Surface processing methods and structural parts

Abstract

The present application provides a surface processing method and a structural part. The surface processing method includes processing a first surface using a first processing technique so that the roughness of the first surface after processing is a first roughness. Processing a second surface using a second processing technique so that the roughness of the second surface after processing is a second roughness. And the absolute value of the difference between the first roughness and the second roughness is less than a preset value. The present application uses different processing techniques to process surfaces with different microstructures, thereby improving the processing effects of different surfaces and making the roughness of different surfaces similar, thereby improving the surface quality uniformity of the workpiece to be processed.

Description

Technical Field

[0001] The present application belongs to the field of additive manufacturing technology, and specifically relates to surface processing methods and structural parts. Background Art

[0002] Additive manufacturing technology (3D printing technology) is a technology that manufactures three-dimensional solid structural parts by layering and stacking materials. Due to its special preparation method, the microstructure of the first surface of the workpiece perpendicular to its stacking direction obtained by additive manufacturing is different from the microstructure of the second surface parallel to its stacking direction, resulting in different mechanical properties and processing performance of the two surfaces. However, at present, the same processing is usually used for these two surfaces, resulting in a large difference in the surface roughness of the two surfaces after processing, resulting in low surface quality uniformity of the overall workpiece. Summary of the invention

[0003] In view of this, the first aspect of the present application provides a surface processing method, which is applied to a workpiece to be processed obtained by additive manufacturing, wherein the workpiece to be processed has a first surface and a second surface connected by a bend, the first surface is perpendicular to the stacking direction of the workpiece to be processed, and the second surface is parallel to the stacking direction of the workpiece to be processed, and the surface processing method comprises:

[0004] Processing the first surface using a first processing technique so that the roughness of the processed first surface is a first roughness;

[0005] The second surface is processed by a second processing technique, so that the roughness of the processed second surface is a second roughness; and the absolute value of the difference between the first roughness and the second roughness is smaller than a preset value.

[0006] The surface processing method provided in the first aspect of the present application has simple steps and strong operability. First, the first surface is processed by a first processing technology, and the second surface is processed by a second processing technology, so that the absolute value of the difference in roughness between the first surface and the second surface is less than a preset value. Among them, the stacking direction of the workpiece to be processed refers to the stacking direction of the material in the process of additive manufacturing, and can also be understood as the direction in which the material is stacked from bottom to top. Therefore, the first surface perpendicular to the stacking direction of the workpiece to be processed can also be understood as the top surface or bottom surface of the workpiece to be processed; the second surface parallel to the stacking direction of the workpiece to be processed can also be understood as the side of the workpiece to be processed.

[0007] Specifically, since the workpiece to be processed is obtained by additive manufacturing, the microstructures of the first surface and the second surface are different, for example, different grain distributions, different grain boundary sizes, etc., so the mechanical properties of the first surface and the second surface are different, resulting in different processing properties of the first surface and the second surface. Therefore, the present application adopts different processing techniques for the first surface and the second surface according to the difference in the microstructures of the first surface and the second surface, so that the processing techniques correspond to the surfaces, which can improve the processing effect, effectively reduce the surface roughness, and improve the surface quality. In addition, the absolute value of the difference between the first roughness and the second roughness is less than the preset value; it can also be understood that the difference between the first roughness and the second roughness is within a preset range; in other words, the first roughness is close to or equal to the second roughness, thereby improving the uniformity of the overall surface quality of the workpiece to be processed.

[0008] In the related art, due to the different microstructures of the first surface and the second surface, using the same processing technology to process the first surface and the second surface can easily lead to a large difference in the roughness of the first surface and the second surface after processing, that is, a large difference between the first roughness and the second roughness, resulting in a low uniformity in the overall surface quality of the workpiece to be processed.

[0009] Therefore, the present application uses different processing techniques to process surfaces with different microstructures, which not only improves the processing effects of different surfaces, but also makes the roughness of different surfaces similar, thereby improving the uniformity of the surface quality of the workpiece to be processed.

[0010] The first surface is composed of a plurality of first grains, the first grains have a first grain size, and in the surface processing method, the first processing technology is obtained according to the first grain size.

[0011] The second surface is composed of a plurality of second grains, the second grains have a second grain size, and in the surface processing method, the second processing technology is obtained according to the second grain size.

[0012] Wherein, before “using a first processing technique to process the first surface so that the roughness of the processed first surface is the first roughness”, it also includes:

[0013] The first surface and the second surface are processed by the first processing technique or the second processing technique, so that the roughness of the processed first surface is the first pre-processing roughness, and the roughness of the processed second surface is the second pre-processing roughness;

[0014] When the absolute value of the difference between the first pre-processing roughness and the second pre-processing roughness is not less than the preset value, the second processing technology of the first surface is adjusted to the first processing technology; or the first processing technology of the second surface is adjusted to the second processing technology.

[0015] Wherein, before “using a first processing technique to process the first surface so that the roughness of the processed first surface is the first roughness”, it also includes:

[0016] The first surface and the second surface are processed by the third processing technique, so that the roughness of the processed first surface is the first pre-processing roughness, and the roughness of the processed second surface is the second pre-processing roughness;

[0017] When the absolute value of the difference between the first pre-processing roughness and the second pre-processing roughness is not less than the preset value, the third processing technology of the first surface is adjusted to the first processing technology, and the third processing technology of the second surface is adjusted to the second processing technology.

[0018] Wherein, in the surface processing method, the first processing technology includes a first processing speed, a first spindle speed, a first processing time, a first processing feed amount, and a first processing depth, and the second processing technology includes a second processing speed, a second spindle speed, a second processing time, a second processing feed amount, and a second processing depth;

[0019] Among them, the first processing speed is greater than or less than the second processing speed; and / or, the first spindle speed is greater than or less than the second spindle speed; and / or, the first processing time is greater than or less than the second processing time; and / or, the first processing feed rate is greater than or less than the second processing feed rate; and / or, the first processing depth is greater than or less than the second processing depth.

