Film forming device, film forming method and evaporation source unit

Abstract

The present invention provides a film forming device, a film forming method and an evaporation source unit that can easily remove an evaporation source from a cover. The film forming device vaporizes an evaporation substance to form a film on a substrate. A container forms an internal space, and the internal space includes a storage space for storing the evaporation substance and a diffusion space for the vaporized evaporation substance to diffuse. A cover member covers at least a portion of the container. The container forms the internal space in a manner of providing a diffusion space whose width in a first direction is narrower than the storage space on the upper surface of the storage space. The cover member includes a first cover and a second cover, the first cover at least covers a first side wall that defines a side of the storage space in the container, and the second cover is rotatably supported on the first cover, and covers at least a connecting wall in the container, and the connecting wall connects the first side wall and the second side wall that defines a side of the diffusion space.

Description

Technical Field

[0001] The present invention relates to a film forming device, a film forming method and an evaporation source unit. Background Art

[0002] In the manufacture of organic EL displays, etc., a thin film is formed on a substrate by depositing a vaporized substance emitted from an evaporation source onto the substrate. Patent Document 1 discloses an evaporation source structure comprising a container for storing the vaporized substance and a diffusion section for diffusing the vaporized vaporized substance. Furthermore, Patent Document 1 discloses a structure in which the diffusion section is narrower than the container section.

[0003]

Prior art literature

[0004] [Patent Literature]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2018-003122 Summary of the Invention

[0006] [Problems to be solved by the invention]

[0007] However, in film-forming apparatuses, the evaporation source is sometimes covered by a cover or the like. To facilitate replenishment of the evaporation material and maintenance, it is desirable to easily remove the evaporation source from the cover or the like. Regarding this point, in evaporation sources with different widths between the diffusion section and the receiving section, as in the prior art, there is room for improvement in the structure of the cover covering the evaporation source.

[0008] The present invention provides a technology for easily removing an evaporation source from a cover.

[0009]

Solutions to Solve the Problem

[0010] According to one aspect of the present invention, there is provided a film forming apparatus for vaporizing a vapor deposition material to form a film on a substrate, the film forming apparatus comprising:

[0011] a container, wherein the container forms an internal space, the internal space including a receiving space for receiving the vaporized deposition material and a diffusion space for diffusing the vaporized deposition material; and

[0012] a cover member covering at least a portion of the container,

[0013] The container forms the internal space by providing the diffusion space having a width narrower than the accommodation space in the first direction on the upper surface of the accommodation space.

[0014] The cover member comprises:

[0015] a first cover, the first cover covering at least a first side wall defining a side of the receiving space in the container; and

[0016] The second cover is rotatably supported by the first cover and covers at least a connecting wall in the container, the connecting wall connecting the first side wall and a second side wall defining a side surface of the diffusion space.

[0017] According to another aspect of the present invention, there is provided a film forming method comprising a film forming step of forming a film on a substrate using the above-mentioned film forming apparatus.

[0018] According to another aspect of the present invention, there is provided an evaporation source unit for vaporizing an evaporation material to form a film on a substrate, characterized by comprising:

[0019] a container, wherein the container forms an internal space, the internal space including a receiving space for receiving the vaporized deposition material and a diffusion space for diffusing the vaporized deposition material; and

[0020] a cover member covering at least a portion of the container,

[0021] The container forms the internal space by providing the diffusion space having a width narrower than the accommodation space in the first direction on the upper surface of the accommodation space.

[0022] The cover member comprises:

[0023] a first cover, the first cover covering at least a first side wall defining a side of the receiving space in the container; and

[0024] The second cover is rotatably supported by the first cover and covers at least a connecting wall in the container, the connecting wall connecting the first side wall and a second side wall defining a side surface of the diffusion space.

[0025] Effects of the invention

[0026] According to the present invention, the evaporation source can be easily taken out from the cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a plan view schematically showing the structure of a film forming apparatus according to one embodiment.

[0028] Figure 2 It is schematically represented Figure 1 A front view of the structure of the film forming device.

[0029] Figure 3 It is a perspective view schematically showing the structure of a film forming unit.

[0030] Figure 4 It is a cross-sectional view showing the internal structure of the evaporation source.

[0031] Figure 5 This is an exploded view of the space forming portion and the plate-shaped member.

[0032] Figure 6 It is a perspective view showing the structure of an evaporation source and a cover member.

[0033] Figure 7 It is a perspective view showing the structure of an evaporation source and a cover member.

[0034] FIG8(A) is an overall view of an organic EL display device, and FIG8(B) is a view showing a cross-sectional structure of one pixel.

[0035] Figure 9 This is a cross-sectional view for explaining the internal structure of an evaporation source according to one embodiment.

[0036] Figure 10 It is a plan view for explaining the structure of the partition portion of the evaporation source.

[0037] [Description of Reference Numerals]

[0038] 1: Film forming device, 10: Film forming unit, 12: Evaporation source, 121: Container, 124: Plate-shaped member, 125: Extension, 15: Cover member, 151: Lower cover, 152: Upper cover, 100: Substrate, 101: Mask, SP1: Accommodation space, SP2: Diffusion space DETAILED DESCRIPTION

[0039] The following detailed description of the embodiments is provided with reference to the accompanying drawings. It should be noted that the following embodiments do not limit the inventions described in the claims. Although various features are described in the embodiments, not all of these features are essential to the inventions, and any combination of these features is possible. Furthermore, in the accompanying drawings, identical or similar structures are denoted by the same reference numerals, and duplicate descriptions are omitted.

[0040] <First embodiment>

[0041] <Overview of Film Formation Apparatus>

[0042] Figure 1 It is a plan view schematically showing the structure of a film forming apparatus 1 according to one embodiment. Figure 2 It is schematically represented Figure 1 1 is a front view of the structure of the film forming apparatus 1. It should be noted that in each figure, arrows X and Y indicate mutually orthogonal horizontal directions, and arrow Z indicates the vertical direction (plumb direction). Furthermore, in each figure, some reference numerals may be omitted for ease of viewing.

