Sheet bonding alignment system

Abstract

The application relates to a sheet bonding alignment system, comprising an alignment mechanism, the alignment mechanism comprising a supporting platform and at least one pressing head; the supporting platform comprises a supporting end face and a rotating motor, a plurality of first vacuum adsorption holes are arranged on the supporting end face, and the rotating motor is used for driving the supporting end face to rotate relative to the pressing head; the pressing head is provided with a pressing surface, the pressing surface faces the supporting end face, and the distance between the pressing surface and the supporting end face is adjustable; the first vacuum adsorption holes are used for pre-adsorbing sheets to be bonded, the rotating motor drives the supporting end face to rotate, and the pressing head is used for pressing the sheets to be bonded adsorbed by the plurality of first vacuum adsorption holes respectively. The first vacuum adsorption holes increase the bonding alignment precision. The pressing head and the supporting end face automatically move, and the bonding efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of bonding equipment technology, and more particularly to a sheet bonding alignment system. Background Technology

[0002] Currently, micro light-emitting diode (micro LED) display panels, as a new generation of display technology, have advantages such as fast display response speed, higher brightness, better luminous efficiency, longer lifespan, and lower power consumption, making micro LEDs widely used.

[0003] Micro-LED display panels typically include multiple pixel regions, each containing red, blue, and green LED chips. During panel fabrication, these three types of chips need to be transferred from their respective growth substrates to a display backplane. The current transfer method involves: bonding the red LED chip to a temporary substrate; then laser-peeling the growth substrate of the red LED chip, transferring it to the temporary substrate; and finally, using a transfer substrate, transferring the red LED chip from the temporary substrate to the display backplane. The same method is used to transfer the blue and green LED chips. This multiple bonding and alignment transfer process to the display backplane is known as mass transfer. However, current bonding and alignment methods suffer from inconsistent alignment accuracy and low bonding efficiency. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this application is to provide an alignment mechanism and a sheet bonding alignment system provided with the alignment mechanism, which improves the alignment accuracy of the bonding process in mass transfer processes, such as the alignment accuracy of LED chips and display backplanes, and can improve bonding efficiency.

[0005] The sheet bonding alignment system provided in this application includes an alignment mechanism, which includes a support platform and at least one pressing head. The support platform includes a support end face and a rotary motor. The support end face is provided with a plurality of first vacuum adsorption holes. The rotary motor is used to drive the support end face to rotate relative to the pressing head. The pressing head is provided with a pressing surface facing the support end face. The distance between the pressing surface and the support end face is adjustable. The first vacuum adsorption holes are used to pre-adsorb the sheet to be bonded. The rotary motor drives the support end face to rotate. The pressing head is used to press the sheet to be bonded adsorbed by the plurality of first vacuum adsorption holes respectively.

[0006] The sheet bonding alignment system provided in this application embodiment has a plurality of first vacuum adsorption holes on the support platform. These first vacuum adsorption holes can pre-adsorb the sheet to be bonded placed on the support end face, thus fixing the sheet in place and preventing displacement, thereby ensuring the positioning accuracy of the sheet. Furthermore, using the first vacuum adsorption holes to adsorb the sheet also prevents the heating element from touching the sheet during upward movement, which could cause displacement and increase the positional accuracy of the sheet. This allows the bonding of the sheet to be bonded to be completed. By providing first vacuum adsorption holes on the support platform, the alignment accuracy of the sheet to be bonded is increased. By controlling the automatic movement of the pressing head and the automatic rotation of the support end face driven by the rotary motor, pressure is applied to the sheet to be bonded, thereby quickly completing the bonding process and improving bonding efficiency.

[0007] In some embodiments, a plurality of the first vacuum adsorption holes are evenly distributed in a circle around the rotation axis of the support end face.

[0008] In some embodiments, the support platform is provided with a chamber communicating with the first vacuum adsorption hole, and a heating element is provided in the chamber. The heating element is respectively corresponding to a plurality of the first vacuum adsorption holes, and the heating element is movable in a direction toward or away from the first vacuum adsorption holes. The heating element is used to heat the sheet to be bonded.

[0009] In some embodiments, the alignment mechanism includes two or more pressing heads, and the cavity is provided with two or more heating elements. Each pressing head and the corresponding heating element are used to press and heat the sheet to be bonded.

[0010] In some embodiments, the heating element has a heating end face facing the first vacuum adsorption hole and parallel to the supporting end face; the heating end face is used to contact the sheet to be bonded.

[0011] In some embodiments, a transfer mechanism is further included, the transfer mechanism including a gripping end face, the gripping end face being provided with a second vacuum adsorption hole; the second vacuum adsorption hole is used to adsorb the sheet to be bonded onto the gripping end face, and the transfer mechanism is used to place the adsorbed sheet to be bonded onto the supporting end face.

[0012] In some embodiments, the sheet bonding alignment system further includes an image acquisition device for acquiring an image of the sheet to be bonded adsorbed by the second vacuum adsorption orifice. This image is used to correct the position of the transfer mechanism when placing the sheet to be bonded onto the support end face.

[0013] In some embodiments, the pressing head is provided with a pressure sensor, which is used to detect the pressure value applied by the pressing surface to the sheet to be bonded;

[0014] The heating element is equipped with a temperature sensor, which is used to detect the temperature value at which the heating element heats the sheet to be bonded.

[0015] In some embodiments, the alignment system further includes: a lifter; the pressing head is connected to the lifter, and the lifter can drive the pressing head to move toward or away from the support platform, so that the distance between the pressing surface and the support end face is adjustable.

[0016] Alternatively, the alignment system may further include: a lifter; the support platform is connected to the lifter, and the lifter is capable of moving the support platform toward or away from the pressing head, so that the distance between the pressing surface and the support end face is adjustable.

[0017] Alternatively, the alignment mechanism may further include: a first lifter and a second lifter; the pressing head is connected to the first lifter, which can drive the pressing head to move toward or away from the support platform; the support platform is connected to the second lifter, which can drive the support platform to move toward or away from the pressing head; so that the distance between the pressing surface and the support end face is adjustable.