[0020] The second aspect of the present application provides a structural part, which is a workpiece to be processed obtained by additive manufacturing through a surface processing method as provided in the first aspect of the present application, and the structural part has an end face and a side face connected by a bending connection, and the roughness of the end face is a first roughness, and the roughness of the side face is a second roughness, and the absolute value of the difference between the first roughness and the second roughness is less than a preset value.

[0021] The structural part provided in the second aspect of the present application is obtained by using the surface processing method provided in the first aspect of the present application on the workpiece to be processed. The structural part is composed of an end face and a side face. Among them, the first surface of the workpiece to be processed is subjected to the surface processing method provided in the present application so that the roughness of the first surface is the first roughness, thereby obtaining a structural part with the roughness of the end face being the first roughness. And the second surface of the workpiece to be processed is subjected to the surface processing method provided in the present application so that the roughness of the second surface is the second roughness, thereby obtaining a structural part with the roughness of the side face being the second roughness. And, the first roughness is similar to the second roughness.

[0022] Therefore, by using different processing techniques to process the first surface and the second surface with different microstructures respectively, a structural part with end faces and side faces with similar roughness can be obtained, which not only improves the surface quality uniformity of the structural part, but also improves the processing effect of the end faces and side faces, thereby improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0024] Figure 1 This is a process flow chart of a surface processing method in one embodiment of the present application.

[0025] Figure 2 This is a schematic diagram of the structure of a workpiece to be processed in one embodiment of the present application.

[0026] Figure 3 Schematic diagram of the structure of the first surface in one embodiment of the present application.

[0027] Figure 4 Schematic diagram of the structure of the second surface in one embodiment of the present application.

[0028] Figure 5 This is a schematic structural diagram of the second surface in another embodiment of the present application.

[0029] Figure 6 This is a process flow chart of a surface processing method in another embodiment of the present application.

[0030] Figure 7 This is a process flow chart of a surface processing method in another embodiment of the present application.

[0031] Figure 8 Schematic diagram of the structure of a structural member in one embodiment of the present application.

[0032] Description of labels:

[0033] Workpiece to be processed-1, first surface-11, first grain boundary-111, second surface-12, second grain boundary-121, structural component-2, end face-21, side face-22. DETAILED DESCRIPTION

[0034] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0035] Before introducing the technical solution of the present application, the technical problems in the related technology are introduced in detail.

[0036] Additive manufacturing technology is a technology that manufactures three-dimensional solid parts by layering and stacking materials. Metal materials prepared by additive manufacturing technology have excellent mechanical properties and have broad application prospects in various fields. The surface roughness of the workpiece obtained by additive manufacturing is still relatively high, and cutting, milling or grinding is required to reduce the surface roughness and obtain the desired shape.

[0037] In the traditional surface processing method, the processing method for the workpiece to be processed using traditional methods (such as casting, forging) is suitable for non-anisotropic workpieces to be processed. Usually, the same processing parameters are adopted on different processing surfaces, that is, the same processing process is used for different surfaces.

[0038] However, due to the particularity of the workpiece to be processed by additive manufacturing, which is formed by stacking, the microstructure of the end face (top face and / or bottom face) perpendicular to the stacking direction and the side face parallel to the stacking direction of the workpiece to be processed by additive manufacturing are different, and regardless of whether the same or different materials are used, the microstructure of the end face and the side face of the workpiece to be processed are different, resulting in different mechanical properties and processing properties of the two surfaces. It can also be understood that each surface of the workpiece to be processed is anisotropic. Among them, the microstructure refers to the grain size, grain distribution, etc. in the surface. At present, the same processing treatment is usually used for these two surfaces. For example, the processing characteristics of different surfaces of metal materials after additive manufacturing are not distinguished. Generally, the same cutting processing parameters are used on the side and end faces, so it cannot be guaranteed to obtain a uniform and consistent processing surface, that is, the surface roughness of the two surfaces after processing is quite different, which leads to a low uniformity of the overall surface quality of the workpiece to be processed.

[0039] In view of this, in order to solve the above problems, this application provides a surface processing method. Please refer to Figure 1-Figure 2 , Figure 1 This is a process flow chart of a surface processing method in one embodiment of the present application. Figure 2This is a schematic diagram of the structure of a workpiece to be processed in one embodiment of the present application.

[0040] This embodiment provides a surface processing method, which is applied to a workpiece 1 to be processed obtained by additive manufacturing. The workpiece 1 to be processed has a first surface 11 and a second surface 12 connected by a bend. The first surface 11 is perpendicular to the stacking direction of the workpiece 1 to be processed, and the second surface 12 is parallel to the stacking direction of the workpiece 1 to be processed.

[0041] The surface processing method in this embodiment is used to process the workpiece 1 to reduce the roughness of its surface and improve the surface quality. In addition, the surface processing method in this embodiment makes the absolute value of the difference between the roughness of each surface less than a preset value to improve the uniformity of the surface quality of the workpiece 1. Optionally, the surface processing method includes but is not limited to rough processing, precision processing, ultra-precision processing, etc.

[0042] The workpiece 1 in this embodiment includes a first surface 11 and a second surface 12. The stacking direction of the workpiece 1 refers to the stacking direction of the material in the additive manufacturing process, which can also be understood as the direction in which the material is stacked from bottom to top. Figure 2 The first surface 11 (shown in the direction D1 in the figure) can also be understood as the top surface or bottom surface of the workpiece 1 to be processed; the second surface 12 parallel to the stacking direction D1 of the workpiece 1 to be processed can also be understood as the side surface of the workpiece 1 to be processed. This embodiment does not limit the shape, size, and material of the workpiece 1 to be processed. Optionally, the material of the workpiece 1 to be processed includes but is not limited to metals, alloys, etc., such as titanium alloy, stainless steel, copper alloy, aluminum alloy, etc. The shape of the workpiece 1 to be processed is but is not limited to a cube, a cuboid, a prism, etc.

