Electronic package and method of making the same

Abstract

The present invention relates to an electronic package and its manufacturing method, comprising embedding a first electronic component in a package layer, wherein the first electronic component has opposite active and non-active surfaces, and at least one recess is formed on the non-active surface to extend and communicate with the side surface of the package layer, so that the recess is exposed to the package layer as an air passage, and a metal layer is formed on the non-active surface of the first electronic component to guide the heat generated by the first electronic component during operation into the air passage.

Description

TECHNICAL FIELD

[0001] The present invention relates to a semiconductor packaging process, and more particularly to an electronic package with heat dissipation mechanism and the manufacturing method thereof. BACKGROUND

[0002] With the rapid development of portable electronic products in recent years, the development of various related products is also towards high density, high performance and light, thin, short, small trend. For this reason, the industry has developed various integrated multi-functional packaging styles in order to meet the requirements of light, thin, short and small and high density of electronic products. For example, wireless communication technology has been widely used in various consumer electronic products to facilitate the reception or transmission of various wireless signals. Among them, the patch antenna is widely used in the wireless communication module of electronic products such as cell phones and personal digital assistants (PDA) due to its small size, light weight and easy manufacturing.

[0003] Figure 1 A cross-sectional view of a conventional electronic device 1 is shown. The electronic device 1 includes a circuit structure 10 with a plurality of solder balls 13, a plurality of semiconductor chips 11, 12 disposed on the circuit structure 10 and electrically connected to the circuit structure 10, a packaging layer 16 covering the semiconductor chips 11, 12, and an antenna structure 17 disposed on the outer surface of the packaging layer 16, so that the antenna structure is combined with the packaging layer 16 through the dielectric layer 14, and the circuit structure 10 is mounted on a circuit board (not shown) through the solder balls 13.

[0004] However, in the conventional electronic device 1, the heat generated by the semiconductor chips 11, 12 during operation needs to be conducted to the external environment through the packaging layer 16 (or through the dielectric layer 14 of the circuit structure 10 and the antenna structure 17 to the external environment), so it is easy to accumulate heat and cannot meet the heat dissipation requirement.

[0005] Therefore, how to overcome the above problems of the prior art has become a urgent problem to be solved. SUMMARY

[0006] In view of the various defects of the prior art, the present invention provides an electronic package and a manufacturing method thereof to meet the heat dissipation requirement.

[0007] The electronic package of the present invention includes: a package layer; a first electronic component embedded in the package layer, wherein the first electronic component has an opposing active surface and a non-active surface, and at least one groove is formed on the non-active surface such that the groove extends to communicate with the side surface of the package layer, and the groove is exposed in the package layer to serve as an air channel; and a metal layer disposed on the non-active surface of the first electronic component.

[0008] The present invention also provides a method for manufacturing an electronic package, comprising: covering a first electronic component with a package layer, wherein the first electronic component is embedded in the package layer, wherein the first electronic component has an opposing active surface and a non-active surface, and at least one groove is formed on the non-active surface, such that the groove extends to communicate with the side of the package layer, and the groove is exposed in the package layer to serve as an air channel; and forming a metal layer on the non-active surface of the first electronic component.

[0009] In the aforementioned electronic package and its manufacturing method, the metal layer extends along the wall of the groove.

[0010] In the aforementioned electronic package and its manufacturing method, a second electronic component is stacked on the functional surface of the first electronic component.

[0011] The aforementioned electronic package and its manufacturing method further include forming a plurality of conductive elements in the package layer, such that the plurality of conductive elements are exposed in the package layer. For example, it further includes placing the plurality of conductive elements on a circuit board, such that the air channel is located between the circuit board and the non-functional surface of the first electronic component.

[0012] In the aforementioned electronic package and its manufacturing method, thermal conductive elements are partially or completely arranged in the groove.

[0013] In the aforementioned electronic package and its manufacturing method, at least one heat dissipation layer covering the groove is formed on the non-functional surface.

