Display substrate, preparation method thereof and display device

Abstract

The application provides a display substrate, a preparation method thereof and a display device. The display substrate comprises a substrate, an encapsulation layer, a light filtering layer and an optical film layer. The encapsulation layer is located on the substrate, the light filtering layer is located in the encapsulation layer, and the light filtering layer comprises a black matrix. The black matrix comprises a black matrix opening. The optical film layer is located on a side of the encapsulation layer away from the substrate. The optical film layer is configured to partially transmit and partially absorb incident light. The light transmittance of the optical film layer is greater than that of the black matrix. The optical film layer comprises an optical film layer opening. The projection of the optical film layer opening on the substrate is located within the projection of the black matrix opening on the substrate. The technical scheme provided by the embodiment of the application can improve the dark state color separation phenomenon.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display substrate, its preparation method, and a display device. Background Technology

[0002] Among related technologies, organic light-emitting diodes (OLEDs) are active light-emitting devices with advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, and extremely high response speed. Therefore, they are widely used in display panels.

[0003] OLED display panels typically achieve a "black" effect when the screen is off by laminating polarizers to reduce ambient light reflectivity. To achieve greater integration and reduce the thickness of the display panel, a color filter and black matrix structure are formed directly on the thin-film encapsulation layer to replace the polarizer, i.e., a COE (Color Film On Encapsulation) structure.

[0004] However, when reflected ambient light encounters the gap between two adjacent black matrices, diffraction occurs, leading to a phenomenon on the display panel where bright spots are surrounded by colored halos, resulting in dark-state color separation. Improving dark-state color separation is a technical problem that needs to be solved. Summary of the Invention

[0005] This invention provides a display substrate, a method for preparing the same, and a display device.

[0006] According to a first aspect of the present invention, a display substrate is provided, comprising:

[0007] Substrate;

[0008] A pixel defining layer is located on the substrate; the pixel defining layer includes a pixel defining layer opening.

[0009] An encapsulation layer is located on the side of the pixel defining layer away from the substrate; the encapsulation layer includes a first inorganic encapsulation layer, which is located on the side of the pixel defining layer away from the substrate.

[0010] A filter layer is located within the encapsulation layer and on the side of the first inorganic encapsulation layer away from the substrate. The filter layer includes a color filter layer, which includes a first surface and a second surface. The first surface and the second surface are located on the side of the color filter layer facing the first inorganic encapsulation layer. The projection of the first surface on the substrate is located within the projection of the pixel defining layer opening on the substrate. The projection of the second surface on the substrate is located within the projection of the pixel defining layer on the substrate. The second surface is substantially parallel to at least a portion of the side surface of the pixel defining layer.

[0011] In one embodiment, the filter layer further includes a black matrix located on the side of the color filter layer away from the first inorganic encapsulation layer.

[0012] In one embodiment, the black matrix includes black matrix openings, and at least a portion of the black matrix openings are enlarged in the direction in which the black matrix points toward the substrate.

[0013] In one embodiment, the encapsulation layer further includes an organic encapsulation layer and a second inorganic encapsulation layer; the organic encapsulation layer is located on the side of the filter layer away from the first inorganic encapsulation layer, and the second inorganic encapsulation layer is located on the side of the organic encapsulation layer away from the first inorganic encapsulation layer.

[0014] In one embodiment, the encapsulation layer further includes an organic planarization layer located between the filter layer and the organic encapsulation layer.

[0015] In one embodiment, the thickness of the organic encapsulation layer is 2.0 to 12.0 micrometers, and the thickness of the organic planarization layer is 0.1 to 50.0 micrometers.

[0016] In one embodiment, the display substrate further includes a support pillar located on the side of the pixel defining layer away from the substrate, with at least a portion of the support pillar's projection on the substrate located within the projection of the pixel defining layer on the substrate, and the first inorganic encapsulation layer located on the side of the support pillar away from the substrate.

[0017] The color filter layer also includes a third surface that is substantially parallel to at least a portion of the side surface of the support column.

[0018] In one embodiment, the slope angle of the third surface is greater than that of the second surface.

[0019] In one embodiment, the projection of the interface between the color filter layer and the black matrix on the substrate falls within the projection of the support pillar on the substrate.

[0020] In one embodiment, the distance from the surface of the black matrix away from the substrate to the surface of the substrate facing the filter layer is greater than the distance from the surface of the color filter layer away from the substrate to the surface of the substrate facing the filter layer.

[0021] According to a second aspect of the present invention, a display substrate is provided, comprising:

[0022] Substrate;

[0023] The encapsulation layer is located on the substrate.

[0024] A color filter layer is located on the substrate of the encapsulation layer, and the color filter layer includes a black matrix; the black matrix includes black matrix openings;

[0025] An optical film layer is located on the side of the color filter layer encapsulation layer away from the substrate. The optical film layer is configured to partially transmit and partially absorb incident light. The transmittance of the optical film layer is greater than the transmittance of the black matrix. The optical film layer includes an optical film layer opening. The projection of the optical film layer opening on the substrate is located within the projection of the black matrix opening on the substrate.

[0026] In one embodiment, the transmittance of the optical film is 30% to 80%; the transmittance of the black matrix is ​​close to zero.

[0027] In one embodiment, the optical film is a black optical film.

[0028] In one embodiment, the filter layer further includes a color filter layer, wherein the projection of the black matrix opening on the substrate is located within the projection of the color filter layer on the substrate.

[0029] In one embodiment, the optical film is a colored optical film, and the optical film with an overlapping projection area on the substrate has the same color as the colored filter layer.

[0030] In one embodiment, the surface of the black matrix facing the optical film is uneven.

[0031] In one embodiment, the display substrate further includes a light-emitting layer and a pixel-defining layer, the pixel-defining layer being located between the substrate and the encapsulation layer, and the pixel-defining layer including a pixel-defining layer opening;

[0032] The light-emitting layer is located between the substrate and the encapsulation layer. The light-emitting layer includes a sub-pixel. The sub-pixel includes a first electrode and an organic light-emitting layer. The organic light-emitting layer is located on the side of the first electrode closer to the encapsulation layer.

[0033] The pixel defining layer is located on the side of the first electrode near the encapsulation layer; the projection of the organic light-emitting layer on the substrate is located within the projection of the pixel defining layer opening on the substrate, and the projection of the bottom surface of the pixel defining layer opening near the first electrode on the substrate is located within the projection of the optical film layer opening on the substrate.

[0034] In one embodiment, when the filter layer further includes a color filter layer, the distance between the bottom surface of the black matrix near the pixel defining layer and the surface of the substrate facing the light-emitting layer is greater than the distance between the bottom surface of the color filter layer near the light-emitting layer and the surface of the substrate facing the light-emitting layer.

[0035] In one embodiment, the projection of the organic light-emitting layer on the substrate is located within the projection of the first electrode on the substrate;

[0036] There is a gap between the organic light-emitting layers in two adjacent sub-pixels with the same emission color; there is a gap between adjacent color filter layers with the same color.

[0037] In one embodiment, the projection of the black matrix on the substrate is located within the projection of the pixel defining layer on the substrate, or the projection of the pixel defining layer on the substrate is located within the projection of the black matrix on the substrate.

[0038] In one embodiment, the display substrate further includes a support pillar located between the pixel defining layer and the encapsulation layer, wherein the projection of the support pillar on the substrate is within the projection of the pixel defining layer on the substrate.

[0039] In one embodiment, when the filter layer further includes a color filter layer, the distance between the bottom surface of the black matrix near the pixel defining layer and the surface of the substrate facing the light-emitting layer is greater than the distance between the surface of the color filter layer near the light-emitting layer and the surface of the substrate facing the light-emitting layer.

[0040] In one embodiment, when the filter layer further includes a color filter layer, the projection of the bottom surface of the pixel defining layer opening near the first electrode onto the substrate is located within the projection of the color filter layer onto the substrate.

[0041] In one embodiment, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic encapsulation layer is located on the light-emitting layer, the organic encapsulation layer is located on the side of the first inorganic encapsulation layer away from the light-emitting layer, and the second inorganic encapsulation layer is located on the side of the organic encapsulation layer away from the light-emitting layer.

[0042] The filter layer is located between the first inorganic encapsulation layer and the organic encapsulation layer, or the filter layer is located between the organic encapsulation layer and the second inorganic encapsulation layer.

[0043] In one embodiment, the projection of the organic encapsulation layer on the substrate is located within the projection of the first inorganic encapsulation layer on the substrate, and is also located within the projection of the second inorganic encapsulation layer on the substrate.

[0044] In one embodiment, the display substrate further includes a protective layer located on the side of the optical film layer away from the encapsulation layer.

[0045] In one embodiment, the optical film is a black optical film.

