Component supply method and component supply apparatus

Abstract

A component supply method supplies components scattered on a table, the component supply method including: a storage process that stores position information indicating positions of the components, posture information indicating postures of the components, and quantity information indicating quantities of the components, based on captured data of the components scattered on the table; and a holding process that holds the components scattered on the table by a holding member, based on the position information and the posture information stored in the storage process.

Description

TECHNICAL FIELD

[0001] The present application relates to a component supply method and a component supply apparatus that supply components scattered on a work table. BACKGROUND

[0002] The component supply apparatus supplies components scattered on a work table as described in the following patent document.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENTS

[0005] Patent Document 1: International Publication No. 2019 / 053888

[0006] Patent Document 2: International Publication No. 2017 / 208325 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] The present application relates to a component supply method and a component supply apparatus that supply components scattered on a work table.

[0009] TECHNICAL SOLUTION TO SOLVE THE PROBLEMS

[0010] To solve the above problems, the present application discloses a component supply method that supplies components scattered on a work table, the component supply method including: a storage step of storing position information indicating positions of components, posture information indicating postures of components, and quantity information indicating quantities of components, based on captured data of components scattered on the work table; and a holding step of holding components scattered on the work table by a holding member, based on the position information and the posture information stored in the storage step. Further, the present application is a component supply method that supplies components scattered on a work table, the component supply method including: a calculation step of calculating position information indicating positions of components, posture information indicating postures of components, and quantity information indicating quantities of components, based on captured data of components scattered on the work table; a holding step of holding components scattered on the work table by a holding member, using the position information and the posture information calculated in the calculation step; a determination step of determining whether or not to change a parameter used when performing image processing on captured data in the calculation step, based on the quantity information calculated in the calculation step; and a change step of changing the parameter used when performing image processing on captured data in the calculation step, in a case where it is determined to change the parameter in the determination step.

[0011] EFFECT OF THE INVENTION

[0012] According to this disclosure, it is possible to appropriately supply components on the worktable using position information, posture information, and quantity information. Attached Figure Description

[0013] Figure 1 It is a three-dimensional diagram showing a component mounting machine.

[0014] Figure 2 It is a three-dimensional view showing the component assembly device of the component mounting machine.

[0015] Figure 3 This is a three-dimensional diagram showing the bulk component supply device.

[0016] Figure 4 This is a three-dimensional diagram representing the component supply unit.

[0017] Figure 5 This is a transmission diagram showing the component supply unit.

[0018] Figure 6 This is a transmission diagram showing the component supply unit.

[0019] Figure 7 It is a three-dimensional diagram showing the component distribution device.

[0020] Figure 8 It is a three-dimensional diagram showing the component distribution device.

[0021] Figure 9 This is a three-dimensional view showing the component holding head.

[0022] Figure 10 This is a diagram showing a component receiving part that houses electronic circuit components.

[0023] Figure 11 This is a block diagram representing the control device of the component mounting machine.

[0024] Figure 12 It is a diagram showing the state of pin components scattered on the workbench.

[0025] Figure 13 This is a diagram showing pin elements identified through pattern matching.

[0026] Figure 14 It is a graph that represents the total number of elements stored in the storage device, the number that can be retained, the probability of retention, the number of stack-up units, and the empty area rate.

[0027] Figure 15 It is an image used to display information.

[0028] Figure 16 It is an image used to display information. Detailed Implementation

[0029] Hereinafter, an embodiment of the present application will be explained in detail with reference to the drawings as a mode for carrying out the present application.

[0030] Figure 1 An element mounting machine 10 is shown. The element mounting machine 10 is a device for performing an installation work of elements with respect to a circuit substrate 12. The element mounting machine 10 is provided with a device main body 20, a substrate carrying and holding device 22, an element mounting device 24, photographing devices 26, 28, an element supply device 30, a bulk element supply device 32, a control device (refer to Figure 11 )34. In addition, as the circuit substrate 12, a circuit board, a three-dimensional structured substrate, and the like can be cited, and as the circuit board, a printed wiring board, a printed circuit board, and the like can be cited.

[0031] The device main body 20 is constituted by a frame 40 and a beam portion 42 erected on the frame 40. The substrate carrying and holding device 22 is disposed at the center in the front-rear direction of the frame 40, and has a carrying device 50 and a clamping device 52. The carrying device 50 is a device for carrying the circuit substrate 12, and the clamping device 52 is a device for holding the circuit substrate 12. Thereby, the substrate carrying and holding device 22 carries the circuit substrate 12, and fixedly holds the circuit substrate 12 at a predetermined position. In addition, in the following explanation, a carrying direction of the circuit substrate 12 will be referred to as an X direction, a horizontal direction orthogonal to the direction will be referred to as a Y direction, and a vertical direction will be referred to as a Z direction. In other words, a width direction of the element mounting machine 10 is the X direction, and a front-rear direction is the Y direction.

[0032] The element mounting device 24 is disposed on the beam portion 42, and has two work heads 60, 62 and a work head moving device 64. Each of the work heads 60, 62 has a suction nozzle (refer to Figure 2 )66, and holds an element by the suction nozzle 66. Further, the work head moving device 64 has an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Moreover, the two work heads 60, 62 are integrally moved to an arbitrary position on the frame 40 by the X direction moving device 68 and the Y direction moving device 70. Further, as shown in Figure 2 , each of the work heads 60, 62 is mounted to a slide 74, 76 in a detachable manner, and the slide 74, 76 is independently moved in the vertical direction by the Z direction moving device 72. In other words, the work heads 60, 62 are independently moved in the vertical direction by the Z direction moving device 72.

[0033] The photographing device 26 is mounted to the slide 74 in a state of facing downward, and is moved in the X direction, the Y direction, and the Z direction together with the work head 60. Thereby, the photographing device 26 photographs an arbitrary position on the frame 40. As shown in Figure 1As shown, the imaging device 28 is positioned upwards between the substrate handling and holding device 22 and the component supply device 30 on the frame 40. Thus, the imaging device 28 images the components held by the suction nozzles 66 of the working heads 60 and 62.

[0034] The component supply device 30 is disposed at one end of the frame 40 in the front-rear direction. The component supply device 30 includes a tray-type component supply device 78 and a feeder-type component supply device (not shown). The tray-type component supply device 78 is a device for supplying components that are placed on a tray. The feeder-type component supply device is a device for supplying components by means of a belt feeder (not shown) or a rod feeder (not shown).

[0035] The bulk component supply device 32 is disposed at the other end of the frame 40 in the front-rear direction. The bulk component supply device 32 is a device that arranges multiple components that are scattered in a loose state into a neat and orderly arrangement and supplies components in this arrangement. In other words, it is a device that arranges multiple components in an arbitrary orientation into a predetermined orientation and supplies components in that predetermined orientation. The structure of the component supply device 32 will be described in detail below. Furthermore, examples of components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, structural components of solar cells, and structural components of power modules. In addition, electronic circuit components may include components with leads and components without leads.

