Substrate processing method and substrate processing apparatus

Abstract

The present application provides a technology that can perform monitoring processing on a plurality of monitoring targets based on more appropriate image data. A substrate processing method of the present application includes: a holding step of moving a substrate into an inside of a chamber and holding the substrate; a supplying step of supplying a fluid to the substrate in the inside of the chamber; a photographing step (S12) of sequentially photographing the inside of the chamber by a camera to acquire image data; a condition setting step (S11) of determining a monitoring target and changing an image condition based on the monitoring target; and a monitoring step (S13) of performing monitoring processing on the monitoring target based on the image data having the image condition corresponding to the monitoring target.

Description

Technical Field

[0001] This invention relates to a substrate processing method and a substrate processing apparatus. Background Technology

[0002] In the past, various processing solutions such as pure water, photoresist solution, and etching solution have been supplied to substrates in the manufacturing process of semiconductor devices to perform various substrate treatments such as cleaning and photoresist coating. As an apparatus for performing substrate treatment using the aforementioned processing solutions, a substrate processing apparatus that rotates the substrate in a horizontal position while dispensing the processing solution from a nozzle onto the surface of the substrate is widely used.

[0003] In such a substrate processing apparatus, it is confirmed whether the processing liquid has been ejected from the nozzle. As a method to more reliably determine whether the ejection has occurred, for example, the technique of directly monitoring the ejection of the processing liquid from the nozzle by setting up a camera or other imaging means, as proposed in Patent Documents 1 and 2.

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-135679

[0006] Patent Document 2: Japanese Patent Application Publication No. 2015-173148 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] However, in order to properly process the substrate, it is desirable to monitor not only the processing liquid but also more monitoring objects. However, the monitoring objects may vary, for example, depending on the progress of the substrate processing. Specifically, during the period when the nozzle moves to a processing position above the substrate and then stops, the stopping position of the nozzle is monitored. During the subsequent dispensing of the processing liquid, the dispensing status of the processing liquid from the nozzle is monitored.

[0009] Acquiring image data for a variety of monitored objects under common image conditions may not necessarily allow for the acquisition of image data for all monitored objects under suitable image conditions. For example, if image data is acquired with a wide field of view, high resolution, and high frame rate, the amount of image data will become excessively large due to the varying monitored objects, thus excessively increasing the processing burden in the monitoring process.

[0010] Therefore, the present invention was made in view of the above-mentioned problems, and its object is to provide a technique for monitoring multiple monitoring objects separately based on more appropriate image data.

[0011] means for solving problems

[0012] A first embodiment of the substrate processing method is a substrate processing method comprising: a holding step of moving a substrate into the interior of a chamber and holding the substrate therein; a supply step of supplying fluid to the substrate inside the chamber; an image capturing step of sequentially capturing images of the interior of the chamber by a camera to acquire image data; a condition setting step of determining a monitoring object and changing image conditions according to the monitoring object; and a monitoring step of performing monitoring processing on the monitoring object based on the image data having image conditions corresponding to the monitoring object.

[0013] The second embodiment of this substrate processing method is a substrate processing method related to the first embodiment, wherein the image conditions include at least one of the resolution of the image data, the frame rate, and the size of the field of view displayed in the image data.

[0014] The third embodiment of this substrate processing method is a substrate processing method related to the second embodiment, wherein, in the condition setting step, during a first period in which at least one of the shape and position of an object in the cavity is set as the monitoring object, the frame rate is set to a first frame rate as the image condition for the image data; and during a second period in which the time-dependent state change of the processing liquid ejected from the nozzle in the cavity is set as the monitoring object, the frame rate is set to a second frame rate higher than the first frame rate as the image condition for the image data.

[0015] The fourth embodiment of this substrate processing method is a substrate processing method related to the third embodiment, wherein, in the condition setting step, during the third period in which at least one of the shape and position of the object in the chamber and the time-dependent state change of the processing liquid are set as the monitored object, the frame rate is set to the second frame rate as the image condition of the image data.

[0016] The fifth embodiment of this substrate processing method is a substrate processing method related to any one of the second to fourth embodiments, wherein, during a first period in which at least one of the shape and position of an object in the cavity is set as the monitoring object, the resolution is set to a first resolution as the image condition of the image data; and, during a second period in which the time-dependent state change of the processing liquid ejected from the nozzle in the cavity as the fluid is set as the monitoring object, the resolution is set to a second resolution lower than the first resolution as the image condition of the image data.

[0017] The sixth embodiment of this substrate processing method is a substrate processing method related to the fifth embodiment, wherein, in the condition setting step, during the third period in which at least one of the shape and position of the object in the chamber and the time-dependent state change of the processing liquid are set as the monitored object, the resolution is set to the first resolution as the image condition of the image data.

[0018] The seventh embodiment of this substrate processing method is a substrate processing method related to any one of the third to sixth embodiments, wherein the monitored object includes at least one of the following: at least one of the shape and position of the substrate; at least one of the shape and position of the nozzle; and at least one of the shape and position of the processing cup for receiving the fluid that spills from the periphery of the substrate.

[0019] The eighth embodiment of this substrate processing method is a substrate processing method related to any one of the third to seventh embodiments, wherein the monitored object includes the time-dependent state changes of the processing liquid, including at least one of the discharge start time point, discharge stop time point, droplet bouncing of the processing liquid on the substrate, and dripping and flowing of the processing liquid from the nozzle.

[0020] The ninth embodiment of this substrate processing method is a substrate processing method related to any one of the second to eighth embodiments, wherein, in the condition setting step, during the fourth period in which the presence or absence of a first anomaly occurring in the cavity during the first occurrence period is set as the monitoring object, the frame rate is set to a first frame rate as the image condition of the image data; and during the fifth period in which the presence or absence of a second anomaly occurring in the cavity during a second occurrence period shorter than the first occurrence period is set as the monitoring object, the frame rate is set to a second frame rate higher than the first frame rate as the image condition of the image data.

[0021] The tenth embodiment of this substrate processing method is a substrate processing method related to any one of the first to ninth embodiments, wherein the condition setting step includes a step of setting the image conditions as shooting conditions, and in the shooting step, the camera uses the image conditions corresponding to the monitored object as shooting conditions to acquire the image data.

[0022] The eleventh embodiment of this substrate processing method is a substrate processing method related to any one of the first to ninth embodiments, wherein, in the shooting step, the camera acquires the image data under predetermined shooting conditions, and performs image processing on the image data acquired by the camera to obtain image data having the image conditions corresponding to the monitored object.

[0023] This substrate processing apparatus includes: a substrate holding unit that holds a substrate inside a chamber; a nozzle that supplies fluid to the substrate inside the chamber; a camera that sequentially captures images of the interior of the chamber to acquire image data; and a control unit that determines a monitoring object, changes image conditions according to the monitoring object, and performs monitoring processing on the monitoring object based on the image data having image conditions corresponding to the monitoring object.

[0024] The effects of the invention

[0025] According to the first, second, seventh and eighth embodiments of the substrate processing method and the embodiments of the substrate processing apparatus, monitoring processing of each of the multiple monitored objects can be performed based on more appropriate image data.

[0026] According to a third embodiment of the substrate processing method, when at least one of the position and shape of an object is the object to be monitored, the frame rate is set to a lower first frame rate. Therefore, the processing load can be reduced. On the other hand, when the time-dependent state change of the processing liquid is the object to be monitored, the frame rate is set to a higher second frame rate. Therefore, it is possible to monitor the state change of the processing liquid with higher accuracy.

[0027] According to the fourth embodiment of this substrate processing method, since the frame rate is set to a higher second frame rate, the state changes of the processing liquid can be monitored appropriately.

[0028] According to the fifth embodiment of this substrate processing method, during the second period when the state change of the processing liquid over time is the object of monitoring, the resolution is set to a lower second resolution. Therefore, the processing burden can be reduced. On the other hand, during the first period when at least one of the position and shape of an object is the object of monitoring, the resolution is set to a higher first resolution. Therefore, at least one of the position and shape of an object can be monitored with higher accuracy.

[0029] According to the sixth embodiment of the substrate processing method, since the resolution is set to a higher first resolution, at least one of the shape and position of the object can be appropriately monitored.

[0030] According to the ninth embodiment of the substrate processing method, in the case of a first anomaly with a relatively long occurrence period, since the frame rate is set to a lower first frame rate, the presence or absence of the first anomaly can be monitored with a lower processing burden. Furthermore, in the case of a second anomaly with a relatively short occurrence period, since the frame rate is set to a higher second frame rate, the presence or absence of the second anomaly can be monitored.

[0031] According to the tenth embodiment of this substrate processing method, since the camera acquires image data through shooting conditions corresponding to the monitored object, the image data corresponding to the monitored object can be used for monitoring processing.

[0032] According to the eleventh embodiment of the substrate processing method, even if the camera cannot change the shooting conditions, image data with image conditions corresponding to the monitored object can still be obtained. Attached Figure Description

[0033] Figure 1 This is a diagram that roughly illustrates an example of the overall configuration of a substrate processing apparatus.

[0034] Figure 2 This is a top view that roughly shows an example of the structure of a processing unit.

[0035] Figure 3 This is a longitudinal sectional view that roughly shows an example of the configuration of the processing unit.

[0036] Figure 4 This is a diagram that roughly represents an example of the movement path of each nozzle.

[0037] Figure 5 This is a functional block diagram illustrating an example of the internal structure of the control unit.

[0038] Figure 6 This is a flowchart illustrating an example of the actions of a processing unit.

[0039] Figure 7 This is a table that represents an example of the specific steps involved in the liquid treatment process.

[0040] Figure 8 This is a diagram that roughly represents an example of captured image data.

[0041] Figure 9 This is a diagram that roughly represents an example of captured image data.

[0042] Figure 10 This is a diagram that roughly represents an example of captured image data.

[0043] Figure 11 This is a diagram that roughly represents an example of captured image data.

[0044] Figure 12This is a diagram that roughly represents an example of captured image data.

[0045] Figure 13 This is a flowchart illustrating an example of the actions of a processing unit.

[0046] Figure 14 This is a diagram that roughly represents an example of captured image data.

[0047] Figure 15 This is a diagram that roughly represents an example of captured image data.

[0048] Figure 16 This is a diagram that roughly represents an example of captured image data.

[0049] Figure 17 This is a diagram that roughly represents an example of edge image data.

[0050] Figure 18 This is a diagram that roughly represents an example of edge image data.

[0051] Figure 19 This is a diagram that roughly represents an example of captured image data.

[0052] Figure 20 This is a graph that roughly illustrates the relationship between the position of the substrate and the rotation angle.

[0053] Figure 21 This is a table that represents an example of the monitored object and the shooting conditions.

[0054] Figure 22 This is a diagram that roughly represents an example of captured image data.

[0055] Figure 23 This is a graph that roughly represents the change in brightness value over time.

[0056] Figure 24 This is a longitudinal sectional view that roughly shows an example of the configuration of the processing unit.

[0057] Figure 25 This is a diagram that roughly represents an example of captured image data.

[0058] Figure 26 This is a diagram that roughly represents an example of captured image data.

[0059] Figure 27 This is a diagram that roughly represents an example of captured image data.

[0060] Figure 28 This is a diagram that roughly represents an example of a difference image.

[0061] Figure 29This is a longitudinal sectional view that roughly shows an example of the configuration of the processing unit.

[0062] Figure 30 This is a diagram that roughly represents an example of captured image data.

[0063] Figure 31 It is a diagram used to illustrate the field of view.

[0064] Figure 32 This is a table that represents an example of the monitored object and the shooting conditions.

[0065] Figure 33 This is a functional block diagram that roughly represents an example of the internal structure of the control unit. Detailed Implementation

[0066] The embodiments will now be described with reference to the accompanying drawings. It should be noted that the drawings are schematic and that components have been omitted or simplified for ease of explanation. Furthermore, the relative sizes and positions of the components shown in the drawings are not necessarily accurate and may be appropriately modified.

[0067] Furthermore, in the following description, the same components are identified by the same symbols, and the names and functions of these components are also set to be the same. Therefore, there are instances where detailed descriptions of these components are omitted to avoid repetition.

[0068] Furthermore, in the following description, even when sequence numbers such as "first" or "second" are used, these terms are used for convenience in order to facilitate understanding of the implementation method, and the present invention is not limited to the order generated by the aforementioned sequence numbers.

[0069] In this invention, expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) mean, unless otherwise stated, not only accurately representing their positional relationship, but also indicating a state after relative displacement in angle or distance within tolerance or the range where the same level of function can be obtained. Expressions indicating equal states (e.g., "same," "equal," "homogeneous," etc.) mean, unless otherwise stated, not only representing a quantitatively and accurately equal state, but also indicating a state where there is a difference in tolerance or the range where the same level of function can be obtained. Expressions indicating shapes (e.g., "quadrilateral shape" or "cylindrical shape," etc.) mean, unless otherwise stated, not only accurately representing the shape geometrically, but also indicating a shape having, for example, concavity, convexity, or chamfering, within the range where the same level of effect can be obtained. The expressions "possessing," "having," "having," "comprises," or "containing" a constituent component in this invention are not exclusive expressions excluding the existence of other constituent components. In this invention, the expression "at least one of A, B and C" includes: only A; only B; only C; any two of A, B and C; and all of A, B and C.

[0070] <Overall Composition of the Substrate Processing Device>

[0071] Figure 1 This is a top view illustrating an example of the internal arrangement of the substrate processing apparatus 100 according to this embodiment. Figure 1 As illustrated, the substrate processing apparatus 100 is a monolithic processing apparatus that processes the substrate W, which is the object of processing, one at a time.

[0072] The substrate processing apparatus 100 of this embodiment performs a drying process after cleaning a circular thin silicon substrate, namely substrate W, with a rinsing solution such as a chemical solution and pure water.

[0073] For example, a mixture of ammonia and hydrogen peroxide water (SC1), a mixed aqueous solution of hydrochloric acid and hydrogen peroxide water (SC2), or DHF solution (diluted hydrofluoric acid) can be used as the above-mentioned solution.

[0074] In the following description, the chemical solutions, rinsing solutions, and organic solvents are collectively referred to as "processing solutions". It should be noted that, in addition to the chemical solutions used for cleaning, chemical solutions used to remove unwanted films or for etching are also included in "processing solutions".

[0075] The substrate processing apparatus 100 includes multiple processing units 1, a loading port LP, an indexing robot 102, a main transport robot 103, and a control unit 9.

[0076] As a mounting stage, a FOUP (Front Opening Unified Pod), an SMIF (Standard Mechanical Interface) transport box, or an OC (Open Cassette) that exposes the substrate W to external gases can be used. Furthermore, a transfer robot moves the substrate W between the mounting stage and the main transport robot 103.

[0077] Processing unit 1 performs liquid processing and drying processing on a substrate W. In the substrate processing apparatus 100 of this embodiment, 12 processing units 1 with the same configuration are arranged.

[0078] Specifically, four towers, each comprising three processing units 1 stacked along the vertical direction, are configured to surround the main transport robot 103.

[0079] Figure 1 The diagram shows, in a schematic representation, one of the three overlapping processing units 1. It should be noted that the number of processing units 1 in the substrate processing apparatus 100 is not limited to 12 and can be varied appropriately.

[0080] The main transfer robot 103 is positioned at the center of the four towers on which the processing units 1 are stacked. The main transfer robot 103 transports the substrates W, which are the objects of processing, collected from the indexing robot 102, into their respective processing units. In addition, the main transfer robot 103 removes the processed substrates W from each processing unit 1 and hands them over to the indexing robot 102. The control unit 9 controls the operation of each component of the substrate processing apparatus 100.

[0081] Hereinafter, one of the 12 processing units 1 mounted on the substrate processing apparatus 100 will be described, but the other processing units 1 have the same configuration except for the different arrangement of the nozzles.

[0082] <Processing Unit>

[0083] Next, the processing unit 1 will be described. Hereinafter, one of the 12 processing units 1 mounted on the substrate processing apparatus 100 will be described. Figure 2 This is a top view of processing unit 1. Furthermore, Figure 3 This is a longitudinal sectional view of processing unit 1.

[0084] The processing unit 1 includes, within the chamber 10, a rotating chuck 20 (as an example of a substrate holding part), a first nozzle 30, a second nozzle 60, a third nozzle 65, a fixed nozzle 80, a processing cup 40, and a camera 70.

[0085] The chamber 10 includes a side wall 11 along the vertical direction, a top wall 12 that closes the upper side of the space enclosed by the side wall 11, and a bottom wall 13 that closes the lower side. The space enclosed by the side wall 11, top wall 12, and bottom wall 13 becomes a processing space. In addition, a portion of the side wall 11 of the chamber 10 is provided with a loading / unloading inlet for the main transport robot 103 to load and unload the substrate W, and a gate for opening and closing the loading / unloading inlet (both omitted from the figure).