[0046] In one embodiment, the optical film layer comprises at least one of a ferrous metal, a ferrous organic material, and a ferrous inorganic material.

[0047] In one embodiment, when the optical film comprises the ferrous metal, the optical film comprises molybdenum oxide.

[0048] In one embodiment, the optical film is doped with thallium.

[0049] In one embodiment, the thickness of the optical film is 10–55 nanometers.

[0050] In one embodiment, the optical film layer includes scattering particles.

[0051] In one embodiment, the scattering particles are made of zirconium oxide, and the radius of the scattering particles is less than or equal to 100 nanometers; or,

[0052] The scattering particles are made of titanium dioxide, and the radius of the scattering particles is less than or equal to 200 nanometers.

[0053] In one embodiment, the concentration of the scattering particles is less than or equal to 30%.

[0054] In one embodiment, the optical film layer comprises at least one of organic and inorganic pigments.

[0055] In one embodiment, the thickness of the optical film is 0.5 to 5.0 micrometers.

[0056] According to a third aspect of the present invention, a display device is provided, comprising: a display module and the display substrate described above.

[0057] As can be seen from the above embodiments, since the optical film layer is located on the side of the encapsulation layer away from the substrate, and the optical film layer partially transmits incident light, the transmittance of the optical film layer is greater than that of the black matrix. Therefore, when light incident from the black matrix side encounters the opening of the optical film layer, no diffraction phenomenon will occur. Furthermore, since the projection of the opening of the optical film layer on the substrate is located within the projection of the opening of the black matrix on the substrate, the optical film layer partially absorbs the incident light. Therefore, if light incident from the substrate side encounters the opening of the black matrix and diffracts, some of the diffracted light will be incident on the optical film layer, and the energy of the diffracted light incident on the optical film layer will be partially absorbed by the optical film layer. Thus, the diffracted light generated at the opening of the black matrix is ​​weakened, thereby improving the dark-state color separation phenomenon.

[0058] Moreover, since the filter layer is located in the encapsulation layer, the distance between the organic light-emitting layer and the filter layer can be shortened, thereby increasing the viewing angle and improving L-decay (brightness decay).

[0059] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description

[0060] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0061] Figure 1 This is an electron microscope image of a display substrate according to an embodiment of the present invention.

[0062] Figure 2 This is a schematic diagram of the structure of a display substrate according to an embodiment of the present invention.

[0063] Figure 3 This is a schematic diagram of another display substrate structure according to an embodiment of the present invention.

[0064] Figure 4 This is a schematic diagram of another display substrate structure according to an embodiment of the present invention.

[0065] Figure 5 This is a schematic diagram of another display substrate structure according to an embodiment of the present invention.

[0066] Figure 6 This is a schematic diagram of another display substrate structure according to an embodiment of the present invention.

[0067] Figure 7 This is a schematic diagram of another display substrate structure according to an embodiment of the present invention.

[0068] Figure 8 This is a schematic flowchart illustrating a method for fabricating a display substrate according to an embodiment of the present invention.

[0069] Figures 9-12 This is a schematic diagram of an intermediate structure generated during the fabrication process of a display substrate, as shown in an embodiment of the present invention. Detailed Implementation

[0070] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0071] This invention provides a display substrate. The display substrate, such as... Figure 1 As shown, it includes: a substrate 11, a driving circuit layer 14, a light-emitting layer 15, a pixel defining layer 16, a support pillar 41, an encapsulation layer, and a filter layer.

[0072] In this embodiment, as Figure 1 As shown, the driving circuit layer 14 is located on the substrate 11. The pixel defining layer 16 is located on the substrate 11, and the pixel defining layer 16 includes a pixel defining layer opening.

[0073] In this embodiment, as Figure 1 As shown, the light-emitting layer 15 is located on the side of the driving circuit layer 14 away from the substrate 11. The light-emitting layer 15 may include pixel units arranged in an array, and each pixel unit may include at least one sub-pixel. In this embodiment, each pixel unit may include three sub-pixels. In this embodiment, each pixel unit may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel arranged in sequence. The red sub-pixel is used to emit red light, the green sub-pixel is used to emit green light, and the blue sub-pixel is used to emit blue light.

[0074] In this embodiment, each sub-pixel can be an OLED (Organic Light-Emitting Diode) sub-pixel. Each sub-pixel may include a first electrode, an organic light-emitting layer, and a second electrode. The first electrode may be an anode, electrically connected to the pixel circuit, and the second electrode may be a cathode. The first electrode is located on the side of the driving circuit layer 14 away from the substrate 11, the organic light-emitting layer is located on the side of the first electrode close to the encapsulation layer, and the second electrode is located on the side of the organic light-emitting layer close to the encapsulation layer. The organic light-emitting layer is located in the opening of the pixel defining layer, and the projection of the organic light-emitting layer on the substrate 11 may be located within the projection of the first electrode on the substrate 11. The second electrode may be a surface electrode, shared by all sub-pixels, but is not limited to this. The second electrode may be a transparent conductive material; for example, the second electrode may include at least one of metal or ITO (indium tin oxide).

[0075] In this embodiment, the red sub-pixel includes a first organic light-emitting layer 151 for emitting red light, the green sub-pixel includes a second organic light-emitting layer 152 for emitting green light, and the blue sub-pixel includes a third organic light-emitting layer 153 for emitting blue light. The organic light-emitting layer can be the first organic light-emitting layer 151, the second organic light-emitting layer 152, or the third organic light-emitting layer 153.

[0076] In this embodiment, as Figure 1 As shown, the support pillar 41 is located on the side of the pixel defining layer 16 away from the substrate 11, and at least a portion of the projection of the support pillar 41 onto the substrate 11 lies within the projection of the pixel defining layer 16 onto the substrate 11. The support pillar 41 is used to support the fine metal mask (FMM) used during the deposition of the organic light-emitting layer, which helps to ensure uniform stress on the fine metal mask, reduces the deformation of the openings on the fine metal mask, decreases the possibility of organic light-emitting layer filling misalignment, and thus helps to control the shape and coverage of the organic light-emitting layer, thereby improving yield.

[0077] In this embodiment, the encapsulation layer is located on the side of the pixel defining layer 16 away from the substrate 11. The filter layer is located within the encapsulation layer. This shortens the distance between the organic light-emitting layer and the filter layer, thereby increasing the viewing angle and improving L-decay (luminance attenuation).

[0078] In this embodiment, as Figure 1 As shown, the encapsulation layer includes a first inorganic encapsulation layer 171, an organic planarization layer 42, an organic encapsulation layer 172, and a second inorganic encapsulation layer. The filter layer includes a black matrix 131 and a color filter layer. The color filter layer includes a red filter layer 132, a green filter layer 133, and a blue filter layer 134. Figure 1 Only one of the red filter layer 132, green filter layer 133, and blue filter layer 134 is shown in the image.

[0079] In this embodiment, as Figure 1 As shown, the first inorganic encapsulation layer 171 is located on the side of the support pillar 41 away from the substrate 11, the filter layer is located on the side of the first inorganic encapsulation layer 171 away from the substrate, the organic planarization layer 42 is located between the filter layer and the organic encapsulation layer 172, the organic encapsulation layer 172 is located on the side of the first inorganic encapsulation layer 171 away from the substrate 11, and the second inorganic encapsulation layer 173 is located on the side of the organic encapsulation layer 172 away from the substrate 11.

[0080] In this embodiment, the organic planarization layer 42 serves to planarize the layers, alleviate stress between the first inorganic encapsulation layer 171 and the second inorganic encapsulation layer 173, and protect the filter layer. The thickness of the organic planarization layer 42 can be from 0.1 to 50.0 micrometers; for example, the thickness can be 0.1 micrometer, 3.0 micrometer, 10 micrometer, 20 micrometer, 30 micrometer, 40 micrometer, or 50.0 micrometers. Preferably, the thickness of the organic planarization layer 42 is 3.0 micrometers.

[0081] In this embodiment, the organic encapsulation layer 172 is used to alleviate stress between the first inorganic encapsulation layer 171 and the second inorganic encapsulation layer 173. The thickness of the organic encapsulation layer 172 can be 2.0 to 12.0 micrometers. For example, the thickness of the organic encapsulation layer 172 can be 2.0 micrometers, 6.0 micrometers, 8.0 micrometers, 10.0 micrometers, or 12.0 micrometers. In this embodiment, the thickness of the organic planarization layer 42 can be less than the thickness of the organic encapsulation layer 172.

[0082] In this embodiment, as Figure 1 As shown, the color filter layer includes a first surface F1, a second surface F2, and a third surface F3. The first surface F1, the second surface F2, and the third surface F3 are located on the side of the color filter layer facing the first inorganic encapsulation layer 171. The projection of the first surface F1 onto the substrate 11 lies within the projection of the pixel defining layer opening onto the substrate 11. The projection of the second surface F2 onto the substrate 11 lies within the projection of the pixel defining layer 16 onto the substrate 11. The second surface F2 is substantially parallel to at least a portion of the side surface of the pixel defining layer 16. The third surface F3 is substantially parallel to at least a portion of the side surface of the support pillars 41.