[0043] The film forming device 1 forms a film by attaching the vaporized evaporation material to the substrate. In the present embodiment, the film forming device 1 performs evaporation while moving the evaporation source. The film forming device 1 is used, for example, in the manufacture of a display panel of an organic EL display device for a smartphone, and a plurality of devices are arranged to form its production line. As the material of the substrate on which the film forming device 1 is to be evaporated, glass, resin, metal, etc. can be appropriately selected, and a structure in which a resin layer such as polyimide is formed on glass is preferably used. As the evaporation material, organic materials, inorganic materials (metals, metal oxides, etc.) are used. The film forming device 1 can be applied to manufacturing devices for manufacturing electronic devices, optical components, such as display devices (flat panel displays, etc.), thin-film solar cells, organic photoelectric conversion elements (organic thin-film imaging elements), and in particular, can be applied to manufacturing devices for manufacturing organic EL panels. Moreover, in the present embodiment, the film forming device 1 forms a film on a G8H-sized glass substrate (1100×2500mm, 1250mm×2200mm), but the size of the substrate on which the film forming device 1 forms the film can be appropriately set.

[0044] The film forming apparatus 1 includes a film forming unit 10 (evaporation source unit), a moving unit 20, and a plurality of support units 30A and 30B (hereinafter, when collectively referred to as such, they are referred to as support units 30, and the same applies to their components, etc.). The film forming unit 10, the moving unit 20, and the support unit 30 are arranged inside a chamber 45 that is maintained as a vacuum when in use. In the present embodiment, the plurality of support units 30A and 30B are arranged in the upper part of the chamber 45 separately along the Y direction, and the film forming unit 10 and the moving unit 20 are arranged below them. In addition, a plurality of substrate inlets 44A and 44B for carrying in and out the substrate 100 are provided in the chamber 45. It should be noted that, in the present embodiment, "vacuum" refers to a state filled with a gas having a pressure lower than the atmospheric pressure, in other words, a reduced pressure state.

[0045] The film forming apparatus 1 also includes a power supply 41 for supplying power to the film forming unit 10, and an electrical connection portion 42 for electrically connecting the film forming unit 10 to the power supply 41. The electrical connection portion 42 is formed by electrical wiring passing horizontally through the interior of the movable arm, and as described later, is capable of supplying power from the power supply 41 to the film forming unit 10 as it moves in the XY directions.

[0046] The film forming apparatus 1 also includes a control unit 43 that controls the operation of each component. For example, the control unit 43 may include a processor such as a CPU, memory such as RAM and ROM, and various interfaces. For example, the control unit 43 reads programs stored in the ROM into the RAM and executes them, thereby implementing various processes of the film forming apparatus 1.

[0047] <Support Unit>

[0048] The support unit 30 supports the substrate 100 and the mask 101 and adjusts their positions. The support unit 30 includes a substrate support portion 32 , a position adjustment portion 34 , and a mask support portion 36 .

[0049] It should be noted that regarding the reference numerals that appear in this specification and the accompanying drawings, components located on the support unit 30A side are denoted by the letter "A" appended to the numeral, and components located on the support unit 30B side are denoted by the letter "B" appended to the numeral. When referring to related components collectively, the reference numerals are simply numerals. For example, the mask located on the support unit 30A side is 101A, the mask located on the support unit 30B side is 101B, and the masks collectively are referred to as mask 101. The reference numerals for other components are similarly arranged.

[0050] The substrate support portion 32 supports the substrate 100. In this embodiment, the substrate support portion 32 supports the substrate 100 such that the longitudinal direction of the substrate 100 is the X direction and the width direction of the substrate 100 is the Y direction. For example, the substrate support portion 32 can support the substrate 100 by clamping the edge of the substrate 100 at multiple locations, or by adsorbing the substrate 100 using an electrostatic chuck or the like.

[0051] The position adjustment unit 34 adjusts the positional relationship between the substrate 100 and the mask 101. In the present embodiment, the position adjustment unit 34 adjusts the positional relationship between the substrate 100 and the mask 101 by moving the substrate support unit 32 that supports the substrate 100. However, the positional relationship between the substrate 100 and the mask 101 can also be adjusted by moving the mask 101. The position adjustment unit 34 includes a fixed unit 341 fixed to the chamber 45 and a movable unit 342 that supports the substrate support unit 32 and moves relative to the fixed unit 341. The movable unit 342 moves in the X direction relative to the fixed unit 341, thereby moving the substrate 100 supported by the substrate support unit 32 in the X direction and adjusting the approximate positional relationship between the substrate 100 and the mask 101 in the X direction. In addition, the movable unit 342 includes a mechanism for moving the supported substrate support unit 32 in the XY direction in order to perform precise position adjustment (alignment) of the substrate 100 and the mask 101. As for the specific method of alignment, well-known technology can be used, so detailed description is omitted. The movable portion 342 moves the substrate support portion 32 in the Z direction to adjust the Z-direction positional relationship between the substrate 100 and the mask 101. The movable portion 342 can appropriately employ known techniques such as a rack and pinion mechanism and a ball screw mechanism.

[0052] The mask support 36 supports the mask 101. In this embodiment, the mask support 36 supports the mask 101 so that the mask 101 is located at the center in the X direction in the chamber 45. For example, the mask support 36 can support the mask 101 by clamping the edge of the mask 101 at multiple locations.

[0053] The film deposition apparatus 1 of this embodiment is a so-called dual-stage film deposition apparatus 1 capable of supporting multiple substrates 100A and 100B using multiple support units 30A and 30B. For example, while vapor deposition is being performed on the substrate 100A supported by the support unit 30A, alignment between the substrate 100 supported by the support unit 30B and the mask 101 can be performed, enabling efficient film deposition. Hereinafter, the stage on the support unit 30A side will sometimes be referred to as stage A, and the stage on the support unit 30B side will sometimes be referred to as stage B.