[0014] As can be seen from the above, in the electronic package and manufacturing method of the present invention, the design of forming at least one groove on the non-functional surface of the first electronic component is mainly used to directly introduce the heat generated by the first electronic component into the air channel. Therefore, compared with the prior art, the heat generated by the first electronic component during operation does not need to pass through the packaging layer and can be conducted to the external environment, so there will be no heat accumulation problem, thus meeting the heat dissipation requirements. Attached Figure Description

[0015] Figure 1 This is a cross-sectional schematic diagram of an existing electronic device.

[0016] Figures 2A-2F This is a cross-sectional schematic diagram illustrating the manufacturing method of the electronic package of the present invention.

[0017] Figure 2E-1 For the corresponding Figure 2E A schematic diagram of its cross-section.

[0018] Figure 3A and Figure 3B For the corresponding Figure 2F Cross-sectional schematic diagrams of other different embodiments.

[0019] Explanation of reference numerals in the attached figures

[0020] 1: Electronic devices

[0021] 10: Circuit Structure

[0022] 11,12: Semiconductor chips

[0023] 13: Welding ball

[0024] 14: Dielectric layer

[0025] 16, 26: Encapsulation layer

[0026] 17,27: Antenna Structure

[0027] 2,3,4: Electronic packages

[0028] 20: Load-bearing structure

[0029] 20a: First side

[0030] 20b: Second side

[0031] 200: Line Layer

[0032] 21: First electronic component

[0033] 21a: Surface of Action

[0034] 21b: Non-acting surface

[0035] 210: Conductive bump

[0036] 211: Base Rubber

[0037] 212: Electrode pad

[0038] 22: Second electronic component

[0039] 23: Conductive elements

[0040] 25: Metal layer

[0041] 250: Groove

[0042] 26a: Surface

[0043] 26c: Side view

[0044] 260: Perforation

[0045] 35: Thermal conductive element

[0046] 45: Heat dissipation layer

[0047] 8: Circuit board

[0048] S: Air passage. Detailed Implementation

[0049] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0050] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the invention, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

[0051] Figures 2A-2F The figure is a cross-sectional schematic diagram of the manufacturing method of the electronic package 2 of the present invention.

[0052] like Figure 2A As shown, a packaged module is provided, which includes a carrier structure 20, a second electronic component 22 embedded in the carrier structure 20, and an antenna structure 27 disposed on the carrier structure 20.

[0053] The carrier structure 20 is, for example, a package substrate with a core layer and a circuit structure or a coreless circuit structure, which forms multiple circuit layers 200 on an insulating material, such as a fan-out redistribution layer (RDL).

[0054] In this embodiment, the bearing structure 20 has a first side 20a and a second side 20b, and the material forming the circuit layer 200 is copper, while the insulating material is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or a solder resist such as green paint or ink.

[0055] The second electronic component 22 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.

[0056] In this embodiment, the second electronic component 22 is a semiconductor chip, which can be electrically connected to the circuit layer 200 via flip-chip bonding, wire bonding, direct contact with the circuit layer 200, or other suitable methods, without any particular limitation.

[0057] The antenna structure 27 is attached to the second side 20b of the supporting structure 20.

[0058] In this embodiment, the thin antenna structure 27 is fabricated using methods such as sputtering, vaporizing, electroplating, electroless electroplating, chemical plating, or foaming. For example, the antenna structure 27 can be fabricated by first forming a patterned groove on the carrier structure 20, and then forming a conductive material in the groove to serve as the antenna structure 27; or, the antenna structure 27 can be fabricated by directly forming a patterned conductive material on the carrier structure 20 (without first forming the groove) to serve as the antenna structure 27.

[0059] like Figure 2B As shown, a first electronic component 21 is disposed on the first side 20a of the support structure 20, and the first electronic component 21 is electrically connected to the circuit layer 200.

[0060] In this embodiment, the first electronic component 21 is an active component, a passive component, or a combination of both. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, capacitor, or inductor. For example, the first electronic component 21 has opposing active surfaces 21a and non-active surfaces 21b. The first electronic component 21 can be electrically connected to the circuit layer 200 via multiple conductive bumps 210 made of solder material, using a flip-chip method, with the electrode pads 212 of its active surface 21a covered by a primer 211. Alternatively, the electrode pads 212 of the first electronic component 21 can be electrically connected to the circuit layer 200 via multiple bonding wires (not shown). Or, the electrode pads 212 of the first electronic component 21 can be directly electrically connected to the circuit layer 200. However, the method by which the first electronic component 21 is electrically connected to the carrier structure 20 is not limited to the above.