[0036] like Figure 3 As shown, the bulk component supply device 32 has a main body 80, a component supply unit 82, a shooting device 84, and a component transfer device 86.

[0037] The component supply unit 82 includes a component feeder 88 and a component distribution device (see reference). Figure 4 90. Component return device (refer to) Figure 4 )92, the aforementioned component supplier 88, component distribution device 90, and component return device 92 are integrally formed. The component supply unit 82 is assembled on the base 96 of the main body 80 in a detachable manner. In the bulk component supply device 32, five component supply units 82 are arranged in a row along the X direction.

[0038] The component feeder 88 is roughly in the shape of a rectangular box, such as... Figure 4 and Figure 5 As shown, it is configured to extend along the Y direction. In addition, the Y direction is described as the front-back direction of the component feeder 88, the direction in the component supply unit 82 toward the side where the component return device 92 is arranged is described as front, and the direction toward the side where the component feeder 88 is arranged is described as rear.

[0039] The component feeder 88 is opened at the upper surface and the front surface. The opening at the upper surface is formed as a component drop port 97, and the opening at the front surface is formed as a component discharge port 98. In the component feeder 88, an inclined plate 104 is disposed below the drop port 97. The inclined plate 104 is disposed so as to be inclined downward from an end surface of the rear side of the component feeder 88 toward the central direction.

[0040] Further, as shown in FIG. 1, a pair of side frames 130 is assembled to the base 96. The pair of side frames 130 is erected so as to be parallel to each other in a facing state and extend in the Y direction. Also, the distance between the pair of side frames 130 is slightly larger than the widthwise dimension of the component feeder 88, and the component feeder 88 is fitted between the pair of side frames 130 in a detachable manner. Figure 5 Further, as shown in FIG. 1, a pair of side frames 130 is assembled to the base 96. The pair of side frames 130 is erected so as to be parallel to each other in a facing state and extend in the Y direction. Also, the distance between the pair of side frames 130 is slightly larger than the widthwise dimension of the component feeder 88, and the component feeder 88 is fitted between the pair of side frames 130 in a detachable manner. Figure 5 Further, as shown in FIG. 1, a pair of side frames 130 is assembled to the base 96. The pair of side frames 130 is erected so as to be parallel to each other in a facing state and extend in the Y direction. Also, the distance between the pair of side frames 130 is slightly larger than the widthwise dimension of the component feeder 88, and the component feeder 88 is fitted between the pair of side frames 130 in a detachable manner.

[0041] Further, as shown in FIG. 1, a pair of side frames 130 is assembled to the base 96. The pair of side frames 130 is erected so as to be parallel to each other in a facing state and extend in the Y direction. Also, the distance between the pair of side frames 130 is slightly larger than the widthwise dimension of the component feeder 88, and the component feeder 88 is fitted between the pair of side frames 130 in a detachable manner.

[0042] Further, as shown in FIG. 1, a pair of side frames 130 is assembled to the base 96. The pair of side frames 130 is erected so as to be parallel to each other in a facing state and extend in the Y direction. Also, the distance between the pair of side frames 130 is slightly larger than the widthwise dimension of the component feeder 88, and the component feeder 88 is fitted between the pair of side frames 130 in a detachable manner. Figure 4 Further, as shown in FIG. 1, a pair of side frames 130 is assembled to the base 96. The pair of side frames 130 is erected so as to be parallel to each other in a facing state and extend in the Y direction. Also, the distance between the pair of side frames 130 is slightly larger than the widthwise dimension of the component feeder 88, and the component feeder 88 is fitted between the pair of side frames 130 in a detachable manner.

[0043] The component spreader 90 includes a component support member 150 and a component support member moving device 152. The component support member 150 is composed of a table 156 and a pair of side wall portions 158. The table 156 is substantially in the shape of a long strip-shaped plate and is disposed so as to extend from below the component feeder 88 disposed between the pair of side frames 130 toward the front. Also, the upper surface of the table 156 is substantially horizontal and, as shown in FIG. 1, is disposed in a state of having a slight gap with the end portion of the front side of the inclined plate 128 of the component feeder 88. Figure 5 Figure 4 Further, as shown in FIG. 1, a pair of side frames 130 is assembled to the base 96. The pair of side frames 130 is erected so as to be parallel to each other in a facing state and extend in the Y direction. Also, the distance between the pair of side frames 130 is slightly larger than the widthwise dimension of the component feeder 88, and the component feeder 88 is fitted between the pair of side frames 130 in a detachable manner.

[0044] Further, the component support member moving device 152 moves the component support member 150 by a cylinder (see FIG. 1).​Figure 11 )166 causes the component support member 150 to slide in the Y direction. At this time, the component support member 150 moves between a housed state (refer to Figure 6 ) in which it is housed below the component feeder 88 and an exposed state (refer to Figure 5 ) in which it is exposed from below the component feeder 88.

[0045] As shown in Figure 7 , the component return device 92 includes a component housing container 180 and a container swing device 181. The component housing container 180 is roughly box-shaped, with a bottom surface formed in a circular arc shape. The component housing container 180 is held so as to be swingable at an end portion on the front side of the worktable 156 of the component support member 150, and swings by operation of the container swing device 181. At this time, the component housing container 180 swings between a housed posture (refer to Figure 7 ) in which the opening faces upward and a return posture (refer to Figure 8 ) in which the opening faces the upper surface of the worktable 156 of the component support member 150.

[0046] As shown in Figure 3 , the imaging device 84 includes a camera 290 and a camera moving device 292. The camera moving device 292 includes a guide rail 296 and a slide 298. The guide rail 296 is fixed to the main body 80 above the component feeder 88 so as to extend in the width direction (X direction) of the bulk component supply device 32. The slide 298 is installed so as to be slidable to the guide rail 296, and slides to an arbitrary position by operation of an electromagnetic motor (refer to Figure 11 ) 299. In addition, the camera 290 is attached to the slide 298 in a state facing downward.

[0047] As shown in Figure 3 , the component handover device 86 includes a component holding head moving device 300, a component holding head 302, and two shuttle devices 304.

[0048] The component holding head moving device 300 includes an X direction moving device 310, a Y direction moving device 312, and a Z direction moving device 314. The Y direction moving device 312 has a Y slide 316 disposed above the component supply unit 82 so as to extend in the X direction, and the Y slide 316 moves to an arbitrary position in the Y direction by driving of an electromagnetic motor (refer to Figure 11 ) 319. The X direction moving device 310 has an X slide 320 disposed on the side surface of the Y slide 316, and the X slide 320 moves to an arbitrary position in the X direction by driving of an electromagnetic motor (refer to Figure 11 ) 321. The Z direction moving device 314 has a Z slide 322 disposed on the side surface of the X slide 320, and the Z slide 322 moves to an arbitrary position in the Z direction by driving of an electromagnetic motor (refer toFigure 11 Driven by )323, it moves to any position in the Z direction.

