A process for the preparation of a carbon fiber composite material that can be used in folding electronic devices and articles
By developing a process for preparing carbon fiber composite materials, the problems of poor bending performance and heavy weight of metal materials have been solved, providing lightweight, bendable materials for foldable electronic devices, achieving the characteristics of high strength and thinness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGZHOU SHUANGLIAN TECH CO LTD
- Filing Date
- 2022-06-28
- Publication Date
- 2026-05-19
AI Technical Summary
Existing metal materials such as stainless steel and titanium alloys have problems with poor bending performance and heavy weight when used as support back panels for electronic devices, making it difficult to meet the needs of foldable electronic devices.
The carbon fiber composite material preparation process involves coating carbon fibers with molten resin, hot pressing, and a special lamination design. Combined with specific resin ratios and additives, a material with excellent bending performance and lightweight is prepared. Furthermore, a mesh structure is formed through a punching process to improve bending performance.
The prepared carbon fiber composite material has high bending force, light weight and thinness, and can replace metal materials as support back plate to meet the use requirements of foldable electronic devices, and does not break after 200,000 bends.
Abstract
Description
Technical Field
[0001] This invention relates to the field of carbon fiber composite materials, and more specifically to a preparation process and product of a carbon fiber composite material that can be used in foldable electronic devices. Background Technology
[0002] In today's society, smart electronic devices are being updated and iterated at a rapid pace. This includes not only software and system updates, but also a constant stream of screen upgrades, such as high definition, eye protection, and explosion-proof features. In particular, more and more foldable electronic devices are appearing on the market. This requires the supporting materials used to have high bending performance. Only in this way can foldable electronic devices withstand tens of thousands of folds without breaking.
[0003] Currently, most electronic device support plates are made of metal materials, such as stainless steel and titanium alloys. These metal materials have poor bending performance, which cannot meet the requirements of foldable electronic devices. Furthermore, they are heavy, making them inconvenient for daily use. Patent CN113257123A discloses a display module and an electronic device. The display module includes a support plate and a display panel. The support plate includes a first panel and a second panel, connected by a bending zone to achieve bendability. However, this method suffers from complex manufacturing processes and low bending performance. To overcome these problems, this invention provides a manufacturing process and product of carbon fiber composite material suitable for foldable electronic devices. This material features high bending force, high strength, light weight, and thinness, and can replace stainless steel, titanium alloys, and other metal materials as support back plates. Summary of the Invention
[0004] To address the technical problems of existing technologies using metallic materials, such as stainless steel and titanium alloys, for support back panels, which are heavy, have poor flexibility, and are inconvenient to use, this invention prepares a carbon fiber composite material for foldable electronic devices. This composite material features high bending force, high strength, light weight, and thinness, and can replace stainless steel, titanium alloys, and other metallic materials as support back panels.
[0005] This invention provides a process for preparing carbon fiber composite materials that can be used in foldable electronic devices, comprising the following steps:
[0006] 1) Melt the resin in a heating device;
[0007] 2) After the molten resin is coated onto the surface of the carbon fiber and mixed, it is passed through a pressure roller to obtain a carbon fiber-resin prepreg;
[0008] 3) The obtained carbon fiber-resin prepreg is specially laminated, hot-pressed, and pressed to obtain carbon fiber composite material sheets.
[0009] 4) The obtained carbon fiber composite material sheet is processed by punching to finally obtain the carbon fiber composite material.
[0010] As a preferred technical solution, the resin in step 1) is at least one of thermosetting resin, thermoplastic resin, and synthetic resin.
[0011] Preferably, the thermosetting resin is at least one of epoxy resin, polyimide resin, bismaleimide resin, and phenolic resin; the thermoplastic resin is at least one of polycarbonate resin, polypropylene resin, and polyethersulfone resin; and the synthetic resin is at least one of polyethylene resin, polyvinyl chloride resin, and polystyrene resin.
[0012] Preferably, the resin is a thermosetting resin and a thermoplastic resin, wherein the thermosetting resin is an epoxy resin and the thermoplastic resin is a polycarbonate resin, and the weight ratio of the two is (1-5):(4-11).
[0013] More preferably, the thermosetting resin is epoxy resin and the thermoplastic resin is polycarbonate resin, with a weight ratio of (3-5):(4-8). More preferably, the weight ratio is 4:6.
