Heating element, atomizing core, atomizer and electronic atomization device

Abstract

The present application relates to a heating element, an atomizing core, an atomizer and an electronic atomizing device, the heating element comprising a first heating layer and a second heating layer stacked together, the porosity and the pore density of the first heating layer being smaller than those of the second heating layer. In the heating element of the present application, the surface of the second heating layer facing away from the first heating layer can be connected to the porous substrate in the atomizer, and the liquid atomizing substrate in the atomizer can penetrate into the second heating layer to increase the atomizing surface, so that the atomization is more sufficient to produce a larger amount of smoke, and the atomizing temperature field is more sufficient. On this basis, the first heating layer can prevent the liquid atomizing substrate from penetrating through the second heating layer and from seeping out from the surface of the second heating layer in contact with the first heating layer. Thus, the problem of liquid explosion and liquid collapse of the liquid atomizing substrate on the second heating layer can be avoided, thereby effectively improving the user experience.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of atomization devices, in particular to a heating element, an atomization core, an atomizer and an electronic atomization device. BACKGROUND

[0002] At present, in the structure of a heating body for an atomizer, a heating element is usually attached to a porous substrate, wherein the heating element is used to generate energy required for atomization.

[0003] During use, in order to make atomization more sufficient and liquid supply effect, the heating element can also adopt a porous heating element with a pore structure, the pore structure can increase an atomization surface and realize liquid guiding and storing functions, so as to generate a larger amount of smoke and make the atomization temperature field more uniform.

[0004] However, a large number of through pore structures also simultaneously cause liquid atomization substrates inside to be not atomized in time, thereby forming a phenomenon of liquid explosion and liquid collapse, which seriously affects the experience of a user during use. SUMMARY

[0005] Therefore, it is necessary to provide a heating element, an atomization core, an atomizer and an electronic atomization device in view of the problem of liquid explosion and liquid collapse during use of an atomizer.

[0006] In a first aspect, the present application provides a heating element, comprising a first heating layer and a second heating layer stacked together, wherein the porosity and the pore density of the first heating layer are both less than those of the second heating layer.

[0007] In some embodiments, the porosity of the first heating layer is 0-30%, and / or the porosity of the second heating layer is 30-70%.

[0008] In some embodiments, a plurality of first micropores are formed through the second heating layer along the thickness direction of the second heating layer.

[0009] In some embodiments, the second heating layer is a metal heating layer.

[0010] In some embodiments, the material of the first heating layer comprises a metal material and / or a ceramic material.

[0011] In some embodiments, a plurality of second micropores are formed through the first heating layer along the thickness direction of the first heating layer, and each of the second micropores is in communication with at least part of the first micropores.

[0012] In some embodiments, the heating element comprises a filler, and the filler is filled in each of the second micropores in communication with the first micropores.

[0013] In some embodiments, the first heating layer is a metal heating layer, and the filler material includes metal materials and / or ceramic materials.

[0014] In some embodiments, the thermal conductivity of the filler is greater than or equal to 10 W / (m·K).

[0015] In some embodiments, the filler material includes one or more of alumina, boron nitride, and silicon carbide.

[0016] Secondly, this application provides an atomizing core, including a porous substrate and a heating element as described above, wherein the heating element is stacked on at least one surface of the porous substrate.

[0017] Thirdly, this application provides an atomizer, including the atomizing coil as described above.

[0018] Fourthly, this application provides an electronic atomizing device, including a power supply assembly and an atomizer as described above, wherein the power supply assembly is used to supply power to the atomizer.

