Method of manufacturing a display panel and display panel

Abstract

The application provides a display panel manufacturing method and a display panel. The display panel manufacturing method comprises the following steps: providing at least two display devices, wherein the display device comprises a carrier substrate and a flexible display functional layer arranged on the carrier substrate; splicing the at least two display devices so that the carrier substrates in the display devices are connected and the flexible display functional layers are arranged on the same side, and a spliced body is obtained; forming a fixing layer on the side of the flexible display functional layer of the spliced body away from the carrier substrate; and peeling off the flexible display functional layer from the carrier substrate in the spliced body. The display panel manufacturing method provided by the application has higher splicing precision, is beneficial to reducing the splicing seam and realizes seamless splicing by splicing the at least two display devices in the case that the carrier substrate is rigid.

Description

Technical Field

[0001] This application relates to the field of displays, and more particularly to a method for manufacturing a display panel and a display panel. Background Technology

[0002] Currently, the realization of large-size sub-millimeter light-emitting diode (MiniLED) display panels mainly relies on the splicing of rigid MiniLED display panels. Since the splicing of rigid MiniLED display panels involves fixing the MiniLED display panels to a base plate, bending flexibility is not a concern, making the splicing process relatively simple. However, flexible displays are the future trend, and more and more applications require flexible displays. Currently, there is no good solution for splicing large-size flexible MiniLED display panels. The commonly used manufacturing method for flexible MiniLED display panels involves first peeling the flexible display functional layer of a single flexible MiniLED display panel from the carrier substrate, and then splicing multiple flexible MiniLED display panels together. Because the MiniLED display panels are already in a flexible state after being peeled from the carrier substrate, seamless splicing is difficult. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a method for manufacturing a display panel and a display panel that can improve the splicing effect.

[0004] This application provides a method for manufacturing a display panel, which includes the following steps:

[0005] At least two display devices are provided, wherein each display device includes a carrier substrate and a flexible display functional layer disposed on the carrier substrate;

[0006] The at least two display devices are spliced ​​together so that the carrier substrates in the display devices are connected and the flexible display functional layers are disposed on the same side, thereby obtaining a spliced ​​body;

[0007] A fixing layer is formed on the side of the flexible display functional layer of the splicing body away from the carrier substrate;

[0008] The flexible display functional layer in the splicing body is peeled off from the carrier substrate.

[0009] In one embodiment, the step of forming a fixing layer on the side of the flexible display functional layer of the splicing body away from the carrier substrate includes:

[0010] An adhesive layer is bonded to the side of the flexible display functional layer of the splicing body away from the carrier substrate to form the fixing layer.

[0011] In one embodiment, the adhesive layer is a rigid adhesive layer.

[0012] In one embodiment, the step of forming a fixing layer on the side of the flexible display functional layer of the splicing body away from the carrier substrate includes:

[0013] A support substrate is attached to the side of the flexible display functional layer of the splicing body away from the carrier substrate, and the support substrate and the flexible display functional layer are bonded together by an adhesive layer to form the fixing layer.

[0014] In one embodiment, the support substrate covers the splice body.

[0015] In one embodiment, the adhesive layer includes a protrusion that extends beyond the edges of the support substrate and the splice.

[0016] In one embodiment, after the step of peeling the flexible display functional layer in the splicing body from the carrier substrate, the method further includes:

[0017] A pulling force is applied to the protrusion to separate the adhesive layer from the flexible display functional layer and the supporting substrate, thereby separating the splicing body from the fixing layer.

[0018] In one embodiment, the adhesive layer material is viscous in a first direction and loses its viscousness when subjected to tensile force in a second direction perpendicular to the first direction. The first direction is the direction from the flexible display functional layer to the carrier substrate, and the second direction is the direction parallel to the plane of the carrier substrate.

[0019] In one embodiment, after the step of peeling the flexible display functional layer in the splicing body from the carrier substrate, the method further includes:

[0020] In the splicing body, the bonding layer on one side of the carrier substrate is peeled off to assemble the display device.

[0021] This application provides a display panel manufactured using the display panel manufacturing method described above. The manufacturing method of this application, by splicing at least two display devices on a rigid carrier substrate, achieves higher splicing precision, reduces seam gaps, and enables seamless splicing. Furthermore, the manufacturing process of the display panel of this application is simple, reducing costs. The display panel manufactured using the manufacturing method of this application can achieve seamless splicing. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a flowchart illustrating one embodiment of the manufacturing method of the display panel of this application.

