heater

Abstract

A heating appliance has a heater member and a peripheral wall member. The heater member includes a cylindrical ceramic base, a heating resistor provided to the ceramic base, and a plurality of flange portions fixed to an outer peripheral surface of the ceramic base and extending in a direction away from the outer peripheral surface. The peripheral wall member surrounds the heater member in an axial direction and in a circumferential direction. A first flange portion is located at a position closer to one side than a central portion of the ceramic base in the axial direction, and a second flange portion is located at a position closer to the other side than the central portion of the ceramic base in the axial direction.

Description

Technical Field

[0001] This disclosure relates to heaters. Background Technology

[0002] An example of prior art is described in Patent Document 1.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Publication No. 2019-521656 Summary of the Invention

[0006] The heater of one embodiment of this disclosure has:

[0007] A heater component includes a cylindrical ceramic substrate, a heating resistor disposed on the ceramic substrate, and a plurality of flanges fixed to the outer peripheral surface of the ceramic substrate and extending away from the outer peripheral surface; and

[0008] A peripheral wall member that surrounds the heater member in the axial direction and circumferential direction.

[0009] One flange is located on one side of the center in the axial direction of the ceramic substrate, and the other flange is located on the other side of the center in the axial direction of the ceramic substrate. Attached Figure Description

[0010] The purpose, features, and advantages of this disclosure will become clearer from the following detailed description and accompanying drawings.

[0011] Figure 1 This is a longitudinal sectional view showing the heater of the first embodiment.

[0012] Figure 2 This is an exploded perspective view of the heater.

[0013] Figure 3 This is a longitudinal sectional view showing the heater according to the second embodiment.

[0014] Figure 4 This is an enlarged longitudinal sectional view showing the heater according to the third embodiment.

[0015] Figure 5 This is a longitudinal sectional view showing the heater according to the fourth embodiment.

[0016] Figure 6 This is a diagram of the unfolded heating resistor.

[0017] Figure 7 This is a longitudinal sectional view of the ceramic matrix.

[0018] Figure 8This is a longitudinal sectional view of the ceramic matrix.

[0019] Figure 9 This is a longitudinal sectional view showing the heater according to the fifth embodiment.

[0020] Figure 10 This is a cross-sectional view showing the heater according to the fifth embodiment. Detailed Implementation

[0021] As a type of heater that forms the basis of the heater disclosed herein, cylindrical heaters are known in heating devices for heating objects such as cigarettes, food, or medicine. In such heating devices, the outer peripheral surface of the heater is fixed to the inner peripheral surface of the housing by a plurality of flanges (see, for example, Patent Document 1).

[0022] Hereinafter, embodiments of the heater of this disclosure will be described in detail with reference to the accompanying drawings.

[0023] Figure 1 This is a longitudinal sectional view showing the heater of the first embodiment. Figure 2 This is an exploded perspective view of the heater. The heater 100 of this embodiment includes a heater component 10 and a peripheral wall component 20. The heater component 10 includes: a cylindrical ceramic substrate 11; a heating resistor 12 disposed on the ceramic substrate 11; and a plurality of flanges 13, 14 fixed to the outer peripheral surface 11s of the ceramic substrate 11 and extending in a direction away from the outer peripheral surface. The peripheral wall component 20 surrounds the heater component 10 in the axial direction and circumferential direction. Figure 1 The object to be heated, T, shown by the imaginary lines, is, for example, a cylindrical cigarette. The heater 100 can insert the object to be heated, T, into the cylindrical ceramic substrate 11 and heat the object T by means of the heating resistor 12.

[0024] The ceramic substrate 11 is a cylindrical component, and in the longitudinal direction (towards) Figure 1 The ceramic substrate 11 has an end on one side (also referred to as the first end) 11a and an end on the other side (hereinafter referred to as the second end) 11b in the vertical direction when viewed from the paper. The shape of the ceramic substrate 11 may be, for example, cylindrical, polygonal, or other shapes. In this embodiment, the ceramic substrate 11 is cylindrical.

