substrate and light-emitting panel

Abstract

This invention provides a substrate and a light-emitting plate. The substrate includes a driving functional layer, an insulating layer, and a reflective layer sequentially disposed on a substrate. The driving functional layer includes conductive pads, and the insulating layer has openings exposing the conductive pads. In a direction perpendicular to the substrate, the height of the insulating layer around the openings is greater than the height of the reflective layer, and the insulating layer around the openings protrudes from the surface of the reflective layer. The protruding insulating layer can prevent the reflective layer from flowing towards the opening side, thereby solving the problem of white ink overflow causing abnormal soldering when preparing the white ink reflective layer using inkjet printing.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically to a substrate and a light-emitting plate. Background Technology

[0002] In the manufacturing process of Mini-LED or Micro-LED substrates, a white solder mask layer typically needs to be formed on the substrate. This white solder mask process generally employs either screen printing or inkjet printing. Screen printing offers higher precision, but it involves direct contact with the substrate, easily scratching it and causing short circuits in the metal layer. Inkjet printing avoids direct contact with the substrate, effectively preventing scratches, but its printing precision is difficult to guarantee. White solder mask overflow can easily occur in the pads where the LEDs are bonded, causing oxidation and discoloration of the pads, leading to abnormal soldering and preventing the LEDs from being properly assembled.

[0003] Therefore, it is necessary to provide a technical solution to solve the above problems. Summary of the Invention

[0004] This invention provides a substrate and a light-emitting plate to solve the problem that white oil easily overflows into the pad area when the white oil reflective layer is prepared by inkjet printing process on existing LED substrates.

[0005] To solve the above problems, the technical solution provided by the present invention is as follows:

[0006] This invention provides a substrate comprising:

[0007] Base;

[0008] A driving functional layer is located on one side of the substrate, and the driving functional layer includes a conductive pad;

[0009] An insulating layer is disposed on the side of the driving function layer away from the substrate, and the insulating layer has an opening that exposes the conductive pad;

[0010] A reflective layer is disposed on the side of the insulating layer away from the substrate;

[0011] In the direction perpendicular to the substrate, the height of the insulating layer around the opening is greater than the height of the reflective layer, and the insulating layer around the opening protrudes from the surface of the reflective layer.

[0012] Optionally, in some embodiments of the present invention, the substrate includes a barrier portion disposed toward the driving functional layer, the barrier portion corresponding to the opening, the driving functional layer including a first sub-barrier portion corresponding to the barrier portion, the insulating layer including a second sub-barrier portion corresponding to the first sub-barrier portion, and the reflective layer located on the side of the second sub-barrier portion away from the opening.

[0013] Optionally, in some embodiments of the present invention, the barrier portion includes a boss, the orthographic projection of the first sub-barrier portion on the substrate covers the orthographic projection of the boss on the substrate, and the orthographic projection of the opening on the substrate falls within the range of the orthographic projection of the boss on the substrate;

[0014] The portion of the driving function layer corresponding to the boss protrudes in a direction away from the substrate to form the first sub-barrier portion, and the portion of the insulating layer corresponding to the first sub-barrier portion protrudes in a direction away from the substrate to form the second sub-barrier portion. The orthographic projection of the second sub-barrier portion on the substrate overlaps with the orthographic projection of the first sub-barrier portion on the substrate.

[0015] Optionally, in some embodiments of the present invention, the thickness of the boss is 1 micrometer to 20 micrometers, and the thickness of the first sub-barrier portion is greater than or equal to the thickness of the boss.

[0016] Optionally, in some embodiments of the present invention, the barrier portion further includes a groove, the groove being located around the protrusion, the driving function layer further includes a third sub-barrier portion located around the first sub-barrier portion, the insulating layer further includes a fourth sub-barrier portion corresponding to the third sub-barrier portion, the fourth sub-barrier portion being located around the second sub-barrier portion, and the edge portion of the reflective layer being located in the fourth sub-barrier portion;

[0017] The portion of the driving function layer corresponding to the groove is recessed towards the substrate to form a third sub-barrier portion, and the portion of the insulating layer corresponding to the third sub-barrier portion is recessed towards the substrate to form a fourth sub-barrier portion. The orthographic projection of the fourth sub-barrier portion on the substrate overlaps with the orthographic projection of the third sub-barrier portion on the substrate.