[0043] Optionally, the angle α1 between the second surface 12 and the stacking direction of the workpiece 1 to be processed satisfies the following range: 0°≤α1<90°. Therefore, the second surface 12 can also be understood as an inclined surface with a certain inclination angle to the stacking direction of the workpiece 1 to be processed.

[0044] The surface processing method includes S100 and S200, wherein S100 and S200 are described in detail as follows.

[0045] S100, using a first processing technique to process the first surface 11, so that the roughness of the processed first surface 11 is a first roughness.

[0046] In this embodiment, the first processing technique is used to process the first surface 11, so as to reduce the roughness of the first surface 11 and improve the surface quality of the first surface 11. In this embodiment, the type and processing parameters of the first processing technique are not limited, and the roughness of the processed first surface 11 only needs to be the first roughness. Optionally, the first processing technique includes but is not limited to milling, grinding, laser processing, electric discharge processing, etc.

[0047] For example, in one embodiment, when the first processing technology is milling, the roughness of the first surface 11 can be the first roughness by adjusting processing parameters such as milling speed, milling time, milling depth, milling width, and milling feed. In another embodiment, when the first processing technology is grinding, the roughness of the first surface 11 can be the first roughness by adjusting processing parameters such as grinding speed, speed of the workpiece 1 to be processed, grinding time, and grinding feed. In another embodiment, when the first processing technology is laser processing, the roughness of the first surface 11 can be the first roughness by adjusting processing parameters such as scanning speed, scanning mode, scanning path, substrate preheating temperature, cutting speed, laser power, laser time, and laser frequency. In another embodiment, when the first processing technology is discharge machining, the roughness of the first surface 11 can be the first roughness by adjusting processing parameters such as current, pulse width, gap voltage, discharge time, and voltage.

[0048] S200, using a second processing technique to process the second surface 12, so that the roughness of the processed second surface 12 is a second roughness; and the absolute value of the difference between the first roughness and the second roughness is less than a preset value.

[0049] In this embodiment, the second processing technology is used to process the second surface 12, so as to reduce the roughness of the second surface 12 and improve the surface quality of the second surface 12. In this embodiment, the type and processing parameters of the second processing technology are not limited, and the roughness of the processed second surface 12 only needs to be the second roughness. Optionally, the second processing technology includes but is not limited to milling, grinding, laser processing, electric discharge processing, etc.

[0050] For example, in one embodiment, when the second processing technology is milling, the roughness of the second surface 12 can be adjusted to the second roughness by adjusting processing parameters such as milling speed, milling time, milling depth, milling width, and milling feed. In another embodiment, when the second processing technology is grinding, the roughness of the second surface 12 can be adjusted to the second roughness by adjusting processing parameters such as grinding speed, speed of the workpiece 1 to be processed, grinding time, and grinding feed. In another embodiment, when the second processing technology is laser processing, the roughness of the second surface 12 can be adjusted to the second roughness by adjusting processing parameters such as scanning speed, scanning mode, scanning path, substrate preheating temperature, cutting speed, laser power, laser time, and laser frequency. In another embodiment, when the second processing technology is discharge machining, the roughness of the second surface 12 can be adjusted to the second roughness by adjusting processing parameters such as current, pulse width, gap voltage, discharge time, and voltage.

[0051] Optionally, in one embodiment, before the workpiece 1 is processed using the surface processing method provided in this embodiment, the absolute value of the difference between the initial roughness of the first surface 11 and the second surface 12 before processing is not less than a preset value.

[0052] In another embodiment, before the workpiece 1 is processed using the surface processing method provided in this embodiment, the absolute value of the difference between the initial roughness of the first surface 11 and the second surface 12 before processing is less than the preset value, but the initial roughness of the first surface 11 is not equal to the first roughness, and the initial roughness of the second surface 12 is not equal to the second roughness, which cannot meet the roughness requirements of the structural parts obtained by subsequent processing. It can also be understood that although the initial roughness of the first surface 11 and the second surface 12 are similar, their initial roughness is not within the preset roughness range required by the product, and the workpiece 1 needs to be processed so that the roughness of the first surface 11 and the second surface 12 in the workpiece 1 are similar, and the first roughness and the second roughness are within the preset roughness range. Among them, the preset roughness can be adjusted according to product requirements.

[0053] Optionally, the type of the first processing technology is the same as the type of the second processing technology. When the type of the first processing technology is the same as the type of the second processing technology, only the processing parameters of the first processing technology and the second processing technology need to be adjusted without replacing the processing equipment, so the processing time can be reduced and the processing efficiency can be improved.

[0054] Optionally, the type of the first processing technology is different from the type of the second processing technology. In this case, according to the microstructure of the first surface 11 and the second surface 12, a processing technology with better processing efficiency for the corresponding surface can be selected to improve the processing efficiency of the workpiece 1 to be processed. For example, in one embodiment, when milling has a higher processing efficiency for the first surface 11 and laser processing has a higher processing efficiency for the second surface 12, the first processing technology is milling and the second processing technology is laser processing to improve the surface processing efficiency of the workpiece to be processed.

[0055] In this embodiment, the absolute value of the difference between the first roughness and the second roughness is less than the preset value, which can also be understood as making the difference between the first roughness and the second roughness within the preset range; or, making the first roughness and the second roughness similar or equal. For example, when the first roughness is 100nm, the second roughness is 108nm, and the preset value is 10, the absolute value of the difference between the first roughness and the second roughness is 8, which is less than the preset value of 10. At this time, the first roughness of the first surface 11 is similar to the second roughness of the second surface 12 to improve the uniformity of the surface quality of the workpiece 1 as a whole. It can also be understood that the preset range is between -10 and 10, and the difference between the first roughness and the second roughness -8 is within the preset range.