[0083] In this embodiment, as Figure 1 As shown, the slope angle of the third surface F3 is greater than that of the second surface F2. The slope angle of the second surface F2 can be the acute angle between the second surface F2 and the surface of the substrate 11 facing the color filter layer, and the slope angle of the third surface F3 can be the acute angle between the third surface F3 and the surface of the substrate 11 facing the color filter layer.

[0084] In this embodiment, as Figure 1As shown, the black matrix 131 is located on the side of the color filter layer away from the first inorganic encapsulation layer 171. The distance from the surface of the black matrix 131 away from the substrate 11 to the surface of the substrate 11 facing the filter layer is greater than the distance from the surface of the color filter layer away from the substrate 11 to the surface of the substrate 11 facing the filter layer. The distance from the surface of the black matrix 131 facing the substrate 11 to the surface of the substrate 11 facing the filter layer is greater than the distance from the surface of the color filter layer facing the substrate 11 to the surface of the substrate 11 facing the filter layer.

[0085] In this embodiment, as Figure 1 As shown, the projection of the interface between the color filter layer and the black matrix 131 on the substrate 11 falls within the projection of the support pillar 41 on the substrate 11.

[0086] In this embodiment, as Figure 1 As shown, the black matrix 131 includes black matrix openings. In the direction Y from the black matrix 131 to the substrate 11, at least a portion of the black matrix openings are larger in size, for example, a portion of the black matrix openings are larger in size, or all of the black matrix openings are larger in size.

[0087] This invention provides a display substrate. The display substrate, such as... Figure 2 As shown, it includes: a substrate 11, an encapsulation layer 17, a filter layer, and an optical film layer 12.

[0088] In this embodiment, as Figure 2 As shown, the encapsulation layer 17 is located on the substrate 11, and the filter layer is located in the encapsulation layer 17. The filter layer includes a black matrix 131. The black matrix 131 includes black matrix openings 1311.

[0089] In this embodiment, as Figure 2 As shown, the optical film layer 12 is located on the side of the encapsulation layer 17 away from the substrate 11. The optical film layer 12 is configured to partially transmit and partially absorb incident light. The transmittance of the optical film layer 12 is greater than the transmittance of the black matrix 131. The optical film layer 12 includes an optical film opening 121. The projection of the optical film opening 121 on the substrate 11 is located within the projection of the black matrix opening 1311 on the substrate 11.

[0090] In this embodiment, since the optical film layer 12 is located on the side of the encapsulation layer 17 away from the substrate 11, and the optical film layer 12 partially transmits incident light, the transmittance of the optical film layer 12 is greater than that of the black matrix 131. Therefore, when light incident from the black matrix 131 side encounters the optical film layer opening 121, no diffraction phenomenon occurs. Furthermore, since the projection of the optical film layer opening 121 on the substrate 11 is located within the projection of the black matrix opening 1311 on the substrate 11, the optical film layer 12 partially absorbs the incident light. Therefore, if light incident from the substrate 11 side encounters the black matrix opening 1311 and diffracts, some of the diffracted light will be incident on the optical film layer 12, and the energy of the diffracted light incident on the optical film layer 12 will be partially absorbed by the optical film layer 12. Thus, the diffracted light generated at the black matrix opening 1311 is weakened, thereby improving the dark-state color separation phenomenon.

[0091] The above provides a brief description of the display substrate provided in the embodiments of the present invention. The following provides a detailed description of the display substrate provided in the embodiments of the present invention.

[0092] This invention also provides a display substrate. The display substrate, such as... Figure 2 As shown, it includes: a substrate 11, a driving circuit layer 14, a light-emitting layer 15, a pixel defining layer 16, an encapsulation layer 17, a filter layer, an optical film layer 12, and a protective layer 18.

[0093] In this embodiment, the substrate 11 can be a rigid substrate; in other embodiments, the substrate 11 can also be a flexible substrate.

[0094] In this embodiment, the substrate 11 can be a transparent substrate, but is not limited thereto.

[0095] In this embodiment, the substrate 11 can be made of alkali-free glass or quartz. When the substrate 11 is a flexible substrate, the material of the substrate 11 can include at least one of polyimide, polyethylene, polypropylene, polystyrene, polyethylene terephthalate, and polyethylene terephthalate. For example, the material of the substrate 11 can include polyimide, or a combination of polyimide and polyethylene.

[0096] In this embodiment, as Figure 2As shown, the driving circuit layer 14 is located on the substrate 11. The driving circuit layer 14 may include pixel circuits for driving sub-pixels to emit light. The pixel circuits may be 1T pixel circuits, 2T1C pixel circuits, 3T1C pixel circuits, 4T1C pixel circuits, 6T1C pixel circuits, 7T1C pixel circuits, 8T1C pixel circuits, or 8T2C pixel circuits, but are not limited thereto. The pixel circuits include thin-film transistors, or thin-film transistors and capacitors. The transistors may include a gate, a source, and a drain. The materials of the gate, source, and drain of the transistors may be metal. The pixel circuits have current regulation functions or voltage regulation functions for controlling the intensity of light emitted by the sub-pixels.

[0097] In this embodiment, as Figure 2 As shown, the light-emitting layer 15 is located on the side of the driving circuit layer 14 away from the substrate 11. The light-emitting layer 15 includes pixel units arranged in an array, and each pixel unit may include at least one sub-pixel. In this embodiment, each pixel unit may include three sub-pixels. In this embodiment, each pixel unit may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel arranged in sequence. The red sub-pixel is used to emit red light, the green sub-pixel is used to emit green light, and the blue sub-pixel is used to emit blue light. Of course, in other embodiments, the pixel unit may also include a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white light sub-pixel, or the pixel unit may only include a white light sub-pixel. The white light sub-pixel is used to emit white light.

[0098] In this embodiment, each sub-pixel can be an OLED (Organic Light-Emitting Diode) sub-pixel. Each sub-pixel may include a first electrode, an organic light-emitting layer, and a second electrode. The first electrode may be an anode, electrically connected to the pixel circuit, and the second electrode may be a cathode. The first electrode is located on the side of the driving circuit layer 14 away from the substrate 11, the organic light-emitting layer is located on the side of the first electrode close to the encapsulation layer, and the second electrode is located on the side of the organic light-emitting layer close to the encapsulation layer. The projection of the organic light-emitting layer on the substrate 11 lies within the projection of the first electrode on the substrate 11. The second electrode may be a surface electrode, shared by all sub-pixels, but is not limited to this. The second electrode may be a transparent conductive material; for example, the second electrode may include at least one of metal or ITO (indium tin oxide).

[0099] In this embodiment, the red sub-pixel includes a first organic light-emitting layer 151 for emitting red light, the green sub-pixel includes a second organic light-emitting layer 152 for emitting green light, and the blue sub-pixel includes a third organic light-emitting layer 153 for emitting blue light. The organic light-emitting layer can be the first organic light-emitting layer 151, the second organic light-emitting layer 152, or the third organic light-emitting layer 153.

[0100] In this embodiment, the pixel defining layer 16 is located on the side of the driving circuit layer 14 near the encapsulation layer, and also on the side of the first electrode near the encapsulation layer. The pixel defining layer 16 includes a pixel defining layer opening, and the organic light-emitting layer is located in the pixel defining layer opening. The projection of the organic light-emitting layer onto the substrate 11 lies within the projection of the pixel defining layer opening onto the substrate 11.

[0101] In this embodiment, the pixel defining layer 16 can be made of a transparent organic material. In other embodiments, the pixel defining layer 16 can be made of a black organic material, which eliminates the need for the black matrix 131, simplifies the process, and avoids the problem of residual black matrix material.

[0102] In this embodiment, as Figure 2 As shown, the encapsulation layer 17 is located on the side of the light-emitting layer 15 away from the substrate 11, and is used to prevent water and oxygen from eroding the sub-pixels, thus protecting them. The encapsulation layer 17 can be fabricated using a thin-film encapsulation (TFE) process.

[0103] In this embodiment, as Figure 2 As shown, the encapsulation layer 17 may include a first inorganic encapsulation layer 171, an organic encapsulation layer 172, and a second inorganic encapsulation layer 173. The first inorganic encapsulation layer 171 is located on the side of the light-emitting layer 15 away from the substrate 11, the organic encapsulation layer 172 is located on the side of the first inorganic encapsulation layer 171 away from the light-emitting layer 15, and the second inorganic encapsulation layer 173 is located on the side of the organic encapsulation layer 172 away from the light-emitting layer 15.

