Display modules and display devices

Abstract

This invention discloses a display module and a display device. A composite tape layer is provided on the side of the display panel away from the light-emitting surface. The composite tape layer includes at least one first through hole penetrating the composite tape layer. A conductive structure is at least partially located in the first through hole. Along the direction perpendicular to the plane of the substrate of the display panel, the length H1 of the composite tape layer is less than or equal to the length H2 of the conductive structure. A flexible circuit board is electrically connected to the display panel. The flexible circuit board includes at least one first conductive area. The conductive structure is electrically connected to the first conductive area of ​​the flexible circuit board. When external charge accumulates on the display panel, the charge will reach the flexible circuit board electrically connected to the conductive structure through the conductive structure. Moreover, the conductive structure is electrically connected to the first conductive area on the flexible circuit board, preventing the charge from entering the display area of ​​the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology

[0002] With the rapid development of flat panel display technology, organic light-emitting display panels (OLEDs) are becoming increasingly widely used due to their excellent characteristics such as self-illumination, high brightness, wide viewing angle, and fast response.

[0003] Static electricity has a significant impact on the display effect of display panels and cannot be ignored. Therefore, providing a display panel and display device that can improve electrostatic protection capabilities, effectively prevent or improve the entry of static electricity into the display screen, and help improve product yield and display quality is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] In view of this, the present invention provides a display module and a display device to solve problems such as screen periphery brightening, abnormal screen display or four-screen phenomenon, decreased sensitivity or even failure caused by static charge easily entering the display panel, while without increasing the space at the lower edge of the display module and improving product yield.

[0005] This invention discloses a display module, comprising:

[0006] The display panel includes a substrate.

[0007] A flexible circuit board, including at least one first conductive region, is electrically connected to the display panel;

[0008] The composite tape layer is located on the side of the substrate away from the light-emitting surface of the display panel;

[0009] At least one conductive structural component;

[0010] The composite tape layer includes at least one first through hole penetrating the composite tape layer, and the conductive structure is at least partially located within the first through hole; along a direction perpendicular to the plane of the substrate, the length of the composite tape layer is H1, the length of the conductive structure is H2, H1≤H2, and the conductive structure is electrically connected to the first conductive region.

[0011] Based on the same inventive concept, the present invention also discloses a display device, which includes the above-mentioned display module.

[0012] Compared with the prior art, the display module and display device provided by the present invention achieve at least the following beneficial effects:

[0013] The display panel of this invention has a composite tape layer on the side away from the light-emitting surface. This composite tape layer protects and dissipates heat from the display panel, improving its reliability and heat dissipation performance. The composite tape layer includes at least one first through-hole penetrating the composite tape layer. A conductive structural component is at least partially located within the first through-hole. Along a direction perpendicular to the plane of the substrate of the display panel, the length H1 of the composite tape layer is less than or equal to the length H2 of the conductive structural component. A flexible circuit board is electrically connected to the display panel. The flexible circuit board includes at least one first conductive area, and the conductive structural component is electrically connected to the first conductive area of ​​the flexible circuit board. When external charges accumulate on the display panel, such as during the cutting process or electrostatic testing when charges enter from the edge of the display panel, or due to friction, charges accumulate on the cover plate of the display module and then escape from the display. The edge of the panel is penetrated by a first through-hole in the composite tape layer attached to the backlight side of the display panel. A conductive structure is located within this through-hole, allowing charge to travel via the conductive structure to the flexible circuit board electrically connected to it. Furthermore, the conductive structure is electrically connected to a first conductive area on the flexible circuit board, preventing charge from entering the display area of ​​the display panel. This avoids risks such as screen perimeter brightening, abnormal screen display, screen splitting, decreased sensitivity, or even malfunction caused by charge entering the display area, thus improving the user experience, extending the lifespan of the display module, and enhancing the display effect. Moreover, compared to related technologies, this invention eliminates the need to reserve space at the bending area of ​​the display panel for conductive liquid or conductive silver paste. Therefore, the lower edge of the display module does not suffer from insufficient clearance, and the width of the lower edge is not excessive, which facilitates the achievement of a narrow bezel. Furthermore, this invention only requires setting a first through hole in the existing composite tape layer and placing a conductive structure within the first through hole to electrically connect the conductive structure to the first conductive area of ​​the flexible circuit board. The manufacturing method is relatively simple, convenient, and yields a high product yield. In contrast, related technologies that apply conductive liquid or conductive silver paste to the lower edge of the display module have higher process requirements and result in greater yield losses. Moreover, this invention does not increase the thickness or width of the display module, achieving electrostatic protection while ensuring a thinner display module and narrower bezels.

[0014] Of course, any product implementing this invention does not necessarily need to achieve all of the technical effects described above at the same time.

[0015] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0017] Figure 1 It is a plan view of a display module in related technologies;

[0018] Figure 2 yes Figure 1 A cross-sectional view along line A-A' in the middle;

[0019] Figure 3 This is a schematic diagram of a planar structure of a display module provided by the present invention;

[0020] Figure 4 This is a schematic diagram of a planar structure of another display module provided by the present invention;

[0021] Figure 5 yes Figure 3 A cross-sectional view along the B-B' direction;

[0022] Figure 6 yes Figure 3 A cross-sectional view along the C-C' direction;

[0023] Figure 7 yes Figure 3 Another cross-sectional view along the B-B' direction;

[0024] Figure 8 yes Figure 3 Another cross-sectional view along the B-B' direction;

[0025] Figure 9 This is a schematic diagram of a conductive structural component provided by the present invention;

[0026] Figure 10 This is a schematic diagram of another conductive structural component provided by the present invention;

[0027] Figure 11 This is a schematic diagram of another conductive structural component provided by the present invention;

[0028] Figure 12 This is a schematic diagram of another conductive structural component provided by the present invention;

[0029] Figure 13 yes Figure 3 Another cross-sectional view along the B-B' direction;

[0030] Figure 14 yes Figure 3 Another cross-sectional view along the B-B' direction;

[0031] Figure 15 yes Figure 3Another cross-sectional view along the B-B' direction;

[0032] Figure 16 yes Figure 3 Another cross-sectional view along the B-B' direction;

[0033] Figure 17 This is a schematic diagram of another conductive structural component provided by the present invention;

[0034] Figure 18 This is a schematic diagram of another conductive structural component provided by the present invention;

[0035] Figure 19 This is a schematic diagram of another conductive structural component provided by the present invention;

[0036] Figure 20 This is a schematic diagram of another conductive structural component provided by the present invention;

[0037] Figure 21 This is a schematic diagram of a planar structure of another display module provided by the present invention;

[0038] Figure 22 This is a schematic diagram of a planar structure of another display module provided by the present invention;