[0019] In the aforementioned heating element, atomizing core, atomizer, and electronic atomization device, the surface of the second heating layer in the heating element, which faces away from the first heating layer, can connect with the porous substrate in the atomizer. The liquid atomizing matrix in the atomizer can penetrate into the second heating layer to increase the atomization surface area, resulting in more complete atomization and a larger amount of vapor, as well as a more complete atomization temperature field. Furthermore, the first heating layer can prevent the liquid atomizing matrix from penetrating the second heating layer and from seeping out from the surface where the second heating layer contacts the first heating layer. This avoids the problem of liquid atomizing matrix bursting or collapsing on the second heating layer, thereby effectively improving the user experience. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a heating element according to one embodiment of this application;

[0021] Figure 2 This is a schematic diagram of the structure of a heating element according to another embodiment of this application;

[0022] Figure 3 A physical diagram showing a through-hole structure for a heating element in the prior art;

[0023] Figure 4 This is a physical diagram of the heating element in one embodiment of this application;

[0024] Figure 5 for Figure 4 A partial magnified view of point A of the heating element in the embodiment;

[0025] Figure 6 forFigure 4 A-A cross-sectional view of the heating element in the embodiment;

[0026] Figure 7 A physical diagram of the heating element in another embodiment of the present application;

[0027] Figure 8 A physical diagram of the heating element in another embodiment of the present application; Figure 7 B partial enlarged view of the heating element in the embodiment;

[0028] Figure 9 A physical diagram of the heating element in another embodiment of the present application; Figure 7 B-B cross-sectional view of the heating element in the embodiment;

[0029] Reference signs: 100, heating element; 10, first heating layer; 20, second heating layer; 30, filler; 40, porous matrix; 11, second micropore; 21, first micropore; a, thickness direction. DETAILED DESCRIPTION

[0030] In order to make the above objectives, characteristics and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, a lot of specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many different ways from those described herein, and those skilled in the art can make similar improvements without departing from the scope of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0032] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified.

[0033] In the present application, unless specifically defined and limited otherwise, the terms "mounting", "connected", "connecting", "fixed", and similar terms are to be construed in a broad sense, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] In the present application, unless specifically defined and limited otherwise, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0035] It should be noted that when an element is referred to as "fixed to" or "provided on" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and are not the only implementation.

[0036] It should be noted that in the traditional structure of the atomizer heating element, the heating element is attached to the porous substrate, and the heating element can generate the energy required for atomization. With the further development of the atomizer, in order to improve the preheating effect of the heating element on the tobacco liquid and make the atomization more sufficient, a scheme of using a porous heating element with a pore structure for the heating element appears, the pore structure of the heating element makes the heating element have a larger atomization surface and can realize the functions of liquid guiding and liquid storage, thereby being able to generate a larger amount of smoke, and being able to make the atomization temperature field more uniform.

[0037] As shown in Figure 3 When the porosity of the heating element is high, the applicant notices that the atomizer with the above structure is prone to produce a large amount of liquid explosion sound during use, which seriously affects the user's experience during use.

[0038] After deep research, the applicant finds that when the heating element is attached to the porous substrate, the heating element has a large number of through holes in the pore structure, that is, the through holes are through holes passing through at least two surfaces. The liquid atomization substrate inside the atomizer can enter the inside of the heating element through the through holes and quickly guide to the surface of the heating body. Under the action of high temperature of the heating element, the liquid atomization substrate near the inner wall of the through hole changes temperature quickly, and the liquid atomization substrate in the central region of the through hole changes temperature slowly because it is far away from the inner wall of the through hole. Thus, part of the liquid atomization substrate in the through hole does not have time to atomize, thereby forming the phenomenon of liquid explosion and liquid collapse. Another reason is that during the rapid heating process of the heating element, the volume of the internal liquid atomization substrate expands rapidly, which will squeeze the liquid atomization substrate to the outside surface of the heating element, forming a thick liquid film. The existence of the thick liquid film hinders the escape of the internal aerosol on the one hand, and forms a liquid bubble and quickly breaks, causing liquid explosion on the other hand.

[0039] In addition, due to the through hole, the liquid atomization substrate in the through hole can be directly transmitted through the through hole, and the part of the liquid atomization substrate directly transmitted through the through hole has a low temperature, which is not conducive to full atomization.