[0054] In this embodiment, during film formation, approximately half of the substrate 100 overlaps with the mask 101 by the support unit 30. Therefore, a suppression plate (not shown) is appropriately provided inside the chamber 45 to suppress the deposition material from adhering to the portion of the substrate 100 that does not overlap with the mask 101 during film formation.

[0055] <Mobile Unit>

[0056] The moving unit 20 includes an X-direction moving portion 22 that moves the film forming unit 10 in the X direction and a Y-direction moving portion 24 that moves the film forming unit 10 in the Y direction.

[0057] The X-direction moving section 22, a component provided in the film deposition unit 10, includes a motor 221, a pinion 222 mounted on a shaft member rotated by the motor 221, and a guide member 223. Furthermore, the X-direction moving section 22 includes a frame member 224 that supports the film deposition unit 10, a rack 225 formed on the upper surface of the frame member 224 and meshing with the pinion 222, and a guide rail 226 along which the guide member 223 slides. The pinion 222, rotated by the drive of the motor 221, meshes with the rack 225, allowing the film deposition unit 10 to move in the X-direction along the guide rail 226.

[0058] The Y-direction moving section 24 includes two support members 241A and 241B extending in the Y direction and separated in the X direction. The two support members 241A and 241B support the short sides of the frame member 224 of the X-direction moving section 22. The Y-direction moving section 24 includes a drive mechanism (not shown), such as a motor and a rack and pinion mechanism, and moves the film forming unit 10 in the Y direction by moving the frame member 224 in the Y direction relative to the two support members 241A and 241B. The Y-direction moving section 24 moves the film forming unit 10 in the Y direction between a position below the substrate 100A supported by the support unit 30A and a position below the substrate 100B supported by the support unit 30B.

[0059] <Film Forming Unit>

[0060] Figure 3 It is a three-dimensional diagram schematically showing the structure of the film forming unit 10. The film forming unit 10 includes evaporation sources 12a to 12c arranged in the X direction with the Y direction as the longitudinal direction (hereinafter, they will be collectively referred to as evaporation sources 12, and the same applies to their components, etc.). The structure of the evaporation source 12 will be described later, but in this embodiment, a plurality of evaporation sources 12 are provided, thereby enabling a plurality of vapor deposition materials to be vaporized and released in one film forming unit 10. In addition, the film forming unit 10 includes a cover member 15 and a lid member 16 that cover the evaporation source 12. In this embodiment, the cover member 15 is fixed to the support table 19 of the film forming unit 10. Details of the cover member 15 will be described later.

[0061] The film forming unit 10 also includes monitoring devices 14a to 14f (hereinafter, collectively referred to as monitoring devices 14, and the same applies to their components) disposed on both sides of the evaporation sources 12a to 12c in the Y direction. The monitoring devices 14 monitor the release of the evaporation material from the evaporation sources 12. In this embodiment, the monitoring devices 14a and 14d monitor the release of the evaporation material from the evaporation source 12a, the monitoring devices 14b and 14e monitor the release of the evaporation material from the evaporation source 12b, and the monitoring devices 14c and 14f monitor the release of the evaporation material from the evaporation source 12c. Furthermore, the monitoring devices 14a to 14c are housed in a housing 145a, and the monitoring devices 14d to 14f are housed in a housing 145b. Openings for allowing the evaporation material to enter the housings 145a and 145b are appropriately provided so that the evaporation material released from each monitored evaporation source 12 can reach each monitoring device 14.

[0062] The monitoring device 14 of this embodiment is equipped with a crystal oscillator (not shown) as a film thickness sensor inside the housing. The evaporation material emitted from the evaporation source 12 adheres to the crystal oscillator through an inlet portion (not shown) such as an opening formed in the housing. The vibration frequency of the crystal oscillator varies according to the amount of the evaporation material attached. Thus, the control unit 43 can calculate the film thickness of the evaporation material evaporated on the substrate 100 by monitoring the vibration frequency of the crystal oscillator. The amount of evaporation material attached to the crystal oscillator per unit time is related to the amount of evaporation material emitted from the evaporation source 12, so that the emission state of the evaporation material from multiple evaporation sources 12 can be monitored.

[0063] In this embodiment, two monitoring devices 14 are provided for one evaporation source 12. However, one monitoring device 14 may be provided for one evaporation source 12. Furthermore, the number of evaporation sources 12 and monitoring devices 14 may be changed as appropriate.

[0064] Furthermore, the film forming unit 10 may include a baffle (not shown) to block the evaporation material emitted from the evaporation source 12 from scattering toward the substrate 100. For example, the film forming unit 10 may include a baffle to block the evaporation material emitted from the evaporation sources 12a and 12b from scattering toward the substrate 100, and a baffle to block the evaporation material emitted from the evaporation source 12c from scattering toward the substrate 100. Furthermore, for example, after evaporation is performed using the evaporation sources 12a and 12b while the evaporation material is blocked from scattering toward the substrate 100 by the baffle (not shown), evaporation may be performed using the evaporation source 12c while the evaporation material is blocked from scattering toward the substrate 100 by the baffle (not shown). Thus, when the evaporation sources 12a and 12b emit different evaporation materials than the evaporation source 12c, two thin films can be formed on the substrate using a single film forming unit 10. Furthermore, when the evaporation sources 12a and 12b emit different evaporation materials, co-evaporation can be achieved to form a mixed film on the substrate 100.

[0065] In this embodiment, the film forming unit 10 forms a film on the substrate 100 by releasing the evaporation material from the evaporation source 12 while moving in the X direction (movement direction) by the moving unit 20. However, a structure in which the film is formed on the transported substrate 100 by a fixed evaporation source may also be employed.