[0018] The third sub-barrier portion is adjacent to the first sub-barrier portion, and the fourth sub-barrier portion is adjacent to the second sub-barrier portion.

[0019] Optionally, in some embodiments of the present invention, the driving functional layer further includes a thin-film transistor, the orthographic projection of the thin-film transistor on the substrate overlapping the boss, the conductive pad being located on the side of the thin-film transistor away from the substrate, and the conductive pad being electrically connected to the thin-film transistor through a via.

[0020] Optionally, in some embodiments of the present invention, the driving functional layer further includes a thin-film transistor, the thin-film transistor including a source and a drain, and the orthographic projection of the thin-film transistor on the substrate is spaced apart from the boss;

[0021] The conductive pad is disposed in the same layer as the source and the drain, and the conductive pad is electrically connected to the source or the drain.

[0022] Optionally, in some embodiments of the present invention, the portion of the insulating layer adjacent to the second sub-barrier portion has a height difference with the second sub-barrier portion, and the height difference is greater than or equal to the thickness of the reflective layer.

[0023] Optionally, in some embodiments of the present invention, the second sub-barrier portion extends along the side of the first sub-barrier portion to the side of the first sub-barrier portion facing away from the substrate.

[0024] This invention also provides a light-emitting plate, including a substrate and an LED chip as described above, wherein the LED chip is disposed on the substrate.

[0025] The beneficial effects of the present invention are as follows: The substrate and light-emitting board provided by the present invention include a stacked driving functional layer, an insulating layer and a reflective layer. The driving functional layer includes a conductive pad. The insulating layer has an opening that exposes the conductive pad. By setting the height of the insulating layer around the opening to be greater than the height of the reflective layer, and the insulating layer around the opening protruding from the surface of the reflective layer, after the reflective layer is prepared, the protruding insulating layer can prevent the reflective layer from flowing to the opening side, thereby solving the problem that the white oil is prone to overflow and causes abnormal soldering when the white oil reflective layer is prepared by inkjet printing process. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a cross-sectional schematic diagram of the substrate provided in Embodiment 1 of the present invention;

[0028] Figure 2 This is a cross-sectional schematic diagram of the substrate provided in Embodiment 2 of the present invention;

[0029] Figure 3 This is a schematic diagram of the boss and groove structure of the substrate provided in Embodiment 2 of the present invention;

[0030] Figure 4 This is a cross-sectional schematic diagram of a substrate provided in Embodiment 1 of the present invention;

[0031] Figure 5 This is a cross-sectional schematic diagram of another substrate provided in Embodiment 1 of the present invention. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present invention and are not intended to limit the present invention. In the present invention, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0033] Please see Figures 1-5 This invention provides a substrate 1, which can be applied to Mini LED, Micro LED, or other LED display panels. The substrate 1 includes a base 100, a driving functional layer 200, an insulating layer 300, and a reflective layer 400. The driving functional layer 200 is located on the base 100, the insulating layer 300 is located on the driving functional layer 200, and the reflective layer 400 is located on the insulating layer 300.

[0034] The driving functional layer 200 includes a conductive pad 203, and the insulating layer 300 has an opening 301 exposing the conductive pad 203. Specifically, in a direction perpendicular to the substrate 1, the height of the insulating layer 300 around the opening 301 is greater than the height of the reflective layer 400, and the insulating layer 300 around the opening 301 protrudes beyond the surface of the reflective layer 400. After the reflective layer 400 is fabricated, because the insulating layer 300 around the opening 301 protrudes or is higher than the surface of the reflective layer 400, it can prevent the reflective layer 400 from flowing towards the opening 301, thereby solving the problem of white ink overflow leading to abnormal soldering when fabricating a white ink reflective layer using a spray printing process.