[0025] The ceramic matrix 11 is formed of an electrically insulating ceramic material. For example, oxide ceramics such as alumina and zirconium oxide, nitride ceramics such as aluminum nitride, carbide ceramics such as silicon carbide, or silicon nitride ceramics can be used.

[0026] The heating resistor 12 is a component that generates heat by applying an electric current, and is disposed inside or on the surface (inner or outer circumferential surface) of the ceramic substrate 11. The heating resistor 12 may have a take-out portion at its end for connection to external wiring, and can be energized through the take-out portion. The heating resistor 12 is formed, for example, of carbides of materials such as tungsten, molybdenum, and chromium, or metals such as gold, silver, and palladium. The heating resistor 12 may also contain aluminum oxide or silicon nitride as components other than metals. The shape is not particularly limited as long as the heating resistor 12 is configured to be distributed and generate heat throughout the entire ceramic substrate 11. The heating resistor 12 may be, for example, a spiral shape coaxial with the axis of the ceramic substrate 11, or a bent shape (zigzag line shape) having multiple straight portions parallel to the axis of the ceramic substrate 11 and multiple connecting portions connecting the ends of the straight portions to each other.

[0027] The ceramic substrate 11 is fixed to the peripheral wall member 20 by means of a plurality of flanges 13, 14. In this embodiment, the heater member 10 has two flanges 13, 14. One of the flanges 13 (first flange) 13 is located on one side further away from the center in the axial direction of the ceramic substrate 11, and the other flange (second flange) 14 is located on the other side further away from the center in the axial direction of the ceramic substrate 11.

[0028] Flanges 13 and 14 are formed of, for example, ceramic, metallic, or resin materials. As ceramic materials, for example, oxide ceramics such as alumina and zirconium oxide, nitride ceramics such as aluminum nitride, carbide ceramics such as silicon carbide, or silicon nitride ceramics can be used. As resin materials, for example, PEEK (polyetheretherketone), PAI (polyamide-imide), PTFE (polytetrafluoroethylene), etc., can be used. As metallic materials, for example, stainless steel, aluminum alloys, titanium alloys, nickel alloys, magnesium alloys, etc. The first flange 13 can be a component formed of a ceramic material, a metallic material, or a resin material. The second flange 14 can be a component formed of a ceramic material, a metallic material, or a resin material. The first flange 13 and the second flange 14 can be components formed of the same material or components formed of different materials.

[0029] The peripheral wall member 20 is a cylindrical member that surrounds the heater member 10 in the axial direction and circumferential direction. The shape of the peripheral wall member 20 can be, for example, cylindrical, polygonal, or other shapes. In this embodiment, the peripheral wall member 20 is a bottomed cylindrical member that is open on one side of the axial direction and sealed by the bottom surface on the other side of the axial direction, and has a cylindrical portion 21 and a bottom portion 22.

[0030] In this embodiment, for the heater component 10, the first end 11a of the ceramic substrate 11 is located on the open side of the peripheral wall component 20, and the second end 11b of the ceramic substrate 11 is located on the side facing the bottom portion 22 of the peripheral wall component 20. Alternatively, for example, a space can be provided between the second end 11b of the ceramic substrate 11 and the bottom portion 22 of the peripheral wall component 20, and a power source such as a battery and a power control circuit can be arranged in this space. Alternatively, the end of the heating resistor 12 can be exposed at the second end 11b of the ceramic substrate 11 to provide a connection terminal, and the power control circuit can be wired and connected to the connection terminal. Alternatively, the peripheral wall component 20 can be simply a cylindrical portion 21, also open in the other direction along the axis. In this case, for example, the power source and power control circuit can be arranged outside the peripheral wall component 20, and the end of the heating resistor 12 exposed at the second end 11b of the ceramic substrate 11 can be wired and connected to the component.

[0031] The material of the peripheral wall member 20 is not limited as long as it can support the heater member 10; for example, it can be made of metal or resin. Examples of metal materials include stainless steel, aluminum alloy, titanium alloy, nickel alloy, and magnesium alloy. Examples of resin materials include silicone resin and polyimide resin. Alternatively, a combination of metal and resin materials can be used.

