Maleimide copolymer and resin composition
By adding a maleimide-based copolymer of a specific composition to the thermoplastic resin, the problem of wire drawing during hot plate welding is solved, and the effect of suppressing wire drawing, improving appearance and imparting heat resistance is achieved.
CN115605520BActive Publication Date: 2025-05-02DENKA CO LTD
Patent Information
- Application Number
- CN202180035361.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-08-31
- Filing Date
- 2021-06-08
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2041-06-08
AI Technical Summary
Technical Problem
During the welding process of hot plates, the resin surface is prone to wire drawing when it is pulled away from the hot plate, resulting in poor appearance and reduced workability.
Method used
By adding a maleimide-based copolymer of a specific composition to the thermoplastic resin, the increase in yellowness is suppressed and heat resistance is imparted, while the wire drawing phenomenon during welding of the hot plate is suppressed.
Benefits of technology
The wire drawing phenomenon during hot plate welding is effectively suppressed, the appearance and workability of the finished product are improved, and the resin composition is given good heat resistance.
✦ Generated by Eureka AI based on patent content.
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Abstract
The present invention relates to a maleimide copolymer, which has 40 to 65% by mass of an aromatic vinyl monomer unit and 35 to 60% by mass of a maleimide monomer unit, wherein the residual amount of the aromatic vinyl monomer is 200 to 2000 ppm by mass, and the residual amount of the maleimide monomer is 30 to 400 ppm by mass.
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Citation Information
Patent Citations
Resin composition for fusing heat plate
JP1997012902A
Maleimide copolymer, its production and thermoplastic resin composition containing the copolymer
JP1994093044A
Preparation of maleimide-based copolymer
JP1999158215A
Thermoplastic resin composition for lamp housing
JP2004182835A
Method for producing thermoplastic resin composition
JP2009191096A