[0086] A fan filter unit (FFU) 14 is installed on the top wall 12 of the chamber 10 to further purify the air in the cleanroom where the substrate processing apparatus 100 is located and supply it to the processing space within the chamber 10. The fan filter unit 14 includes a fan and a filter (e.g., a HEPA (High Efficiency Particulate Air) filter) for introducing air from the cleanroom and delivering it to the chamber 10, thus creating a downward flow of clean air in the processing space within the chamber 10. To uniformly distribute the clean air supplied from the fan filter unit 14, a perforated plate with multiple through-holes can also be provided directly below the top wall 12.

[0087] The rotary chuck 20 holds the substrate W in a horizontal position (with the normal along the vertical direction). The rotary chuck 20 has a circular plate-shaped rotating base 21, which is fixed horizontally at the upper end of a rotating shaft 24 extending vertically. A rotary motor 22 is provided below the rotating base 21 to rotate the rotating shaft 24. The rotary motor 22 rotates the rotating base 21 in the horizontal plane via the rotating shaft 24. Furthermore, a cylindrical outer casing member 23 is provided to surround the rotary motor 22 and the rotating shaft 24.

[0088] The outer diameter of the circular plate-shaped rotating base 21 is slightly larger than the diameter of the circular substrate W held by the rotating chuck 20. Therefore, the rotating base 21 has an upper surface 21a that faces the entire lower surface of the substrate W to be held.

[0089] On the periphery of the upper surface 21a of the rotating base 21, a plurality of chuck pins 26 (four in this embodiment) are erected. The plurality of chuck pins 26 are arranged at equal intervals (90° intervals if there are four chuck pins 26 as in this embodiment) along a circumference corresponding to the periphery of the circular substrate W. Each chuck pin 26 is configured to be driven between a holding position abutting against the periphery of the substrate W and an open position away from the periphery of the substrate W. The plurality of chuck pins 26 are driven by a linkage mechanism (not shown) housed within the rotating base 21. The rotating chuck 20 holds the substrate W above the rotating base 21 in a horizontal position close to the upper surface 21a by stopping the plurality of chuck pins 26 in their respective abutting positions (see reference). Figure 3 Furthermore, the holding of the substrate W can be released by stopping the multiple chuck pins 26 in their respective open positions.

[0090] The outer casing 23 covering the rotary motor 22 has its lower end fixed to the bottom wall 13 of the chamber 10, while its upper end reaches directly below the rotating base 21. A serrated member 25 is provided at the upper end of the outer casing 23, protruding approximately horizontally outward from the outer casing 23 and extending downward in a curved manner. With the substrate W held by the rotary chuck 20 using multiple chuck pins 26, the rotary motor 22 rotates the rotation shaft 24, thereby allowing the substrate W to rotate about a vertical rotation axis CX passing through the center of the substrate W. It should be noted that the drive of the rotary motor 22 is controlled by the control unit 9.

[0091] The first nozzle 30 is configured such that a discharge head 31 is mounted on the front end of the nozzle arm 32. The base end of the nozzle arm 32 is fixedly connected to the nozzle base 33. The nozzle base 33 is configured to rotate about an axis along the vertical direction via a motor (not shown). Figure 2 As shown by arrow AR34, the first nozzle 30 moves in an arc shape in the space above the rotating chuck 20 by rotating through the nozzle base 33.

[0092] Figure 4 This is a top view that roughly represents an example of the movement path of the first nozzle 30. (Example) Figure 4 As illustrated, the discharge head 31 of the first nozzle 30 moves along a circumferential direction centered on the nozzle base 33 by rotation of the nozzle base 33. The first nozzle 30 can stop at an appropriate position. Figure 4 In the example, the first nozzle 30 can be stopped at the central position P31, the peripheral position P32, and the standby position P33, respectively.

[0093] The central position P31 is the position where the ejector head 31 faces the center of the substrate W held in the rotating chuck 20 in the vertical direction. By ejecting processing liquid from the first nozzle 30 located at the central position P31 onto the upper surface of the rotating substrate W, the processing liquid can be supplied to the entire upper surface of the substrate W. Therefore, the entire upper surface of the substrate W can be processed.

[0094] Peripheral position P32 is the position where the ejector head 31 faces the periphery of the substrate W held in the rotating chuck 20 in the vertical direction. The first nozzle 30 can also eject processing liquid onto the upper surface of the rotating substrate W while in the peripheral position P32. Therefore, processing liquid can be ejected only onto the periphery of the upper surface of the substrate W, and only the periphery of the substrate W can be processed (so-called edge processing).

[0095] Furthermore, the first nozzle 30 can also spray processing liquid onto the upper surface of the rotating substrate W while oscillating between the central position P31 and the peripheral position P32. In this case, the entire upper surface of the substrate W can be processed.

[0096] On the other hand, the first nozzle 30 may not discharge the treatment fluid at the peripheral position P32. For example, the peripheral position P32 may also be a relay position for temporary standby when the first nozzle 30 moves from the central position P31 toward the standby position P33.

[0097] The standby position P33 is a position where the ejector head 31 and the base plate W held in the rotating chuck 20 are not facing each other in the vertical direction. A standby box for accommodating the ejector head 31 of the first nozzle 30 may also be provided in the standby position P33.

[0098] like Figure 3 As illustrated, the first nozzle 30 is connected to the treatment fluid supply source 36 via a supply pipe 34. A valve 35 is provided in the supply pipe 34. The valve 35 opens and closes the flow path of the supply pipe 34. When the valve 35 is opened, the treatment fluid supply source 36 supplies treatment fluid to the first nozzle 30 through the supply pipe 34. It should be noted that the first nozzle 30 may also be configured to be supplied with multiple treatment fluids (including at least pure water).

[0099] Furthermore, in the processing unit 1 of this embodiment, in addition to the first nozzle 30 described above, a second nozzle 60 and a third nozzle 65 are further provided. The second nozzle 60 and the third nozzle 65 of this embodiment have the same configuration as the first nozzle 30 described above. That is, the second nozzle 60 is configured to have a discharge head 61 mounted on the front end of the nozzle arm 62. The second nozzle 60 moves in an arc shape in the space above the rotating chuck 20 as shown by arrow AR64 via a nozzle base 63 connected to the base end side of the nozzle arm 62. The relative positional relationship of the central position P61, the peripheral position P62, and the standby position P63 on the movement path of the second nozzle 60 is the same as the relative positional relationship of the central position P31, the peripheral position P32, and the standby position P33, respectively.

[0100] Similarly, the third nozzle 65 is configured to have a discharge head 66 mounted on the front end of the nozzle arm 67. The third nozzle 65 moves in an arc shape in the space above the rotating chuck 20, as indicated by arrow AR69, via a nozzle base 68 connected to the base end of the nozzle arm 67. It moves in an arc shape between the processing position and the standby position, which is further outward from the processing cup 40. The relative positional relationships of the central position P66, peripheral position P67, and standby position P68 along the movement path of the third nozzle 65 are the same as the relative positional relationships of the central position P31, peripheral position P32, and standby position P33, respectively.

[0101] Furthermore, the third nozzle 65 can also be raised or lowered. For example, the third nozzle 65 can be raised or lowered via a nozzle raising mechanism (not shown) built into the nozzle base 68. In this case, the third nozzle 65 can also stop at a central upper position P69, which is vertically above the central position P66. It should be noted that it can also be configured that at least one of the first nozzle 30 and the second nozzle 60 can also be raised or lowered.

[0102] The second nozzle 60 and the third nozzle 65 are each connected to a processing liquid supply source (not shown) via a supply pipe (not shown), similar to the first nozzle 30. A valve is provided in each supply pipe, and the supply / stopping of the processing liquid is switched by opening and closing the valve. It should be noted that the second nozzle 60 and the third nozzle 65 can each be configured to supply multiple processing liquids, including at least pure water. Furthermore, at least one of the first nozzle 30, the second nozzle 60, and the third nozzle 65 can be a two-fluid nozzle that mixes a cleaning liquid such as pure water with pressurized gas to generate droplets and then sprays the mixture of droplets and gas onto the substrate W. Moreover, the number of nozzles provided in the processing unit 1 is not limited to three; one or more is acceptable.

[0103] exist Figure 2 and Figure 3In this example, a fixed nozzle 80 is also provided in the processing unit 1. The fixed nozzle 80 is located higher than the rotary chuck 20 and radially outward from the outer periphery of the rotary chuck 20. As a more specific example, the fixed nozzle 80 is positioned facing the processing cup 40 described later in the vertical direction. The outlet of the fixed nozzle 80 faces the substrate W, and its opening axis is, for example, along the horizontal direction. The fixed nozzle 80 also dispenses processing liquid onto the upper surface of the substrate W held in the rotary chuck 20. The processing liquid dispensed from the fixed nozzle 80 may, for example, fall onto the central portion of the upper surface of the substrate W.

[0104] like Figure 3 As illustrated, the fixed nozzle 80 is connected to the treatment fluid supply source 83 via a supply pipe 81. A valve 82 is provided in the supply pipe 81. The valve 82 opens and closes the flow path of the supply pipe 81. When the valve 82 is open, the treatment fluid supply source 83 supplies treatment fluid (e.g., pure water) to the fixed nozzle 80 through the supply pipe 81, and the treatment fluid is then discharged from the outlet of the fixed nozzle 80.

[0105] The processing cup 40 surrounding the rotary chuck 20 includes an inner cup 41, a middle cup 42, and an outer cup 43 that can be raised and lowered independently. The inner cup 41 surrounds the rotary chuck 20 and has a shape that is substantially rotationally symmetrical with respect to the axis of rotation CX passing through the center of the base plate W held in the rotary chuck 20. The inner cup 41 integrally includes: a bottom 44 that is annular when viewed from above; a cylindrical inner wall portion 45 that rises upward from the inner periphery of the bottom 44; a cylindrical outer wall portion 46 that rises upward from the outer periphery of the bottom 44; a first guide portion 47 that rises between the inner wall portion 45 and the outer wall portion 46 and whose upper end extends obliquely upward toward the center (near the axis of rotation CX of the base plate W held in the rotary chuck 20) ​​along a smooth arc; and a cylindrical middle wall portion 48 that rises upward between the first guide portion 47 and the outer wall portion 46.

[0106] The inner wall portion 45 is formed such that it is accommodated between the outer cover member 23 and the blade member 25 in a manner that maintains an appropriate gap when the inner cup 41 is raised to its highest position. The middle wall portion 48 is formed such that it is accommodated between the second guide portion 52 (described later) and the processing liquid separation wall 53 of the middle cup 42 in a manner that maintains an appropriate gap when the inner cup 41 and the middle cup 42 are in their closest position.

[0107] The first guide portion 47 has an upper end portion 47b that extends obliquely upward toward the center (in the direction close to the rotation axis CX of the substrate W) along a smooth arc. Furthermore, a waste ditch 49 is provided between the inner wall portion 45 and the first guide portion 47 for collecting and discarding used processing fluid. An annular inner recovery ditch 50 is provided between the first guide portion 47 and the middle wall portion 48 for collecting and recycling used processing fluid. Furthermore, an annular outer recovery ditch 51 is provided between the middle wall portion 48 and the outer wall portion 46 for collecting and recycling processing fluid of a different type than that in the inner recovery ditch 50.

[0108] A venting mechanism (not shown) is connected to the waste ditch 49 to discharge the treated liquid collected in the waste ditch 49 and to forcibly vent the waste ditch 49. For example, four venting mechanisms are provided at equal intervals along the circumference of the waste ditch 49. Furthermore, recovery mechanisms (not shown) are connected to the inner recovery ditch 50 and the outer recovery ditch 51, respectively, to recover the treated liquid collected in the inner and outer recovery ditch 50 to a recovery tank located outside the processing unit 1. It should be noted that the bottoms of the inner and outer recovery ditch 50 and the outer recovery ditch 51 are inclined at a slight angle relative to the horizontal direction, and the recovery mechanism is connected at their lowest point. Therefore, the treated liquid flowing into the inner and outer recovery ditch 50 can be smoothly recovered.

[0109] The middle cup 42 surrounds the rotary chuck 20 and has a shape that is substantially rotationally symmetrical with respect to the axis of rotation CX passing through the center of the base plate W held in the rotary chuck 20. The middle cup 42 integrally includes a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52.

[0110] The second guide portion 52 has the following on the outer side of the first guide portion 47 of the inner cup 41: a lower end portion 52a that is coaxially cylindrical with the lower end portion of the first guide portion 47; an upper end portion 52b that extends obliquely upward from the upper end portion 52a along a smooth arc towards the center (in the direction close to the rotation axis CX of the substrate W); and a folded-back portion 52c formed by folding the front end portion of the upper end portion 52b downward. When the inner cup 41 and the middle cup 42 are in the closest position, the lower end portion 52a is received in the inner recovery groove 50 with an appropriate gap between the first guide portion 47 and the middle wall portion 48. Furthermore, the upper end portion 52b is configured to overlap with the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction, and when the inner cup 41 and the middle cup 42 are in the closest position, it approaches the upper end portion 47b of the first guide portion 47 with a very small gap. Furthermore, the folded portion 52c formed by folding the front end of the upper end 52b downwards is set to be the length by which the folded portion 52c overlaps with the front end of the upper end 47b of the first guide portion 47 in the horizontal direction when the inner cup 41 and the middle cup 42 are closest.

[0111] Furthermore, the upper end portion 52b of the second guide portion 52 is formed to become thicker towards the bottom, and the processing liquid separation wall 53 has a cylindrical shape that extends downward from the lower outer periphery of the upper end portion 52b. When the inner cup 41 and the middle cup 42 are in the closest possible position, the processing liquid separation wall 53 is housed within the outer recovery groove 51, maintaining an appropriate gap between the middle wall portion 48 and the outer cup 43.

[0112] The outer cup 43 surrounds the rotary chuck 20 outside the second guide portion 52 of the middle cup 42, and has a shape that is approximately rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W held in the rotary chuck 20. The outer cup 43 functions as a third guide portion. The outer cup 43 has: a lower end portion 43a that is coaxially cylindrical with the lower end portion 52a of the second guide portion 52; an upper end portion 43b that extends obliquely upward from the upper end of the lower end portion 43a along a smooth arc towards the center (in the direction close to the rotation axis CX of the substrate W); and a folded-back portion 43c formed by folding the front end portion of the upper end portion 43b downward.

[0113] When the inner cup 41 and outer cup 43 are in the closest position, the lower end portion 43a is received within the outer recovery groove 51 with a suitable gap between the processing liquid separation wall 53 of the middle cup 42 and the outer wall portion 46 of the inner cup 41. Furthermore, the upper end portion 43b is configured to overlap the second guide portion 52 of the middle cup 42 in the vertical direction, and when the middle cup 42 and outer cup 43 are in the closest position, it approaches the upper end portion 52b of the second guide portion 52 with a very small gap. Additionally, the folded-back portion 43c formed by folding the front end portion of the upper end portion 43b downwards is configured such that when the middle cup 42 and outer cup 43 are in the closest position, the folded-back portion 43c overlaps with the folded-back portion 52c of the second guide portion 52 in the horizontal direction.

[0114] Furthermore, the inner cup 41, the middle cup 42, and the outer cup 43 are designed to be raised and lowered independently of each other. That is, each of the inner cup 41, the middle cup 42, and the outer cup 43 is provided with a cup lifting mechanism (not shown), thereby allowing them to be raised and lowered individually and independently. Such a cup lifting mechanism can be, for example, a ball screw mechanism or a cylinder, or other well-known mechanisms.

[0115] The partition plate 15 is configured to vertically divide the inner space of the chamber 10 around the processing cup 40. The partition plate 15 can be a single plate-like member surrounding the processing cup 40, or it can be constructed by joining multiple plate-like members. In addition, the partition plate 15 may also have through holes or notches extending along the thickness direction. In this embodiment, a through hole is formed for a support shaft to pass through, and the support shaft is used to support the nozzle base 33 of the first nozzle 30, the nozzle base 63 of the second nozzle 60, and the nozzle base 68 of the third nozzle 65.

[0116] The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10. Furthermore, the edge of the partition plate 15 surrounding the processing cup 40 is formed into a circular shape with a diameter larger than the outer diameter of the outer cup 43. Therefore, the partition plate 15 does not obstruct the raising and lowering of the outer cup 43.

[0117] Furthermore, an exhaust pipe 18 is provided on a portion of the side wall 11 of the chamber 10 and near the bottom wall 13. The exhaust pipe 18 is connected to an exhaust mechanism (not shown). Clean air supplied from the fan filter unit 14 and flowing downwards within the chamber 10 will be discharged from the exhaust pipe 18 to the outside of the device through the air between the processing cup 40 and the partition plate 15.

[0118] Camera 70 is disposed within chamber 10 and positioned above partition plate 15. Camera 70 includes, for example, an optical system such as a CCD (Charge Coupled Device) as a solid-state imaging element and a lens. Camera 70 is disposed for monitoring various objects within chamber 10, as described later. Specific examples of monitored objects will be detailed later. Camera 70 is positioned to include various monitored objects within its field of view. Camera 70 acquires image data by capturing images of its field of view at each frame rate and sequentially outputs the acquired image data to control unit 9.