[0066] <Evaporation Source>

[0067] Next, the structure of the evaporation source 12 will be described. Figure 4 It is a cross-sectional view for explaining the internal structure of the evaporation source 12. Figure 4 In FIG, the cover member 16 is omitted, and the upper cover 152 is shown in a closed state.

[0068] The evaporation source 12 includes a container 121 and a plate-shaped member 124. The container 121 defines an internal space, which includes a storage space SP1 and a diffusion space SP2. The storage space SP1 stores the evaporation material, while the diffusion space SP2 allows the vaporized evaporation material to diffuse. It should be noted that the space referred to herein refers to the region defined by the container 121. This region is still referred to as a space even if it is filled with a substance different from the components of the container 121, such as a gas or liquid.

[0069] The container 121 includes a pair of side walls 1211 and a pair of side walls 1212. The pair of side walls 1211 define the side surfaces of the storage space SP1 in the Y direction. The pair of side walls 1212 define the side surfaces of the diffusion space SP2 in the Y direction. Furthermore, the container 121 includes a pair of connecting walls 1213. The pair of connecting walls 1213 connects the pair of side walls 1211 and the pair of side walls 1212 on the +Y side. Furthermore, the other pair of connecting walls 1213 connects the pair of side walls 1211 and the pair of side walls 1212 on the -Y side. Furthermore, the pair of connecting walls 1213 connects the upper end portions of the pair of side walls 1211 and the lower end portions of the pair of side walls 1212. In this embodiment, the pair of side walls 1212 is disposed between the pair of side walls 1211 in the Y direction, and thus the pair of connecting walls 1213 is disposed to extend from the pair of side walls 1211 in the Y direction to the inside of the container 121 .

[0070] With such a structure, the container 121 forms an internal space in such a manner that a diffusion space SP2 having a width in the Y direction narrower than that of the receiving space SP1 is provided on the upper surface of the receiving space SP1. Here, if the width of the receiving space SP1 is widened, the capacity of the evaporated material can be increased. On the other hand, if the width of the diffusion space SP2 is widened, the nozzle 122 is arranged further outward in the Y direction (the width direction of the substrate 100), and the evaporated material is scattered toward the substrate 100 at a large angle relative to the normal direction of the evaporation surface of the substrate 100. In this case, the evaporated material may enter between the substrate 100 and the mask 101. In this embodiment, the receiving space SP1 is constructed to be relatively wide and the diffusion space SP2 is constructed to be relatively narrow, thereby increasing the capacity of the evaporated material and suppressing the evaporated material from entering between the substrate 100 and the mask 101.

[0071] In addition, the container 121 includes a bottom wall 1214 defining the bottom surface of the storage space SP1, an upper wall 1215 defining the upper surface of the diffusion space SP2, a pair of side walls 1216 defining the side surfaces of the storage space SP1 in the X direction, and a pair of side walls 1217 defining the side surfaces of the diffusion space SP2 in the X direction. Figure 4 The overall shape is an inverted T in the direction of the diagram.

[0072] In the receiving space SP1, a plurality of partition members 126 are separately provided along the Y direction. Each partition member 126 is provided in a manner connected to the bottom wall 1214 and the side wall 1216. Furthermore, each portion separated by the plurality of partition members 126 functions as a receiving portion for receiving the evaporated material. In the present embodiment, five receiving portions are formed in the receiving space SP1 by four partition members 126. By providing a plurality of receiving portions in the receiving space SP1, even if there is uneven heating of the evaporated material by the heater 129 described later and there is a change in the reduction method of the evaporated material in the Y direction, uneven film formation on the substrate 100 can be suppressed. It should be noted that, in the present embodiment, the plurality of receiving portions formed in the receiving space SP1 are formed in a manner of equal size, but the size of each receiving portion may also be different.

[0073] Furthermore, a plurality of nozzles 122 are formed on the upper wall 1215. The evaporation material diffused in the diffusion space SP2 is discharged from the plurality of nozzles 122 toward the substrate 100. The plurality of nozzles 122 are spaced apart in the Y direction. Furthermore, the nozzles 122 disposed outward in the Y direction are arranged such that their axial directions are tilted outward in the Y direction relative to the Z direction. This configuration enables the evaporation material to be deposited across the entire width of the substrate 100.

[0074] The plate-shaped member 124 is a member that separates the storage space SP1 from the diffusion space SP2 within the container 121. In this embodiment, the plate-shaped member 124 divides the interior space formed by the container 121 into upper and lower parts. Specifically, the plate-shaped member 124 defines the lower portion of the interior space of the container 121 as the storage space SP1, while the upper portion as the diffusion space SP2.

[0075] The plate-like member 124 also has openings 1241 formed therein for the vaporized deposition material to pass through. In this embodiment, when the vaporized deposition material contained in the storage space SP1 vaporizes, it enters the diffusion space SP2 through the openings 1241. In other words, the plate-like member 124 divides the interior of the container 121 into multiple spaces and allows the vaporized deposition material to move between these spaces. In this embodiment, the plate-like member 124 is formed from a single flat plate, but the shape of the plate-like member 124 and other aspects may be modified as appropriate.

[0076] The plate-shaped member 124 is also provided with an extension 125 that surrounds the opening 1241 and extends from the plate-shaped member 124. In this embodiment, the extension 125 extends from the plate-shaped member 124 toward the storage space SP1. The extension 125 rectifies the vaporized deposition material moving from the storage space SP1 to the diffusion space SP2. This facilitates uniform diffusion of the vaporized deposition material within the diffusion space SP2. Furthermore, since the extension 125 is provided on the plate-shaped member 124 that partitions the interior of the container 121, the container 121 can be prevented from increasing in size in the vertical direction. Specifically, in this embodiment, the upper surface of the storage space SP1 and the lower surface of the diffusion space SP2 are connected via the plate-shaped member 124. Therefore, compared to a structure in which the storage space SP1 and the diffusion space SP2 are separated, the storage space SP1 and the diffusion space SP2 can be arranged more compactly in the vertical direction, and the deposition material rectified by the extension 125 can be introduced into the diffusion space SP2.