[0061] like Figure 2C As shown, an encapsulation layer 26 is formed on the first side 20a of the carrier structure 20 to cover the first electronic component 21. Then, a plurality of through holes 260 are formed in the encapsulation layer 26 to expose a portion of the surface of the circuit layer 200 to the through holes 260.

[0062] In this embodiment, the encapsulation layer 26 is an insulating material, such as polyimide (PI), dry film, encapsulation colloid or molding compound such as epoxy resin, but is not limited to the above.

[0063] Furthermore, a leveling process can be used to make the surface 26a of the encapsulation layer 26 flush with the non-functional surface 21b of the first electronic component 21, so that the non-functional surface 21b of the first electronic component 21 is exposed on the surface 26a of the encapsulation layer 26. For example, the leveling process removes part of the material of the first electronic component 21 and part of the material of the encapsulation layer 26 by grinding.

[0064] like Figure 2D As shown, conductive elements 23 are formed in the through holes 260 so that the conductive elements 23 are electrically connected to the circuit layer 200.

[0065] In this embodiment, the conductive element 23 is spherical, such as a solder ball, or columnar, such as a copper pillar, solder bump, or stud conductor made by a wire bonding machine, but is not limited to these. For example, the conductive element 23 protrudes from the surface 26a of the encapsulation layer 26, so that multiple conductive elements 23 are exposed on the surface 26a of the encapsulation layer 26.

[0066] like Figure 2E As shown, at least one groove 250 is formed on the non-functional surface 21b of the first electronic component 21, and a metal layer 25 is formed on the non-functional surface 21b. The metal layer 25 extends along the wall of the groove 250, thereby forming an air channel S on the non-functional surface 21b of the first electronic component 21, and thus forming the electronic package 2 of the present invention.

[0067] In this embodiment, the non-functional surface 21b of the first electronic component 21 and a portion of the material of the encapsulation layer 26 are removed together by etching, such as... Figure 2E-1 The cross-sectional view shown illustrates the formation of multiple grooves 250 connecting opposite sides 26c of the encapsulation layer 26, allowing the air channel S to be used for heat dissipation. It should be noted that the metal layer 25 does not completely fill the grooves 250.

[0068] Furthermore, the metal layer 25 is formed on the non-functional surface 21b of the electronic component 21 and the wall surface of the groove 250 by electroplating, sputtering or other coating methods.

[0069] In subsequent processes, such as Figure 2F As shown, the electronic package 2 is attached to a circuit board 8 with the conductive elements 23, and the metal layer 25 is in contact with the circuit board 8.

[0070] Therefore, the manufacturing method of the present invention forms at least one groove 250 on the non-functional surface 21b of the first electronic component 21 to directly introduce the heat generated by the first electronic component 21 into the air channel S formed by the groove 250. Thus, when the electronic package 2 is placed on the circuit board 8, the heat generated by the first electronic component 21 during operation does not need to pass through the package layer 26 and can be conducted to the external environment through the air channel S (in other words, the first electronic component 21 and the circuit board 8 can dissipate heat through the air channel S), so there is no heat accumulation problem, thus meeting the heat dissipation requirements and greatly improving the heat dissipation efficiency.

[0071] In addition, such as Figure 3A In another embodiment of the present invention, the electronic package 3 may have at least one thermally conductive element 35, such as a copper pillar, formed partially or entirely in the recess 250. This thermally conductive element 35 contacts and bonds to the metal layer 25, but the air channel S is still formed so that when the electronic package 3 is placed on the circuit board 8, the thermally conductive element 35 contacts the circuit board 8 to facilitate heat dissipation. Further, as... Figure 3B The electronic package 4 of another embodiment of the present invention shown can form a heat dissipation layer 45 on the metal layer 25 on the non-functional surface 21b of the first electronic component 21 and on the heat-conducting element 35, so that the heat dissipation layer 45 covers the groove 250, but still forms the air channel S, so that when the electronic package 4 is placed on the circuit board 8, the heat dissipation layer 45 contacts the circuit board 8 to facilitate heat dissipation.