[0049] like Figure 9 As shown, the component holding head 302 includes a head body 330, a suction nozzle 332, a nozzle rotation device 334, and a nozzle rotation device 335. The head body 330 is integrally formed with the Z-slider 322. The suction nozzle 332 holds the component and is detachably mounted to the lower end of the retainer 340. The retainer 340 is configured to bend on the support shaft 344, and the retainer 340 bends upward by 90 degrees through the operation of the nozzle rotation device 334. As a result, the suction nozzle 332 mounted to the lower end of the retainer 340 rotates 90 degrees to the rotated position. In other words, the suction nozzle 332 rotates between the non-rotational position and the rotated position through the operation of the nozzle rotation device 334. Of course, it is also possible to stop the positioning at the angle between the non-rotational position and the rotated position. Furthermore, the nozzle rotation device 335 rotates the suction nozzle 332 about its axis.

[0050] In addition, such as Figure 3 As shown, the two shuttle devices 304 each include a component carrier 388 and a component carrier moving device 390, and are arranged laterally on the front side of the component supply unit 82 and fixed to the main body 80. In the component carrier 388, five component receiving parts 392 are assembled in a row arranged laterally, and each component receiving part 392 carries a component.

[0051] Furthermore, the bulk component supply device 32 can supply various components, and the component receiving component 392 prepares various components according to the shape of the components. Here, electronic circuit components supplied by the bulk component supply device 32 include, for example, Figure 10 As shown, the component receiving component 392 corresponding to the pin element 410 with pins will be described. The pin element 410 is composed of a block-shaped component body 412 and two pins 414 protruding from the bottom surface of the component body 412.

[0052] Furthermore, a component receiving member 392 has a component receiving recess 416 with a shape corresponding to the lead element 410. The component receiving recess 416 is a stepped recess and is composed of a main body receiving recess 418 that opens on the upper surface of the component receiving member 392 and a lead receiving recess 420 that opens on the bottom surface of the main body receiving recess 418. Moreover, the lead element 410 is inserted into the component receiving recess 416 with the lead 414 facing downward. Thus, with the lead 414 inserted into the lead receiving recess 420 and the component body 412 inserted into the main body receiving recess 418, the lead element 410 is placed inside the component receiving recess 416.

[0053] In addition, such as Figure 3As shown, the component carrier moving device 390 is a plate-like long member and is disposed in front of the component supply unit 82 in a manner extending in the front-rear direction. The component carrier 388 is disposed on the upper surface of the component carrier moving device 390 in a manner capable of sliding in the front-rear direction, and is caused to slide to an arbitrary position in the front-rear direction by driving of an electromagnetic motor (refer to Figure 11 ) 430. In addition, when the component carrier 388 is caused to slide in a direction approaching the component supply unit 82, it is caused to slide to a component receiving position located within the moving range of the component holding head 302 based on the component holding head moving device 300. On the other hand, when the component carrier 388 is caused to slide in a direction away from the component supply unit 82, it is caused to slide to a component supply position located within the moving range of the work head 60, 62 based on the work head moving device 64.

[0054] Further, as shown in Figure 11 , the control device 34 includes a unified control device 450, a plurality of individual control devices (only one is shown in the figure) 452, and an image processing device 454. The unified control device 450 is constituted with a computer as the main body, and is connected to the substrate conveyance and holding device 22, the component mounting device 24, the photographing device 26, the photographing device 28, the component supply device 30, and the bulk component supply device 32. Thereby, the unified control device 450 unifiedly controls the substrate conveyance and holding device 22, the component mounting device 24, the photographing device 26, the photographing device 28, the component supply device 30, and the bulk component supply device 32. The plurality of individual control devices 452 are constituted with computers as the main body, and are provided corresponding to the substrate conveyance and holding device 22, the component mounting device 24, the photographing device 26, the photographing device 28, the component supply device 30, and the bulk component supply device 32 (in the figure, only the individual control device 452 corresponding to the bulk component supply device 32 is shown).

[0055] The individual control device 452 of the bulk component supply device 32 is connected to the component scattering device 90, the component return device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. Thereby, the individual control device 452 of the bulk component supply device 32 controls the component scattering device 90, the component return device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. Further, the image processing device 454 is connected to the photographing device 84, and processes the photographed data photographed by the photographing device 84. The image processing device 454 is connected to the individual control device 452 of the bulk component supply device 32. Thereby, the individual control device 452 of the bulk component supply device 32 acquires the photographed data photographed by the photographing device 84.

[0056] Further, the bulk component supply device 32 has a storage device 458. The storage device 458 is connected to the individual control device 452, and stores various information according to an instruction from the individual control device 452. Also, the individual control device 452 is connected to a display panel 460. As shown in Fig. 66, the display panel 460 is disposed on an end surface of the bulk component supply device 32, and displays an arbitrary screen according to an instruction from the individual control device 452. Figure 1

[0057] The component mounting machine 10 performs a component mounting work on the circuit substrate 12 held by the substrate carrying and holding device 22 by the above-described structure. Specifically, the circuit substrate 12 is carried to a work position, and is fixedly held at this position by the clamping device 52. Next, the imaging device 26 is moved above the circuit substrate 12, and images the circuit substrate 12. Thereby, information relating to an error of the holding position of the circuit substrate 12 is obtained. Further, the component supply device 30 or the bulk component supply device 32 supplies a component at a predetermined supply position. Also, the supply of the component based on the bulk component supply device 32 will be described later in detail. Also, either one of the work heads 60, 62 is moved above the supply position of the component, and holds the component by the suction nozzle 66. Next, the work head 60, 62 holding the component is moved above the imaging device 28, and the component held by the suction nozzle 66 is imaged by the imaging device 28. Thereby, information relating to an error of the holding position of the component is obtained. Also, the work head 60, 62 holding the component is moved above the circuit substrate 12, and corrects an error of the holding position of the circuit substrate 12, an error of the holding position of the component, and the like, and mounts the held component on the circuit substrate 12.

[0058] Further, in the bulk component supply device 32, the pin component 410 is dropped by the operator from the drop port 97 of the component feeder 88, and is supplied in a state of being placed on the component receiving member 392 of the component carrier 388 by the work of the component supply unit 82 and the component transfer device 86.

[0059] Specifically, the operator drops the pin component 410 from the drop port 97 of the upper surface of the component feeder 88. At this time, the component support member 150 is moved to the lower side of the component feeder 88 by the work of the component support member moving device 152, and becomes a housed state (refer to Fig. 67). Figure 6 Further, when the component support member 150 becomes the housed state, the component housing container 180 disposed at the end portion of the front side of the component support member 150 is positioned in front of the component feeder 88, and becomes a posture in which the opening of the component housing container 180 faces upward (a housed posture).