[0039] Figure 23 This is a schematic diagram of the planar structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0040] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0041] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0042] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0043] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0044] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0045] In related technologies, static electricity can easily enter the display panel, causing risks such as bright spots around the screen, abnormal screen display, screen splitting, decreased sensitivity, or even malfunction. To address this, the inventors conducted the following research: They discovered that static electricity accumulation is a common problem in display panels. For example, an organic light-emitting display panel typically includes an array substrate, multiple organic light-emitting diodes (OLEDs) on the array substrate, and an encapsulation layer covering the OLEDs on the side facing away from the array substrate. Static electricity is generated during the fabrication of these structures, such as during cutting, and during testing or use of the organic light-emitting display panel. Furthermore, before the display leaves the factory, it must undergo electrostatic discharge (ESD) protection testing or copper rod friction experiments, which easily generate negative charges. Similarly, micro-drop testing of the display also generates a large amount of static charge, producing both positive and negative charges. Additionally, static electricity accumulates on the surface of the cover plate of the organic light-emitting display device after prolonged friction. Electrostatic charges can enter the screen through the edge of the cover plate, affecting the electrical properties of the transistors inside the display (e.g., the transistor threshold voltage can easily become forward biased). This can lead to issues such as bright edges on the screen, abnormal screen display or screen splitting, decreased sensitivity, or even malfunction, reducing the user experience and potentially shortening the lifespan of the display device, ultimately impacting display quality. (Refer to...) Figure 1 and Figure 2 , Figure 1 It is a plan view of a display module in related technologies. Figure 2 yes Figure 1 A cross-sectional view along line A-A'. Figure 1 The display module 000 has a display panel 002 and a cover plate 001 located on one side of the light-emitting surface of the display panel 002. Of course, a light-shielding layer 008 is provided on the cover plate 001 to prevent light leakage from the edges of the display module. The display panel 000 includes a display area AA' and BB' surrounding the display area AA'. The display panel 000 has a lower border BB1' along the second direction YY. Figure 2As can be seen, the display panel 000 is bent in the area of ​​the lower bezel BB1' to bend to the backlight side of the display panel 000. A first support layer 003 is located on the backlight side of the display panel 000. A composite tape 004 is located on the side of the first support layer 003 away from the cover plate 001. A second support layer 005 is also located on the side of the composite tape 004 away from the cover plate 001. The second support layer 005 and the composite tape 004 are fixed together by double-sided adhesive 006. After bending, the display panel 000 is pasted onto the back of the second support layer 005. Then, a flexible circuit board 006 is bound to the display panel 000. A position is set near the lower bezel BB1' of the display module. The conductive liquid or conductive silver paste 010 is used to conduct charge, but it occupies space K1, which increases the width of the display module in the second direction Y, making it difficult to achieve a narrow bezel. Of course, if no additional space K1 is set for applying the conductive liquid or conductive silver paste, there will be insufficient clearance at the bottom edge of the display module. Furthermore, the part of the display panel 000 that bends to the back is mainly the signal lines in the conductive layer. The conductive liquid or conductive silver paste 010 needs to be placed between adjacent signal lines to prevent signal crosstalk. Moreover, the method of applying the conductive liquid or conductive silver paste has high process requirements and may result in yield loss.

[0046] In view of this, the present invention provides a display module and a display device to solve the problems caused by static charge entering the display panel, such as screen periphery brightening, abnormal screen display or four-screen phenomenon, decreased sensitivity or even failure, while not increasing the space at the lower edge of the display module and improving product yield.

[0047] Reference Figure 3 , Figure 4 , Figure 5 and Figure 6 , Figure 3 This is a schematic diagram of a planar structure of a display module provided by the present invention. Figure 4 This is a schematic diagram of a planar structure of another display module provided by the present invention. Figure 5 yes Figure 3 A cross-sectional view along the B-B' direction. Figure 6 yes Figure 3A cross-sectional view along the C-C' direction is shown. The display module 1000 of this embodiment includes: a display panel 100, which includes a substrate 10; a flexible circuit board 300, including at least one first conductive region 3001, which is electrically connected to the display panel 100; a composite tape layer 400, located on the side of the substrate 10 away from the light-emitting surface of the display panel 100; and at least one conductive structural member 500. The composite tape layer 400 includes at least one first through hole 4001 penetrating the composite tape layer 400, and the conductive structural member 500 is at least partially located within the first through hole 4001. Along a direction perpendicular to the plane of the substrate 10, the length of the composite tape layer 400 is H1, the length of the conductive structural member 500 is H2, H1≤H2, and the conductive structural member 500 is electrically connected to the first conductive region 3001.

[0048] Specifically, the display panel 100 provided in this embodiment can be an organic light-emitting display panel. The display principle of an organic light-emitting display panel is that, under the drive of a certain electric field, electrons and holes are injected from the cathode and anode into the electron and hole transport layers, respectively. The electrons and holes migrate through the electron and hole transport layers to the light-emitting layer of the light-emitting device, where they meet to form excitons and excite the light-emitting molecules. When the power is supplied to an appropriate voltage, the anode holes and cathode charges combine in the light-emitting layer to produce light. Depending on the formula, red, green, and blue primary colors are produced, constituting the basic colors and forming the display image. Optionally, the display area AA of the display panel 100 in this embodiment can include multiple sub-pixels P of different colors (not filled in the figure). The sub-pixels P are arranged in an array along the first direction X and the second direction Y. The specific structure of each sub-pixel P can be fabricated using film layers such as a driving circuit layer, planarization layer, anode layer, pixel definition layer, organic light-emitting layer, cathode layer, and thin film encapsulation layer disposed on the substrate 10. Figure 6 This is merely a simplified illustration of the film layer structure of the display panel 100. This embodiment does not elaborate on the specific film layer structure within the display area AA of the display panel 100. For details, please refer to the design structure of organic light-emitting display panels in related technologies for understanding.

[0049] The display panel 100 in this embodiment includes a display area AA and a non-display area BB that is at least partially surrounding the display area AA. Optionally, the non-display area BB may surround only a portion of the display area AA, or it may surround the entire display area AA. This embodiment does not specifically limit the shape of the non-display area BB. The non-display area BB may be a closed ring shape surrounding the display area AA, that is, the non-display area BB may completely surround the display area AA. Alternatively, the non-display area BB may be an open arc shape surrounding the display area AA, that is, the non-display area BB may surround only a portion of the display area AA. In specific implementation, it can be designed according to actual needs.

[0050] It should be noted that in this embodiment... Figure 6 This embodiment only illustrates the cross-sectional structure of a portion of the display area AA of the display panel 100; further details are omitted here. Regarding the film layer structure of the display area AA of the display panel 100, this embodiment… Figure 6 This is merely an illustrative example; for a more detailed understanding, please refer to the film structure of the display area AA in related technologies for organic light-emitting display panels. This embodiment will not elaborate further. The display panel 100 may include a substrate 10, which may be made of at least one organic material such as polyimide, polyethylene terephthalate, or polyurethane. Substrate 10 made of organic materials such as polyimide, polyethylene terephthalate, or polyurethane possesses excellent thermal, mechanical, electrical, and dimensional stability, good film-forming properties, high optical transparency, and low moisture absorption, resulting in good planarization and adhesion properties. In some optional embodiments, the substrate 10 may be fabricated as having two flexible substrates, namely a first substrate and a second substrate (not shown in the figure). During the fabrication of the substrate 10, the film layers are typically fabricated layer by layer. Optionally, the first substrate (which can be fabricated by coating) is generally fabricated first on a rigid substrate, followed by the second substrate, enhancing the bending resistance of the substrate 10 and facilitating its application in the fabrication of flexible display devices.

[0051] Optionally, a driving circuit layer including multiple thin-film transistors may also be disposed within the display area AA on the substrate 10. This embodiment is only an example illustrating the film layer structure that the substrate 10 may include. In specific implementations, the design structure of the substrate 10 includes, but is not limited to, this, and may also include other film layer structures, such as... Figure 6 As shown, Figure 6 yes Figure 3A cross-sectional view along the C-C' direction is shown in the diagram. The display panel 100 includes: a substrate 10, a buffer layer 92 located on one side of the substrate 10, a semiconductor active layer 210 located on the buffer layer 92, a first metal layer 202 located on the side of the semiconductor active layer 210 away from the substrate 10, a capacitor metal layer 203 located on the side of the first metal layer 202 away from the substrate 10, a second metal layer 204 located on the side of the capacitor metal layer 203 away from the substrate 10, and a third metal layer 205 located on the side of the second metal layer 204 away from the substrate 10. The display panel 100 also includes a thin-film transistor T and a light-emitting device 40 located on the side of the thin-film transistor T away from the substrate 10. The light-emitting device 40 includes an anode layer 410, a light-emitting layer 420 located on the side of the anode away from the substrate 10, and a cathode 430 located on the side of the light-emitting layer 420 away from the substrate 10. The thin-film transistor T includes a gate and a source / drain. The gate is located on a first metal layer 202, and the source / drain is located on a second metal layer 204. A third metal layer 205 is provided between the anode layer 410 and the source / drain. Optionally, the thin-film transistor T is located on a buffer layer 92. Figure 6 The structural description here uses only a top-gate type thin-film transistor (TFT) as an example. Only one TFT T is shown schematically; in actual products, each pixel has at least one TFT. For example, a pixel driving circuit of type 7T1C has 7 transistors and 1 storage capacitor. The TFT T shown here is only for illustrative purposes regarding the film layer of the display panel 100. The TFT T includes a semiconductor active layer 210 located on the buffer layer 92. The semiconductor active layer 210 includes a source region and a drain region formed by doping with N-type or P-type impurity ions. The region between the source and drain regions is a channel region where no impurities are doped. The semiconductor active layer can be formed by crystallizing amorphous silicon to change it into polycrystalline silicon. To crystallize the amorphous silicon... The gate may comprise a single or multiple layers of gold (Au), silver (Ag), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), aluminum (Al), molybdenum (Mo), or chromium (Cr), or alloys such as aluminum (Al):neodymium (Nd) alloys or molybdenum (Mo):tungsten (W) alloys. The source and drain are electrically connected (or bonded) to the source and drain regions of the semiconductor active layer 210, respectively, through contact holes formed by selectively removing the insulating layer.