[0056] Optionally, the preset value range is 1nm-10μm. Wherein, 1μm=1000nm. For example, the preset value is one of 1nm, 3nm, 5nm, 7nm, 10nm, 15nm, 20nm, 50nm, 70nm, 100nm, 300nm, 500nm, 700nm, 900nm, 1000nm, 3μm, 5μm, and 7μm. Wherein, the preset value can be adjusted according to the accuracy of surface processing, such as rough processing, precision processing, ultra-precision processing, and / or the product quality requirements of the workpiece to be processed.

[0057] Optionally, a preset value of the absolute value of the difference between the first roughness and the second roughness is 5% of the first roughness or 5% of the second roughness.

[0058] In one embodiment, the first processing technology and the second processing technology can optimize the processing parameters of their respective processing technologies according to the respective microstructures of the first surface 11 and the second surface 12, so as to obtain the optimal processing parameters corresponding to the first surface 11 and the second surface 12, which can not only improve the processing effect and surface quality, but also improve the processing efficiency and save processing costs.

[0059] Specifically, since the workpiece 1 to be processed is obtained by additive manufacturing, the microstructures of the first surface 11 and the second surface 12 are different, for example, different grain distributions, different grain boundary sizes, etc. Therefore, the mechanical properties of the first surface 11 and the second surface 12 are different, resulting in different processing properties of the first surface 11 and the second surface 12. According to the difference in the microstructures of the first surface 11 and the second surface 12, this embodiment adopts different processing techniques for the first surface 11 and the second surface 12, so that the processing techniques correspond to the surfaces, which can improve the processing effect, effectively reduce the surface roughness, and improve the surface quality.

[0060] In the related art, due to the different microstructures of the first surface 11 and the second surface 12, the first surface 11 and the second surface 12 are processed by the same processing technology, which easily leads to a large difference in the roughness of the first surface 11 and the second surface 12 after processing, that is, the first roughness is greatly different from the second roughness, thereby resulting in a low uniformity in the overall surface quality of the workpiece 1 to be processed.

[0061] Therefore, this embodiment uses different processing techniques to process surfaces with different microstructures, which not only improves the processing effects of different surfaces, but also makes the roughness of different surfaces similar, thereby improving the uniformity of the surface quality of the workpiece 1 to be processed.

[0062] Furthermore, by optimizing the processing technology, this embodiment can improve the surface quality while ensuring that the workpiece 1 obtained after processing does not require secondary processing, thereby saving working hours and processes, significantly improving processing efficiency, and effectively reducing the processing cost of the workpiece 1, especially when the workpiece 1 is a metal part.

[0063] It should be noted that the embodiments listed in this application do not represent all embodiments of actual processing. In view of the high diversity of materials and shapes of the workpiece 1 to be processed, the embodiments listed in this application are for illustrative purposes only. In other cases, other embodiments can be used to make the absolute value of the difference between the first roughness and the second roughness less than the preset value.

[0064] In one embodiment, in the surface processing method, the first processing technology includes a first processing speed, a first spindle speed, a first processing time, a first processing feed, and a first processing depth, and the second processing technology includes a second processing speed, a second spindle speed, a second processing time, a second processing feed, and a second processing depth;

[0065] Among them, the first processing speed is greater than or less than the second processing speed; and / or, the first spindle speed is greater than or less than the second spindle speed; and / or, the first processing time is greater than or less than the second processing time; and / or, the first processing feed rate is greater than or less than the second processing feed rate; and / or, the first processing depth is greater than or less than the second processing depth.

[0066] The processing parameters of the processing technology in this embodiment include processing speed, spindle speed, processing time, processing feed rate, and processing depth. Among them, this embodiment does not limit the specific data of the processing parameters of the processing technology. The specific values ​​of the processing parameters are related to the material of the workpiece 1 to be processed, the surface microstructure, the initial roughness before surface processing, the preset roughness required for the workpiece 1 to be processed, the type of surface processing technology, and the surface processing accuracy.

[0067] Optionally, the first processing technology includes a first processing direction, the second processing technology includes a second processing direction, and the first processing direction is different from the second processing direction. It should be noted that the processing direction refers to the movement direction of the processing piece to process the workpiece 1. For example, the cutting direction of the cutting piece to cut the workpiece 1.

[0068] Specifically, the first processing speed is greater than or less than the second processing speed; and / or, the first spindle speed is greater than or less than the second spindle speed; and / or, the first processing time is greater than or less than the second processing time; and / or, the first processing feed is greater than or less than the second processing feed; and / or, the first processing depth is greater than or less than the second processing depth. It can also be understood that at least one processing parameter (processing speed, spindle speed, processing time, processing feed, and processing depth) in the first processing process is different from that in the second processing process, so that the first processing process is more suitable for processing the first surface 11, and the second processing process is more suitable for processing the second surface 12, so as to improve the processing effect and improve the surface quality.

[0069] For example, when the initial roughness of the first surface 11 is greater than the initial roughness of the second surface 12, the first processing speed is greater than the second processing speed; and / or, the first spindle speed is greater than the second spindle speed; and / or, the first processing time is greater than the second processing time. When the hardness of the first surface 11 is greater than the hardness of the second surface 12 due to different surface microstructures, and the area required to be processed on the first surface 11 is greater than the area required to be processed on the second surface 12, the first processing speed is greater than the second processing speed; and / or, the first processing time is greater than the second processing time; and / or, the first processing feed is greater than the second processing feed; and / or, the first processing depth is greater than the second processing depth.