[0060] ​The pin component 410 dropped from the drop port 97 of the component feeder 88 falls on the inclined plate 104 of the component feeder 88 and rolls down to the lower end of the front side of the inclined plate 104. At this time, the pin component 410 that rolled down to the lower end of the front side of the inclined plate 104 is stacked between the lower end of the front side of the inclined plate 104 and the lower end of the rear side of the conveyer 106. Further, by the operation of the conveyer 106, the conveyer belt 112 of the conveyer 106 is circulated in the counterclockwise direction in FIG. 8. By this, the pin component 410 stacked between the inclined plate 104 and the conveyer belt 112 is carried by the conveyer belt 112 toward the obliquely upward direction. Figure 6

[0061] Further, the pin component 410 carried by the conveyer belt 112 falls from the upper end of the front side of the conveyer 106 onto the inclined plate 126. The pin component 410 that fell onto the inclined plate 126 rolls on the inclined plate 126 toward the rear side and falls onto the inclined plate 128. The pin component 410 that fell onto the inclined plate 128 rolls toward the front side and is discharged from the discharge port 98 of the front side of the component feeder 88.

[0062] By this, the pin component 410 discharged from the discharge port 98 of the component feeder 88 is accommodated in the inside of the component accommodation container 180. Further, if a predetermined amount of pin components 410 is discharged from the component feeder 88, in other words, if the conveyer 106 is operated at a constant amount, the conveyer 106 is stopped. Next, the component support member 150 is moved from the housed state toward the front side by the operation of the component support member moving device 152.

[0063] Further, at the timing when the component support member 150 is moved from the housed state toward the front side by a predetermined amount, the container oscillating device 181 of the component return device 92 is operated and the component accommodation container 180 is oscillated. By this, the posture of the component accommodation container 180 is abruptly changed from the posture in which the opening is directed upward (accommodation posture) to the posture in which the opening is directed toward the work table 156 (return posture). At this time, the pin components 410 accommodated in the component accommodation container 180 are abruptly discharged toward the work table 156. By this, the pin components 410 are scattered on the work table 156 from the component accommodation container 180.

[0064] Further, if the pin components 410 are scattered on the work table 156 of the component support member 150, as shown in FIG. 9, the pin components 410 are moved toward the component mounting head 20 by the operation of the component mounting head 20. Figure 12 ​As shown, the pin elements 410 are scattered in substantially four postures on the work table 156. Specifically, as a first posture, the pin elements 410 are scattered in a posture in which the faces on which the pins 414 extend are oriented to the lateral direction and the two pins 414 are arranged in a substantially horizontal direction. Further, as a second posture, the pin elements 410 are scattered in a posture in which the faces on which the pins 414 extend are oriented to the lateral direction and the two pins 414 are arranged in a substantially vertical direction. Further, as a third posture, the pin elements 410 are scattered in a posture in which the faces on which the pins 414 extend are oriented to the upward direction. Further, as a fourth posture, the pin elements 410 are scattered in a posture in which two or more pin elements 410 are overlapped. In addition, in distinguishing the pin elements 410 according to the scattered postures, the pin elements 410a of the first posture, the pin elements 410b of the second posture, the pin elements 410c of the third posture, and the pin elements 410d of the fourth posture are described. Incidentally, Figure 12 In the middle, a pin element 500 different in shape from the pin elements 410 is also scattered on the work table 156. This is because the operator erroneously put the pin element 500 different in kind from the pin elements 410 into the component feeder 88, and the pin element 500 different in kind is scattered on the work table in a state of being mixed with the pin elements 410.

[0065] Further, if the pin elements 410 are scattered on the work table 156 as described above, the camera 290 of the imaging device 84 is moved to the upper side of the component support member 150 by the operation of the camera moving device 292. At this time, the pin elements 410 scattered on the work table 156 are imaged by the camera 290. In addition, since the angle of view, i.e., the imaging range of the camera 290 is larger than the work table 156, all the pin elements 410 scattered on the entire work table 156, i.e., the work table 156 are imaged by one imaging. Further, based on the imaging data imaged by the camera 290, the pin elements which are the objects of picking (hereinafter, sometimes abbreviated as "picking object elements") are determined by pattern matching.

[0066] Specifically, based on the imaging data in which the pin elements 410 are imaged by the camera 290, the outer edge, i.e., the outline of the pin elements 410 is determined, and the shape of the upper surface of the pin elements 410, i.e., the shape viewed from the upper side of the pin elements 410 is calculated. Further, based on the imaging data, the positions of the pin elements 410 are also calculated. On the other hand, as shown in FIG. 6, the storage device 458 stores image data of the shape corresponding to the outline of the pin element 410a of the first posture (hereinafter, sometimes abbreviated as "first posture element image data") and image data of the shape corresponding to the outline of the pin element 410b of the second posture (hereinafter, sometimes abbreviated as "second posture element image data"). Figure 13

[0067] ​Moreover, it is determined whether the shape of the upper surface of the pin element 410 calculated based on the captured data (hereinafter, sometimes referred to as "captured element shape") is identical to the shape of the pin element 410 based on the first posture element image data (hereinafter, sometimes referred to as "first stored element shape") or the shape of the pin element 410 based on the second posture element image data (hereinafter, sometimes referred to as "second stored element shape"). Moreover, in a case where it is determined that the captured element shape is identical to the first stored element shape or the second stored element shape, the pin element 410 corresponding to the captured element shape is set as the pickup target element.

[0068] In other words, the pin element 410a in the first posture and the pin element 410b in the second posture are set as the pickup target elements, and the pin element 410c in the third posture and the pin element 410d in the fourth posture are not set as the pickup target elements. This is because, in the pin element 410c in the third posture, the pin 414 is arranged on the upper surface, and the pin 414 becomes an obstacle, so that the pin element 410 cannot be properly held by the suction nozzle 332. Further, this is because, in the pin element 410d in the fourth posture, the upper surface of the pin element 410d is not horizontal, and the like, so that the pin element 410 cannot be properly held by the suction nozzle 332. In this way, the pin element 410a in the first posture and the pin element 410b in the second posture are set as the pickup target elements, and are stored in the storage device 458 as information indicating the posture of the pin element.

[0069] In addition, Figure 12 Among the pin elements in the first posture, the pin element 410al in which the pin 414 is bent is a defective product in the first posture (hereinafter, referred to as "defective product in the first posture"), but the shape in which the pin 414 is bent is not identical to the first stored element shape. Therefore, the defective product 410al in the first posture is not set as the pickup target element. Further, among the pin elements in the second posture, the pin element 410bl in which the pin 414 is bent is a defective product in the second posture (hereinafter, referred to as "defective product in the second posture"), but the shape in which the pin 414 is bent is not identical to the second stored element shape. Therefore, the defective product 410bl in the second posture is not set as the pickup target element. Further, the shape of the pin element 500 different from the pin element 410 is of course not identical to the first stored element shape and the second stored element shape, and therefore, the pin element 500 is not set as the pickup target element.

