tracker module, power amplifier module, high frequency module, and communication device

Abstract

A tracker module, a power amplifier module, a high frequency module, and a communication device are provided. Power consumption is reduced. A tracker module (1) of the present invention includes a second substrate separate from a first substrate, a tracker component (3), and a low pass filter (4). A power amplifier is disposed on the first substrate. The tracker component (3) supplies a power supply voltage to the power amplifier. The low pass filter (4) is connected to a path between an output of the tracker component (3) and the power amplifier. The tracker component (3) and the low pass filter (4) are disposed on the second substrate.

Description

Technical Field

[0001] This invention generally relates to tracker modules, power amplifier modules, high-frequency modules, and communication devices. More specifically, this invention relates to a tracker module having tracker components, a power amplifier module having tracker components, a high-frequency module having a power amplifier module, and a communication device having a high-frequency module. Background Technology

[0002] In recent years, power amplifier circuits using envelope tracking (hereinafter referred to as "ET method") have been known (for example, see Patent Document 1). The ET method is a high-frequency amplification technique that varies the amplitude of the power supply voltage of the amplifying element based on the amplitude of the envelope of the high-frequency signal. More specifically, the ET method is a technique that reduces power loss when operating under a fixed power supply voltage by varying the collector voltage of the amplifying element according to the output voltage, thereby achieving high efficiency.

[0003] The power amplifier circuit described in Patent Document 1 includes a transistor that amplifies a signal input to the base and outputs it from the collector, and changes the power supply voltage of the transistor according to the amplitude of the envelope of the high-frequency signal, and supplies the power supply voltage to the transistor.

[0004] Patent Document 1: International Publication No. 2003 / 176147

[0005] However, in the power amplifier circuit described in Patent Document 1, a low-pass filter is connected in the path between the tracker component and the power amplifier in order to reduce the high-order harmonic components of the power supply voltage from the tracker component.

[0006] However, in conventional power amplifier circuits, there is a tendency for power consumption to increase due to parasitic resistance generated in the path between the tracker component and the low-pass filter. Summary of the Invention

[0007] The present invention was made in view of the above-mentioned points, and the object of the present invention is to provide a tracker module, a power amplifier module, a high-frequency module, and a communication device that can reduce power consumption.

[0008] One embodiment of the tracker module of the present invention includes a second substrate separate from a first substrate, a tracker component, and a low-pass filter. A power amplifier is disposed on the first substrate. The tracker component applies a power supply voltage to the power amplifier. The low-pass filter is connected in the path between the output terminal of the tracker component and the power amplifier. The tracker component and the low-pass filter are disposed on the second substrate.

[0009] One embodiment of the tracker module of the present invention includes a tracker component and a low-pass filter. The tracker component outputs a power supply voltage to a power amplifier. The low-pass filter is connected to the output terminal of the tracker component. The first path length of the path between the tracker component and the low-pass filter is shorter than the second path length of the path between the low-pass filter and the power amplifier.

[0010] One embodiment of the power amplifier module of the present invention includes the tracker module and the power amplifier described above.

[0011] One embodiment of the high-frequency module of the present invention includes the aforementioned tracker module, the aforementioned power amplifier, and a transmission filter. The transmission filter allows the high-frequency signal amplified by the aforementioned power amplifier to pass through.

[0012] One aspect of the communication device of the present invention includes the aforementioned high-frequency module and signal processing circuit. The signal processing circuit outputs a high-frequency signal to the high-frequency module.

[0013] The tracker module, power amplifier module, high-frequency module, and communication device according to the above-described manner of the present invention can reduce the power consumption of the tracker module. Attached Figure Description

[0014] Figure 1 This is a top view of the tracker module in the implementation method.

[0015] Figure 2 This is a perspective view of the tracker module.

[0016] Figure 3 This is a conceptual diagram illustrating the structure of the tracker module, power amplifier module, high-frequency module, and communication device in the implementation method.

[0017] Figure 4 This is a conceptual diagram used to illustrate the details of this tracker module.

[0018] Figure 5 This is a graph representing the characteristics of the low-pass filter in the tracker module.

[0019] Figure 6 This is a conceptual diagram showing the structure of the tracker module, power amplifier module, high-frequency module, and communication device in Modified Example 1 of the implementation method.

[0020] Figure 7 This is a conceptual diagram showing the structure of the power amplifier module in Modified Example 2 of the implementation method. Detailed Implementation

[0021] Hereinafter, the tracker module, power amplifier module, high-frequency module, and communication device of the embodiments will be described with reference to the accompanying drawings. The drawings referred to in the following embodiments are schematic diagrams, and the size, thickness, and proportions of the constituent elements shown in the drawings may not reflect actual dimensions.

[0022] (Implementation Method)

[0023] (1) Tracker Module

[0024] Referring to the accompanying drawings, the structure of the tracker module 1 in the embodiment will be described.

[0025] like Figure 1 and Figure 2 As shown, the tracker module 1 of the embodiment includes a substrate 2, a tracker component 3, a low-pass filter 4, and multiple (16 in the example) external connection terminals 23. The tracker module 1 communicates with, for example, a communication device 7 such as a terminal equipped with a high-frequency module 5 (see reference 7). Figure 3 A battery (not shown) is connected, supplying battery voltage V2 (see reference) to tracker module 1. Figure 3 ).

