. Figure 8 The second configuration example shown is different from Figure 4 the first configuration example shown in that the organic insulating film O has a third portion OI between the transparent substrate 10 and the pixel electrode PE. That is, the third portion OI is located between the insulating film 12 and the capacitor electrode C and has a film thickness T1 in the third direction Z. The capacitor electrode C is in contact with the organic insulating film O. The film thickness T1 is smaller (thinner) than the film thickness T0. As described above, in the present embodiment, from the perspective of suppressing the absorption of light by the organic insulating film O, it is preferable that the volume of the organic insulating film O is small. Even in the second configuration example where the organic insulating film O is interposed between the transparent substrate 10 and the pixel electrode PE, it is also preferable that its film thickness T1 is small. In one example, the film thickness T1 is 1 / 2 or less of the film thickness T0.

[0075] In such a second configuration example, since the total volume of the organic insulating film O can be reduced, the same effects as those of the first configuration example can also be obtained.

[0076] [Third Configuration Example]

[0077] Figure 9 It is a top view showing a third configuration example of the pixel PX in the first substrate SUB1. Figure 9 The shown third configuration example compared with Figure 2 the shown first configuration example is different in that the organic insulating film O and the metal wiring M are formed in a strip shape along the second direction Y. That is, the organic insulating film O has a second part OY that overlaps with the switching element SW and overlaps with the signal line S. On the other hand, the organic insulating film O does not have the first part OX. In addition, the metal wiring M has a second wiring part MY that overlaps with the switching element SW and overlaps with the signal line S with the organic insulating film O in between. On the other hand, the metal wiring M does not have the first wiring part MX.

[0078] In such a third configuration example, the same effects as those of the above first configuration example can also be obtained. Moreover, by omitting the first part OX, the total volume of the organic insulating film O is further reduced, thereby further suppressing the light absorption of the organic insulating film O.

[0079] In addition, by omitting the first part OX, when the light from the light-emitting element LD enters the organic insulating film O, it suppresses Figure 2 the unwanted scattering on the shown second side E2. In addition, the width of the light-shielding layer BM overlapping with the scanning line G along the first direction X can be reduced, and the opening area of each pixel can be enlarged.

[0080] [Fourth Configuration Example]

[0081] Figure 10 It is a top view showing a fourth configuration example of the pixel PX in the first substrate SUB1. Figure 10 The shown fourth configuration example compared with Figure 2 the shown first configuration example is different in that the organic insulating film O and the metal wiring M are formed in a strip shape along the first direction X. That is, the organic insulating film O has a first part OX that overlaps with the switching element SW and overlaps with the scanning line G. On the other hand, the organic insulating film O does not have the second part OY. In addition, the metal wiring M has a first wiring part MX that overlaps with the switching element SW and overlaps with the scanning line G with the organic insulating film O in between. On the other hand, the metal wiring M does not have the second wiring part MY.

[0082] In such a fourth configuration example, the same effects as those of the above first configuration example can also be obtained. Moreover, by omitting the second part OY, the total volume of the organic insulating film O is further reduced, thereby further suppressing the light absorption of the organic insulating film O.

[0083] In addition, by omitting the second part OY, the Figure 2 poor alignment of the liquid crystal molecules 32 at the third side surface E3 and the fourth side surface E4 shown is suppressed. In addition, the width of the light-shielding layer BM overlapping with the signal line S in the second direction Y can be reduced, and the aperture area of each pixel can be enlarged.

[0084] Next, refer to Figure 11 and Figure 12 to describe the fifth and sixth structural examples. It should be noted that in the fifth and sixth structural examples, a plurality of light-emitting elements LD are arranged at intervals in the second direction Y, and the extending direction D1 of the polymer 31 is in the second direction Y.

[0085] [Fifth Structural Example]

[0086] Figure 11 is a top view showing a fifth structural example of the pixel PX in the first substrate SUB1. Except for the above-mentioned light-emitting element LD and the extending direction D1 of the polymer 31, Figure 11 the fifth structural example shown and Figure 9 the third structural example shown have the same structure.

[0087] In such a fifth structural example, the same effect as the above-mentioned first structural example can also be obtained. In addition, by omitting the first part OX, the total volume of the organic insulating film O is further reduced, thereby further suppressing the light absorption of the organic insulating film O.