[0052] Optional, Figure 6The diagram also shows an encapsulation layer 50 located on the side of the light-emitting device 40 away from the substrate 10. Optionally, the encapsulation layer 50 can be a stacked structure of an inorganic encapsulation layer, an organic encapsulation layer, and an inorganic encapsulation layer. Of course, the specific structure of the encapsulation layer 50 is not limited in this invention; the encapsulation layer 50 can have multiple inorganic encapsulation layers and multiple organic encapsulation layers, as long as it can provide good protection for the light-emitting device 40 within the display area AA. A thin-film transistor T drives the light-emitting device 40 to emit light for display.

[0053] Optionally, the display panel 100 is a flexible display panel 100. The display panel 100 is bent in the area of ​​the lower bezel so that the display panel 100 is bent to the backlight side of the display panel 100. A cover plate 200 is provided on the light-emitting side of the display panel 100 to protect the display panel 100. Optionally, the cover plate 200 is fixed to the display panel 100 by optical adhesive 201. Of course, the cover plate 200 is made larger at the periphery of the display panel 100 to better protect the display panel 100. A first support layer 601 is provided on the backlight side of the display panel 100. A composite tape layer 400 is provided on the side of the first support layer 601 away from the cover plate 200. A second support layer 602 is also provided on the side of the composite tape layer 400 away from the cover plate 200. The second support layer 602 and the composite tape layer 400 are fixed together by double-sided adhesive 603. After the display panel 100 is bent, it is pasted on the back of the second support layer 602. Then, a flexible circuit board 300 is bound to the display panel 100.

[0054] The flexible printed circuit board 300 (FPC) is a highly reliable and extremely flexible printed circuit board made with polyimide or polyester film as the substrate. It features high wiring density, light weight, thinness, and good bendability. In this invention, the display panel 100 is bent and then attached to the back of the second support layer 602. After the flexible circuit board 300 is bonded to the display panel 100, this structure eliminates the need to bond the flexible circuit board 300 or the driver chip (not shown) to the lower step on the light-emitting side of the display panel 100, thus achieving a narrow lower bezel. The flexible circuit board 300 includes at least one first conductive region 3001.

[0055] For the flexible display panel 100, its substrate 10 is flexible, so its edges are prone to bending, and its surface is also easily scratched. A first support layer 601 is provided on the side of the substrate 10 away from the light-emitting surface. After the display panel 100 is bent, it is attached to the second support layer 602. This serves two purposes: firstly, it prevents the edges of the substrate 10 from bending and provides support; secondly, it prevents the substrate 10 from being scratched. Optionally, the material of the first support layer 601 can be polyimide. The materials of the first support layer 601 and the second support layer 602 can be the same or different; no specific limitation is made here.

[0056] The composite tape layer 400 is located on the side of the first support layer 601 away from the substrate 10. It is used to dissipate heat from the display panel 100 and to conduct static electricity and shield signals, thereby ensuring the reliability of the display module 1000. The composite tape layer 400 can be made of conductive materials or metal materials. Optionally, the composite tape layer 400 is made of SCF (Super-Composite-Film), which is composed of foam, polyimide, and copper foil, and provides good heat dissipation, buffering, conductivity, and protection.

[0057] In this invention, the composite tape layer 400 includes at least one first through hole 4001 penetrating the composite tape layer 400. The number of first through holes 4001 can be one, two, three, or more than three, and no specific limitation is made here. Figure 3 The illustration uses only an example with a first through hole 4001. Figure 4 The illustration is based on an example with four first through holes 4001. Of course, the orthographic projection of the first through hole 4001 onto the plane of the substrate 10 can be circular, rectangular, elliptical, or other shapes. There is no specific limitation here, as long as the first through hole 4001 penetrates the composite tape layer 400 in a direction perpendicular to the plane of the substrate 10.

[0058] like Figure 5The conductive structural component 500 is at least partially located in the first through hole 4001. Along the direction perpendicular to the plane of the substrate 10 of the display panel 100, the length H1 of the composite tape layer 400 is less than or equal to the length H2 of the conductive structural component 500. It is understood that the length of the conductive structural component 500 along the plane of the substrate 10 can be greater than or equal to the thickness of the composite tape layer 400. To ensure that the length H1 of the composite tape layer 400 is less than or equal to the length H2 of the conductive structural component 500, a portion of the composite tape layer 400 can be thinned, allowing the flexible circuit board 300 to adhere to the surface of the composite tape layer 400 close to it. Alternatively, the flexible circuit board 300 can be bent, allowing it to adhere to the side of the first through hole 4001 away from the substrate 10, ensuring that the length H1 of the composite tape layer 400 is less than or equal to the length H2 of the conductive structural component 500. No specific limitations are imposed here. Optionally, the conductive structure 500 can be cylindrical, prismatic, or similar in shape. The material of the conductive structure 500 is not specifically limited here. In this invention, the function of the conductive structure 500 is to conduct static electricity from the display panel 100 to the flexible circuit board 300. Therefore, the conductive structure 500 only needs to be a good conductor of charge. If a certain amount of static charge accumulates on the display panel 100, it will be directly conducted through the conductive structure 500 in the first through hole 4001 to the first conductive area 3001 of the flexible circuit board 300. Thus, the static charge will not enter the display area AA of the display panel 100.

[0059] Compared with related technologies, the display module 1000 of this embodiment has at least the following beneficial effects:

[0060] The composite tape layer 400 of the present invention includes at least one first through hole 4001 penetrating the composite tape layer 400. A conductive structure 500 is at least partially located in the first through hole 4001. Along a direction perpendicular to the plane of the substrate 10 of the display panel 100, the length H1 of the composite tape layer 400 is less than or equal to the length H2 of the conductive structure 500. A flexible circuit board 300 is electrically connected to the display panel 100. The flexible circuit board 300 includes at least one first conductive region 3001. The conductive structure 500 is electrically connected to the first conductive region 3001 of the flexible circuit board 300. When external charges accumulate on the display panel 100, for example, during a cutting process or electrostatic testing, charges enter from the edge of the display panel 100, or due to friction, charges accumulate on the cover plate 200 of the display module 1000. After the charge accumulates, it enters from the edge of the display panel 100. Because the composite tape layer 400 attached to the backlight side of the display panel 100 has a first through hole 4001 and a conductive structure 500 is provided in the first through hole 4001, the charge will reach the flexible circuit board 300 electrically connected to the conductive structure 500 through the conductive structure 500. Moreover, the conductive structure 500 is electrically connected to the first conductive area 3001 on the flexible circuit board 300, which prevents the charge from entering the display area AA of the display panel 100. This avoids the risk of screen periphery brightening, screen display abnormality or four-screen phenomenon, decreased sensitivity or even failure caused by the charge entering the display area AA of the display panel 100. This improves the user experience of the display module 1000, extends the service life of the display module 1000, and improves the display effect.

[0061] Compared with related technologies, since the present invention does not require reserving space in the bending area of ​​the display panel 100 to set the conductive liquid or conductive silver paste 5003, the lower edge of the display module 1000 will not have insufficient clearance space, and the width of the lower edge of the display module 1000 will not be large, which is conducive to achieving a narrow bezel.

[0062] Compared with related technologies, the present invention only requires a first through hole 4001 to be provided on the original composite tape layer 400, and a conductive structural component 500 to be provided in the first through hole 4001 so that the conductive structural component 500 is electrically connected to the first conductive area 3001 of the flexible circuit board 300. The manufacturing method is relatively simple, convenient to operate, and has a high product yield. In contrast, the related technologies, which involve providing conductive liquid or conductive silver paste 5003 at the lower edge of the display device, have higher process requirements and result in greater yield loss. Moreover, the present invention does not increase the thickness and width of the display module 1000, and can ensure the thinness and narrow bezel of the display device while achieving electrostatic protection.