[0040] Based on this, in order to solve the problem that the atomizer is easy to produce liquid explosion and liquid collapse during use, the application provides a heating element, which can connect the side of the second heating layer of the heating element away from the first heating layer with the porous substrate. The liquid atomization substrate in the atomizer can penetrate into the second heating layer, thereby increasing the atomization surface and realizing the effects of full atomization, rapid liquid guiding and liquid storage. On this basis, the first heating layer can block the liquid atomization substrate in the second heating layer from penetrating the second heating layer, thereby avoiding the phenomenon of liquid explosion and liquid collapse of the liquid atomization substrate on the side surface of the second heating layer in contact with the first heating layer, and improving the experience of users.

[0041] Referring to Figure 1 An embodiment of the application provides a heating element 100, which comprises a first heating layer 10 and a second heating layer 20 stacked together, wherein the porosity and the pore density of the first heating layer 10 are both less than those of the second heating layer 20.

[0042] It should be noted that porosity refers to the ratio of the pore volume to the total volume of a porous material. In this application, the porosity of the first heating layer 10 refers to the ratio of the pore volume to the total volume of the first heating layer 10. Similarly, the porosity of the second heating layer 20 refers to the ratio of the pore volume to the total volume of the second heating layer 20. Therefore, in this invention, the porosity of the first heating layer 10 is less than that of the second heating layer 20. This has the advantage of reducing the amount of liquid stored in the pores of the first heating layer 10, preventing excessive liquid from flowing to its atomization surface during heating, and reducing the thickness of the oil film. Furthermore, the above-mentioned porosity is based on the microscopic perspective of the first heating layer 10 and the second heating layer 20, that is, the pore size of the pores on the first heating layer 10 and the second heating layer 20 is in the micrometer range, for example, the pore size range can be set to 1μm-50μm.

[0043] Pore ​​density refers to the average number of pores per unit volume of the first heating layer 10 or the second heating layer 20. Therefore, if the pore density of the first heating layer 10 is less than that of the second heating layer 20, it indicates that the pores on the first heating layer 10 are sparsely distributed, while the pores on the second heating layer 20 are densely distributed.

[0044] Therefore, when the heating element 100 is applied in an atomizer, the side of the second heating layer 20 away from the first heating layer 10 can be connected to the porous substrate of the atomizer, that is, the surface of the second heating layer 20 away from the first heating layer 10 is attached to the porous substrate.

[0045] During atomizer use, the liquid atomizing matrix can penetrate to the surface of the porous substrate, and a portion of the liquid atomizing matrix penetrates into the interior of the second heating layer 20 through the pores in the second heating layer 20. This results in a larger contact area between the liquid atomizing matrix and the heating element 100, providing a larger atomization surface and thus enabling more complete atomization.

[0046] Based on this, the liquid atomizing matrix inside the second heating layer 20 is blocked inside the heating element 100 by the first heating layer 10, preventing the liquid atomizing matrix from seeping out of the second heating layer 20. This avoids the phenomenon of liquid splattering or bursting on the surface of the second heating layer 20, effectively improving the user experience.

[0047] This application improves the structure of the heating element 100. The improved structure is simple and easy to operate, and can effectively solve the problems of liquid splattering and liquid collapse while ensuring sufficient atomization, thereby improving the user experience.

[0048] In some embodiments, the porosity of the first heating layer 10 is 0% to 30%, and / or the porosity of the second heating layer 20 is 30% to 70%.

[0049] When the porosity of the first heating layer 10 is 0 or close to 0, the first heating layer 10 is constructed as a dense film layer. At this time, the first heating layer 10 can block the liquid atomizing matrix in the pores of the second heating layer 20, which can prevent the liquid atomizing matrix from producing splattering or collapse on the surface of the second heating layer 20, effectively improving the user experience.

[0050] Understandably, when the porosity of the first heating layer 10 is not equal to 0, its porosity is between 0% and 30%. The liquid atomizing matrix within the pores of the second heating layer 20 typically has a certain viscosity. Therefore, although the porosity of the first heating layer 10 is not 0, the fine pores on the first heating layer 10 can still provide some barrier effect against the liquid atomizing matrix within the pores of the second heating layer 20. The specific porosity of the first heating layer 10 can be adjusted according to actual factors such as the viscosity of the liquid atomizing matrix and the volume of the liquid atomizing matrix within the pores of the second heating layer 20, so that the first heating layer 10 can provide good barrier effect against the liquid atomizing matrix within the pores of the second heating layer 20. This will not be elaborated upon here.