[0119] like Figure 3 As shown, an illumination unit 71 is provided inside the chamber 10 and above the partition plate 15. When the chamber 10 is a darkroom, the control unit 9 can also control the illumination unit 71 to illuminate the camera 70 when it takes a picture.

[0120] The hardware configuration of the control unit 9, which is installed in the board processing apparatus 100, is the same as that of a general computer. That is, the control unit 9 is configured to include a processing unit such as a CPU (Central Processing Unit) for performing various arithmetic operations, a temporary storage medium such as ROM (Read Only Memory) for storing basic programs, a RAM (Random Access Memory) for storing various information, and a non-temporary storage medium such as a disk for pre-storing control software or data. By executing a predetermined processing program through the CPU of the control unit 9, the various operating mechanisms of the board processing apparatus 100 are controlled by the control unit 9, thereby performing processing within the board processing apparatus 100. It should be noted that the functions of the control unit 9 can also be implemented using dedicated hardware circuitry that does not require software.

[0121] Figure 5 This is a functional block diagram that roughly illustrates an example of the internal structure of the control unit 9. The control unit 9 includes a monitoring and processing unit 91, a condition setting unit 92, and a processing and control unit 93.

[0122] The processing control unit 93 controls the various components within the control chamber 10. Specifically, the processing control unit 93 controls the rotary motor 22, various valves such as valves 35 and 82, the motors of nozzle bases 33, 63, and 68, the nozzle lifting mechanism, the cup lifting mechanism, and the fan filter unit 14. By controlling these components according to a predetermined procedure, the processing unit 1 can process the substrate W. An example of the specific process for processing the substrate W will be described in detail later.

[0123] The monitoring processing unit 91 performs monitoring processing based on the image data acquired by the camera 70 from taking pictures of the cavity 10. Therefore, the monitoring processing unit 91 can monitor various objects within the cavity 10. Specific examples of monitoring processing will be described in detail later.

[0124] The condition setting unit 92 determines the object to be monitored and changes the shooting conditions of the camera 70 according to the object. Then, the condition setting unit 92 notifies the camera 70 of the shooting conditions. Shooting conditions may include, for example, at least one of resolution, frame rate, and field of view. The camera 70 acquires image data according to the shooting conditions notified by the condition setting unit 92 and outputs the image data to the control unit 9. A specific example of shooting conditions corresponding to the monitored object will be described in detail later.

[0125] <An example of a substrate processing procedure>

[0126] <Overall Process>

[0127] Figure 6 This is a flowchart illustrating an example of a substrate processing procedure. First, the main transport robot 103 moves the unprocessed substrate W into the processing unit 1 (step S1: moving step). Second, the rotating chuck 20 holds the substrate W in a horizontal position (step S2: holding step). Specifically, the substrate W is held by multiple chuck pins 26 moving to their respective abutment positions.

[0128] Next, the rotary motor 22 begins to rotate the substrate W (step S3: rotation step). Specifically, the rotary motor 22 rotates the rotary chuck 20, thereby rotating the substrate W held in the rotary chuck 20. Next, the cup lifting mechanism raises the processing cup 40 (step S4: cup lifting step). Therefore, the processing cup 40 stops at the upper position.

[0129] Next, the processing liquid is sequentially supplied to the substrate W (step S5: processing liquid step). It should be noted that in this processing liquid step (step S5), although the cup lifting mechanism appropriately switches the rising cup according to the type of processing liquid supplied to the substrate W, since this point is different from the nature of this embodiment, its description is omitted below.

[0130] Figure 7 This is a table illustrating an example of the specific procedure for the liquid treatment step (step S5). In Figure 7 In the example, the treatment fluid steps are defined by steps ST1 to ST12. This shows the required time for each step, the flow rate (discharge flow rate) of the treatment fluid discharged from the first nozzle 30, second nozzle 60, third nozzle 65, and fixed nozzle 80, and the positions of the first nozzle 30, second nozzle 60, and third nozzle 65. It should be noted that in... Figure 7 The examples also show examples of monitoring processes and shooting conditions that can be performed in each step, but these examples will be described in detail later.

[0131] exist Figure 7 In the example, after a required time t1 in step ST1, the outflow rate of the processed liquid from the first nozzle 30, the second nozzle 60, the third nozzle 65, and the fixed nozzle 80 is zero, and the first nozzle 30, the second nozzle 60, and the third nozzle 65 stop at their respective standby positions P33, P63, and P68. The required time t1 can also be zero, for example. In this case, step ST1 only shows the initial state.

[0132] In the next step ST2, the nozzle base 33 moves the first nozzle 30 from the standby position P33 to the central position P31 within a required time t2. The required time t2 is, for example, about a few seconds.

[0133] In the next step ST3, the first nozzle 30 ejects the processing liquid onto the upper surface of the substrate W at a flow rate F30 within a required time t3. The processing liquid landing on the upper surface of the substrate W is spread across the upper surface of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and then disperses from the periphery of the substrate W. The processing liquid dispersed from the periphery of the substrate W is collected and recovered by the processing cup 40. The required time t3 is, for example, about tens of seconds, and the flow rate F30 is, for example, about several thousand cc / min. Through this step ST3, the substrate W can be processed according to the processing liquid.

[0134] In the next step ST4, during the required time t4, the fixed nozzle 80 discharges a treatment liquid (e.g., rinsing liquid) at a flow rate F80, while the nozzle base 33 moves the first nozzle 30 from the central position P31 to the peripheral position P32. The treatment liquid from the fixed nozzle 80 falls onto the central portion of the upper surface of the substrate W, expands on the upper surface of the substrate W due to centrifugal force, and scatters from the periphery of the substrate W. The treatment liquid scattered from the periphery of the substrate W is collected and recovered by the treatment cup 40. The required time t4 is, for example, about tens of seconds, and the flow rate F80 is, for example, about several thousand cc / min.

[0135] In the next step ST5, while the fixed nozzle 80 discharges the treatment fluid (e.g., rinsing fluid) at a flow rate F80, the nozzle base 33 moves the first nozzle 30 from the peripheral position P32 to the standby position P33 within a required time t5. The required time t5 is, for example, about a few seconds.

[0136] In the next step ST6, while the fixed nozzle 80 discharges the treatment fluid (e.g., rinsing fluid) at a flow rate F80, the nozzle base 63 moves the second nozzle 60 from the standby position P63 to the peripheral position P62 within a required time t6. The required time t6 is, for example, about a few seconds.

[0137] The fixed nozzle 80 ejects the processing liquid in steps ST4 to ST6. When the processing liquid ejected by the fixed nozzle 80 is a rinsing liquid, at the end of step ST3, the processing liquid remaining on the upper surface of the substrate W can be replaced with rinsing liquid.

[0138] In the next step ST7, during the required time t7, the nozzle base 63 moves the second nozzle 60 from the peripheral position P62 to the central position P61, and the second nozzle 60 ejects the processing liquid onto the upper surface of the substrate W at a flow rate F60. The required time t7 is, for example, about tens of seconds, and the flow rate F60 is, for example, about several thousand cc / min. Through this step ST7, the upper surface of the substrate W can be processed.

[0139] In the next step ST8, the nozzle base 63 moves the second nozzle 60 from the central position P61 to the standby position P63 within a required time t8. The required time t8 is, for example, about a few seconds.

[0140] In the next step ST9, the nozzle base 68 moves the third nozzle 65 from the standby position P68 to the central upper position P69 within a required time t9. The required time t9 is, for example, about a few seconds.

[0141] In the next step ST10, the third nozzle 65 ejects the processing liquid onto the upper surface of the substrate W at a flow rate F65 for a required time t10. The required time t10 is, for example, about tens of seconds, and the flow rate F65 is, for example, several thousand cc / min. If the processing liquid ejected by the third nozzle 65 is a rinsing liquid, at the end of step ST7, the processing liquid remaining on the upper surface of the substrate W can be replaced with rinsing liquid.

[0142] In the next step ST11, the nozzle base 63 lowers the third nozzle 65 from the upper central position P69 to the central position P66 within a required time t11. The required time t11 is, for example, about several tens of seconds.

[0143] In the next step ST12, the nozzle base 63 moves the third nozzle 65 from the central position P66 to the standby position P68 within a required time t12. The required time t12 is, for example, about a few seconds.

[0144] Refer again Figure 6After the liquid treatment step (step S5) is completed, the processing unit 1 dries the substrate W (step S6: drying step). For example, the rotary motor 22 increases the rotational speed of the substrate W, thereby drying the substrate W (so-called rotary drying).

[0145] Next, the cup lifting mechanism lowers the processing cup 40 (step S7: cup lowering step).

[0146] Next, the rotary motor 22 ends the rotation of the rotary chuck 20 and the substrate W, and the rotary chuck 20 releases the substrate W from its holding position (step S8: holding release step). Specifically, the holding is released by moving the plurality of chuck pins 26 to their respective open positions.

[0147] Next, the main transport robot 103 removes the processed substrate W from the self-processing unit 1 (step S9: removal step).

[0148] As described above, the substrate W is processed.

[0149] <Surveillance>

[0150] The monitoring and processing unit 91 uses the camera 70 to monitor the interior of the chamber 10 to determine whether the substrate W is being processed appropriately. As can be understood from the following description, the objects monitored by the monitoring and processing unit 91 change sequentially according to the progress of the processing. Hereinafter, examples of the objects monitored within the chamber 10 will be described.

[0151] <Monitored Target>

[0152] <Nozzle position>

[0153] In the above-mentioned treatment liquid steps (refer to...) Figure 7 In step ST3, the first nozzle 30, the second nozzle 60, and the third nozzle 65 move appropriately. For example, the first nozzle 30 moves from the standby position P33 to the central position P31 in step ST2. However, there is a possibility that the first nozzle 30 may deviate from the central position P31 and stop due to a malfunction in the motor of the nozzle base 33. In such a case, the process in step ST3 may end inappropriately.

[0154] Therefore, the nozzle position can also be used as the monitoring object during the nozzle movement step (during). Figure 7 In the example, the steps of position monitoring processing, which involves monitoring the position of the nozzle, are schematically represented by diagonal shading. The following describes a specific example of position monitoring processing.

[0155] Figure 8 This is a diagram that roughly represents an example of image data acquired during the location monitoring process. Figure 8This represents an example of the captured image data obtained in step ST2. Figure 8 The captured image data contains the ejection head 31 of the first nozzle 30, which stops at the central position P31. That is, Figure 8 This refers to the image data acquired after the first nozzle 30 moves from the standby position P33 to the central position P31 in step ST2. This image data, in addition to the first nozzle 30, also includes the processing cup 40 located at the upper position, the substrate W located within the opening of the processing cup 40, and the fixed nozzle 80.

[0156] The monitoring processing unit 91 analyzes the captured image data acquired in step ST2 to detect the position of the first nozzle 30. For example, the monitoring processing unit 91 determines the position of the first nozzle 30 within the captured image data by performing pattern matching between reference image data RI1, which includes the first nozzle 30 (specifically, the ejector head 31), which is pre-stored in a storage medium, and the captured image data. It should be noted that in Figure 8 In the example, the image data RI1 is shown schematically with virtual lines superimposed on the captured image data.

[0157] Next, the monitoring and processing unit 91 determines whether the detected position of the first nozzle 30 is appropriate. For example, the monitoring and processing unit 91 determines whether the difference between the position of the first nozzle 30 and the preset center position P31 is below a predetermined nozzle position tolerance value. If the difference is below the nozzle position tolerance value, the monitoring and processing unit 91 determines that the first nozzle 30 is located at the center position P31. On the other hand, if the difference is greater than the nozzle position tolerance value, the monitoring and processing unit 91 determines that the first nozzle 30 is not located at the center position P31. That is, the monitoring and processing unit 91 determines that a nozzle position abnormality has occurred.

[0158] In the event of an anomaly, the monitoring and processing unit 91 can notify the anomaly via a notification unit (e.g., an indicator or speaker, not shown). Furthermore, the control unit 9 can also stop the operation of the processing unit 1, thereby interrupting the processing of the board W. It should be noted that this part is the same in all the monitoring and processing described below, so it will not be repeated here.

[0159] Furthermore, in step ST2, the first nozzle 30 moves from the standby position P33 to the central position P31. The monitoring processing unit 91 does not need to determine whether the position of the first nozzle 30 is appropriate during this movement. Therefore, the monitoring processing unit 91 can determine that the first nozzle 30 has stopped when its position is fixed in multiple consecutive captured image data. Then, the monitoring processing unit 91 can also determine whether the difference between the position of the stopped first nozzle 30 and the central position P31 is below the nozzle position tolerance value. That is, the monitoring processing unit 91 can determine whether the position of the first nozzle 30 is appropriate only after the position of the first nozzle 30 has stabilized.

[0160] exist Figure 7 In the example, in step ST3, similar to step ST2, the first nozzle 30 stops at the central position P31. In the consecutive steps ST2 and ST3, when the position of the first nozzle 30 does not change, the monitoring processing unit 91 does not need to perform position monitoring processing in step ST3. Figure 7 In the example, the monitoring processing unit 91 does not perform position monitoring processing in step ST3. Therefore, the execution of unnecessary position monitoring processing can be reduced, thereby reducing the processing burden on the monitoring processing unit 91.

[0161] In addition, Figure 7 In the example, in step ST4, the first nozzle 30 moves from the central position P31 to the peripheral position P32. Therefore, the monitoring processing unit 91 can also perform position monitoring processing in step ST4. Specifically, the monitoring processing unit 91 can also detect the position of the first nozzle 30 after stopping based on the captured image data, and determine whether the first nozzle 30 has stopped properly at the peripheral position P32. This determination of whether it is proper can also be performed in the same way as described above.

[0162] In addition, Figure 7 In the example, in step ST5, the first nozzle 30 moves from the peripheral position P32 to the standby position P33. However, in Figure 7 In this example, the monitoring processing unit 91 does not perform position monitoring processing in step ST5. That is, the monitoring processing unit 91 does not monitor the position of the first nozzle 30 with respect to the standby position P33. The reason for this is that even if the first nozzle 30 deviates from the standby position P33 and stops, the impact on the processing of the substrate W is minimal. Of course, the monitoring processing unit 91 may also perform position monitoring processing with respect to the standby position P33.

[0163] For the second nozzle 60 and the third nozzle 65, the monitoring and processing unit 91 can perform position monitoring and processing at least during the steps in which their positions change. Figure 7In the example, since the second nozzle 60 moves in steps ST6 and ST7, the monitoring processing unit 91 performs position monitoring processing to monitor the position of the second nozzle 60 in steps ST6 and ST7. Furthermore, in... Figure 7 In the example, since the third nozzle 65 moves in steps ST9 and ST11, the monitoring processing unit 91 performs position monitoring processing to monitor the position of the third nozzle 65 in steps ST9 and ST11.

[0164] It should be noted that, Yu Figure 7 In the example, during step ST8, when the second nozzle 60 moves to the standby position P63, and step ST12, when the third nozzle 65 moves to the standby position P68, the monitoring processing unit 91 does not perform position monitoring processing. Of course, position monitoring processing can also be performed in these steps.

[0165] <Treatment Fluid>

[0166] In the above-mentioned treatment liquid steps (refer to...) Figure 7 In this process, the first nozzle 30, the second nozzle 60, the third nozzle 65, and the fixed nozzle 80 appropriately dispense processing liquid. For example, the first nozzle 30 dispenses processing liquid onto the upper surface of the substrate W during the required time t3 in step ST3. At this time, by appropriately dispensing processing liquid through the first nozzle 30, processing of the substrate W can be performed.

[0167] Therefore, the state of the treatment fluid can also be used as the monitoring object during the process of each nozzle discharging the treatment fluid. Figure 7 In the example, the steps of monitoring the treatment fluid are schematically represented by sand-like shading. A specific example of treatment fluid monitoring will be described below.

[0168] <Discharge Time>

[0169] For example, if the actual dispensing time of the processing liquid from the first nozzle 30 in step ST3 deviates from the specified time, the processing in step ST3 may end inappropriately. Specifically, if the dispensing time is too short, the processing of the substrate W will be insufficient; if the dispensing time is too long, the processing of the substrate W will be excessive.

[0170] Therefore, the monitoring targets during the process of discharging the treatment fluid from each nozzle can be the start and stop times of the discharge, or even the discharge time itself. The following is a specific example of discharge time monitoring processing for monitoring the discharge time of the treatment fluid.

[0171] Figure 9 This is a diagram that roughly represents an example of the captured image data obtained during the ejection time monitoring process. Figure 9This represents an example of the image data acquired in step ST3. Figure 9 The captured image data contains the first nozzle 30 that discharges the processing liquid. That is, Figure 9 This refers to the image data acquired after the first nozzle 30 begins dispensing the treatment liquid in step ST3.

