High efficiency test apparatus for laser chips

Abstract

The application discloses a kind of high-efficiency test equipment for laser chip, comprising: test probe assembly, the test probe assembly includes: with the body of driving support connection, support plate, probe for being contacted with chip to be tested and dynamic point contact probe head, one end of the support plate is installed with a cantilever, the other end is installed with the dynamic point contact probe head, the lower end surface of the body one side is provided with a static point contact probe head in the upper portion of dynamic point contact probe head and with it corresponding, the cantilever is fixed with a probe seat being installed with the probe at the end away from support plate, when probe is contacted with chip to be tested, the dynamic point contact probe head is rotated away from static point contact probe head with support plate, dynamic, static point contact probe head changes from initial state of mutual contact to mutual separation state, the included angle of probe and support plate is 60 °.The application improves the stability, repeatability, comparability and consistency of detection data.

Description

Technical Field

[0001] This invention relates to a high-efficiency testing device for laser chips, belonging to the field of chip testing technology. Background Technology

[0002] In the testing of single laser chips (LDs) for optical communication, the stability of the probe plays a crucial role. Due to the extremely small size of a single chip (typically within the 300μm range), the test probe will inevitably cause some displacement in the chip's position or angle during contact. Once the chip's position and angle change, it will directly affect the stability and efficiency of subsequent test indicators. Moreover, the pressure stability of the test probe will also directly reflect the stability of the test values. For mass production testing, a single probe needs to test a large number of chips, and the same chip needs to be tested multiple times. The stability and durability of the power-on probe assembly will directly affect the consistency and reproducibility of the test data. Therefore, the long-term stability of the test probe assembly is subject to very stringent requirements during the testing process. Summary of the Invention

[0003] The inventors discovered that changes in pressure exerted by the probe on the chip cause variations in contact resistance, thus affecting the consistency of test data. During prolonged testing, excessive pressure changes can make it impossible to distinguish whether the changes in test results are due to the chip itself or the testing equipment, leading to a loss of comparability. Based on this discovery, the purpose of this invention is to provide a high-efficiency testing device for laser chips. This device solves the problem of unstable and inconsistent test data during long-term use due to fatigue of the test probe assembly on the testing equipment, a problem present in existing technologies.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is: a high-efficiency testing device for laser chips, comprising: a substrate, a test stage mounted on the upper surface of the substrate, a drive bracket mounted on the outer side of the substrate, and a test probe assembly mounted on the drive bracket and located above the test stage. The test probe assembly comprises: a body connected to the drive bracket, a support plate, a probe for contacting the chip under test, and a moving contact probe. A cantilever is mounted on one end of the support plate, and the moving contact probe is mounted on the other end. A stationary contact probe is disposed on one side of the lower end face of the body, located above the moving contact probe and corresponding to it. When the probe contacts the chip under test, the moving contact probe rotates away from the stationary contact probe with the support plate, and the moving and stationary contact probes change from an initial state of mutual contact to a state of mutual separation. A probe holder on which the probe is mounted is fixed at the end of the cantilever away from the support plate, and the angle between the probe and the support plate is 60°.

[0005] An adapter is installed on the upper surface of the middle part of the support plate. The adapter has a front baffle and a rear baffle on its front and rear sides, respectively. A first through hole and two guide grooves are opened on both the front and rear baffles. The two ends of a first pin are located in the first through hole of the front baffle and the rear baffle, respectively.

[0006] A second pin and a third pin are arranged parallel to each other on the lower protrusion on the other side of the lower end face of the body. The second pin and the third pin are located above the first pin and on both sides of it. Both ends of the second pin and the third pin extend from the front and rear sides of the lower protrusion. The first bearing and the second bearing are respectively sleeved on both ends of the second pin and located on the front and rear sides of the lower protrusion. The third bearing and the fourth bearing are respectively sleeved on both ends of the third pin and located on the front and rear sides of the lower protrusion.

[0007] The first bearing, the third bearing, the second bearing, and the fourth bearing are respectively located between the lower protrusion and the front baffle and the rear baffle. One end of the first elastic element located in the vertical through hole of the lower protrusion is connected to the middle area of ​​the first pin between the front baffle and the rear baffle, and the other end is connected to the fourth pin located in the body and above the second and third pins. The first elastic element is in a stretched state, thereby pressing the moving rings of the first bearing, the second bearing, the third bearing, and the fourth bearing into contact with the side surface of the first pin.

[0008] The center-of-gravity torque of the support plate portion, cantilever, probe holder, and probe located to the right of the first pin is greater than the center-of-gravity torque of the remaining support plate portion and the moving point contact probe located to the left of the first pin.