[0070] Therefore, the adjustment of specific parameters of the first processing technology and the second processing technology needs to be determined based on multiple factors, such as the material of the workpiece 1 to be processed, the surface microstructure, the initial roughness before surface processing, the preset roughness required for the workpiece 1 to be processed, the type of surface processing technology, and the surface processing accuracy, so that the first processing technology is more suitable for processing the first surface 11, the second processing technology is more suitable for processing the second surface 12, and the first roughness is similar to the second roughness, thereby improving the surface quality uniformity of the workpiece 1 to be processed.

[0071] Please refer to Figure 3 , Figure 3 Schematic diagram of the structure of the first surface in one embodiment of the present application. In one embodiment, the first surface 11 has a plurality of first grain boundaries 111, and the extension directions of the plurality of first grain boundaries 111 are different. In the surface processing method, the first processing is obtained according to the extension directions of the plurality of first grain boundaries 111.

[0072] In this embodiment, the first surface 11 has a plurality of first grain boundaries 111, and the first grain boundaries 111 refer to grain boundaries in the first surface 11. The extension directions of the plurality of first grain boundaries 111 (eg Figure 3 It can also be understood that the first grain boundaries 111 are staggered and distributed on the first surface 11. This embodiment does not limit the extension direction of the first grain boundaries 111 on the first surface 11. Optionally, the angle α2 formed between the staggered first grain boundaries 111 satisfies the following range: 0°<α2<180°. Further optionally, the angle α2 satisfies the following range: 45°<α2<135°, 60°<α2<120°, 60°<α2<120°, 80°<α2<100°.

[0073] According to the extension direction of the multiple first grain boundaries 111, the process parameters in the processing process, such as the spindle speed, processing speed, processing time, processing feed rate, and processing depth, can be adjusted to obtain the first processing speed, the first spindle speed, the first processing time, the first processing feed rate, and the first processing depth, thereby obtaining the first processing process.

[0074] In one embodiment, the processing direction of the first processing technology is parallel to the extension direction of at least part of the first grain boundary 111, so that the cutting force of the workpiece on the workpiece 1 is relatively gentle, the processing resistance is reduced, the processing effect is improved, and thus the product quality and processing efficiency are improved.

[0075] When the extension directions of the multiple first grain boundaries 111 are different, the distribution of the first grain boundaries 111 is different, which can also be understood as the different angles α2 formed between the staggered first grain boundaries 111, resulting in different mechanical properties of the first surface 11, and further resulting in different processing properties of the first surface 11. Therefore, it is necessary to adjust the processing parameters according to the extension directions of the multiple first grain boundaries 111 to obtain a first processing technology corresponding to the first surface 11, so that the roughness of the first surface 11 is the first roughness.

[0076] Optionally, the surface processing method provided in this embodiment is suitable for precision milling.

[0077] Embodiment 1, the microstructure of the workpiece before processing is as follows: the initial roughness of the first surface is 10μm-15μm; the first grain boundaries in the first surface are interlaced, and the angle between any two first grain boundaries is 55°-105°, specifically, such as 60°, 70°, 80°, 90°, 100°, etc.; the sizes of at least part of the first grains are not equal, and the average size of the first grains is 30μm. The initial roughness of the second surface is 15μm-20μm; the extension direction of the second grain boundaries in the second surface is approximately the same; multiple second grains can form a second grain strip, and a second grain boundary is provided between any two adjacent second grain strips, and the width of the second grain strip is 50μm, and the length of the second grain strip is 500μm.

[0078] The surface mechanical property parameters of the workpiece before processing are: Vickers hardness of the first surface: 400HV-430HV; Vickers hardness of the second surface: 300HV-330HV.

[0079] The parameters of the first machining process include: a first machining depth of 300 μm; a first spindle speed of 12000 rpm; a first machining feed rate of 150 μm; and a first machining speed of 150 mm / min. The first machining speed can also be understood as a first cutting speed.

[0080] After the first surface is processed by the first processing technology, the first roughness of the first surface is 480nm-500nm.

[0081] Optionally, if the second surface is processed by the first processing technology, the surface roughness of the second surface is 650nm-670nm. Therefore, even if the same processing method, such as the first processing technology, is used to process the first surface and the second surface, due to the different microstructures of the first surface and the second surface, their surface mechanical performance parameters are different, so the absolute value of the difference in the roughness of the first surface and the second surface after processing is greater than the preset value, in other words, the roughness of the first surface and the second surface differ greatly.

[0082] The surface processing method of this embodiment improves the process according to the microstructure of the first surface and / or the second surface to obtain a second processing process. Therefore, the parameters of the second processing process include: the second processing depth is 300μm; the second spindle speed is 12000rpm; the second processing feed is 120μm; the second processing speed is 200mm / min. Among them, the second processing speed can also be understood as the second cutting speed. Compared with the first processing process, the second processing process reduces the processing feed and increases the cutting speed.

[0083] It should be noted that the improvement method of the process in this embodiment is for a better understanding of the present application. In some other embodiments, the process can also be improved in other ways. It is only necessary to use the surface processing method provided in this embodiment to make the absolute value of the difference between the first roughness and the second roughness less than a preset value.

[0084] After the second surface is processed by the second processing technology, the second roughness of the second surface is 465nm-485nm. The absolute value of the difference between the first roughness and the second roughness is less than the preset value of 15nm.

[0085] In Example 2, the microstructure and surface mechanical property parameters of the workpiece before processing are the same as those in Example 1, and will not be repeated here.

[0086] The parameters of the first machining process include: a first machining depth of 300 μm; a first spindle speed of 10,000 rpm; a first machining feed rate of 150 μm; and a first machining speed of 200 mm / min. The first machining speed can also be understood as a first cutting speed.

[0087] After the first surface is processed by the first processing technology, the first roughness of the first surface is 455nm-470nm.

[0088] Optionally, after the second surface is processed by the first processing technology, the surface roughness of the second surface is 620nm-640nm.