[0051] In some embodiments, a plurality of first micropores 21 are formed through the second heating layer 20 along its thickness direction. The first micropores 21 can be used to store the liquid atomizing matrix that permeates from the porous substrate into the second heating layer 20, and can also play a certain role in guiding the liquid atomizing matrix in the second heating layer 20.

[0052] When the liquid atomizing matrix penetrates from the porous substrate into each of the first micropores 21, the contact area between the liquid atomizing matrix and the second heating layer 20 is larger, that is, the atomization surface is larger, thereby generating a larger amount of smoke and making the atomization temperature field more uniform.

[0053] In some embodiments, the second heating layer 20 is a metal heating layer. That is, the second heating layer 20 is made of a metal material, specifically, the second heating layer 20 may be made of a nickel alloy or nickel-iron alloy, etc. Making the second heating layer 20 of metal can improve the thermal conductivity of the second heating layer 20 to the liquid atomizing matrix inside. In some embodiments, the material of the first heating layer 10 includes metal materials and / or ceramic materials.

[0054] When the porosity of the first heating layer 10 is equal to or close to 0, the first heating layer 10 is constructed as a dense film layer. In this case, the first heating layer 10 can be made of metals such as nickel alloy or nickel-iron alloy, or it can be made of high thermal conductivity ceramics such as alumina or boron nitride. Specifically, the material formulation of the first heating layer 10 can be adjusted according to actual heat conduction, oil supply, and other effects, and will not be elaborated here.

[0055] In some embodiments, a plurality of second micropores 11 are formed on the first heating layer 10 along its own thickness direction, and each second micropore 11 is connected to at least a portion of the first micropores 21.

[0056] When the porosity of the first heating layer 10 is not equal to 0, a plurality of second micropores 11 can be formed on the first heating layer 10 along its own thickness direction. When the first heating layer 10 is stacked on the second heating layer 20, the second micropores 11 are connected to at least a portion of the first micropores 21.

[0057] In some embodiments, the heating element 100 includes a filler 30, which fills each of the second micropores 11 that communicate with the first micropore 21.

[0058] When the first heating layer 10 has second micropores 11, the first micropores 11 communicating with each of the second micropores 11 are filled with filler 30. This seals the first micropores 11 on the first heating layer 10. When the first heating layer 10 is stacked on the second heating layer 20, the end communicating with the second micropore 21 is sealed, allowing the first heating layer 10 to effectively block the liquid atomizing matrix within the first micropores 11, preventing the liquid atomizing matrix from splattering or bursting on the surface of the second heating layer 20, thus effectively improving the user experience.

[0059] In some embodiments, the first heating layer 10 is a metal heating layer, and the filler 30 is made of metal materials and / or ceramic materials.

[0060] When the first heating layer 10 has a second micropore 11, the first heating layer 10 can be made of metals such as nickel alloy or nickel-iron alloy, but is not limited to. Meanwhile, the filler 30 can include a high thermal conductivity metal material different from that of the first heating layer 10, such as alumina. Of course, the filler 30 can also include high-melting-point ceramic slurry such as silicon carbide or boron oxide.

[0061] In some embodiments, the thermal conductivity of the filler 30 is greater than or equal to 10 W / (m·K). Preferably, the thermal conductivity of the filler 30 can be set to 30 W / (m·K)-300 W / (m·K). This results in the filler 30 having high thermal conductivity, thereby making the atomization temperature field distribution more uniform and the atomization more complete.

[0062] In some embodiments, the filler 30 is made of one or more of alumina, boron nitride, and silicon carbide. This effectively improves the thermal conductivity of the filler 30.

[0063] Please refer to Figure 1Specifically, in Embodiment 1 of this application, a plurality of first micropores 21 are formed through the second heating layer 20 along its own thickness direction, and the porosity is 30% to 70%. The porosity of the first heating layer 10 is equal to or close to 0, that is, the first heating layer 10 is constructed as a dense film layer.