[0024] Figure 2 This is a flowchart illustrating another embodiment of the manufacturing method of the display panel of this application.

[0025] Figures 3(a) to 3(h) This is a cross-sectional view of the steps in the manufacturing method of the display panel of this application.

[0026] Figures 4(a) to 4(c) This is a schematic diagram of the process of removing the fixed layer in Figure 3(g).

[0027] Figure 5 A schematic diagram of the display panel provided in this application.

[0028] Figure 6 for Figure 5 A cross-sectional schematic diagram of the display panel.

[0029] Explanation of reference numerals in the attached figures

[0030] 100: Display panel; 10: Display device; 20: Splicing body; 1: Carrier substrate; 2: Flexible display functional layer; 21: Flexible substrate; 22: Display functional layer; 23: Encapsulation layer; 4: Splicing layer; 31: Support substrate; 32: Adhesive layer; 3: Fixing layer. Detailed Implementation

[0031] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] The display panel of this application is composed of at least two flexible display panels spliced ​​together. The type of flexible display panel can be a micro light-emitting diode (Micro-LED) display panel or a mini light-emitting diode (Mini-LED) display panel.

[0033] Please refer to Figure 1 , Figure 1 This is a flowchart illustrating one embodiment of the manufacturing method of the display panel of this application.

[0034] The manufacturing method of the display panel includes the following steps:

[0035] 101: Provide at least two display devices, wherein the display devices include a carrier substrate and a flexible display functional layer disposed on the carrier substrate.

[0036] Specifically, the flexible display functional layer includes a flexible substrate, a display functional layer, and an encapsulation layer stacked sequentially. The carrier substrate is a rigid substrate used to support the flexible substrate, display functional layer, and encapsulation layer. The carrier substrate can be, for example, a glass substrate or a plastic substrate. The flexible substrate is made of a material selected from polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyarylate (PAR), polycarbonate (PC), polyetherimide (PEI), and polyethersulfone (PES). The display functional layer includes a driving circuit and a light-emitting chip. The light-emitting chip is electrically connected to the driving circuit. The driving circuit includes a driving device for driving the light-emitting chip to emit light, such as a thin-film transistor (TFT). The light-emitting chip can be a micro-light-emitting diode or a sub-millimeter light-emitting diode. The encapsulation layer is made of a light-transmitting material with good water and oxygen barrier properties.

[0037] 102: At least two display devices are spliced ​​together so that the carrier substrates in the display devices are connected and the flexible display functional layers are arranged on the same side, and a spliced ​​body is obtained.

[0038] At least two display devices can be spliced ​​together on a splicing platform. The specific number of display devices is determined by the size of the display panel to be manufactured. At least two display devices are arranged in a predetermined manner according to the shape of the display panel to be manufactured and spliced ​​together. The spliced ​​at least two display devices form a spliced ​​assembly. At least two display devices are spliced ​​together with a carrier substrate connected and disposed on the same layer, and with flexible display functional layers connected and disposed on the same layer. Specifically, at least two display devices are spliced ​​on the splicing platform with the carrier substrate of each display device located below the flexible display functional layer, to facilitate subsequent steps on the flexible device.

[0039] 103: A fixing layer is formed on the side of the flexible display functional layer of the splicing body away from the carrier substrate.

[0040] In step 103, the fixing layer is used to fix at least two display devices of the spliced ​​assembly to prevent relative movement of the at least two spliced ​​display devices during the transfer of the spliced ​​assembly, which would cause the splicing seam to widen. In some embodiments, the fixing layer covers the spliced ​​assembly to better fix the at least two display devices. More specifically, the area of ​​the fixing layer is larger than the area of ​​the spliced ​​assembly.

[0041] In one embodiment, step 103 may include: attaching an adhesive layer to the side of the flexible display functional layer of the splicing assembly away from the carrier substrate to form a fixing layer. That is, the fixing layer is an adhesive layer. Using the adhesive layer to bond and fix at least two display devices of the splicing assembly can prevent relative movement of the at least two display devices during the transfer of the splicing assembly, thus preventing the splicing seam from widening. The adhesive layer material can be optical adhesive or acrylic adhesive, etc. When the fixing layer is an adhesive layer, the adhesive layer covers the flexible display functional layer in the splicing assembly. It is understood that the fixing layer can also be other structures capable of fixing at least two display devices.