[0104] In this embodiment, the projection of the organic encapsulation layer 172 onto the substrate 11 lies within the projection of the first inorganic encapsulation layer 171 onto the substrate 11, and also within the projection of the second inorganic encapsulation layer 173 onto the substrate 11. Thus, the first inorganic encapsulation layer 171 and the second inorganic encapsulation layer 173 are in contact at their edges, encapsulating the organic encapsulation layer 172. This prevents water and oxygen from eroding the organic encapsulation layer 172, significantly improving the reliability of the display substrate during high-temperature and high-humidity storage. Furthermore, film separation is less likely to occur during bending tests, effectively ensuring the static and dynamic reliability of the display substrate.

[0105] In this embodiment, the first inorganic encapsulation layer 171 is used to block water and oxygen. The material of the first inorganic encapsulation layer 171 may include any one or any combination of silicon oxynitride (SiOxNy), silicon nitride (SiNx), silicon oxide (SiOx), and aluminum oxide (AlOx). For example, the material of the first inorganic encapsulation layer 171 may include silicon nitride, or silicon oxide, or a combination of silicon oxynitride and silicon nitride, but is not limited thereto. The first inorganic encapsulation layer 171 may be prepared using plasma-enhanced chemical vapor deposition (PECVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), or HDMSO (hexamethyldisiloxane) coating process.

[0106] In this embodiment, the thickness of the first inorganic encapsulation layer 171 is 0.1–2.0 micrometers. For example, the thickness of the first inorganic encapsulation layer 171 can be 0.1 micrometers, 1.0 micrometers, or 2.0 micrometers. If the thickness of the first inorganic encapsulation layer 171 is less than 0.1 micrometers, the effect of blocking water and oxygen is relatively poor; if the thickness of the first inorganic encapsulation layer 171 is greater than 2.0 micrometers, the bending radius is relatively large, and the bending performance is poor. Therefore, when the thickness of the first inorganic encapsulation layer 171 is 0.1–2.0 micrometers, both the effect of blocking water and oxygen and the bending performance can be balanced. Preferably, the thickness of the first inorganic encapsulation layer 171 is 1.0 micrometer.

[0107] In this embodiment, the organic encapsulation layer 172 is used to relieve stress between the first inorganic encapsulation layer 171 and the second inorganic encapsulation layer 173. The material of the organic encapsulation layer 172 may include at least one of thermosetting and photocurable organic materials. For example, the material of the organic encapsulation layer 172 may include at least one of acrylates and epoxy resins. The organic encapsulation layer 172 may be prepared using a blade coating process or an inkjet printing (IJP) process.

[0108] In this embodiment, the thickness of the organic encapsulation layer 172 can be 2.0 to 12.0 micrometers. For example, the thickness of the organic encapsulation layer 172 can be 2.0 micrometers, 6.0 micrometers, 8.0 micrometers, 10.0 micrometers, or 12.0 micrometers.

[0109] In this embodiment, the second inorganic encapsulation layer 173 is used to block water and oxygen. The material of the second inorganic encapsulation layer 173 may include any one or any combination of silicon oxynitride (SiOxNy), silicon nitride (SiNx), silicon oxide (SiOx), and aluminum oxide (AlOx). For example, the material of the second inorganic encapsulation layer 173 may include silicon nitride, or silicon oxide, or a combination of silicon oxynitride and silicon nitride, but is not limited thereto. Preferably, the material of the second inorganic encapsulation layer 173 includes silicon nitride, as silicon nitride has good density and can improve encapsulation performance. The second inorganic encapsulation layer 173 may be prepared using plasma-enhanced chemical vapor deposition, chemical vapor deposition, atomic layer deposition, or HDMSO coating.

[0110] In this embodiment, the thickness of the second inorganic encapsulation layer 173 can be 0.7 to 1.0 micrometers. For example, the thickness of the second inorganic encapsulation layer 173 can be 0.7 micrometers, 0.8 micrometers, 0.9 micrometers, or 1.0 micrometers.

[0111] In this embodiment, as Figure 2 As shown, the filter layer can be located in the encapsulation layer 17, which can shorten the distance between the organic light-emitting layer and the filter layer, thereby increasing the viewing angle and improving L-decay (brightness decay).

[0112] In this embodiment, since the filter layer is located in the encapsulation layer 17, the thickness of the display substrate can be reduced without increasing it. Furthermore, since the bending strain of the second inorganic encapsulation layer 173 is reduced, a small radius bending is achieved, thus improving the bending performance.

[0113] It should be noted that high PPI (pixel density) display substrates and white OLED display substrates can also employ a scheme where the filter layer is located within the encapsulation layer 17. A white OLED display substrate refers to a pixel unit that includes only white sub-pixels.

[0114] In this embodiment, as Figure 2 As shown, the filter layer can be located between the first inorganic encapsulation layer 171 and the organic encapsulation layer 172. In this embodiment, the organic encapsulation layer 172 also serves to planarize and protect the filter layer. Of course, in other embodiments, the filter layer can also be located between the organic encapsulation layer 172 and the second inorganic encapsulation layer 173.

[0115] In this embodiment, as Figure 2 As shown, the filter layer may include a black matrix 131 and color filter layers. The black matrix 131 is located between two adjacent color filter layers and is used to isolate the two adjacent color filter layers.

[0116] In this embodiment, the thickness of the color filter layer is 1.0 to 4.0 micrometers, for example, the thickness of the color filter layer is 1.0 micrometer, 2.0 micrometer, 3.0 micrometer or 4.0 micrometer.

[0117] In this embodiment, the thickness of the black matrix 131 is 0.7 to 1.5 micrometers, for example, the thickness of the black matrix 131 is 0.7 micrometers, 1.0 micrometers or 1.5 micrometers.

[0118] In this embodiment, as Figure 2 As shown, the color filter layer includes a red filter layer 132, a green filter layer 133, and a blue filter layer 134. A black matrix 131 exists between the red filter layer 132 and the green filter layer 133, and between the green filter layer 133 and the blue filter layer 134.

[0119] In this embodiment, as Figure 2 As shown, the projection of the bottom surface of the pixel defining layer opening near the first electrode onto the substrate 11 is located within the projection of the color filter layer onto the substrate 11.

[0120] In this embodiment, as Figure 2 As shown, the projection of the organic light-emitting layer on the substrate 11 lies within the projection of the color filter layer on the substrate 11. For example, the projection of the first organic light-emitting layer 151 in the red sub-pixel on the substrate 11 lies within the projection of the red filter layer 132 on the substrate 11, the projection of the second organic light-emitting layer 152 in the green sub-pixel on the substrate 11 lies within the projection of the green filter layer 133 on the substrate 11, and the projection of the third organic light-emitting layer 153 in the blue sub-pixel on the substrate 11 lies within the projection of the blue filter layer 134 on the substrate 11.

[0121] In this embodiment, as Figure 3 As shown, there are gaps between adjacent color filter layers of the same color. For example, when two green filter layers 133 are adjacent, there are gaps between them, and a black matrix 131 exists between them. This reduces the intensity of green diffracted light, thereby improving dark-state color separation.

[0122] In this embodiment, as Figure 2 As shown, the projection of the black matrix 131 onto the substrate 11 lies within the projection of the pixel defining layer 16 onto the substrate 11. In other embodiments, the projection of the pixel defining layer 16 onto the substrate 11 may also lie within the projection of the black matrix 131 onto the substrate 11.

[0123] In this embodiment, as Figure 2As shown, the black matrix 131 includes a black matrix opening 1311. The projection of the black matrix opening 1311 onto the substrate 11 lies within the projection of the color filter layer onto the substrate 11. The projection of the bottom surface of the pixel defining layer opening near the first electrode onto the substrate 11 lies within the projection of the black matrix opening 1311 onto the substrate 11. This avoids reducing the light-emitting area.

[0124] In this embodiment, as Figure 2 As shown, the distance between the bottom surface of the black matrix 131 near the pixel defining layer 16 and the surface of the substrate 11 facing the light-emitting layer 15 is greater than the distance between the bottom surface of the color filter layer near the light-emitting layer 15 and the surface of the substrate 11 facing the light-emitting layer 15. The structure of this filter layer can be prepared by the following method: first, a red filter layer 132, a green filter layer 133, and a blue filter layer 134 are prepared; then, a black matrix material layer is formed on the red filter layer 132, the green filter layer 133, and the blue filter layer 134; finally, the black matrix material layer is patterned to obtain the black matrix 131. This preparation method can utilize the planarization treatment of the color filter layer to avoid black matrix material residue, effectively ensuring the light-emitting area and improving yield and optical performance.

[0125] In this embodiment, the surface of the black matrix 131 facing the optical film layer 12 is uneven. This allows for diffuse reflection of the diffracted light incident on the surface of the black matrix 131 facing the optical film layer 12, disrupting the arrangement of the various colors of diffracted light and thus improving the dark-state color separation phenomenon.

