Dehumidification module, storage cabinet and integrated cooker

Abstract

This invention discloses a dehumidification module, a storage cabinet, and an integrated stove. The dehumidification module includes a housing, a semiconductor refrigeration component, and a switching component. The housing has an inner cavity, and an air inlet is provided on one side of the housing. The semiconductor refrigeration component is connected to the housing and located in the inner cavity, with its cold end facing the air inlet. The switching component is connected to the housing and located in the inner cavity, and is used to open or close the air inlet. The dehumidification module is applied to the storage cabinet. During dehumidification, the switching component actuates to open the air inlet, allowing air inside the storage cabinet to contact the cold end of the semiconductor refrigeration component, thereby condensing water vapor in the air to achieve dehumidification and simultaneously lowering the temperature. When the air humidity inside the storage cabinet reaches a target threshold, the semiconductor refrigeration component stops, and the switching component actuates to close the air inlet. Condensate on the cold end evaporates without entering the interior of the storage cabinet, preventing the humidity inside the cabinet from rising rapidly over a long period, thus reducing energy consumption.

Description

Technical Field

[0001] This invention relates to the field of integrated stove technology, and in particular to a dehumidification module, a storage cabinet, and an integrated stove. Background Technology

[0002] An integrated cooktop is a kitchen appliance that combines multiple functions such as a range hood, gas stove, disinfection cabinet, and storage cabinet. It is also known in the industry as an eco-friendly cooktop or integrated eco-friendly cooktop. It boasts advantages such as space saving, excellent fume extraction, energy efficiency, and environmental friendliness. Utilizing a downdraft design, it eliminates the need for a traditional wall-mounted range hood, seamlessly integrating the cooktop and cabinetry. This allows for greater installation flexibility and provides more space for island-style and open-plan modern kitchens.

[0003] The storage cabinets of integrated stoves need to be dehumidified and moisture-proofed for storing dry food. Among the relevant technologies, the semiconductor dehumidification module used for moisture-proofing has a long dehumidification time and basically needs to be kept on all the time, resulting in high energy consumption. Therefore, it is not suitable for storing dry food in the storage cabinets of integrated stoves. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a dehumidification module that, while meeting dehumidification requirements, can reduce operating time and lower energy consumption.

[0005] The present invention also proposes a storage cabinet that utilizes the aforementioned dehumidification module.

[0006] The present invention also proposes an integrated stove having the above-mentioned storage cabinet.

[0007] A dehumidification module according to a first aspect of the present invention includes a housing, a semiconductor refrigeration component, and a switch component. The housing has an inner cavity, and an air inlet is provided on one side of the housing. The semiconductor refrigeration component is connected to the housing and located in the inner cavity, with the cold end of the semiconductor refrigeration component facing the air inlet. The switch component is connected to the housing and located in the inner cavity, and the switch component is used to open or close the air inlet.

[0008] The dehumidification module according to embodiments of the present invention has at least the following beneficial effects: When the dehumidification module is applied to a storage cabinet, and dehumidification is required inside the cabinet, the semiconductor cooling component is activated, and the switching component actuates to open the air inlet. Air inside the cabinet contacts the cold end of the semiconductor cooling component through the air inlet, thereby condensing water vapor in the air to achieve dehumidification and simultaneously lowering the temperature. When the air humidity inside the cabinet reaches the target threshold, the semiconductor cooling component stops, and the switching component actuates to close the air inlet. The cold end of the semiconductor cooling component is isolated from the air inside the cabinet, and the condensate on the cold end does not enter the interior of the cabinet when it evaporates, preventing the humidity inside the cabinet from rising rapidly over a long period. This satisfies dehumidification requirements while reducing energy consumption.

[0009] According to some embodiments of the first aspect of the present invention, the switch assembly includes a cover and a drive component, the cover being movably connected to the housing, and the drive component being used to drive the cover.

[0010] According to some embodiments of the first aspect of the present invention, the cover is rotatably connected to the housing, and the cover is provided with a vent hole matching the air inlet.