[0077] In the present embodiment, the extension portion 125 has a cylindrical shape. The shape of the extension portion 125 can be appropriately changed, but the extension portion 125 may also have a cylindrical shape in which the cross-section of the surface perpendicular to the axial direction is circular, elliptical, or polygonal. Moreover, in the present embodiment, the extension portion 125 extends from the plate-like member 124 toward the lower side, that is, the accommodation space SP1 side, but the extension portion 125 may also extend from the plate-like member 124 toward the upper side, that is, the diffusion space SP2 side. Alternatively, the extension portion 125 may also extend from the plate-like member 124 on both the upper and lower sides. Moreover, in the present embodiment, the portion of the plate-like member 124 that forms the edge of the opening 1241 is continuous with the extension portion 125. That is, the inner diameter of the opening 1241 and the hollow portion of the extension portion 125 are the same. However, a structure in which the opening 1241 is smaller than the inner diameter of the extension portion 125 may also be adopted. That is, the portion of the plate-like member 124 that forms the edge of the opening 1241 may overlap with the hollow portion of the extension portion 125.

[0078] The length of the extension 125 extending from the plate-shaped member 124 can also be appropriately set. For example, the length of the extension 125 can be 5 to 120 mm, 10 to 100 mm, 15 to 35 mm, or 20 to 30 mm. Furthermore, the length of the extension 125 can be 25 mm. Furthermore, for example, the length of the extension 125 can be set based on its positional relationship with the partition member 126. For example, the length of the extension 125 can be set within a range in the Z direction such that the extension 125 and the partition member 126 do not overlap.

[0079] In addition, the shape of the opening 1241 can also be appropriately changed in the same manner as the extension 125, and can be a circular, elliptical or polygonal shape. Moreover, the shape of the opening 1241 can be set based on the relationship between the lengths in the X direction (the moving direction of the substrate 100) and the Y direction (the width direction of the substrate 100). For example, when the length of the opening 1241 in the X direction is set to a and the length in the Y direction is set to b, the shape of the opening 1241 can be set in a manner such that the length a < length b. That is, the shape of the opening 1241 can be set to become longer along the Y direction. In this case, the amount of the evaporated material moving from the receiving space SP1 to the diffusion space SP2 can be stabilized. On the other hand, the shape of the opening 1241 can be set in a manner such that the length a > length b. That is, the shape of the opening 1241 can be set to become longer along the X direction. In this case, uneven film formation in the Y direction can be suppressed.

[0080] In addition, in this embodiment, the opening 1241 is provided between the plurality of partition members 126 in the Y direction. That is, the partition member 126 is provided so as to avoid being directly below the opening 1241. This can improve the uniformity of film formation on the substrate 100. In other words, the structure inside the container 121 can be centered around the opening 1241. Figure 4 Thus, the uniformity of film formation on the substrate 100 can be improved.

[0081] In addition, as mentioned above, the container 121 is covered by the cover member 15. The cover member 15 will be described later, but in this embodiment, a heater 129 for heating the vapor deposition material is provided between the cover member 15 composed of the lower cover 151 and the upper cover 152 and the container 121. In detail, the heater 129 is provided between the lower cover 151 and the side wall 1211, the bottom wall 1214 and the side wall 1216. Moreover, a heater 129 is also provided between the upper cover 152 and the side wall 1212. As the heater 129, a well-known technology can be appropriately adopted. For example, the heater 129 can be constructed by embedding a heating wire in a metal plate. Moreover, in this embodiment, the heater 129 is respectively installed on each wall portion of the container 121. It should be noted that the configuration of the heater 129 can be appropriately changed. The heater 129 may be provided to heat both the wall forming the housing space SP1 and the wall forming the diffusion space SP2 as in the present embodiment, or may be provided to heat only one of the walls.

[0082] In addition, in the present embodiment, a cooling pipe 154 for cooling the cover member 15 is provided inside the cover member 15. The cooling pipe 154 is a pipe through which cooling water can pass, and is connected to a heat dissipation portion not shown. The cooling water circulates between the cooling pipe 154 and the heat dissipation portion, absorbs the heat of the cover member 15 while passing through the cooling pipe 154, and dissipates the absorbed heat in the heat dissipation portion. The evaporated material emitted from the evaporation source 12, or in other words, the organic material, may change its luminescent properties due to the influence of heat. Thus, the cooling pipe 154 suppresses the heat from the heater 129 from being dissipated to the outside of the cover member 15, thereby reducing the influence of the heat from the evaporation source 12 on the properties of the evaporated material. It should be noted that, in Figure 4 In the embodiment, the cooling pipe 154 is provided only in the lower cover 151 , but the cooling pipe 154 may also be provided in the upper cover 152 .

[0083] Figure 5 This is an exploded view illustrating the structure of container 121 and plate-shaped member 124. In this embodiment, container 121 can be separated into a lower portion 121a and an upper portion 121b. Furthermore, plate-shaped member 124 is provided separately from lower portion 121a and upper portion 121b. Lower portion 121a, upper portion 121b, and plate-shaped member 124 can be assembled and disassembled using fastening members such as bolts.

[0084] The lower portion 121a includes sidewalls 1211, a bottom wall 1214, and sidewalls 1216. Furthermore, the upper portion 121b includes sidewalls 1212, an upper wall 1215, and sidewalls 1217. Thus, in this embodiment, the sidewalls 1211 and 1216, which define the outer periphery of the storage space SP1, and the sidewalls 1212 and 1217, which define the outer periphery of the diffusion space SP2, can be separated. This allows for easy access to both the storage space SP1 and the diffusion space SP2 for replenishment or maintenance of the vapor deposition material.