[0009] The following are further improvements to the above technical solution:

[0010] 1. In the above scheme, the probe holder includes a base and a clip, and at least one surface of the base and clip that contacts the probe has a V-shaped groove for the probe to be embedded.

[0011] 2. In the above scheme, the drive bracket further includes two parallel uprights, a mounting plate connected between the upper ends of the two uprights, and a connecting plate connected between the lower ends of the two uprights, and the two test probe assemblies are respectively mounted on the upper surfaces of both ends of the mounting plate.

[0012] 3. In the above scheme, a fixing plate mounted on the base plate is vertically arranged between the upright of the drive bracket and the base plate. A motor is installed at the lower part of the fixing plate. A lead screw is installed on the output shaft of the motor in a vertical direction. A lead screw nut fitted on the lead screw is connected to the connecting plate of the drive bracket.

[0013] 4. In the above scheme, a slide rail is provided on each side of the lead screw and between the upright and the fixed plate, and the upright is movably connected to the slide rail through at least two sliders.

[0014] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0015] This invention relates to a high-efficiency testing device for laser chips. Based on the ability to perform performance testing on a large number of chips, it features a first pin perpendicular to the length of the support plate, mounted on a rotatable support plate with probes. Second and third pins, fixed to the main body, are positioned on either side above the first pin. Four bearings, in contact with the first pin, are installed at both ends of the second and third pins. Finally, a first elastic element tightens the first pin on the support plate and the fourth pin inside the main body, ensuring that the outer rings of the four bearings maintain pressure contact with the outer circumference of the first pin and can rotate relative to it. This eliminates the fatigue problem present in existing technologies, facilitates accurate setting of horizontal and vertical position parameters, and maintains the stability of the initial pressure setting even after long-term, high-frequency use. This improves the stability, repeatability, comparability, and consistency of the test data. It also overcomes the defect of slight vertical vibration of the probe when it detaches from the chip, thus shortening the time between adjacent tests, improving testing efficiency, and avoiding unnecessary damage to the chip. Furthermore, it eliminates slight horizontal rotational offset of the probe, ensuring the accuracy of the test data and further improving the stability, repeatability, comparability, and consistency of the test data. Attached Figure Description

[0016] Appendix Figure 1 This is a schematic diagram of the structure of the high-efficiency testing equipment for laser chips according to the present invention;

[0017] Appendix Figure 2 This is a schematic diagram of the test probe assembly in the high-efficiency testing equipment of the present invention;

[0018] Appendix Figure 3 This is a partial structural cross-sectional view of the test probe assembly in the high-efficiency testing equipment of the present invention;

[0019] Appendix Figure 4 This is a partial structural diagram of the test probe assembly in the high-efficiency testing device of the present invention;

[0020] Appendix Figure 5 for Figure 4 A schematic diagram of the exploded structure;

[0021] Appendix Figure 6 This is a bottom view of a partial structure of the test probe assembly in the high-efficiency testing equipment of the present invention;

[0022] Appendix Figure 7 This is a schematic diagram of the probe holder in the high-efficiency testing equipment for laser chips according to the present invention.

[0023] In the attached diagrams: 1. Body; 2. Support plate; 31. Moving contact probe; 32. Stationary contact probe; 4. Cantilever; 5. Probe holder; 51. Probe; 52. Base; 53. Clamping piece; 54. Adjusting nut; 55. V-groove; 6. Adapter; 61. Front baffle; 62. Rear baffle; 7. First through hole; 8. Guide groove; 9. First pin; 10. Lower protrusion; 11. Second pin; 12. Third pin; 13. 14. First bearing; 15. Second bearing; 16. Third bearing; 17. Fourth bearing; 18. Vertical through hole; 19. First elastic element; 20. Fourth pin; 21. Base plate; 22. Test stage; 23. Drive bracket; 231. Upright pole; 232. Mounting plate; 233. Connecting plate; 24. Test probe assembly; 25. Fixing plate; 26. Motor; 27. Lead screw; 28. Lead screw nut; 29. ​​Slide rail; 30. Slider. Detailed Implementation

[0024] In the description of this patent, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this patent based on the specific circumstances.