[0089] The surface processing method of this embodiment improves the process according to the microstructure of the first surface and / or the second surface to obtain a second processing process. Therefore, the parameters of the second processing process include: the second processing depth is 300μm; the second spindle speed is 12000rpm; the second processing feed is 130μm; the second processing speed is 200mm / min. Among them, the second processing speed can also be understood as the second cutting speed. Compared with the first processing process, the second processing process increases the spindle speed and reduces the processing feed.

[0090] After the second surface is processed by the second processing technology, the second roughness of the second surface is 450nm-465nm. The absolute value of the difference between the first roughness and the second roughness is less than the preset value of 15nm.

[0091] It should be emphasized that the microstructure of the first surface and the second surface (for example, grain size, extension direction of grain boundaries, etc.) determines the surface mechanical performance parameters of the first surface and the second surface, so the present embodiment can improve the processing technology according to the microstructure of the first surface and the second surface, so that the absolute value of the difference between the first roughness and the second roughness is less than a preset value.

[0092] Specifically, the surface mechanical properties of the workpiece to be processed and the grain size satisfy the Hall-Petch relationship. As the grain size of the workpiece to be processed increases, the surface mechanical parameters of the workpiece to be processed will also change. For example, the yield stress of the workpiece to be processed will decrease. In addition, as the number of grains increases, the distance between any two adjacent grain boundaries decreases, and the surface mechanical parameters of the workpiece to be processed will also change. Moreover, as the number of grains increases, the extension direction of the grain boundaries will also change, further exacerbating the change in the surface mechanical parameters of the workpiece to be processed. Therefore, since the microstructures of the first surface and the second surface are different, it is necessary to adjust the processing direction, spindle speed, processing speed, processing time, processing feed rate, and processing depth in the processing process so that the absolute value of the difference between the first roughness and the second roughness is less than the preset value.

[0093] Please refer to Figure 4-Figure 5 , Figure 4 Schematic diagram of the structure of the second surface in one embodiment of the present application. Figure 5 FIG. 1 is a schematic diagram of the structure of the second surface in another embodiment of the present application. In one embodiment, Figure 4 and Figure 5 As shown, S220, the second surface 12 has a plurality of second grain boundaries 121, and the extension directions of the plurality of second grain boundaries 121 are the same or approximately the same. In the surface processing method, the second processing technology is obtained according to the extension directions of the plurality of second grain boundaries 121.

[0094] In this embodiment, the second surface 12 has a plurality of second grain boundaries 121, and the second grain boundaries 121 refer to grain boundaries in the second surface 12. The extension direction of the plurality of second grain boundaries 121 (eg Figure 4 or Figure 5 Since the workpiece 1 is manufactured by additive manufacturing in layers, the extension directions of the second grain boundaries 121 arranged on the second surface 12, that is, the side surface, are the same or approximately the same.

[0095] This embodiment does not limit the extension direction of the second grain boundary 121 of the second surface 12. Optionally, the angle α3 formed between the second grain boundary 121 and the stacking direction of the workpiece 1 to be processed satisfies the following range: 0°≤α3<180°. Further optionally, the angle α3 satisfies the following range: 0°≤α3≤150°, 0°≤α3≤135°, 0°≤α3≤120°, 0°≤α3≤90°.

[0096] According to the extension direction of the multiple second grain boundaries 121, the process parameters in the processing process, such as the processing speed, processing time, processing feed rate, and processing depth, can be adjusted to obtain a second processing speed, a second processing time, a second processing feed rate, and a second processing depth, etc., thereby obtaining a second processing process.

[0097] Since the extension directions of the second grain boundaries 121 on different second surfaces 12 are different when the extension directions of the second grain boundaries 121 on different second surfaces 12 change, it can also be understood that the angles α3 formed between the second grain boundaries 121 on different second surfaces 12 and the stacking direction of the workpiece 1 to be processed are different, resulting in different mechanical properties of the second surface 12, and further resulting in different processing properties of the second surface 12. Therefore, it is necessary to adjust the processing parameters according to the extension directions of the multiple second grain boundaries 121 to obtain a second processing process corresponding to the second surface 12, so that the roughness of the second surface 12 is the second roughness.

[0098] Please refer to it again Figure 4 and Figure 5 In one embodiment, the second processing technology includes a processing direction, and in the surface processing method, the processing direction is parallel to the extension direction of the second grain boundary 121.

[0099] Since the processing direction will affect the surface roughness after processing, when the processing direction of the second processing technology is parallel to the extension direction of the second grain boundary 121, it can also be understood that the processing direction (such as Figure 4 or Figure 5 The extension direction of the second grain boundary 121 (as shown in the D4 direction in FIG. Figure 4 or Figure 5 When the machining direction is the same as that of the workpiece 1 (shown in the direction D4 in the figure), the cutting force of the workpiece on the workpiece 1 is relatively gentle, the machining resistance is reduced, the machining effect is improved, and thus the product quality and machining efficiency are improved. The machining direction refers to the movement direction of the workpiece when machining the workpiece 1. Optionally, the workpiece includes but is not limited to a tool, a milling cutter, a grinding wheel, a laser, etc.

[0100] In the prior art, the processing direction is usually not parallel to the extension direction of the second grain boundary 121. For example, when the processing direction and the extension direction of the second grain boundary 121 have an angle, and the angle is 0°, 45°, or 90°, or 135°, since the processing direction of the second surface 12 is not parallel to the extension direction of the second grain boundary 121, during the processing, the contact between the workpiece and the workpiece 1 causes a large fluctuation in cutting force, causing increased wear of the workpiece and surface defects, and ultimately failing to obtain the preset roughness, and the processing quality of each surface will also be different. In addition, the processing direction is not parallel to the extension direction of the grain boundary, which will also cause the workpiece to be subjected to a large processing resistance on the second surface 12, which is not conducive to improving the processing effect and is prone to reducing the surface quality. Therefore, in this embodiment, the processing direction of the workpiece is adjusted according to the extension direction of the second grain boundary 121, so that the processing direction is the same as the extension direction of the second grain boundary 121, so as to reduce the processing resistance, improve the processing effect, and improve the surface quality.