[0035] Furthermore, in some embodiments, the substrate 1 further includes a barrier portion 2 located on the substrate 100 and disposed toward the driving functional layer 200, and the barrier portion 2 is disposed corresponding to the opening 301.

[0036] The driving function layer 200 includes a first sub-barrier portion 210 corresponding to the barrier portion 2, the insulating layer 300 includes a second sub-barrier portion 310 corresponding to the first sub-barrier portion 210, and the reflective layer 400 is located on the side of the second sub-barrier portion 310 away from the opening 301.

[0037] Specifically, the second sub-barrier portion 310 is the portion of the insulating layer 300 located on the first sub-barrier portion 210, and the second sub-barrier portion 310 has a ring-shaped structure. The orthographic projection of the second sub-barrier portion 310 on the substrate 100 overlaps with the orthographic projection of the first sub-barrier portion 210 on the substrate 100. Furthermore, the orthographic projection of the first sub-barrier portion 210 on the substrate 100 falls within the range of the orthographic projection of the second sub-barrier portion 310 on the substrate 100.

[0038] In this embodiment of the invention, a barrier portion 2 is provided on the side of the substrate 100 facing the driving functional layer 200. This barrier portion 2 enables the driving functional layer 200 above to form a first sub-barrier portion 210 protruding in a direction away from the substrate 100. The conductive pad 203 is disposed on the first sub-barrier portion 210. Influenced by the first sub-barrier portion 210, the insulating layer 300 above the driving functional layer 200 forms a second sub-barrier portion 310 protruding in a direction away from the substrate 100 at the position corresponding to the first sub-barrier portion 210, thus exposing the conductive pad 203. During the inkjet printing process of the reflective layer 400, the reflective layer 400 is blocked by the second sub-barrier portion 310, thereby preventing the reflective layer 400 from overflowing onto the conductive pad 203 and causing abnormal soldering.

[0039] Please refer to the following embodiments for a detailed description of the substrate provided by the present invention, which are explained in detail below.

[0040] Please see Figure 1 , Figure 1 This is a cross-sectional schematic diagram of the substrate provided in Embodiment 1 of the present invention. The substrate 1 includes a substrate 100, a driving functional layer 200, an insulating layer 300, and a reflective layer 400 stacked together.

[0041] The substrate 100 may be a glass substrate or a flexible substrate. The driving functional layer 200 includes a first metal layer 201, a gate insulating layer 202, and a conductive pad 203, wherein the gate insulating layer 202 is located between the first metal layer 201 and the conductive pad 203. It should be noted that the driving functional layer 200 may also include other conventional film layers such as an active layer.

[0042] The substrate 1 further includes a barrier portion 2 located on the base 100. In this embodiment, the barrier portion 2 includes a boss 500. The boss 500 is located on the side surface of the base 100 facing the driving functional layer 200.

[0043] The thickness of the boss 500 is 1 micrometer to 20 micrometers. For example, the thickness of the boss 500 is 5 micrometers, 10 micrometers, 15 micrometers or 20 micrometers.

[0044] Due to the presence of the protrusion 500, the side of the driving functional layer 200 facing away from the substrate 100 forms a raised terrain at the position corresponding to the protrusion 500. That is, the portion of the driving functional layer 200 corresponding to the protrusion 500 protrudes in the direction away from the substrate 100 to form a first sub-barrier portion 210. The orthographic projection of the first sub-barrier portion 210 onto the substrate 100 overlaps the orthographic projection of the protrusion 500 onto the substrate 100, and the thickness of the first sub-barrier portion 210 is greater than or equal to the thickness of the protrusion 500.

[0045] The insulating layer 300 is disposed on the side of the driving functional layer 200 facing away from the substrate 100, and the insulating layer 300 has an opening 301 exposing the conductive pad 203, wherein the orthographic projection of the opening 301 on the substrate 100 falls within the range of the orthographic projection of the protrusion 500 on the substrate 100. The orthographic projection of the first sub-barrier portion 210 on the substrate 100 covers the orthographic projection of the protrusion 500 on the substrate 100. Therefore, the portion of the insulating layer 300 near the opening 301 is formed on the first sub-barrier portion 210. Influenced by the terrain of the first sub-barrier portion 210, the portion of the insulating layer 300 corresponding to the first sub-barrier portion 210 protrudes in a direction away from the substrate 100 to form the second sub-barrier portion 310.