[0064] Furthermore, the second heating layer 20 is constructed as a metallic heating layer. At the same time, the first heating layer 10 is constructed as a dense film layer using a metal such as a nickel alloy or a nickel-iron alloy, and is stacked on the second heating layer 20 to achieve the blocking effect on the liquid atomization matrix inside the first micropore 21.

[0065] In Embodiment 1, the raw material slurry of the first heating layer 10 can be screen-printed onto the second heating layer 20 and then sintered to form a dense film layer on one side of the second heating layer 20, thereby blocking one end of the first micropore 21.

[0066] Furthermore, the first heating layer 10 can be fabricated into a cast film to tightly adhere to one side of the second heating layer 20. Specifically, the first heating layer 10 is first fabricated into a cast film and then laser-cut. The laser-cut first heating layer 10 is then adhered to one side of the second heating layer 20, and the stacked first heating layer 10 and second heating layer 20 are sintered to ensure a tight connection between them. Thus, the first heating layer 10 effectively blocks one end of the first micropore 21.

[0067] Please continue reading. Figure 1 In Embodiment 2 of this application, a plurality of first micropores 21 are formed through the second heating layer 20 along its own thickness direction, and the porosity is 30% to 70%. The porosity of the first heating layer 10 is equal to or close to 0, that is, the first heating layer 10 is constructed as a dense film layer.

[0068] Furthermore, the second heating layer 20 is constructed as a metallic heating layer. At the same time, the first heating layer 10 is constructed as a dense film layer using a high thermal conductivity ceramic material such as alumina or boron nitride, and is stacked on the second heating layer 20 to achieve the blocking effect on the liquid atomization matrix inside the first micropore 21.

[0069] In Embodiment 2, the first heating layer 10 can be screen-printed onto the second heating layer 20 so that the first heating layer 10 forms a dense film layer on one side of the second heating layer 20 to block one end of the first micropore 21.

[0070] Furthermore, the first heating layer 10 can be fabricated into a cast film to tightly adhere to one side of the second heating layer 20. Specifically, the first heating layer 10 is first fabricated into a cast film and then laser-cut. The laser-cut first heating layer 10 is then adhered to one side of the second heating layer 20, and the stacked first heating layer 10 and second heating layer 20 are sintered to ensure a tight connection between them. Thus, the first heating layer 10 effectively blocks one end of the first micropore 21.

[0071] In both Embodiment 1 and Embodiment 2 described above, the first heating layer 10 is constructed as a dense film layer. Specifically, as shown... Figure 4 As shown, Figure 4 This is a physical diagram of a heating element in one embodiment of this application. Wherein, Figure 5 It shows Figure 4 A magnified view of a section at point A in the middle, from Figure 5 As can be seen, the uppermost first heating layer 10 is constructed as a dense film layer. Thus, the first heating layer 10 can cover the second heating layer 20 and block one end of each of the first micropores 21 in the second heating layer 20.

[0072] Furthermore, Figure 6 It shows Figure 4 Cross-sectional view along the AA direction, as shown Figure 6 As shown, when a dense film layer covers the second heating layer 20, the interior of the second heating layer 20 remains porous and interconnected. Therefore, the liquid atomizing matrix enters the second heating layer 20 through the first micropore 21, resulting in a larger contact area between the liquid atomizing matrix and the second heating layer 20, i.e., a larger atomization surface. This allows for the generation of a larger amount of smoke and a more uniform atomization temperature field. Furthermore, the end of the first micropore 21 facing away from the porous substrate 40 is sealed by the first heating layer 10, preventing the liquid atomizing matrix within the first micropore 21 from bursting or collapsing on the surface of the second heating layer 20, effectively improving the user experience.

[0073] Please refer to Figure 2 In Embodiment 3 of this application, a plurality of first micropores 21 are formed through the second heating layer 20 along its own thickness direction, and the porosity is 30% to 70%. A plurality of second micropores 11 are formed through the first heating layer 10 along its own thickness direction, and each second micropore 11 is connected to at least a portion of the first micropores 21.