[0032] Regarding the temperature distribution of the ceramic substrate 11 based on the heating resistor 12, the central portion in the axial direction is at a high temperature, and the temperature decreases towards both ends in the axial direction from the central portion. The first flange portion 13 and the second flange portion 14 are located at the ends in the axial direction, closer to the central portion of the ceramic substrate 11 than the central portion in the axial direction. Here, the central portion in the axial direction is, for example, the portion located in the center when the axial length of the ceramic substrate 11 is divided into three equal parts. As a result, the heat transfer path from the ceramic substrate 11 to the peripheral wall member 20 based on the flange portions 13 and 14 becomes a path that bypasses the central portion in the axial direction and passes through the low-temperature portion near both ends in the axial direction, thus reducing heat release and improving the heating performance of the heater 100.

[0033] In this embodiment, the first flange portion 13 is located at the first end portion 11a of the ceramic substrate 11. The second flange portion 14 is located between the second end portion 11b and the central portion of the ceramic substrate 11. The first end portion 11a of the ceramic substrate 11 is the lowest temperature portion from the central portion to the first end portion 11a in the temperature distribution of the ceramic substrate 11. The first flange portion 13 is located in the low-temperature portion of the ceramic substrate 11, thus further reducing heat release.

[0034] Furthermore, by making the inner diameter of the ceramic substrate 11 the same as or slightly smaller than the outer diameter of the object to be heated T, the object to be heated T can easily adhere tightly to the inner circumferential surface of the ceramic substrate 11, thus facilitating heating. When using the heater 100, when the user inserts the object to be heated T into the ceramic substrate 11, the external force applied to the ceramic substrate 11 often deviates from the axial direction. In particular, a greater external force is applied to the insertion side of the object to be heated T, i.e., the first end 11a of the ceramic substrate 11. Therefore, by using the first flange 13 for support, it is possible to suppress positional displacement of the heater component 10 due to external forces, and to prevent the heater component 10 from detaching from the peripheral wall component 20.

[0035] By providing the first flange portion 13 at the first end 11a of the ceramic substrate 11, the first flange portion 13 can be located away from the central portion of the ceramic substrate 11, which is at a high temperature. Therefore, compared to the case where the first flange portion 13 is not provided at the first end 11a, the heat transfer path from the ceramic substrate 11 to the peripheral wall member 20 can be increased. As a result, since heat release is reduced, the heating rate can be further improved.

[0036] It should be noted that the inner diameter of the ceramic substrate 11 can be set according to the intended use of the heater 100. When the heater 100 is used as a portable food heater for outdoor use such as camping, the inner diameter of the ceramic substrate 11 can be set to, for example, approximately 5 cm, to accommodate the average size of the food being heated (e.g., grilled chicken skewers, meatballs, or sausages). Furthermore, when the heater 100 is used as a cigarette heating device, the inner diameter of the ceramic substrate 11 can be set to, for example, approximately 1 cm, to accommodate the size of the cigarette being heated. Additionally, when the heater 100 is used as a heating device for needles in acupuncture treatment medical devices, the inner diameter of the ceramic substrate 11 can be set to, for example, approximately 2 cm.

[0037] Figure 3 This is a longitudinal sectional view showing the heater of the second embodiment. The heater 100A of the second embodiment is identical to the heater 100 of the first embodiment, except that the second flange portion 14 is located at the second end portion 11b of the ceramic substrate 11. Therefore, the structure other than the second flange portion 14 is omitted from the description. The second end portion 11b of the ceramic substrate 11 is the portion with the lowest temperature from the center to the second end portion 11b in the temperature distribution of the ceramic substrate 11. The second flange portion 14 is located in the low-temperature portion of the ceramic substrate 11, thus further reducing heat release.