[0126] In this embodiment, as Figure 2 As shown, the optical film layer 12 is located on the side of the encapsulation layer 17 away from the substrate 11. The optical film layer 12 is configured to partially transmit and partially absorb incident light. The transmittance of the optical film layer 12 is greater than the transmittance of the black matrix 131. The optical film layer 12 includes an optical film opening 121. The projection of the optical film opening 121 on the substrate 11 is located within the projection of the black matrix opening 1311 on the substrate 11.

[0127] In this embodiment, since the optical film layer 12 is located on the side of the encapsulation layer 17 away from the substrate 11, and the optical film layer 12 partially transmits incident light, the transmittance of the optical film layer 12 is greater than that of the black matrix 131. Therefore, when light incident from the black matrix 131 side encounters the optical film layer opening 121, no diffraction phenomenon occurs. Furthermore, since the projection of the optical film layer opening 121 on the substrate 11 is located within the projection of the black matrix opening 1311 on the substrate 11, the optical film layer 12 partially absorbs the incident light. Therefore, when light incident from the substrate 11 side encounters the black matrix opening 1311 and diffracts, some of the diffracted light will be incident on the optical film layer 12, and the energy of the diffracted light incident on the optical film layer 12 will be partially absorbed by the optical film layer 12. Thus, the diffracted light generated by the black matrix opening 1311 is weakened, thereby improving the dark-state color separation phenomenon.

[0128] In this embodiment, the projection of the bottom surface of the pixel defining layer opening near the first electrode onto the substrate 11 lies within the projection of the optical film opening 121 onto the substrate 11. This avoids reducing the light-emitting area and affecting the light efficiency.

[0129] In this embodiment, the transmittance of the optical film layer 12 is 30% to 80%. For example, the transmittance of the optical film layer 12 can be 30%, 40%, 50%, 60%, 70%, or 80%, but is not limited thereto. Preferably, the transmittance of the optical film layer 12 is 70%. This can effectively prevent diffraction when light incident from the black matrix 131 side encounters the opening 121 of the optical film layer, and can also appropriately increase the absorption rate of the optical film layer 12 for incident light, thus significantly improving the dark-state color separation phenomenon.

[0130] In this embodiment, the optical film layer 12 is a black optical film layer. For example, the optical film layer 12 may include at least one of a black metal, a black organic material, and a black inorganic material.

[0131] In this embodiment, the optical film 12 may include a ferrous metal, for example, the optical film 12 may include molybdenum oxide (MoOx).

[0132] In this embodiment, the thickness of the optical film layer 12 can be 10–55 nanometers, for example, 10 nanometers, 20 nanometers, 35 nanometers, 40 nanometers, or 55 nanometers. The transmittance of the optical film layer 12 is negatively correlated with its thickness; the higher the transmittance, the smaller the thickness, and vice versa. The thickness of the optical film layer 12 can be determined according to the desired transmittance.

[0133] In this embodiment, the optical film 12 is doped with thallium (Tl). This reduces the reflectivity of the optical film 12, which in turn increases its transmittance and improves dark-state color separation.

[0134] In this embodiment, as Figure 2 As shown, the protective layer 18 is located on the side of the optical film layer 12 away from the filter layer. The protective layer 18 is also located on the side of the encapsulation layer 17 away from the substrate 11. The material of the protective layer 18 is a transparent organic material. The protective layer 18 is used to protect the optical film layer 12.

[0135] In this embodiment, the thickness of the protective layer 18 is 2.0 to 3.0 micrometers, for example, the thickness of the protective layer 18 is 2.0 micrometers, 2.5 micrometers or 3.0 micrometers.

[0136] An embodiment of the present invention also provides a display substrate. Unlike the above embodiments, in this embodiment, the optical film layer 12 is a color optical film layer.

[0137] In this embodiment, as Figure 4 As shown, the colored optical film layer may include a red optical film layer 123, a green optical film layer 124, and a blue optical film layer 125. The red optical film layer 123 allows red light to pass through, the green optical film layer 124 allows green light to pass through, and the blue optical film layer 125 allows blue light to pass through.

[0138] In this embodiment, as Figure 4 As shown, the red optical film layer 123, the green optical film layer 124, and the blue optical film layer 125 each include a corresponding optical film opening 121. For example, the red optical film layer 123 includes a red optical film opening 1211, the green optical film layer 124 includes a green optical film opening 1212, and the blue optical film layer 125 includes a blue optical film opening 1213.

[0139] In this embodiment, as Figure 4 As shown, the projection of the red optical film opening 1211 on the substrate 11 is located within the projection of the red filter layer 132 on the substrate 11, the projection of the green optical film opening 1212 on the substrate 11 is located within the projection of the green filter layer 133 on the substrate 11, and the projection of the blue optical film opening 1213 on the substrate 11 is located within the projection of the blue filter layer 134 on the substrate 11.

[0140] In this embodiment, as Figure 4As shown, the optical film 12, whose projection on the substrate 11 overlaps with the projection of the color filter layer, has the same color. Thus, the optical film 12 can reduce the intensity of diffracted light of the same color as the color filter layer from the color filter layer side, improving dark-state color separation. For example, the projection of the red optical film 123 on the substrate 11 overlaps with the projection of the red filter layer 132 on the substrate 11, and the red optical film 123 can reduce the intensity of red diffracted light incident from the red filter layer 132 side. Similarly, the projection of the green optical film 124 on the substrate 11 overlaps with the projection of the green filter layer 133 on the substrate 11, and the green optical film 124 can reduce the intensity of green diffracted light incident from the green filter layer 133 side. The projection of the blue optical film 125 onto the substrate 11 overlaps with the projection of the blue filter layer 134 onto the substrate 11. The blue optical film 125 can reduce the intensity of the blue diffracted light incident from the side of the blue filter layer 134.

[0141] In this embodiment, the colored optical film layer may include at least one of polymethyl methacrylate and silicone resin. For example, the colored optical film layer may include polymethyl methacrylate, or silicone resin, or a mixture of polymethyl methacrylate and silicone resin.

[0142] In this embodiment, the colored optical film layer may include at least one of organic and inorganic pigments. For example, the colored optical film layer may include organic pigments, or inorganic pigments, or a combination of organic and inorganic pigments. For example, the red optical film layer 123 may include red organic pigments, the green optical film layer 124 may include green organic pigments, and the blue optical film layer 125 may include blue organic pigments.

[0143] In this embodiment, the optical film layer 12 may include scattering particles. This allows for the scattering of diffracted light from the black matrix 131 side, disrupting the arrangement of different colors of diffracted light and thus improving dark-state color separation.

[0144] In this embodiment, the scattering particles are made of zirconium oxide (ZrOx) and have a radius of less than 100 nanometers. In other embodiments, the radius of the scattering particles may also be equal to 100 nanometers.

[0145] In another embodiment, the scattering particles may be made of titanium dioxide (TiO2), and the radius of the scattering particles may be less than 200 nanometers. In other embodiments, the radius of the scattering particles may also be equal to 200 nanometers.

[0146] In this embodiment, the concentration of scattering particles may be less than or equal to 30%. For example, the concentration of scattering particles may be 5%, 10%, 20%, or 30%.

[0147] In this embodiment, the thickness of the optical film layer 12 can be 0.5 to 5.0 micrometers. For example, the thickness of the optical film layer 12 can be 0.5 micrometers, 1 micrometer, 1.5 micrometers, 3.0 micrometers, 4.0 micrometers, or 5.0 micrometers. Preferably, the thickness of the optical film layer 12 can be 3.0 micrometers.

[0148] In this embodiment, the transmittance of the optical film layer 12 is negatively correlated with its thickness. The higher the transmittance of the optical film layer 12, the smaller its thickness; conversely, the lower the transmittance of the optical film layer 12, the larger its thickness. Therefore, the thickness of the optical film layer 12 can be determined based on its transmittance. The transmittance of the optical film layer 12 can be determined based on the requirements for L-decay and color separation.

[0149] Embodiments of the present invention also provide a display substrate. Unlike the above embodiments, in this embodiment, as... Figure 5 As shown, the display substrate also includes a support pillar 41.

[0150] In this embodiment, as Figure 5 As shown, the support pillar 41 is located between the pixel defining layer 16 and the encapsulation layer 17. The projection of the support pillar 41 onto the substrate 11 lies within the projection of the pixel defining layer 16 onto the substrate 11. The support pillar 41 is used to support the fine metal mask (FMM) used during the deposition of the organic light-emitting layer. This facilitates uniform stress on the fine metal mask, minimizes the deformation of the openings on the fine metal mask, reduces the possibility of organic light-emitting layer filling misalignment, and thus helps control the shape and coverage area of ​​the organic light-emitting layer, improving yield.