[0070] Moreover, information indicating the position of the pin element 410 set as the pickup target element is calculated on the basis of the captured data. Next, on the basis of the calculated information indicating the position of the pickup target element, the component holding head 302 is moved to above the pickup target element by the operation of the component holding head moving device 300, and the pickup target element is held by suction by the suction nozzle 332. In addition, when the pickup target element is held by suction by the suction nozzle 332, the suction nozzle 332 is located at the non-rotation position.

[0071] Next, after the pin element 410 is held by the suction nozzle 332, the component holding head 302 is moved to above the component carrier 388. At this time, the component carrier 388 is moved to the component receiving position by the operation of the component carrier moving device 390. Further, when the component holding head 302 is moved to above the component carrier 388, the suction nozzle 332 is rotated to the rotated position. In addition, the suction nozzle 332 is rotated by the operation of the nozzle rotating device 335 so that the pin 414 of the pin element 410 held by the suction nozzle 332 at the rotated position is directed downward in the vertical direction.

[0072] When the component holding head 302 is moved to above the component carrier 388, the pin element 410 in the state where the pin 414 is directed downward in the vertical direction is inserted into the component accommodating recess 416 of the component receiving member 392. Thus, as shown in FIG. 8, the pin element 410 is placed on the component receiving member 392 in the state where the pin 414 is directed downward in the vertical direction. Figure 10

[0073] Moreover, when the pin element 410 is placed on the component receiving member 392, the component carrier 388 is moved to the component supply position by the operation of the component carrier moving device 390. The component carrier 388 moved to the component supply position is located in the movement range of the work heads 60, 62, and thus, in the bulk component supply device 32, the pin element 410 is supplied to the component mounting machine 10 at this position. In this way, in the bulk component supply device 32, the pin element 410 is supplied in the state where the pin 414 is directed downward and the upper surface facing the bottom surface to which the pin 414 is connected is directed upward. Therefore, the suction nozzle 66 of the work head 60, 62 can properly hold the pin element 410.

[0074] ​Thus, in the bulk component supply device 32, when there are components to be picked up scattered on the worktable 156 of the component support member 150, the picking up of the scattered components is repeated, and the picked-up components are placed on the component receiving member 392. Furthermore, the component carrier 388, which is equipped with the component receiving member 392, moves to the component supply position, thereby supplying the lead component 410. However, if there are no components to be picked up scattered on the worktable 156 of the component support member 150, the lead component 410 cannot be picked up from the worktable 156. In other words, if all the lead components 410 that are determined to be pickable have been picked up, and the lead components 410 that are determined to be unpickable or unidentifiable remain on the worktable 156, the lead component 410 cannot be picked up from the worktable 156.

[0075] Therefore, in the bulk component supply device 32, under such circumstances, the lead element 410 remaining on the worktable 156 is recovered into the component receiving container 180. Moreover, the lead element 410 recovered into the component receiving container 180 is once again distributed on the worktable 156, and the posture of the lead element 410 is changed, thereby restarting the picking of the lead element 410 from the worktable 156.

[0076] Specifically, if all the components to be picked up on the worktable 156 are picked up, the component support member 150 moves downward toward the component feeder 88 via the operation of the component support member moving device 152. In other words, the component support member 150 moves from its exposed state (see reference 156) to a position below the component feeder 88. Figure 5 Oriented towards storage (refer to) Figure 6 The component support member 150 moves from the exposed state to the stored state. At this time, the component receiving container 180 disposed at the front end of the component support member 150 is configured in a posture with the opening facing upward (retraction posture). Moreover, when the component support member 150 moves from the exposed state to the stored state, the lead element 410 on the worktable 156 of the component support member 150 is intercepted by the front end of the inclined plate 128 of the component feeder 88.

[0077] And, as Figure 6 As shown, if the component support member 150 moves to the retracted state, the lead element 410 on the worktable 156 is scraped off into the component receiving container 180. Thus, the lead element 410 on the worktable 156 is retrieved into the component receiving container 180. Therefore, if the lead element 410 on the worktable 156 is retrieved into the component receiving container 180, the retrieved lead element 410 is replenished onto the worktable 156 again.

[0078] In other words, at the end of the return of the pin element 410 to the element receiving container 180, as Figure 6As shown, the component support member 150 is formed in the housed state. Therefore, the component support member 150 is moved from the housed state toward the front by the operation of the component support member moving device 152. Also, at the time when the component support member 150 is moved from the housed state toward the front by a predetermined amount, the container oscillating device 181 of the component return device 92 is operated, and the component storage container 180 is oscillated. Thereby, the posture of the component storage container 180 is abruptly changed from the posture in which the opening is directed upward (storage posture) to the posture in which the opening is directed toward the table 156 (return posture).

[0079] At this time, the pin component 410 stored in the component storage container 180 is abruptly discharged toward the table 156. Thereby, the pin component 410 is scattered on the table 156 from the component storage container 180. In other words, the pin component 410 returned to the component storage container 180 is replenished to the table 156. Thereby, the posture of the replenished pin component 410 is changed, and the pin component 410 is picked up from the table 156 again.

[0080] As described above, in the bulk component supply device 32, if the pick-up target component is picked up from the table 156, the pin component 410 on the table 156 is returned to the component storage container 180. Also, the pin component 410 returned to the component storage container 180 is scattered on the table 156 again, so that the posture of the pin component 410 is changed, and the pin component 410 is picked up from the table 156 again. In other words, if the pin component 410 returned to the component storage container 180 is scattered on the table 156 again, the component on the table 156 is imaged by the camera 290, and the pick-up target component is determined on the basis of the imaging data, so that the pick-up target component is held by the component holding head 302.

[0081] At this time, the pin component 410 scattered on the table 156 from the component storage container 180 preferably has a high probability of becoming the first posture or the second posture, that is, a probability of becoming the pick-up target component (hereinafter, referred to as "holdable probability"). If the holdable probability is high, the number of times of the return work of the pin component 410 to the component storage container 180 and the replenishment work of the pin component 410 from the component storage container 180 to the table 156 is reduced. Thereby, the time required for the return work and the replenishment work can be reduced. In addition, the pin component 410 is subjected to a load in the return work and the replenishment work, and can be damaged or broken, so that if the return work and the replenishment work are reduced, the load on the pin component 410 can be reduced. In view of such a situation, in the bulk component supply device 32, the holdable probability is calculated every time the component is scattered on the table 156 from the component storage container 180.