[0038] The second end 11b of the ceramic substrate 11 exposes the heating resistor 12, as described above, and becomes a portion for wiring connection with the power supply circuit. If, when the user inserts the object to be heated T into the ceramic substrate 11, the external force applied to the ceramic substrate 11 deviates from the axial direction, the displacement of the second end 11b of the ceramic substrate 11 is greater than the displacement of the first end 11a. If the second end 11b repeatedly displaces due to the insertion and removal of the object to be heated T, poor connection between the power supply circuit and the heating resistor 12, such as wire breakage or wire detachment, can occur. As in this embodiment, the second flange 14 is located at the second end 11b of the ceramic substrate 11, thereby reducing the displacement of the second end 11b and suppressing poor connection of the power supply circuit.

[0039] Figure 4 This is an enlarged cross-sectional view showing the heater according to the third embodiment. The heater 100B of the third embodiment is identical to the heater 100 of the first embodiment, except that the second flange 14 is fixed to the outer peripheral surface 11s of the ceramic substrate 11 by the glass material 15. Therefore, the structure other than the glass material 15 is omitted from the description. For example, borosilicate glass, quartz glass, etc., can be used as the glass material 15.

[0040] Glass material 15 is sandwiched between the second flange portion 14 and the ceramic substrate 11. A portion of the glass material 15 is located on the central side of the ceramic substrate 11 in the axial direction, relative to the second flange portion 14, while another portion of the glass material 15 is located on the other side of the ceramic substrate 11 in the axial direction (the second end portion 11b side), relative to the second flange portion 14. In this embodiment, the amount of the portion 15a located on the central side of the glass material 15 is less than the amount of the portion 15b located on the second end portion 11b side. The glass material 15 can also serve as a heat transfer path, so by reducing the portion 15a located on the central side, heat release can be reduced. By increasing the portion 15b located on the second end portion 11b side, the fixing strength between the second flange portion 14 and the ceramic substrate 11 can be increased.

[0041] In the first to third embodiments, for example, the first flange portion 13 can be formed using resin material, and the second flange portion 14 can be formed using ceramic material. As described above, a larger external force is easily applied to the first end 11a of the ceramic substrate 11, which is the insertion side of the heated object T. By forming the first flange portion 13 located at the first end 11a using resin material, the external force can be dispersed under the elastic force of the resin material, and small displacement of the first end 11a can be allowed. As described above, the second end 11b of the ceramic substrate 11 is prone to displacement more significantly than the first end 11a when the heated object T is inserted or removed. By forming the second flange portion 14 using ceramic material, displacement of the second end 11b can be suppressed. Furthermore, if small displacement of the first end 11a is allowed, displacement of the second end 11b is further suppressed. Thus, poor connection between the heating resistor 12 and the power supply circuit can be suppressed.

[0042] Figure 5 This is a longitudinal sectional view showing the heater according to the fourth embodiment. Figure 6 This is a unfolded view showing the shape of the heating resistor 12. The heating resistor 12 is cylindrical along the ceramic substrate 11, therefore, for ease of understanding of the shape... Figure 6 The diagram is shown in its unfolded form. The vertical direction when viewed from the paper is taken as the axial direction of the ceramic substrate 11. Figure 6 As shown, the heating resistor 12 of this embodiment has a bent shape with multiple straight sections parallel to the axis of the ceramic substrate 11 and multiple connecting sections connecting the ends of the straight sections to each other. In the bent shape, particularly because the straight sections are adjacent to each other and the connection between the straight sections and the connecting sections is bent, a high-temperature region 12a with high heat generation exists. The heating resistor 12 has a take-out portion 12b for electrical connection to an external source. The take-out portion 12b is wider and has lower resistance than the wiring in the high-temperature region 12a, thereby suppressing heat generation.

[0043] In the heater 100C of this embodiment, when viewed from a direction orthogonal to the axis of the heater base 11, the first flange portion 13 and the second flange portion 14 are offset from the high-temperature region 12a of the heating resistor 12. As a result, the heat transfer path from the ceramic base 11 to the peripheral wall member 20 based on the flange portions 13 and 14 is a path that avoids the high-temperature portion, thereby reducing heat release. As a result, the heating performance of the heater 100C is improved.