[0088] In addition, by omitting the first part OX, the Figure 2 poor alignment of the liquid crystal molecules 32 at the first side surface E1 and the second side surface E2 shown is suppressed. In addition, the width of the light-shielding layer BM overlapping with the scanning line G in the first direction X can be reduced, and the aperture area of each pixel can be enlarged.

[0089] [Sixth Structural Example]

[0090] Figure 12 is a top view showing a sixth structural example of the pixel PX in the first substrate SUB1. Except for the above-mentioned light-emitting element LD and the extending direction D1 of the polymer 31, Figure 12 the sixth structural example shown and Figure 10 the fourth structural example shown have the same structure.

[0091] In such a sixth structural example, the same effect as the above-mentioned first structural example can also be obtained. In addition, by omitting the second part OY, the total volume of the organic insulating film O is further reduced, thereby further suppressing the light absorption of the organic insulating film O.

[0092] In addition, by omitting the first part OX, when the light from the light-emitting element LD enters the organic insulating film O, the unwanted scattering on the fourth side surface E4 shown in Figure 2 is suppressed. In addition, the width of the light-shielding layer BM overlapping with the signal line S in the second direction Y can be reduced, and the aperture area of each pixel can be enlarged. Figure 2 Shown in Figure 2 .

[0093] [Seventh Configuration Example]

[0094] Figure 13 It is a top view showing a seventh configuration example of the pixel PX in the first substrate SUB1. Figure 13 The seventh configuration example shown in Figure 13 is different from the first configuration example shown in Figure 2 in that the organic insulating film O has overlapping portions OX1 and OX2 and overlapping portions OY1 and OY2. The overlapping portions OX1 and OX2 overlap with the scanning line G. The overlapping portion OX1 is separated from the overlapping portion OX2. That is, between the overlapping portion OX1 and the overlapping portion OX2, the organic insulating film O does not overlap with the scanning line G. The overlapping portions OY1 and the overlapping portions OY2 overlap with the signal line S. The overlapping portion OY1 is separated from the overlapping portion OY2. That is, between the overlapping portion OY1 and the overlapping portion OY2, the organic insulating film O does not overlap with the signal line S. The display panel PNL has the cell gap CG2 shown in Figure 4 between the overlapping portion OX1 and the overlapping portion OX2 and between the overlapping portion OY1 and the overlapping portion OY2. Therefore, during the process of manufacturing the liquid crystal layer LC, the liquid crystal material easily spreads. Figure 2 Shown in Figure 2 . Figure 4 Shown in Figure 4 .

[0095] In such a seventh configuration example, the same effect as the above-mentioned first configuration example can also be obtained.

[0096] In the seventh configuration example, the overlapping portion OX1 and the overlapping portion OY1 correspond to the first overlapping portion, and the overlapping portion OX2 and the overlapping portion OY2 correspond to the second overlapping portion.

[0097] [Eighth Configuration Example]

[0098] Figure 14 It is a top view showing an eighth configuration example of the pixel PX in the first substrate SUB1. Figure 14 The eighth configuration example shown in Figure 14 is different from the first configuration example shown in Figure 2 in that the organic insulating film O only overlaps with the switching element SW. Figure 2 Shown in Figure 2 .

[0099] In such an eighth configuration example, the same effect as the above-mentioned first configuration example can also be obtained. Moreover, by omitting the first part OX and the second part OY, the total volume of the organic insulating film O is further reduced, thereby further suppressing the absorption of light by the organic insulating film O.

[0100] Next, refer to Figures 15 to 18 . Figures 15 to 18, which illustrates the effects of this embodiment based on actual measurements.

[0101] Figure 15 This is a diagram for explaining a measurement method for measuring the absorptivity of a sample. The light source 101 irradiates the sample SA with reference light. The detector 102 measures the transmittance of the light transmitted through the sample SA. The detector 103 measures the reflectance of the light reflected by the sample SA. Here, the light source 101, the detector 102, and the detector 103 are arranged such that the incident angle θi of the reference light with respect to the sample SA, the exit angle θt of the light transmitted through the sample SA, and the reflection angle θr of the light reflected by the sample SA are specified values. In one example, the incident angle θi, the exit angle θt, and the reflection angle θr are all equal, for example, set to 5°. When the absorptivity (%), transmittance (%), and reflectance (%) of the sample SA are set as A, T, and R respectively, the absorptivity A can be defined as follows.