[0011] According to some embodiments of the first aspect of the present invention, the driving component includes a motor and a gear, the gear being connected to the output shaft of the motor, and the outer periphery of the cover is provided with teeth that mesh with the gear.

[0012] According to some embodiments of the first aspect of the present invention, the air inlet is configured as at least three fan-shaped holes, the at least three fan-shaped holes are circumferentially distributed, and the vent hole corresponds one-to-one with the fan-shaped holes.

[0013] According to some embodiments of the first aspect of the present invention, the housing is provided with a baffle located at the edge of the fan-shaped hole and passing through the vent hole.

[0014] According to some embodiments of the first aspect of the present invention, the housing is connected to a detachable face cover, the air inlet is disposed on the face cover, and the sealing member is connected to the face cover.

[0015] According to some embodiments of the first aspect of the present invention, the cold end of the semiconductor cooling assembly is provided with cooling fins extending toward the air inlet, the cooling fins being arranged vertically.

[0016] According to some embodiments of the first aspect of the present invention, the housing is provided with a mounting bracket located in the inner cavity, the semiconductor cooling assembly is connected to the mounting bracket, and the mounting bracket is provided with a water receiving groove located below the cooling fins.

[0017] According to some embodiments of the first aspect of the present invention, the mounting frame is provided with a vertically arranged partition, the mounting frame is connected to a water-absorbing component, the water-absorbing component and the water-receiving trough are respectively disposed on both sides of the partition, the partition is provided with a water-passing hole, and the water-absorbing component is connected to the water-receiving trough through the water-passing hole.

[0018] According to some embodiments of the first aspect of the present invention, the hot end of the semiconductor cooling component is provided with heat dissipation fins, the housing is connected to a fan, the fan blows air onto the heat dissipation fins, the housing is provided with an exhaust channel, and the water absorption element is arranged in the exhaust channel.

[0019] According to some embodiments of the first aspect of the present invention, the heat dissipation fins are arranged vertically, and the water absorption member is located directly below the heat dissipation fins.

[0020] According to some embodiments of the first aspect of the present invention, the partition is provided with a mounting hole, and a heat insulation element is connected to the outer periphery of the semiconductor cooling assembly, the heat insulation element being installed in the mounting hole.

[0021] According to a second aspect embodiment of the present invention, a storage cabinet includes a dehumidification module as described in the first aspect embodiment. The dehumidification module has a switching component capable of opening or closing the air inlet. During dehumidification, the air inlet is opened via the switching component, and the semiconductor cooling component operates. Air inside the storage cabinet comes into contact with the cold end of the semiconductor cooling component through the air inlet, thereby condensing the water vapor in the air to achieve dehumidification. After dehumidification is completed, the air inlet is closed via the switching component, isolating the cold end of the semiconductor cooling component from the air inside the storage cabinet. When the condensate on the cold end evaporates, it does not enter the interior of the storage cabinet, so that the humidity inside the storage cabinet does not rise rapidly over a long period of time, thus meeting the dehumidification requirements while reducing energy consumption.

[0022] The integrated stove according to a third aspect embodiment of the present invention includes a storage cabinet as described in the second aspect embodiment, and has all the technical effects of a storage cabinet, which will not be repeated here.

[0023] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] Additional aspects and advantages of the invention will become apparent and readily understood in conjunction with the following description of the embodiments, in which:

[0025] Figure 1 This is a schematic diagram of the structure of a dehumidification module according to some embodiments of the first aspect of the present invention;

[0026] Figure 2 for Figure 1 Front view sectional view of the dehumidification module;

[0027] Figure 3 for Figure 1 Top-view sectional view of the dehumidification module;

[0028] Figure 4 for Figure 1 Exploded view of the dehumidification module;

[0029] Figure 5 This is an exploded view of the switch assembly and the faceplate in some embodiments of the first aspect of the present invention;

[0030] Figure 6 This is a schematic diagram of the structure of the cover member closing the air inlet in some embodiments of the first aspect of the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of the cover opening the air inlet in some embodiments of the first aspect of the present invention;