[0018] In some embodiments, the sheet bonding alignment system further includes a loading platform and a unloading platform, wherein the loading platform is used to support the sheet to be bonded; and the unloading platform is used to support the bonded sheet. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the sheet bonding alignment system provided in the first embodiment of this application.

[0020] Figure 2 yes Figure 1 A schematic diagram of the supporting platform.

[0021] Figure 3 This is a schematic diagram of the heating element and heat-conducting element arrangement structure provided in the first embodiment of this application.

[0022] Figure 4 This is a schematic diagram of the sheet bonding alignment system provided in the second embodiment of this application.

[0023] Figure 5 This is a schematic diagram of the sheet bonding alignment system provided in the third embodiment of this application.

[0024] Figure 6yes Figure 5 A schematic diagram of the supporting platform.

[0025] Figure 7 This is a schematic diagram of the sheet bonding alignment system provided in the fourth embodiment of this application.

[0026] Figure 8 yes Figure 7 A schematic diagram of the supporting platform.

[0027] Explanation of reference numerals in the attached figures:

[0028] 100, 100a, 100b - Alignment mechanism; 20, 20a, 20b - Support platform; 21 - First vacuum adsorption hole; 22 - Support end face; 24 - First vacuum adsorption hole; 26 - Rotary motor; 40 - Pressing head; 42 - Pressing surface; 50 - Heating element; 60 - Rotary motor; 70 - Heat conducting element; 72 - Adsorption hole; 80 - Lifter; 90 - Base; 200 - Transfer mechanism; 210 - Gripping end face; 220 - Second vacuum adsorption hole; 300 - Image acquisition device; 400 - Loading platform; 500 - Unloading platform; L - Rotary shaft. Detailed Implementation

[0029] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0031] Please refer to Figures 1 to 2 , Figure 1 This is a schematic diagram of the sheet bonding alignment system provided in the first embodiment of this application. Figure 2 yes Figure 1 A schematic diagram of the support platform is shown. In the first embodiment of this application, a sheet bonding alignment system includes an alignment mechanism 100; the alignment mechanism 100 includes a support platform 20 and at least one pressing head 40.

[0032] The support platform 20 includes a support end face 22 and a rotary motor 26. The support end face 22 is provided with a plurality of first vacuum adsorption holes 24. The rotary motor 26 is used to drive the support end face 22 to rotate relative to the pressing head 40. The pressing head 40 is provided with a pressing surface 42 facing the support end face 22. The distance between the pressing surface 42 and the support end face 22 is adjustable. The first vacuum adsorption holes 24 are used to pre-adsorb the sheets to be bonded. The rotary motor 26 drives the support end face 22 to rotate. The pressing head 40 is used to press the sheets to be bonded adsorbed by the plurality of first vacuum adsorption holes 24 respectively.

[0033] Specifically, the support platform 20 is provided with a plurality of first vacuum adsorption holes 24 penetrating the support end face 22 and a chamber communicating with the first vacuum adsorption holes 24; a heating element 50 is provided in the chamber, and the heating element 50 can correspond to the plurality of first vacuum adsorption holes 24 respectively; a rotary motor 26 is provided in the chamber, and the heating element 50 can move toward or away from the first vacuum adsorption holes 24, and the heating element 50 is used to heat the sheet to be bonded; the rotary motor 26 is used to drive the support end face 22 to rotate relative to the pressing head 40, so that the pressing surface 42 and the heating element 50 both face the first vacuum adsorption holes 24 on which the sheet to be bonded is adsorbed, the distance between the pressing surface 42 and the support end face 22 is adjustable, and the distance between the heating element 50 and the first vacuum adsorption holes 24 is adjustable, so that the pressing surface 42 presses the sheet to be bonded, and the heating element 50 heats the sheet to be bonded.

[0034] The bonding sheet includes a first sheet and a second sheet. After the first sheet is placed in the first vacuum adsorption hole 24, the first vacuum adsorption hole 24 is used to pre-adsorb the first sheet. The second sheet is stacked on the adsorbed first sheet. The rotary motor 26 drives the support end face 22 to rotate so that the first sheet faces the heating element 50. After the heating element 50 moves towards the first vacuum adsorption hole 24 and contacts the first sheet, the heating element 50 heats up and the distance between the pressing surface 42 and the support end face 22 shortens, so that the pressing surface 42 applies pressure to the second sheet.

[0035] The detailed steps are as follows:

[0036] S10: Place a first sheet on the support end face 22, the first sheet corresponding to the first vacuum adsorption hole 24; the first vacuum adsorption hole 24 pre-adsorbs the first sheet. Specifically, in one embodiment, when the pressing head 40 is away from the support end face 22, the support end face 22 does not rotate, and the first sheet is placed on each of the first vacuum adsorption holes 21 on the support end face 22; in another embodiment, after placing the first sheet on one of the first vacuum adsorption holes 24 on the support end face 22, the rotary motor 26 drives the support end face 22 to rotate, and the first sheet is placed on the other first vacuum adsorption hole 24 at the next station, and the above steps are repeated until the first sheet is placed on each of the first vacuum adsorption holes 21.

[0037] S11: A second sheet is laminated on top of the first sheet.

[0038] S12: The heating element 50 moves to contact one of the first sheets.

[0039] S13: The heating element 50 begins to heat up, shortening the distance between the pressing surface 42 and the supporting end face 22, thus heating and pressurizing the first and second sheets. It is understandable that after the heating element 50 moves to contact the first sheet and begins to heat up, it can be controlled to continue moving upwards until it slightly extends beyond the first vacuum suction hole 24, allowing the heating element 50 to support and press the first and second sheets together. Alternatively, the heating element 50 can move upwards until a larger portion extends beyond the first vacuum suction hole 24, thus driving the first sheet upwards and allowing it to quickly approach the pressing surface 42.

[0040] S14: The heating element 50 moves to disengage from one of the first sheets, the pressing head 40 moves to disengage from the second sheet, and the support platform 20 rotates so that the other first sheet faces the heating element 50; then, following steps S12 to S13 above, the other first sheet is bonded to the second sheet; until the first sheet on each of the first vacuum adsorption holes 24 on the support end face 22 is bonded to the second sheet.