[0151] In this embodiment, as Figure 5 As shown, the encapsulation layer 17 further includes an organic planarization layer 42, which is located between the filter layer and the organic encapsulation layer 172. The organic planarization layer 42 is used to relieve stress between the first inorganic encapsulation layer 171 and the second inorganic encapsulation layer 173 and to protect the filter layer.

[0152] In this embodiment, the organic planarization layer 42 is made of a transparent material, and the light transmittance of the organic planarization layer 42 can be greater than 95%. For example, the light transmittance of the organic planarization layer 42 can be 98%, but it is not limited to this.

[0153] In this embodiment, the material of the organic planarization layer 42 may include at least one of a thermocurable organic material and a photocurable organic material.

[0154] In this embodiment, the material of the organic planarization layer 42 may include at least one of acrylates and epoxy resins.

[0155] In this embodiment, the thickness of the organic planarization layer 42 can be from 0.1 to 50.0 micrometers. For example, the thickness of the organic planarization layer 42 can be 0.1 micrometer, 3.0 micrometer, 10 micrometer, 20 micrometer, 30 micrometer, 40 micrometer, or 50.0 micrometer. Preferably, the thickness of the organic planarization layer 42 is 3.0 micrometers.

[0156] In this embodiment, the projection of the organic planarization layer 42 on the substrate 11 is located within the projection of the first inorganic encapsulation layer 171 on the substrate 11, and is also located within the projection of the second inorganic encapsulation layer 173 on the substrate 11.

[0157] In this embodiment, the distance between the edge of the projection of the organic planarization layer 42 onto the substrate 11 and the edge of the projection of the first inorganic encapsulation layer 171 onto the substrate 11 is 100 micrometers to 1000 micrometers. For example, the distance between the edge of the projection of the organic planarization layer 42 onto the substrate 11 and the edge of the projection of the first inorganic encapsulation layer 171 onto the substrate 11 is 100 micrometers, 150 micrometers, 200 micrometers, 300 micrometers, 500 micrometers, 800 micrometers, or 1000 micrometers. Preferably, the distance between the edge of the projection of the organic planarization layer 42 onto the substrate 11 and the edge of the projection of the first inorganic encapsulation layer 171 onto the substrate 11 is 200 micrometers. This ensures that the first inorganic encapsulation layer 171 and the second inorganic encapsulation layer 173 have sufficient contact area to guarantee an effective encapsulation distance, and also ensures that the organic planarization layer 42 can cover the cathode of the sub-pixel, thereby ensuring the reliability of the product display.

[0158] In this embodiment, the material of the organic planarization layer 42 may be the same as the material of the organic encapsulation layer 172.

[0159] In this embodiment, to make the illustrations concise and clear and to ensure their accuracy, Figure 6 Only the projection edges 132' of the red filter layer 132, 133' of the green filter layer 133, 134' of the blue filter layer 134, 151' of the first organic light-emitting layer 151, 152' of the second organic light-emitting layer 152, 153' of the third organic light-emitting layer 153, and 1211', 1212', and 1213' of the optical film openings 121 on the substrate 11 are shown.

[0160] In this embodiment, as Figure 6As shown, the distance a1 between the projection edge 134' of the blue filter layer 134 on the substrate 11 and the projection edge 153' of the third organic light-emitting layer 153 on the substrate 11 can be 0 to 12 micrometers. For example, the distance a1 between the projection edge 134' of the blue filter layer 134 on the substrate 11 and the projection edge 153' of the third organic light-emitting layer 153 on the substrate 11 can be 0 micrometers, 4 micrometers, 6 micrometers or 12 micrometers.

[0161] Similarly, in this embodiment, as Figure 6 As shown, the distance a1 between the projection edge 133' of the green filter layer 133 on the substrate 11 and the projection edge 152' of the second organic light-emitting layer 152 on the substrate 11 can be 0 to 12 micrometers. For example, the distance a1 between the projection edge 133' of the green filter layer 133 on the substrate 11 and the projection edge 152' of the second organic light-emitting layer 152 on the substrate 11 can be 0 micrometers, 4 micrometers, 6 micrometers or 12 micrometers.

[0162] Similarly, in this embodiment, as Figure 6 As shown, the distance a1 between the projection edge 132' of the red filter layer 132 on the substrate 11 and the projection edge 151' of the first organic light-emitting layer 151 on the substrate 11 can be 0 to 12 micrometers. For example, the distance a1 between the projection edge 132' of the red filter layer 132 on the substrate 11 and the projection edge 151' of the first organic light-emitting layer 151 on the substrate 11 can be 0 micrometers, 4 micrometers, 6 micrometers or 12 micrometers.

[0163] In this embodiment, as Figure 6 As shown, for the projection onto the substrate 11, there are overlapping third organic light-emitting layer 153 and optical film opening 121. The distance a2 between the projection edge 1213' of the optical film opening 121 on the substrate 11 and the projection edge 153' of the third organic light-emitting layer 153 on the substrate 11 is -5 to 5 micrometers. For example, the distance a2 can be -5 micrometers, 0 micrometers, or 5 micrometers. Specifically, when a2 is greater than 0, the optical film opening 121 is located outside the projection edge 1213' of the third organic light-emitting layer 153 on the substrate 11; when a2 is less than 0, the optical film opening 121 is located inside the projection edge 153' of the third organic light-emitting layer 153 on the substrate 11; and when a2 is equal to 0, the optical film opening 121 is located at the projection edge 1213' of the third organic light-emitting layer 153 on the substrate 11, which coincides with the projection edge 153' of the third organic light-emitting layer 153 on the substrate 11.

[0164] Similarly, in this embodiment, as Figure 6As shown, for the projection onto the substrate 11, there is an overlapping second organic light-emitting layer 152 and an optical film opening 121. The distance a2 between the projection edge 1212' of the optical film opening 121 on the substrate 11 and the projection edge 152' of the second organic light-emitting layer 152 on the substrate 11 is -5 to 5 micrometers. For example, the distance a2 can be -5 micrometers, 0 micrometers, or 5 micrometers. Specifically, when a2 is greater than 0, the projection edge 1212' of the optical film layer on the substrate 11 is located outside the projection edge 152' of the second organic light-emitting layer 152 on the substrate 11; when a2 is less than 0, the projection edge 1212' of the optical film layer on the substrate 11 is located inside the projection edge 152' of the second organic light-emitting layer 152 on the substrate 11; and when a2 is equal to 0, the projection edge 1212' of the optical film layer on the substrate 11 coincides with the projection edge 152' of the second organic light-emitting layer 152 on the substrate 11.

[0165] Similarly, in this embodiment, as Figure 6 As shown, for the projection onto the substrate 11, there is an overlapping first organic light-emitting layer 151 and an optical film opening 121. The distance a2 between the projection edge 1211' of the optical film opening 121 on the substrate 11 and the projection edge 151' of the first organic light-emitting layer 151 on the substrate 11 is -5 to 5 micrometers. For example, the distance a2 can be -5 micrometers, 0 micrometers, or 5 micrometers. Specifically, when a2 is greater than 0, the projection edge 1211' of the optical film layer on the substrate 11 is located outside the projection edge 151' of the first organic light-emitting layer 151 on the substrate 11; when a2 is less than 0, the projection edge 1211' of the optical film layer on the substrate 11 is located inside the projection edge 151' of the first organic light-emitting layer 151 on the substrate 11; and when a2 is equal to 0, the projection edge 1211' of the optical film layer on the substrate 11 coincides with the projection edge 151' of the first organic light-emitting layer 151 on the substrate 11.

[0166] In this embodiment, to make the illustrations concise and clear and to ensure their accuracy, Figure 7 Only the projection edge 1311' of the black matrix opening 1311 on the substrate 11, the projection edge 161' of the pixel defining layer opening on the substrate 11, and the projection edge 41' of the support pillar 41 on the substrate 11 are shown.

[0167] In this embodiment, as Figure 7As shown, the distance b between the projection edge 1311' of the black matrix opening 1311 on the substrate 11 and the projection edge 161' of the pixel defining layer opening on the substrate 11 is -2 to 12 micrometers. For example, the distance b between the projection edge 1311' of the black matrix opening 1311 on the substrate 11 and the projection edge 161' of the pixel defining layer opening on the substrate 11 is -2 micrometers, 0 micrometers, 3 micrometers, 5 micrometers, 8 micrometers, 10 micrometers, or 12 micrometers. When b is negative, the projection edge 1311' of the black matrix opening 1311 on the substrate 11 is located outside the projection edge 161' of the pixel defining layer opening on the substrate 11, and the projection of the black matrix 131 on the substrate 11 is located within the projection of the pixel defining layer 16 on the substrate 11. When b is positive, the projection edge 1311' of the black matrix opening 1311 on the substrate 11 is located inside the projection edge 161' of the pixel defining layer opening on the substrate 11, and the projection of the pixel defining layer 16 on the substrate 11 is located within the projection of the black matrix 131 on the substrate 11.