[0102] A = 100 - T - R

[0103] However, here it is assumed that the haze of the sample SA and the scattering on the sample SA can be ignored, and it is assumed that the surface of the sample SA is flat.

[0104] Figure 16 This is a diagram showing the measurement results of the absorptivity of the material forming the organic insulating film O. The horizontal axis in the figure is the wavelength (nm), and the vertical axis is the absorptivity (%). Regarding the absorptivity of the material (sample A) forming the organic insulating film O of this embodiment and the material (sample B) forming the transparent substrate of the liquid crystal display device, measurements are made by referring to the Figure 15 measurement method described. Sample A is an acrylic resin, and sample B is glass. The main emission wavelengths of the light-emitting element LD of this embodiment are 466 nm (blue wavelength), 531 nm (green wavelength), and 622 nm (red wavelength).

[0105] Regarding sample B, it hardly absorbs any wavelength. On the other hand, regarding sample A, there is a tendency that the absorptivity on the short-wavelength side is higher than that on the long-wavelength side. For example, in sample A, the absorptivity of the green wavelength is higher than that of the red wavelength, and the absorptivity of the blue wavelength is higher than that of the green wavelength. In particular, it is confirmed that the absorptivity exceeds 1% at the blue wavelength. That is, among the light emitted from the light-emitting element LD, compared with the light of the red wavelength and the green wavelength, the light of the blue wavelength is more likely to be absorbed in the organic insulating film O. According to this embodiment, compared with the case where the organic insulating film O is provided over the entire area of the display portion DA, the total volume of the organic insulating film O is smaller. Therefore, in particular, the absorption of the light of the blue wavelength by the organic insulating film O can be suppressed, and as the light propagates in the display device DSP, the undesired chromaticity deviation caused by the difference in the absorptivity of each color wavelength by the organic insulating film O can be suppressed, and the reduction in display quality can be suppressed.

[0106] Figure 17 This is a diagram for explaining the propagation of the emitted light from the light-emitting element LD in the display device DSP. The display device DSP includes a transparent substrate 30 in addition to the display panel PNL. The transparent substrate 20 has a side surface 20C facing the light-emitting element LD. The side surface 20C corresponds to Figure 1 the end portion E21 of the second substrate SUB2 shown. The transparent substrate 30 includes a main surface (lower surface) 30A, a main surface (upper surface) 30B on the side opposite to the main surface 30A, and a side surface 30C. The main surfaces 30A and 30B are surfaces substantially parallel to the X-Y plane. The main surface 30A faces the main surface 20B of the transparent substrate 20. The main surface 30B is in contact with, for example, an air layer. The side surface 30C faces the light-emitting element LD and overlaps with the side surface 20C. The transparent substrate 30 is bonded to the transparent substrate 20 through a transparent adhesive layer AD. The adhesive layer AD is in contact with the main surfaces 30A and 20B.

[0107] As shown by the arrows in the figure, the emitted light from the light-emitting element LD attenuates more as it is farther from the side surfaces 20C and 30C serving as the light-incident portions. As Figure 16 shown, the light absorption rate in the glass forming the transparent substrates 10, 20, 30, etc. is less than 0.1%, so the main reason for the attenuation of the emitted light is the light absorption in the various thin films between the transparent substrate 10 and the transparent substrate 20 and between the transparent substrate 20 and the transparent substrate 30, respectively.