[0063] In some alternative embodiments, refer to Figure 7 , Figure 7 yes Figure 3 Another cross-sectional view along the B-B' direction also includes a first support layer 601, with the substrate 10 located on the side of the first support layer 601 near the light-emitting surface of the display panel 100; along a direction perpendicular to the plane of the substrate 10, there is at least one second through hole 6011 penetrating through the first support layer 601, with the conductive structural member 500 at least partially located in the second through hole 6011 and in contact with the first conductive region 3001 and the display panel 100 respectively;

[0064] Along a direction perpendicular to the plane of the substrate 10, the first through hole 4001 and the second through hole 6011 at least partially overlap.

[0065] For the flexible display panel 100, its substrate 10 is a flexible substrate 10, so its edges are prone to bending, and its surface is also easily scratched. A first support layer 601 is provided on the side of the substrate 10 away from the light-emitting surface of the display panel 100. This serves two purposes: firstly, it prevents the edges of the substrate 10 from bending and provides support; secondly, it prevents the substrate 10 from being scratched. Optionally, the material of the first support layer 601 can be polyimide.

[0066] Optionally, along a direction perpendicular to the plane of the substrate 10, at least one second through hole 6011 penetrating the first support layer 601 is included. The number of second through holes 6011 in the direction perpendicular to the plane of the substrate 10 can be one, two, three, or more than three; no specific limitation is made here. Figure 3 The illustration uses only one example with a second through hole 6011. Of course, the orthographic projection of the second through hole 6011 onto the plane of the substrate 10 can be circular, rectangular, elliptical, etc., and is not specifically limited here. Along the direction perpendicular to the plane of the substrate 10, the first through hole 4001 and the second through hole 6011 at least partially overlap. Figure 7 Taking the example where the orthographic projection of the second through hole 6011 on the plane of the substrate 10 is greater than the orthographic projection of the first through hole 4001 on the plane of the substrate 10, it is also possible that the orthographic projection of the second through hole 6011 on the plane of the substrate 10 is equal to the orthographic projection of the first through hole 4001 on the plane of the substrate 10, or the orthographic projection of the second through hole 6011 on the plane of the substrate 10 is less than the orthographic projection of the first through hole 4001 on the plane of the substrate 10. No specific limitation is made here, as long as the conductive structure 500 is at least partially located in the first through hole 4001 and the second through hole 6011, and the conductive structure 500 is in contact with the first conductive area 3001 and the display panel 100 respectively.

[0067] In this embodiment, the conductive structure 500 is not only partially located in the first through hole 4001, but also partially located in the second through hole 6011. Therefore, the length H2 of the conductive structure 500 in the direction perpendicular to the plane of the substrate 10 is greater than the length of the composite tape layer 400 in the direction perpendicular to the plane of the substrate 10.

[0068] In this embodiment, since the conductive structure 500 is in direct contact with the first conductive area 3001 and the display panel 100, it can directly and quickly transfer the charge accumulated on the display panel 100 to the first conductive area 3001 of the flexible circuit board 300 through the conductive structure 500 provided in the second through hole 6011 and the first through hole 4001, thereby more effectively preventing the charge from entering the display area AA of the display panel 100.

[0069] In some alternative embodiments, refer to Figure 8 , Figure 8 yes Figure 3 Another cross-sectional view along the B-B' direction shows that the orthographic projection of the conductive structural component 500 onto the plane where the substrate 10 is located is within the orthographic projection of the first conductive region 3001 onto the plane where the substrate 10 is located.

[0070] Specifically, after the display panel 100 is bent in the area of ​​the lower frame, it is attached to the second support layer 602. However, there will be a process error in the bending radius during the bending process. Therefore, when the flexible circuit board is then bound to the display panel 100, the corresponding position will also have a certain error. In this embodiment, the orthographic projection of the conductive structure 500 on the plane of the substrate 10 is located within the orthographic projection of the first conductive area 3001 on the plane of the substrate 10. That is, the area of ​​the first conductive area 3001 is larger than the orthographic projection area of ​​the conductive structure 500. This way, even if there is a certain error after the display panel 100 is bent, it can still ensure that the conductive structure 500 is electrically connected to the first conductive area 3001, thereby preventing charge from entering the display area AA of the display panel 100.

[0071] In some alternative embodiments, reference continues to be made to... Figure 5 , Figure 7 and Figure 8 The first conductive region 3001 includes a copper drain 3002.

[0072] Since the flexible circuit board 300 needs to be soldered to the ground, a portion of the copper on the flexible circuit board 300 needs to be exposed. This means that this portion of copper should not be protected with varnish; it is usually covered with solder mask, exposing the copper itself. Because the exposed copper 3002 on the flexible circuit board 300 itself needs to be grounded, there is no need to set up an additional grounding area on the flexible circuit board 300. Simply connecting the conductive component 500 to the exposed copper 3002, which already needs to be grounded, allows the charge accumulated on the display panel 100 to be conducted to the ground through the exposed copper 3002, thereby preventing the charge from entering the display area AA of the display panel 100.

[0073] In some alternative embodiments, reference continues to be made to... Figure 5 , Figure 7 and Figure 8 The conductive structural component 500 includes conductive double-sided adhesive 5001.

[0074] Understandably, the conductive structure 500 needs to be a good conductor of charge so that the charge accumulated on the display panel 100 can be conducted through the conductive structure 500 to the first conductive area 3001 of the flexible circuit board 300. After the flexible circuit board 300 is bonded to the display panel 100, a part of it will protrude from the display panel 100. The flexible circuit board 300 is unstable, that is, the flexible circuit board 300 is easy to bend, which will affect the signal transmission of the flexible circuit board 300 and reduce the reliability of the display module 1000.

[0075] Conductive double-sided adhesive 5001 is an adhesive that exhibits conductivity after curing or drying. It can connect various conductive materials together, creating an electrical path between the connected materials. Conductive adhesive mainly consists of a resin matrix, conductive particles, dispersing additives, and auxiliaries. Before curing or drying, the conductive particles in conductive double-sided adhesive 5001 exist separately within the adhesive, without continuous contact, and are therefore in an insulating state. After curing or drying, the volume of the adhesive shrinks due to solvent evaporation and adhesive solidification, causing the conductive particles to form a stable, continuous state, thus exhibiting conductivity. If the conductive structural component 500 includes conductive double-sided adhesive 5001, then the side of conductive double-sided adhesive 5001 near the cover plate 200 can be bonded to the back of the first support layer 601, the side of conductive double-sided adhesive 5001 near the flexible circuit board 300 can be bonded to the flexible circuit board 300, or the side of conductive double-sided adhesive 5001 near the cover plate 200 can be bonded to the backlight side of the display panel 100, and the side of conductive double-sided adhesive 5001 near the flexible circuit board 300 can be bonded to the flexible circuit board 300, thereby fixing the flexible circuit board 300 to the back of the first support layer 601. Figure 5 and Figure 8It can be fixed to the backlight side of the display panel 100. In this embodiment, the conductive structure 500 includes conductive double-sided adhesive 5001, which can both transfer charge to the first conductive area 3001 of the flexible circuit board 300 and fix the flexible circuit board 300, thereby improving the reliability of the display module 1000.

[0076] In some alternative embodiments, refer to Figure 9 and combined Figure 5 , Figure 7 and Figure 8 , Figure 9 This is a schematic diagram of a conductive structural component provided by the present invention. The conductive structural component 500 includes a conductive double-sided adhesive 5001 and a conductive metal layer 5002.

[0077] like Figure 9 As shown, the conductive structural component 500 is illustrated using a quadrangular prism structure as an example. The conductive double-sided adhesive 5001 and the conductive metal layer 5002 are arranged side-by-side along the second direction Y and extend along the third direction Z, which is perpendicular to the plane of the substrate 10. Because the conductive double-sided adhesive 5001 has adhesive properties, it and the conductive metal layer 5002 are fixedly connected. The specific arrangement of the conductive double-sided adhesive 5001 and the conductive metal layer 5002 is not specified here.