[0082] In detail, if the components are scattered on the work table 156 from the component storage container 180, the components on the work table 156 are imaged by the camera 290, and based on the imaging data, the pickup target component is determined. At this time, based on the imaging data, not only the position information and the posture information are calculated, but also information indicating the number of components (hereinafter, referred to as "number information") is calculated. Here, as the number information, the total number of the pin components 410 (hereinafter, referred to as "component total number") scattered on the work table 156, the number of the pickup target components (hereinafter, referred to as "holdable number"), and the number of the pin components 410 that are overlapped (hereinafter, referred to as "stacked number") are calculated.

[0083] In detail, based on the imaging data, an area in the work table 156 on which the pin components 410 are placed and occupied by the pin components 410 (hereinafter, referred to as "component exclusive area") is calculated. In other words, for example, based on the imaging data, the outline of each of the plurality of components is recognized, and the area of the portion surrounded by each outline is calculated as the component exclusive area.

[0084] In addition, the work table 156 in a state where nothing is placed before the pin components 410 are scattered on the work table 156 is imaged by the camera 290. Moreover, based on this imaging data, the area of the work table 156 (hereinafter, referred to as "work table area") is calculated. Furthermore, by dividing the component occupied area by the work table area, the ratio of the portion on the work table 156 on which the components are placed (hereinafter, referred to as "component occupancy rate") is calculated. If this component occupancy rate becomes high, the total number of the components placed on the work table 156, that is, the component total number, is large, and if the component occupancy rate becomes low, the component total number is small. Therefore, the relationship between the component occupancy rate and the component total number is generally proportional, and this proportional relationship is stored in the storage device 458 as mapping data. Therefore, if the component occupancy rate is calculated, the component total number is calculated by referring to this mapping data.

[0085] In addition, based on the component occupied area and the work table area, the ratio of the portion on the work table 156 on which the components are not placed, that is, the idle space (hereinafter, referred to as "idle space rate") is also calculated. In detail, by subtracting the component occupied area from the work table area, the area of the idle space is calculated, and by dividing this idle space area by the work table area, the idle space rate is calculated.

[0086] Furthermore, the number of elements that can be held is counted when the target element is determined by pattern matching according to the steps described above. Additionally, the number of elements that can be held is counted for each orientation of the element. In other words, the number of pin elements 410a in the first orientation is counted as the number of elements that can be held A, and the number of pin elements 410b in the second orientation is counted as the number of elements that can be held B. Thus, the number of elements that can be held A and the number of elements that can be held B are calculated. Moreover, if the total number of elements, the number of elements that can be held A, and the number of elements that can be held B are calculated, the probability of holding them is calculated by dividing the sum of the number of elements that can be held A and the number of elements that can be held B by the total number of elements.

[0087] In addition, such as Figure 12 As shown, in the case of overlapping pin elements 410d, since multiple pin elements are identified as a single element, the outline of this element is larger than that of the pin elements in the first and second postures when the outline of the element is identified based on the captured data. Therefore, when identifying the outline of the element based on the captured data and performing pattern matching, if the shape of the identified element does not match the shape of the first and second storage elements, the element larger than the shape of the first or second storage element is counted as the stacking number. Thus, the stacking number is calculated.

[0088] Thus, if the total number of components, the number that can be held (A), the number that can be held (B), the holding probability, the empty area rate, and the stack-up number are calculated, they are stored in the storage device 458. Furthermore, the total number of components, the number that can be held (A), the number that can be held (B), the holding probability, the empty area rate, and the stack-up number are calculated each time a component is replenished from the component receiving container 180 to the worktable 156, and stored in the storage device 458 in association with the number of replenishments. In other words, for example, as... Figure 14 As shown, the total number of components, the number of components that can be maintained (A), the number of components that can be maintained (B), the probability of maintaining them, the empty area rate, and the number of stacks are stored according to the number of replenishments, just like the total number of components, the number of components that can be maintained (A), the number of components that can be maintained (B), the probability of maintaining them, the empty area rate, and the number of stacks are stored during the first replenishment.

[0089] Thus, whenever components are replenished from the component receiving container 180 to the worktable 156, the total number of components, the number that can be held A, the number that can be held B, the probability of holding, the empty area rate, and the number of stacks are continuously stored, so that various information screens are displayed on the display panel 460 in the bulk component supply device 32.

[0090] Specifically, such as Figure 12As shown, sometimes pin elements 500 of a different kind from the pin elements 410, defective products 410al, bl in which the pins 414 are bent, are scattered on the table 156. Also, the above pin elements 500, defective products 410al, bl are not set as pickup target elements as described above. Therefore, even if the replenishment operation from the component storage container 180 is performed several times, the above three elements are not picked up from the table 156. Such elements are called stationary elements, and the probability of being held is reduced due to the stationary elements. In particular, the more the number of replenishment times increases, the smaller the total number of components, and the probability of being held is reduced more due to the stationary elements.

[0091] For example, in a case where the probability of being held is 50% in a case where the pin elements 410 are scattered on the table 156, if 50 pin elements 410 do not have stationary elements, 50% of 50, that is, 25 pin elements 410 become pickup target elements. On the other hand, in a case where three stationary elements are scattered on the table 156, in a case where the total number of components of the table 156 at that time is 50, 50% of 47, that is, 23.5 pin elements 410 become pickup target elements with respect to the theoretical value. In other words, the theoretical value of the pickup target elements is 23.5. Figure 12

[0092] In addition, Figure 14 It is described that the total number of components calculated in a case where three stationary elements are scattered on the table 156, and the like. Also, Figure 14 In the first replenishment, the total number of components calculated becomes 50, and the number of components that can be held (A+B), that is, the number of pickup target elements becomes 24. The number of pickup target elements calculated at the time of the first replenishment (24) becomes a value that is substantially close to the theoretical value of the pickup target elements (23.5). In addition, the probability of being held calculated at the time of the first replenishment becomes 48%, which is substantially the same as the theoretical value of the probability of being held (50%).

[0093] In addition, after 24 pickup target elements are picked up from the table 156, the remaining 26 components are stored in the component storage container 180, and are again scattered on the table 156 from the component storage container 180. At this time, three out of the total number of components 26 are stationary elements, and therefore, the theoretical value of the pickup target elements is 50% of 23, that is, 11.5. Also, Figure 14 ​In the example, the number of retainable elements (A+B) calculated at the second replenishment, i.e., the number of pickup target elements, was 11. The number of pickup target elements (11) calculated at the second replenishment was a value close to the theoretical value (11.5) of pickup target elements. On the other hand, the retainable probability calculated at the second replenishment was 42%, which was lower than the theoretical value (50%) of the retainable probability. In other words, the retainable probability calculated at the first replenishment was 48%, but the retainable probability calculated at the second replenishment was 42%, which was further lower than the theoretical value (50%) of the retainable probability. This is because the ratio of the number of immobile elements (3 / 26) in the total number of elements at the time of calculation of the retainable probability at the second replenishment was about twice as large as the ratio of the number of immobile elements (3 / 50) in the total number of elements at the time of calculation of the retainable probability at the first replenishment.