[0025] Example 1: A high-efficiency testing device for laser chips, comprising: a substrate 21, a test stage 22 mounted on the upper surface of the substrate 21, a drive bracket 23 mounted on the outer side of the substrate 21, and a test probe assembly 24 mounted on the drive bracket 23 and located above the test stage 22. The test probe assembly 24 includes: a body 1 connected to the drive bracket 23, a support plate 2, a probe 51 for contacting the chip under test, and a moving contact probe 31. A cantilever 4 is mounted on one end of the support plate 2, and the moving contact probe 31 is mounted on the other end. The body 1... A stationary contact probe 32 is located above the moving contact probe 31 and corresponding to it on one side of the lower end face. When the probe contacts the chip to be tested, the moving contact probe rotates away from the stationary contact probe with the support plate. The moving and stationary contact probes change from the initial state of mutual contact to the state of mutual separation. After the chip test control system receives the signal that the moving and stationary contact probes are separated, it performs a power-on operation to make the probe and the chip electrically connected, and then performs various parameter tests on the chip. A probe holder 5 on which the probe 51 is installed is fixed at the end of the cantilever 4 away from the support plate 2.

[0026] An adapter 6 is installed on the upper surface of the middle part of the support plate 2. The front side and the rear side of the adapter 6 have a front baffle 61 and a rear baffle 62 respectively. The front baffle 61 and the rear baffle 62 each have a first through hole 7 and two guide grooves 8 located on both sides of the first through hole 7. The two ends of a first pin 9 are located in the first through hole 7 of the front baffle 61 and the rear baffle 62 respectively.

[0027] A second pin 11 and a third pin 12 are arranged parallel to each other on the lower protrusion 10 located on the other side of the lower end face of the body 1. The second pin 11 and the third pin 12 are located above the first pin 9 and on both sides of it. Both ends of the second pin 11 and the third pin 12 extend from the front and rear sides of the lower protrusion 10. The first bearing 13 and the second bearing 14 are respectively sleeved on both ends of the second pin 11 and located on the front and rear sides of the lower protrusion 10. The third bearing 15 and the fourth bearing 16 are respectively sleeved on both ends of the third pin 12 and located on the front and rear sides of the lower protrusion 10.

[0028] The first bearing 13, the third bearing 15, the second bearing 14, and the fourth bearing 16 are respectively located between the lower protrusion 10 and the front baffle 61 and the rear baffle 62. One end of the first elastic member 18 located in the vertical through hole 17 of the lower protrusion 10 is connected to the middle area of ​​the first pin 9 between the front baffle 61 and the rear baffle 62, and the other end is connected to the fourth pin 19 located in the body 1 and above the second pin 11 and the third pin 12. The first elastic member 18 is in a stretched state, thereby pressing the moving rings of the first bearing 13, the second bearing 14, the third bearing 15, and the fourth bearing 16 into contact with the side surface of the first pin 9.

[0029] The center-of-gravity torque of the support plate 2 part located on the right side of the first pin 9, the cantilever 4, the probe seat 5 and the probe 51 is greater than the center-of-gravity torque of the remaining part of the support plate 2 located on the left side of the first pin 9 and the moving point contact probe 31.

[0030] The probe holder 5 includes a base 52 and a clamp 53, and the probe 51 is located between the base 52 and the clamp 53. The clamp 53 is connected to the base 52 by an adjusting nut 54.

[0031] At least one of the surfaces of the base 52 and the clip 53 that contact the probe 51 has a V-shaped groove 55 for the probe 51 to be inserted; the angle between the probe 51 and the support plate 2 is 30°.

[0032] Example 2: A high-efficiency testing device for laser chips, comprising: a substrate 21, a test stage 22 mounted on the upper surface of the substrate 21, a drive bracket 23 mounted on the outer side of the substrate 21, and a test probe assembly 24 mounted on the drive bracket 23 and located above the test stage 22. The test probe assembly 24 includes: a body 1 connected to the drive bracket 23, a support plate 2, a probe 51 for contacting the chip under test, and a moving contact probe 31. A cantilever 4 is mounted on one end of the support plate 2, and the moving contact probe 31 is mounted on the other end. A stationary contact probe 32 is provided on one side of the lower end face of the body 1, located above the moving contact probe 31 and corresponding to it. A probe holder 5 on which the probe 51 is mounted is fixed at the end of the cantilever 4 away from the support plate 2.

[0033] An adapter 6 is installed on the upper surface of the middle part of the support plate 2. The front side and the rear side of the adapter 6 have a front baffle 61 and a rear baffle 62 respectively. The front baffle 61 and the rear baffle 62 each have a first through hole 7 and two guide grooves 8 located on both sides of the first through hole 7. The two ends of a first pin 9 are located in the first through hole 7 of the front baffle 61 and the rear baffle 62 respectively.