[0168] Embodiments of the present invention also provide a display device, including a display module and a display substrate of any of the above embodiments.

[0169] Embodiments of the present invention also provide a method for fabricating a display substrate. This method for fabricating a display substrate can be used to prepare... Figure 2 The display substrate shown, and the method for manufacturing the display substrate, are as follows: Figure 8 As shown, the steps 701 to 707 may be included:

[0170] In step 701, a driving circuit layer 14 is formed on the substrate 11.

[0171] In this embodiment, the driving circuit layer 14 can be fabricated on the substrate 11 using processes such as exposure, development, magnetron sputtering, dry etching, and wet etching.

[0172] In this embodiment, the driving circuit layer 14 may not include the first electrode (anode) of the sub-pixel.

[0173] In step 702, a pixel defining layer 16 and a light-emitting layer 15 are formed, with the pixel defining layer 16 and the light-emitting layer 15 located on the side of the driving circuit layer 14 away from the substrate 11.

[0174] In this embodiment, the light-emitting layer 15 includes pixel units arranged in an array, and each pixel unit may include at least one sub-pixel. Each sub-pixel may include a first electrode, an organic light-emitting layer, and a second electrode.

[0175] In this embodiment, the first electrode of the sub-pixel can be prepared first on the driving circuit layer 14, then the pixel defining layer 16 can be prepared, and then the organic light-emitting layer and the second electrode can be prepared.

[0176] In this embodiment, a pixel defining layer 16 with a regular arrangement can be fabricated using photoresist coating, exposure, and development processes. The thickness of the pixel defining layer 16 is 0.5 to 1.5 micrometers, for example, 0.5 micrometers, 1.0 micrometers, or 1.5 micrometers.

[0177] In this embodiment, after fabricating the pixel defining layer 16, support pillars 41 can also be fabricated. The method for fabricating the support pillars 41 is to coat the pixel defining layer 16 with photoresist and then perform subsequent exposure and development processes to create support pillars 41 arranged in a regular pattern. The thickness of the support pillars 41 is 0.5–1.5 micrometers; for example, the thickness of the support pillars 41 is 0.5 micrometers, 1.0 micrometers, or 1.5 micrometers.

[0178] In this embodiment, the material of the support pillar 41 can be the same as that of the pixel defining layer 16, and a halftone mask is used for single-exposure development to utilize the regional exposure energy difference characteristics for fabrication.

[0179] In this embodiment, after the support pillar 41 is prepared, an organic light-emitting layer can be prepared. For example, the first organic light-emitting layer 151, the second organic light-emitting layer 152, and the third organic light-emitting layer 153 can be filled into the corresponding pixel-defining layer openings using a vacuum high-temperature evaporation process, an inkjet printing process, or a transfer process.

[0180] In step 703, a first inorganic encapsulation layer 171 is formed, which is located on the side of the pixel defining layer 16 and the light-emitting layer 15 away from the substrate 11.

[0181] In this embodiment, the first inorganic encapsulation layer 171 can be prepared using plasma-enhanced chemical vapor deposition, chemical vapor deposition, atomic layer deposition, or HDMSO coating.

[0182] In step 704, a filter layer is formed. The filter layer is located on the side of the first inorganic encapsulation layer 171 away from the substrate 11. The filter layer includes a black matrix 131 and a color filter layer. The black matrix 131 includes a black matrix opening 1311.

[0183] In this embodiment, a color filter layer can be formed first, and then a black matrix material layer can be formed on the side of the color filter layer away from the substrate 11. The black matrix material layer is then patterned to obtain a black matrix 131.

[0184] In this embodiment, a color filter layer is formed first, and then a black matrix 131 is prepared. The color filter layer can be used for planarization, and the black matrix material can be effectively cleaned, avoiding the problem of process chamber contamination caused by the residue of black matrix material, and reducing the cost of equipment maintenance.

[0185] In this embodiment, the materials used to prepare the color filter layer can be effectively exposed and cleaned, which effectively ensures the consistency between the process parameters and the design parameters and greatly improves the yield.

[0186] In this embodiment, the problems of residual black matrix material at the pixel defining layer opening and local peeling at the support pillar 41 position caused by factors such as insufficient flatness of the substrate under the filter layer, insufficient exposure depth, large discontinuity, and material affinity can be effectively solved. This can effectively ensure the light-emitting area of ​​the sub-pixel and avoid the reduction in brightness or the reduction in the lifespan of the organic light-emitting layer caused by the reduction in the light-emitting area.

[0187] In this embodiment, the material of the color filter layer can be a negative photoresist. The method for forming the color filter layer involves coating, exposing, and developing the negative photoresist sequentially to form a green filter layer 133, a red filter layer 132, and a blue filter layer 134. The order in which the green filter layer 133, red filter layer 132, and blue filter layer 134 are formed is not limited to the order described above. In other embodiments, the material of the color filter layer can be an organic resin material containing a thermosetting agent or a photocurable agent, and the color filter layer can be prepared using inkjet printing or transfer printing processes.

[0188] In this embodiment, the material of the black matrix 131 is negative photoresist. A black matrix material layer can be obtained by coating with negative photoresist, and then the black matrix material layer can be patterned by exposure and development processes to obtain the black matrix 131.

[0189] In this embodiment, after step 704, the following can be obtained: Figure 9 The intermediate structure shown.

[0190] In step 705, an organic encapsulation layer 172 and a second inorganic encapsulation layer 173 are formed. The organic encapsulation layer 172 is located on the side of the filter layer away from the substrate 11, and the second inorganic encapsulation layer 173 is located on the side of the organic encapsulation layer 172 away from the substrate 11.

[0191] In this embodiment, an organic planarization layer 42 may be formed before forming the organic encapsulation layer 172 and the second inorganic encapsulation layer 173.

[0192] In this embodiment, the organic planarization layer 42 can be prepared by a blade coating process or an inkjet printing process, and then cured by a thermosetting or photocuring process. Specifically, when the material of the organic planarization layer 42 includes a thermosetting organic material, it can be cured by thermosetting. When the material of the organic planarization layer 42 includes a photocurable organic material, it can be cured by thermosetting.

[0193] In this embodiment, after forming the organic planarization layer 42, an organic encapsulation layer 172 is formed first, followed by the formation of a second inorganic encapsulation layer 173. The preparation method of the organic encapsulation layer 172 is the same as that of the organic planarization layer 42, and the preparation method of the second inorganic encapsulation layer 173 is the same as that of the first inorganic encapsulation layer 171; therefore, these methods will not be described in detail here.

[0194] In this embodiment, after step 705, the following can be obtained: Figure 10 The intermediate structure shown.

[0195] In step 706, an optical film layer 12 is formed. The optical film layer 12 is located on the side of the filter layer away from the substrate 11. The optical film layer 12 is configured to partially transmit and partially absorb incident light. The transmittance of the optical film layer 12 is greater than the transmittance of the black matrix 131. The optical film layer 12 includes an optical film opening 121. The projection of the optical film opening 121 on the substrate 11 is located within the projection of the black matrix opening 1311 on the substrate 11.

[0196] In this embodiment, the material of the optical film layer 12 includes molybdenum oxide. In this embodiment, a low-temperature deposition process can be used to prepare an optical material film layer on the side of the encapsulation layer 17 away from the substrate 11. The material of the optical material film layer includes molybdenum oxide. Then, a photomask is used to pattern the optical material film layer to obtain the optical film layer 12.

[0197] In this embodiment, after step 706, the following can be obtained: Figure 11 The intermediate structure shown.

[0198] In step 707, a protective layer 18 is formed, which is located on the side of the optical film layer 12 and the encapsulation layer 17 away from the substrate 11.

[0199] In this embodiment, a protective layer 18 is formed on the side of the optical film layer 12 away from the substrate 11.

[0200] In this embodiment, after step 707, the following can be obtained: Figure 2 The display substrate shown.

[0201] Embodiments of the present invention also provide a method for fabricating a display substrate. This method for fabricating a display substrate is used to prepare... Figure 4The display substrate shown.

[0202] In this embodiment, steps 701-705 and 707 are the same as steps 701-705 and 707 in the above embodiment. The difference is that in step 706, three photolithography processes can be used to prepare the red optical film 123, the green optical film 124 and the blue optical film 125 respectively.

[0203] In this embodiment, after step 706, the following can be obtained: Figure 12 The intermediate structure shown.

[0204] It should be noted that the contents of the above embodiments can complement each other.

[0205] It should be noted that the display device in this embodiment can be any product or component with display function, such as electronic paper, mobile phone, tablet computer, television, laptop computer, digital photo frame, or navigator.