[0026] (2) High-frequency module

[0027] Next, the high-frequency module 5, which uses tracker module 1, will be described with reference to the attached diagram.

[0028] like Figure 3 As shown, the high-frequency module 5 includes a tracker module 1, a power amplifier circuit 6, a filter 51, a switch 52, an input terminal 53, and an antenna terminal 54. The high-frequency signal output from the high-frequency module 5 is transmitted to a base station (not shown) via an antenna 71, which will be described later. The high-frequency module 5 is used in communication devices such as the communication device 7, which will be described later.

[0029] (3) Communication device

[0030] Next, the communication device 7 using the high-frequency module 5 will be described with reference to the accompanying drawings.

[0031] like Figure 3 As shown, the communication device 7 includes a high-frequency module 5, an antenna 71, and a signal processing circuit 72.

[0032] Here, when amplifying high-frequency signals, envelope tracking (hereinafter referred to as "ET mode") is used. ET mode includes analog envelope tracking (hereinafter referred to as "analog ET mode") and digital envelope tracking (hereinafter referred to as "digital ET mode").

[0033] Analog ET mode continuously detects the envelope of the amplitude of the high-frequency signal input to the amplification element, and changes the amplitude level of the power supply voltage of the amplification element according to the envelope. In analog ET mode, because the envelope is continuously detected, the amplitude level of the power supply voltage changes continuously.

[0034] Digital Echo Echo (ET) mode discretely detects the envelope of the amplitude of the high-frequency signal input to the amplification element, and adjusts the amplitude level of the power supply voltage of the amplification element according to this envelope. In digital ET mode, the amplitude level of the high-frequency signal is detected at regular intervals, not continuously, and the detected amplitude level is quantized. Because the envelope is detected discretely in digital ET mode, the amplitude level of the power supply voltage changes discretely (see reference). Figure 2 ).

[0035] (4) Components of the tracker module

[0036] Hereinafter, the constituent elements of the tracker module 1 of the embodiment will be described with reference to the accompanying drawings.

[0037] (4.1)Substrate

[0038] Figure 1 The substrate 2 shown is associated with a power amplifier 61 (see reference). Figure 3 The first substrate is a separate substrate. For example... Figure 1 and Figure 2 As shown, the substrate 2 has a first main surface 21 and a second main surface 22. The first main surface 21 and the second main surface 22 are opposite to each other in the thickness direction of the substrate 2.

[0039] Additionally, a plurality of external connection terminals 23 (16 in the example) are disposed on the second main surface 22 of the substrate 2. The plurality of external connection terminals 23 include terminals for connection to the power amplifier 61 (see reference 61). Figure 3 The power amplifier is connected to terminal 24 (output terminal).

[0040] (4.2) Tracker components

[0041] like Figure 3 As shown, the tracker component 3 is configured to supply a power supply voltage V1 to the power amplifier 61. More specifically, the tracker component 3 generates a power supply voltage V1 corresponding to the level of the envelope extracted from the modulation signal of the high-frequency signal, and supplies the power supply voltage V1 to the power amplifier circuit 6.

[0042] The tracker component 3 has an input terminal (not shown) for inputting a power control signal and an output terminal (not shown) for outputting a power supply voltage V1. The input terminal is connected to the signal processing circuit 72, from which the power control signal is input. The tracker component 3 generates the power supply voltage V1 based on the power control signal input to the input terminal. At this time, the tracker component 3 changes the amplitude of the power supply voltage V1 based on the power control signal from the signal processing circuit 72. In other words, the tracker component 3 is an envelope tracking circuit that generates a power supply voltage V1 that varies according to the envelope of the amplitude of the high-frequency signal output from the signal processing circuit 72. The tracker component 3 is, for example, configured as a DC-DC converter, which detects the amplitude level of the high-frequency signal based on the I-phase signal and the Q-phase signal, and uses the detected amplitude level to generate the power supply voltage V1.

[0043] (4.3) Low-pass filter

[0044] like Figure 3 As shown, the low-pass filter 4 is positioned on the path between the output terminal of the tracker component 3 and the power amplifier 61. Figure 1 As shown, the low-pass filter 4 has multiple (four in the example) electronic components 401 to 404. The low-pass filter 4 is, for example, an LC filter, which is a filter whose main components are inductors and capacitors.

[0045] The low-pass filter 4 in this embodiment reduces the high-order harmonic components of the power supply voltage V1. This reduces noise caused by the power supply voltage V1.

[0046] (4.4) Configuration relationship of tracker components, low-pass filter and power amplifier connection terminals

[0047] In the tracker module 1 described above, such as Figure 1 As shown, the tracker component 3 and the low-pass filter 4 are disposed on the substrate 2. More specifically, the tracker component 3 and the low-pass filter 4 are disposed on the first main surface 21 of the substrate 2. Figure 1 In this example, multiple electronic components 401-404 are disposed on the substrate 2. More specifically, multiple electronic components 401-404 are disposed on the first main surface 21 of the substrate 2. This allows the path 81 (refer to...) between the tracker component 3 and the low-pass filter 4 to be... Figure 4 The parasitic resistance component generated is reduced.

[0048] However, in this embodiment, the tracker component 3 and the low-pass filter 4 are packaged together. This allows for a further reduction in the parasitic resistance component generated in the path 81 between the tracker component 3 and the low-pass filter 4.