[0078] It is understandable that although the conductive double-sided adhesive 5001 has both adhesive and conductive properties, its conductivity is not as high as that of the conductive metal layer 5002. In this embodiment, it is necessary to quickly conduct the charge accumulated on the display panel 100 to the first conductive area 3001 of the flexible circuit board 300. Therefore, the conductive metal layer 5002 in the conductive structure 500 can achieve the purpose of quickly transferring static charge. Of course, since the conductive structure 500 in this embodiment also includes the conductive double-sided adhesive 5001, it can both transfer the charge to the first conductive area 3001 of the flexible circuit board 300 and fix the flexible circuit board 300, thereby improving the reliability of the display module 1000.

[0079] In some alternative embodiments, refer to Figure 10 and Figure 11 and combined Figure 5 , Figure 7 and Figure 8 , Figure 10 This is a schematic diagram of another conductive structural component provided by the present invention. Figure 11 This is a schematic diagram of another conductive structural component provided by the present invention. In the orthographic projection of the conductive structural component 500 onto the plane of the substrate 10, the conductive double-sided adhesive 5001 at least partially surrounds the conductive metal layer 5002.

[0080] Figure 10 The following is a schematic illustration using the example of a conductive structural component 500 being prismatic in shape, and the conductive double-sided adhesive 5001 partially surrounding the conductive metal layer 5002 in the orthographic projection of the conductive structural component 500 onto the plane of the substrate 10. Figure 10 In the orthographic projection of the conductive structural component 500 onto the plane of the substrate 10, the conductive double-sided adhesive 5001 forms a groove structure, and the conductive metal layer 5002 is located within this groove structure. Figure 10 This is just one possible embodiment. In the orthographic projection of the conductive structural component 500 onto the plane where the substrate 10 is located, the conductive double-sided adhesive 5001 can partially surround the conductive metal layer 5002. No specific limitation is made here. Figure 11 The illustration is based solely on the example of a cylindrical conductive structural component 500, in which the conductive double-sided adhesive 5001 completely surrounds the conductive metal layer 5002 in the orthographic projection of the conductive structural component 500 onto the plane of the substrate 10. The thickness of the conductive double-sided adhesive 5001 in the second direction Y is not specifically limited here.

[0081] In this embodiment, in the orthographic projection of the conductive structure 500 onto the plane of the substrate 10, the conductive double-sided adhesive 5001 at least partially surrounds the conductive metal layer 5002. The conductive double-sided adhesive 5001 can both transfer charge to the first conductive area 3001 of the flexible circuit board 300 and fix the flexible circuit board 300, thereby improving the reliability of the display module 1000. The conductive metal layer 5002 disposed in the conductive structure 500 has one side near the substrate 10 in contact with the first support layer 601 or the display panel 100, and the other side near the flexible circuit board 300 in contact with the flexible circuit board 300. Because the conductive metal layer 5002 has good conductivity, it can quickly and directly conduct the charge accumulated on the display panel 100 to the first conductive area 3001 of the flexible circuit board 300.

[0082] In some alternative embodiments, refer to Figure 12 and combined Figure 5 , Figure 7 and Figure 8 , Figure 12 This is a schematic diagram of another conductive structural component provided by the present invention. Along the direction perpendicular to the plane where the substrate 10 is located, the conductive structural component 500 includes a first conductive double-sided adhesive 50011, a conductive metal layer 5002 located on the side of the first conductive double-sided adhesive 50011 near the display panel 100, and a second conductive double-sided adhesive 50012 located on the side of the conductive metal layer 5002 near the display panel 100.

[0083] The conductive structural component 500 has a sandwich structure, including a first conductive double-sided adhesive 50011, a conductive metal layer 5002, and a second conductive double-sided adhesive 50012. Along a direction perpendicular to the plane of the substrate 10, the conductive metal layer 5002 is sandwiched between the first conductive double-sided adhesive 50011 and the second conductive double-sided adhesive 50012. The first conductive double-sided adhesive 50011 is located on the side of the conductive structural component 500 closest to the display panel 100. The materials of the first conductive double-sided adhesive 50011 and the second conductive double-sided adhesive 50012 can be the same or different; no specific limitation is made here. Figure 5 and Figure 8 The first conductive double-sided adhesive 50011 is bonded to the side of the first support layer 601 away from the substrate 10, and the second conductive double-sided adhesive 50012 is bonded to the first conductive region 3001 of the flexible circuit board 300, thus bonding... Figure 7 The first conductive double-sided adhesive 50011 is bonded to the backlight surface of the display panel 100, and the second conductive double-sided adhesive 50012 is bonded to the first conductive area 3001 of the flexible circuit board 300.

[0084] In this embodiment, the charge accumulated on the display panel 100 is transferred to the first conductive area 3001 of the flexible circuit board 300 via the first conductive double-sided adhesive 50011, the conductive metal layer 5002, and the second conductive double-sided adhesive 50012. The first conductive double-sided adhesive 50011 and the second conductive double-sided adhesive 50012 can play a dual role of conducting electricity and fixing. The conductive metal layer 5002 located between the first conductive double-sided adhesive 50011 and the second conductive double-sided adhesive 50012 can accelerate the transfer of charge.

[0085] In some alternative embodiments, refer to Figure 13 and Figure 14 , Figure 13 yes Figure 3 Another cross-sectional view along the B-B' direction. Figure 14 yes Figure 3 Another cross-sectional view along the B-B' direction shows that the composite tape layer 400 includes a metal layer 40011, and the conductive structural component 500 is in contact with the metal layer 40011.

[0086] Figure 13 The intermediate composite tape layer 400 includes a first through hole 4001, and a portion of the conductive structural component 500 is located in the first through hole 4001. Figure 14The composite tape layer 400 includes a first through hole 4001, and the first support layer 601 includes a second through hole 6011. A portion of the conductive structural component 500 is located within the first through hole 4001 and the second through hole 6011. In this embodiment, the composite tape layer 400 includes a metal layer 40011. As described above, the composite tape layer 400 serves to dissipate heat from the display panel 100 and to conduct static electricity and shield signals. Therefore, the metal layer 40011 here serves to conduct static electricity and shield signals.

[0087] The conductive structure 500 has a sandwich structure, including a first conductive double-sided adhesive 50011, a conductive metal layer 5002, and a second conductive double-sided adhesive 50012. The conductive metal layer 5002 is sandwiched between the first conductive double-sided adhesive 50011 and the second conductive double-sided adhesive 50012 along a direction perpendicular to the plane of the substrate 10. The first conductive double-sided adhesive 50011 is located on the side of the conductive structure 500 closer to the display panel 100. The conductive metal layer 5002 in the conductive structural component 500 is in contact with the metal layer 40011 in the composite tape layer 400. The metal layer 40011 itself plays a role in electrostatic conduction. In this way, some of the charge accumulated on the display panel 100 can also be conducted to the composite tape layer 400 through the conductive structural component 500. That is, the charge conduction path is from the first conductive double-sided adhesive 50011 to the conductive metal layer 5002, and then to the metal layer 40011 of the composite tape layer 400. This increases the charge conduction path and can further prevent the charge from entering the display area AA of the display panel 100. This further improves the risk of screen periphery brightening, screen display abnormalities or four-screen splitting, decreased sensitivity or even failure.

[0088] In some alternative embodiments, refer to Figure 15 , Figure 15 yes Figure 3 Another cross-sectional view along the B-B' direction shows that the composite tape layer 400 includes a metal layer 40011, and the metal layer 40011 and the conductive metal layer 5002 are an integral structure.

[0089] In this embodiment, the composite tape layer 400 includes a metal layer 40011. As described above, the composite tape layer 400 serves to dissipate heat from the display panel 100 and to conduct static electricity and shield signals. Therefore, the metal layer 40011 here also serves to conduct static electricity and shield signals. On one hand, the metal layer 40011 and the conductive metal layer 5002 are an integral structure, and the metal layer 40011 itself plays a role in static electricity conduction. In this way, some of the charge accumulated on the display panel 100 can also be conducted to the composite tape layer 400 through the conductive structural component 500. That is, the charge conduction path is from the first conductive double-sided adhesive 50011 to the conductive metal layer 5002, and then to the metal layer 40011 of the composite tape layer 400. This increases the charge conduction path and can further prevent charge from entering the display panel 100. Area AA is shown. On the other hand, since the metal layer 40011 and the conductive metal layer 5002 are integrally structured, the conductive metal layer 5002 in the conductive structural component 500 and the metal layer 40011 in the composite tape layer 400 can be fabricated simultaneously during manufacturing, which is beneficial to simplifying the manufacturing process. Of course, if the thickness of the conductive metal layer 5002 in the direction perpendicular to the plane of the substrate 10 is equal to the thickness of the metal layer 40011 in the composite tape layer 400 in the direction perpendicular to the plane of the substrate 10, it is even more beneficial to simplify the manufacturing process.