[0042] The adhesive layer can also be a rigid adhesive layer. It should be noted that, in this application, "rigid adhesive layer" refers to an adhesive layer that, under external force and visual observation, will not deform or bend, maintaining its original shape. After splicing, the spliced ​​body needs to be transferred to a laser stripping platform. During the transfer, the spliced ​​body is located on the splicing platform, and a suction cup or robotic arm picks up or grasps the spliced ​​body from above, lifting it upwards from the splicing platform, and then transferring or translating it to the laser stripping platform via a transfer mechanism. During this process, due to the gravity of the display devices, the splicing between the display devices in the spliced ​​body may loosen. In this embodiment, the display devices are fixed to the rigid adhesive layer, which provides a certain tensile force to the display devices to counteract their gravity. When moving the spliced ​​body vertically, due to the tensile force of the rigid adhesive layer, the display devices in the spliced ​​body will not move relative to each other due to gravity, preventing the seams of the spliced ​​body from widening during the transfer process.

[0043] The adhesive layer material can also be an adhesive that is tacky in a first direction but loses its tackiness when subjected to tensile force in a second direction perpendicular to the first direction. Specifically, the first direction is the direction from the flexible display functional layer to the carrier substrate, or the direction perpendicular to the plane containing the flexible display functional layer and the carrier substrate, i.e., the vertical direction. The second direction is the direction parallel to the plane containing the flexible display functional layer and the carrier substrate, i.e., the horizontal direction. Since the adhesive layer is in direct contact with the flexible display functional layer, it is desirable that the adhesive layer will not remain on the flexible display functional layer or damage it after subsequent removal. An adhesive layer with this property is easy to separate from the display device without residue and without damaging the surface of the flexible display functional layer. More specifically, the adhesive layer includes protrusions that extend beyond the edge of the splice, facilitating subsequent application of tensile force to remove the adhesive layer. The number of protrusions can be one or more. In other embodiments, the adhesive layer may include two oppositely arranged protrusions, facilitating subsequent application of tensile force from both sides to remove the adhesive layer. These protrusions can be located along the long side of the flexible display functional layer and protrude beyond the short side of the flexible display functional layer.

[0044] In another embodiment, step 103 may also include: attaching a support substrate to the side of the flexible display functional layer of the splicing assembly away from the carrier substrate, with the support substrates bonded to the flexible display functional layer via an adhesive layer to form a fixing layer. When a flexible adhesive layer is used, or when the rigidity of the adhesive layer is insufficient, a support substrate can be provided on the side of the adhesive layer away from the flexible display functional layer to provide tensile force to counteract the weight of the display devices and prevent loosening of the splicing between the display devices in the splicing assembly due to the weight of the display devices in the splicing assembly. Specifically, the support substrate can be a glass substrate. The adhesive layer is used to bond at least two display devices and the support substrate of the splicing assembly.

[0045] Both the top and bottom surfaces of the adhesive layer have release films. The release film on one surface of the adhesive layer can be peeled off, and the adhesive layer can be adhered to the support substrate using a roller or other bonding method. Then, the release film on the other surface of the adhesive layer can be peeled off, and the adhesive layer and support substrate can be adhered together onto the flexible display functional layer. Alternatively, the release film on one surface of the adhesive layer can be peeled off, the adhesive layer can be adhered to the flexible display functional layer, and then the release film on the other surface of the adhesive layer can be peeled off, allowing the support substrate to be adhered to the adhesive layer.

[0046] A support substrate can cover the splicing body. Specifically, the area of ​​the support substrate is greater than or equal to the area of ​​the splicing body, so that when the support substrate is attached to the splicing body, it can cover the splicing body and provide sufficient tensile force to resist its weight. Furthermore, the area of ​​the adhesive layer is greater than or equal to the area of ​​the support substrate, so that the adhesive layer can completely adhere to the support substrate and the splicing body. Alternatively, the adhesive layer covers the flexible display functional layer in the splicing body. The adhesive layer material can be optical adhesive or acrylic adhesive, etc. In this embodiment, the adhesive layer material is an adhesive that is tacky in a first direction but loses its tackyness when subjected to tensile force in a second direction perpendicular to the first direction. Specifically, the first direction is the direction from the flexible display functional layer to the carrier substrate, or the direction perpendicular to the plane where the flexible display functional layer and the carrier substrate are located, i.e., the vertical direction. The second direction is the direction parallel to the plane where the flexible display functional layer and the carrier substrate are located, i.e., the horizontal direction. Since the adhesive layer is in direct contact with the flexible display functional layer, it is desirable that after the adhesive layer is subsequently removed, it will not remain on the flexible display functional layer or damage it. This type of adhesive layer easily separates from the display device without leaving any residue and without damaging the surface of the flexible display functional layer. The adhesive layer also includes protrusions that extend beyond the edges of the supporting substrate and the splicing assembly, facilitating subsequent application of tension to remove the adhesive layer. The number of protrusions can be one or more. Alternatively, the adhesive layer can include two opposing protrusions, facilitating subsequent application of tension from both sides to remove the adhesive layer. These protrusions can be positioned along the long side of the flexible display functional layer, protruding beyond its short side.