[0041] The first sheet can be an LED wafer, and the second sheet can be a display backplane. The display backplane is stacked on the LED wafer. After being heated and pressurized, the LED wafer can be soldered onto the display backplane, that is, the LED wafer and the display backplane are bonded together.

[0042] In another example, the fabrication process of micro-electro-mechanical systems (MEMS) typically employs silicon wafer bonding technology, with silicon wafers bonded to sapphire wafers being one of the most common silicon wafer bonding techniques. Therefore, the first wafer mentioned above can be a silicon wafer, and the second wafer can be sapphire.

[0043] In another example, the manufacturing process of integrated circuits typically employs silicon wafer bonding technology. Therefore, the first wafer mentioned above can be a silicon wafer, and the second wafer can also be a silicon wafer.

[0044] When the first sheet is a silicon wafer and the second sheet is sapphire or a silicon wafer, the above "S11: stacking a second sheet on the first sheet" specifically includes: in some embodiments, with the pressing head 40 away from the support end face 22, the support end face 22 does not rotate, and a second sheet is placed on each of the first sheets on the support end face 22; in some embodiments, after placing a second sheet on one of the first sheets on the support end face 22, the rotary motor 26 drives the support end face 22 to rotate, and another second sheet is stacked on another first sheet at the next station, repeating the above steps until a first sheet is placed on each of the first vacuum adsorption holes 21; when another second sheet is stacked on the corresponding first sheet, the heating element 50 moves to contact the first sheet it faces, the heating element 50 starts to heat up, and the distance between the pressing surface 42 and the support end face 22 is shortened, heating and pressurizing the first sheet and the second sheet, thereby improving the bonding efficiency between the first sheet and the second sheet.

[0045] Other examples could include glass-to-glass bonding, silicon-to-silicon bonding, metal-to-metal bonding, or silicon-to-glass bonding, silicon-to-metal bonding, etc. The metal can be gold (Au). That is, the wafer bonding alignment system provided in this application embodiment can be applied to any bonding process, and this application is not limited thereto.

[0046] For ease of description, this application uses the first sheet as an LED chip and the second sheet as a display backplane as an example.

[0047] The sheet bonding and alignment system provided in the first embodiment of this application has a plurality of first vacuum adsorption holes 24 provided on the support platform 20. The plurality of first vacuum adsorption holes 24 are evenly distributed in a circle with the rotation axis L of the support end face 22 as the axis. The first vacuum adsorption holes 24 can pre-adsorb the LED chip placed on the support end face 22, that is, the first vacuum adsorption holes 24 are used to fix the LED chip. So when the display back plate is stacked on the LED chip, the LED chip will not shift, thus ensuring the alignment accuracy between the LED chip and the display back plate. In addition, using the first vacuum adsorption holes 24 to pre-adsorb the LED chip can also prevent the heating element 50 from touching the first sheet when it moves upward, causing the first sheet to shift, thus increasing the positional accuracy of the LED chip.

[0048] by Figure 1With the direction in the middle as a reference, the heating element 50 can be moved along the Z-axis to contact the first sheet, thereby heating the first and second sheets that need to be bonded. The pressing head 40 can be moved along the Z-axis to contact the second sheet. As the pressing head 40 continues to move towards the support end face 22 along the Z-axis, the pressing head 40 and the heating element 50 cooperate to apply pressure to the first and second sheets, while the heating element 50 heats the first and second sheets. Thus, the bonding of one of the first and second sheets is completed. The rotary motor 26 drives the support end face 22 to rotate relative to the pressing head 40 so that the other first vacuum adsorption hole 22 faces the heating element 50 and the pressing surface 42, that is, the first sheet of the other first vacuum adsorption hole 22 faces the heating element 50. At this time, the heating element 50 can move along the Z-axis to contact the first sheet, thereby heating the first sheet and the second sheet that need to be bonded. The pressing head 40 can move along the Z-axis to contact the second sheet. When the pressing head 40 continues to move towards the support end face 22 along the Z-axis, the pressing head 40 and the heating element 50 cooperate to apply pressure to the first sheet and the second sheet, while the heating element 50 heats the first sheet and the second sheet. The above steps are repeated until all the first sheets on the support end face 22 are bonded to the second sheet.

[0049] As can be seen from the above, the sheet bonding alignment system provided in the first embodiment of this application increases the alignment accuracy of the two sheets to be bonded by setting the first vacuum adsorption hole 24 on the support platform 20. By controlling the automatic movement of the pressing head 40 and the heating element 50, the sheets to be bonded are heated and pressurized, thereby quickly completing the bonding process and improving the bonding efficiency. By driving the support end face 22 to rotate by the rotary motor 26, each first vacuum adsorption hole 24 faces the heating element 50 and the pressing head 40, so that the first sheet on the first vacuum adsorption hole 24 can bond with the second sheet, which not only has high alignment accuracy but also improves the bonding efficiency.

[0050] refer to Figure 3 , combined Figure 1 and Figure 2 , Figure 3 This is a schematic diagram of the heating element 50 and heat-conducting element 70 provided in the first embodiment of this application. In some embodiments, the cavity of the support platform 20 is further provided with a heat-conducting element 70, which is fixedly connected to the heating element 50. The heat-conducting element 70 is provided with an adsorption hole 72 corresponding to the first vacuum adsorption hole 24. The heating element 50 and the heat-conducting element 70 can move simultaneously towards or away from the first vacuum adsorption hole 24 along the Z-axis. After a second sheet is stacked on the first sheet that has been adsorbed, the heating element 50 and the heat-conducting element 70 move simultaneously towards the first vacuum adsorption hole 24 until the heat-conducting element 70 contacts the first sheet and the adsorption hole 72 adsorbs the first sheet; then the heating element 50 generates heat.

