A Simulation-Based Method for Calculating the Lifetime of Microelectronic Packaging Structures

Abstract

This application provides a simulation-based method for calculating the lifetime of microelectronic packaging structures. This method establishes a finite element model of the microelectronic packaging structure, simplifying the finite element mesh model as much as possible while ensuring computational accuracy. The failure model of the microelectronic structure is determined through simulation analysis. Output power spectral density data of nodes in the region of interest are batch-processed. Narrow-band and wide-band distribution methods in the frequency domain are used to analyze the lifetime of all solder joints, determining the applicability of the narrow-band and wide-band distribution methods and their relationship with solder joint locations. Finally, a simulation-based method for calculating the lifetime of microelectronic packaging structures under random vibration loads is formed. This allows for predictive analysis during the design phase or before random vibration fatigue testing, improving the efficiency and level of physical testing and supporting the development needs of aircraft electronic equipment.

Description

Technical Field

[0001] This application relates to the field of reliability technology of microelectronic packaging, specifically to a simulation-based method for calculating the lifetime of microelectronic packaging structures. Background Technology

[0002] As aircraft operate in increasingly harsh and extreme environments, and as electronic devices become smaller and more sophisticated, microelectronic packaging structure failures caused by random vibration loads have become one of the main causes of aircraft malfunctions.

[0003] In the development of electronic devices, virtual simulation analysis is typically conducted before testing to improve structural design and enhance the effectiveness of experimental verification, and to predict the fatigue life of the devices. However, the dimensions of various components in electronic devices vary significantly, and overly complex model meshes increase the difficulty of simulation. Furthermore, there is currently a lack of simulation-based methods for calculating the lifespan of microelectronic packaging structures under random vibration loads. Summary of the Invention

[0004] To address the aforementioned technical problems, this application proposes a simulation-based method for calculating the lifetime of microelectronic packaging structures. This method is used for locating vulnerable failure sites and predicting the lifetime of electronic devices. It involves a simplified finite element modeling method for microelectronic packaging models and a method for calculating the lifetime of microelectronic packaging structures under random vibration loads. This method can be used for research on environmental condition determination, structural strength assessment, and experimental prediction of electronic components inside aircraft, providing technical support for the testing and design of various packaging structures at different levels and of different types. The technical solution adopted in this application is as follows:

[0005] A simulation-based method for calculating the lifetime of microelectronic packaging structures, the testing method comprising:

[0006] Step 1: Establish a finite element model of the microelectronic packaging structure based on the experimental setup;

[0007] Step 2: Simplify the finite element model while ensuring calculation accuracy;

[0008] Step 3: Perform lifetime prediction analysis of the microelectronic packaging structure.

[0009] Furthermore, in step 1, the microelectronic packaging structure includes a printed circuit board, a packaging interconnect structure, and electronic components, wherein the packaging interconnect structure is composed of solder of single or multiple components.

[0010] Furthermore, in the test apparatus, by applying a random vibration load at the fixed support position and after a preset application time, the damage degree of the solder joints and the distribution of damaged solder joints are measured, and the relationship between the damage degree and the application time of the random vibration load is determined based on the damage degree and the distribution of damaged solder joints, so as to calculate the life of the microelectronic packaging structure under random vibration load.

[0011] Furthermore, the finite element model of the microelectronic packaging structure includes electronic components, packaging interconnect materials, and printed circuit boards.

[0012] Furthermore, in step 2, the simplified finite element model includes: taking into account both computational efficiency and accuracy, using shell elements with high computational efficiency for large component models relative to the weld point size; increasing the mesh size in areas far from the weld point and refining the mesh size in areas close to the weld point.

[0013] Furthermore, in step 3, the lifetime prediction analysis includes:

[0014] Step 301: Output the Rmises stress cloud diagram of each solder joint, determine the location of easily damaged solder joints, and obtain the damage failure mode of the microelectronic packaging structure.

[0015] Step 302: Conduct lifetime prediction analysis of microelectronic packaging structure based on amplitude distribution to obtain structural damage lifetime under random vibration load.

[0016] Furthermore, the output power spectral density data of the solder joints of interest are batch processed, and the lifetime analysis of all solder joints is performed using the frequency domain method.

[0017] Furthermore, solid element meshes are used for solder joints to reduce the number of solder joints, and the mesh is refined in the solder joint model of interest.

[0018] Furthermore, a transitional mesh is used between large and small parts.

[0019] Furthermore, the large-size component is more than ten times the size of the small-size component; the solder joint of concern is a solder joint that is easily damaged due to high stress and strain values.

[0020] The following technical effects can be achieved through the embodiments of this application: by simplifying the model mesh, the simulation accuracy is improved while ensuring simulation efficiency, and based on the simulation results, the lifetime of the packaging structure is predicted using the amplitude distribution method, and the prediction results are within a reasonable range. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a microelectronic packaging structure;

[0023] Figure 2 A schematic diagram of a finite element model for microelectronic packaging;

[0024] Figure 3 This is a schematic diagram of the power spectrum of random vibration load;

[0025] Figure 4 This is a finite element mesh model diagram of a BGA package structure.

[0026] Figure 5 The results show the predicted lifespan of the packaged structure under random vibration loads.

[0027] Figure 6 This is a flowchart illustrating the method for calculating the lifetime of microelectronic packaging structures. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] Figure 1 This is a schematic diagram of a microelectronic package. Figure 6 This is a flowchart illustrating a method for calculating the lifetime of microelectronic packaging structures. The method includes the following steps:

[0030] Step 1: Establish a finite element model of the microelectronic packaging structure based on the experimental setup;

[0031] The microelectronic packaging structure includes a printed circuit board, a packaging interconnect structure, and electronic components, wherein the packaging interconnect structure is composed of solder with single or multiple components.