[0032] Figure 8 This is a schematic diagram of the structure of the housing in some embodiments of the first aspect of the present invention. Figure 1 ;

[0033] Figure 9 This is a schematic diagram of the structure of a dehumidification module according to some embodiments of the first aspect of the present invention. Figure 2 ;

[0034] Figure 10 This is a cross-sectional view of a locker according to some embodiments of the second aspect of the present invention;

[0035] Figure 11 This is a schematic diagram of the structure of an integrated stove according to some embodiments of the third aspect of the present invention;

[0036] Figure 12 This is a schematic diagram of the structure of an integrated stove according to some other embodiments of the third aspect of the present invention.

[0037] The attached icons are numbered as follows:

[0038] Dehumidification module 100, housing 110, inner cavity 111, air inlet 112, shaft hole 113, baffle 114, air outlet 115, cover 120, motor cover 121, mounting bracket 130, water receiving tray 131, partition 132, water passage hole 133, mounting hole 134, water absorption component 140, fan 150;

[0039] Semiconductor cooling component 200, cooling fins 210, heat dissipation fins 220, heat insulation component 230;

[0040] Switch assembly 300, cover 310, rotating shaft 311, vent 312, gear 313, drive component 320, motor 321, gear 322;

[0041] Storage cabinet 400, storage cavity 401, cabinet body 410, cabinet door 420;

[0042] Integrated stove 500. Detailed Implementation

[0043] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0044] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0045] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0046] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0047] An integrated cooktop, also known as an eco-friendly cooktop or integrated eco-friendly cooktop, is a kitchen appliance that combines multiple functions such as a range hood, gas stove, disinfection cabinet, and storage cabinet. It has advantages such as saving space, energy saving, low consumption and environmental protection. It also features high oil fume absorption rate, quiet operation and intuitive display, saving space, cost and manual operation procedures.

[0048] It is understandable that integrated cooktops have storage cabinets for storing items. In daily life, some users store dry food in the storage cabinets. Since dry food is prone to mold and spoilage in a humid environment, the storage cabinets need to be dehumidified and moisture-proof to meet the needs of storing dry food for a long time.

[0049] In related technologies, dehumidification and moisture prevention usually use semiconductor dehumidification modules, which basically need to be turned on all the time. They have long dehumidification time and high energy consumption, and are not suitable for the storage cabinets of integrated stoves, so they need to be improved.

[0050] Reference Figure 1 The first aspect of this invention provides a dehumidification module 100, such as... Figure 10 As shown, the dehumidification module 100 is installed on the inner wall of the storage cabinet 400. The storage cabinet 400 includes a cabinet body 410 and a cabinet door 420. The cabinet door 420 is movably connected to the front end of the cabinet body 410. The interior of the cabinet body 410 forms a storage cavity 401 for storing items. The storage cavity 401 can be sealed to prevent moisture from entering. The storage cabinet 400 is opened through the cabinet door 420 to retrieve and place items. The dehumidification module 100 is typically located on the upper part of the rear side wall to avoid affecting the items stored in the storage cabinet 400. The storage cabinet 400 uses the dehumidification module 100 to remove moisture from the internal air, reducing air humidity, facilitating the storage of dry food and extending shelf life.

[0051] Reference Figure 1 and Figure 2 The dehumidification module 100 has a housing 110, which is basically an airtight structure to prevent internal condensate from evaporating and entering the interior of the storage cabinet 400. The housing 110 is usually made of injection molding, and an inner cavity 111 is formed inside the housing 110. The inner cavity 111 is used to install components such as the semiconductor cooling component 200.

[0052] Understandably, the semiconductor cooling component 200 is a type of heat pump. Its advantages include the absence of sliding parts, making it suitable for applications where space is limited, reliability is critical, and refrigerant contamination is undesirable. The semiconductor cooling component 200 utilizes the Peltier effect of semiconductor materials. When direct current passes through a thermocouple composed of two different semiconductor materials connected in series, heat is absorbed and released at the two ends of the thermocouple, respectively. Heat is transferred from one end of the thermocouple to the other, creating a temperature difference that forms a cold and hot junction, thus achieving the purpose of cooling.