[0074] Furthermore, the second heating layer 20 is constructed as a metallic heating layer. Simultaneously, the first heating layer 10 is made of a metallic material such as a nickel alloy or a nickel-iron alloy, and each of the second micropores 11 on the first heating layer 10 is filled with a filler 30. Alumina may be added to the filler 30, and the volume percentage of alumina in the filler 30 is 10%-30%. Therefore, when the filler 30 fills each of the second micropores 11 on the first heating layer 10, it can effectively improve the heat dissipation effect of the first heating layer 10, making the atomized temperature field distribution more uniform and the atomization more complete.

[0075] In Embodiment 3, the filler 30 can be screen-printed onto the surface of the first heating layer 10 away from the second heating layer 20, and vacuum suction can be used to draw the filler 30 on the surface of the first heating layer 10 into the second micropore 11, thereby sealing the second micropore 11 and blocking the liquid atomized matrix in the first micropore 21 that is connected to the second micropore 11.

[0076] Specifically, when vacuum suction is applied to the filler 30, the depth of the filler 30 penetrating into the second micropore 11 can be controlled by adjusting the particle size of the filler 30 and the vacuum negative pressure, thereby adjusting the sealing degree of the filler 30 to the first heating layer 10 and achieving effective sealing of one end of the first micropore 21.

[0077] Please continue reading. Figure 2 In Embodiment 4 of this application, a plurality of first micropores 21 are formed through the second heating layer 20 along its own thickness direction, and the porosity is 30% to 70%. A plurality of second micropores 11 are formed through the first heating layer 10 along its own thickness direction, and each second micropore 11 is connected to at least a portion of the first micropores 21.

[0078] Furthermore, the second heating layer 20 is constructed as a metallic heating layer. Meanwhile, the first heating layer 10 is made of a metallic material such as a nickel alloy or a nickel-iron alloy, and each of the second micropores 11 on the first heating layer 10 is filled with a filler 30. The filler 30 may contain high-melting-point ceramic slurry such as silicon carbide or boron oxide.

[0079] In Embodiment 3, the filler 30 can be screen-printed onto the surface of the first heating layer 10 away from the second heating layer 20, and vacuum suction can be used to draw the filler 30 on the surface of the first heating layer 10 into the second micropore 11, thereby sealing the second micropore 11 and blocking the liquid atomized matrix in the first micropore 21 that is connected to the second micropore 11.

[0080] Specifically, when vacuum suction is applied to the filler 30, the depth of the filler 30 penetrating into the second micropore 11 can be controlled by adjusting the particle size of the filler 30 and the vacuum negative pressure, thereby adjusting the sealing degree of the filler 30 to the first heating layer 10 and achieving effective sealing of one end of the first micropore 21.

[0081] In embodiments three and four above, a plurality of second micropores 11 are formed through the first heating layer 10, and each second micropore 11 is sealed and filled with a filler 30. Specifically, as shown... Figure 7 As shown, Figure 7 This is a physical diagram of a heating element according to another embodiment of this application. Wherein, Figure 8 It shows Figure 7 A magnified view of a section at point B in the middle, from Figure 8 As can be seen, multiple second micropores 11 are formed through the first heating layer 10, and then each second micropore 11 is sealed and filled with filler 30. During the filling process, the sealing degree of filler 30 in each second micropore 11 can be controlled according to the required final porosity of the first heating layer 10. Compared with the porosity of the first heating layer 10 in Embodiments 1 and 2, the porosity of the first heating layer 10 in Embodiments 3 and 4 is larger, and the porosity is between 0% and 30%.

[0082] Therefore, as Figure 9 As shown, after the filler 30 is sealed and filled into each of the first micropores 11, the first heating layer 10 is placed over the second heating layer 20, so that the first heating layer 10 can block one end of each of the first micropores 21 in the second heating layer 20. At the same time, the interior of the second heating layer 20 also maintains a porous and interconnected state. The liquid atomizing matrix enters the second heating layer 20 from the first micropores 21, making the contact area between the liquid atomizing matrix and the second heating layer 20 larger, that is, the atomization surface larger, thereby generating a larger amount of smoke and making the atomization temperature field more uniform. The end of the first micropore 21 facing away from the porous substrate 40 is sealed by the first heating layer 10 and the filler 30 in each of the second micropores 11, preventing the liquid atomizing matrix in the first micropore 21 from bursting or collapsing on the surface of the second heating layer 20, effectively improving the user experience.