[0090] In some alternative embodiments, reference continues to be made to... Figures 13 to 15 The material of the 40011 metal layer is copper.

[0091] Specifically, the composite tape layer 400 serves to dissipate heat from the display panel 100, conduct static electricity, and shield signals. The metal layer 40011 also serves to conduct static electricity and shield signals. Copper is a good conductor, so the material of the metal layer 40011, copper, effectively conducts static electricity and shields signals. Optionally, the metal layer 40011 is in contact with the conductive metal layer 5002, or the metal layer 40011 and the conductive metal layer 5002 are an integral structure. This allows for faster transfer of some of the accumulated charge on the display panel 100 to the metal layer 40011, further preventing charge from entering the display area AA of the display panel 100.

[0092] In some alternative embodiments, refer to Figure 16 , Figure 16 yes Figure 3 Another cross-sectional view along the B-B' direction shows that the composite tape layer 400 also includes a first foam layer 40012 and a second foam layer 40013. The first foam layer 40012 is located on the side of the metal layer closer to the display panel 100, and the second foam layer 40013 is located on the side of the metal layer away from the second foam layer 40013.

[0093] Optionally, the composite tape layer 400 uses SCF (Super-Composite-Film, copper foil tape), which is composed of foam, polyimide, and copper foil, providing good heat dissipation, cushioning, conductivity, and protection. The metal layer provides conductivity and heat dissipation, while the foam provides cushioning and protection. The foam can be a single-layer structure, such as... Figures 13 to 15 Only one first foam layer 40012 is provided. In this embodiment, the composite tape layer 400 has a sandwich structure, with a metal layer sandwiched between the first foam layer 40012 and the second foam layer 40013. The double-layer foam structure can better buffer and protect the display panel 100.

[0094] In some alternative embodiments, refer to Figure 17 and combined Figure 5 , Figure 7 and Figure 8 , Figure 17 This is a schematic diagram of another conductive structural component provided by the present invention. The conductive structural component 500 includes conductive double-sided adhesive 5001 and silver paste 5003.

[0095] Silver paste 5003 is a conductive material formulated from silver or its compounds, flux, binder, and diluent. When used to fabricate conductive structural component 500, silver paste 5003 is in a solid state. The conductivity of silver paste 5003 is positively correlated with its silver content. During the fabrication of conductive structural component 500, silver paste 5003 can be applied to conductive double-sided adhesive 5001 and then cured.

[0096] like Figure 17 As shown, the conductive structural component 500 is illustrated using a quadrangular prism structure as an example. The conductive double-sided adhesive 5001 and silver paste 5003 are arranged side-by-side along the second direction Y and extend along the third direction Z, which is perpendicular to the plane of the substrate 10. Since the conductive double-sided adhesive 5001 has adhesive properties and the silver paste 5003 also has a certain degree of adhesion, the conductive double-sided adhesive 5001 and the silver paste 5003 are fixedly connected. The specific arrangement of the conductive double-sided adhesive 5001 and the silver paste 5003 is not specified here.

[0097] As described above, the conductive structure 500 needs to be a good conductor of charge, thereby conducting the charge accumulated on the display panel 100 to the first conductive area 3001 of the flexible circuit board 300 through the conductive structure 500. After the flexible circuit board 300 is bonded to the display panel 100, a portion of it will protrude from the display panel 100. The flexible circuit board 300 is unstable, meaning it is easily bent, which will affect the signal transmission of the flexible circuit board 300 and compromise the reliability of the display module 1000. The conductive double-sided adhesive 5001 is an adhesive that has a certain degree of conductivity after curing or drying, which can connect various conductive materials together, forming an electrical path between the connected materials. If the conductive structural component 500 includes conductive double-sided adhesive 5001, then the side of conductive double-sided adhesive 5001 near the cover plate 200 can be bonded to the back of the first support layer 601, the side of conductive double-sided adhesive 5001 near the flexible circuit board 300 can be bonded to the flexible circuit board 300, or the side of conductive double-sided adhesive 5001 near the cover plate 200 can be bonded to the backlight side of the display panel 100, and the side of conductive double-sided adhesive 5001 near the flexible circuit board 300 can be bonded to the flexible circuit board 300, thereby fixing the flexible circuit board 300 to the back of the first support layer 601 or to the backlight side of the display panel 100.

[0098] Although the conductive double-sided adhesive 5001 has both adhesive and conductive properties, its conductivity is not as high as that of the silver paste 5003. In this embodiment, it is necessary to quickly conduct the charge accumulated on the display panel 100 to the first conductive area 3001 of the flexible circuit board 300. Therefore, the silver paste 5003 in the conductive structure 500 can achieve the purpose of quickly transferring static charge. Of course, since the conductive structure 500 in this embodiment also includes the conductive double-sided adhesive 5001, it can both transfer the charge to the first conductive area 3001 of the flexible circuit board 300 and fix the flexible circuit board 300, thereby improving the reliability of the display module 1000.

[0099] In some alternative embodiments, refer to Figure 18 and Figure 19 and combined Figure 5 , Figure 7 and Figure 8 , Figure 18 This is a schematic diagram of another conductive structural component provided by the present invention. Figure 19 This is a schematic diagram of another conductive structural component provided by the present invention. In the orthographic projection of the conductive structural component 500 onto the plane of the substrate 10, the conductive double-sided adhesive 5001 at least partially surrounds the silver paste 5003.

[0100] Figure 18The following is an illustrative example, using a conductive structural component 500 as an example where the conductive double-sided adhesive 5001 surrounds the silver paste 5003 in the orthographic projection of the conductive structural component 500 onto the plane of the substrate 10. Figure 18 In the orthographic projection of the conductive structural component 500 onto the plane of the substrate 10, the conductive double-sided adhesive 5001 forms a groove structure, and the silver paste 5003 is located within this groove structure. Figure 18 This is just one possible embodiment. In the orthographic projection of the conductive structure 500 onto the plane of the substrate 10, the conductive double-sided adhesive 5001 can surround the silver paste 5003. No specific limitation is made here. Figure 19 The example shown is based solely on the conductive structural component 500 being cylindrical, with the conductive double-sided adhesive 5001 completely surrounding the silver paste 5003 in the orthographic projection of the conductive structural component 500 onto the plane of the substrate 10. The thickness of the conductive double-sided adhesive 5001 in the second direction Y is not specifically limited here.

[0101] In this embodiment, in the orthographic projection of the conductive structure 500 onto the plane of the substrate 10, the conductive double-sided adhesive 5001 at least partially surrounds the silver paste 5003. The conductive double-sided adhesive 5001 can both transfer the charge to the first conductive area 3001 of the flexible circuit board 300 and fix the flexible circuit board 300, thereby improving the reliability of the display module 1000. The silver paste 5003 disposed in the conductive structure 500 has the side of the silver paste 5003 near the substrate 10 in contact with the first support layer 601 or the display panel 100, and the side of the silver paste 5003 near the flexible circuit board 300 in contact with the flexible circuit board 300. Since the silver paste 5003 has good conductivity, it can quickly and directly conduct the charge accumulated on the display panel 100 to the first conductive area 3001 of the flexible circuit board 300.

[0102] In some alternative embodiments, refer to Figure 20 and combined Figure 5 , Figure 7 and Figure 8 , Figure 20 This is a schematic diagram of another conductive structural component provided by the present invention. Along the direction perpendicular to the plane where the substrate 10 is located, the conductive structural component 500 includes a third conductive double-sided adhesive 50013, a silver paste 5003 located on the side of the third conductive double-sided adhesive 50013 near the display panel 100, and a fourth conductive double-sided adhesive 50014 located on the side of the silver paste 5003 near the display panel 100.