[0094] Further, after 11 pickup target elements were picked up from the stage 156, the remaining 15 elements were housed in the element housing container 180, and were again scattered on the stage 156 from the element housing container 180. At this time, three out of the total number of elements 15 were immobile elements, and thus the theoretical value of pickup target elements was 6, which was 50% of 12. Also, Figure 14 In the example, the number of retainable elements (A+B) calculated at the third replenishment, i.e., the number of pickup target elements, was 6. The number of pickup target elements (6) calculated at the third replenishment was the same as the theoretical value (6) of pickup target elements. On the other hand, the retainable probability calculated at the third replenishment was 40%, which was lower than the theoretical value (50%) of the retainable probability. In other words, the retainable probability calculated at the first replenishment was 48%, but the retainable probability calculated at the third replenishment was 40%, which was further lower than the theoretical value (50%) of the retainable probability. This is because the ratio of the number of immobile elements (3 / 15) in the total number of elements at the time of calculation of the retainable probability at the third replenishment was about 3.3 times as large as the ratio of the number of immobile elements (3 / 50) in the total number of elements at the time of calculation of the retainable probability at the first replenishment.

[0095] Further, after 6 pickup target elements were picked up from the stage 156, the remaining 9 elements were housed in the element housing container 180, and were again scattered on the stage 156 from the element housing container 180. At this time, three out of the total number of elements 9 were immobile elements, and thus the theoretical value of pickup target elements was 3, which was 50% of 6. Also, Figure 14In this case, the number of pick-up target components calculated at the 4th replenishment, i.e., the number of components that can be held, is three. The number of pick-up target components calculated at the 4th replenishment (three) is the same as the theoretical value of pick-up target components (three). On the other hand, the holding probability calculated at the 4th replenishment is 33%, which is lower than the theoretical value of the holding probability (50%). In other words, the holding probability calculated at the 1st replenishment is 48%, but the holding probability calculated at the 4th replenishment is 33%, which is significantly lower than the theoretical value of the holding probability (50%). This is because the ratio of the number of stationary components in the total number of components at the 4th replenishment (3 / 9) is more than five times the ratio of the number of stationary components in the total number of components at the 1st replenishment (3 / 50).

[0096] Thus, the more the number of replenishments increases and the smaller the total number of components is, the higher the ratio of the number of stationary components in the total number of components is, and the lower the holding probability calculated at the replenishment is. In other words, if there are stationary components on the stage 156, the more the number of replenishments increases, the lower the holding probability calculated at the replenishment is. On the other hand, if there are no stationary components on the stage 156, even if the number of replenishments increases, the holding probability calculated at the replenishment does not decrease, and substantially becomes the theoretical value of the holding probability. In view of this, in the bulk component supply device 32, in a case where the holding probability calculated each time components are supplied from the component housing container 180 to the stage 156 becomes a reference value or less than the reference value based on the theoretical value of the holding probability, a notification screen that warns of the mixing of stationary components is displayed on the display panel 460. In addition, considering errors and the like, for example, the reference value is set to a value that is 10% lower than the theoretical value of the holding probability (50%). Therefore, in a case where the holding probability calculated at the 3rd replenishment becomes 40% or less, in other words, when the holding probability calculated at the 3rd replenishment is calculated, as shown in FIG. 5B, the notification screen 510 that warns of the mixing of stationary components is displayed on the display panel 460. Figure 15

[0097] ​In addition, the comment 512 that urges confirmation of the component of the work table 156 is displayed on the notification screen 510. Thus, in a case where a stationary component is mixed in the work table 156, the operator removes the stationary component, and thus it is possible to prevent a decrease in the probability of holding. Further, in a case where the suction nozzle 332 generates some kind of abnormality when holding the component from the work table 156, it is feared that the component is broken at the time of holding of the component based on the suction nozzle 332. Further, in a case where the component storage device 92 generates some kind of abnormality when the component stored in the component storage container 180 is scattered on the work table 156, it is feared that the component is broken. In other words, it is feared that the normal pin component 410 becomes a defective product 410al, bl due to the operation of the suction nozzle 332 or the component return device 92. Thus, the comment 514 that urges confirmation of the holding member, that is, the suction nozzle 332 and the component return device 92, which holds the component is also displayed on the notification screen 510. Thus, it is possible to suppress generation of the defective product 410al, bl and prevent a decrease in the probability of holding.

[0098] Further, as a cause of a decrease in the probability of holding calculated at the time of replenishment, not only a stationary component, it is feared that pattern matching cannot be appropriately performed based on the captured data. In detail, when pattern matching is performed based on the captured data, image processing is performed on the captured data, but in this image processing, for example, binarization is performed in a pixel unit. At this time, whether or not a value of luminance, hue, brightness, or the like of a pixel unit is equal to or greater than a threshold value is determined, and the outline of the component is recognized by binarization in the pixel unit. Thus, in the image processing based on the captured data, a threshold value of the value of the luminance or the like is set as a parameter, and the image processing is performed based on this parameter. However, sometimes the outline of the component cannot be appropriately recognized depending on the conditions of the exposure amount, brightness, or the like at the time of capturing. In this way, if the outline of the component cannot be appropriately recognized, the pickup target component cannot be determined, and the probability of holding decreases.

[0099] In view of such a situation, in a case where the probability of holding calculated at the time of replenishment decreases, specifically, in a case where the probability of holding calculated at the time of replenishment becomes equal to or less than the above-mentioned reference value (40%), the parameter of the image processing is changed. Further, the pattern matching based on the captured data is performed by binarization in the pixel unit based on the changed parameter. Thus, by appropriately recognizing the outline of the component, the pickup target component is appropriately determined, and it is possible to prevent a decrease in the probability of holding. In this way, in the bulk component supply device 32, in a case where the probability of holding calculated at the time of replenishment becomes equal to or less than the above-mentioned reference value (40%), the notification screen 510 is displayed on the display panel 460, and the parameter of the image processing is changed, and thus a decrease in the probability of holding is prevented.

[0100] Furthermore, in the bulk component supply device 32, based on the number of stacks and the number of components that can be held calculated during replenishment, a notification screen urging an adjustment to the supply interval of components supplied from the component supplier 88 is displayed on the display panel 460. Specifically, the number of stacks is the number of components overlapping on the worktable 156, and the number of components that can be held is the number of components that can be picked up from the worktable 156. Moreover, even if the number of components that can be picked up from the worktable 156 is small, if the number of components overlapping on the worktable 156 is large, it can be assumed that the number of components supplied to the worktable 156 is excessive.