[0172] In step ST3, before the first nozzle 30 begins to discharge the treated liquid, the camera 70 sequentially acquires image data (e.g., images of the first nozzle 30 before the treated liquid is discharged) containing images of the first nozzle 30 before the treated liquid is discharged. Figure 8 If the treatment fluid begins to be ejected from the first nozzle 30, the camera 70 sequentially acquires image data containing the ejected treatment fluid from the first nozzle 30 (e.g., ...). Figure 9 Therefore, if it can be determined whether the first nozzle 30 is discharging treatment liquid for each sequentially acquired image data, the discharging start time of the first nozzle 30 can be determined based on the determination result.

[0173] Therefore, the monitoring and processing unit 91 determines whether the first nozzle 30 has dispensed processing fluid for each captured image data. Figure 8 and Figure 9 In the example, a dispensing determination region R1 is set in the captured image data. The dispensing determination region R1 includes a region extending from the front end of the first nozzle 30 (i.e., the front end of the dispensing head 31) in the dispensing direction. The dispensing determination region R1, for example, has a rectangular shape extending from the front end of the first nozzle 30 in the dispensing direction (here, the lower side).

[0174] pass Figure 8 and Figure 9 As can be understood from the comparison, the pixel values ​​in the discharge determination area R1 are not the same when the first nozzle 30 discharges the processing liquid and when the first nozzle 30 does not discharge the processing liquid. For example, the sum of the pixel values ​​in the discharge determination area R1 when the first nozzle 30 discharges the processing liquid is greater than the sum of the pixel values ​​in the discharge determination area R1 when the first nozzle 30 does not discharge the processing liquid.

[0175] Therefore, for each image data acquired in step ST3, the monitoring and processing unit 91 determines whether the first nozzle 30 has dispensed processing liquid based on the pixel values ​​of the dispensing determination area R1. Specifically, the monitoring and processing unit 91 determines whether the sum of the pixel values ​​within the dispensing determination area R1 is above a predetermined dispensing reference value, and if the sum is above the dispensing reference value, it determines that the first nozzle 30 has dispensed processing liquid. Conversely, if the sum does not reach the dispensing reference value, the monitoring and processing unit 91 determines that the first nozzle 30 has not dispensed processing liquid.

[0176] It should be noted that the determination of whether or not the processed liquid is dispensed based on the pixel values ​​within the dispensing determination area R1 is not limited to this, and various methods can be used. For example, the dispersion of pixel values ​​within the dispensing determination area R1 when the first nozzle 30 dispenses processed liquid is greater than the dispersion when the first nozzle 30 does not dispense processed liquid. Therefore, the monitoring and processing unit 91 can also calculate this dispersion and determine whether or not processed liquid is dispensed based on the magnitude of this dispersion. Alternatively, the standard deviation can be used instead of the dispersion.

[0177] The monitoring and processing unit 91 determines the start time point, for example, based on the acquisition time point of the image data of the first nozzle 30 not dispensing the treatment liquid and the acquisition time point of the image data of the first nozzle 30 dispensing the treatment liquid.

[0178] Similarly, the monitoring and processing unit 91 can also determine the end time point of the discharge of the processing liquid from the first nozzle 30.

[0179] Then, the monitoring and processing unit 91 calculates the difference between the dispensing stop time and the dispensing start time as the dispensing time. Next, the monitoring and processing unit 91 determines whether the dispensing time is appropriate. For example, the monitoring and processing unit 91 determines whether the difference between the dispensing time and the specified time is below the specified time tolerance. If the difference is below the time tolerance, the monitoring and processing unit 91 determines that the dispensing time is appropriate. Furthermore, if the difference is greater than the time tolerance, the monitoring and processing unit 91 determines that the dispensing time is inappropriate. That is, the monitoring and processing unit 91 determines that an abnormal dispensing time has occurred.

[0180] Furthermore, in the above-mentioned treatment liquid step (refer to...) Figure 7 In this process, since the second nozzle 60 and the third nozzle 65 also discharge the treatment liquid, the discharge time can be monitored at each step of the treatment liquid discharge. The discharge time monitoring process for the second nozzle 60 and the third nozzle 65 is the same as that for the first nozzle 30.

[0181] It should be noted that the fixed nozzle 80 discharges the treatment liquid in steps ST4 to ST6. Figure 7 In the example, although the monitoring and processing unit 91 performs processing fluid monitoring in step ST4, this processing fluid monitoring includes the droplet bouncing monitoring described later, but does not include the dispensing time monitoring for the fixed nozzle 80. Furthermore, in Figure 7 In the example, the monitoring and processing unit 91 does not perform monitoring of the processing liquid in steps ST5 and ST6. However, it is not limited to this, and the monitoring and processing unit 91 may also perform monitoring of the discharge time of the fixed nozzle 80 in steps ST4 to ST6.

[0182] Figure 10This is a diagram that roughly represents an example of the image data acquired in steps ST4 to ST6. Figure 10 The captured image data contains a fixed nozzle 80 that discharges the processing fluid. That is, Figure 10 This represents the image data acquired after the treatment liquid is ejected from the fixed nozzle 80.

[0183] exist Figures 8 to 10 In the example, a discharge determination region R11 is set to determine whether the processed liquid is discharged from the fixed nozzle 80. Since the fixed nozzle 80 discharges the processed liquid horizontally, the discharge determination region R11 has, for example, a rectangular shape extending laterally from the front end of the fixed nozzle 80. The discharge time monitoring process using the discharge determination region R11 is the same as the discharge time monitoring process using the discharge determination region R1.

[0184] <Droplet Bouncing>

[0185] In step ST3, due to various factors such as dispensing the processing liquid onto the upper surface of the substrate W at a flow rate greater than that of the flow rate F30, the processing liquid may bounce on the upper surface of the substrate W (so-called droplet bouncing). If such droplet bouncing occurs, the processing unit 1 cannot properly process the substrate W.

[0186] Therefore, the presence or absence of droplet bouncing in the treatment fluid can also be used as a monitoring object in the step of dispensing treatment fluid from each nozzle. The following is a specific example of droplet bouncing monitoring processing for monitoring the presence or absence of droplet bouncing.

[0187] Figure 11 This is a diagram that roughly represents an example of the image data acquired in step ST3. Figure 11 The captured image data shows droplet bouncing. For example... Figure 11 As illustrated, the processing liquid flowing from the first nozzle 30 bounces back on the upper surface of the substrate W, causing the processing liquid to bounce up in a crown-like shape surrounding its droplet location.

[0188] exist Figures 8 to 11 In the example, a droplet bouncing determination region R2 is defined in the captured image data. The droplet bouncing determination region R2 only needs to be defined as a region including a portion of the processing liquid that bounces off the upper surface of the substrate W. Since the processing liquid bounces around the droplet location, the droplet bouncing determination region R2 can, for example, be defined next to the ejection determination region R1. In the illustrated example, the droplet bouncing determination region R2 is separate from the ejection determination region R1, for example, located to the left of the ejection determination region R1. In the illustrated example, the droplet bouncing determination region R2 has a rectangular shape.

[0189] When droplet bouncing does not occur (e.g.) Figure 9) and when droplet bouncing occurs (e.g. Figure 11 The pixel values ​​within the droplet bouncing determination area R2 are not the same. For example, since light will diffusely scatter when it hits the processing liquid bouncing off the upper surface of the substrate W, the sum of the pixel values ​​in the droplet bouncing determination area R2 when droplet bouncing occurs will be greater than the sum of the pixel values ​​in the droplet bouncing determination area R2 when droplet bouncing does not occur.

[0190] Therefore, for each image data acquired in step ST3, the monitoring processing unit 91 determines whether droplet bouncing has occurred based on the pixel values ​​within the droplet bouncing determination area R2. Specifically, the monitoring processing unit 91 determines whether the sum of the pixel values ​​within the droplet bouncing determination area R2 is above a predetermined droplet bouncing reference value, and if the sum is below the reference value, it determines that droplet bouncing has not occurred. On the other hand, if the sum is above the reference value, the monitoring processing unit 91 determines that droplet bouncing has occurred. That is, the monitoring processing unit 91 determines that a droplet bouncing anomaly has occurred.

[0191] It should be noted that the determination of the presence or absence of droplet bouncing based on the pixel values ​​within the droplet bouncing determination area R2 is not limited to this, and various methods can be used. For example, since light will diffusely scatter when it shines on the processing liquid bouncing off the upper surface of the substrate W, the dispersion of pixel values ​​within the droplet bouncing determination area R2 when droplet bouncing occurs will be greater than the dispersion when droplet bouncing does not occur. Therefore, the monitoring processing unit 91 can also calculate this dispersion and determine the presence or absence of droplet bouncing based on the magnitude of this dispersion. It should be noted that standard deviation can also be used instead of dispersion.

[0192] Since the second nozzle 60, the third nozzle 65, and the fixed nozzle 80 also eject treatment liquid, the monitoring and processing unit 91 performs droplet bouncing monitoring processing during the step of each nozzle ejecting treatment liquid. It should be noted that because the fixed nozzle 80 ejects treatment liquid horizontally from its tip, droplet bouncing is more likely to occur on the opposite side of its landing position compared to the fixed nozzle 80. Figure 11 In the example, since the droplet bouncing determination area R2 is located on the opposite side of the fixed nozzle 80 relative to the droplet position, the detection of droplet bouncing caused by the discharge of the processing liquid from the fixed nozzle 80 can also be used.

[0193] exist Figure 7 In the example, for the fixed nozzle 80, although droplet bouncing monitoring is performed in step ST4, droplet bouncing monitoring can also be performed in steps ST5 and ST6.

[0194] <Drip>

[0195] When the discharge of the processing liquid from the first nozzle 30, the second nozzle 60, and the third nozzle 65 stops, there may be a situation where droplets of processing liquid fall from each discharge port (so-called dripping). If such droplets fall onto the upper surface of the substrate W, an malfunction may occur.

[0196] Therefore, the presence or absence of dripping can also be used as a monitoring object in the step of dispensing treatment liquid from each nozzle. The following is a specific example of drip monitoring treatment for monitoring the presence or absence of dripping.

[0197] Figure 12 This is a diagram that roughly represents an example of the captured image data obtained in step ST3. Figure 12 This refers to the image data acquired immediately after the first nozzle 30 stops discharging the treatment liquid, and in... Figure 12 In the example, dripping occurred.

[0198] pass Figure 8 , Figure 9 and Figure 12 The comparison is understandable when the first nozzle 30 does not discharge the treatment liquid ( Figure 8 When the first nozzle 30 discharges the treatment liquid ( Figure 9 ), and when dripping occurs ( Figure 12 The pixel values ​​within the discharge determination area R1 are not the same. For example, the sum of pixel values ​​within the discharge determination area R1 when dripping occurs will be less than the sum of pixel values ​​within the discharge determination area R1 when the first nozzle 30 discharges the treatment liquid, but greater than the sum of pixel values ​​within the discharge determination area R1 when the first nozzle 30 does not discharge the treatment liquid.

[0199] Therefore, for each image data acquired in step ST3, the monitoring and processing unit 91 determines whether dripping has occurred based on the pixel values ​​of the dispensing determination area R1. As a specific example, the monitoring and processing unit 91 may determine that the first nozzle 30 has dispensed processing liquid when the sum of the pixel values ​​in the dispensing determination area R1 is above a predetermined first reference value, and determine that a dripping abnormality has occurred when the sum of the pixel values ​​in the dispensing determination area R1 is below the first reference value but above a predetermined second reference value, and determine that the first nozzle 30 has not dispensed processing liquid when the sum of the pixel values ​​in the dispensing determination area R1 is below the second reference value.

[0200] It should be noted that the determination of the presence or absence of dripping based on the pixel values ​​within the discharge determination area R1 is not limited to this, and various methods can be used. For example, the presence or absence of dripping can also be determined based on the dispersion or standard deviation within the discharge determination area R1.

[0201] <Leaked>

[0202] Even though the processing control unit 93 has output a shut-off signal to each valve, there may be instances where each valve is slightly open due to malfunctions. In such cases, the discharge of the processing liquid cannot be properly stopped, and the processing liquid will continue to flow out of the nozzle (so-called outflow). In this situation, since the processing liquid is continuously discharged onto the upper surface of the substrate W, processing defects may occur.

[0203] Therefore, the presence or absence of outflow can also be used as the monitoring object in the step of discharging treatment fluid from each nozzle. The following is a specific example of outflow monitoring treatment for monitoring the presence or absence of outflow.

[0204] As described above, outflow is an anomaly where the processed liquid is still being ejected from the nozzle even when the valve has been given a closed signal. Since the valve is controlled by the processing control unit 93, the monitoring processing unit 91 can identify whether the valve has been given a closed signal. Furthermore, as described in the ejection time monitoring processing, the monitoring processing unit 91 can determine whether the processed liquid is being ejected from the nozzle based on captured image data.

[0205] For example, if the monitoring and processing unit 91 determines that the first nozzle 30 is discharging processing liquid even though the processing control unit 93 outputs a closing signal to the valve 35, then it determines that the first nozzle 30 has an abnormal flow. The same applies to the second nozzle 60 and the third nozzle 65.

[0206] <Filming Conditions>

[0207] As described above, the monitored object varies depending on the steps specified for the treatment process (step S5). Figure 7 In this process, the monitored object, for example, is the position of the first nozzle 30 during the execution of step ST2, while during the execution of step ST3, it is the change in the state (shape) of the processed liquid ejected from the first nozzle 30 (e.g., the start of ejection, the stop of ejection, droplet bouncing, dripping, and flowing out). That is, during the execution of step ST2, the change in the state of the processed liquid is not the monitored object, but the position of the nozzle; while during the execution of step ST3, the position of the nozzle is not the monitored object, but the ejection state of the processed liquid is the monitored object. Furthermore, there are also cases, as during the execution of step ST7, where both the position of the nozzle and the change in the state of the processed liquid are monitored.

[0208] In this embodiment, the condition setting unit 92 sets the shooting conditions according to the monitored object during each execution period. Hereinafter, as a specific example, the shooting conditions for the execution period in which the nozzle position is set as the monitored object (e.g., step ST2) and the shooting conditions for the execution period in which the state change of the treatment liquid is set as the monitored object (e.g., step ST3) will be explained first, and then the shooting conditions for the execution period in which both the nozzle position and the state change of the treatment liquid are set as the monitored object (e.g., step ST7) will be explained.

[0209] <Nozzle position monitoring and processing>

[0210] The higher the resolution of the captured image data, the more finely and clearly the shapes of each nozzle within the captured image data are displayed. Therefore, if the camera 70 acquires captured image data for position monitoring processing at a high resolution, the monitoring processing unit 91 can detect the position of the nozzle with higher accuracy based on the captured image data.

[0211] Therefore, the condition setting unit 92 sets the resolution to high resolution as the shooting condition when the camera 70 acquires image data for position monitoring processing. Specifically, as the shooting condition in steps ST2, ST4, ST6, ST7, ST9, and ST11, the condition setting unit 92 sets the resolution to a higher resolution (see also...). Figure 7 ).

[0212] On the other hand, even at a low frame rate for capturing image data, position monitoring processing is unlikely to encounter problems. That is, since the stopping position of the nozzle is monitored, position monitoring processing will not have problems even at a low frame rate. Furthermore, even when monitoring the time-varying changes in the nozzle position, if the necessity for detecting the nozzle position at short time intervals is not high, it is acceptable to set the frame rate to a low level.

[0213] However, a higher frame rate is preferable when performing liquid monitoring. This will be discussed in detail later.

[0214] Therefore, as the shooting conditions during the execution of steps ST2, ST6, ST9, and ST11, the condition setting unit 92 sets the resolution to high resolution and the frame rate to low frame rate. In simpler terms, the condition setting unit 92 sets the resolution to high resolution and the frame rate to low frame rate for shooting image data that is used for position monitoring processing instead of processing fluid monitoring processing. In other words, the condition setting unit 92 sets the resolution to high resolution and the frame rate to low frame rate for shooting conditions during a period where the nozzle position is monitored instead of changes in the state of the processing fluid.

[0215] The condition setting unit 92 notifies the camera 70 of the set shooting conditions. The camera 70 acquires shooting image data according to the received shooting conditions. That is, in steps ST2, ST6, ST9 and ST11, the camera 70 acquires shooting image data at high resolution and low frame rate.

[0216] Resolution can be changed, for example, through the binning function of the camera 70. The binning function changes the number of photosensitive elements read out as a single pixel from among the multiple photosensitive elements of the camera 70. For example, consider a case where the photosensitive surface of the camera 70 consists of Nx (e.g., 2448) vertically × Ny (e.g., 2048) horizontally photosensitive elements. The camera 70 reads out the data of each photosensitive element as a single pixel, thereby acquiring image data with Nx vertically × Ny horizontally pixels. Furthermore, the camera 70, for example, reads out the data of a total of four photosensitive elements (2 vertically × 2 horizontally) as a single pixel, thereby acquiring image data with Nx / 2 vertically (e.g., 1224) × Ny / 2 horizontally (e.g., 1024) pixels. Since the field of view of the image data does not change, the resolution of the image data can be reduced.

[0217] The frame rate can be changed, for example, by changing the period at which the camera shutter (electronic or mechanical shutter) 70 is opened. A high frame rate is, for example, 100 fps (frames per second), while a low frame rate is, for example, 30 fps.