[0206] The formation processes used in the above process may include, for example, film formation processes such as deposition and sputtering, and patterning processes such as etching.

[0207] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0208] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0209] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. The invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0210] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A display substrate, characterized in that, include: Substrate; A pixel defining layer is located on the substrate. The pixel defining layer includes a pixel defining layer opening; An encapsulation layer is located on the side of the pixel defining layer away from the substrate; the encapsulation layer includes a first inorganic encapsulation layer, which is located on the side of the pixel defining layer away from the substrate. A filter layer is located within the encapsulation layer and on the side of the first inorganic encapsulation layer away from the substrate; the filter layer includes a color filter layer. The filter layer further includes a black matrix, which is located on the side of the color filter layer away from the first inorganic encapsulation layer, and the black matrix includes a black matrix opening; An optical film layer is located on the side of the encapsulation layer away from the substrate. The optical film layer is configured to partially transmit and partially absorb incident light. The transmittance of the optical film layer is greater than the transmittance of the black matrix. The optical film layer includes an optical film layer opening. The projection of the optical film layer opening on the substrate is located within the projection of the black matrix opening on the substrate.

2. The display substrate according to claim 1, characterized in that, The color filter layer includes a first surface and a second surface, the first surface and the second surface being located on the side of the color filter layer facing the first inorganic encapsulation layer, the projection of the first surface on the substrate being located within the projection of the pixel defining layer opening on the substrate, the projection of the second surface on the substrate being located within the projection of the pixel defining layer on the substrate; the second surface is substantially parallel to at least a portion of the side surface of the pixel defining layer.

3. The display substrate according to claim 1, characterized in that, In the direction in which the black matrix points toward the substrate, at least a portion of the openings in the black matrix are enlarged.

4. The display substrate according to claim 1, characterized in that, The encapsulation layer further includes an organic encapsulation layer and a second inorganic encapsulation layer; the organic encapsulation layer is located on the side of the filter layer away from the first inorganic encapsulation layer, and the second inorganic encapsulation layer is located on the side of the organic encapsulation layer away from the first inorganic encapsulation layer.

5. The display substrate according to claim 4, characterized in that, The encapsulation layer further includes an organic planarization layer, which is located between the filter layer and the organic encapsulation layer.

6. The display substrate according to claim 5, characterized in that, The thickness of the organic encapsulation layer is 2.0~12.0 micrometers, and the thickness of the organic planarization layer is 0.1~50.0 micrometers.

7. The display substrate according to claim 2, characterized in that, It also includes support pillars, which are located on the side of the pixel defining layer away from the substrate, and at least a portion of the projection of the support pillars on the substrate is located within the projection of the pixel defining layer on the substrate, and the first inorganic encapsulation layer is located on the side of the support pillars away from the substrate. The color filter layer also includes a third surface that is substantially parallel to at least a portion of the side surface of the support column.

8. The display substrate according to claim 7, characterized in that, The slope angle of the third surface is greater than that of the second surface.

9. The display substrate according to claim 7, characterized in that, The projection of the interface between the color filter layer and the black matrix on the substrate lies within the projection of the support pillar on the substrate.

10. The display substrate according to claim 2, characterized in that, The distance from the surface of the black matrix away from the substrate to the surface of the substrate facing the filter layer is greater than the distance from the surface of the color filter layer away from the substrate to the surface of the substrate facing the filter layer.

11. A display substrate, characterized in that, include: Substrate; The encapsulation layer is located on the substrate. A filter layer is located within the encapsulation layer, the filter layer comprising a black matrix; the black matrix comprising black matrix openings; An optical film layer is located on the side of the encapsulation layer away from the substrate. The optical film layer is configured to partially transmit and partially absorb incident light. The transmittance of the optical film layer is greater than the transmittance of the black matrix. The optical film layer includes an optical film layer opening. The projection of the optical film layer opening on the substrate is located within the projection of the black matrix opening on the substrate.

12. The display substrate according to claim 11, characterized in that, The transmittance of the optical film is 30%~80%; the transmittance of the black matrix is ​​close to zero.

13. The display substrate according to claim 11, characterized in that, The optical film is a black optical film.

14. The display substrate according to claim 11, characterized in that, The filter layer also includes a color filter layer, and the projection of the black matrix opening on the substrate is located within the projection of the color filter layer on the substrate.

15. The display substrate according to claim 14, characterized in that, The optical film is a colored optical film, and the optical film with an overlapping area on the substrate has the same color as the colored filter layer.

16. The display substrate according to claim 11, characterized in that, The surface of the black matrix facing the optical film is uneven.

17. The display substrate according to any one of claims 11 to 16, characterized in that, It also includes a light-emitting layer and a pixel-defining layer, wherein the pixel-defining layer is located between the substrate and the encapsulation layer, and the pixel-defining layer includes a pixel-defining layer opening; The light-emitting layer is located between the substrate and the encapsulation layer. The light-emitting layer includes a sub-pixel. The sub-pixel includes a first electrode and an organic light-emitting layer. The organic light-emitting layer is located on the side of the first electrode closer to the encapsulation layer. The pixel defining layer is located on the side of the first electrode near the encapsulation layer; the projection of the organic light-emitting layer on the substrate is located within the projection of the pixel defining layer opening on the substrate, and the projection of the bottom surface of the pixel defining layer opening near the first electrode on the substrate is located within the projection of the optical film layer opening on the substrate.

18. The display substrate according to claim 17, characterized in that, When the filter layer further includes a color filter layer, the distance between the bottom surface of the black matrix near the pixel defining layer and the surface of the substrate facing the light-emitting layer is greater than the distance between the bottom surface of the color filter layer near the light-emitting layer and the surface of the substrate facing the light-emitting layer.

19. The display substrate according to claim 17, characterized in that, The projection of the organic light-emitting layer on the substrate is located within the projection of the first electrode on the substrate; There is a gap between the organic light-emitting layers in two adjacent sub-pixels with the same emission color; there is a gap between adjacent color filter layers with the same color.

20. The display substrate according to claim 17, characterized in that, The projection of the black matrix on the substrate is located within the projection of the pixel defining layer on the substrate, or the projection of the pixel defining layer on the substrate is located within the projection of the black matrix on the substrate.

21. The display substrate according to claim 17, characterized in that, It also includes a support pillar, which is located between the pixel defining layer and the encapsulation layer, and the projection of the support pillar on the substrate is located within the projection of the pixel defining layer on the substrate.

22. The display substrate according to claim 17, characterized in that, When the filter layer further includes a color filter layer, the projection of the bottom surface of the pixel defining layer opening near the first electrode onto the substrate is located within the projection of the color filter layer onto the substrate.

23. The display substrate according to claim 17, characterized in that, The encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic encapsulation layer is located on the light-emitting layer, the organic encapsulation layer is located on the side of the first inorganic encapsulation layer away from the light-emitting layer, and the second inorganic encapsulation layer is located on the side of the organic encapsulation layer away from the light-emitting layer. The filter layer is located between the first inorganic encapsulation layer and the organic encapsulation layer, or the filter layer is located between the organic encapsulation layer and the second inorganic encapsulation layer.

24. The display substrate according to claim 23, characterized in that, The projection of the organic encapsulation layer on the substrate is located within the projection of the first inorganic encapsulation layer on the substrate, and is also located within the projection of the second inorganic encapsulation layer on the substrate.

25. The display substrate according to claim 11, characterized in that, It also includes a protective layer located on the side of the optical film layer away from the encapsulation layer.

26. The display substrate according to claim 13, characterized in that, The optical film layer includes at least one of ferrous metal, ferrous organic material and ferrous inorganic material.

27. The display substrate according to claim 26, characterized in that, When the optical film layer includes the ferrous metal, the optical film layer includes molybdenum oxide.

28. The display substrate according to claim 27, characterized in that, The optical film is doped with thallium.

29. The display substrate according to claim 13, characterized in that, The thickness of the optical film is 10~55 nanometers.

30. The display substrate according to claim 15, characterized in that, The optical film layer includes scattering particles.

31. The display substrate according to claim 30, characterized in that, The scattering particles are made of zirconium oxide, and the radius of the scattering particles is less than or equal to 100 nanometers; or, The scattering particles are made of titanium dioxide, and the radius of the scattering particles is less than or equal to 200 nanometers.

32. The display substrate according to claim 30, characterized in that, The concentration of the scattering particles is less than or equal to 30%.

33. The display substrate according to claim 15, characterized in that, The optical film layer includes at least one of organic pigments and inorganic pigments.

34. The display substrate according to claim 15, characterized in that, The thickness of the optical film is 0.5 to 5.0 micrometers.

35. A display device, characterized in that, include: The display module and the display substrate as described in any one of claims 1 to 34.

Images