[0047] 104: Separate the flexible display functional layer from the carrier substrate in the splicing body.

[0048] In step 104, the flexible display functional layer can be separated from the carrier substrate using a laser list off (LLO) method. Specifically, step 104 may include:

[0049] 1041: Laser scanning of the splicing body to separate the flexible display functional layer of the splicing body from the carrier substrate.

[0050] Laser lift-off is used to separate the flexible display functional layer from the carrier substrate. This allows the spliced ​​assembly to be transferred from the splicing platform to the laser lift-off platform. During the transfer, a fixing layer is formed on the side of the flexible display functional layer away from the carrier substrate, preventing relative movement between at least two spliced ​​display devices.

[0051] To prevent the laser beam from damaging the driving circuitry and other components of the flexible display's functional layer, the carrier substrate of the display device is placed face up on the laser scanning platform of the LLO (Light Array Locator) device, and the laser is scanned from the carrier substrate side towards the display device. The flexible substrate is formed by coating its surface with a polymer solution and then drying it into a film. The flexible substrate and the carrier substrate are connected by covalent bonds and van der Waals forces. When the laser is scanned from the carrier substrate side towards the display device, the interface between the carrier substrate and the flexible substrate absorbs the laser energy. The covalent bonds between the carrier substrate and the flexible substrate break, and the van der Waals forces are released.

[0052] 1042: Peel the flexible display functional layer of the splicing body from the carrier substrate.

[0053] After laser scanning, the spliced ​​assembly is transferred from the LLO device to the separation device. In the separation device, cutting tools are used to completely separate the carrier substrate from the flexible display functional layers, and the carrier substrate is removed. After separation, at least two flexible display functional layers in the spliced ​​assembly remain in their spliced ​​state because they are fixed by the fixing layer, preventing any change in their relative positions.

[0054] In one embodiment, after step 104, step 105 may be included: peeling off the bonding layer on one side of the carrier substrate in the splicing body to splice the display device.

[0055] Step 105 specifically includes: attaching a splicing layer to one side of the splice body where the flexible display functional layer of the carrier substrate has been peeled off, to splice at least two display devices. The function of the splicing layer is to completely splice at least two display devices to form a display panel.

[0056] The bonding layer can be made of adhesive. This adhesive can be optically clear adhesive (OCA) or acrylic adhesive, among other things. Additionally, the bonding layer can also serve as a protective film for the display device, protecting the flexible display's functional layers from scratches.

[0057] Corresponding to step 103, the following steps may be included after step 106:

[0058] 106: Remove the fixing layer.

[0059] In step 106, after at least two display devices of the spliced ​​assembly are joined together, the fixing layer needs to be removed. Specifically, the joined at least two display devices are transferred to the fixing layer removal platform with the fixing layer facing upwards, and then the fixing layer is removed. The fixing layer can be removed using physical or chemical methods.

[0060] In one embodiment, the fixing layer includes an adhesive layer. The adhesive layer is made of a material that is tacky in a first direction but loses its tackyness when subjected to tensile force in a second direction perpendicular to the first direction. The adhesive layer includes protrusions that extend beyond the edge of the splice. The splice and the fixing layer can be separated by applying tensile force to the protrusions to separate the adhesive layer from the flexible display functional layer.

[0061] Existing display devices are flexibly spliced ​​after the rigid carrier substrate is removed by laser peeling, making it difficult to achieve seamless splicing. The display panel manufacturing method of this application splices at least two display devices on a rigid carrier substrate, resulting in higher splicing precision, reducing seam width, and achieving seamless splicing. Furthermore, the manufacturing process of the display panel of this application is simple and can reduce costs.

[0062] The adhesive layer is used to bond at least two display devices and a supporting substrate to the splice.