[0044] In this embodiment, the first flange portion 13 and the second flange portion 14 may also be made of a metallic material, and the peripheral wall member 20 may also be made of a metallic material. In the heater 100C of this embodiment, the metallic first flange portion 13 and the second flange portion 14 are fixed to the outer peripheral surface 11s of the ceramic substrate 11 by solder. To improve the solder-based bonding strength, a bonding layer 16 may be provided on the outer peripheral surface 11s of the ceramic substrate 11. The bonding layer 16 may use one or more metallic materials such as Mo, W, Mn, Ag, Cu, and Ti. The bonding layer 16 can be formed as a so-called metal-sprayed layer, for example, it can be formed using high-melting-point metal methods such as Mo-Mn metal spraying and W metal spraying, or active metal methods such as Ag-Cu-Ti metal spraying. Alternatively, a metallic plating layer such as gold or nickel may also be formed on the bonding layer 16 to improve the wettability of the solder. By using the bonding layer 16 for brazing, the bonding force between the first flange portion 13 and the second flange portion 14 and the ceramic substrate 11 can be improved. The bonding layer 16 can be continuously disposed in a strip along the circumferential direction on the outer peripheral surface 11s of the ceramic substrate 11, or it can be disposed intermittently and at equal intervals along the circumferential direction on the outer peripheral surface 11is of the ceramic substrate 11.

[0045] When the bonding layer 16 is continuously disposed in a strip along the circumferential direction on the outer peripheral surface 11s of the ceramic substrate 11, and the first flange portion 13 and the second flange portion 14 are also bonded to the peripheral wall member 20 by, for example, solder, the space surrounded by the first flange portion 13 and the second flange portion 14, the ceramic substrate 11, and the peripheral wall member 20 can be made into a sealed space. By making this sealed space a vacuum state, a heat insulation effect is obtained. As a result, heat dissipation from the central part of the ceramic substrate 11 in the axial direction, which is at a relatively high temperature, is suppressed, and consequently, the heating performance of the heater 100C is improved.

[0046] Alternatively, in order to electrically connect the extraction portion 12b of the heating resistor 12 to external wiring, the extraction portion 12b is exposed from the ceramic substrate 11. In this case, the ceramic substrate 11 is configured to include an inner portion 110 and an outer portion 111. Both the inner portion 110 and the outer portion 111 are cylindrical, and the heating resistor 12 is located between the inner portion 110 and the outer portion 111.

[0047] Figure 7 This is a longitudinal sectional view of the ceramic matrix. Figure 7In the example of the ceramic substrate 11 shown, the inner portion 110 is longer than the outer portion 111, and the inner portion 110 protrudes at the second end 11b side of the ceramic substrate 11. Because of this protrusion, the outer peripheral surface of the inner portion 110 is exposed, and at least a portion of the extraction portion 12b of the heating resistor 12 is located on this outer peripheral surface. The extraction portion 12b has a portion not covered by the outer portion 111, thus enabling electrical connection to external wiring. A metal plating layer, such as gold or nickel, may also be formed on the exposed portion of the extraction portion 12b.

[0048] Figure 8 This is a longitudinal sectional view of the ceramic matrix. Figure 8 In the example of the ceramic substrate 11 shown, the outer portion 111 is longer than the inner portion 110, and the outer portion 111 protrudes at the second end 11b side of the ceramic substrate 11. Because of this protrusion, the inner circumferential surface of the outer portion 111 is exposed, and at least a portion of the extraction portion 12b of the heating resistor 12 lies on this inner circumferential surface. Since the extraction portion 12b has a portion not covered by the inner portion 110, it can be electrically connected to external wiring. A metal plating layer, such as gold or nickel, may also be formed on the exposed portion of the extraction portion 12b.