[0049] Furthermore, in this embodiment, the tracker component 3 is disposed adjacent to the low-pass filter 4 on the substrate 2. More specifically, two electronic components 401 and 402, among the plurality of electronic components 401 to 404, are disposed adjacent to the tracker component 3. As a result, since the path 81 between the tracker component 3 and the low-pass filter 4 can be further shortened, the parasitic resistance component generated in the path 81 between the tracker component 3 and the low-pass filter 4 can be further reduced.

[0050] The power amplifier connection terminal 24 is disposed on the second main surface 22 of the substrate 2, and overlaps with the low-pass filter 4 when viewed from above in the thickness direction of the substrate 2. Figure 2 In this example, the power amplifier connection terminal 24 overlaps with the electronic component 404. Therefore, the path between the low-pass filter 4 and the power amplifier connection terminal 24, i.e., between the low-pass filter 4 and the power amplifier 61 (see reference), can be shortened. Figure 3 Path 82 between (refer to) Figure 4 Therefore, the parasitic resistance component generated in the path 82 between the low-pass filter 4 and the power amplifier 61 can be reduced.

[0051] (5) Components of the high-frequency module

[0052] Hereinafter, the constituent elements of the high-frequency module 5 of the embodiment will be described with reference to the accompanying drawings.

[0053] (5.1) Power Amplifier Circuit

[0054] like Figure 3 As shown, the power amplifier circuit 6 includes a power amplifier 61 and a control circuit 62.

[0055] The power amplifier circuit 6 is an amplifier circuit that amplifies the power of the high-frequency signal (RF signal) output from the RF signal processing circuit 75 (described later) to the level required for transmission to the base station (not shown) and outputs the amplified high-frequency signal.

[0056] (5.1.1) Power Amplifier

[0057] Although not illustrated, Figure 3 The power amplifier 61 shown includes transistors (amplifying elements), bias circuits, resistors, input matching circuits, and output matching circuits.

[0058] (5.1.2) Transistor

[0059] Figure 3The transistor (not shown) in the power amplifier 61 shown is, for example, an NPN transistor, an amplifying element supplied with power supply voltage V1 and used to amplify high-frequency signals. The transistor amplifies the high-frequency signal output from the RF signal processing circuit 75. The base of the transistor is connected to the output of the input matching circuit (not shown). Alternatively, the base of the transistor can also be electrically connected to the output of the input matching circuit via a capacitor (not shown). The collector of the transistor is electrically connected to the low-pass filter 4 of the tracker module 1. The emitter of the transistor is grounded.

[0060] A power supply voltage V1 is supplied to the transistor of power amplifier 61. A high-frequency signal output from the input matching circuit is input to the base of the transistor. Additionally, a bias circuit (not shown) is connected to the base of the transistor via a resistor (not shown), and a predetermined bias current is superimposed on the high-frequency signal output from the input matching circuit. Tracker module 1 is connected to the collector of the transistor. A power supply voltage V1 controlled according to the amplitude level of the high-frequency signal is applied from tracker module 1 to the collector of the transistor. Furthermore, the collector of the transistor is connected to filter 51 via an output matching circuit (not shown).

[0061] Here, as mentioned above, due to the use of the ET method, the amplitude level of the power supply voltage V1 varies based on the amplitude of the high-frequency signal.

[0062] (5.1.3) Bias Circuit

[0063] Figure 3 The bias circuit (not shown) of the power amplifier 61 is used to bias the transistors (not shown) of the power amplifier 61 to their operating points. The bias circuit is constructed, for example, by a transistor such as an HBT.

[0064] The bias circuit is connected to the base of the transistor that amplifies the high-frequency signal. More specifically, the bias circuit has an output terminal connected between the output terminal of the input matching circuit (not shown) and the base of the transistor. Furthermore, the bias circuit is configured to supply bias (bias current) to the base of the transistor.

[0065] Although the diagram is omitted, a battery voltage, such as that supplied from a battery in a communication device 7 equipped with a high-frequency module 5, is applied to the collector of the transistor constituting the bias circuit. The emitter of the transistor constituting the bias circuit is connected to the base of the transistor that amplifies the high-frequency signal. Furthermore, the bias circuit is not limited to the structure described above; any circuit that biases the transistor that amplifies the high-frequency signal to its operating point can have other structures.

[0066] (5.1.4) Input Matching Circuit

[0067] Figure 3The input matching circuit (not shown) of the power amplifier 61 is connected to the input side of the transistor and is a matching circuit used to match the output impedance of the circuit on the input side of the transistor (e.g., the RF signal processing circuit 75) with the input impedance of the transistor. The input matching circuit is, for example, composed of at least one of an inductor and a capacitor.

[0068] (5.1.5) Output Matching Circuit

[0069] Figure 3 The output matching circuit (not shown) of the power amplifier 61 is connected to the output side of the transistor and is a matching circuit used to match the output impedance of the transistor with the input impedance of a circuit (e.g., filter 51) on the output side of the transistor. The output matching circuit is composed of, for example, at least one of an inductor and a capacitor.

[0070] (5.1.6) Control Circuit

[0071] like Figure 3 As shown, control circuit 62 controls power amplifier 61. More specifically, control circuit 62 controls the bias circuit of power amplifier 61.