[0063] Please refer to Figure 2 , Figure 2 This is a flowchart illustrating another embodiment of the manufacturing method of the display panel according to this application. The manufacturing method of the display panel includes the following steps:

[0064] 201: Provide at least two display devices, wherein the display devices include a carrier substrate and a flexible display functional layer disposed on the carrier substrate.

[0065] 202: At least two display devices are spliced ​​together so that the carrier substrates in the display devices are connected and the flexible display functional layers are arranged on the same side, and a spliced ​​body is obtained.

[0066] Steps 201 and 202 are the same as steps 101 and 102, and their descriptions are omitted.

[0067] 203: A support substrate is attached to the side of the flexible display functional layer of the splicing assembly away from the carrier substrate. The support substrates are bonded to each other and to the flexible display functional layer using an adhesive layer to form a fixing layer. The support substrates provide tensile strength to counteract the weight of the display devices, preventing loosening of the splicing between the display devices in the splicing assembly due to their gravity. The support substrate can be a glass substrate. The adhesive layer is used to bond at least two display devices and the support substrates of the splicing assembly.

[0068] The support substrate can cover the splicing body. Specifically, the area of ​​the support substrate is greater than or equal to the area of ​​the splicing body, so that when the support substrate is attached to the splicing body, it can cover the splicing body and provide sufficient tensile force to resist its weight. Furthermore, the area of ​​the adhesive layer is greater than or equal to the area of ​​the support substrate, so that the adhesive layer can completely adhere to the support substrate and the splicing body. The adhesive layer material can be optical adhesive or acrylic adhesive, etc. However, in this embodiment, the adhesive layer material is an adhesive that is tacky in a first direction but loses its tackiness when subjected to tensile force in a second direction perpendicular to the first direction. Specifically, the first direction is the direction from the flexible display functional layer to the carrier substrate, or the direction perpendicular to the plane containing the flexible display functional layer and the carrier substrate, i.e., the vertical direction. The second direction is the direction parallel to the plane containing the flexible display functional layer and the carrier substrate, i.e., the horizontal direction. Since the adhesive layer is in direct contact with the flexible display functional layer, it is desirable that after the adhesive layer is subsequently removed, it will not remain on the flexible display functional layer or damage it. The adhesive layer also includes protrusions that extend beyond the edges of the supporting substrate and the splice assembly, facilitating subsequent application of tension to remove the adhesive layer. There can be one or more protrusions. Alternatively, the adhesive layer may include two opposing protrusions, allowing for subsequent application of tension from both sides to remove the adhesive layer. The two opposing protrusions can be positioned along the long side of the flexible display functional layer.

[0069] 204: Peel the flexible display functional layer from the carrier substrate in the splicing body.

[0070] In step 204, a laser lift-off method can be used to peel the flexible display functional layer from the carrier substrate. Specifically, step 204 may include:

[0071] 2041: Laser scanning of the splicing body to separate the flexible display functional layer from the carrier substrate.

[0072] 2042: Peel the flexible display functional layer from the carrier substrate.

[0073] 205: The bonding layer on one side of the carrier substrate is peeled off in the splicing body to splice the display devices.

[0074] Step 205 specifically includes: attaching a splicing layer to one side of the splice body where the flexible display functional layers have been peeled off from the carrier substrate, to splice at least two flexible display functional layers. The function of the splicing layer is to completely splice at least two flexible display functional layers to form a display panel.

[0075] 206: Remove the fixing layer.

[0076] In step 206, after at least two flexible display functional layers of the spliced ​​assembly are joined, the fixing layer needs to be removed. Specifically, the joined flexible display functional layers are transferred to the fixing layer removal platform with the fixing layer facing upwards, and then the fixing layer is removed. The fixing layer can be removed using physical or chemical methods.

[0077] In one embodiment, the fixing layer includes an adhesive layer. The adhesive layer is made of a material that is tacky in a first direction but loses its tackyness when subjected to tensile force in a second direction perpendicular to the first direction. The adhesive layer includes protrusions that extend beyond the edge of the splice. The splice and the fixing layer can be separated by applying tensile force to the protrusions to separate the adhesive layer from the flexible display functional layer.

[0078] Next, refer to Figures 3(a) to 3(h) The present invention describes a method for manufacturing a display panel. Figures 3(a) to 3(h) This is a cross-sectional view of the steps in the manufacturing method of the display panel of this application.