[0049] Figure 9 This is a longitudinal sectional view showing the heater according to the fifth embodiment. Figure 10 This is a cross-sectional view showing the heater according to the fifth embodiment. In this embodiment, the heater 100D has a connection terminal 17 provided on the outer peripheral surface 11s of the ceramic substrate 11 to electrically connect the extraction portion 12b of the heating resistor 12 to external wiring. The connection terminal 17 can be configured to electrically connect to the extraction portion 12b located in the inner layer of the ceramic substrate 11. For example, a conductor can be provided that extends from the outer peripheral surface 11s of the ceramic substrate 11 to the extraction portion 12b. The connection terminal 17 is provided on the outer peripheral surface 11s of the ceramic substrate 11 to cover this conductor, and the connection terminal 17 is electrically connected to the extraction portion 12b. By electrically connecting the external wiring to the connection terminal 17, the external wiring is electrically connected to the extraction portion 12b. Alternatively, the connection terminal 17 can be a metal-plated layer similar to the bonding layer 16, and a metal material such as Mo, W, Mn, Ag, Cu, or Ti can be used. A metal plating layer such as gold or nickel can also be formed on the connection terminal 17. The extraction portion 12b of the heating resistor 12 is located on the second end 11b side of the ceramic substrate 11, and the connecting terminal 17 is also similarly provided on the outer peripheral surface 11s of the second end 11b side of the ceramic substrate 11. The second flange portion 14 is located, for example, on the central side of the ceramic substrate 11, closer to the connecting terminal 17.

[0050] The heater 100D of this embodiment has a through hole 21a in the peripheral wall member 20. The through hole 21a is provided, for example, in the cylindrical portion 21 of the peripheral wall member 20. The through hole 21a connects the external space and the internal space of the peripheral wall member 20. When gas flows out from the internal space of the peripheral wall member 20 to the external space through the through hole 21a, the through hole 21a functions as an exhaust port. When gas flows in from the external space of the peripheral wall member 20 to the internal space through the through hole 21a, the through hole 21a functions as an intake port.

[0051] When the heater 100D is used as a cigarette heating device, for example, a through-hole 21a is provided near the bottom portion 22 of the cylindrical portion 21. When a user smokes, the pressure inside the heater 100D decreases, and external air flows in through the through-hole 21a near the bottom portion 22. The external air flowing in through the through-hole 21a cools the area around the connection terminal 17. Sometimes, the temperature of the outlet portion 12b of the heating resistor 12 rises due to heat transfer from the high-temperature region 12a, which can cause the temperature of the connection terminal 17 connected to the outlet portion 12b to also rise. Furthermore, the external wiring is bonded to the connection terminal 17 by solder or the like, and the bonding portion may heat up. This temperature rise can, for example, lead to poor connection between the outlet portion 12b and the external wiring, such as partial peeling of the connection terminal 17 from the ceramic substrate 11 or partial detachment of the external wiring from the connection terminal 17. As described above, by allowing external air to flow in through the through-hole 21a, the area around the connection terminal 17, including the external wiring, can be cooled by the external air, thus suppressing poor connection. The through holes 21a can be provided at equal intervals along the circumference of the cylindrical portion 21, or they can be provided near the connection terminal 17.

[0052] As a variation of the above embodiments, through holes in the thickness direction may be provided in the first flange portion 13 and the second flange portion 14, for example. By providing through holes, the heat transfer resistance can be increased and heat release can be reduced in the heat transfer path from the ceramic substrate 11 to the peripheral wall member 20.

[0053] The heating apparatus equipped with the heaters of each embodiment may include a housing that houses the heater, and the peripheral wall member 20 may also be a housing. In the case of the heater 100D of the fifth embodiment, the heater housed in the housing may also have a through hole provided in the housing. It is configured such that external air outside the housing flows into the housing and then into the peripheral wall member 20.

[0054] The embodiments of this disclosure have been described in detail above. However, this disclosure is not limited to the above-described embodiments, and various modifications and improvements can be made without departing from the spirit of this disclosure. Of course, all or part of the embodiments described above can be appropriately combined within a non-contradictory scope.

[0055] This disclosure can be implemented in the following ways.