[0101] Therefore, if the number of stacks calculated during replenishment exceeds the preset maximum number of stacks, or if the number of units that can be maintained during replenishment is less than the preset minimum number of units that can be maintained, such as... Figure 16 As shown, a notification screen 520 urging the reduction of the number of components supplied to the worktable 156 is displayed on the display panel 460. This notification screen 520 displays a note 522 urging an increase in the component supply interval from the component feeder 88 to the worktable 156. Furthermore, by increasing the component supply interval according to this note 522, the operator can reduce the number of components on the worktable 156. Therefore, by reducing the overlap of components on the worktable 156, the number of components that can be picked up from the worktable 156 is increased, improving the retention probability.

[0102] On the other hand, if the number of overlapping components on worktable 156 is small, and the number of components that can be picked up from worktable 156 is also small, then if the area of ​​worktable 156 without components is large, it can be assumed that the number of components supplied to worktable 156 is too small. Therefore, if the number of stacks is less than the preset minimum number of stacks and the number that can be held is less than the preset minimum number that can be held, a notification screen (not shown) urging an increase in the number of components supplied to worktable 156 is displayed on display panel 460, based on the condition that the empty area rate is greater than a set ratio. This notification screen displays a note urging a shorter component supply interval from component feeder 88 to worktable 156. Moreover, the operator can shorten the component supply interval according to this note, thereby increasing the number of components on worktable 156. Thus, by increasing the number of components that can be picked up from worktable 156, the probability of holding components can be improved.

[0103] Further, the individual control device 452 of the bulk component supply device 32 has an arithmetic unit 550, a storage unit 552, a holding unit 554, a determination unit 556, a change unit 558, and a replenishment unit 560. The arithmetic unit 550 is a functional unit for calculating position information indicating the position of the component on the work table 156, posture information indicating the posture of the component, and quantity information indicating the number of components based on the captured data. The storage unit 552 is a functional unit for storing the calculated position information, posture information, and quantity information in the storage device 458. The holding unit 554 is a functional unit for holding the component by the suction nozzle 332 based on the calculated position information and posture information. The determination unit 556 is a functional unit for determining whether to change the parameter of the image processing based on the calculated quantity information. The change unit 558 is a functional unit for changing the parameter of the image processing in the case where the determination unit 556 determines to change the parameter. The replenishment unit 560 is a functional unit for operating the conveyance device 106 of the component feeder 88 to replenish the component from the component feeder 88 to the work table 156.

[0104] Further, the bulk component supply device 32 is an example of a component supply device. The work table 156 is an example of a work table. The camera 290 is an example of a capturing device. The suction nozzle 332 is an example of a holding member. The individual control device 452 is an example of an arithmetic device. The storage device 458 is an example of a storage device. Further, the process performed by the arithmetic unit 550 is an example of an arithmetic process. The process performed by the storage unit 552 is an example of a storage process. The process performed by the holding unit 554 is an example of a holding process. The process performed by the determination unit 556 is an example of a determination process. The process performed by the change unit 558 is an example of a change process. The process performed by the replenishment unit 560 is an example of a replenishment process.

[0105] Further, the present application is not limited to the above-described embodiments, and can be implemented in various manners in which various changes and improvements are implemented based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiments, the notification screen prompting the change of the supply interval of the component from the component feeder 88 is displayed on the display panel 460 based on the calculated number of layers, the number of holdable components, and the like at the time of replenishment, but the supply interval of the component can also be automatically changed. In other words, in the case where the number of layers exceeds the maximum number of layers and the number of holdable components is less than the minimum number of holdable components, the supply interval of the component can also be automatically lengthened. Further, it can also be that, in the case where the number of layers is less than the minimum number of layers and the number of holdable components is less than the minimum number of holdable components, the supply interval of the component is automatically shortened with the condition that the empty area rate is greater than the set ratio. In this way, the process of automatically changing the supply interval of the component becomes an example of a change process.

[0106] Further, in the above-described embodiment, the display of the informing screen, the change of the parameter of the image processing is performed based on the number information such as the maintainable probability stored in the storage device 458, but various jobs can be performed based on the number information. For example, in a case where a plurality of components on the work table 156 are imaged, the order of the image processing of the plurality of components performed based on the imaging data can be determined based on the number information. Specifically, in a case where a larger number of components are placed on the left side of the work table 156, the image processing can be performed from the components on the left side.

[0107] Further, in the above-described embodiment, the camera 290 having a wide angle of view is used, and the imaging of the entire work table 156 can be performed at once, but in a case where a camera having a narrow angle of view is used, the work table 156 can be divided into a plurality of regions, and the imaging can be performed a plurality of times.

[0108] Further, in the above-described embodiment, the total number of components is calculated based on the component-specific area, but the total number of components can be calculated by various methods. For example, the outline of the components in various postures can be distinguished based on the imaging data, and the total number of components can be calculated based on the distinguished outlines.

[0109] Further, in the above-described embodiment, the present application is applied to the lead component 410, but the present application can be applied to various kinds of components. Specifically, for example, the present application can be applied to a structural component of a solar cell, a structural component of a power module, an electronic circuit component having no lead, and the like.

[0110] Explanation of Reference Numerals

[0111] 32 bulk component supply device (component supply device) 156 work table 290 camera (imaging device) 332 suction nozzle (holding member) 452 individual control device (control device) 458 storage device 550 calculation section (calculation step) 552 storage section (storage step) 554 holding section (holding step) 556 determination section (determination step) 558 change section (change step) 560 replenishment section (replenishment step).

Claims

1. A component supply method of supplying components scattered on a table, the component supply method comprising: an operation step of operating position information indicating positions of components, posture information indicating postures of components, and quantity information indicating quantities of components, based on captured data of components scattered on the table; a holding step of holding components scattered on the table by a holding member using the position information and the posture information operated in the operation step; a determination step of determining whether or not to change a parameter at the time of image processing of captured data in the operation step, based on the quantity information operated in the operation step; and a change step of changing the parameter at the time of image processing of captured data in the operation step, in a case where it is determined to change the parameter in the determination step.

2. The component supply method according to claim 1, wherein the parameter is used to recognize outer edges of components based on captured data.

3. The component supply method according to claim 1, wherein the quantity information is information indicating at least one of a quantity of components on the table, a quantity of components capable of being held from the table by the holding member, and a quantity of components overlapped on the table.

4. The component supply method according to claim 2, wherein the quantity information is information indicating at least one of a quantity of components on the table, a quantity of components capable of being held from the table by the holding member, and a quantity of components overlapped on the table.

5. A component supply apparatus comprising: a table on which components are scattered; a holding member that holds components scattered on the table; a capturing device that captures components scattered on the table; and an operation device that operates position information indicating positions of components, posture information indicating postures of components, and quantity information indicating quantities of components, based on captured data of components captured by the capturing device, the holding member holds components scattered on the table using the position information and the posture information operated by the operation device, in a case where the quantity information operated indicates a predetermined value, the operation device changes a parameter at the time of image processing of captured data and operates the quantity information based on captured data. ​

Images