[0072] (5.2) Filter

[0073] like Figure 3 As shown, filter 51 is a transmit filter for the communication band that allows high-frequency signals to pass through. Filter 51 is disposed in the path between power amplifier circuit 6 and antenna terminal 54 in the transmit path. More specifically, filter 51 is disposed in the path between power amplifier circuit 6 and switch 52. Filter 51 allows the high-frequency signal amplified by power amplifier circuit 6 and output from power amplifier circuit 6 to pass through. The transmit path is the path connecting input terminal 53 and antenna terminal 54 for transmitting high-frequency signals from antenna 71.

[0074] Furthermore, filter 51 is not limited to a transmitting filter; it may also include a duplexer containing both a transmitting filter and a receiving filter, or a multiplexer containing three or more filters.

[0075] (5.3) Switch

[0076] like Figure 3 As shown, switch 52 is a switch that switches the path connected to antenna terminal 54. In other words, switch 52 is a switch that switches the filter connected to antenna terminal 54 from among a plurality of filters including filter 51.

[0077] Switch 52 has a common terminal 521 and multiple (two in the example) select terminals 522, 523. The common terminal 521 is connected to the antenna terminal 54. Select terminal 522 is connected to filter 51. Select terminal 523 is connected to another filter (not shown) that is different from filter 51.

[0078] Switch 52 is, for example, a switch capable of connecting any one of the multiple selectable terminals 522, 523 to a common terminal 521. Switch 52 is, for example, a switch IC (Integrated Circuit). Switch 52 is, for example, controlled by the signal processing circuit 72 described later. Switch 52 switches the connection state between the common terminal 521 and the multiple selectable terminals 522, 523 according to the control signal from the RF signal processing circuit 75 of the signal processing circuit 72. Alternatively, switch 52 can also be a switch capable of simultaneously connecting multiple selectable terminals 522, 523 to the common terminal 521. In this case, switch 52 is a switch capable of one-to-many connections.

[0079] (5.4) Antenna terminal

[0080] like Figure 3 As shown, antenna terminal 54 is the terminal for connecting to antenna 71, which will be described later. High-frequency signals from high-frequency module 5 are output to antenna 71 via antenna terminal 54. Additionally, although not shown, high-frequency signals from antenna 71 are output to high-frequency module 5 via antenna terminal 54.

[0081] (6) Components of a communication device

[0082] Hereinafter, the constituent elements of the communication device 7 according to the embodiment will be described with reference to the accompanying drawings.

[0083] (6.1) Antenna

[0084] like Figure 3 As shown, antenna 71 is connected to antenna terminal 54 of high-frequency module 5. Antenna 71 has the function of radiating high-frequency signals (transmit signals) output from high-frequency module 5 through radio wave radiation and the function of receiving high-frequency signals (receive signals) as radio waves from the outside and outputting them to high-frequency module 5.

[0085] (6.2) Signal processing circuit

[0086] like Figure 3 As shown, the signal processing circuit 72 includes a baseband signal processing circuit 74 and an RF signal processing circuit 75. The signal processing circuit 72 outputs high-frequency signals to the high-frequency module 5.

[0087] The baseband signal processing circuit 74, for example, is a BBIC (Baseband Integrated Circuit), which performs signal processing for high-frequency signals. The frequency of high-frequency signals is, for example, from several hundred MHz to several GHz.

[0088] The baseband signal processing circuit 74 generates I-phase and Q-phase signals based on the baseband signal. The baseband signal can be, for example, an externally input audio signal or image signal. The baseband signal processing circuit 74 performs IQ modulation processing by combining the I-phase and Q-phase signals, and outputs a transmit signal. At this time, the transmit signal is generated as a modulated signal (IQ signal) whose amplitude is modulated by a carrier signal at a specified frequency with a period longer than the period of the carrier signal. The modulated signal output from the baseband signal processing circuit 74 is output as the IQ signal. The IQ signal represents the amplitude and phase on the IQ plane. The frequency of the IQ signal is, for example, around several MHz to tens of MHz.

[0089] The RF signal processing circuit 75 is, for example, an RFIC (Radio Frequency Integrated Circuit) that performs signal processing for high-frequency signals. For example, the RF signal processing circuit 75 performs prescribed signal processing on the modulated signal (IQ signal) output from the baseband signal processing circuit 74. More specifically, the RF signal processing circuit 75 performs up-conversion and other signal processing on the modulated signal output from the baseband signal processing circuit 74, and outputs the processed high-frequency signal to the power amplifier circuit 6. Furthermore, the RF signal processing circuit 75 is not limited to performing a direct conversion from the modulated signal to a high-frequency signal. The RF signal processing circuit 75 can also convert the modulated signal to an intermediate frequency (IF) signal and generate a high-frequency signal based on the converted IF signal.

[0090] The signal processing circuit 72 outputs a power control signal to the tracker component 3 of the tracker module 1. The power control signal is a signal containing information related to changes in the amplitude of the high-frequency signal, and is output from the signal processing circuit 72 to the tracker module 1 to change the amplitude of the power supply voltage V1. The power control signal may be, for example, an I-phase signal and a Q-phase signal.

[0091] (7) Actions of the tracker module

[0092] Next, the operation of the tracker module 1 of the embodiment will be described with reference to the accompanying drawings.