[0056] One aspect of the heater disclosed herein includes: a heater component comprising a cylindrical ceramic substrate, a heating resistor disposed on the ceramic substrate, and a plurality of flanges fixed to the outer peripheral surface of the ceramic substrate and extending in a direction away from the outer peripheral surface; and a peripheral wall component surrounding the heater component in the axial direction and circumferential direction. One flange is located on one side further than the center in the axial direction of the ceramic substrate, and another flange is located on the other side further than the center in the axial direction of the ceramic substrate.

[0057] According to one aspect of the present disclosure, the heat generated by the heater component is conducted through a flange located near the end of the component in a position closer to the center in the axial direction, thereby reducing heat release from the heater component and improving heating performance.

[0058] The embodiments of this disclosure have been described in detail above. However, this disclosure is not limited to the above-described embodiments, and various modifications and improvements can be made without departing from the spirit of this disclosure. Of course, all or part of the embodiments described above can be appropriately combined within a non-contradictory scope.

[0059] Explanation of reference numerals in the attached figures

[0060] 10. Heater components

[0061] 11 Ceramic matrix

[0062] 11a First end

[0063] 11b Second end

[0064] 11s outer periphery

[0065] 12 Heating resistor

[0066] 13 First flange portion

[0067] 14 Second flange portion

[0068] 15. Glass Materials

[0069] 16 Bonding Layer

[0070] 17 Connection terminals

[0071] 20 circumferential wall components

[0072] 21 cylindrical part

[0073] 21a Through hole

[0074] 22 Bottom surface

[0075] Heaters 100, 100A, 100B, 100C, 100D

[0076] 110 Inner part

[0077] 111 Outer part

[0078] T is the object being heated.

Claims

1. A heater comprising: A heater component includes a cylindrical ceramic substrate, a heating resistor disposed on the ceramic substrate, and a plurality of flanges fixed to the outer peripheral surface of the ceramic substrate and extending away from the outer peripheral surface; and A peripheral wall member that surrounds the heater member in both the axial and circumferential directions. in, The first flange is located on one side further from the center of the ceramic substrate along its axial direction, and the second flange is located on the other side further from the center of the ceramic substrate along its axial direction. The peripheral wall component is open on one side along the axial direction. The heating resistor is located in the axial direction within the range from one side to the second flange.

2. The heater according to claim 1, wherein, The first flange is located at the end of one side of the ceramic substrate.

3. The heater according to claim 1 or 2, wherein, The second flange is located at the end of the ceramic substrate on the other side.

4. A heater comprising: A heater component includes a cylindrical ceramic substrate, a heating resistor disposed on the ceramic substrate, and a plurality of flanges fixed to the outer peripheral surface of the ceramic substrate and extending away from the outer peripheral surface; and A peripheral wall member that surrounds the heater member in both the axial and circumferential directions. in, The first flange is located on one side further from the center of the ceramic substrate along its axial direction, and the second flange is located on the other side further from the center of the ceramic substrate along its axial direction. The peripheral wall component is a bottomed cylindrical shape that is open on one side of the axial direction and sealed off by the bottom surface on the other side of the axial direction. For the heater component, one end of the ceramic substrate is located on the open side of the peripheral wall component, and the other end of the ceramic substrate is located on the side facing the bottom surface of the peripheral wall component. The first flange portion is made of resin material. The second flange is made of ceramic material.

5. A heater comprising: A heater component includes a cylindrical ceramic substrate, a heating resistor disposed on the ceramic substrate, and a plurality of flanges fixed to the outer peripheral surface of the ceramic substrate and extending away from the outer peripheral surface; and A peripheral wall member that surrounds the heater member in both the axial and circumferential directions. in, The first flange is located on one side further from the center of the ceramic substrate along its axial direction, and the second flange is located on the other side further from the center of the ceramic substrate along its axial direction. The second flange is fixed to the outer peripheral surface of the ceramic substrate by a glass material. For the glass material, the amount of the second flange portion relative to the central side of the ceramic substrate in the axial direction is less than the amount of the second flange portion relative to the other side of the ceramic substrate in the axial direction.

Images