[0053] Reference Figures 2 to 4 The inner cavity 111 of the housing 110 is provided with a semiconductor cooling component 200 and a switch component 300. An air inlet 112 is provided on the side of the housing 110 facing the center of the storage cavity 401 of the storage cabinet 400. The air inlet 112 serves as a channel for air in the storage cavity 401 to enter the inner cavity 111 of the housing 110 and contact the semiconductor cooling component 200. The cold end of the semiconductor cooling component 200 is arranged near the air inlet 112. When the air in the storage cavity 401 enters the inner cavity 111 and contacts the cold end of the semiconductor cooling component 200, the water vapor in the air is cooled and condensed into water droplets, thereby achieving the purpose of dehumidification.

[0054] The switch assembly 300 has the function of opening or closing the air inlet 112. When dehumidification is required, the switch assembly 300 is operated to open the air inlet 112 for dehumidification. After dehumidification is completed, the switch assembly 300 is operated to open the air inlet 112 to isolate the dehumidification module 100 from the storage cabinet 400.

[0055] During use, the workflow is as follows: When the air in the storage cavity 401 of the storage cabinet 400 needs to be dehumidified, the semiconductor cooling component 200 is activated, and at the same time, the operating switch component 300 is used to open the air inlet 112. The air in the storage cavity 401 enters the inner cavity 111 through the air inlet 112 and comes into contact with the cold end of the semiconductor cooling component 200. Since the cold end of the semiconductor cooling component 200 has a low temperature, the water vapor in the air is condensed into water droplets to achieve dehumidification, reducing the humidity and temperature of the air in the storage cavity 401. Low-temperature and dry air is beneficial for storing dry food and prevents mold growth. When the air humidity in the storage chamber 401 drops to the target threshold, i.e., dehumidification ends, the semiconductor refrigeration component 200 stops, and the operation switch component 300 closes the air inlet 112. The dehumidification module 100 is isolated from the storage cabinet 400. The water condensed on the cold end of the semiconductor refrigeration component 200 will not evaporate and enter the storage chamber 401, so that the humidity in the storage chamber 401 will not rise rapidly over a long period of time, meeting the needs of storing dry food for a long time. The dehumidification module 100 does not need to be turned on for a long time, reducing energy consumption.

[0056] Understandably, in order to close and open the air inlet 112, the switch assembly 300 employs a cover 310, which is connected to the housing 110 and can move relative to it. That is, the cover 310 has at least two states: a first state in which the air inlet 112 is closed and a second state in which the air inlet 112 is open. The switch assembly 300 also has a drive member 320 for driving the cover 310, which drives the cover 310 to switch between at least two states.

[0057] It is understood that the cover 310 can be rotated relative to close and open the air inlet 112, or it can be moved relative to close and open the air inlet 112.

[0058] Reference Figure 5 It is understood that the cover 310 is provided with a rotating shaft 311, and the housing 110 is provided with a shaft hole 113 that mates with the rotating shaft 311. The rotating shaft 311 passes through the shaft hole 113, allowing the cover 310 to rotate relative to the housing 110. A vent hole 312 is provided on the cover 310. When the cover 310 is rotated, the vent hole 312 is aligned with the air inlet 112, thus opening the air inlet 112; when the vent hole 312 is misaligned with the air inlet 112, the air inlet 112 is closed.

[0059] Of course, the rotating shaft 311 can also be set in the housing 110, the cover 310 can be provided with the shaft hole 113, or the rotating shaft 311 can be an independent component.

[0060] It is understandable that the housing 110 may also have a receiving groove, and the cover 310 may be installed in the receiving groove and be able to rotate. For example, the receiving groove may be circular, and the cover 310 may also be circular, and the two may work together to achieve rotation.