[0046] When the reflective layer 400 is formed on the insulating layer 300, the second sub-barrier portion 310 can prevent the reflective layer 400 from overflowing to the opening 301 side, thereby avoiding the phenomenon of the reflective layer 400 overflowing onto the conductive pad 203 and causing abnormal soldering.

[0047] It should be noted that the area corresponding to the opening 301 is the bonding area between the LED chip and the conductive pad 203, which is the commonly referred to solder pad area.

[0048] The material of the reflective layer 400 includes white oil, but it can also be other reflective materials, such as black and white double-sided tape, or other types of reflective ink.

[0049] Furthermore, the second sub-barrier portion 310 extends along the side of the first sub-barrier portion 210 to the side of the first sub-barrier portion 210 facing away from the substrate 100. This increases the thickness h1 of the second sub-barrier portion 310, ensuring a significant height difference between the portion of the insulating layer 300 adjacent to the second sub-barrier portion 310 and the second sub-barrier portion 310, thereby achieving a better effect in blocking the reflective layer 400.

[0050] Furthermore, the height difference h1' between the portion of the insulating layer 300 adjacent to the second sub-barrier portion 310 and the second sub-barrier portion 310 is greater than or equal to the thickness h2 of the reflective layer 400. This ensures that the reflective layer 400 cannot overflow across the second sub-barrier portion 310 onto the conductive pad 203.

[0051] It is understood that the insulating layer 300 extends from the side of the first sub-barrier portion 210 to the side of the first sub-barrier portion 210 facing away from the substrate 100, and the thickness h1 of the second sub-barrier portion 310 is at least equal to the thickness of the first sub-barrier portion 210.

[0052] Please see Figure 2 , Figure 2 This is a cross-sectional schematic diagram of the substrate provided in Embodiment 2 of the present invention. The substrate 1 of this embodiment includes a substrate 100, a driving functional layer 200, an insulating layer 300, and a reflective layer 400 stacked together. The difference between the substrate of this embodiment and the substrate of Embodiment 1 is that the barrier portion 2 of this embodiment, in addition to including a boss 500, also includes a groove 600 corresponding to the periphery of the boss 500. The driving functional layer 200, in addition to including a first sub-barrier portion 210, also includes a third sub-barrier portion 220 located around the first sub-barrier portion 210. The insulating layer 300 includes a fourth sub-barrier portion 320 corresponding to the third sub-barrier portion 220. The fourth sub-barrier portion 320 is located around the second sub-barrier portion 310, and the edge portion of the reflective layer 400 is located within the fourth sub-barrier portion 320.

[0053] Specifically, the third sub-barrier portion 220 can be formed in the following manner: as follows Figure 2 As shown, a groove 600 is provided on the side surface of the substrate 100 facing the driving function layer 200. As the driving function layer 200 fills the groove 600, the portion of the driving function layer 200 corresponding to the groove 600 is recessed towards the substrate 100 to form a third sub-barrier portion 220.

[0054] The groove 600 has a depth of 1 micrometer to 2 micrometers. For example, the depth of the groove 600 is 1 micrometer, 1.5 micrometers, 1.8 micrometers, or 2 micrometers. The groove 600 has a width of 3 micrometers to 10 micrometers. For example, the width of the groove 600 is 3 micrometers, 5 micrometers, 8 micrometers, or 10 micrometers.

[0055] The insulating layer 300 is disposed on the side of the driving function layer 200 facing away from the substrate 100. Due to the influence of the terrain of the third sub-barrier portion 220, the portion of the insulating layer 300 corresponding to the third sub-barrier portion 220 will form a fourth sub-barrier portion 320 that is recessed toward the substrate 100.