[0085] Furthermore, in this embodiment, the plate-like member 124 is provided as a separate component from the peripheral wall portions (side walls 1211 and 1216) defining the outer perimeter of the storage space SP1 and the peripheral wall portions (side walls 1212 and 1217) defining the outer perimeter of the diffusion space SP2. This facilitates inspection of the interior of the container 121. It should be noted that the separate components can be separated from each other by releasing bolts or the like, for example, when an operator performs inspection.

[0086] Meanwhile, the plate-shaped member 124 may be integrally formed with the peripheral wall portion (side wall 1212 and side wall 1217) defining the diffusion space SP2. By integrally forming them, the thermal conductivity of the container 121 and the plate-shaped member 124 is improved, thereby increasing the heating efficiency of the heater 129.

[0087] It should be noted that in this embodiment, the side wall 1212 and the connecting wall 1213 are connected to each other in the upper portion 121b. However, the connecting wall 1213 may be omitted from the upper portion 121b. In this case, the portion of the plate-shaped member 124 that is located outside the side wall 1212 in the Y direction can function as the connecting wall connecting the side wall 1211 and the side wall 1212.

[0088] <Cover Member>

[0089] Figure 6 It is a perspective view showing the structure of the evaporation source 12 , the cover member 15 , and the lid member 16 . Figure 7 1 is a perspective view showing the structure of the evaporation source 12 and the cover member 15. Figure 7 In the figure, it is shown that Figure 6 The cover member 16 is removed and the hood member 15 is opened.

[0090] In this embodiment, the three containers 121 are substantially entirely covered by the cover member 15 and the lid member 16. Specifically, the lower cover 151 covers the side wall 1211, the bottom wall 1214, the side wall 1216, and the side wall 1217; the upper cover 152 covers the side wall 1212 and the connecting wall 1213; and the lid member 16 covers the upper wall 1215.

[0091] In addition, the upper cover 152 is rotatably supported on the lower cover 151 by the rotating portion 153. For example, the rotating portion 153 includes a shaft member connected to the upper cover 152 and having the X direction as the axial direction and a bearing member that supports the shaft member so as to be rotatable. With this structure, the upper cover 152 can at least be in the closed position ( Figure 6 ) and the open position where the connecting wall 1213 is exposed ( Figure 7 ) between the upper and lower covers 151. Specifically, in this embodiment, the upper cover 152 is positioned in the open position so that the container 121 can be removed from the lower cover 151 in the Z direction. Specifically, when viewed from above, the upper cover 152 is positioned so that the container 121, partially covered by the lower cover 151, does not overlap. This allows the container 121 to be easily removed from the cover member 15 in the Z direction.

[0092] It should be noted that in this embodiment, as the upper cover 152 opens and closes relative to the lower cover 151, the heater 129 mounted on the upper cover 152 also opens and closes together with the upper cover 152. Therefore, by configuring the cover member 15 to be openable and closable, the heater 129 can be installed on more surfaces of the container 121.

[0093] It should be noted that the upper cover 152 only needs to cover at least the connecting wall 1213. The side wall 1212 may be covered by the lid member 16 rather than the upper cover 152. Even in this case, the container 121 can be removed from the cover member 15 by removing the lid member 16 and opening the upper cover 152. Alternatively, the upper cover 152 may cover at least a portion of the upper wall 1215 or the side wall 1217, or the lid member 16 may be omitted. Furthermore, the lower cover 151, upper cover 152, and lid member 16 may be separated as appropriate.

[0094] <Method for Manufacturing Electronic Device>

[0095] Next, an example of a method for manufacturing an electronic device is described. Hereinafter, as an example of an electronic device, the structure and manufacturing method of an organic EL display device are illustrated. In this example, Figure 1 A plurality of the film forming apparatuses 1 shown as an example are installed in a production line.

[0096] First, the manufactured organic EL display device will be described. Fig. 8(A) is an overall view of an organic EL display device 50, and Fig. 8(B) is a diagram showing a cross-sectional structure of one pixel.

[0097] 8A , a plurality of pixels 52 each including a plurality of light-emitting elements are arranged in a matrix in a display area 51 of an organic EL display device 50. Each light-emitting element has an organic layer sandwiched between a pair of electrodes, as will be described in detail later.

[0098] It should be noted that the pixel mentioned here refers to the smallest unit that can display the desired color in the display area 51. In the case of a color organic EL display device, the pixel 52 is formed by a combination of multiple sub-pixels of the first light-emitting element 52R, the second light-emitting element 52G, and the third light-emitting element 52B that display different light. The pixel 52 is mostly composed of a combination of three types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. It is sufficient for the pixel 52 to include at least one type of sub-pixel, preferably two or more types of sub-pixels, and more preferably three or more types of sub-pixels. As the sub-pixels constituting the pixel 52, for example, it can be a combination of four types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element.

[0099] Figure 8(B) is a schematic partial cross-sectional view taken along line AB of Figure 8(A). Pixel 52 includes multiple sub-pixels formed of organic EL elements on substrate 53. The organic EL elements include a first electrode (anode) 54, a hole transport layer 55, one of the red layer 56R, green layer 56G, and blue layer 56B, an electron transport layer 57, and a second electrode (cathode) 58. The hole transport layer 55, red layer 56R, green layer 56G, blue layer 56B, and electron transport layer 57 correspond to organic layers. The red layer 56R, green layer 56G, and blue layer 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively.

[0100] In addition, the first electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 can be formed in common across multiple light-emitting elements, or they can be formed for each light-emitting element. That is, as shown in FIG8(B), on the basis of forming the hole transport layer 55 as a common layer across multiple sub-pixel regions, the red layer 56R, the green layer 56G, and the blue layer 56B can be formed separately for each sub-pixel region, and then the electron transport layer 57 and the second electrode 58 can be formed as a common layer across multiple sub-pixel regions.

[0101] Note that an insulating layer 59 is provided between the first electrodes 54 to prevent short circuits between adjacent first electrodes 54. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen.