[0051] The heat-conducting element 70 can be made of a heat-conducting metal. The heat-conducting element 70 and the heating element 50 are fixed together. The heating element 50 can move up and down along the Z-axis. Therefore, the heat-conducting element 70 can move up and down simultaneously with the heating element 50. When the heating element 50 needs to heat the first and second sheets for bonding, the heating element 50 and the heat-conducting element 70 move upwards simultaneously along the Z-axis until the heat-conducting element 70 contacts the first sheet, and the adsorption hole 72 adsorbs the first sheet. At this time, the heat-conducting element 70 can transfer the heat emitted by the heating element 50 to the first sheet, and the adsorption hole 72 enhances the stability of the first sheet. Thus, it can provide heat smoothly for bonding the first and second sheets and increase the stability of the first sheet, thereby ensuring accurate alignment.

[0052] Specifically, the heat-conducting element 70 can be located between the heating element 50 and the first vacuum adsorption hole 24. The heat-conducting element 70 is away from the heating element 50, that is, the side facing the first vacuum adsorption hole 24 is provided with an adsorption hole 72. The adsorption hole 72 is connected to a relatively sealed cavity on the heating element 50. Then, by connecting a vacuum source to the cavity, an adsorption force can be provided to the adsorption hole 72.

[0053] like Figure 1 and Figure 2 As shown, the distance between the pressing surface 42 and the supporting end face 22 is adjustable, specifically requiring the movement of the pressing head 40 and the supporting platform 20 for adjustment. In some embodiments, the alignment mechanism 100 further includes a lifter 80; the pressing head 40 is connected to the lifter 80, which can drive the pressing head 40 to move towards or away from the supporting platform 20 along the Z-axis, so that the distance between the pressing surface 42 and the supporting end face 22 is adjustable. When the pressing surface 42 needs to cooperate with the heating element 50 to press the first sheet and the second sheet, the lifter 80 can drive the pressing head 40 towards the supporting platform 20; after pressing is completed, the lifter 80 can drive the pressing head 40 away from the supporting platform 20 to prevent the pressing head 40 from interfering with the placement of the first sheet and the second sheet on the supporting end face 22. That is, by moving the pressing head 40 through the lifter 80, the pressing head 40 can be moved towards or away from the supporting platform 20 along the Z-axis, increasing the degree of automation and improving bonding efficiency.

[0054] In other embodiments, the alignment mechanism 100 further includes a lifter; a support platform 20 is connected to the lifter, which can move the support platform 20 along the Z-axis towards or away from the pressing head 40, so that the distance between the pressing surface 42 and the support end face 22 is adjustable. When the pressing surface 42 needs to cooperate with the heating element 50 to press the first sheet and the second sheet, the lifter can move the support platform 20 towards the pressing head 40; after pressing is completed, the lifter can move the support platform 20 away from the pressing head 40. That is, by moving the support platform 20 through the lifter, the support platform 20 can be moved towards or away from the pressing head 40, increasing the degree of automation and improving bonding efficiency.

[0055] In some embodiments, the alignment mechanism 100 further includes a first lifter and a second lifter; the pressing head 40 is connected to the first lifter, which can drive the pressing head 40 to move towards or away from the support platform 20 along the Z-axis; the support platform 20 is connected to the second lifter, which can drive the support platform 20 to move towards or away from the pressing head 40 along the Z-axis; so that the distance between the pressing surface 42 and the support end face 22 is adjustable. When the pressing surface 42 needs to cooperate with the heating element 50 to press the first sheet and the second sheet, the first lifter can drive the pressing head 40 to move towards the support platform 20, and the second lifter can drive the support platform 20 to move towards the pressing head 40; after pressing is completed, the first lifter can drive the pressing head 40 away from the support platform 20, and the second lifter can drive the support platform 20 away from the pressing head 40. Therefore, when pressing is required, the distance between the pressing surface 42 and the supporting end face 22 can be quickly shortened; after pressing is completed, the distance between the pressing surface 42 and the supporting end face 22 can be quickly widened to prevent the pressing head 40 from interfering with the transfer mechanism 200, thereby accelerating production efficiency.

[0056] In some embodiments, the alignment mechanism 100 may further include a base 90, which can be used to install a control system and support the support platform 20, the lifter 80, and the pressing head 40, etc.; the alignment control system is used to control the heating element 50, the rotary motor 26, and the lifter 80, etc.

[0057] refer to Figure 4 , Figure 4This is a schematic diagram of the sheet bonding alignment system provided in the second embodiment of this application. The sheet bonding alignment system in the second embodiment further includes a transfer mechanism 200 based on the first embodiment. The transfer mechanism 200 includes a gripping end face 210, on which a second vacuum adsorption hole 220 is provided. The second vacuum adsorption hole 220 is used to adsorb the first sheet onto the gripping end face 210. The transfer mechanism 200 is used to place the adsorbed first sheet onto a supporting end face 22, with the first sheet corresponding to the first vacuum adsorption hole 24. The second vacuum adsorption hole 220 is also used to adsorb the second sheet onto the gripping end face 210 after the first sheet is placed on the supporting end face 22. The transfer mechanism 200 is also used to stack the adsorbed second sheet onto the first sheet.

[0058] The transfer mechanism 200 can specifically be a six-axis robot, whose robotic arm can move in six dimensions. Specifically, the six-axis robot has six axes, each driven by a motor equipped with a reducer. Each axis has a different movement mode and direction, simulating the movements of various joints in a human hand. This allows for more precise grasping of the first and second sheets, more precise alignment of the first sheet with the first vacuum suction hole 24, and more precise stacking of the second sheet with the first sheet.

[0059] The transfer mechanism 200 can automatically transfer the first sheet to the support end face 22 and can automatically transfer the second sheet to be stacked on the first sheet, realizing automated operation and making mass production highly feasible.

[0060] Of course, those skilled in the art will understand that the gripping end face 210 and the supporting end face 22 can be configured to have the same shape, and the distribution of the second vacuum adsorption holes 220 on the supporting end face 22 can be configured to be the same as the distribution of the first vacuum adsorption holes 24 on the gripping end face 210. Thus, when the gripping end face 210 grips the first sheet, and the gripping end face 210 is aligned with the supporting end face 22 (i.e., the projection of the gripping end face 210 coincides with the supporting end face 22), the adsorption force of the first vacuum adsorption holes 24 is eliminated, and the first sheet is placed on the supporting end face 22. At this time, the first sheet corresponds exactly to the second vacuum adsorption holes 220. The distribution of the first vacuum adsorption holes 24 and the second vacuum adsorption holes 220 includes shape, size, and spacing, etc. The second sheet is layered on top of the first sheet in the same manner. As can be seen from the above, by setting the gripping end face 210 and the supporting end face 22 to have the same shape, and setting the distribution of the second vacuum adsorption holes 220 on the supporting end face 22 to be the same as the distribution of the first vacuum adsorption holes 24 on the gripping end face 210, the alignment accuracy of the first sheet and the second sheet can be increased.