[0032] In the test apparatus, random vibration load is applied at the fixed support position. After a preset application time, the damage degree of the solder joint and the distribution of damaged solder joints are measured. The relationship between the damage degree and the application time of the random vibration load is determined based on the damage degree and the distribution of damaged solder joints, so as to calculate the life of the microelectronic packaging structure under random vibration load.

[0033] Based on the above experimental setup, a finite element model of the microelectronic packaging structure is established, such as... Figure 2 As shown, the finite element model of the microelectronic packaging structure includes electronic components, packaging interconnect materials, and printed circuit boards;

[0034] Step 2: Simplify the finite element model while ensuring calculation accuracy;

[0035] In step 2, the simplified finite element model includes: comprehensively considering computational efficiency and accuracy, using shell elements with high computational efficiency for large component models (e.g., printed circuit boards, chips) relative to the solder joint size; increasing the mesh size in regions far from the solder joints and refining the mesh size in regions close to the solder joints; using solid element meshes for the solder joints to reduce the number of solder joints, and refining the mesh in the solder joint model of interest; using transition meshes for large and small components; the large component being more than ten times the size of the small component; the solder joint of interest being a fragile solder joint with high stress and strain values; and finally improving computational efficiency while ensuring computational accuracy.

[0036] Step 3: Perform lifetime prediction analysis of the microelectronic packaging structure;

[0037] In step 3, the lifetime prediction analysis includes:

[0038] Step 301: Output the Rmises stress cloud diagram of each solder joint, determine the location of easily damaged solder joints, and obtain the damage failure mode of the microelectronic packaging structure.

[0039] Step 302: Conduct lifetime prediction analysis of microelectronic packaging structure based on amplitude distribution to obtain structural damage lifetime under random vibration load.

[0040] The output power spectral density data of nodes in the region of interest are batch processed, and the lifetime analysis of all solder joints is performed using the frequency domain method.

[0041] This embodiment is a random vibration load test of a typical BGA packaged circuit board structure. The load is as follows: Figure 3 As shown. A finite element model of the BGA package structure is established, and the simulation mesh model of the microelectronic package is simplified as follows. Figure 4 As shown, Rmises stress was output for each solder joint, and the lifetime calculation results based on the wide and narrow band method are as follows. Figure 5As shown, the results are compared and verified with the three-interval method commonly used in packaging structures. The calculation results demonstrate that this method can achieve good predictive results for random vibration load tests on microelectronic packages.

[0042] In summary, this application establishes a finite element model of a microelectronic packaging structure, simplifying the finite element mesh model as much as possible while ensuring computational accuracy. The failure model of the microelectronic structure is determined through simulation analysis. Output power spectral density data of nodes in the region of interest are batch-processed, and narrowband and broadband distribution methods in the frequency domain are used to perform lifetime analysis on all solder joints. The applicability of the narrowband and broadband distribution methods and their relationship with solder joint locations are determined, ultimately forming a simulation-based method for calculating the lifetime of microelectronic packaging structures under random vibration loads. This allows for predictive analysis during the design phase or before random vibration fatigue testing, improving the efficiency and level of physical testing and supporting the development needs of aircraft electronic equipment.

[0043] While specific embodiments of this application have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this application is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this application, but all such changes and modifications fall within the scope of protection of this application.

Claims

1. A method for calculating the lifetime of a microelectronic package structure based on simulation modeling, characterized in that, The calculation method comprises: Step 1, establishing a finite element model of the microelectronic packaging structure based on a test device; Step 2, simplifying the finite element model under the premise of ensuring calculation accuracy; Step 3, performing life prediction analysis of the microelectronic packaging structure; In step 2, the simplified finite element model comprises: comprehensively considering calculation efficiency and accuracy, adopting a shell element with high calculation efficiency for a large component model relative to the size of the solder joint; increasing the grid size away from the solder joint area and densifying the grid size near the solder joint area; In step 3, the life prediction analysis comprises: Step 301, outputting a Rmises stress cloud map of each solder joint, determining the position of the vulnerable solder joint, and obtaining the damage failure mode of the microelectronic packaging structure; Step 302, based on the amplitude distribution, carrying out life prediction analysis of the microelectronic packaging structure under random vibration load, and obtaining the structural damage life under random vibration load; The microelectronic packaging structure comprises a printed circuit board, a packaging interconnection structure and electronic components, wherein the packaging interconnection structure is composed of single or multiple components of solder; In the test device, the relationship between the damage degree and the application time of the random vibration load is determined by measuring the damage degree of the solder joint and the distribution of the damaged solder joint after a predetermined application time of the random vibration load at the fixed position, so as to calculate the life of the microelectronic packaging structure under the random vibration load.

2. The method of claim 1, wherein, The finite element model of the microelectronic packaging structure comprises electronic components, packaging interconnection materials and a printed circuit board.

3. The method of claim 1, wherein, The method further comprises: batch processing the power spectral density data of the vulnerable solder joint with large stress and strain values, and performing life analysis on all solder joints by using a frequency domain method.

4. The method of claim 1, wherein, The method further comprises: using a solid element grid for the solder joint to reduce the number of solder joints, and densifying the grid of the vulnerable solder joint model with large stress and strain values.

5. The method according to one of claims 1 or 4, characterized in that, The method further comprises: using a transition grid between the large component model and the small component model relative to the size of the solder joint; wherein the size of the large component model is more than ten times the size of the small component model.

Images