[0072] The present invention also provides an electronic package 2,3,4, which includes: a package layer 26, a first electronic component 21 and a metal layer 25.

[0073] The first electronic component 21 is embedded in the encapsulation layer 26. The first electronic component 21 has an opposing active surface 21a and a non-active surface 21b. At least one groove 250 is formed on the non-active surface 21b so that the groove 250 extends and connects to the side surface 26c of the encapsulation layer 26, so that the groove 250 is exposed in the encapsulation layer 26 and serves as an air channel S.

[0074] The metal layer 25 is disposed on the non-functional surface 21b of the first electronic component 21.

[0075] In one embodiment, the metal layer 25 extends along the wall of the groove 250.

[0076] In one embodiment, a second electronic component 22 is stacked on the working surface 21a of the first electronic component 21.

[0077] In one embodiment, the electronic package 2, 3, 4 further includes a plurality of conductive elements 23 embedded in the package layer 26, and the plurality of conductive elements 23 are exposed outside the package layer 26. For example, the plurality of conductive elements 23 are mounted on the circuit board 8 so that the air channel S is located between the circuit board 8 and the non-functional surface 21b of the first electronic component 21.

[0078] In one embodiment, a plurality of heat-conducting elements 35 are provided in part or all of the groove 250.

[0079] In one embodiment, at least one heat dissipation layer 45 covering the groove 250 is formed on the non-functional surface 21b.

[0080] In summary, the electronic package and its manufacturing method of the present invention, by forming a groove on the non-functional surface of the first electronic component, directly introduces the heat generated by the first electronic component into the air channel. Therefore, the heat generated by the first electronic component during operation does not need to pass through the packaging layer and can be conducted to the external environment, thus avoiding heat accumulation problems and meeting the heat dissipation requirements.

[0081] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the claims.

Claims

1. An electronic package, characterized in that, include: Encapsulation layer; A first electronic component is embedded in the encapsulation layer, wherein the first electronic component has an opposing active surface and a non-active surface, and at least one groove is formed on the non-active surface, such that the groove extends to communicate with the side of the encapsulation layer, and the groove is exposed in the encapsulation layer to serve as an air channel. A metal layer disposed on the non-functional surface of the first electronic component; and Multiple conductive components are embedded in and exposed in the encapsulation layer for placement on a circuit board, with the air channel located between the circuit board and the non-functional surface of the first electronic component.

2. The electronic package as described in claim 1, characterized in that, The metal layer extends along the wall of the groove.

3. The electronic package as described in claim 1, characterized in that, The second electronic component is stacked on the working surface of the first electronic component.

4. The electronic package as described in claim 1, characterized in that, The groove is partially or entirely equipped with heat-conducting elements.

5. The electronic package as described in claim 1, characterized in that, At least one heat dissipation layer is formed on the non-functional surface to cover the groove.

6. A method for manufacturing an electronic package, characterized in that, include: The first electronic component is encapsulated in the encapsulation layer, wherein the first electronic component has a working surface and a non-working surface, and at least one groove is formed on the non-working surface, such that the groove extends to communicate with the side of the encapsulation layer, and the groove is exposed in the encapsulation layer to serve as an air channel. A metal layer is formed on the non-functional surface of the first electronic component; A plurality of conductive elements are formed in the encapsulation layer, and the plurality of conductive elements are exposed outside the encapsulation layer; and The multiple conductive components are connected to the circuit board so that the air channel is located between the circuit board and the non-functional surface of the first electronic component.

7. The method for manufacturing an electronic package as described in claim 6, characterized in that, The metal layer extends along the wall of the groove.

8. The method for manufacturing an electronic package as described in claim 6, characterized in that, The second electronic component is stacked on the working surface of the first electronic component.

9. The method for manufacturing an electronic package as described in claim 6, characterized in that, The groove is partially or entirely equipped with heat-conducting elements.

10. The method for manufacturing an electronic package as described in claim 6, characterized in that, The manufacturing method also includes forming at least one heat dissipation layer on the non-functional surface to cover the groove.

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