[0103] The conductive structural component 500 has a sandwich structure, including a third conductive double-sided adhesive 50013, silver paste 5003, and a fourth conductive double-sided adhesive 50014. Along a direction perpendicular to the plane of the substrate 10, the silver paste 5003 is sandwiched between the third conductive double-sided adhesive 50013 and the fourth conductive double-sided adhesive 50014. The third conductive double-sided adhesive 50013 is located on the side of the conductive structural component 500 closest to the display panel 100. The materials of the third conductive double-sided adhesive 50013 and the fourth conductive double-sided adhesive 50014 can be the same or different; no specific limitation is made here. Figure 5 and Figure 8 The third conductive double-sided adhesive 50013 is bonded to the side of the first support layer 601 away from the substrate 10, and the fourth conductive double-sided adhesive 50014 is bonded to the first conductive area 3001 of the flexible circuit board 300, thus bonding... Figure 7 The third conductive double-sided adhesive 50013 is bonded to the backlight surface of the display panel 100, and the fourth conductive double-sided adhesive 50014 is bonded to the first conductive area 3001 of the flexible circuit board 300.

[0104] In this embodiment, the charge accumulated on the display panel 100 is transferred to the first conductive area 3001 of the flexible circuit board 300 via the third conductive double-sided adhesive 50013, silver paste 5003, and fourth conductive double-sided adhesive 50014. The third conductive double-sided adhesive 50013 and the fourth conductive double-sided adhesive 50014 can play a dual role of conducting electricity and fixing, while the silver paste 5003 located between the third conductive double-sided adhesive 50013 and the fourth conductive double-sided adhesive 50014 can accelerate the transfer of charge.

[0105] In some alternative embodiments, reference continues to be made to... Figure 5 The first conductive region 3001 includes a first metal sheet 3003, which is made of copper.

[0106] It is understood that the first conductive area 3001 has a first metal sheet 3003, which is made of copper. Copper is a good conductor of charge. In this way, the charge accumulated on the display panel 100 can be conducted to the first metal sheet 3003 in the first conductive area 3001, thus preventing the charge from entering the display area AA of the display panel 100.

[0107] In some alternative embodiments, reference continues to be made to... Figures 3 to 20 The first conductive region 3001 is grounded, or the first conductive region 3001 is connected to a positive voltage, or the first conductive region 3001 is electrically connected to the electrostatic circuit.

[0108] Optionally, the first conductive area 3001 is grounded. Since the composite tape layer 400 attached to the backlight side of the display panel 100 has a first through hole 4001 and a conductive structure 500 is provided in the first through hole 4001, the charge will reach the flexible circuit board 300 electrically connected to the conductive structure 500 through the conductive structure 500. Moreover, the conductive structure 500 is electrically connected to the first conductive area 3001 on the flexible circuit board 300. The first conductive area 3001 is grounded, and the charge is directly conducted to the ground, preventing the charge from entering the display area AA of the display panel 100. This avoids the risk of screen periphery brightening, screen display abnormalities or four-screen phenomena, decreased sensitivity or even failure caused by the charge entering the display area AA of the display panel 100. This improves the user experience of the display module 1000, extends the service life of the display module 1000, and improves the display effect.

[0109] Optionally, the first conductive area 3001 is connected to a positive voltage. Since the composite tape layer 400 attached to the backlight side of the display panel 100 is provided with a first through hole 4001, and a conductive structure 500 is provided in the first through hole 4001, the static charge is generally a negative charge. It will reach the flexible circuit board 300 electrically connected to the conductive structure 500 through the conductive structure 500. Moreover, the conductive structure 500 is electrically connected to the first conductive area 3001 on the flexible circuit board 300. The first conductive area 3001 is connected to a positive voltage. The negative charge cancels out the positive voltage of the first conductive area 3001, thus fundamentally eliminating the static charge accumulated on the display panel 100.

[0110] Optionally, the first conductive area 3001 is electrically connected to an electrostatic circuit (not shown in the figure). Typically, the flexible circuit board 300 is equipped with an electrostatic circuit. Since the composite tape layer 400 attached to the backlight side of the display panel 100 has a first through hole 4001, and a conductive structure 500 is provided in the first through hole 4001, the charge will reach the flexible circuit board 300 that is electrically connected to the conductive structure 500 through the conductive structure 500. Moreover, the conductive structure 500 is electrically connected to the first conductive area 3001 on the flexible circuit board 300. The first conductive area 3001 is electrically connected to the electrostatic circuit, which can play a role in electrostatic protection, discharge the charge, and prevent the charge from entering the display area AA of the display panel 100.

[0111] In some alternative embodiments, refer to Figure 21 and combined Figure 5 , Figure 21 This is a schematic diagram of a planar structure of another display module provided by the present invention. The display panel 100 includes a fingerprint recognition area 700. In the direction perpendicular to the plane of the substrate 10, the first through hole 4001 at least partially overlaps with the fingerprint recognition area 700.

[0112] The fingerprint recognition area 700 is located in the display area AA of the display panel 100. This design can improve the screen-to-body ratio of the display panel 100. Figure 21 The diagram only shows the case where the first through hole 4001 is located within the fingerprint recognition area 700 in the direction perpendicular to the plane of the substrate 10. It is also possible that the first through hole 4001 and the fingerprint recognition area 700 partially overlap in the direction perpendicular to the plane of the substrate 10. No specific limitation is made here.

[0113] Because everyone's fingerprints are unique, they can be used for identity verification, and fingerprint recognition technology is widely used in the display technology field. Since fingerprint recognition requires repeated touching of the fingerprint recognition area 700, static charge is generated during the touch process. Typically, the fingerprint recognition area 700 contains a photodiode (not shown in the diagram). When a finger touches the screen, light shines on the valleys and ridges of the fingerprint, causing reflection. Due to the different reflection angles and intensities of the reflected light, the light is projected onto the photodiode, causing a change in its resistance and thus a change in its current, which identifies the valleys and ridges of the fingerprint. If static charge accumulates in the fingerprint recognition area 700, it directly affects the transistor characteristics of the pixel circuits in the surrounding area, potentially causing localized brightening of the display panel, severely impacting display quality and user experience. Especially before the display panel leaves the factory, a copper rod friction test is usually performed to verify the stability of the display panel during prolonged screen sliding. When the copper rod repeatedly rubs the display panel, charge accumulation easily occurs around the fingerprint recognition area 700, making brightening of the display more likely. Therefore, static electricity is a significant issue affecting the overall display panel performance.

[0114] Optionally, the photodiode can be located on the side of the substrate 10 away from the light-emitting surface of the display panel 100. In this case, since the photodiode needs to receive reflected light, the composite tape 400 is usually designed with an opening at the fingerprint recognition area 700 to allow a path for the reflected light to pass through, ensuring fingerprint recognition performance. In reliability tests, such as copper rod friction tests, electrostatic charges easily accumulate near the fingerprint recognition area 700.

[0115] In this embodiment, in the direction perpendicular to the plane of the substrate 10, the first through hole 4001 overlaps at least partially with the fingerprint recognition area 700. During the fingerprint recognition process, static charge is generated due to finger friction. The static charge is directly transferred through the conductive structure 500 to the flexible circuit board 300 electrically connected to the conductive structure 500. Moreover, the conductive structure 500 is electrically connected to the first conductive area 3001 on the flexible circuit board 300, which discharges the static charge and avoids the accumulation of static electricity. This avoids the impact of the charge on the pixel circuit characteristics in the fingerprint recognition area 700, thus preventing the display effect of the fingerprint recognition area from being affected.

[0116] In this embodiment, the conductive structure 500 is placed near the location corresponding to the fingerprint recognition area 700 that accumulates static charge, which enables the static charge to be discharged more accurately and purposefully.

[0117] In some alternative embodiments, refer to Figure 22 and combined Figure 5 , Figure 22 This is a schematic diagram of a planar structure of another display module provided by the present invention. The display panel 100 includes a fingerprint recognition area 700. The orthographic projection of the first through hole 4001 on the plane where the substrate 10 is located at least partially surrounds the orthographic projection of the fingerprint recognition area 700 on the plane where the substrate 10 is located.

[0118] The fingerprint recognition area 700 is located in the display area AA of the display panel 100. This design can improve the screen-to-body ratio of the display panel 100. Figure 22 The figure only shows the case where the orthographic projection of the first through hole 4001 on the plane of the substrate 10 completely surrounds the orthographic projection of the fingerprint recognition area 700 on the plane of the substrate 10. Alternatively, the orthographic projection of the first through hole 4001 on the plane of the substrate 10 may partially surround the orthographic projection of the fingerprint recognition area 700 on the plane of the substrate 10, but this is not shown in the figure.