[0061] Of course, in other embodiments, the gripping end face 210 and the supporting end face 22 may be configured to have different shapes.

[0062] It is important to understand that when the transfer mechanism 200 needs to place the first sheet on the support end face 22 or stack the second sheet on the first sheet, there needs to be sufficient distance between the pressing head 40 and the support platform 20 to prevent the pressing head 40 from interfering with the operation of the transfer mechanism 200. That is, the distance between the pressing head 40 and the support platform 20 needs to be adjusted to be relatively large. In some embodiments, the length of the pressing head 40 extending in the X direction is small, that is, the length of the pressing head 40 extending in the X direction only covers a portion of the support platform 20. Therefore, it is only necessary to adjust the distance between the pressing head 40 and the support platform 20 to be relatively close to enable the transfer mechanism 200 to place the first and second sheets on the support platform 20. In this embodiment, the pressing head 40 faces one of the first vacuum suction holes 24 on the support platform 20, and the rotary motor 26 drives the support platform 20 to rotate, so as to facilitate the transfer mechanism 200 in placing the first and second sheets on the support platform 20.

[0063] In a sheet alignment and bonding system equipped with a transfer mechanism 200, the specific bonding steps are as follows:

[0064] The detailed steps are as follows:

[0065] S20: The gripping end face 210 grips the first sheet using the second vacuum adsorption hole 220.

[0066] S21: The transfer mechanism 200 places a first sheet on the support end face 22, the first sheet corresponding to the first vacuum adsorption hole 24; the first vacuum adsorption hole 24 adsorbs the first sheet. Specifically, in one embodiment, when the pressing head 40 is away from the support end face 22, the support end face 22 does not rotate, and the transfer mechanism 200 places the first sheet on each of the first vacuum adsorption holes 21 on the support end face 22; in another embodiment, after the transfer mechanism 200 places the first sheet on one of the first vacuum adsorption holes 24 on the support end face 22, the rotary motor 26 drives the support end face 22 to rotate, and places the first sheet on the other first vacuum adsorption hole 24 at the next station, repeating the above steps until the first sheet is placed on each of the first vacuum adsorption holes 21.

[0067] S22: The gripping end face 210 grips the second sheet using the second vacuum adsorption hole 220.

[0068] S23: The transfer mechanism 200 stacks a second sheet on the first sheet. Specifically, in some embodiments, if the second sheet is a display backplate, the pressing head 40 is away from the support end face 22, the support end face 22 does not need to rotate, and the transfer mechanism 200 places the second sheet on the first sheet on the support end face 22. In some embodiments, if the second sheet is a silicon wafer or a sapphire wafer, the pressing head 40 is away from the support end face 22, the support end face 22 does not need to rotate, and the transfer mechanism 200 places the second sheet on all the first sheets on the support end face 22 respectively; or after the transfer mechanism 200 places the second sheet on one of the first sheets on the support end face 22, the rotary motor 26 drives the support end face 22 to rotate, and places the second sheet on another first sheet at the next station, repeating the above steps until the second sheet is placed on each first sheet.

[0069] S24: The heating element 50 moves to contact the first sheet.

[0070] S25: The heating element 50 starts to heat up, which shortens the distance between the pressing surface 42 and the supporting end surface 22, and heats and pressurizes the first sheet and the second sheet.

[0071] S26: The heating element 50 moves to disengage from one of the first sheets, the pressing head 40 moves to disengage from the second sheet, and the support platform 20 rotates so that the other first sheet faces the heating element 50; then, following steps S24 to S25 above, the other first sheet is bonded to the second sheet; until the first sheet on each of the first vacuum adsorption holes 24 on the support end face 22 is bonded to the second sheet.

[0072] In some embodiments, reference Figure 4 The sheet bonding alignment system further includes an image acquisition device 300 and a control system. The image acquisition device 300 and the transfer mechanism 200 are electrically connected to the control system. The image acquisition device 300 is used to acquire an image of the sheet to be bonded adsorbed by the second vacuum adsorption hole 220. The image is used to correct the position of the transfer mechanism 200 placing the sheet to be bonded on the support end face 22. Specifically, before the transfer mechanism 200 places the adsorbed first sheet on the support end face 22, the image acquisition device 300 acquires a first image of the first sheet adsorbed by the second vacuum adsorption hole 220 onto the gripping end face 210, and then sends the first image to the control system. After receiving the first image, the control system identifies the first coordinates of the first sheet in the first image, compares the first coordinates with the reference coordinates, and determines a first position correction coefficient based on the comparison result. The first position correction coefficient is used to correct the position of the transfer mechanism 200 placing the first sheet on the support end face 22.

[0073] Before the transfer mechanism 200 stacks the adsorbed second sheet onto the first sheet, the image acquisition device 300 also acquires a second image of the second vacuum adsorption hole 220 adsorbing the second sheet onto the gripping end face 210, and then sends the second image to the control system. After receiving the second image, the control system identifies the second coordinates of the second sheet in the second image, compares the second coordinates with the reference coordinates, and confirms the second position correction coefficient based on the comparison result. The second position correction coefficient is used to correct the position of the transfer mechanism 200 stacking the second sheet onto the first sheet.

[0074] The image acquisition device 300 described above can be a camera, video camera, mobile phone with a camera, tablet computer with a camera, etc. This application does not impose any limitations. The video camera described above can be a charge-coupled device (CCD) camera.