[0108] Figure 18 This is a diagram showing the brightness measurement results in the display device DSP of the present embodiment and the display devices of the comparative examples. In the display device (C) of the comparative example, the organic insulating film O is disposed almost over the entire region of the first substrate SUB1, and the scanning line G is formed of a laminate of molybdenum (Mo), aluminum (Al), and molybdenum (Mo). In the display device (B) of the comparative example, the organic insulating film O is disposed almost over the entire region of the first substrate SUB1, and the scanning line G is formed of a laminate of molybdenum (Mo), aluminum (Al), and molybdenum (Mo). In the display device DSP (A) of the present embodiment, as described above, the organic insulating film O is disposed in a lattice pattern, and the scanning line G is formed of a laminate of molybdenum (Mo), aluminum (Al), and molybdenum (Mo). The brightness of each display device was measured at different distances from the light-incident portion. The light-incident portion corresponds to Figure 17 the side surfaces 20C and 30C shown. Figure 18 The horizontal axis of is the distance from the light-incident portion, and the vertical axis is the relative value of the brightness. As Figure 18As shown, it can be confirmed that, compared with the display device (B) of the comparative example, the total capacitance of the organic insulating film O in the display device DSP(A) of the present embodiment is small. Therefore, even when away from the light incident portion, the brightness reduction is small, and about 8% reduction of light can be suppressed. In addition, it can be confirmed that, compared with the display device (C) of the comparative example, in the display device DSP(A) of the present embodiment, since the total capacitance of the organic insulating film O is small and the structure of the laminate forming the scanning line G is different, even when away from the light incident portion, the brightness reduction is small, and about 16% reduction of light can be suppressed.

[0109] As described above, according to the present embodiment, a display device capable of suppressing the deterioration of display quality can be provided.

[0110] It should be noted that although some embodiments of the present invention have been described, these embodiments are presented by way of example only and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments or their modifications are included in the scope or gist of the invention and are included in the invention described in the claims and its equivalents.

[0111] Next, an example of a display device that can be obtained from the structures disclosed in this specification will be supplementarily described. (1)

[0113] A display device includes:

[0114] A first substrate;

[0115] A second substrate;

[0116] A liquid crystal layer located between the first substrate and the second substrate and containing a polymer and liquid crystal molecules; and

[0117] A light-emitting element,

[0118] The first substrate includes a transparent substrate, a scanning line, a signal line intersecting with the scanning line, a switching element electrically connected to the scanning line and the signal line, an organic insulating film overlapping with the switching element, and a pixel electrode electrically connected to the switching element.

[0119] The film thickness of the organic insulating film between the transparent substrate and the pixel electrode is thinner than the film thickness of the organic insulating film overlapping with the switching element. (2)

[0121] According to the display device described in (1), wherein,

[0122] The first substrate includes:

[0123] An inorganic insulating film, located between the transparent substrate and the pixel electrode; and

[0124] A capacitive electrode, located between the inorganic insulating film and the pixel electrode,

[0125] The organic insulating film is located between the inorganic insulating film and the capacitive electrode,

[0126] The capacitive electrode is in contact with the organic insulating film. (3)

[0128] The display device according to (2), wherein,

[0129] The first substrate includes a metal wiring electrically connected to the capacitive electrode,

[0130] The organic insulating film is located at least on one of between the scanning line and the metal wiring and between the signal line and the metal wiring. (4)

[0132] A display device, comprising:

[0133] A first substrate;

[0134] A second substrate;

[0135] A liquid crystal layer, located between the first substrate and the second substrate, and containing a polymer and liquid crystal molecules; and

[0136] A light-emitting element,

[0137] The first substrate includes: a transparent substrate, a scanning line, a signal line intersecting with the scanning line, a switching element electrically connected to the scanning line and the signal line, an organic insulating film overlapping with the switching element, and a pixel electrode electrically connected to the switching element,

[0138] The organic insulating film is not provided between the transparent substrate and the pixel electrode. (5)

[0140] The display device according to (4), wherein,

[0141] The first substrate includes:

[0142] An inorganic insulating film, located between the transparent substrate and the pixel electrode; and

[0143] A capacitive electrode, located between the inorganic insulating film and the pixel electrode,

[0144] The capacitive electrode is in contact with the upper surface of the inorganic insulating film. (6)

[0146] The display device according to (5), wherein,

[0147] The first substrate includes a metal wiring electrically connected to the capacitive electrode,

[0148] The organic insulating film is located at least on one side between the scanning line and the metal wiring and between the signal line and the metal wiring. (7)

[0150] The display device according to any one of (1) to (6), wherein,

[0151] The second substrate includes a light-shielding layer overlapping with the switching element,

[0152] The organic insulating film has a first side surface close to the light-emitting element and a second side surface opposite to the first side surface,

[0153] The light-shielding layer overlaps with the second side surface. (8)

[0155] The display device according to (7), wherein,

[0156] The second substrate includes a common electrode,

[0157] The light-shielding layer is a conductive layer having a lower resistance than the common electrode and is electrically connected to the common electrode. (9)

[0159] The display device according to (7) or (8), further includes a spacer located between the organic insulating film and the light-shielding layer. (10)

[0161] The display device according to any one of (1) to (9), wherein,

[0162] When viewed from above, the organic insulating film overlaps at least one of the scanning line and the signal line. (11)

[0164] The display device according to (10), wherein,

[0165] The organic insulating film has a first overlapping portion and a second overlapping portion overlapping with the scanning line or the signal line,

[0166] The first overlapping portion and the second overlapping portion are separated from each other.