[0119] As described above, a photodiode (not shown in the figure) is provided in the fingerprint recognition area 700. When a finger touches the screen, the light source shines on the valleys and ridges of the fingerprint and is reflected. Due to the different reflection angles and light intensities of the reflected light from the valleys and ridges, the light is projected onto the photodiode, causing a change in the resistance of the photodiode. This, in turn, changes the current of the photodiode, thus recognizing the valleys and ridges of the fingerprint. If electrostatic charge enters the fingerprint recognition area 700, it will affect the characteristic curve of the transistor in the pixel circuit, causing localized brightening of the display panel and affecting the display effect and user experience.

[0120] In this embodiment, the orthographic projection of the first through hole 4001 onto the plane of the substrate 10 at least partially surrounds the orthographic projection of the fingerprint recognition area 700 onto the plane of the substrate 10. In this way, the static charge around the fingerprint recognition area 700 will be directly transferred through the conductive structure 500 to the flexible circuit board 300 electrically connected to the conductive structure 500. Moreover, the conductive structure 500 is electrically connected to the first conductive area 3001 on the flexible circuit board 300, which discharges the static charge and avoids affecting the display effect of the display panel due to the charge entering the fingerprint recognition area 700.

[0121] In some alternative embodiments, please refer to Figure 23 , Figure 23 This is a schematic diagram of a planar structure of a display device provided in an embodiment of the present invention. The display device 2000 provided in this embodiment includes the display module 1000 provided in the above embodiment. Figure 23 This embodiment uses a mobile phone as an example to illustrate the display device 2000. It is understood that the display device 2000 provided in this embodiment can be any other display device 2000 with display functions, such as a computer, television, or vehicle-mounted display device; this invention does not impose specific limitations on this. The display device 2000 provided in this embodiment has the beneficial effects of the display module 1000 provided in this embodiment. For details, please refer to the specific descriptions of the display module 1000 in the above embodiments; these will not be repeated here.

[0122] As can be seen from the above embodiments, the display module and display device provided by the present invention achieve at least the following beneficial effects:

[0123] The display panel of this invention has a composite tape layer on the side away from the light-emitting surface. This composite tape layer protects and dissipates heat from the display panel, improving its reliability and heat dissipation performance. The composite tape layer includes at least one first through-hole penetrating the composite tape layer. A conductive structural component is at least partially located within the first through-hole. Along a direction perpendicular to the plane of the substrate of the display panel, the length H1 of the composite tape layer is less than or equal to the length H2 of the conductive structural component. A flexible circuit board is electrically connected to the display panel. The flexible circuit board includes at least one first conductive area, and the conductive structural component is electrically connected to the first conductive area of ​​the flexible circuit board. When external charges accumulate on the display panel, such as during the cutting process or electrostatic testing when charges enter from the edge of the display panel, or due to friction, charges accumulate on the cover plate of the display module and then escape from the display. The edge of the panel is penetrated by a first through-hole in the composite tape layer attached to the backlight side of the display panel. A conductive structure is located within this through-hole, allowing charge to travel via the conductive structure to the flexible circuit board electrically connected to it. Furthermore, the conductive structure is electrically connected to a first conductive area on the flexible circuit board, preventing charge from entering the display area of ​​the display panel. This avoids risks such as screen perimeter brightening, abnormal screen display, screen splitting, decreased sensitivity, or even malfunction caused by charge entering the display area, thus improving the user experience, extending the lifespan of the display module, and enhancing the display effect. Moreover, compared to related technologies, this invention eliminates the need to reserve space at the bending area of ​​the display panel for conductive liquid or conductive silver paste. Therefore, the lower edge of the display module does not suffer from insufficient clearance, and the width of the lower edge is not excessive, which facilitates the achievement of a narrow bezel. Furthermore, this invention only requires setting a first through hole in the existing composite tape layer and placing a conductive structure within the first through hole to electrically connect the conductive structure to the first conductive area of ​​the flexible circuit board. The manufacturing method is relatively simple, convenient, and yields a high product yield. In contrast, related technologies that apply conductive liquid or conductive silver paste to the lower edge of the display module have higher process requirements and result in greater yield losses. Moreover, this invention does not increase the thickness or width of the display module, achieving electrostatic protection while ensuring a thinner display module and narrower bezels.

[0124] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A display module, characterized in that, include: The display panel includes a substrate. A flexible circuit board, including at least one first conductive region, is electrically connected to the display panel; The composite tape layer is located on the side of the substrate away from the light-emitting surface of the display panel; At least one conductive structural component; The composite tape layer includes at least one first through hole penetrating the composite tape layer, and the conductive structure is at least partially located within the first through hole; along a direction perpendicular to the plane of the substrate, the length of the composite tape layer is H1, the length of the conductive structure is H2, H1≤H2, and the conductive structure is electrically connected to the first conductive region, the first conductive region is grounded, or the first conductive region is connected to a positive voltage, or the first conductive region is electrically connected to an electrostatic circuit.

2. The display module according to claim 1, characterized in that, It also includes a first support layer, wherein the substrate is located on the side of the first support layer closer to the light-emitting surface of the display panel; Along a direction perpendicular to the plane of the substrate, there is at least one second through hole penetrating the first support layer, and the conductive structure is at least partially located in the second through hole and is in contact with the first conductive area and the display panel, respectively. Along a direction perpendicular to the plane of the substrate, the first through hole and the second through hole at least partially overlap.

3. The display module according to claim 1, characterized in that, The orthographic projection of the conductive structural component onto the plane of the substrate is located within the orthographic projection of the first conductive region onto the plane of the substrate.

4. The display module according to claim 1, characterized in that, The first conductive region includes exposed copper.

5. The display module according to claim 1, characterized in that, The conductive structural component includes conductive double-sided adhesive.

6. The display module according to claim 1, characterized in that, The conductive structural component includes conductive double-sided adhesive and a conductive metal layer.

7. The display module according to claim 6, characterized in that, In the orthographic projection of the conductive structural component onto the plane of the substrate, the conductive double-sided adhesive at least partially surrounds the conductive metal layer.

8. The display module according to claim 6, characterized in that, Along a direction perpendicular to the plane of the substrate, the conductive structure includes a first conductive double-sided adhesive, a conductive metal layer located on the side of the first conductive double-sided adhesive near the display panel, and a second conductive double-sided adhesive located on the side of the conductive metal layer near the display panel.

9. The display module according to claim 8, characterized in that, The composite tape layer includes a metal layer, and the conductive structural component is in contact with the metal layer.

10. The display module according to claim 9, characterized in that, The composite tape layer includes a metal layer, and the metal layer and the conductive metal layer are an integral structure.

11. The display module according to claim 9, characterized in that, The metal layer is made of copper.

12. The display module according to claim 9, characterized in that, The composite tape layer further includes a first foam layer and a second foam layer, wherein the first foam layer is located on the side of the metal layer closer to the display panel, and the second foam layer is located on the side of the metal layer away from the second foam layer.

13. The display module according to claim 1, characterized in that, The conductive structural component includes conductive double-sided adhesive and silver paste.

14. The display module according to claim 13, characterized in that, In the orthographic projection of the conductive structural component onto the plane of the substrate, the conductive double-sided adhesive at least partially surrounds the silver paste.

15. The display module according to claim 14, characterized in that, Along a direction perpendicular to the plane of the substrate, the conductive structure includes a third conductive double-sided adhesive, silver paste located on the side of the third conductive double-sided adhesive near the display panel, and a fourth conductive double-sided adhesive located on the side of the silver paste near the display panel.

16. The display module according to claim 1, characterized in that, The first conductive region includes a first metal sheet, which is made of copper.

17. The display module according to claim 1, characterized in that, The display panel includes a fingerprint recognition area, and in a direction perpendicular to the plane of the substrate, the first through hole at least partially overlaps with the fingerprint recognition area.

18. The display module according to claim 1, characterized in that, The display panel includes a fingerprint recognition area, and the orthographic projection of the first through hole onto the plane of the substrate at least partially surrounds the orthographic projection of the fingerprint recognition area onto the plane of the substrate.

19. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 18.

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