[0102] In FIG8(B), the hole transport layer 55 and the electron transport layer 57 are represented by a single layer. However, depending on the structure of the organic EL display element, they may also be formed by multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer may be formed between the first electrode 54 and the hole transport layer 55. The hole injection layer has an energy band structure that allows for smooth injection of holes from the first electrode 54 to the hole transport layer 55. Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57.

[0103] The red layer 56R, the green layer 56G, and the blue layer 56B can each be formed by a single light-emitting layer or by stacking multiple layers. For example, the red layer 56R can be formed by two layers, with the red light-emitting layer forming the upper layer and the hole transport layer or the electron blocking layer forming the lower layer. Alternatively, the lower layer can be formed by the red light-emitting layer and the upper layer can be formed by the electron transport layer or the hole blocking layer. By arranging a layer on the lower side or the upper side of the light-emitting layer in this way, the light-emitting position in the light-emitting layer is adjusted and the optical path length is adjusted, thereby having the effect of improving the color purity of the light-emitting element.

[0104] It should be noted that while the example shown here shows the red layer 56R, the same structure can also be used for the green layer 56G and the blue layer 56B. Furthermore, the number of stacked layers can be two or more. Furthermore, layers made of different materials can be stacked, such as in the case of the light-emitting layer and the electron-blocking layer, or layers made of the same material can be stacked, such as in the case of stacking two or more light-emitting layers.

[0105] Next, an example of a method for manufacturing an organic EL display device will be specifically described. Here, it is assumed that the red layer 56R is composed of two layers, the lower layer 56R1 and the upper layer 56R2 , and the green layer 56G and the blue layer 56B are composed of a single light-emitting layer.

[0106] First, a substrate 53 is prepared on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed. It should be noted that the material of the substrate 53 is not particularly limited and can be made of glass, plastic, metal, etc. In this embodiment, a substrate 53 is used in which a polyimide film is laminated on a glass substrate.

[0107] A resin layer, such as acrylic or polyimide, is applied to the substrate 53 having the first electrode 54 formed thereon by bar coating or spin coating. The resin layer is then patterned by photolithography to form an opening in the portion where the first electrode 54 is formed, thereby forming an insulating layer 59. This opening corresponds to the light-emitting region where the light-emitting element actually emits light. It should be noted that in this embodiment, a large substrate is processed until the insulating layer 59 is formed. After the insulating layer 59 is formed, a dividing step is performed to divide the substrate 53.

[0108] The substrate 53 with the patterned insulating layer 59 is fed into the first film-forming apparatus, where the hole transport layer 55 is formed as a common layer on the first electrode 54 in the display area. The hole transport layer 55 is formed using a mask having openings formed therein corresponding to the display areas 51. The display areas 51 ultimately become the panel portion of each organic EL display device.

[0109] Next, the substrate 53 formed to the hole transport layer 55 is fed into the second film forming device. The substrate 53 and the mask are aligned, the substrate is placed on the mask, and a red layer 56R is formed on the portion of the red-emitting element of the substrate 53 configured above the hole transport layer 55 (the region forming the red sub-pixel). Here, the mask used in the second film forming chamber is a high-precision mask having openings formed only in the multiple regions that become red sub-pixels among the multiple regions on the substrate 53 that become sub-pixels of the organic EL display device. As a result, the red layer 56R including the red light-emitting layer is formed only on the region that becomes the red sub-pixel among the regions that become the multiple sub-pixels on the substrate 53. In other words, the red layer 56R is not formed on the region that becomes the blue sub-pixel or the region that becomes the green sub-pixel among the regions that become the multiple sub-pixels on the substrate 53, but is selectively formed on the region that becomes the red sub-pixel.

[0110] Similar to the formation of the red layer 56R, the green layer 56G is formed in the third film-forming apparatus, and the blue layer 56B is further formed in the fourth film-forming apparatus. After the formation of the red, green, and blue layers 56R, 56G, and 56B is completed, the electron transport layer 57 is formed over the entire display area 51 in the fifth film-forming apparatus. The electron transport layer 57 is formed as a common layer for the three layers: the red, green, and blue layers 56R, 56G, and 56B.

[0111] The substrate on which the electron transport layer 57 is formed is moved to the sixth film forming device to form the second electrode 58. In this embodiment, the film formation of each layer is performed by vacuum evaporation in the first film forming device to the sixth film forming device. However, the present invention is not limited to this. For example, the film formation of the second electrode 58 in the sixth film forming device can also be performed by sputtering. Then, the substrate on which the second electrode 58 is formed is moved to the sealing device and the protective layer 60 is formed by plasma CVD (sealing process), and the organic EL display device 50 is completed. It should be noted that, here, the protective layer 60 is formed by the CVD method, but it is not limited to this. It can also be formed by the ALD method or the inkjet method.

[0112] <Other Implementation Methods>

[0113] Figure 9 1 is a cross-sectional view for explaining the internal structure of the evaporation source 92 according to one embodiment. Figure 10 This is a plan view for explaining the structure of the partition portion 924 of the evaporation source 92. Hereinafter, the same reference numerals are given to the same structures as those in the above-described embodiment, and description thereof will be omitted.

[0114] The evaporation source 92 includes a container 121 and a partition 924. The container 121 defines a space within it. The partition 924 divides the interior of the container 121 into a receiving space SP1, a diffusion space SP21, and a diffusion space SP22. In other words, while the interior of the container 121 is divided into two spaces—the receiving space SP1 and the diffusion space SP2—in the above embodiment, the interior of the container 121 is divided into three spaces in this embodiment. The partition 924 includes a lower plate 9241, an upper plate 9242, an intermediate plate 9243, and a plurality of supports 9244.