[0034] A second pin 11 and a third pin 12 are arranged parallel to each other on the lower protrusion 10 located on the other side of the lower end face of the body 1. The second pin 11 and the third pin 12 are located above the first pin 9 and on both sides of it. Both ends of the second pin 11 and the third pin 12 extend from the front and rear sides of the lower protrusion 10. The first bearing 13 and the second bearing 14 are respectively sleeved on both ends of the second pin 11 and located on the front and rear sides of the lower protrusion 10. The third bearing 15 and the fourth bearing 16 are respectively sleeved on both ends of the third pin 12 and located on the front and rear sides of the lower protrusion 10.

[0035] The first bearing 13, the third bearing 15, the second bearing 14, and the fourth bearing 16 are respectively located between the lower protrusion 10 and the front baffle 61 and the rear baffle 62. One end of the first elastic member 18 located in the vertical through hole 17 of the lower protrusion 10 is connected to the middle area of ​​the first pin 9 between the front baffle 61 and the rear baffle 62, and the other end is connected to the fourth pin 19 located in the body 1 and above the second pin 11 and the third pin 12. The first elastic member 18 is in a stretched state, thereby pressing the moving rings of the first bearing 13, the second bearing 14, the third bearing 15, and the fourth bearing 16 into contact with the side surface of the first pin 9.

[0036] The center-of-gravity torque of the support plate 2 part located on the right side of the first pin 9, the cantilever 4, the probe seat 5 and the probe 51 is greater than the center-of-gravity torque of the remaining part of the support plate 2 located on the left side of the first pin 9 and the moving point contact probe 31.

[0037] The aforementioned drive bracket 23 further includes two parallel uprights 231, a mounting plate 232 connected between the upper ends of the two uprights 231, and a connecting plate 233 connected between the lower ends of the two uprights 231. The two aforementioned test probe assemblies 24 are respectively mounted on the upper surfaces at both ends of the mounting plate 232.

[0038] A fixing plate 25 mounted on the base plate 21 is vertically arranged between the upright 231 of the drive bracket 23 and the base plate 21. A motor 26 is installed at the lower part of the fixing plate 25. A lead screw 27 is installed on the output shaft of the motor 26 in a vertical direction. A lead screw nut 28 fitted on the lead screw 27 is connected to the connecting plate 233 of the drive bracket 23.

[0039] A slide rail 29 is provided on both sides of the lead screw 27 and between the upright 231 and the fixed plate 25. The upright 231 is movably connected to the slide rail 29 through at least two sliders 30. The angle between the probe 51 and the support plate 2 is 60°.

[0040] When using the aforementioned high-efficiency testing equipment for laser chips, the test probe assembly is moved by the drive bracket driven by the motor, so that the probe on the test probe assembly contacts the chip to be tested on the test stage. The probe applies downward pressure to the chip and receives an upward reaction force from the chip, which drives the support plate to rotate. The moving contact probe mounted on the support plate moves downward, changing from the initial state of contact with the stationary contact probe to the state of separation from the stationary contact probe, indicating that the probe has applied appropriate pressure to the chip. At this time, the chip test control system performs a power-on operation to make the probe and the chip electrically connected and test various parameters of the chip. After the test is completed, the support plate rotates in the opposite direction under the action of the second elastic element, returning to the initial horizontal position, and at the same time, the moving contact probe contacts the stationary contact probe.

[0041] During long-term testing of a large number of chips and the reciprocating rotation of the support plate, the first elastic element ensures that the first pin mounted on the support plate is in contact with the four bearings on its two sides and two ends, which are mounted on the main body. This ensures that the support plate can rotate smoothly around the first pin as a fulcrum, while also precisely limiting the first pin, so that the support plate can only rotate and will not deviate in other directions. This eliminates the fatigue problem of existing technologies that use spring sheet support structures to support the front-end probe structure, while enabling performance testing of a large number of chips. It is also beneficial to accurately set the horizontal and vertical position parameters, and can maintain the stability of the initial pressure setting value even after long-term, high-frequency use. This improves the stability, repeatability, comparability, and consistency of the test data, and overcomes the defect of slight vertical vibration of the probe when it is separated from the chip. This helps to shorten the time between adjacent tests, thereby improving the test efficiency and avoiding unnecessary damage to the chip.

[0042] Furthermore, it also eliminates the slight rotational offset of the probe in the horizontal direction, ensuring the accuracy of the detection data and further improving the stability, repeatability, comparability, and consistency of the detection data.

[0043] This invention provides a high-efficiency testing device for laser chips, which can be extended to other industries for semiconductor chip testing. Its application is not limited to the optical communication industry; all industries that require high-efficiency testing equipment for laser chips can simultaneously expand its use, making it widely applicable.