[0101] In one embodiment, the first surface 11 is composed of a plurality of first grains, the first grains have a first grain size, and in the surface processing method, the first processing technology is obtained according to the first grain size.

[0102] In this embodiment, the first surface 11 has a plurality of first grains, and the first grain size refers to the width, length, height, or diameter of the first grain. This embodiment does not limit the shape of the first grain. And this embodiment does not limit the size of the first grain. Optionally, the first grain size h1 satisfies the following range: 1μm≤h1≤100μm. Further optionally, the first grain size h1 satisfies the following range: 0.1μm≤h1≤1μm.

[0103] According to the first grain size, process parameters in the processing technology, such as processing speed, processing time, processing feed rate, and processing depth, can be adjusted to obtain a first processing speed, a first processing time, a first processing feed rate, and a first processing depth, etc., thereby obtaining a first processing technology.

[0104] When the first grain size is different, the mechanical properties of the first surface 11 are different, which leads to different processing properties of the first surface 11. Therefore, it is necessary to adjust the processing parameters according to the first grain size to obtain a first processing technology corresponding to the first surface 11, so that the roughness of the first surface 11 is the first roughness.

[0105] In one embodiment, the second surface 12 is composed of a plurality of second grains, the second grains have a second grain size, and in the surface processing method, the second processing technology is obtained according to the second grain size.

[0106] In this embodiment, the second surface 12 has a plurality of second grains, and the second grain size refers to the width, length, height, or diameter of the second grain. This embodiment does not limit the shape of the second grain. And this embodiment does not limit the size of the second grain. Optionally, the second grain size h2 satisfies the following range: 100μm≤h2≤1000μm. Further optionally, the second grain size h2 satisfies the following range: 10μm≤h2≤100μm.

[0107] According to the second grain size, the process parameters in the processing technology, such as the processing speed, processing time, processing feed rate, and processing depth, can be adjusted to obtain a second processing speed, a second processing time, a second processing feed rate, and a second processing depth, etc., thereby obtaining a second processing technology.

[0108] When the second grain size is different, the mechanical properties of the second surface 12 are different, which leads to different processing properties of the second surface 12. Therefore, it is necessary to adjust the processing parameters according to the second grain size to obtain a second processing technology corresponding to the second surface 12, so that the roughness of the second surface 12 is the second roughness.

[0109] Please refer to Figure 6 , Figure 6 This is a process flow chart of a surface processing method in another embodiment of the present application. In S100, the first surface 11 is processed by a first processing technique so that the roughness of the processed first surface 11 is a first roughness, and the method further includes:

[0110] S300, using the first processing technology or the second processing technology to process the first surface 11 and the second surface 12, so that the roughness of the processed first surface 11 is the first pre-processing roughness, and the roughness of the processed second surface 12 is the second pre-processing roughness.

[0111] S400, when the absolute value of the difference between the first pre-processing roughness and the second pre-processing roughness is not less than the preset value, adjusting the second processing technology of the first surface 11 to the first processing technology; or adjusting the first processing technology of the second surface 12 to the second processing technology.

[0112] In this embodiment, the first surface 11 and the second surface 12 are pre-processed by using a unified first processing technology or a second processing technology to achieve pre-processing of the workpiece 1, that is, preliminary processing, thereby reducing the roughness of the first surface 11 and the second surface 12, and obtaining a first surface 11 with a first pre-processing roughness and a second surface 12 with a second pre-processing roughness, so as to prepare for subsequent further processing, reduce the difficulty of subsequent processing, and improve processing efficiency.

[0113] When the absolute value of the difference between the first pre-processing roughness and the second pre-processing roughness is not less than the preset value, that is, the first pre-processing roughness and the second pre-processing roughness differ greatly, it is necessary to continue processing the first surface 11 and the second surface 12. If the first processing technology is first used to pre-process the first surface 11 and the second surface 12, the first processing technology of the second surface 12 is adjusted to the second processing technology; if the second processing technology is first used to pre-process the first surface 11 and the second surface 12, the second processing technology of the first surface 11 is adjusted to the first processing technology, and then the first surface 11 and the second surface 12 are further processed, so as to obtain the first surface 11 with the first roughness and the second surface 12 with the second roughness, so as to improve the surface quality uniformity of the workpiece 1 to be processed.

[0114] Therefore, this embodiment pre-processes the first surface 11 and the second surface 12 using a unified first processing technology or a second processing technology, and then adjusts the processing technology of one of the surfaces to prepare for further processing, that is, the subsequent step of adjusting the surface quality, thereby reducing the difficulty of subsequent processing and improving processing efficiency.

[0115] Please refer to Figure 7 , Figure 7 This is a process flow chart of a surface processing method in another embodiment of the present application. In S100, before processing the first surface 11 using a first processing technique so that the roughness of the processed first surface 11 is a first roughness, the method further includes:

[0116] S500, using the third processing technology to process the first surface 11 and the second surface 12, so that the roughness of the processed first surface 11 is the first pre-processing roughness, and the roughness of the processed second surface 12 is the second pre-processing roughness;

[0117] S600, when the absolute value of the difference between the first pre-processing roughness and the second pre-processing roughness is not less than the preset value, the third processing technology of the first surface 11 is adjusted to the first processing technology, and the third processing technology of the second surface 12 is adjusted to the second processing technology.

[0118] In this embodiment, the first surface 11 and the second surface 12 are pre-processed by a unified third processing technology to achieve pre-processing of the workpiece 1, that is, preliminary processing, thereby reducing the roughness of the first surface 11 and the second surface 12, and obtaining a first surface 11 with a first pre-processing roughness and a second surface 12 with a second pre-processing roughness, so as to prepare for subsequent further processing, reduce the difficulty of subsequent processing, and improve processing efficiency.