[0061] Reference Figure 5 Understandably, in order to drive the cover 310 to rotate, the drive component 320 uses a motor 321. A gear 322 is mounted on the output shaft of the motor 321, and a toothed portion 313 is provided on the outer periphery of the cover 310. The gear 322 meshes with the toothed portion 313. The motor 321 drives the gear 322 to rotate, and the gear 322 drives the cover 310 through the toothed portion 313 to open or close the air inlet 112.

[0062] It is understandable that the cover 310 is circular, the rotating shaft 311 is located at the center of the cover 310, and a ring of teeth 313 is provided on the outer periphery of the cover 310. The cover 310 is similar to a large gear. Due to the large diameter and numerous teeth of the cover 310, the gear 322 drives the cover 310 to reduce speed. The low rotational speed of the cover 310 is beneficial for accurately controlling the opening or closing of the air inlet 112.

[0063] Of course, it is also possible to provide a toothed section 313 only on the outer periphery of the cover 310, such as one-third or one-quarter of the outer periphery of the cover 310, which can also satisfy the requirement that the gear 322 drives the cover 310 to rotate through the toothed section 313.

[0064] Alternatively, the cover 310 can be directly driven to rotate by the motor 321, with the output shaft of the motor 321 fixedly connected to the cover 310. The cover 310 opens or closes the air inlet 112 as it rotates with the output shaft of the motor 321.

[0065] Reference Figure 4 and Figure 5 It is understandable that the air inlet 112 uses at least three fan-shaped holes, preferably six, and will be used as an example. The six fan-shaped holes are evenly distributed circumferentially. The cover 310 also has six vent holes 312, each corresponding to a fan-shaped hole. The vent holes 312 can be the same size as the fan-shaped holes, or they can be slightly larger. Figure 6 As shown, when the vent 312 is aligned with the fan-shaped hole, air in the storage cavity 401 can enter the inner cavity 111 of the dehumidification module 100 through the fan-shaped hole. Conversely, when the vent 312 is misaligned with the fan-shaped hole, air in the storage cavity 401 cannot enter the inner cavity 111 of the dehumidification module 100. Using six fan-shaped holes, the cover 310 can be rotated a maximum of 60° to open or close the air inlet 112, resulting in a short stroke and fast response.

[0066] Of course, the air inlet 112 can also be made of other shapes, such as round holes, oval holes, etc. The air inlet 112 can also be opened or closed by rotating the cover 310.

[0067] Reference Figures 5 to 7 It is understandable that the housing 110 is also provided with a baffle 114, which is inserted into the vent 312 and used to limit the rotation angle of the cover 310. Considering the correspondence between the vent 312 and the fan-shaped hole, the baffle is set at the edge of the fan-shaped hole so that the vent 312 can be aligned with the fan-shaped hole for easy control.

[0068] It is understandable that the housing 110 may be provided with a positioning pin, and the cover 310 may be provided with an arc-shaped positioning groove, with the positioning pin passing through the positioning groove, thereby limiting the rotation angle of the cover 310.

[0069] Reference Figure 4 and Figure 5 It is understood that a face cover 120 is installed on the housing 110. The face cover 120 is a detachable structure, the air inlet 112 is located on the face cover 120, and the sealing member 310 is installed on the face cover 120. By removing the face cover 120, it is convenient to inspect and maintain the conductor cooling assembly 200.

[0070] It is understood that the face cover 120 is connected to a detachable motor cover 121, and a space for installing the drive component 320 is formed between the motor cover 121 and the housing 110. Removing the motor cover 121 facilitates the inspection and maintenance of the drive component 320.

[0071] Reference Figures 2 to 4 It is understandable that the semiconductor cooling component 200 has cooling fins 210 at the cold end. Typically, the cooling fins 210 are made of aluminum alloy or copper alloy. The cooling fins 210 have a low temperature and a large surface area, which helps to accelerate the condensation of water vapor. The cooling fins 210 are located near the air inlet 112 and extend towards it. Air in the storage cavity 401 can come into contact with the cooling fins 210 by passing through the air inlet 112.