[0079] The manufacturing method of the display panel includes the following steps:

[0080] (1) Referring to Figure 3(a), at least two display devices 10 are provided, and at least two display devices 10 are spliced ​​together to obtain a spliced ​​body 20, wherein the display device 10 includes a carrier substrate 1 and a flexible display functional layer 2, the flexible display functional layer 2 being disposed on the carrier substrate 1. It should be noted that the "flexible display functional layer" referred to in this application refers to a display functional layer made of soft material that can be deformed or bent under the condition observed by the naked eye.

[0081] Specifically, the flexible display functional layer 2 includes a flexible substrate 21, a display functional layer 22, and an encapsulation layer 23. The carrier substrate 1 is a rigid substrate used to support the flexible substrate 21, the display functional layer 22, and the encapsulation layer 23. The carrier substrate 1 can be, for example, a glass substrate or a plastic substrate. The material of the flexible substrate 21 is selected from polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyarylate (PAR), polycarbonate (PC), polyetherimide (PEI), and polyethersulfone (PES). The display functional layer 22 includes a driving circuit and a light-emitting chip. The light-emitting chip is electrically connected to the driving circuit. The driving circuit includes a driving device for driving the light-emitting chip to emit light, such as a thin-film transistor (TFT). The light-emitting chip can be a micro-light-emitting diode or a sub-millimeter light-emitting diode. The encapsulation layer 23 is made of a light-transmitting material with good water and oxygen barrier properties.

[0082] Referring to Figure 3(b), the splicing of two display devices can be performed on a splicing platform (not shown). The specific number of display devices 10 is determined by the size of the display panel 100 to be manufactured. At least two display devices 10 are arranged in a predetermined manner according to the shape of the display panel 100 to be manufactured, and spliced ​​together. The spliced ​​at least two display devices 10 form a splicing body 20.

[0083] (2) Referring to Figure 3(c), a support substrate 31 is attached to the side of the flexible display functional layer 2 of the splicing body 20 away from the carrier substrate 1. The support substrate 31 and the flexible display functional layer 2 are attached together by an adhesive layer 32 to form a fixing layer 3. More specifically, the adhesive layer 32 and the support substrate 31 are disposed on the encapsulation layer 23.

[0084] In some embodiments, the support substrate 31 is used to provide tensile force to counteract the gravity of the display devices 10, preventing loosening of the splicing between the display devices 10 in the splicing assembly 20 due to the gravity of the display devices 10 in the splicing assembly 20. The support substrate 31 can be a glass substrate. The adhesive layer 32 is used to bond at least two display devices 10 of the splicing assembly 20, as well as the splicing assembly 20 and the support substrate 31.

[0085] Both the upper and lower surfaces of the adhesive layer 32 have release films. The release film on one surface of the adhesive layer 32 can be peeled off, and the adhesive layer 32 can be adhered to the support substrate 31 using a roller or other bonding method. Then, the release film on the other surface of the adhesive layer 32 can be peeled off, and the adhesive layer 32 and the support substrate 31 can be adhered together to the flexible display functional layer 2. Alternatively, the release film on one surface of the adhesive layer 32 can be peeled off, the adhesive layer 32 can be adhered to the flexible display functional layer 2, and then the release film on the other surface of the adhesive layer 32 can be peeled off, and the support substrate 31 can be adhered to the adhesive layer 32.

[0086] In some embodiments, the support substrate 31 covers the splicing body 20. Specifically, the area of ​​the support substrate 31 is greater than or equal to the area of ​​the splicing body 20, so that when the support substrate 31 is attached to the splicing body 20, it can cover the splicing body 20 and provide sufficient tensile force to the splicing body 20 to resist its weight. Further, the area of ​​the adhesive layer 32 is greater than or equal to the area of ​​the support substrate 31, so that the adhesive layer 32 can completely adhere to the support substrate 31 and the splicing body 20. The material of the adhesive layer 32 can be optical adhesive or acrylic adhesive, etc. However, in this embodiment, the material of the adhesive layer 32 is an adhesive that is tacky in the first direction D1, but loses its tackiness when subjected to tensile force in the second direction D2 perpendicular to the first direction D1. Specifically, the first direction D1 is perpendicular to the display device 10 and the fixing layer 3, i.e., the vertical direction. The second direction D2 is parallel to the display device 10 and the fixing layer 3, i.e., the horizontal direction. Since the adhesive layer 32 is in direct contact with the display device 10, it is desirable that the adhesive layer 32 will not remain on the display device 10 after subsequent removal, nor will it damage the flexible display functional layer 2 of the display device 10. The adhesive layer 32 also includes protrusions 311, which protrude from the edges of the supporting substrate 31 and the splicing body 20, facilitating the subsequent application of pulling force to remove the adhesive layer 32. Optionally, the protrusions 311 may protrude from the short side of the flexible display functional layer 2. The number of protrusions 311 can be one or more. The adhesive layer 32 may also include two opposing protrusions 311, facilitating the subsequent application of pulling force from both sides to remove the adhesive layer 32.