[0218] In steps ST2, ST6, ST9, and ST11, since the camera 70 acquires images at high resolution and low frame rate, the monitoring processing unit 91 performs position monitoring processing based on the high-resolution and low-frame-rate image data. Because high-resolution image data is used, the monitoring processing unit 91 can detect the nozzle position with high accuracy. On the other hand, because low-frame-rate image data is used, the processing burden on the monitoring processing unit 91 is reduced. Therefore, power consumption is reduced.

[0219] <Processing Fluid Monitoring and Treatment>

[0220] The higher the frame rate of the captured image data, the shorter the time interval at which the camera 70 can acquire the captured image data. Therefore, the state changes of the processed liquid ejected from each nozzle can be easily displayed in these multiple captured image data. For example, the higher the frame rate, the easier it is to capture the change from a state of not ejected processed liquid to a state of ejected processed liquid. Therefore, the higher the frame rate, the more accurately the monitoring and processing unit 91 can monitor the start time of processed liquid ejection. The same applies to the stop time of processed liquid ejection. Furthermore, the monitoring and processing unit 91 can calculate the processing time with even higher accuracy.

[0221] Furthermore, since a higher frame rate allows for the acquisition of captured image data at shorter time intervals, even phenomena with short durations can be included in the captured image data. For example, even in cases where droplet bouncing occurs instantaneously due to a sudden increase in the discharge flow rate of the processing liquid caused by flow rate fluctuations, a higher frame rate allows the camera 70 to acquire captured image data including the droplet bouncing.

[0222] Furthermore, dripping occurs when the discharge of the processing liquid stops, and its occurrence period is not very long. In addition, the occurrence period of outflow may also be shorter depending on the degree of valve malfunction. If the frame rate is high, even if dripping or outflow occurs momentarily, the camera 70 can still acquire image data containing the dripping or outflow.

[0223] Therefore, the condition setting unit 92 sets the frame rate to a high frame rate for the shooting conditions in steps ST3, ST4, ST7, and ST10. In simpler terms, the condition setting unit 92 sets the frame rate to a high frame rate for the shooting conditions when the camera 70 acquires image data for monitoring the processing fluid.

[0224] On the other hand, even with low-resolution image data, changes in the state of the processing fluid can still be detected. Therefore, the condition setting unit 92 sets the resolution to low and the frame rate to high for the shooting conditions in steps ST3 and ST10. In simpler terms, the condition setting unit 92 sets the resolution to low and the frame rate to high for the shooting conditions of image data used for processing fluid monitoring processing instead of position monitoring processing. In other words, the condition setting unit 92 sets the resolution to low and the frame rate to high for the shooting conditions during the period when the state changes of the processing fluid are monitored but not the nozzle position.

[0225] The condition setting unit 92 notifies the camera 70 of the set shooting conditions. The camera 70 acquires image data according to the received shooting conditions. Therefore, the monitoring processing unit 91 performs liquid monitoring processing based on the image data acquired at low resolution and high frame rate in each step ST3 and ST10. Therefore, by using high frame rate image data, the monitoring processing unit 91 can monitor the dispensing start time, dispensing stop time, droplet bouncing, dripping, and flowing out with higher accuracy. In addition, by using low resolution image data, the processing burden on the monitoring processing unit 91 can be reduced. Therefore, power consumption can be reduced.

[0226] <Parallel Implementation of Location Monitoring and Processing Fluid Monitoring>

[0227] The condition setting unit 92 sets the resolution to high resolution and the frame rate to a higher frame rate as the shooting conditions in steps ST4 and ST7. In simpler terms, the condition setting unit 92 sets the resolution to high resolution and the frame rate to a high frame rate for the shooting conditions used to capture image data for both position monitoring processing and processing fluid monitoring processing. In other words, the condition setting unit 92 sets the resolution to high resolution and the frame rate to a high frame rate for the shooting conditions during the period when both the nozzle position and the state changes of the processing fluid are monitored.

[0228] The condition setting unit 92 notifies the camera 70 of the set shooting conditions. The camera 70 acquires image data according to the received shooting conditions. Therefore, the monitoring processing unit 91 performs both position monitoring processing and fluid monitoring processing based on the image data acquired at high resolution and high frame rate in each step ST4 and ST7. Thus, position monitoring processing and fluid monitoring processing can be performed with higher accuracy.

[0229] <Process Information>

[0230] For example, upstream equipment or operators input process information (including each step and conditions within each step) indicating the substrate processing procedure to the control unit 9. The processing control unit 93 controls the processing unit 1 based on this process information, thereby enabling processing of the substrate W. The process information may also include, for example, […]. Figure 7 The information includes "step", "time", "output flow rate" and "location". In this case, the condition setting unit 92 determines the monitoring object in each step based on the process information, sets the shooting conditions as described above based on the monitoring object, and notifies the camera 70 of the shooting conditions.

[0231] As a specific example, the condition setting unit 92 determines the nozzle movement step based on the "position" information included in the process information, and uses the nozzle position as the monitoring object in that step. Furthermore, the condition setting unit 92 determines the nozzle dispensing the processing liquid step based on the "dispensing flow rate" information included in the process information, and uses the state change of the processing liquid as the monitoring object in that step. Then, as described above, the condition setting unit 92 sets the shooting conditions during the execution period of each step based on the monitoring objects in each step.

[0232] It should be noted that the condition setting unit 92 does not necessarily need to determine the monitoring object in each step based on the process information. The processing procedure and the information of the monitoring object can also be input to the control unit 9 via upstream devices or operators. Therefore, by reading this information, the condition setting unit 92 can determine the monitoring object in each step and set the shooting conditions corresponding to that monitoring object.

[0233] <Overall monitoring process>

[0234] Figure 13 This is a flowchart illustrating an example of the overall process of the aforementioned monitoring procedure. The condition setting unit 92 determines the monitoring object for each step from a plurality of monitoring object candidates based on the processing procedure (e.g., process information), and sets the imaging conditions for each step based on the monitoring object (step S11: condition setting step). The monitoring object candidates referred to here are previously determined monitoring objects, such as the nozzle position, the start time of liquid discharge, the stop time of discharge, droplet bouncing, dripping, and flowing out.

[0235] The camera 70 acquires image data sequentially according to the shooting conditions set by the condition setting unit 92 (step S12: shooting step). Therefore, the camera 70 acquires image data according to the shooting conditions corresponding to the monitored object in each step.

[0236] The monitoring processing unit 91 performs monitoring processing on the monitored object in each step based on the captured image data captured under the shooting conditions corresponding to the monitored object (step S13: monitoring step).

[0237] It should be noted that the imaging and monitoring steps can be performed in parallel with the processing of the substrate W. Therefore, monitoring can be performed during the processing of the substrate W. The condition setting step can either pre-set the imaging conditions for all steps before processing the substrate W, or set the imaging conditions for each step sequentially as the processing of the substrate W progresses.

[0238] <Effects of the Implementation Method>

[0239] As described above, the condition setting unit 92 sets the shooting conditions corresponding to the monitored object and notifies the camera 70 of these shooting conditions. Since the camera 70 acquires image data according to the notified shooting conditions, it is able to acquire image data according to the shooting conditions corresponding to the monitored object.

[0240] For example, during the execution of the step where the nozzle position is monitored instead of the state change of the processing fluid, the camera 70 acquires image data at high resolution and low frame rate. Therefore, the monitoring processing unit 91 performs position monitoring processing based on the high-resolution, low-frame-rate image data. Thus, the nozzle position can be monitored with high accuracy based on the high-resolution image data, while the processing load is reduced by using a low frame rate.

[0241] Furthermore, for example, during the execution of a step where the state change of the processing fluid is monitored instead of the nozzle position, the camera 70 acquires image data at low resolution and high frame rate. Therefore, the monitoring processing unit 91 performs processing fluid monitoring processing based on the low-resolution, high-frame-rate image data. Thus, while monitoring the state change of the processing fluid with high accuracy based on the high-frame-rate image data, the processing burden is reduced by using low resolution.

[0242] Furthermore, during the execution of the step of monitoring both the nozzle position and the state change of the processing fluid, the camera 70 acquires image data at high resolution and high frame rate. Therefore, the monitoring processing unit 91 can perform position monitoring processing and processing fluid monitoring processing with high accuracy.

[0243] <Another example of a monitored object>

[0244] It should be noted that the monitored object is not limited to the specific example described above; it can be any other monitored object within chamber 10. In short, the condition setting unit 92 can change the shooting conditions sequentially according to the changes in the monitored object, regardless of the type of monitored object. Other specific examples of monitored objects will be described below.

[0245] <Abnormalities in retention and substrate shape>

[0246] In the holding step (step S2), the rotary chuck 20 holds the substrate W. At this time, there is a possibility that the rotary chuck 20 cannot hold the substrate W in a proper posture. For example, while the rotary chuck 20 is holding the substrate W, the contact position between any of the chuck pins 26 and the periphery of the substrate W may deviate in the vertical direction. In this case, the substrate W will be held in an tilted posture. If the deviation is large, the substrate W may end up resting against the chuck pins 26. Hereinafter, the abnormality in which the rotary chuck 20 cannot hold the substrate W in a horizontal posture will be referred to as a holding abnormality. If such a holding abnormality occurs, the substrate W cannot be properly processed.

[0247] Furthermore, there are also cases where the shape of the substrate W becomes abnormal. For example, if the substrate W cracks at its periphery, a step will be created at the cracked portion, and the periphery of the substrate W cannot be rounded. Similarly, if a notch is found in a portion of the periphery of the substrate W, the periphery also cannot be rounded. In such cases, the rotary chuck 20 is highly likely to be unable to hold the substrate W in a horizontal position. Hereinafter, abnormalities such as cracks in the substrate W will be referred to as shape abnormalities. If such shape abnormalities occur, the substrate W cannot be properly processed.

[0248] Therefore, the presence or absence of holding abnormalities and substrate shape abnormalities can also be used as monitoring targets. Below, an example of substrate monitoring processing for monitoring the presence or absence of holding abnormalities and substrate shape abnormalities will be described.

[0249] Figures 14 to 16 This is a diagram that roughly represents an example of the image data acquired during the rotation step. Figures 14 to 16 This refers to the image data acquired before the cup 40 rises. That is, Figures 14 to 16 This represents the image data captured during the steps from the start of the rotation step (step S3) to the cup rising step (step S4). Figure 14 This indicates that the rotating chuck 20 holds the substrate W in a horizontal position. Figure 15 This indicates that the rotating chuck 20 holds the substrate W in an inclined position, while Figure 16 This indicates that the substrate W has cracked. It should be noted that although the chuck pin 26 holding the substrate W can be included in the captured image data, it is not... Figures 14 to 16 In order to avoid making the illustrations too complicated, some parts can be omitted.

[0250] The rotating chuck 20 holds the substrate W in a horizontal position. When the substrate W is rotated, it is best that the peripheral (outline) shape of the substrate W is generally fixed. It should be noted that in the illustrated example, because the camera 70 is tilted when taking pictures of the substrate W, the peripheral shape of the substrate W in the captured image data has an elliptical shape. Ideally, the peripheral shape of the substrate W should remain fixed in multiple sequentially acquired image data during the rotation of the substrate W. However, in reality, the peripheral position of the substrate W will slightly oscillate during the rotation of the substrate W.

[0251] On the other hand, when the rotating chuck 20 holds the substrate W in an inclined position, the rotation axis CX of the rotating chuck 20 is not orthogonal to the substrate W. Therefore, if the rotating chuck 20 rotates the substrate W, the peripheral shape of the substrate W will vary considerably across multiple captured image data. That is, the peripheral edge of the substrate W swings significantly. Figure 15 In the example, the periphery of the substrate W, acquired at different time points, is schematically shown with virtual lines.

[0252] Furthermore, when a crack occurs at the periphery of substrate W, the shape of the periphery of substrate W will deviate significantly from an elliptical shape. Figure 16 In the example, a step difference occurs at the periphery of the substrate W due to a crack. In this case, if the chuck 20 is rotated to rotate the substrate W, the position of the periphery of the substrate W will also vary relatively greatly in multiple captured image data. That is, the periphery of the substrate W swings significantly.

[0253] Therefore, the monitoring processing unit 91 calculates the difference in the peripheral shape of the substrate W between multiple image data acquired sequentially by the camera 70, and determines whether the difference is below a predetermined substrate tolerance value. If the difference is below the substrate tolerance value, the monitoring processing unit 91 determines that the substrate W is being held normally in a horizontal position by the rotating chuck 20; if the difference is greater than the substrate tolerance value, it determines that a holding abnormality or a substrate shape abnormality has occurred.

[0254] It should be noted that the monitoring processing unit 91 does not need to compare the entire peripheral shape of the substrate W between captured image data. For example, it is sufficient to compare the shape of a portion of the periphery of the substrate W near the front or the inner side between captured image data. Figures 14 to 16 In the example, a substrate determination area R3 is set in the captured image data. Figures 14 to 16 In the example, the substrate determination region R3 is a region that includes a portion of the periphery of the substrate W near the front side, and has a shape that extends along the periphery of the substrate W.

[0255] The monitoring processing unit 91, for example, extracts a substrate determination region R3 from the captured image data and calculates the difference between the substrate determination regions R3 of the two captured image data to obtain a difference image. Specifically, the monitoring processing unit 91 subtracts the pixel values ​​of pixels at the same position within the substrate determination region R3 to obtain a difference image. Through this subtraction, the pixel values ​​of the identical first regions within the substrate determination region R3 are canceled out, while the pixel values ​​of the dissimilar second regions are emphasized. That is, the absolute value of the pixel value of the pixel in the second region becomes larger than the absolute value of the pixel value of the pixel in the first region. Therefore, in the difference image, the region sandwiched between the peripheries of the substrate W within the two substrate determination regions R3 (hereinafter referred to as the periphery difference) is emphasized.

[0256] Secondly, the monitoring processing unit 91 performs edge acquisition processing on the differential image, such as the Canny Edge Detection algorithm, to acquire the edge image. Figure 17 and Figure 18 This is a diagram that roughly represents an example of an edge image. Figure 17 This represents the edge image when the rotating chuck 20 holds the substrate W in a horizontal position, while Figure 18 This image shows the edge of the substrate W held in a tilted position by the rotating chuck 20. Figure 17 and Figure 18 In the example, edge 201 is equivalent to the perimeter difference. It should be noted that... Figure 17 and Figure 18 It can be understood that although the edge image contains multiple edges, the longest edge 201, which extends in an arc shape, is equivalent to the perimeter difference.

[0257] since Figure 17 and Figure 18 It can be understood that the circumferential length of the edge 201 when the substrate W is held in a normal horizontal position becomes shorter than the circumferential length of the edge 201 when it is held abnormally. This may be because, due to the greater vertical sway of the periphery of the substrate W when it is held abnormally, the position of the periphery of the substrate W will change vertically over a wider range in the circumferential direction. Since the vertical change of the periphery of the substrate W also increases when the substrate W cracks, the circumferential length of the edge 201 will also increase.

[0258] Therefore, the monitoring and processing unit 91 calculates the circumferential length of the edge 201 from the edge image, determines whether the length is below a predetermined substrate reference value, and determines that the substrate W is being held normally in a horizontal position by the rotating chuck 20 when the length is below the substrate reference value. On the other hand, if the length is longer than the substrate reference value, the monitoring and processing unit 91 determines that a holding abnormality or a substrate shape abnormality has occurred.

[0259] Therefore, in the substrate monitoring process, which monitors for the presence or absence of holding abnormalities and substrate shape abnormalities, it is necessary to detect the position of the periphery of the substrate W. Therefore, the condition setting unit 92 preferably sets the resolution to high for the image data captured as used in the substrate monitoring process. In other words, the condition setting unit 92 sets the resolution to high for the imaging conditions during the rotation of the substrate W before the processing cup 40 rises. Therefore, the monitoring processing unit 91 can detect holding abnormalities or substrate shape abnormalities with higher accuracy.

[0260] On the other hand, in substrate monitoring processing, although differential images between multiple captured image data are acquired, abnormal holding or substrate shape abnormalities can still be detected even if the frame rate is not set high. Therefore, the condition setting unit 92 can also set the frame rate to a low frame rate as the capturing condition for the captured image data used in substrate monitoring processing. In other words, the condition setting unit 92 can also set the frame rate to a low frame rate as the capturing condition during the rotation of the substrate W before the processing cup 40 rises. Therefore, the processing burden of the monitoring processing unit 91 can be reduced.

[0261] It should be noted that when a substrate shape abnormality occurs, the swaying around the periphery of the substrate W increases, so even if the resolution is set to low, there is still a possibility that the substrate shape abnormality can be detected. Therefore, when the substrate shape abnormality is set as the monitoring object instead of the holding abnormality, the condition setting unit 92 can also set the resolution to low.