[0044] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A high-efficiency testing device for laser chips, characterized in that, include: The test platform (22) consists of a substrate (21), a test stage (22) mounted on the upper surface of the substrate (21), a drive bracket (23) mounted on the outer side of the substrate (21), and a test probe assembly (24) mounted on the drive bracket (23) and located above the test stage (22). The test probe assembly (24) includes: a body (1) connected to the drive bracket (23), a support plate (2), a probe (51) for contacting the chip under test, and a moving contact probe (31). A cantilever (4) is mounted on one end of the support plate (2), and the moving contact probe (31) is mounted on the other end. A stationary contact probe (32) is provided on one side of the lower end face of the main body (1) above the moving contact probe (31) and corresponding to it. When the probe (51) contacts the chip to be tested, the moving contact probe (31) rotates away from the stationary contact probe (32) with the support plate (2). The moving and stationary contact probes (31; 32) change from the initial state of mutual contact to the state of mutual separation. A probe seat (5) on which the probe (51) is installed is fixed at one end of the cantilever (4) away from the support plate (2). The angle between the probe (51) and the support plate (2) is 60°. An adapter (6) is installed on the upper surface of the middle part of the support plate (2). The adapter (6) has a front baffle (61) and a rear baffle (62) on the front and rear sides respectively. A first through hole (7) and two guide grooves (8) located on both sides of the first through hole (7) are opened on the front baffle (61) and the rear baffle (62). A first pin (9) is located at both ends in the first through hole (7) of the front baffle (61) and the rear baffle (62) respectively. A second pin (11) and a third pin (12) are arranged parallel to each other on the lower protrusion (10) on the other side of the lower end face of the body (1). The second pin (11) and the third pin (12) are located above the first pin (9) and on both sides of it. Both ends of the second pin (11) and the third pin (12) extend from the front and rear sides of the lower protrusion (10). The first bearing (13) and the second bearing (14) are respectively sleeved on both ends of the second pin (11) and located on the front and rear sides of the lower protrusion (10). The third bearing (15) and the fourth bearing (16) are respectively sleeved on both ends of the third pin (12) and located on the front and rear sides of the lower protrusion (10). The first bearing (13), the third bearing (15), the second bearing (14), and the fourth bearing (16) are respectively located between the lower protrusion (10) and the front baffle (61) and the rear baffle (62). One end of the first elastic element (18) located in the vertical through hole (17) of the lower protrusion (10) is connected to the middle area of ​​the first pin (9) between the front baffle (61) and the rear baffle (62), and the other end is connected to the fourth pin (19) located in the body (1) and above the second pin (11) and the third pin (12). The first elastic element (18) is in a stretched state, thereby pressing the moving rings of the first bearing (13), the second bearing (14), the third bearing (15), and the fourth bearing (16) against the side surface of the first pin (9). The center-of-gravity torque of the support plate (2) part located to the right of the first pin (9), the cantilever (4), the probe seat (5) and the probe (51) is greater than the center-of-gravity torque of the remaining part of the support plate (2) located to the left of the first pin (9) and the moving point contact probe (31).

2. The high-efficiency testing equipment for laser chips according to claim 1, characterized in that: The probe holder (5) includes a base (52) and a clip (53), and at least one of the surfaces of the base (52) and the clip (53) that contact the probe (51) has a V-shaped groove (55) for the probe (51) to be inserted.

3. The high-efficiency testing equipment for laser chips according to claim 1, characterized in that: The drive bracket (23) further includes two parallel uprights (231), a mounting plate (232) connected between the upper ends of the two uprights (231), and a connecting plate (233) connected between the lower ends of the two uprights (231). The two test probe assemblies (24) are respectively mounted on the upper surfaces of the two ends of the mounting plate (232).

4. The high-efficiency testing equipment for laser chips according to claim 3, characterized in that: A fixing plate (25) mounted on the base plate (21) is vertically arranged between the upright (231) of the drive bracket (23) and the base plate (21). A motor (26) is installed at the lower part of the fixing plate (25). A lead screw (27) is installed on the output shaft of the motor (26) in a vertical direction. A lead screw nut (28) fitted on the lead screw (27) is connected to the connecting plate (233) of the drive bracket (23).

5. The high-efficiency testing equipment for laser chips according to claim 4, characterized in that: A slide rail (29) is provided on both sides of the lead screw (27) and between the upright (231) and the fixed plate (25). The upright (231) is movably connected to the slide rail (29) through at least two sliders (30).

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