[0087] (3) Peel the flexible display functional layer 2 of the splicing body 20 from the carrier substrate 1.

[0088] The flexible display functional layer 2 is peeled off from the carrier substrate 1 using a laser lift-off method. Please refer to [reference needed]. Figures 3(c) to 3(d) The splicing assembly 20 can be transferred from the splicing platform to the laser stripping platform. During the transfer, a fixing layer 3 is formed on the side of the flexible display functional layer 2 of the splicing assembly 20 away from the carrier substrate 1. This prevents relative movement of at least two spliced ​​display devices 10 during the transfer process.

[0089] To prevent the laser beam from damaging the driving circuitry of the display functional layer 22, the carrier substrate 1 of the display device 10 is placed upwards on the laser scanning platform of the LLO device, and the laser is scanned from the carrier substrate 1 side towards the display device 10. The flexible display functional layer 2 is formed by coating a polymer solution onto the surface of the carrier substrate 1 and drying it into a film. The flexible display functional layer 2 and the carrier substrate 1 are connected by covalent bonds and van der Waals forces. When the laser is scanned from the carrier substrate 1 side towards the display device 10, the interface between the carrier substrate 1 and the flexible substrate 21 of the flexible display functional layer 2 absorbs the laser energy. The covalent bonds between the carrier substrate 1 and the flexible substrate 21 of the flexible display functional layer 2 break, and the van der Waals forces are released. Please refer to [reference needed]. Figures 3(d) to 3(e) The laser-scanned splice 20 is transferred from the LLO device to the separation device. In the separation device, the carrier substrate 1 is completely separated from the flexible display functional layer 2 using cutting tools, and the carrier substrate 1 is removed.

[0090] In the prior art, after the flexible display functional layer 2 is peeled from the carrier substrate 1, the flexible substrate 21 is prone to curling, making alignment difficult in subsequent steps. Furthermore, it can easily damage the display device 10. In this embodiment, since the fixing layer 3 fixes the flexible display functional layer 2 from one side, the flexible substrate 21 of the flexible display functional layer 2 will not curl, keeping the entire splice 20 flat after the peeling step. This facilitates subsequent alignment and prevents damage to the display device 10.

[0091] (4) Please refer to Figures 3(e) to 3(f) At least two display devices of a splice body, from which the carrier substrate has been removed, are joined together to obtain a display panel.

[0092] A splicing layer 4 is attached to one side of the flexible display functional layer 2 of the splicing body 20 after the carrier substrate 1 has been peeled off, so as to splice at least two display devices 10. The function of the splicing layer 4 is to completely splice at least two display devices 10 to form a display panel 100.

[0093] The material of the splicing layer 4 can be an adhesive. The adhesive can be optically clear adhesive (OCA) or acrylic adhesive, etc. In addition, the splicing layer 4 can also serve as a protective film for the display device 10, protecting the flexible substrate 21 from scratches.

[0094] (5) Please refer to Figures 3(g) to 3(h) Remove the fixed layer 3.

[0095] After at least two display devices 10 of the splicing body 20 are spliced ​​together, the fixing layer 3 needs to be removed from the display device 10.

[0096] Specifically, at least two assembled display devices 10 are transferred to the fixing layer 3 removal platform with one side of the fixing layer 3 facing upwards, and then the fixing layer 3 is removed. The fixing layer 3 can be removed using physical methods or chemical methods.

[0097] Please refer to Figures 4(a) to 4(c) , Figures 4(a) to 4(c)This is a schematic diagram of the process of removing the fixing layer in Figure 3(g). In this embodiment, the adhesive layer 32 is made of an adhesive material that is tacky in the first direction D1 but loses its tackyness when subjected to tension in the second direction D2 perpendicular to the first direction D1. The adhesive layer 32 includes a protrusion 311. The protrusion 311 protrudes from the edge of the splice body 20. The splice body 20 and the fixing layer 3 can be separated by applying tension to the protrusion 311 to separate the adhesive layer 32 from the flexible substrate 21. When a tension is applied to the protrusion 311 in the second direction D2, the protrusion 311 loses its tackyness in the first direction D1 and separates from the flexible substrate 21 and the support substrate 31.