[0093] like Figure 4As shown, the tracker component 3 outputs a power supply voltage V1. Because the first path length L1 of the path 81 between the tracker component 3 and the low-pass filter 4 is short, the magnitude of the parasitic resistance component, parasitic capacitance component, and inductance component generated in the path 81 can be reduced.

[0094] Low-pass filter 4 allows the power supply voltage V1 from tracker component 3 to pass through. Low-pass filter 4 reduces the higher harmonic components of power supply voltage V1. That is, low-pass filter 4 blocks the higher harmonic components of power supply voltage V1, while allowing the fundamental component of power supply voltage V1 to pass through.

[0095] Then, the power supply voltage V1 through the low-pass filter 4 is applied to the power amplifier 61. At this time, since the second path length L2 of the path 82 between the low-pass filter 4 and the power amplifier 61 is shorter, the magnitude of the parasitic resistance component, parasitic capacitance component and inductance component generated in the path 82 can be reduced.

[0096] As described above, by reducing the parasitic capacitance and inductance components generated in paths 81 and 82, such as Figure 5 As shown, in low-pass filter 4, a steep attenuation can be obtained at the attenuation stage. Figure 5 Characteristic A1). On the other hand, when the above path is long, due to the large parasitic capacitance and inductance components, the attenuation at the attenuation electrode in the low-pass filter 4 deteriorates by about 10dB. Figure 5 Characteristic A2).

[0097] (8) Effect

[0098] In the tracker module 1 of this embodiment, a tracker component 3 and a low-pass filter 4 are disposed on a substrate 2 (second substrate) separate from the first substrate on which the power amplifier 61 is disposed. As a result, since the path 81 between the tracker component 3 and the low-pass filter 4 can be shortened, the parasitic resistance component generated in the path 81 between the tracker component 3 and the low-pass filter 4 can be reduced. By reducing the parasitic resistance component, the power consumption of the tracker module 1 can be reduced. That is, the power consumption of the tracker module 1 when supplying the power supply voltage V1 to the power amplifier 61 can be reduced.

[0099] Furthermore, in the tracker module 1 of the embodiment, the low-pass filter 4 has the function of reducing the high-frequency components of the power supply voltage output from the tracker component 3, and its characteristics are determined by the impedance characteristics of the path 81 containing the tracker component 3 and the low-pass filter 4. By disposing the low-pass filter 4 on the substrate 2 (second substrate), the effect of the low-pass filter 4 can be stably obtained regardless of the positional relationship between the first substrate and the second substrate.

[0100] In the tracker module 1 of the embodiment, the tracker component 3 and the low-pass filter 4 are single-packaged. This allows for a further reduction in the parasitic resistance component generated in the path 81 between the tracker component 3 and the low-pass filter 4. By further reducing the parasitic resistance component, the power consumption of the tracker module 1 (power consumption when supplying power supply voltage V1 to the power amplifier 61) can be further reduced.

[0101] In the tracker module 1 of the embodiment, the tracker component 3 and the low-pass filter 4 are arranged adjacent to each other on the substrate 2. Therefore, since the path 81 between the tracker component 3 and the low-pass filter 4 can be further shortened, the parasitic resistance component generated in the path 81 between the tracker component 3 and the low-pass filter 4 can be further reduced. By further reducing the parasitic resistance component, the power consumption of the tracker module 1 (the power consumption when the power supply voltage V1 is supplied to the power amplifier 61) can be further reduced.

[0102] In the tracker module 1 of this embodiment, when viewed from the thickness direction of the substrate 2 (second substrate), the power amplifier connection terminal 24 overlaps with the low-pass filter 4. Therefore, since the path between the low-pass filter 4 and the power amplifier connection terminal 24, i.e., the path 82 between the low-pass filter 4 and the power amplifier 61, can be shortened, the parasitic resistance component generated in the path 82 between the low-pass filter 4 and the power amplifier 61 can be reduced. By reducing the parasitic resistance component, the power consumption of the tracker module 1 (the power consumption when supplying power supply voltage V1 to the power amplifier 61) can be further reduced.

[0103] In the tracker module 1 of the embodiment, the low-pass filter 4 reduces the high-order harmonic components of the power supply voltage V1. This reduces the noise caused by the power supply voltage V1.

[0104] (Modified Example)

[0105] Hereinafter, variations of the implementation method will be described.

[0106] (1) Variation Example 1

[0107] like Figure 6 As shown, the high-frequency module 5a of the modified embodiment 1 includes a tracker module 1a, a power amplifier circuit 6a, a filter 51, a switch 52, an input terminal 53, and an antenna terminal 54.

[0108] like Figure 6 As shown, the tracker module 1a includes a tracker component 3a and multiple (two in the example) low-pass filters 41, 42.

[0109] The tracker component 3a is configured similarly to the tracker component 3 in Embodiment 1 to supply power supply voltages V11 and V12 to the power amplifier 61a. The tracker component 3a outputs power supply voltage V11 to the low-pass filter 41 and power supply voltage V12 to the low-pass filter 42.

[0110] like Figure 6 As shown, the power amplifier circuit 6a includes a power amplifier 61a and a control circuit 62a.