[0083] Based on the same concept as the heating element 100 described above, this application provides an atomizing core, including a porous substrate 40 and the heating element 100 as described above. The heating element 100 is stacked on at least one surface of the porous substrate 40. The porous substrate 40 can be at least one of porous ceramic, porous glass, porous metal, porous carbon material, or porous polymer material. In some specific embodiments, the porous substrate 40 can be a porous ceramic substrate.

[0084] Specifically, the side surface of the second heating layer 20 of the heating element 100 facing away from the first heating layer 10 is stacked on at least one surface of the porous substrate 40, so that the liquid atomizing matrix in the porous substrate 40 can enter the second heating layer 20 through each of the first micropores 21 in the second heating layer 20, thereby increasing the contact area between the liquid atomizing matrix and the second heating layer 20, that is, increasing the atomization surface and making atomization more complete.

[0085] Furthermore, the liquid atomizing matrix in the second heating layer 20 is blocked inside the heating element 100 by the first heating layer 10, which prevents the liquid atomizing matrix from forming splattering or bursting on the surface of the heating element 100, thereby effectively improving the performance of the atomizer.

[0086] Based on the same concept as the aforementioned atomizing core, this application provides an atomizer including the atomizing core described above.

[0087] Based on the same concept as the aforementioned atomizer, this application provides an electronic atomizing device, including a power supply assembly and the atomizer as described above. The power supply assembly is used to supply power to the atomizer.

[0088] In practical application, by stacking the first heating layer 10 on one side of the second heating layer 20, one end of the heating element 100 along its thickness direction is sealed, while the other end is open. When the open end of the heating element 100 is connected to the porous substrate 40, the liquid atomizing matrix permeates to the surface of the porous substrate 40, and part of the liquid atomizing matrix enters the heating element 100 through the pores in the second heating layer 20, and is blocked by the first heating layer 10 within the second heating layer 20.

[0089] This not only increases the contact area between the liquid atomizing matrix and the heating element 100, thus increasing the atomization surface, but also prevents the liquid atomizing matrix from splattering or collapsing on the surface of the heating element 100, thereby improving the user experience of the atomizer.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A heat generating element, characterized by, The heating element comprises a first heating layer and a second heating layer stacked together, the first heating layer has a porosity and a porosity density both of which are less than those of the second heating layer; the second heating layer has a plurality of first micropores penetrating through the second heating layer along a thickness direction of the second heating layer, and the second heating layer is a metal heating layer; the first heating layer has a plurality of second micropores penetrating through the first heating layer along a thickness direction of the first heating layer, and each of the second micropores is in communication with at least part of the first micropores; and the heating element comprises a filler, the filler being filled in each of the second micropores in communication with the first micropores.

2. A heat generating element according to claim 1, characterised in that The porosity of the first heating layer is 0-30%, and / or the porosity of the second heating layer is 30-70%.

3. A heat generating element according to any one of claims 1-2, c h a r a c t e r i z e d in that The material of the first heating layer comprises a metal material and / or a ceramic material.

4. The heat-generating element according to claim 1, characterized in that The first heating layer is a metal heating layer, and the material of the filler comprises a metal material and / or a ceramic material.

5. The heat-generating element according to claim 1, characterized in that The thermal conductivity of the filler is greater than or equal to 10 W / (m·K).

6. The heat-generating element according to claim 1, characterized in that The material of the filler comprises one or more of alumina, boron nitride, and silicon carbide.

7. An atomizing core characterized by, The heating element as claimed in any one of claims 1-6 is stacked on at least one surface of a porous substrate.

8. An atomiser characterised in that, The atomizing core as claimed in claim 7.

9. An electronic atomizing device, characterized by, The atomizer as claimed in claim 8 comprises a power supply assembly for supplying power to the atomizer.

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