[0098] This application also provides a display panel. Please refer to... Figure 5 , Figure 5 A schematic diagram of the display panel provided in this application. Figure 6 for Figure 5 A cross-sectional schematic diagram of the display panel is shown. The display panel 100 is manufactured by the display panel manufacturing method described above. The display panel 100 includes a splicing layer 4, a flexible substrate 21, a display functional layer 22, and an encapsulation layer 23, which are stacked sequentially. For a detailed description of the splicing layer 4, the flexible substrate 21, the display functional layer 22, and the encapsulation layer 23, please refer to the above embodiments, and their descriptions are omitted here.

[0099] This application provides a method for manufacturing a display panel and a display panel itself. The method for manufacturing the display panel includes the following steps: providing at least two display devices, wherein each display device includes a carrier substrate and a flexible display functional layer disposed on the carrier substrate; splicing the at least two flexible display functional layers so that the carrier substrates in the flexible display functional layers are connected and the flexible display functional layers are disposed on the same side, thereby obtaining a spliced ​​body; forming a fixing layer on the side of the flexible display functional layer of the spliced ​​body away from the carrier substrate; and peeling the flexible display functional layer in the spliced ​​body from the carrier substrate. The method for manufacturing the display panel of this application achieves higher splicing accuracy by splicing at least two display devices on a rigid carrier substrate, which helps to reduce splicing seams and achieve seamless splicing. Furthermore, the manufacturing process of the method for manufacturing the display panel of this application is simple and can reduce costs. The display panel manufactured by the method of this application can achieve seamless splicing.

[0100] The foregoing has provided a detailed description of the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for manufacturing a display panel, characterized in that, Includes the following steps: At least two display devices are provided, wherein each display device includes a carrier substrate and a flexible display functional layer disposed on the carrier substrate; the flexible display functional layer includes a flexible substrate, a display functional layer and an encapsulation layer stacked sequentially, wherein the flexible substrate is disposed close to the carrier substrate; The at least two display devices are spliced ​​together so that the carrier substrates in the display devices are connected and the flexible display functional layers are disposed on the same side, thereby obtaining a spliced ​​body; A fixing layer is formed on the side of the flexible display functional layer of the splicing body away from the carrier substrate; The flexible display functional layer in the splicing body is peeled off from the carrier substrate using a laser peeling method.

2. The method for manufacturing a display panel as described in claim 1, characterized in that, The step of forming a fixing layer on the side of the flexible display functional layer of the splice body away from the carrier substrate includes: An adhesive layer is bonded to the side of the flexible display functional layer of the splicing body away from the carrier substrate to form the fixing layer.

3. The method for manufacturing a display panel as described in claim 2, characterized in that, The adhesive layer is a rigid adhesive layer.

4. The method for manufacturing a display panel as described in claim 1, characterized in that, The step of forming a fixing layer on the side of the flexible display functional layer of the splice body away from the carrier substrate includes: A support substrate is attached to the side of the flexible display functional layer of the splicing body away from the carrier substrate, and the support substrate and the flexible display functional layer are bonded together by an adhesive layer to form the fixing layer.

5. The method for manufacturing a display panel as described in claim 4, characterized in that, The supporting substrate covers the splicing body.

6. The method for manufacturing a display panel as described in claim 5, characterized in that, The adhesive layer includes a protrusion that extends beyond the edges of the supporting substrate and the splice.

7. The method for manufacturing a display panel as described in claim 6, characterized in that, After the step of peeling the flexible display functional layer from the carrier substrate in the splicing body, the method further includes: A pulling force is applied to the protrusion to separate the adhesive layer from the flexible display functional layer and the supporting substrate, thereby separating the splicing body from the fixing layer.

8. The method for manufacturing a display panel as described in claim 7, characterized in that, The adhesive layer material is viscous in a first direction and loses its viscousness when subjected to tensile force in a second direction perpendicular to the first direction. The first direction is the direction from the flexible display functional layer to the carrier substrate, and the second direction is the direction parallel to the plane of the carrier substrate.

9. The method for manufacturing a display panel as described in claim 1, characterized in that, After the step of peeling the flexible display functional layer from the carrier substrate in the splicing body, the method further includes: In the splicing body, the bonding layer on one side of the carrier substrate is peeled off to assemble the display device.

10. A display panel, characterized in that, The display panel is manufactured using the manufacturing method of the display panel as described in any one of claims 1 to 9.

Images