[0014] Preferably, the epoxy resin is a bisphenol A type epoxy resin or an aliphatic epoxy resin, with a weight ratio of 1:1.
[0015] The system incorporates specific amounts of epoxy resin and polycarbonate resin, which work synergistically, exhibit good compatibility, moderate viscosity, and strong fluidity. This allows for thorough wetting of carbon fibers upon contact. After roller processing, a uniform resin layer is coated onto the carbon fiber surface, improving the mechanical properties of the resulting material. The added polycarbonate resin is a linear carbonate polyester, possessing excellent flexibility. It mixes and crosslinks thoroughly with the epoxy resin, enhancing both the mechanical properties and the bendability of the prepared material.
[0016] As a preferred technical solution, an additive is also required in step 1), and the weight ratio of the additive to the resin is (3-5):(70-80).
[0017] Preferably, the weight ratio of the additive to the resin is (3.5-4.5):(72-78); more preferably, the weight ratio of the additive to the resin is 4:(74-76); more preferably, the weight ratio of the additive to the resin is 4:75.
[0018] As a preferred technical solution, the additives are curing agents, accelerators, and diluents, with a weight ratio of 1:(0.1-0.3):(0.2-0.3).
[0019] More preferably, the additive is a curing agent, an accelerator, and a diluent, with a weight ratio of 1:0.2:(0.2-0.3); more preferably, the additive is a curing agent, an accelerator, and a diluent, with a weight ratio of 1:0.2:0.25.
[0020] Preferably, the curing agent is an epoxy curing agent, specifically one of 2883 epoxy resin curing agent, FXR-1020 latent epoxy curing agent, or D230 epoxy curing agent; more preferably, the curing agent is FXR-1020 latent epoxy curing agent, purchased from Guangzhou Haoyi New Material Technology Co., Ltd.
[0021] Preferably, the accelerator is LC-100 latent accelerator, purchased from Dongguan Longchuang New Material Technology Co., Ltd.; the diluent is reactive diluent HS501, purchased from Jining Tangyi Chemical Co., Ltd.
[0022] In this system, the addition of specific amounts of additives, especially latent epoxy curing agents and latent accelerators, can ensure that the resin has a longer stability and is easier to process. The addition of diluents improves the fluidity of the resin. The synergistic effect of the three makes the resin have high stability and moderate viscosity, thus improving the mechanical properties of carbon fiber-resin prepreg.
[0023] Preferably, the melting temperature of the resin during step 1) is controlled at 100-150℃.
[0024] More preferably, the melting temperature of the resin during step 1) is controlled at 120-150℃.
[0025] There are no special restrictions on the type and specifications of carbon fiber; preferably, the carbon fiber specification is one of Toray T300 / T400 / T700 / T800 / T1000.
[0026] More preferably, the carbon fiber specification is one of Toray T300 / T400 / T700 / T800.
[0027] Further preferably, the specifications of the carbon fiber tow are not particularly limited, and examples include 1K, 3K, 6K, and 12K.
[0028] As a preferred technical solution, the pressure of the pressure roller in step 2) is 0.3-0.5MPa, and the speed is 1-5m / min.
[0029] Preferably, in step 2), the pressure of the pressure roller is 0.4 MPa and the speed is 2-4 m / min.
[0030] Preferably, in step 2), the pressure of the pressure roller is 0.4 MPa and the speed is 3 m / min.
[0031] As a preferred technical solution, the areal density of the carbon fiber-resin prepreg in step 2) ranges from 15 to 100 g / m³. 2 .
[0032] Preferably, the areal density of the carbon fiber-resin prepreg ranges from 30 to 75 g / m³. 2 .
[0033] More preferably, the areal density of the carbon fiber-resin prepreg is 30 g / m³. 2 55g / m 2 75g / m 2 .
[0034] As a preferred technical solution, the number of layers in step 3) is 1-5, and the thickness is less than 0.2mm.
[0035] Preferably, the number of layers in the stacked design is 2-4, and the thickness is 0.1-0.2 mm.
[0036] In this invention application, the applicant discovered that by limiting the number of layers in the laminated design to 1-5 layers and the thickness to less than 0.2 mm, the bending performance of the prepared material can be greatly improved, meeting its application requirements in foldable electronic devices. Preferably, when the number of layers in the laminated design is 2-4 layers and the thickness is 0.1-0.2 mm, the ultra-thin material thickness allows the prepared material to withstand 200,000 bending cycles from 0-180 degrees with a bending radius of 2.5 mm without breakage. Furthermore, the superior carbon fiber, with its inherent high strength, combined with the specific structure of this invention, results in a product that is lightweight, thin, and possesses high strength.