[0075] An image acquisition device 300 is set up. Before the transfer mechanism 200 places the first sheet onto the support end face 22, the transfer mechanism 200 passes by the image acquisition device 300 so that the image acquisition device 300 can take a picture of the gripping end face 210 of the transfer mechanism 200, thereby acquiring an image of the gripping end face 210 with the first sheet adsorbed. After the image is sent to the control system, the control system can identify the coordinates of the first sheet relative to the gripping end face 210, and then compare these coordinates with the reference coordinates. If there is a deviation, the position of the transfer mechanism 200 placing the first sheet on the support end face 22 needs to be adjusted. Specifically, a first position correction coefficient can be calculated based on the comparison result, and this first position correction coefficient can be used to control the position of the transfer mechanism 200 when transferring the first sheet to the support end face 22. The second sheet is corrected in the same way, which will not be described in detail here. This can increase the alignment accuracy.

[0076] Taking the XY coordinate system as the reference system, the coordinates of the first sheet are 1.1X - 1Y, while the reference coordinates are 1X - 1Y. This means the coordinate error of the first sheet is 0.1X. Therefore, the first position correction coefficient can be -0.1X. More specifically, 0.1X represents the rightward deviation of the first sheet, so the first position correction coefficient is 0.1X to the left. This allows for position correction and increases alignment accuracy.

[0077] As can be seen from the above, by setting the image acquisition device 300, the positions of the first sheet and the second sheet can be corrected, thereby improving the alignment accuracy.

[0078] In the sheet alignment and bonding system equipped with a transfer mechanism 200 and an image acquisition device 300, the specific bonding steps are as follows:

[0079] The detailed steps are as follows:

[0080] S30: The gripping end face 210 grips the first sheet using the second vacuum adsorption hole 220.

[0081] S31: The robotic arm of the transfer mechanism 200 moves so that the gripping end face 210 is facing the lens of the image acquisition device 300. The image acquisition device 300 acquires an image of the gripping end face 210 with the first sheet adsorbed on it, and then sends the image to the control system.

[0082] S32: After receiving the image, the control system identifies the coordinates of the first sheet, compares the identified coordinates with the reference coordinates, and calculates the first position correction coefficient based on the comparison result.

[0083] S33: Based on the first position correction coefficient, the control system controls the transfer mechanism 200 to place the first sheet on the support end face 22, the first sheet corresponding to the first vacuum adsorption hole 24; the first vacuum adsorption hole 24 adsorbs the first sheet.

[0084] S34: The gripping end face 210 grips the second sheet using the second vacuum adsorption hole 220.

[0085] S35: The robotic arm of the transfer mechanism 200 moves so that the gripping end face 210 is facing the lens of the image acquisition device 300. The image acquisition device 300 acquires an image of the gripping end face 210 with the second sheet adsorbed, and then sends the image to the control system.

[0086] S36: After receiving the image, the control system identifies the coordinates of the second sheet, compares the identified coordinates with the reference coordinates, and calculates the second position correction coefficient based on the comparison result.

[0087] S37: The control system uses the second position correction coefficient to control the transfer mechanism 200 to stack the second sheet on the first sheet.

[0088] S38: The control system controls the heating element 50 to move to contact the first sheet.

[0089] S39: The control system controls the heating element 50 to start heating and controls the distance between the pressing surface 42 and the supporting end surface 22 to shorten, thereby heating and pressurizing the first sheet and the second sheet.

[0090] In some embodiments, the heating element 50 is provided with a heating end face, which faces the first vacuum adsorption hole 24 and is parallel to the support end face 22; the heating end face is used to contact the sheet to be bonded, that is, the heating end face is used to contact the first sheet. By providing a heating end face, the heating element 50 can make surface-to-surface contact with the first sheet, thereby increasing the contact area and allowing the heat from the heating element 50 to be better transferred to the first sheet, and then to the second sheet, thereby making the first and second sheets heated evenly and improving the welding reliability.

[0091] like Figure 4 As shown, the sheet bonding and alignment system also includes a loading table 400, which supports the sheets to be bonded. Specifically, the loading table 400 supports and fixes a first substrate to which the first sheet is attached before the first sheet is placed on the support end face 22; the loading table 400 also supports and fixes a second sheet or a second substrate to which the second sheet is attached before the second sheet is laminated onto the first sheet. It is understood that when the second sheet is a display backplate, the second substrate is not required for support, and the display backplate can be directly fixed to the loading table 400. When the second sheet is another material that is not convenient to be directly fixed to the loading table 400, a second substrate is required for support.

[0092] A clamp can be installed on the loading table 400. When the first substrate is placed on the loading table 400, the clamp can hold the first substrate, thereby fixing it in place. The first substrate can be a transfer substrate that carries LED chips. Similarly, when the second substrate is placed on the loading table 400, the clamp can hold the second substrate, thereby fixing it in place. By setting up the loading table 400, the first and second sheets can be temporarily stored before they are picked up by the transfer mechanism 200, increasing ease of use and improving manufacturing efficiency.

[0093] In some embodiments, reference Figure 4 The sheet bonding alignment system further includes a feeding table 500, which supports the bonded sheets. Specifically, the feeding table 500 supports the first and second sheets after they have been bonded under heat and pressure. After the first and second sheets are bonded, the transfer mechanism 200 can use the gripping end face 210 and the second vacuum suction hole 220 to transfer the bonded finished product to the feeding table 500 for temporary storage, thereby increasing operational convenience.

[0094] In some embodiments, the pressing head 40 is equipped with a pressure sensor to detect the pressure applied by the pressing surface 42 to the second sheet. The heating element 50 is equipped with a temperature sensor to detect the temperature at which the heating element 50 heats the sheet to be bonded. Exemplarily, both the pressure sensor and the temperature sensor are electrically connected to the control system described above. The detected pressure and temperature values ​​can be fed back to the control system. When the control system detects that the pressure value is within a reference pressure range, it can control the distance between the pressing head 40 and the support platform 20 to stop changing, that is, it can control the lifting device 80 to stop operating, or control the first and second lifting devices to stop operating. When the control system detects that the temperature of the heating element 50 is within a reference temperature range, it controls the heating element 50 to stop heating. This prevents damage to the first and second sheets due to overheating or overpressure.