[0119] When the absolute value of the difference between the first pre-processing roughness and the second pre-processing roughness is not less than the preset value, that is, the first pre-processing roughness and the second pre-processing roughness differ greatly, and it is necessary to continue processing the first surface 11 and the second surface 12. Then, the first processing technology of the second surface 12 is adjusted to the second processing technology, and the second processing technology of the first surface 11 is adjusted to the first processing technology, and then the first surface 11 and the second surface 12 are further processed, so as to obtain the first surface 11 with the first roughness and the second surface 12 with the second roughness, so as to improve the surface quality uniformity of the workpiece 1 to be processed.

[0120] Therefore, this embodiment uses a unified third processing technology to pre-process the first surface 11 and the second surface 12, and then adjusts the processing technology of the first surface 11 and the second surface 12 to prepare for further processing, that is, the subsequent step of adjusting the surface quality, thereby reducing the difficulty of subsequent processing and improving processing efficiency.

[0121] Optionally, the third processing technology in this embodiment can be obtained according to at least one of the material of the workpiece to be processed, a preset roughness, the first grain boundary 111 , the second grain boundary 121 , the first grain size and the second grain size.

[0122] In addition to the surface processing method provided above, the present application also provides a structural member 2. Please refer to Figure 8 , Figure 8 This is a schematic diagram of the structure of a structural member in an embodiment of the present application. In this embodiment, a structural member 2 is provided, the structural member 2 is obtained by processing a workpiece to be processed by additive manufacturing through a surface processing method as provided in the present application, the structural member 2 has an end face 21 and a side face 22 connected by a bend, and the roughness of the end face 21 is a first roughness, the roughness of the side face 22 is a second roughness, and the absolute value of the difference between the first roughness and the second roughness is less than a preset value.

[0123] The structural member 2 provided in this embodiment is composed of an end face 21 and a side face 22. The first surface of the workpiece to be processed is subjected to the surface processing method provided in this application so that the roughness of the first surface is the first roughness, thereby obtaining a structural member 2 whose end face 21 has the first roughness. The second surface of the workpiece to be processed is subjected to the surface processing method provided in this application so that the roughness of the second surface is the second roughness, thereby obtaining a structural member 2 whose side face 22 has the second roughness. Moreover, the first roughness is similar to the second roughness.

[0124] Therefore, by using different processing techniques to process the first surface and the second surface with different microstructures respectively, a structural part 2 with an end face 21 and a side face 22 with similar roughness can be obtained, which not only improves the surface quality uniformity of the structural part 2, but also improves the processing effect of the end face 21 and the side face 22, thereby improving the processing efficiency.

[0125] The above is a detailed introduction to the contents provided in the implementation mode of the present application. This article explains and illustrates the principles and implementation modes of the present application. The above explanation is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation mode and application scope. In summary, the contents of this specification should not be understood as limiting the present application.

Claims

1. A surface processing method, characterized in that: A workpiece to be processed obtained by additive manufacturing, wherein the workpiece to be processed has a first surface and a second surface connected by a bend, the first surface is perpendicular to the stacking direction of the workpiece to be processed, and the second surface is parallel to the stacking direction of the workpiece to be processed, and the surface processing method comprises: The first surface is processed by a first processing technique so that the roughness of the processed first surface is a first roughness; the first surface is composed of a plurality of first crystal grains, the first crystal grains have a first crystal grain size, and in the surface processing method, the first processing technique is obtained according to the first crystal grain size, and the first crystal grain size h1 satisfies the following range: 0.1 μm≤h1≤100 μm; The second surface is processed by a second processing technique so that the roughness of the processed second surface is a second roughness; the second surface is composed of a plurality of second crystal grains, and the second crystal grains have a second crystal grain size. In the surface processing method, the second processing technique is obtained according to the second crystal grain size, and the second crystal grain size h2 satisfies the following range: 10 μm ≤ h2 ≤ 1000 μm; Furthermore, an absolute value of a difference between the first roughness and the second roughness is smaller than a preset value, and the preset value ranges from 1 nm to 10 μm.

2. The surface processing method according to claim 1, characterized in that: Before "using a first processing technique to process the first surface so that the roughness of the processed first surface is a first roughness", the method further includes: The first surface and the second surface are processed by the first processing technique or the second processing technique, so that the roughness of the processed first surface is the first pre-processing roughness, and the roughness of the processed second surface is the second pre-processing roughness; When the absolute value of the difference between the first pre-processing roughness and the second pre-processing roughness is not less than the preset value, the second processing technology of the first surface is adjusted to the first processing technology; or the first processing technology of the second surface is adjusted to the second processing technology.

3. The surface processing method according to claim 1, characterized in that: Before "using a first processing technique to process the first surface so that the roughness of the processed first surface is a first roughness", the method further includes: Using a third processing technique to process the first surface and the second surface, so that the roughness of the processed first surface is the first pre-processing roughness, and the roughness of the processed second surface is the second pre-processing roughness; When the absolute value of the difference between the first pre-processing roughness and the second pre-processing roughness is not less than the preset value, the third processing technology of the first surface is adjusted to the first processing technology, and the third processing technology of the second surface is adjusted to the second processing technology.

4. The surface processing method according to claim 1, characterized in that: In the surface processing method, the first processing technology includes a first processing speed, a first spindle speed, a first processing time, a first processing feed amount, and a first processing depth, and the second processing technology includes a second processing speed, a second spindle speed, a second processing time, a second processing feed amount, and a second processing depth; Among them, the first processing speed is greater than or less than the second processing speed; and / or, the first spindle speed is greater than or less than the second spindle speed; and / or, the first processing time is greater than or less than the second processing time; and / or, the first processing feed rate is greater than or less than the second processing feed rate; and / or, the first processing depth is greater than or less than the second processing depth.

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