[0072] Reference Figure 8 It is understood that a mounting bracket 130 is provided inside the housing 110, located in the inner cavity 111. The semiconductor cooling component 200 is mounted on the mounting bracket 130. The mounting bracket 130 is provided with a water receiving tank 131, which is arranged below the cooling fins 210. The water receiving tank 131 is used to collect the condensate flowing down from the cooling fins 210, preventing the condensate from contacting the motor 321. To facilitate the flow of condensate, the cooling fins 210 are set vertically, and the condensate automatically flows to the water receiving tank 131 under the action of gravity.

[0073] Reference Figure 8 and Figure 9 It is understandable that, considering the limited capacity of the water tank 131, such as Figure 4 As shown, a water-absorbing component 140 for absorbing condensate is installed on the mounting bracket 130. The mounting bracket 130 has a vertically arranged partition 132 in the middle. The partition separates the inner cavity 111, separating the space where the cold end and the hot end of the semiconductor cooling component 200 are located, preventing heat from the hot end from flowing to the cold end.

[0074] Reference Figure 8 It is understandable that the partition 132 is provided with mounting holes 134 for mounting the semiconductor cooling component 200. A heat insulation component 230 is connected in the mounting holes 134. The heat insulation component 230 surrounds the semiconductor cooling component 200. By utilizing the heat insulation of the heat insulation component 230, heat transfer is reduced, and the efficiency of the semiconductor cooling component 200 is higher.

[0075] It is understandable that, such as Figure 2 As shown, the water-absorbing component 140 is located on one side of the partition 132, and the water-receiving tank 131 is located on the other side of the partition 132, as... Figure 8 and Figure 9 As shown, a water passage hole 133 is provided on the partition plate 132 to guide the water in the water receiving tank 131 to the water suction member 140. The water suction member 140 is positioned low, utilizing the gravity of the water for gravity flow. Moreover, the water suction member 140 is located on the side where the hot end of the semiconductor cooling component 200 is located, which is conducive to the evaporation of condensate.

[0076] Reference Figures 2 to 4 It is understood that the housing 110 is connected to a fan 150 to help dissipate heat from the hot end of the semiconductor cooling component 200, and the hot end of the semiconductor cooling component 200 is provided with heat dissipation fins 220 facing the fan 150. The airflow from the fan 150 flows over the heat dissipation fins 220, carrying away heat and helping to dissipate heat. In addition, an exhaust channel is formed inside the housing 110 to exhaust the hot air that has blown over the heat dissipation fins 220. The exhaust outlet 115 of the exhaust channel and the fan 150 are located on the same side of the housing 110.

[0077] Understandably, the absorbent component 140 uses absorbent cotton and is placed in the exhaust duct. Hot air is used to accelerate the evaporation of condensate in the absorbent component 140 and remove moisture. The absorbent component 140 occupies one-third to one-half of the cross-sectional area of ​​the exhaust duct, maximizing the evaporation of condensate while meeting exhaust requirements.

[0078] It is understandable that, such as Figure 2 and Figure 3As shown, the water-absorbing component 140 is arranged directly below the heat dissipation fins 220, which are arranged vertically. The airflow blown out by the fan 150 passes through the heat dissipation fins 220, then flows downwards, and then contacts the water-absorbing component 140. The large airflow and high temperature help the condensate in the water-absorbing component 140 to evaporate.

[0079] Reference Figure 10 A second aspect of the present invention provides a storage cabinet 400, which is connected to a dehumidification module 100 from the first aspect embodiment. The dehumidification module 100 is located on the rear inner wall of the storage cavity 401. The dehumidification module 100 is provided with an air inlet 112 to communicate with the storage cavity 401. The dehumidification module 100 includes a semiconductor cooling component 200, a switch component 300, and a fan 150. The switch component 300 can open or close the air inlet 112. The cold end of the semiconductor cooling component 200 faces the air inlet 112, and the fan 150 blows air onto the cold end of the semiconductor cooling component 200 to aid in heat dissipation. The storage cabinet 400 has a 12V power supply, which powers the dehumidification module 100. The use of a low-voltage power supply makes it safer and more reliable.