[0095] Please read this together. Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of the sheet bonding alignment system provided in the third embodiment of this application; Figure 6 yes Figure 5 A schematic diagram of the structure of the support platform 20a is shown. The sheet bonding alignment system provided in the third embodiment of this application is similar to the sheet bonding alignment system in the second embodiment, except that: in the third embodiment, the alignment mechanism 100a includes two pressing heads 40, the support platform 20a is provided with two or more first vacuum adsorption holes 24, and the cavity of the support platform 20a is provided with two heating elements 50 corresponding one-to-one with the two pressing heads 40. Each pressing head 40 and the corresponding heating element 50 are used to press and heat the sheet to be bonded. Specifically, two lifting devices 80 are provided at intervals around the support platform 20a on the base 90, and each lifting device 80 is connected to a pressing head 40. The pressing surfaces 42 of the two pressing heads 40 are respectively facing the two first vacuum adsorption holes 24 of the support platform 20a, and the two heating elements 50 are respectively facing the pressing surfaces 42 of the two pressing heads 40. The angle formed by the lines connecting the two first vacuum adsorption holes 24 that are respectively opposite to the two pressing surfaces 42 and the rotation axis L of the support platform 20a is equal to the angle formed by the lines connecting the two heating elements 50 that are respectively opposite to the two first vacuum adsorption holes 24 and the rotation axis L of the support platform 20a.

[0096] In this embodiment, the support end face 22 is provided with six first vacuum adsorption holes 24. The six first vacuum adsorption holes 24 are evenly spaced in a circle with the rotation axis L of the support platform 20a as the axis, that is, the angle between the line connecting each pair of adjacent first vacuum adsorption holes 24 and the rotation axis L of the support platform 20a is 60 degrees. Two pressing surfaces 42 are directly opposite two first vacuum adsorption holes 24 separated by one first vacuum adsorption hole 24, and two heating elements 50 are directly opposite two first vacuum adsorption holes 24 separated by one first vacuum adsorption hole 24. The angle between the line connecting the two first vacuum adsorption holes 24 directly opposite the two pressing surfaces 42 and the rotation axis L of the support platform 20a is 120 degrees; the angle between the line connecting the two first vacuum adsorption holes 24 directly opposite the two heating elements 50 and the line connecting the two first vacuum adsorption holes 24 and the rotation axis L of the support platform 20a is 120 degrees.

[0097] The specific bonding steps of the sheet alignment bonding system in the third embodiment are as follows:

[0098] S50: The gripping end face uses the second vacuum adsorption hole to grip the first sheet.

[0099] S51: The transfer mechanism 200 places a first sheet on the support end face 22, the first sheet corresponding to the first vacuum adsorption hole 24; the first vacuum adsorption hole 24 adsorbs the first sheet. Specifically, after the transfer mechanism 200 places the first sheet on one of the first vacuum adsorption holes 24 on the support end face 22, the rotary motor 26 drives the support end face 22 to rotate, and places the first sheet on the other first vacuum adsorption hole 24 at the next station, repeating the above steps until the first sheet is placed on each of the first vacuum adsorption holes 21.

[0100] S52: The gripping end face uses the second vacuum adsorption hole to grip the second sheet.

[0101] S53: The transfer mechanism 200 stacks the second sheet on the first sheet.

[0102] S54: The heating element 50 moves to contact the first sheet. Specifically, in some embodiments, the two heating elements 50 move together to contact the two first sheets; in some embodiments, the two heating elements 50 may move separately to contact the corresponding first sheet.

[0103] S55: The heating element 50 begins to heat up, shortening the distance between the pressing surface 42 and the supporting end face 22, thus heating and pressurizing the first sheet and the second sheet. Specifically, in some embodiments, the two heating elements 50 can heat up simultaneously, and the two pressing surfaces 42 together press against the second sheet, so that the two first sheets and the second sheet are heated and pressurized simultaneously; in some embodiments, the two heating elements 50 heat up separately, and the two pressing surfaces 42 respectively press against the second sheet, so that the two first sheets and the second sheet are heated and pressurized separately.

[0104] S56: The heating element 50 moves to disengage from one of the first sheets, the pressing head 40 moves to disengage from the second sheet, and the support platform 20 rotates so that the other first sheet faces the heating element 50; specifically, in some embodiments, both heating elements 50 move simultaneously to disengage from their corresponding two first sheets, and both pressing heads 40 move simultaneously to disengage from their second sheets. Then, following steps S54 to S55 above, the other two first sheets are bonded to the second sheet; until the first sheet on each of the first vacuum suction holes 24 of the support end face 22 is bonded to the second sheet.

[0105] In this embodiment, the two heating elements 50 of the sheet bonding alignment system can simultaneously bond two first sheets and two second sheets, thereby improving the bonding efficiency; or, while one heating element 50 and the corresponding pressing head 40 are bonding the corresponding first sheet and second sheet, the transfer mechanism 200 places the first sheet on another first vacuum adsorption hole 24 and stacks the second sheet on the first sheet, thereby improving the bonding efficiency.

[0106] In some embodiments, the angle between the lines connecting the two first vacuum adsorption holes 24 that are respectively opposite to the two pressing surfaces 42 and the rotation axis L of the support platform is equal to the angle between the two adjacent first vacuum adsorption holes 24 and the rotation axis L; the angle between the lines connecting the two heating elements 50 that are respectively opposite to the two first vacuum adsorption holes 24 and the rotation axis L of the support platform is equal to the angle between the two adjacent first vacuum adsorption holes 24 and the rotation axis L.

[0107] In some embodiments, the angle between the lines connecting the two first vacuum adsorption holes 24 that are respectively opposite to the two pressing surfaces 42 and the rotation axis L of the support platform is equal to 180 degrees; the angle between the lines connecting the two heating elements 50 that are respectively opposite to the two first vacuum adsorption holes 24 and the rotation axis L of the support platform is equal to 180 degrees.