[0056] like Figure 3 As shown, Figure 3 This is a schematic diagram of the boss and groove structure of the substrate provided in Embodiment 2 of the present invention. In the top view of the substrate 1, the groove 600 is located on the periphery of the boss 500; the groove 600 can be disposed adjacent to the boss 500 or spaced apart from the boss 500.

[0057] The orthographic projection of the fourth sub-barrier portion 320 on the substrate 100 overlaps with the orthographic projection of the third sub-barrier portion 220 on the substrate 100.

[0058] Furthermore, the third sub-barrier portion 220 is adjacent to the first sub-barrier portion 210, and the fourth sub-barrier portion 320 is adjacent to the second sub-barrier portion 310.

[0059] In this embodiment, by combining the first sub-barrier portion 210 with the third sub-barrier portion 220, and the second sub-barrier portion 310 with the fourth sub-barrier portion 320, the height difference h1' between the portion of the insulating layer 300 adjacent to the second sub-barrier portion 310 (i.e., the portion corresponding to the fourth sub-barrier portion 320) and the second sub-barrier portion 310 is further increased. The height difference h1' is greater than the thickness h2 of the reflective layer 400. The overflow of the reflective layer 400 to the fourth sub-barrier portion 320 causes the liquid surface or edge position of the reflective layer 400 to drop, further increasing the distance between the edge liquid surface or edge position of the reflective layer 400 and the top of the second sub-barrier portion 310. This ensures that the reflective layer 400 cannot overflow across the second sub-barrier portion 310 onto the conductive pad 203.

[0060] It is understood that the other structures of the substrate described in this embodiment are the same as those of the substrate in Embodiment 1 above, and will not be described again here.

[0061] Please see Figure 1 , Figure 2 and Figure 4 , Figure 4 This is a cross-sectional schematic diagram of a substrate provided in Embodiment 1 of the present invention. In the substrates of Embodiments 1 and 2 above, the driving functional layer 200 may specifically include a dielectric layer 204, a thin-film transistor T, and a conductive pad 203. The thin-film transistor T includes a gate 2001, a gate insulating layer 202, an active layer 2002, a source 2003, and a drain 2004. The gate 2001 is located on the first metal layer, the gate insulating layer 202 is located on the first metal layer, and the active layer 2002 is located on the gate insulating layer 202. The active layer 2002 includes a channel region and conductive regions located on both sides of the channel region. The source 2003 and the drain 2004 are located on the active layer 2002 and are respectively connected to the conductive regions of the active layer 2002. The dielectric layer 204 is located on the source 2003 and the drain 2004. The conductive pad 203 is located on the dielectric layer 204 and is electrically connected to the source 2003 or the drain 2004 through a via penetrating the dielectric layer 204.

[0062] It should be noted that this example uses a bottom-gate thin-film transistor, but in other embodiments, the thin-film transistor T can also be a top-gate structure.

[0063] Figure 4 Taking the substrate in Embodiment 1 as an example, the substrate 100 has a protrusion 500 on the side facing the driving functional layer 200. The orthographic projection of the thin-film transistor T on the substrate 100 overlaps with the protrusion 500, and the conductive pad 203 is located on the side of the thin-film transistor T away from the substrate 100. That is, the thin-film transistor T is formed on the protrusion 500. By using the form of the protrusion 500 and the thin-film transistor T superimposed, the terrain of the driving functional layer facing away from the substrate 100 at the position corresponding to the protrusion 500 is further improved, that is, the thickness of the first sub-barrier portion 210 is further increased.

[0064] The thickness of the first sub-barrier portion 210 is greater than the thickness of the boss 500. The orthographic projection of the first sub-barrier portion 210 on the substrate 100 overlaps the orthographic projection of the boss 500 on the substrate 100.