[0037] Preferably, the temperature during hot pressing in step 3) is 85-160℃, the pressure is 0.1-15MPa, and the time is 5-60min.
[0038] Preferably, in step 3), the hot pressing temperature is 90-160℃, the pressure is 0.2-15MPa, and the time is 10-60min.
[0039] Preferably, the carbon fibers in the laminated design are arranged in one or two directions; preferably, the carbon fibers in the laminated design are arranged in one direction.
[0040] Preferably, the punching process in step 4) is as follows: punching is performed along a 45-degree direction, and the punching part is the bending part.
[0041] Further punching processes, especially punching the bending parts, can be applied to the obtained carbon fiber composite sheets to obtain special mesh structures, which further improve the bending performance of the prepared materials.
[0042] Another aspect of the present invention provides a carbon fiber composite material that can be used in foldable electronic devices, which is prepared by the above-described preparation method.
[0043] Beneficial effects:
[0044] 1) The prepared carbon fiber composite material has the characteristics of high bending force, high strength, light weight and thin thickness, and can replace metal materials such as stainless steel and titanium alloy as support back plates.
[0045] 2) Specific amounts of epoxy resin and polycarbonate resin work synergistically to improve the mechanical properties of the prepared material while also improving its bendability.
[0046] 3) A special punching process is used to create a special mesh structure in the bending area, which further improves the bending performance of the prepared material. Detailed Implementation
[0047] Example 1
[0048] Embodiment 1 of the present invention specifically provides a process for preparing a carbon fiber composite material that can be used in foldable electronic devices, including the following steps:
[0049] 1) Melt the resin in a heating device;
[0050] 2) After the molten resin is coated onto the surface of the carbon fiber and mixed, it is passed through a pressure roller to obtain a carbon fiber-resin prepreg;
[0051] 3) The obtained carbon fiber-resin prepreg is specially laminated, hot-pressed, and pressed to obtain carbon fiber composite material sheets.
[0052] 4) The obtained carbon fiber composite material sheet is processed by punching to finally obtain the carbon fiber composite material.
[0053] The resin is epoxy resin and polycarbonate resin, with a weight ratio of 4:6.
[0054] The epoxy resin is a bisphenol A type epoxy resin or an aliphatic epoxy resin, with a weight ratio of 1:1.
[0055] The bisphenol A type epoxy resin is bisphenol A type epoxy resin 128, purchased from Dongguan Bennu Composite Materials Co., Ltd.; the aliphatic epoxy resin is aliphatic epoxy resin JZ-501, purchased from Nanjing Jiazhong Chemical Technology Co., Ltd.; and the polycarbonate resin is polycarbonate resin XH-PC321, purchased from Dongguan Xuhua New Materials Technology Co., Ltd.
[0056] In step 1), an additive is also required, and the weight ratio of the additive to the resin is 4:75.
[0057] The additives are curing agent, accelerator, and diluent, with a weight ratio of 1:0.2:0.25.
[0058] The curing agent is FXR-1020 latent epoxy curing agent, purchased from Guangzhou Haoyi New Material Technology Co., Ltd.; the accelerator is LC-100 latent accelerator, purchased from Dongguan Longchuang New Material Technology Co., Ltd.; and the diluent is reactive diluent HS501, purchased from Jining Tangyi Chemical Co., Ltd.
[0059] In step 1), the melting temperature of the resin is controlled at 140°C.
[0060] The carbon fiber specification is Toray T700SC-6K carbon fiber yarn, purchased from Shenzhen Guosen Leading Technology Co., Ltd.
[0061] In step 2), the pressure of the pressure roller is 0.4 MPa and the speed is 3 m / min.
[0062] In step 2), the areal density of the carbon fiber-resin prepreg is 55 g / m³. 2 .
[0063] In step 3), the stacked design has 3 layers with a thickness of 0.15 mm.
[0064] In step 3), the hot pressing temperature is 120℃, the pressure is 8MPa, and the time is 35min.
[0065] In step 3) of the stacked design, the carbon fibers are arranged in a unidirectional direction.
[0066] The punching process in step 4) is as follows: punching is performed along a 45-degree direction, and the punching part is the bending part.