[0262] Furthermore, the presence or absence of holding abnormalities or substrate shape abnormalities does not necessarily need to be monitored during the substrate's rotation before the processing cup 40 rises. Holding abnormalities or substrate shape abnormalities can be monitored as long as the camera 70 can capture images of the periphery of the rotating substrate W.

[0263] <Eccentricity Anomaly>

[0264] In the holding step (step S2), when the rotary chuck 20 holds the substrate W, there is a situation where the substrate W deviates from the rotary chuck 20 when viewed from above. If the center of the substrate W deviates from the rotation axis CX of the rotary chuck 20 by more than a predetermined eccentricity tolerance value, the substrate W will not rotate properly in the rotation step (step S3). Hereinafter, the abnormality in which the center of the substrate W deviates from the rotation axis CX by more than the eccentricity tolerance value is referred to as an eccentricity abnormality. When such an eccentricity abnormality occurs, there is a situation where the substrate W cannot be properly handled.

[0265] Therefore, the eccentricity anomaly of the substrate W can also be used as the monitoring object. The following is a specific example of an eccentricity monitoring process for monitoring the presence or absence of eccentricity anomalies in the substrate W.

[0266] Figure 19 This is a diagram that roughly represents an example of the image data acquired during the rotation step. Figure 19 This refers to the image data acquired before the cup 40 is raised. That is, Figure 19 This represents the image data captured during the steps from the start of the rotation step (step S3) to the cup rising step (step S4). Figure 19 This indicates a state of eccentricity. If substrate W is eccentric, the position of its periphery will change accordingly to the rotational position of substrate W. For example, in the captured image data, the periphery of substrate W has an elliptical shape, and the point P1 where its major axis intersects the periphery of substrate W corresponds to the rotational position of substrate W and changes laterally. Figure 19 In the example, the substrate W is schematically represented by virtual lines at different time points.

[0267] Figure 20 This is a graph illustrating an example of the relationship between point P1 and the rotation angle θ of substrate W. For example... Figure 20 As shown, point P1 changes in a sinusoidal wave pattern with the rotation angle θ as the variable. Figure 20The lateral position of point P1 is shown as in Figure 19 The larger the center is when it is on the right. The rotation angle θ1 when point P1 is at its maximum represents the eccentricity direction of substrate W, while the amplitude A1 of point P1 represents the eccentricity between substrate W and the rotation axis CX.

[0268] Therefore, firstly, the monitoring processing unit 91 detects the position of point P1 among each of the multiple captured image data. For example, the monitoring processing unit 91 may also perform edge acquisition processing on each captured image data to acquire an edge image, determine the elliptical edge with an elliptical shape from the edge image, and determine the rightmost point of the elliptical edge as point P1. Alternatively, the monitoring processing unit 91 may also calculate the elliptical approximation line closest to the elliptical edge using, for example, the least squares method, and calculate the intersection point of the major axis of the elliptical approximation line and the elliptical approximation line as point P.

[0269] Next, the monitoring processing unit 91 performs curve interpolation processing, such as spline interpolation, on the rotation angle θ of the substrate W at each acquisition time point of the captured image data by the camera 70 and the point P1 in each captured image data to calculate the sine wave VL1 of point P1. Then, the monitoring processing unit 91 calculates the amplitude A1 (eccentricity) and the rotation angle θ1 (eccentricity direction) based on the sine wave VL1.

[0270] The monitoring and processing unit 91 determines whether the eccentricity is below the allowable eccentricity value, and if it determines that the eccentricity is below the allowable eccentricity value, it determines that no eccentricity abnormality has occurred. On the other hand, if the eccentricity is greater than the allowable eccentricity value, the monitoring and processing unit 91 determines that an eccentricity abnormality has occurred.

[0271] In this eccentricity monitoring process, the higher the resolution of the captured image data, the more accurately the position of point P1 can be detected. Therefore, the condition setting unit 92 sets the resolution to high resolution as the capturing condition for the captured image data used in the eccentricity monitoring process. In other words, the condition setting unit 92 sets the resolution to high resolution as the capturing condition during the rotation of the substrate W before the processing cup 40 rises. Therefore, the monitoring processing unit 91 can detect eccentricity anomalies with higher accuracy.

[0272] On the other hand, in eccentric monitoring processing, as long as there are multiple depiction points for point P1 during one rotation of the substrate W, a high frame rate is not necessarily required. Furthermore, even when the number of depiction points is large, there is no need to increase the frame rate if the rotation speed of the substrate W is set to a low value. Therefore, the condition setting unit 92 can also set the frame rate to a low frame rate as the shooting condition for the image data used in eccentric monitoring processing. In other words, the condition setting unit 92 can also set the frame rate to a low frame rate as the shooting condition during the rotation of the substrate W before the processing cup 40 rises. Therefore, the processing burden on the monitoring processing unit 91 can be reduced.

[0273] <Placement of substrate W>

[0274] In the loading step (step S1), the main transport robot 103 loads the substrate W into the processing unit 1. For example, the main transport robot 103 first moves the substrate W to the space above the rotary chuck 20. Next, the main transport robot 103 lowers the substrate W and hands it over to the rotary chuck 20. If this handover position (loading position) deviates when viewed from above, it may cause abnormal eccentricity of the substrate W. Hereinafter, the situation where the loading position deviates beyond the specified loading tolerance value is referred to as loading abnormality.

[0275] Therefore, the presence or absence of abnormalities in the loading of substrate W can also be used as a monitoring target. The following is a specific example of a loading monitoring process for monitoring whether there are any abnormalities in the loading position of substrate W.

[0276] During the loading step, the camera 70 sequentially acquires images. The monitoring processing unit 91 detects the position of the center of the substrate W as the loading position based on the acquired image data. For example, as described above, the monitoring processing unit 91 can also acquire an edge image from the acquired image data, determine the elliptical edge from the edge image, and then calculate an approximate elliptical line from the elliptical edge. The monitoring processing unit 91 calculates the center of this approximate elliptical line as the position of the center of the substrate W. For example, the monitoring processing unit 91 can also determine that the substrate W has been handed over to the rotary chuck 20 when the center position of the substrate W is fixed in multiple acquired image data, and determine the center position of the substrate W as the loading position. The monitoring processing unit 91 determines whether the difference between this loading position and a predetermined reference loading position is below a predetermined loading tolerance value, and if the difference is below the loading tolerance value, it determines that no loading abnormality has occurred. On the other hand, if the difference is greater than the loading tolerance value, the monitoring processing unit 91 determines that a loading abnormality has occurred.

[0277] The higher the resolution of the captured image data, the more accurately the monitoring processing unit 91 can detect the center position of the substrate W. Therefore, the condition setting unit 92 sets the resolution to high resolution as the capture condition for the captured image data used in the loading monitoring processing. In other words, the condition setting unit 92 sets the resolution to high resolution as the capture condition during the execution of the loading step. Therefore, the monitoring processing unit 91 can detect loading abnormalities with higher accuracy.

[0278] On the other hand, the data transfer monitoring process does not require a high frame rate. Therefore, the condition setting unit 92 can also set the frame rate to a low frame rate for the shooting conditions of the captured image data used in the data transfer monitoring process. In other words, the condition setting unit 92 can also set the frame rate to a low frame rate as the shooting conditions during the execution of the data transfer step. Therefore, the processing burden of the monitoring processing unit 91 can be reduced.

[0279] <Handling Cup Abnormalities>

[0280] In the cup-raising step (step S4), there is a possibility that the processing cup 40 may rise improperly due to an abnormality in the cup lifting mechanism. That is, there is a possibility that the processing cup 40 stops in a state that deviates from the predetermined upper position. In this case, there is a possibility that the processing liquid that has spilled from the periphery of the substrate W cannot be properly recovered. Hereinafter, the abnormality of the processing cup 40 deviating from the predetermined cup reference position by more than the predetermined cup tolerance value is referred to as cup position abnormality.

[0281] Furthermore, there are also cases where the processing cup 40 has an abnormal shape. For example, the processing cup 40 may be deformed. In such cases, when the processing cup 40 has an abnormal shape, there is a possibility that the recovery of the processing liquid may be incomplete. Hereinafter, the abnormal shape of the processing cup 40 will be referred to as cup shape abnormality.

[0282] Therefore, the presence or absence of abnormal cup position and cup shape can also be used as monitoring objects. The following describes a specific example of cup monitoring processing to monitor the presence or absence of abnormal cup position and cup shape.

[0283] During the cup-raising step (step S4), the camera 70 acquires captured image data. The monitoring processing unit 91 detects the position of the processing cup 40 based on the captured image data. For example, the monitoring processing unit 91 detects the position of the processing cup 40 by matching the pattern of the captured image data with the reference image data obtained from capturing a normal processing cup 40.

[0284] Since the processing cup 40 moves during the cup-rising step (step S4), the monitoring processing unit 91 determines whether the position of the processing cup 40 is appropriate after the processing cup 40 stops. More specifically, if the position of the processing cup 40 is within a specified range in the multiple captured image data, the monitoring processing unit 91 determines that the processing cup 40 has stopped and determines whether the position of the processing cup 40 is appropriate. For example, the monitoring processing unit 91 determines whether the difference between the position of the processing cup 40 and the cup reference position is below a specified cup position tolerance value, and if the difference is below the cup position tolerance value, it determines that no cup position abnormality has occurred. On the other hand, if the difference is greater than the cup position tolerance value, the monitoring processing unit 91 determines that a cup position abnormality has occurred.

[0285] Next, the issue of cup shape abnormalities will be described. When a cup shape abnormality occurs, the difference between the area containing the processed cup 40 in the captured image data and the reference image data containing a normal processed cup 40 stopped in its normal position will increase. Therefore, for example, the monitoring processing unit 91 calculates the difference between the reference image data and the captured image data to obtain a difference image. Next, the monitoring processing unit 91 performs binarization processing on the difference image to obtain a binarized image. In the binarized image, the absolute values ​​of the pixel values ​​in the portions where the captured image data and the reference image data differ will increase. The monitoring processing unit 91, for example, calculates the area of ​​the portion with the larger pixel value and determines whether this area is below a predetermined cup shape tolerance value. If the area is below the cup shape tolerance value, the monitoring processing unit 91 determines that no cup shape abnormality has occurred; if the area is greater than the cup shape tolerance value, it determines that the processed cup 40 has experienced a cup shape abnormality.

[0286] The higher the resolution of the captured image data, the more accurately the position of the processing cup 40 and the aforementioned differences can be detected. Therefore, the condition setting unit 92 sets the resolution to high for the captured image data used in the cup monitoring process. In other words, the condition setting unit 92 sets the resolution to high for the captured images during the execution of the cup rising step. Therefore, the monitoring processing unit 91 can monitor for the presence or absence of cup position abnormalities and cup shape abnormalities with high accuracy.

[0287] On the other hand, a high frame rate is not necessarily required for monitoring the cup 40. Therefore, the condition setting unit 92 can also set the frame rate to a low frame rate as a condition for capturing image data used in the cup monitoring process. In other words, the condition setting unit 92 can also set the frame rate to a low frame rate as a condition for capturing images during the cup rising step. Therefore, the processing burden on the monitoring processing unit 91 can be reduced.

[0288] It should be noted that the cup monitoring process can be performed not only in the cup rising step (step S4) but also in the cup falling step (step S7).

[0289] Furthermore, regarding the processing cup 40, not only its position but also its shape is monitored. Similarly, regarding the nozzle, not only its position but also its shape is monitored. That is, the monitoring processing unit 91 can also monitor whether there are any abnormalities in the shape of the nozzle.

[0290] <Shooting conditions corresponding to position and shape monitoring and time-varying change monitoring>

[0291] Figure 21 This is a table representing the shooting conditions corresponding to the aforementioned monitored objects. For example... Figure 21 As illustrated, the resolution of the captured image data used in monitoring processes related to nozzle position and shape abnormalities, substrate holding abnormalities, shape abnormalities, loading abnormalities and eccentricity abnormalities, and processing cup position and shape abnormalities is set to high resolution. In simpler terms, when the position or shape of an object within the chamber 10 is the monitoring target, the condition setting unit 92 sets the resolution to high resolution.

[0292] Therefore, the monitoring processing unit 91 can monitor the position or shape of an object with high precision. On the other hand, the condition setting unit 92 can also set the frame rate to a low frame rate when the position or shape of an object within the chamber 10 is the object to be monitored. In this case, the processing burden of the monitoring processing unit 91 can be reduced.

[0293] In contrast, for the image data captured during the monitoring of the processing fluid from the nozzle, including the start and stop of dispensing, droplet bouncing, dripping, and flowing out, the frame rate can be set to a high frame rate. That is, when the time-dependent state changes of the processing fluid within the chamber 10 are the monitoring target, the condition setting unit 92 sets the frame rate to a high frame rate. Therefore, the monitoring processing unit 91 can monitor the time-dependent state changes of the processing fluid with high accuracy. On the other hand, the condition setting unit 92 can also set the resolution to a low resolution when the time-dependent state changes within the chamber 10 are the monitoring target. In this case, the processing burden on the monitoring processing unit 91 can be reduced.

[0294] However, for the image data captured by both the monitoring processing for the position or shape of an object and the monitoring processing for the time-related state changes of the processing fluid, the resolution is set to high resolution and the frame rate is set to high frame rate. Therefore, the monitoring processing unit 91 can monitor the position or shape of the object and the time-related state changes of the processing fluid with high accuracy.

[0295] <Another example of a monitored object>

[0296] <Etching endpoint>

[0297] For example, when the first nozzle 30 dispenses etching solution as a processing liquid in step ST3, the etchable object on the upper surface of the substrate W is etched by the processing liquid. Specifically, from the start of the dispensing of the processing liquid, as time passes, the etchable object is removed, and finally the substrate layer directly below the etchable object is exposed. If the etching processing time (the dispensing time of the processing liquid) deviates from the specified time, the etching will be insufficient or excessive.

[0298] Furthermore, if the etched object on the upper surface of substrate W is removed, the substrate layer will be exposed, and this change will be reflected in the captured image data. That is, since the reflectivity of light is different for the etched object and the substrate layer, the pixel value of the pixel corresponding to substrate W in the captured image data will differ between the state where the etched object is exposed and the state where the substrate layer is exposed. Therefore, by observing the time change of this pixel value, the point in time when the removal of the etched object on substrate W is substantially completed (etching endpoint) can be detected.

[0299] Therefore, the etching endpoint can also be used as the monitoring target. The following describes a specific example of etching monitoring processing for monitoring the etching endpoint.

[0300] Figure 22 This represents an example of the image data acquired in step ST3. Figure 22 The captured image data includes the first nozzle 30 that ejects the etching solution. That is, Figure 22 This represents the image data acquired after the first nozzle 30 begins to eject the etching solution.

[0301] exist Figure 22 In the example, multiple etching determination areas R4 are set in the captured image data. Figure 22 In the example, three etching determination regions R4 are arranged from the center of the substrate W toward the periphery. That is, the three etching determination regions R4 are set at different positions in the radial direction of the substrate W.

[0302] As etching proceeds, the pixel values ​​within the etching determination area R4 change slowly over time. When etching within the etching determination area R4 is complete, the time change of the pixel values ​​becomes smaller. Figure 23 This is a graph illustrating the time-varying brightness value within an etching determination region R4. Here, the brightness value within the etching determination region R4 is the sum or average of the pixel values ​​within R4.

[0303] like Figure 23 As shown, the brightness value initially shifts roughly with respect to time. Figure 23In the example, after time point T1 when the etchant begins to be ejected, the brightness value decreases over time, and after time point T2, the brightness value shifts again relative to time. This is because, during the period from time point T1 to time point T2, the etched object is slowly removed, so the brightness value changes as the etched object is removed; at time point T2, the etched object is completely removed.

[0304] Therefore, the monitoring processing unit 91 calculates, for example, the sum or average value of the pixel values ​​within the etching determination area R4 as a brightness value, and then calculates the change in this brightness value relative to a unit of time, i.e., the differential value. Then, the monitoring processing unit 91 detects a time point where the differential value is lower than a predetermined differential reference value as time point T1, and detects a time point where the differential value exceeds the differential reference value as time point T2. Time point T2 is the etching endpoint within the etching determination area R4.

[0305] The etching endpoints of each etching determination region R4 may be different. For example, when the first nozzle 30 ejects etching solution from the center of the substrate W, the etching determination region R4 that is closer to the center is more likely to reach the etching endpoint earlier.

[0306] Furthermore, when the first nozzle 30 oscillates between the central position P31 and the peripheral position P32 while dispensing etching solution, the etching endpoints vary depending on the moving speed of the first nozzle 30 and the flow rate of the etching solution at each position along the oscillation path. For example, there may be a situation where, among the three etching determination areas R4, the central etching determination area R4 becomes the etching endpoint earliest.

[0307] The processing control unit 93 can also close the valve 35 to stop the ejection of etching solution from the first nozzle 30 when the monitoring and processing unit 91 detects the etching endpoint of all etching determination areas R4. Therefore, the possibility of insufficient etching in all etching determination areas R4 can be reduced.