[0065] The insulating layer 300 is disposed on the side of the driving functional layer 200 facing away from the substrate 100, and the insulating layer 300 has an opening 301 exposing the conductive pad 203, wherein the orthographic projection of the opening 301 on the substrate 100 falls within the range of the orthographic projection of the boss 500 on the substrate 100. Therefore, the portion of the insulating layer 300 near the opening 301 is formed on the first sub-barrier portion 210. Influenced by the terrain of the first sub-barrier portion 210, the portion of the insulating layer 300 corresponding to the first sub-barrier portion 210 forms a second sub-barrier portion 310 that protrudes in a direction away from the substrate 100.

[0066] When the reflective layer 400 is formed on the insulating layer 300, the second sub-barrier portion 310 can prevent the reflective layer 400 from overflowing to the opening 301 side, thereby avoiding the phenomenon of the reflective layer 400 overflowing onto the conductive pad 203 and causing abnormal soldering.

[0067] Please see Figure 1 , Figure 2 and Figure 5 , Figure 5 This is a cross-sectional schematic diagram of another substrate provided in Embodiment 1 of the present invention. In the substrates of Embodiments 1 and 2 above, the driving functional layer 200 may specifically include a thin-film transistor T and a conductive pad 203. The thin-film transistor T includes a gate 2001, a gate insulating layer 202, an active layer 2002, a source 2003, and a drain 2004. The gate 2001 is located on the first metal layer, the gate insulating layer 202 is located on the gate 2001, and the active layer 2002 is located on the gate insulating layer 202. The active layer 2002 includes a channel region and conductive regions located on both sides of the channel region. The source 2003 and the drain 2004 are located on the active layer 2002 and are respectively connected to the conductive regions of the active layer 2002. The conductive pad 203 is disposed in the same layer as the source electrode 2003 and the drain electrode 2004, and the conductive pad 203 is electrically connected to the source electrode 2003 or the drain electrode 2004. Furthermore, the conductive pad 203 can be integrally formed with the source electrode 2003 or the drain electrode 2004.

[0068] In this embodiment, the orthogonal projection of the thin-film transistor T onto the substrate 100 is separated from the boss 500.

[0069] It should be noted that this example uses a bottom-gate thin-film transistor, but in other embodiments, the thin-film transistor T can also be a top-gate structure.

[0070] Figure 5Taking the substrate in Embodiment 1 as an example, the substrate 100 has a protrusion 500 on the side facing the gate insulating layer 202. Due to the presence of the protrusion 500, the driving functional layer on the side facing away from the substrate 100 forms a raised terrain at the position corresponding to the protrusion 500, thus forming a first sub-barrier portion 210. The thickness of the first sub-barrier portion 210 is greater than or equal to the thickness of the protrusion 500. The orthographic projection of the first sub-barrier portion 210 onto the substrate 100 covers the orthographic projection of the protrusion 500 onto the substrate 100.

[0071] The insulating layer 300 is disposed on the side of the driving functional layer 200 facing away from the substrate 100, and the insulating layer 300 has an opening 301 exposing the conductive pad 203, wherein the orthographic projection of the opening 301 on the substrate 100 falls within the range of the protrusion 500. Therefore, the portion of the insulating layer 300 near the opening 301 is formed on the first sub-barrier portion 210. Influenced by the terrain of the first sub-barrier portion 210, the portion of the insulating layer 300 corresponding to the first sub-barrier portion 210 forms a second sub-barrier portion 310 that protrudes in a direction away from the substrate 100.

[0072] When the reflective layer 400 is formed on the insulating layer 300, the second sub-barrier portion 310 can prevent the reflective layer 400 from overflowing to the opening 301 side, thereby avoiding the phenomenon of the reflective layer 400 overflowing onto the conductive pad 203 and causing abnormal soldering.

[0073] This invention also provides a light-emitting plate, including a substrate and an LED chip as described above, wherein the LED chip is disposed on the substrate and electrically connected to the conductive pad.

[0074] In one embodiment, the light-emitting panel can be a Mini LED or Micro LED direct-view panel, or other LED direct-view panels, without limitation.

[0075] In another embodiment, the light-emitting plate can also serve as a backlight for an LCD panel.