Claims

1. A display device, comprising: a first substrate; a second substrate; a liquid crystal layer located between the first substrate and the second substrate and containing a polymer and liquid crystal molecules; and a light-emitting element, wherein the first substrate includes a transparent substrate, scan lines, signal lines intersecting the scan lines, switching elements electrically connected to the scan lines and the signal lines, an organic insulating film overlapping the switching elements, pixel electrodes electrically connected to the switching elements, a first inorganic insulating film located between the transparent substrate and the pixel electrodes, capacitive electrodes located between the first inorganic insulating film and the pixel electrodes, a second inorganic insulating film located between the capacitive electrodes and the pixel electrodes, and metal wirings electrically connected to the capacitive electrodes, the film thickness of the organic insulating film between the transparent substrate and the pixel electrodes is thinner than that of the organic insulating film overlapping the switching elements, the organic insulating film is located between the first inorganic insulating film and the capacitive electrodes, and the area of the capacitive electrodes is larger than that of the pixel electrodes, the organic insulating film is located at least on one side between the scan lines and the metal wirings and between the signal lines and the metal wirings.

2. The display device according to claim 1, wherein the second substrate includes a light-shielding layer overlapping the switching elements, the organic insulating film has a first side face close to the light-emitting element and a second side face opposite to the first side face, the light-shielding layer overlaps the second side face.

3. The display device according to claim 2, wherein the second substrate includes a common electrode, the light-shielding layer is a conductive layer having a lower resistance than the common electrode and is electrically connected to the common electrode.

4. The display device according to claim 2, wherein the display device further includes a spacer located between the organic insulating film and the light-shielding layer.

5. The display device according to claim 1, wherein when viewed from above, the organic insulating film overlaps at least one of the scan lines and the signal lines.

6. The display device according to claim 5, wherein the organic insulating film has a first overlapping portion and a second overlapping portion overlapping the scan lines or the signal lines, the first overlapping portion is separated from the second overlapping portion.

7. A display device, comprising: a first substrate; a second substrate; a liquid crystal layer located between the first substrate and the second substrate and containing a polymer and liquid crystal molecules; and a light-emitting element, wherein the first substrate includes a transparent substrate, scan lines, signal lines intersecting the scan lines, switching elements electrically connected to the scan lines and the signal lines, an organic insulating film overlapping the switching elements, pixel electrodes electrically connected to the switching elements, a first inorganic insulating film located between the transparent substrate and the pixel electrodes, capacitive electrodes located between the first inorganic insulating film and the pixel electrodes, a second inorganic insulating film located between the capacitive electrodes and the pixel electrodes, and metal wirings electrically connected to the capacitive electrodes, the organic insulating film is not provided between the transparent substrate and the pixel electrodes, The area of the capacitive electrode is larger than the area of the pixel electrode. The organic insulating film is located between at least one of the scanning line and the metal wiring and between the signal line and the metal wiring.

8. The display device according to claim 7, wherein The second substrate includes a light-shielding layer overlapping with the switching element. The organic insulating film has a first side face close to the light-emitting element and a second side face opposite to the first side face. The light-shielding layer overlaps with the second side face.

9. The display device according to claim 8, wherein The second substrate includes a common electrode. The light-shielding layer is a conductive layer having a lower resistance than the common electrode and is electrically connected to the common electrode.

10. The display device according to claim 8, wherein The display device further includes a spacer located between the organic insulating film and the light-shielding layer.

11. The display device according to claim 7, wherein In a top view, the organic insulating film overlaps with at least one of the scanning line and the signal line.

12. The display device according to claim 11, wherein The organic insulating film has a first overlapping portion and a second overlapping portion overlapping with the scanning line or the signal line, The first overlapping portion is separated from the second overlapping portion.

Images