[0080] During dehumidification, the air inlet 112 is opened via the switch assembly 300, and the semiconductor cooling assembly 200 operates. Air inside the cabinet comes into contact with the cold end of the semiconductor cooling assembly 200 through the air inlet 112, condensing moisture in the air to achieve dehumidification. After dehumidification, the air inlet 112 is closed via the switch assembly 300, isolating the cold end of the semiconductor cooling assembly 200 from the air inside the cabinet. Condensate on the cold end evaporates without entering the cabinet's interior, preventing a rapid increase in humidity over a long period. This satisfies dehumidification requirements while reducing energy consumption. The rear of the cabinet 400 has an air inlet corresponding to the fan 150 and an exhaust outlet corresponding to the air outlet 115. All hot air flowing through the hot end of the semiconductor cooling assembly 200 is exhausted outside the cabinet 400, without affecting the air inside the storage cavity 401.

[0081] According to a third aspect embodiment of the present invention, the integrated stove 500 includes the storage cabinet 400 of the second aspect embodiment, such as... Figure 11 As shown, the storage cabinet 400 is arranged vertically within the integrated stove 500, or as... Figure 12 As shown, the storage cabinet 400 is arranged horizontally in the integrated stove 500. The integrated stove 500 has all the technical effects of the storage cabinet 400, which will not be described in detail here.

[0082] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A dehumidification module for a storage cabinet, characterized in that, include: The housing has an inner cavity, and an air inlet is provided on one side of the housing. The housing is provided with a mounting bracket located in the inner cavity. The mounting bracket is provided with a water receiving groove and a vertically arranged partition. The mounting bracket is connected to a water suction component. The water suction component and the water receiving groove are respectively located on both sides of the partition. The partition is provided with a water passage hole. The water suction component is connected to the water receiving groove through the water passage hole. A semiconductor cooling assembly is connected to the mounting bracket and located in the inner cavity. The cold end of the semiconductor cooling assembly faces the air inlet. The cold end of the semiconductor cooling assembly is provided with cooling fins extending toward the air inlet. The water receiving tank is located below the cooling fins. A switch assembly, connected to the housing and located in the inner cavity, is used to open the air inlet or close the air inlet when the air humidity inside the storage cabinet reaches a target threshold.

2. The dehumidification module according to claim 1, characterized in that, The switch assembly includes a cover and a drive component. The cover is movably connected to the housing, and the drive component is used to drive the cover.

3. The dehumidification module according to claim 2, characterized in that, The cover is rotatably connected to the housing, and the cover is provided with a vent hole that matches the air inlet.

4. The dehumidification module according to claim 3, characterized in that, The driving component includes a motor and a gear. The gear is connected to the output shaft of the motor, and the outer periphery of the cover is provided with teeth that mesh with the gear.

5. The dehumidification module according to claim 4, characterized in that, The air inlet is configured with at least three fan-shaped holes, which are circumferentially distributed, and the vent holes correspond one-to-one with the fan-shaped holes.

6. The dehumidification module according to claim 5, characterized in that, The housing is provided with a baffle, which is located at the edge of the fan-shaped hole and passes through the vent hole.

7. The dehumidification module according to claim 4, characterized in that, The housing is connected to a detachable face cover, the air inlet is disposed on the face cover, and the sealing member is connected to the face cover.

8. The dehumidification module according to claim 1, characterized in that, The hot end of the semiconductor cooling component is provided with heat dissipation fins, the housing is connected to a fan, the fan blows air onto the heat dissipation fins, the housing is provided with an exhaust channel, and the water absorption component is arranged in the exhaust channel.

9. The dehumidification module according to claim 8, characterized in that, The heat dissipation fins are arranged vertically, and the water absorption element is located directly below the heat dissipation fins.

10. The dehumidification module according to claim 1, characterized in that, The partition is provided with mounting holes, and a heat insulation component is connected to the outer periphery of the semiconductor cooling component, the heat insulation component being installed in the mounting holes.

11. A locker, characterized in that, It includes a dehumidification module as described in any one of claims 1 to 10.

12. An integrated stove, characterized in that, Includes the locker as described in claim 11.

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