[0308] In this etching monitoring process, the sum or average brightness value within the etching determination area R4 is less dependent on the resolution. Therefore, the condition setting unit 92 can also set the resolution to low as the acquisition condition for the image data used in the etching monitoring process. In other words, the condition setting unit 92 can also set the resolution to low as the acquisition condition during the execution of step ST3. Therefore, the processing burden on the monitoring processing unit 91 can be reduced.

[0309] Furthermore, since the etching process is not particularly fast, a high frame rate is not necessary. Therefore, the condition setting unit 92 can also set the frame rate to a low frame rate as a condition for capturing image data used in the etching monitoring process. In other words, the condition setting unit 92 can also set the frame rate to a low frame rate as a condition for capturing images during the execution of step ST3. Therefore, the processing burden on the monitoring processing unit 91 can be reduced.

[0310] It should be noted that when the state change of the processing liquid is also used as the monitoring object in step ST3, the condition setting unit 92 sets the frame rate to a low frame rate as the shooting condition in step ST3.

[0311] <Abnormal drying>

[0312] Figure 24 This is a diagram that schematically illustrates another example of the configuration of processing unit 1A. Processing unit 1A has the same configuration as processing unit 1, except for the presence or absence of heating section 29.

[0313] The heating unit 29 is a heating means for heating the substrate W. The heating unit 29 includes a circular hot plate 291 and a heater 292 that serves as a heat source. The hot plate 291 is disposed between the upper surface 21a of the rotating base 21 and the lower surface of the substrate W, which is held in place by the chuck pin 26. The heater 292 is embedded inside the hot plate 291. The heater 292 can be, for example, an electric heating wire such as a nickel-chromium alloy wire that heats up when energized. When the heater 292 is energized, the hot plate 291 is heated to a temperature higher than the ambient temperature.

[0314] Furthermore, in processing unit 1A, the third nozzle 65 not only discharges a processing liquid (e.g., rinsing liquid) but also a non-reactive gas. The non-reactive gas is a gas with low reactivity with the substrate W, such as rare gases like argon or nitrogen. For example, the discharge head of the third nozzle 65 is provided with a first internal flow path and a first discharge outlet for the processing liquid, and a second internal flow path and a second discharge outlet for the gas. The first internal flow path is connected to a processing liquid supply source via a first supply pipe, and the second internal flow path is connected to a gas supply source via a second supply pipe. A first valve is provided in the first supply pipe, and a second valve is provided in the second supply pipe.

[0315] The substrate processing procedure performed by the processing unit 1A is similar to... Figure 6 The process is the same, but the drying step (step S6) differs from the specific example described above. Hereinafter, an example of the drying step in processing unit 1A will be described. It should be noted that, here, the camera 70 acquires captured image data during the drying step. Figures 25 to 27 This is a diagram that roughly represents an example of the image data acquired during the drying step. Referring hereafter to this image data...

[0316] First, the third nozzle 65 moves from the standby position P68 to the central position P66. Second, the third nozzle 65 supplies a rinsing fluid, for example, with higher volatility than pure water, to the upper surface of the rotating substrate W. This rinsing fluid is, for example, IPA (isopropyl alcohol). Therefore, the rinsing fluid spreads across the entire upper surface of the substrate W, and the processing liquid remaining on the upper surface of the substrate W is replaced by the rinsing fluid.

[0317] Secondly, while the rotary motor 22 stops rotating the substrate W, the third nozzle 65 stops discharging the rinsing liquid. Therefore, the rinsing liquid on the upper surface of the substrate W remains stationary. That is, a liquid film LF1 of rinsing liquid is formed on the upper surface of the substrate W (see reference). Figure 25 Next, the heater 292 of the heating section 29 is energized. This heats the heating section 29, and the heat from the heating section 29 heats the substrate W. Consequently, the lower portion of the rinsing liquid film LF1 that is in contact with the upper surface of the substrate W is also heated. Then, this lower portion of the liquid film LF1 vaporizes. As a result, an IPA vapor layer is formed between the upper surface of the substrate W and the liquid film LF1. That is, the liquid film LF1 becomes a state where it floats above the upper surface of the substrate W.

[0318] Next, the third nozzle 65 ejects an inactive gas. The inactive gas is ejected toward the center of the liquid film LF1. As the inactive gas is sprayed onto the liquid film LF1, the liquid film LF1 moves radially outward and flows outward from the periphery of the substrate W. Simultaneously, a circular opening is formed in the center of the liquid film LF1 when viewed from above (see reference). Figure 26 Since there is no rinsing fluid or other processing liquid at this opening, it is the drying region DR1. The liquid film LF1, pushed by the inactive gas, moves sequentially radially outward and flows down from the periphery of the substrate W; therefore, the drying region DR1 expands isotropically over time. That is, the drying region DR1 expands while maintaining a circular shape when viewed from above. Figure 26 In the example, the dry region DR1 in the captured image data acquired at different time points is schematically represented by a virtual line.

[0319] If the liquid film LF1 on the upper surface of the substrate W is removed, the third nozzle 65 stops emitting inactive gas and moves to the standby position P68. Power to the heater 292 of the heating unit 29 also stops.

[0320] In the aforementioned drying process, it is not easy to consistently form and expand the drying area DR1 as intended. That is, if multiple substrates W are processed sequentially, during the drying process of some substrates W, there may be situations where the position, shape, or number of the drying area DR1 cannot be as intended.

[0321] For example, the substrate W is heated, and a vapor layer of rinsing liquid is formed between the upper surface of the substrate W and the liquid film LF1. At this time, tiny bubbles are generated in the liquid film LF1, and therefore, their presence creates an opening DR2 in a portion of the liquid film LF1 (see reference). Figure 27 If an opening DR2 is formed in a portion of the liquid film LF1 before the inactive gas is sprayed, the vapor of the rinsing liquid between the upper surface of the substrate W and the liquid film LF1 will leak out through the opening DR2. As a result, the vapor layer cannot be maintained, and the drying step cannot be performed properly.

[0322] Furthermore, through the blowing of inert gas, the drying zone DR1 will gradually expand as described above. At this point, there is a possibility that the shape of the drying zone DR1 may break down, or that multiple drying zones DR1 may form. In such cases, the drying process cannot be carried out properly.

[0323] Hereinafter, any anomalies related to the opening will be collectively referred to as drying anomalies. Here, drying anomalies will be used as the monitoring object. The following describes specific examples of drying monitoring procedures for monitoring the presence or absence of drying anomalies.

[0324] First, monitoring of drying anomalies occurring before the release of inactive gases ( Figure 27 (This will be explained.) Figure 25 This indicates that the liquid film LF1 of the rinsing fluid is appropriately formed on the upper surface of the substrate W. Figure 27 This indicates that an unexpected opening DR2 has formed in the liquid film LF1 of the flushing fluid.

[0325] The monitoring processing unit 91 calculates the reference image data obtained from capturing images in a normal state (e.g., Figure 27 The difference between the image data and the captured image data is used to obtain a differential image. If an opening DR2 is formed, the absolute value of the pixel value corresponding to the portion of the opening DR2 in the differential image will become higher. If the area of ​​this portion is large, it can be determined that an opening DR2 has been formed. Therefore, the monitoring processing unit 91 determines whether the area of ​​the portion with a higher absolute value of the pixel value is below a predetermined drying tolerance value, and if the area is below the drying tolerance value, it determines that no drying abnormality has occurred. On the other hand, if the area is greater than the drying tolerance value, the monitoring processing unit 91 determines that a drying abnormality has occurred.

[0326] Next, an example of monitoring a drying abnormality that occurs after the emission of inert gas will be described. The monitoring processing unit 91 calculates the difference between two sequentially acquired image data after the emission of inert gas to obtain differential image data. Figure 28This is a diagram that roughly represents an example of differential image data. In this differential image data, there is a closed curve C corresponding to the periphery of the dry region DR1. If the dry region DR1 expands while maintaining a circular shape, the closed curve C forms an elliptical shape. If the shape of the dry region DR1 collapses, the closed curve C deforms and distorts from its elliptical shape.

[0327] To detect this deformation and distortion, a circularity R is introduced. Circularity R is an indicator of how close the closed curve C is to a perfect circle. Circularity R is expressed using the length L of the closed curve C and the area S of the closed curve C, as follows.

[0328] R = 2πS / L 2 …(1)

[0329] The roundness R of the closed curve C when it has an elliptical shape is higher than the roundness R of the closed curve C when it is deformed and twisted from an elliptical shape. Therefore, the monitoring and processing unit 91 determines whether the roundness R of the closed curve C is above the specified drying reference value, and if the roundness R is above the drying reference value, it determines that no drying abnormality has occurred. On the other hand, if the roundness R does not reach the drying reference value, the monitoring and processing unit 91 determines that a drying abnormality has occurred.

[0330] In drying monitoring, since it is not essential to know the exact shape of the drying area DR1 and the exact location and shape of the opening DR2, the resolution of the captured image data can be relatively low. Furthermore, since the aforementioned drying anomaly does not occur for a very short period, a lower frame rate is also acceptable.

[0331] Therefore, the condition setting unit 92 can also set the resolution of the captured image data used for drying monitoring processing to a low resolution and the frame rate to a low frame rate. In other words, the condition setting unit 92 can also set the resolution to a low resolution and the frame rate to a low frame rate as the shooting conditions during the execution of the drying step. Therefore, the monitoring processing unit 91 can monitor drying abnormalities with a lower processing burden.

[0332] <Fume Anomaly>

[0333] Figure 29 This is a diagram that schematically illustrates the configuration example of another example of processing unit 1, namely processing unit 1B. Processing unit 1B has the same configuration as processing unit 1, except for the presence or absence of the blocking plate 85.

[0334] The baffle plate 85 is a component used to suppress the diffusion of gas near the upper surface of the substrate W. The baffle plate 85 has a circular plate shape and is horizontally positioned above the rotary chuck 20. The baffle plate 85 is connected to a baffle plate lifting mechanism 86. When the baffle plate lifting mechanism 86 is activated, the baffle plate 85 moves up and down between an upper position away from the upper surface of the substrate W held in the rotary chuck 20 and a lower position closer to the upper surface of the substrate W. The baffle plate lifting mechanism 86 can, for example, be a mechanism that converts the rotary motion of a motor into linear motion via a ball screw.

[0335] Furthermore, a blowout port 87 for blowing out inactive gases such as nitrogen is provided at the center of the lower surface of the shielding plate 85. The blowout port 87 is connected to a gas supply unit (not shown) that supplies drying gas to the substrate W during the drying process.

[0336] When the processing liquid is supplied to the substrate W from the first nozzle 30, the second nozzle 60, or the third nozzle 65, the blocking plate 85 retracts to the upper position. After the processing liquid step (step S4) using the processing liquid is completed, during the drying step (step S6) of the substrate W, the blocking plate 85 is lowered to the lower position by the blocking plate lifting mechanism 86. Then, drying gas (e.g., heated nitrogen) is blown from the blow outlet 87 toward the upper surface of the substrate W. At this time, gas diffusion is prevented by the blocking plate 85. As a result, the drying gas can be efficiently supplied to the upper surface of the substrate W.

[0337] Furthermore, in processing unit 1B, the first nozzle 30 is connected to a sulfuric acid supply source 36a and a hydrogen peroxide water supply source 36b via a supply pipe 34. The supply pipe 34 includes, for example, a confluence supply pipe 341, a first supply pipe 342a, and a second supply pipe 342b. The downstream end of the confluence supply pipe 341 is connected to the first nozzle 30, and the upstream end of the confluence supply pipe 341 is connected to the downstream ends of the first supply pipe 342a and the second supply pipe 342b. The upstream end of the first supply pipe 342a is connected to the sulfuric acid supply source 36a, and the upstream end of the second supply pipe 342b is connected to the hydrogen peroxide water supply source 36b. A first valve 35a is provided in the first supply pipe 342a, and a second valve 35b is provided in the second supply pipe 342b.

[0338] With the first nozzle 30 moved to the central position P31, if the first valve 35a and the second valve 35b are open, the sulfuric acid supplied from the sulfuric acid supply source 36a to the first supply pipe 342a and the hydrogen peroxide water supplied from the hydrogen peroxide water supply source 36b to the second supply pipe 342b will merge in the confluence supply pipe 341 to become SPM liquid (a mixture of sulfuric acid and hydrogen peroxide water). Then, the SPM liquid will be ejected from the first nozzle 30 toward the upper surface of the substrate W held on the rotating chuck 20.

[0339] <Substrate Processing Flow>

[0340] The substrate processing procedure performed by the processing unit 1B is similar to... Figure 6 Similarly, but in the processing liquid step (step S5), the first nozzle 30 dispenses a mixture of sulfuric acid and hydrogen peroxide water (SPM liquid) as the processing liquid. Specifically, by opening the first valve 35a and the second valve 35b through the processing control unit 93, sulfuric acid and hydrogen peroxide are supplied to the first nozzle 30, which then dispenses the mixture toward the substrate W. The temperature of the SPM liquid is set, for example, to 150°C to 200°C. Therefore, for example, the resist formed on the upper surface of the substrate W can be removed.

[0341] If the resist is sufficiently removed, close the first valve 35a to stop the supply of sulfuric acid. Since hydrogen peroxide water is supplied, it pushes out the sulfuric acid in the combined supply pipe 341 and the first nozzle 30 (pushing step). Therefore, in subsequent steps, this reduces the possibility of sulfuric acid unexpectedly falling from the first nozzle 30.

[0342] During this extrusion step, the supply of sulfuric acid stops, resulting in an increased proportion of hydrogen peroxide water on the upper surface of substrate W. Consequently, a large amount of hydrogen peroxide water reacts with the sulfuric acid, generating an ambient gas composed of numerous particles, known as smog. If the smog generation is at a normal level, its diffusion can be suppressed by the downward flow within chamber 10. However, if the smog generation becomes excessive, for example, if smog adheres to the baffle plate 85, the adhered smog will eventually solidify into particles. There is a concern that these particles may then disperse again from the baffle plate 85, adhering as foreign matter to the surface of substrate W. Hereinafter, the anomaly of smog diffusing to a higher position is referred to as a smog anomaly.

[0343] Therefore, smoke anomalies can also be used as a monitoring target. The following is a specific example of smoke monitoring procedures for detecting the presence or absence of smoke anomalies.

[0344] Figure 30 This is a diagram that roughly represents an example of image data acquired during the pushing process. Figure 30The captured image data contains smoke. Figure 30 In this example, the smoke extends to the vicinity of the lower surface of the shield 85. That is, Figure 30 This indicates that an abnormal smoke situation has occurred.

[0345] exist Figure 30 In the example, a smoke detection region R5 is defined in the captured image data. The smoke detection region R5 is an area higher than the substrate W and is an area that smoke will not reach during the normal pushing process. The pixel values ​​within the smoke detection region R5 differ when smoke is present and when smoke is not present.

[0346] Therefore, the monitoring processing unit 91 determines whether a smoke anomaly has occurred based on the pixel values ​​of the smoke detection region R5. For example, the monitoring processing unit 91 calculates the difference between the captured image data obtained before the smoke occurred and the captured image data obtained in the pushing step to obtain a difference image. Next, the monitoring processing unit 91 calculates the average value of the pixel values ​​within the smoke detection region R5 in the difference image. If smoke is present within the smoke detection region R5, this average value will increase.

[0347] Therefore, the monitoring processing unit 91 determines whether the average value is above a predetermined first smoke reference value, and if the average value is above the first smoke reference value, it sets the average value as the accumulated target value. Next, the monitoring processing unit 91 calculates the excess value of the average value exceeding the first smoke reference value (= accumulated target value - first smoke reference value), and sequentially accumulates this excess value for each captured image data to calculate an accumulated value. Next, the monitoring processing unit 91 determines whether the accumulated value is above a predetermined second smoke reference value, and if the accumulated value is above the second smoke reference value, it determines that a smoke anomaly has occurred.

[0348] In this smoke monitoring process, since the need to know the exact location of the smoke-generating area is not high, the resolution of the captured image data can be set to a low level. Furthermore, since the duration of smoke anomalies is not short, the frame rate can also be set to a low level.

[0349] Therefore, the condition setting unit 92 can also set the resolution to low resolution and the frame rate to low frame rate as the shooting conditions for the captured image data used in the smoke monitoring process. In other words, the condition setting unit 92 can also set the resolution to low resolution and the frame rate to low frame rate as the shooting conditions during the execution of the pushing step. Therefore, the monitoring processing unit 91 can monitor smoke anomalies with a lower processing burden.

[0350] <Crystallization within chamber 10>

[0351] For example, there may be instances where volatile components of the processing liquid adhere to the components within chamber 10, or where the components within chamber 10 crystallize. Hereinafter, this anomaly will be referred to as a crystallization anomaly.

[0352] Therefore, crystallization anomalies can also be used as a monitoring target. The following is a specific example of crystallization monitoring procedures for detecting the presence or absence of crystallization anomalies.