[0067] A carbon fiber composite material that can be used in foldable electronic devices is provided, which is prepared by the above-described preparation method.
[0068] Example 2
[0069] Example 2 of the present invention specifically provides a preparation process for carbon fiber composite material that can be used in foldable electronic devices. The specific implementation method is the same as that in Example 1, except that the resin is epoxy resin and polycarbonate resin, and the weight ratio of the two is 3:4.
[0070] Example 3
[0071] Example 3 of the present invention specifically provides a preparation process for carbon fiber composite material that can be used in foldable electronic devices. The specific implementation method is the same as that in Example 1, except that the number of layers in step 3) is 4 and the thickness is 0.16 mm.
[0072] Comparative Example 1
[0073] Comparative Example 1 of the present invention specifically provides a preparation process for a carbon fiber composite material that can be used in foldable electronic devices. The specific implementation method is the same as that in Example 1, except that the resin is epoxy resin and polycarbonate resin, and the weight ratio of the two is 7:2.
[0074] Comparative Example 2
[0075] Comparative Example 2 of the present invention specifically provides a preparation process for carbon fiber composite materials that can be used in foldable electronic devices. The specific implementation method is the same as that in Example 1, except that the number of layers in step 3) is 7 and the thickness is 0.28 mm.
[0076] Comparative Example 3
[0077] Comparative Example 3 of the present invention specifically provides a preparation process for carbon fiber composite material that can be used in foldable electronic devices. The specific implementation method is the same as that in Example 1, except that the punching process in step 4) is not performed.
[0078] Performance testing:
[0079] 1. Bending performance: Evaluate the material's fracture condition after 200,000 bends with a bending radius of 2.5mm at a range of 0-180 degrees. The results are categorized as no fracture, creases without fracture, and fracture.
[0080] 2. Strength: Tensile strength and modulus of elasticity are tested in accordance with standard GB / T1447-2005.
[0081] The carbon fiber composite materials obtained in Examples 1-3 and Comparative Examples 1-3 were tested using the reference performance test method. The test results are shown in Table 1.
[0082] Table 1
[0083] Tensile strength (MPa) Elastic modulus (GPa) Bending performance Example 1 3200 235 No fracture Example 2 3158 234 No fracture Example 3 3284 238 No fracture Comparative Example 1 2843 215 There are creases but no breakage. Comparative Example 2 2958 225 fracture Comparative Example 3 2946 224 fracture
Claims
1. A process for preparing carbon fiber composite materials that can be used in foldable electronic devices, characterized in that, Includes the following steps: 1) Melt the resin in a heating device; 2) After the molten resin is coated onto the surface of the carbon fiber and mixed, it is passed through a pressure roller to obtain a carbon fiber-resin prepreg; 3) The obtained carbon fiber-resin prepreg is laminated, hot-pressed, and pressed to obtain carbon fiber composite material sheets. 4) The obtained carbon fiber composite material sheet is processed by punching to finally obtain carbon fiber composite material; The resin in step 1) is a thermosetting resin and a thermoplastic resin; the thermosetting resin is an epoxy resin and the thermoplastic resin is a polycarbonate resin, and the weight ratio of the two is 3:4 or 4:
6. The epoxy resin is a bisphenol A type epoxy resin or an aliphatic epoxy resin, with a weight ratio of 1:
1. In step 1), an additive is also required, and the weight ratio of the additive to the resin is 4:(74-76). The additives are curing agent, accelerator, and diluent, with a weight ratio of 1:0.2:(0.2-0.3). The curing agent is a latent epoxy curing agent, and the accelerator is a latent accelerator; In step 3), the number of layers in the stacked design is 2-4 layers, and the thickness is 0.1-0.2mm; The punching process in step 4) is as follows: punching is performed along a 45-degree direction, and the punching part is the bending part.
2. The preparation process of a carbon fiber composite material for foldable electronic devices as described in claim 1, characterized in that, In step 2), the pressure of the pressure roller is 0.3-0.5 MPa, and the speed is 1-5 m / min.
3. The preparation process of a carbon fiber composite material for foldable electronic devices as described in claim 1, characterized in that, In step 2), the areal density of the carbon fiber-resin prepreg ranges from 15 to 100 g / m³. 2 .
4. A carbon fiber composite material obtained by a preparation process of a carbon fiber composite material that can be used in foldable electronic devices as described in any one of claims 1-3.