[0111] Although not illustrated, Figure 6 The power amplifier 61a shown includes multiple (e.g., two) transistors (amplifying elements), multiple (e.g., two) bias circuits, multiple (e.g., two) resistors, an input matching circuit, an output matching circuit, and a matching circuit. The multiple transistors include a first transistor (not shown) and a second transistor (not shown). The multiple bias circuits include a first bias circuit (not shown) and a second bias circuit (not shown). The multiple resistors include a first resistor (not shown) and a second resistor (not shown).

[0112] A power supply voltage V11 is supplied to the first transistor (not shown). A high-frequency signal output from the input matching circuit is input to the base of the first transistor. Additionally, a first bias circuit is connected to the base of the first transistor via a first resistor, and a predetermined bias current is superimposed on the high-frequency signal output from the input matching circuit. The tracker module 1a is connected to the collector of the first transistor. A power supply voltage V11 controlled according to the amplitude level of the high-frequency signal is applied from the tracker module 1a to the collector of the first transistor. Furthermore, the collector of the first transistor is connected to a second transistor (not shown) via a matching circuit (not shown).

[0113] A power supply voltage V12 is supplied to the second transistor (not shown). A high-frequency signal output from the matching circuit is input to the base of the second transistor. Additionally, a second bias circuit is connected to the base of the second transistor via a second resistor, and a predetermined bias voltage is superimposed on the high-frequency signal output from the matching circuit. The tracker module 1a is connected to the collector of the second transistor. A power supply voltage V12, controlled according to the amplitude level of the high-frequency signal, is applied from the tracker module 1a to the collector of the second transistor. Furthermore, the collector of the second transistor is connected to the filter 51 via an output matching circuit (not shown).

[0114] Figure 6 The first bias circuit (not shown) of the power amplifier 61a shown is a circuit used to bias the first transistor (not shown) to the operating point. Figure 6 The second bias circuit (not shown) of the power amplifier 61a shown is a circuit used to bias the second transistor (not shown) to the operating point.

[0115] A second bias circuit (not shown) is connected to the base of a second transistor (not shown). More specifically, the second bias circuit has an output terminal connected between the output terminal of a matching circuit (not shown) and the base of the second transistor. Furthermore, the second bias circuit is configured to supply bias (bias current) to the base of the second transistor.

[0116] The matching circuit (not shown) of the power amplifier 61a is disposed between the first transistor and the second transistor, and is a matching circuit used to match the output impedance of the first transistor and the input impedance of the second transistor. The matching circuit is, for example, composed of at least one of an inductor and a capacitor.

[0117] like Figure 6 As shown, control circuit 62a controls power amplifier 61a. More specifically, control circuit 62a controls multiple bias circuits of power amplifier 61a.

[0118] (2) Variation Example 2

[0119] As a variation of the implementation, tracker module 1b (high-frequency module 5b) can also be... Figure 7 The structure is as shown. In Modification 2, the tracker module 1b includes a tracker component 3b and a low-pass filter 4b. The tracker component 3b outputs the power supply voltage V1 to the power amplifier 61b. The low-pass filter 4b is connected to the output terminal of the tracker component 3b.

[0120] On the main surface 551 of the substrate 55, the first path length L3 of the path 81b between the tracker component 3b and the low-pass filter 4b is shorter than the second path length L4 of the path 82b between the low-pass filter 4b and the power amplifier 61b.

[0121] In the tracker module 1b of Modified Example 2, the first path length L3 of the path 81b between the tracker component 3b and the low-pass filter 4b is shorter than the second path length L4 of the path 82b between the low-pass filter 4b and the power amplifier 61. This reduces the parasitic resistance component generated in the path 81b between the tracker component 3b and the low-pass filter 4b. By reducing the parasitic resistance component, the power consumption of the tracker module 1b (the power consumption when the tracker module 1b supplies power supply voltage V1 to the power amplifier 61) can be reduced.

[0122] Furthermore, the relationship between the first path length L3 of the path 81b between the tracker component 3b and the low-pass filter 4b and the second path length L4 of the path 82b between the low-pass filter 4b and the power amplifier 61 is not limited to the above. The first path length L3 of the path 81b between the tracker component 3b and the low-pass filter 4b may also be longer than the second path length L4 of the path 82b between the low-pass filter 4b and the power amplifier 61.

[0123] (3) Other variations

[0124] As a variation of the implementation, in tracker module 1, tracker component 3 and low-pass filter 4 can also be configured separately.

[0125] As another variation of the implementation, in tracker module 1, low-pass filter 4 is disposed on substrate 2 between tracker component 3 and at least one electronic component.

[0126] Furthermore, in the low-pass filter 4, it is not limited to two electronic components 401 and 402 from the plurality of electronic components 401 to 404 being arranged adjacent to the tracker component 3. Alternatively, only one electronic component from the plurality of electronic components 401 to 404 may be arranged adjacent to the tracker component 3, or all three electronic components from the plurality of electronic components 401 to 404 may be arranged adjacent to the tracker component 3.

[0127] Furthermore, the low-pass filter 4 is not limited to being composed of multiple electronic components 401 to 404. The low-pass filter 4 can also be composed of a single chip.

[0128] The power amplifier circuit 6 can also be configured as a power amplifier module. The power amplifier module includes a tracker module 1 and a power amplifier 61. The power amplifier 61 is driven by the power supply voltage V1 output from the tracker module 1 and amplifies the high-frequency signal.