[0115] The lower plate 9241 is a plate-shaped member that separates the storage space SP1 and the diffusion space SP21. Figure 4 The position of the evaporation source 12 corresponding to the plate-like member 124 is formed in the lower plate 9241. Moreover, an opening 9241a for the vaporized evaporation material to pass through is formed in the lower plate 9241. The lower plate 9241 divides the internal space of the container 121 into a plurality of spaces and allows the vaporized evaporation material to move between the spaces. In the present embodiment, the lower plate 9241 is composed of a flat plate, but the shape of the lower plate 9241 can be appropriately changed. Moreover, in the present embodiment, the lower plate 9241 extends from one side of a pair of side walls 1211 to the other in the Y direction, but it can also extend from one side of a pair of side walls 1212 to the other.

[0116] The upper plate 9242 is a plate-shaped member that separates the diffusion space SP21 from the diffusion space SP22. Specifically, the upper plate 9242 extends from one side wall 1212 to the other in the Y direction and from one side wall 1217 to the other in the X direction. The upper plate 9242 is formed with an opening 9242a for the vaporized deposition material to pass through. The upper plate 9242 divides the interior of the container 121 into multiple spaces and allows the vaporized deposition material to move between the spaces. In this embodiment, the opening 9242a of the upper plate 9241 and the opening 9241a of the lower plate 9241 are approximately the same size. However, the sizes of these openings, illustratively, may differ in width in the X or Y direction. Alternatively, the location of the opening 9241a and the location of the opening 9242a may differ when viewed from above. In this embodiment, the upper plate 9242 is formed of a single flat plate, but the shape of the upper plate 9242 and the like can be changed as appropriate.

[0117] The intermediate plate 9243 is a plate-shaped member disposed between the lower plate 9241 and the upper plate 9242. Specifically, the intermediate plate 9243 is disposed in the diffusion space SP21. In this embodiment, the width of the intermediate plate 9243 in the XY directions is configured to be wider than the widths of the openings 9241a and 9242a in the XY directions. When viewed from the other side, the intermediate plate 9243 is disposed so as to entirely overlap the openings 9241a of the lower plate 9241 and the openings 9242a of the upper plate 9242 in a plan view. However, the intermediate plate 9243 may alternatively be disposed so as to overlap at least partially the openings 9241a and 9242a in a plan view.

[0118] The plurality of support columns 9244 connect the lower plate 9241, the middle plate 9243, and the upper plate 9242. The plurality of support columns 9244 separate the lower plate 9241, the middle plate 9243, and the upper plate 9242 from each other in the Z direction.

[0119] It should be noted that in Figure 9 In the example, the position of the lower plate 9241 corresponds to Figure 4 The position of the plate-like member 124 is set, but the position of the upper plate 9242 may correspond to Figure 4 The position of the plate-like member 124 is set. Moreover, a structure in which either the lower plate 9241 or the upper plate 9242 is omitted may be adopted.

[0120] The present invention is not limited to the above-described embodiment, and various modifications and changes can be made within the scope of the gist of the invention.

Claims

1. A film forming device, wherein the film forming device forms a film on a substrate by vaporizing a vapor deposition material, wherein: have: A container having an internal space, the internal space including a storage space for storing a solid or liquid evaporation material and a diffusion space for diffusing the vaporized evaporation material; and a cover member covering at least a portion of the container, The diffusion space is arranged above the receiving space. The width of the diffusion space in the first direction is narrower than the width of the accommodation space in the first direction. The container comprises: a first side wall, the first side wall defining a side of the receiving space; a second side wall defining a side of the diffusion space; and a connecting wall, wherein the connecting wall connects the first side wall and the second side wall, The cover member comprises: a first cover, the first cover at least covering the first side wall; and The second cover is rotatably supported by the first cover and covers at least the connecting wall.

2. The film forming device according to claim 1, characterized in that: The film forming apparatus further includes a plate-shaped member that partitions the storage space and the diffusion space inside the container and has an opening formed therein for allowing the vaporized deposition material to pass therethrough.

3. The film forming device according to claim 2, characterized in that: The film forming device further includes an extension portion that surrounds the opening and extends from the plate-like member.

4. The film forming device according to any one of claims 1 to 3, characterized in that: The film forming device forms a film while moving an evaporation source including at least the container relative to a substrate in a moving direction. The first direction is a direction intersecting the moving direction.

5. The film forming apparatus according to any one of claims 1 to 3, characterized in that: The film forming apparatus further includes a heater that is provided between the container and the cover member and heats the vapor deposition material.

6. The film forming device according to claim 5, characterized in that: At least a portion of the heater is mounted on the second cover.

7. The film forming apparatus according to any one of claims 1 to 3, characterized in that: A cooling pipe for cooling the cover member is provided inside the cover member.

8. The film forming apparatus according to any one of claims 1 to 3, characterized in that: The film forming apparatus further includes a partition member that partitions the storage space into a plurality of storage portions that respectively store the vapor deposition material.

9. The film forming apparatus according to any one of claims 1 to 3, characterized in that: The container is provided with a plurality of nozzles arranged along the first direction and configured to discharge the vapor deposition material diffused in the diffusion space.

10. The film forming device according to claim 2 or 3, characterized in that: The housing space and the diffusion space are connected via the plate-shaped member.

11. A film forming method, characterized in that: The method comprises a film forming step of forming a film on a substrate using the film forming apparatus according to any one of claims 1 to 9.

12. An evaporation source unit for vaporizing an evaporation substance to form a film on a substrate, characterized in that: have: A container, wherein the container forms an internal space, the internal space including a receiving space for receiving the evaporation material and a diffusion space for diffusing the vaporized evaporation material; and a cover member covering at least a portion of the container, The container forms the internal space in such a manner that the diffusion space having a width narrower than the accommodation space in the first direction is provided on the upper surface of the accommodation space. The cover member comprises: A first cover, wherein the first cover at least covers a first side wall defining a side of the receiving space in the container; and The second cover is rotatably supported by the first cover and covers at least a connecting wall in the container, the connecting wall connecting the first side wall and a second side wall defining a side surface of the diffusion space.

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