[0353] The crystallization monitoring process is performed, for example, when the substrate W has not been moved into the processing unit 1 and all components within the processing unit 1 are stopped at their initial positions. That is, the crystallization monitoring process is performed in a standby state where no processing of the substrate W is performed. Furthermore, this crystallization monitoring process does not need to be performed every time the substrate W is processed; for example, it can be performed when the number of processed substrates W reaches a predetermined number or more, or after a predetermined period has elapsed since the last crystallization monitoring process.

[0354] The monitoring and processing unit 91 can also determine the presence or absence of crystallization abnormalities by comparing the reference image data acquired by taking pictures of the normal chamber 10 in standby mode with the captured image data acquired by the camera 70. For example, a crystallization determination area for the crystallized object can be preset, and if the sum of the pixel values ​​in the difference image between the reference image and the captured image data within the crystallization determination area is large, it can be determined that a crystallization abnormality has occurred.

[0355] Since the necessity for accurately detecting the location and shape of crystallization anomalies is not very high, high resolution is not required. Furthermore, since crystallization anomalies occur continuously once they occur, a high frame rate is also unnecessary. Therefore, the condition setting unit 92 can also set the resolution and frame rate to a low setting as the conditions for capturing image data used in crystallization monitoring processing. In other words, the condition setting unit 92 can also set the resolution and frame rate to a low setting as the conditions for capturing images during standby periods when the processing unit 1 is stopped. Therefore, the monitoring processing unit 91 can monitor the presence or absence of crystallization anomalies with a lower processing load.

[0356] <The duration of the anomaly is related to the frame rate>

[0357] As described above, during the execution of the step of setting a first anomaly (e.g., drying anomaly, smoke anomaly, and crystallization anomaly) occurring during the first occurrence period as a monitoring target, the condition setting unit 92 sets the frame rate to a low frame rate. On the other hand, during the execution of the step of setting a second anomaly (e.g., droplet bouncing, dripping, and flowing out) occurring during a second occurrence period shorter than the first occurrence period as a monitoring target, the condition setting unit 92 sets the frame rate to a high frame rate.

[0358] In this way, for the first anomaly with a longer occurrence period, the processing burden of the monitoring processing unit 91 can be reduced by setting the frame rate to a lower first frame rate. Furthermore, for the second anomaly with a shorter occurrence period, the monitoring processing unit 91 can appropriately monitor the presence or absence of the second anomaly by setting the frame rate to a higher second frame rate.

[0359] <Cleansing of chamber 10>

[0360] In the processing unit 1, there is a case where a chamber nozzle (not shown) is provided to clean the chamber 10. This chamber nozzle releases cleaning fluid (e.g., pure water) into the chamber 10 to clean each component within the chamber 10 (chamber cleaning step). This chamber cleaning step is performed when the substrate W is not being moved into the processing unit 1. That is, the chamber cleaning step is performed in a standby state where the processing of the substrate W is not being carried out. For example, the processing control unit 93 can perform the chamber cleaning step by releasing cleaning fluid from the chamber nozzle each time the substrate W is moved in, or it can perform the chamber cleaning step each time the number of substrates W processed reaches a predetermined number or more, or it can perform the chamber cleaning step after a predetermined period has elapsed since the last chamber cleaning step.

[0361] The monitoring target can also be any abnormality in the discharge of the cleaning fluid from the nozzle tip of the chamber. The following is a specific example of chamber cleaning monitoring procedures.

[0362] During the chamber cleaning step, the camera 70 sequentially acquires image data. The acquired image data includes the tip of the nozzle for the chamber. Furthermore, the acquired image data includes a discharge determination region encompassing an area extending from the tip of the nozzle in the discharge direction. The monitoring and processing unit 91 determines whether a discharge abnormality has occurred based on the pixel values ​​within this discharge determination region of the acquired image data. For example, a discharge abnormality can also be determined by comparing the discharge determination region of the image data when the treatment fluid is discharged normally with the discharge determination region of the acquired image data.

[0363] Since this ejection anomaly does not directly affect the substrate W, high resolution and high frame rate are not required. Therefore, the condition setting unit 92 can also set the resolution to low resolution and the frame rate to low frame rate as the conditions for capturing image data used in the chamber cleaning monitoring process. In other words, the condition setting unit 92 can also set the resolution to low resolution and the frame rate to low frame rate as the conditions for capturing images during the chamber cleaning step. Therefore, the monitoring processing unit 91 can monitor the presence or absence of ejection anomalies with a lower processing load.

[0364] <Another example of shooting conditions>

[0365] The above example uses resolution and frame rate as shooting conditions. However, it is not necessarily limited to these. For example, the size of the field of view displayed by the captured image data can also be used as a shooting condition. For example, camera 70 can use a field of view V1 (refer to...) Figure 2 The camera can be used to photograph the interior of chamber 10, and can also photograph the interior of chamber 10 with a field of view V2. The field of view V1 is wider than the field of view V2. The field of view angle of field of view V1 when viewed from above is, for example, 120 degrees, while the field of view angle of field of view V2 is, for example, 60 degrees.

[0366] The image data acquired with field of view V2 contains the entire opening of the processing cup 40, but only the vicinity of the opening. The image data acquired with field of view V1 also contains the entire opening of the processing cup 40 and the area farther away from the opening.

[0367] Figure 31 This is a diagram that roughly represents an example of image data taken with different fields of view. In Figure 31 In the example, the image data captured with a wider field of view V1, and the image data cropped with a specified area as the field of view V2, is equivalent to the image data captured with the field of view V2. Therefore, the amount of data in the image data captured with the field of view V2 is less than the amount of data in the image data captured with the field of view V1.

[0368] The camera 70 can adjust the field of view, for example, by cropping a portion of the image data read from all the image sensors. Alternatively, the camera 70 may read only the image sensor data within the area designated as the field of view. Therefore, the camera 70 can also change the field of view.

[0369] However, in all the monitoring processes of the aforementioned monitored objects, it is not necessary to use the captured image data obtained with the widest field of view V1. For example, in the position monitoring process of monitoring the nozzle position, it is sufficient that the tip of each nozzle is included in the captured image data, and the field of view V2 is sufficient.

[0370] Therefore, the condition setting unit 92 can also set the field of view according to the monitored object. Figure 32 This is a table representing an example of a monitored object and filming conditions. It should be noted that... Figure 32 In the example above, for the shape anomaly of substrate W, the resolution can be set to either high resolution or low resolution. Since the algorithms for monitoring the shape anomaly and the retention anomaly of substrate W are the same, when monitoring the retention anomaly is also performed, the resolution can be set to high resolution.

[0371] Furthermore, the condition setting unit 92 can employ shooting conditions with higher data volume for the period during which monitoring processing of multiple monitored objects is performed in parallel. For example, when performing both monitoring processing requiring a large field of view and monitoring processing that does not require a large field of view in parallel, the condition setting unit 92 sets the field of view to a larger field of view as the shooting condition for that step. For example, in the squeezing step where sulfuric acid is squeezed with hydrogen peroxide water and expelled from the first nozzle 30, monitoring processing can be performed on both abnormal smoke and the discharge status of the processing liquid. In this case, the condition setting unit 92 sets the field of view to a larger range, the resolution to a lower resolution, and the frame rate to a higher frame rate as the shooting conditions for the squeezing step.

[0372] <Image Conditions>

[0373] In the example above, the condition setting unit 92 sets the shooting conditions of the camera 70. However, it is not necessarily limited to this. For example, the camera 70 can also acquire image data under predetermined shooting conditions. Prescribed shooting conditions may include, for example, a wide field of view, a high resolution, and a high frame rate. The control unit 9 can also change the image conditions of the captured image data by performing image processing on the captured image data received from the camera 70. The image conditions referred to here are the same as the shooting conditions. However, the image conditions are not directly used by the controller of the camera 70. Image conditions include, for example, the field of view, resolution, and frame rate of the captured image data.

[0374] Figure 33 This is a functional block diagram that roughly illustrates an example of the internal structure of the control unit 9. The control unit 9 includes a monitoring and processing unit 91, a condition setting unit 92, a processing control unit 93, and a preprocessing unit 94.

[0375] The preprocessing unit 94 modifies the image conditions of the captured image data received from the camera 70. For example, the preprocessing unit 94 acquires captured image data with a smaller field of view V2 by cropping out a portion of the captured image data. Furthermore, the preprocessing unit 94 can acquire captured image data with low resolution by averaging the pixel values ​​of adjacent vertical (nx) × horizontal (ny) pixels within the captured image data and setting it to one pixel. Additionally, the preprocessing unit 94 can acquire captured image data with a low frame rate by skipping at least one sequentially acquired captured image data and deleting at least one captured image data.

[0376] As described above, the condition setting unit 92 determines a monitoring target from the monitoring target candidates in the chamber 10 and sets image conditions corresponding to the monitoring target.

[0377] The preprocessing unit 94 performs the above-described processing on the captured image data so that the image conditions of the captured image data received from the camera 70 are consistent with the image conditions set by the condition setting unit 92.

[0378] The monitoring processing unit 91 performs monitoring processing on the monitored object based on the captured image data processed by the preprocessing unit 94.

[0379] Therefore, the monitoring processing unit 91 can still monitor the monitored object based on the captured image data with image conditions corresponding to the monitored object. Thus, even with a camera 70 whose shooting conditions cannot be changed, the monitoring processing unit 91 can still monitor the monitored object based on the captured image data with image conditions corresponding to the monitored object. Therefore, as described above, the monitored object can be monitored with high precision. Furthermore, it can appropriately reduce the processing burden on the monitoring processing unit 91.

[0380] As described above, although the substrate processing method and substrate processing apparatus 100 have been described in detail, the above description is illustrative in all embodiments and the substrate processing apparatus is not limited thereto. Numerous variations not illustrated can be interpreted as deduced without departing from the scope of this disclosure. The components described in the above embodiments and variations can be appropriately combined or omitted as long as they do not contradict each other.

[0381] For example, in the above example, while field of view, resolution, and frame rate are used as image conditions, they are not limited to these. For example, the exposure time, white balance, and other image conditions of the camera 70 can also be changed according to the monitored object.

[0382] Furthermore, in the example described above, the condition setting unit 92 modifies the image conditions to binary. For example, the condition setting unit 92 sets the resolution to either high resolution or low resolution depending on the monitored object. However, the condition setting unit 92 can also modify the image conditions (e.g., resolution) more finely depending on the monitored object.

[0383] Explanation of reference numerals in the attached figures

[0384] 1: Processing Unit

[0385] 10: Chamber

[0386] 20: Rotary chuck

[0387] 30: Nozzle (First Nozzle)

[0388] 40: Processing Cup

[0389] 60: Nozzle (Second Nozzle)

[0390] 65: Nozzle (Third Nozzle)

[0391] 80: Nozzle (fixed nozzle)

[0392] 9: Control Department

[0393] 70: Camera

[0394] 100: Substrate processing apparatus

[0395] W: substrate

Claims

1. A substrate processing method, wherein, have: The holding step involves moving the substrate into the interior of the chamber and holding the substrate therein; In the supply step, fluid is supplied to the substrate inside the chamber; The shooting process involves using a camera to sequentially photograph the interior of the chamber to acquire image data. The condition setting step determines the monitoring object based on the procedure for processing the substrate, and changes the image conditions according to the monitoring object. and The monitoring step involves performing monitoring processing on the monitored object based on the image data having image conditions corresponding to the monitored object. The image conditions include at least one of the image data's resolution, frame rate, and the size of the field of view displayed in the image data. In the condition setting step, During a first period in which at least one of the shape and position of an object within the cavity is set as the monitored object, the frame rate is set to a first frame rate as the image condition for the image data. During a second period, when the monitored object is defined as the time-varying state change of the treatment fluid ejected from the nozzle within the chamber, the frame rate is set to a second frame rate, higher than the first frame rate, as the image condition for the image data. In the condition setting step, during the third period of the monitored object, when at least one of the shape and position of the object in the chamber and the time-dependent state change of the processing fluid are set as the image conditions of the image data, the frame rate is set to the second frame rate.

2. A substrate processing method, wherein, have: The holding step involves moving the substrate into the interior of the chamber and holding the substrate therein; In the supply step, fluid is supplied to the substrate inside the chamber; The shooting process involves using a camera to sequentially photograph the interior of the chamber to acquire image data. The condition setting step determines the monitoring object based on the procedure for processing the substrate, and changes the image conditions according to the monitoring object. and The monitoring step involves performing monitoring processing on the monitored object based on the image data having image conditions corresponding to the monitored object. The image conditions include at least one of the image data's resolution, frame rate, and the size of the field of view displayed in the image data. During a first period in which at least one of the shape and position of an object within the cavity is set as the monitored object, the resolution is set to a first resolution as the image condition for the image data. During a second period in which the state change of the treatment fluid ejected from the nozzle in the chamber is set as the monitoring object over a period of time, the resolution is set to a second resolution, which is lower than the first resolution, as the image condition for the image data.

3. The substrate processing method as described in claim 2, wherein, In the condition setting step, during the third period of the monitored object, where at least one of the shape and position of the object in the chamber and the time-dependent state change of the processing fluid are set as the image conditions of the image data, the resolution is set to the first resolution.

4. A substrate processing method, wherein, have: The holding step involves moving the substrate into the interior of the chamber and holding the substrate therein; In the supply step, fluid is supplied to the substrate inside the chamber; The shooting process involves using a camera to sequentially photograph the interior of the chamber to acquire image data. The condition setting step determines the monitoring object based on the procedure for processing the substrate, and changes the image conditions according to the monitoring object. and The monitoring step involves performing monitoring processing on the monitored object based on the image data having image conditions corresponding to the monitored object. The image conditions include at least one of the image data's resolution, frame rate, and the size of the field of view displayed in the image data. In the condition setting step, During a first period in which at least one of the shape and position of an object within the cavity is set as the monitored object, the frame rate is set to a first frame rate as the image condition for the image data. During a second period, when the monitored object is defined as the time-varying state change of the treatment fluid ejected from the nozzle within the chamber, the frame rate is set to a second frame rate, higher than the first frame rate, as the image condition for the image data. The monitored object, which includes at least one of the shape and position of the object, includes at least one of the following: the shape and position of the substrate; and the shape and position of the processing cup that receives the fluid that spills from the periphery of the substrate.

5. The substrate processing method as described in any one of claims 1 to 4, wherein, The monitored object, which includes the time-dependent state changes of the processing liquid, includes at least one of the following: the start time of dispensing the processing liquid, the stop time of dispensing the processing liquid, the bouncing of droplets of the processing liquid on the substrate, and the dripping and flowing of the processing liquid from the nozzle.

6. A substrate processing method, wherein, have: The holding step involves moving the substrate into the interior of the chamber and holding the substrate therein; In the supply step, fluid is supplied to the substrate inside the chamber; The shooting process involves using a camera to sequentially photograph the interior of the chamber to acquire image data. The condition setting step determines the monitoring object based on the procedure for processing the substrate, and changes the image conditions according to the monitoring object. and The monitoring step involves performing monitoring processing on the monitored object based on the image data having image conditions corresponding to the monitored object. The image conditions include at least one of the image data's resolution, frame rate, and the size of the field of view displayed in the image data. In the condition setting step, During the fourth period, in which the presence or absence of a first anomaly occurring during the first occurrence within the chamber is set as the monitoring object, the frame rate is set to a first frame rate as the image condition for the image data, and... During a fifth period in which the presence or absence of a second anomaly occurring within the chamber during a second occurrence period shorter than the first occurrence period is set as the monitoring object, the frame rate is set to a second frame rate higher than the first frame rate as the image condition of the image data.

7. The substrate processing method according to any one of claims 1 to 4 and 6, wherein, The condition setting step includes setting the image conditions as shooting conditions. In the shooting step, the camera uses the image conditions corresponding to the monitored object as shooting conditions to acquire the image data.

8. The substrate processing method according to any one of claims 1 to 4 and 6, wherein, In the shooting step, the camera acquires the image data under specified shooting conditions. The image data acquired by the camera is processed to obtain image data with image conditions corresponding to the monitored object.

9. A substrate processing apparatus, wherein, have: The substrate holding section holds the substrate inside the chamber; A nozzle supplies fluid to the substrate inside the chamber; A camera sequentially captures images of the interior of the chamber to obtain image data; and The control unit determines a monitoring target from multiple candidate monitoring targets based on the processing procedure of the substrate, changes image conditions according to the monitoring target, and performs monitoring processing on the monitoring target based on image data having the image conditions corresponding to the monitoring target. The image conditions include at least one of the image data's resolution, frame rate, and the size of the field of view displayed in the image data. During a first period in which the control unit sets at least one of the shape and position of an object within the cavity as the monitored object, the frame rate is set to a first frame rate as the image condition for the image data. During a second period when the control unit sets the monitoring object to a second frame rate that is higher than the first frame rate, as the image condition for the image data, the time-varying state change of the treatment fluid ejected from the nozzle in the chamber is considered as the monitoring object. During a third period in which the control unit sets at least one of the shape and position of the object in the chamber and the time-dependent state change of the processing fluid as the monitored object, the frame rate is set to the second frame rate as the image condition of the image data.

Images