[0076] In summary, the substrate and light-emitting plate provided by the present invention, by setting a barrier portion on the substrate, enable the driving functional layer above to form a first sub-barrier portion, and the conductive pad is disposed on the first sub-barrier portion; the insulating layer above the driving functional layer forms a second sub-barrier portion at the position corresponding to the first sub-barrier portion and exposes the conductive pad. After the reflective layer is prepared, the reflective layer can be blocked by the second sub-barrier portion, thereby avoiding the phenomenon of the reflective layer overflowing onto the conductive pad and causing abnormal soldering.

[0077] The embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A substrate, characterized in that, include: The substrate, including the barrier portion; A driving functional layer is located on one side of the substrate. The driving functional layer includes a conductive pad and a thin-film transistor. The conductive pad is located on the side of the thin-film transistor away from the substrate. An insulating layer is disposed on the side of the driving function layer away from the substrate, and the insulating layer has an opening that exposes the conductive pad; A reflective layer is disposed on the side of the insulating layer away from the substrate; Wherein, in the direction perpendicular to the substrate, the height of the insulating layer around the opening is greater than the height of the reflective layer, and the insulating layer around the opening protrudes from the surface of the reflective layer; The barrier portion includes a boss that protrudes toward the driving functional layer; the orthographic projection of the thin-film transistor on the substrate overlaps with the boss, and the orthographic projection of the opening on the substrate falls within the range of the orthographic projection of the boss on the substrate.

2. The substrate according to claim 1, characterized in that, The driving function layer includes a first sub-barrier portion corresponding to the barrier portion, the insulating layer includes a second sub-barrier portion corresponding to the first sub-barrier portion, and the reflective layer is located on the side of the second sub-barrier portion away from the opening.

3. The substrate according to claim 2, characterized in that, The orthographic projection of the first sub-barrier portion on the substrate covers the orthographic projection of the boss on the substrate, and the orthographic projection of the opening on the substrate falls within the range of the orthographic projection of the boss on the substrate; The portion of the driving function layer corresponding to the boss protrudes in a direction away from the substrate to form the first sub-barrier portion, and the portion of the insulating layer corresponding to the first sub-barrier portion protrudes in a direction away from the substrate to form the second sub-barrier portion. The orthographic projection of the second sub-barrier portion on the substrate overlaps with the orthographic projection of the first sub-barrier portion on the substrate.

4. The substrate according to claim 2, characterized in that, The thickness of the boss is 1 micrometer to 20 micrometers, and the thickness of the first sub-barrier portion is greater than or equal to the thickness of the boss.

5. The substrate according to claim 3, characterized in that, The barrier portion further includes a groove, which is located around the periphery of the boss. The driving function layer further includes a third sub-barrier portion located around the first sub-barrier portion. The insulating layer further includes a fourth sub-barrier portion corresponding to the third sub-barrier portion, which is located around the periphery of the second sub-barrier portion. The edge portion of the reflective layer near the opening is located in the fourth sub-barrier portion. The portion of the driving function layer corresponding to the groove is recessed towards the substrate to form a third sub-barrier portion, and the portion of the insulating layer corresponding to the third sub-barrier portion is recessed towards the substrate to form a fourth sub-barrier portion. The orthographic projection of the fourth sub-barrier portion on the substrate at least partially overlaps with the orthographic projection of the third sub-barrier portion on the substrate. The third sub-barrier portion is adjacent to the first sub-barrier portion, and the fourth sub-barrier portion is adjacent to the second sub-barrier portion.

6. The substrate according to claim 1, characterized in that, The conductive pad is electrically connected to the thin-film transistor through a via.

7. The substrate according to claim 2, characterized in that, The portion of the insulating layer adjacent to the second sub-barrier portion has a height difference from the second sub-barrier portion, and the height difference is greater than or equal to the thickness of the reflective layer.

8. The substrate according to claim 2, characterized in that, The second sub-barrier extends along the side of the first sub-barrier to the side of the first sub-barrier facing away from the substrate.

9. A light-emitting panel, characterized in that, It includes a substrate and an LED chip as described in any one of claims 1-8, wherein the LED chip is disposed on the substrate.

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