[0129] In this modified power amplifier module, a tracker component 3 and a low-pass filter 4 are arranged in the tracker module 1. Therefore, since the path 81 between the tracker component 3 and the low-pass filter 4 can be shortened, the parasitic resistance component generated in the path 81 between the tracker component 3 and the low-pass filter 4 can be reduced. By reducing the parasitic resistance component, the power consumption of the tracker module 1 (the power consumption of the tracker module 1 when supplying power supply voltage V1 to the power amplifier 61) can be reduced.

[0130] The embodiments and modifications described above are only a part of the various embodiments and modifications of the present invention. Furthermore, the embodiments and modifications can be modified in various ways, depending on the design, as long as they achieve the objectives of the present invention.

[0131] (Way)

[0132] The following methods are disclosed in this specification.

[0133] The tracker module (1; 1a; 1b) of the first embodiment includes a second substrate (substrate 2) separate from the first substrate, tracker components (3; 3a; 3b), and a low-pass filter (4; 41; 42; 4b). A power amplifier (61; 61a) is disposed on the first substrate. The tracker components (3; 3a; 3b) supply power supply voltages (V1; V11; V12) to the power amplifier (61; 61a). The low-pass filter (4; 41; 42; 4b) is disposed on the path between the output terminal of the tracker components (3; 3a; 3b) and the power amplifier (61; 61a). The tracker components (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) are disposed on the second substrate.

[0134] According to the tracker module (1; 1a; 1b) of the first embodiment, since the path (81; 81b) between the tracker components (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be shortened, the parasitic resistance component generated in the path (81; 81b) between the tracker components (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be reduced. By reducing the parasitic resistance component, the power consumption of the tracker module (1; 1a; 1b) can be reduced.

[0135] Furthermore, in the tracker module (1; 1a; 1b) of the first embodiment, the low-pass filter (4; 41; 42; 4b) has the function of reducing the high-frequency components of the power supply voltage (V1; V11; V12) output from the tracker component (3; 3a; 3b), and its characteristics are determined by the impedance characteristics of the path (81) containing the tracker component (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b). By disposing the low-pass filter (4; 41; 42; 4b) on the second substrate (substrate 2), the effect of the low-pass filter (4; 41; 42; 4b) can be stably obtained regardless of the positional relationship between the first substrate and the second substrate.

[0136] In the second type of tracker module (1; 1a; 1b), based on the first type, the tracker components (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) are single-packaged.

[0137] According to the tracker module (1; 1a; 1b) of the second embodiment, the parasitic resistance component generated in the path (81; 81b) between the tracker component (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be further reduced. By further reducing the parasitic resistance component, the power consumption of the tracker module (1; 1a; 1b) can be further reduced.

[0138] In the third-party tracker module (1; 1a; 1b), based on the first or second method, a low-pass filter (4; 41; 42; 4b) is disposed adjacent to the tracker component (3; 3a; 3b) on the second substrate (substrate 2).

[0139] According to the third-party tracker module (1; 1a; 1b), since the path (81; 81b) between the tracker components (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be further shortened, the parasitic resistance component generated in the path (81; 81b) between the tracker components (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be further reduced. By further reducing the parasitic resistance component, the power consumption of the tracker module (1; 1a; 1b) can be further reduced.

[0140] In the tracker module (1; 1a; 1b) of the fourth embodiment, based on the third embodiment, the low-pass filter (4; 41; 42; 4b) has multiple electronic components (401-404). At least one of the multiple electronic components (401-404) is arranged adjacent to the tracker component (3; 3a; 3b).

[0141] In the fifth type of tracker module (1; 1a; 1b), based on any of the first to fourth types, the second substrate (substrate 2) has a first main surface (21) and a second main surface (22) that are opposite to each other, and has a power amplifier connection terminal (24) for connecting to a power amplifier (61; 61a). Tracker components (3; 3a; 3b) and low-pass filters (4; 41; 42; 4b) are disposed on the first main surface (21) of the second substrate. The power amplifier connection terminal (24) is disposed on the second main surface (22) of the second substrate and overlaps with the low-pass filters (4; 41; 42; 4b) when viewed from the thickness direction of the second substrate.

[0142] According to the tracker module (1; 1a; 1b) of the fifth embodiment, since the path between the low-pass filter (4; 41; 42; 4b) and the power amplifier connection terminal (24), i.e. the path (82; 82b) between the low-pass filter (4; 41; 42; 4b) and the power amplifier (61; 61a), can be shortened, the parasitic resistance component generated in the path (82; 82b) between the low-pass filter (4; 41; 42; 4b) and the power amplifier (61; 61a) can be reduced. By reducing the parasitic resistance component, the power consumption of the tracker module (1; 1a; 1b) can be further reduced.

[0143] In the tracker module (1; 1a; 1b) of the sixth method, the low-pass filter (4; 41; 42; 4b) is composed of a single chip, based on any one of the first to fifth methods.

[0144] The seventh type of tracker module (1; 1a; 1b) includes a tracker component (3; 3a; 3b) and a low-pass filter (4; 41; 42; 4b). The tracker component (3; 3a; 3b) outputs the power supply voltage (V1; V11; V12) of the power amplifier (61; 61a). The low-pass filter (4; 41; 42; 4b) is connected to the output of the tracker component (3; 3a; 3b). The first path length (L1; L3) of the path (81; 81b) between the tracker component (3; 3a; 3b) and the low-pass filter (4; 4a; 42; 4b) is shorter than the second path length (L2; L4) of the path (82; 82b) between the low-pass filter (4; 41; 42; 4b) and the power amplifier (61; 61a).

[0145] According to the tracker module (1; 1a; 1b) of the seventh method, the parasitic resistance component generated in the path (81; 81b) between the tracker component (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be reduced. By reducing the parasitic resistance component, the power consumption of the tracker module (1; 1a; 1b) can be reduced.

[0146] The power amplifier module of the eighth method has any one of the tracker modules (1; 1a; 1b) and the power amplifier (61; 61a) from the first to the seventh methods.

[0147] According to the power amplifier module of the eighth embodiment, in the tracker module (1; 1a; 1b), since the path (81; 81b) between the tracker components (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be shortened, the parasitic resistance component generated in the path (81; 81b) between the tracker components (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be reduced. By reducing the parasitic resistance component, the power consumption of the tracker module (1; 1a; 1b) can be reduced.

[0148] The high-frequency module (5) of the ninth method includes any one of the tracker modules (1; 1a; 1b) of the first to seventh methods, a power amplifier (61; 61a), and a transmission filter (filter 51). The transmission filter allows the high-frequency signal amplified by the power amplifier (61; 61a) to pass through.

[0149] According to the high-frequency module (5) of the ninth embodiment, in the tracker module (1; 1a; 1b), since the path (81; 81b) between the tracker component (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be shortened, the parasitic resistance component generated in the path (81; 81b) between the tracker component (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be reduced. By reducing the parasitic resistance component, the power consumption of the tracker module (1; 1a; 1b) can be reduced.

[0150] The tenth type of communication device (7) includes the ninth type of high-frequency module (5) and signal processing circuit (72). The signal processing circuit (72) outputs a high-frequency signal to the high-frequency module (5).

[0151] According to the communication device (7) of the tenth method, in the tracker module (1; 1a; 1b), since the path (81; 81b) between the tracker component (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be shortened, the parasitic resistance component generated in the path (81; 81b) between the tracker component (3; 3a; 3b) and the low-pass filter (4; 41; 42; 4b) can be reduced. By reducing the parasitic resistance component, the power consumption of the tracker module (1; 1a; 1b) can be reduced.

[0152] Explanation of reference numerals in the attached figures

[0153] 1, 1a, 1b… Tracker module; 2… Substrate (second substrate); 21… First main surface; 22… Second main surface; 23… External connection terminal; 24… Power amplifier connection terminal; 3, 3a, 3b… Tracker components; 4, 41, 42, 4b… Low-pass filter; 401-404… Electronic components; 5, 5a, 5b… High-frequency module; 51… Filter; 52… Switch; 521… Common terminal; 522, 523… Selection terminal; 53… Input terminal; 54… Antenna terminal; 55… Base… Board; 551…Main surface; 6, 6a…Power amplifier circuit; 61, 61a, 61b…Power amplifier; 62, 62a…Control circuit; 7…Communication device; 71…Antenna; 72…Signal processing circuit; 74…Baseband signal processing circuit; 75…RF signal processing circuit; 81, 81b…Path; 82, 82b…Path; L1, L3…First path length; L2, L4…Second path length; V1, V11, V12…Power supply voltage; V2…Battery voltage; A1, A2…Characteristics.

Claims

1. A tracker module, comprising: The second substrate is separate from the first substrate in which the power amplifier is configured; The tracker component supplies power voltage to the aforementioned power amplifier; and A low-pass filter is disposed on the path between the output of the tracker component and the power amplifier. The aforementioned tracker component and the aforementioned low-pass filter are disposed on the aforementioned second substrate. The low-pass filter is disposed adjacent to the tracker component on the second substrate.

2. The tracker module according to claim 1, wherein, The aforementioned tracker component and the aforementioned low-pass filter are individually packaged.

3. The tracker module according to claim 1, wherein, The aforementioned low-pass filter has multiple electronic components. At least one of the aforementioned electronic components is configured adjacent to the aforementioned tracker component.

4. The tracker module according to claim 1, wherein, The second substrate has a first main surface and a second main surface that are opposite to each other, and has a power amplifier connection terminal for connecting to the power amplifier. The aforementioned tracker component and the aforementioned low-pass filter are disposed on the aforementioned first main surface of the aforementioned second substrate. The power amplifier connection terminal is disposed on the second main surface of the second substrate and overlaps with the low-pass filter when viewed from the thickness direction of the second substrate.

5. The tracker module according to claim 1, wherein, The aforementioned low-pass filter is composed of a single chip.

6. A power amplifier module, comprising: The tracker module according to any one of claims 1 to 5; and The aforementioned power amplifier.

7. A high-frequency module, comprising: The tracker module according to any one of claims 1 to 5; The aforementioned power amplifier; and A transmission filter is used to allow the high-frequency signal amplified by the aforementioned power amplifier to pass through.

8. A communication device comprising: The high-frequency module according to claim 7; and The signal processing circuit outputs a high-frequency signal to the aforementioned high-frequency module.

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