[0108] Please read this together. Figure 7 and Figure 8 , Figure 5 This is a schematic diagram of the sheet bonding alignment system provided in the fourth embodiment of this application; Figure 8 yes Figure 7A schematic diagram of the support platform 20b is shown. The sheet bonding alignment system provided in the fourth embodiment of this application is similar to the sheet bonding alignment system in the third embodiment, except that: the alignment mechanism 100b in the fourth embodiment includes two or more pressing heads 40, and the number of first vacuum adsorption holes 24 on the support platform 20b is greater than the number of pressing heads 40, that is, the number of first vacuum adsorption holes 24 on the support platform 20b is at least one more than the number of multiple pressing heads 40; the cavity of the support platform 20b is provided with two or more heating elements 50 corresponding to the two or more pressing heads 40, and each pressing head 40 and the corresponding heating element 50 are used to press and heat the sheet to be bonded. In this embodiment, the alignment mechanism 100b includes three pressing heads 40, the support platform 20b is provided with three or more first vacuum adsorption holes 24, and the cavity of the support platform 20b is provided with three heating elements 50 corresponding to the three pressing heads 40. Specifically, three lifting devices 80 are spaced apart around the support platform 20b on the base 90. Each lifting device 80 is connected to a pressing head 40. The pressing surfaces 42 of the three pressing heads 40 are respectively aligned with the three first vacuum adsorption holes 24 of the support platform 20b. The three heating elements 50 are respectively aligned with the pressing surfaces 42 of the three pressing heads 40. The angle formed by the lines connecting the two first vacuum adsorption holes 24 opposite each of the two adjacent pressing surfaces 42 to the rotation axis L of the support platform 20b is equal to the angle formed by the lines connecting the two first vacuum adsorption holes 24 opposite each of the two adjacent heating elements 50 to the rotation axis L of the support platform 20a.

[0109] In this embodiment, the support end face 22 is provided with six first vacuum adsorption holes 24. The six first vacuum adsorption holes 24 are arranged in a circle with the rotation axis L of the support platform 20b as the center, that is, the angle between the line connecting each two adjacent first vacuum adsorption holes 24 and the rotation axis L of the support platform 20b is 60 degrees. The three pressing surfaces 42 are respectively facing the three spaced-apart first vacuum adsorption holes 24, and the three heating elements 50 are respectively facing the three spaced-apart first vacuum adsorption holes 24. The angle between the line connecting each two adjacent pressing surfaces 42 and the two adjacent first vacuum adsorption holes 24 and the rotation axis L of the support platform 20b is 120 degrees; the angle between the line connecting each two adjacent heating elements 50 and the two adjacent first vacuum adsorption holes 24 and the rotation axis L of the support platform 20b is 120 degrees.

[0110] The specific bonding steps of the sheet alignment bonding system in the fourth embodiment are the same as those in the sheet alignment bonding system in the third embodiment, and will not be described again here.

[0111] In this embodiment, the three heating elements 50 of the sheet bonding alignment system can simultaneously bond three first sheets to two sheets, thereby improving the bonding efficiency; or, while at least one heating element 50 and the corresponding pressing head 40 are bonding the corresponding first sheet to the second sheet, the transfer mechanism 200 places the first sheet on another first vacuum adsorption hole 24 and stacks the second sheet on the first sheet, thereby improving the bonding efficiency.

[0112] For example, the support platform is provided with multiple first vacuum adsorption holes 24, and the cavity of the support platform is provided with multiple heating elements 50 corresponding to the multiple first vacuum adsorption holes 24 one by one. Here, "multiple" means two or more. Because the number of materials to be transferred in batches is very large, multiple first vacuum adsorption holes 24 are correspondingly provided. Each first vacuum adsorption hole 24 corresponds to adsorbing one first sheet, which can be used for batch processing, thereby increasing efficiency. It can be understood that the cavity in the support platform 20 is connected to all the first vacuum adsorption holes 24. The cavity is relatively sealed. Therefore, only a vacuum source needs to be connected to the cavity to provide adsorption force for all the first vacuum adsorption holes 24.

[0113] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A sheet bonding alignment system, characterized in that, include: Alignment mechanism; the alignment mechanism includes a support platform and at least one pressing head; The support platform includes a support end face and a rotary motor. The support end face has a plurality of first vacuum adsorption holes. The rotary motor drives the support end face to rotate relative to the pressing head. The plurality of first vacuum adsorption holes are evenly distributed in a circle around the rotation axis of the support end face. The pressing head has a pressing surface facing the support end face, and the distance between the pressing surface and the support end face is adjustable. The support platform has a chamber communicating with the first vacuum adsorption holes. A heating element is provided in the chamber. The heating element has a heating end face facing the first vacuum adsorption holes and parallel to the support end face. By driving the support end face to rotate through the rotary motor, the heating element can be directly opposite each of the first vacuum adsorption holes, and the heating element can move towards or away from the first vacuum adsorption holes. The first vacuum adsorption hole is used to pre-adsorb the sheet to be bonded, the heating end face is used to contact the sheet to be bonded, the rotary motor drives the supporting end face to rotate, the pressing head is used to press the sheet to be bonded adsorbed by each of the first vacuum adsorption holes, and the heating element is used to heat the sheet to be bonded.

2. The sheet bonding alignment system according to claim 1, characterized in that, The alignment mechanism includes two or more pressing heads, and the cavity is provided with two or more heating elements. The pressing heads and the heating elements are directly opposite each other. Each pressing head and the opposite heating element are used to press and heat the sheet to be bonded.

3. The sheet bonding alignment system according to claim 1, characterized in that, It also includes a transfer mechanism, which includes a gripping end face and a second vacuum adsorption hole on the gripping end face; the second vacuum adsorption hole is used to adsorb the sheet to be bonded onto the gripping end face, and the transfer mechanism is used to place the sheet to be bonded onto the support end face.

4. The sheet bonding alignment system according to claim 3, characterized in that, The sheet bonding alignment system further includes an image acquisition device, which is used to acquire an image of the sheet to be bonded adsorbed by the second vacuum adsorption hole. The image is used to correct the position of the transfer mechanism placing the sheet to be bonded onto the support end face.

5. The sheet bonding alignment system according to claim 1, characterized in that, The pressing head is equipped with a pressure sensor, which is used to detect the pressure value applied by the pressing surface to the sheet to be bonded. The heating element is equipped with a temperature sensor, which is used to detect the temperature value at which the heating element heats the sheet to be bonded.

6. The sheet bonding alignment system according to any one of claims 1 to 5, characterized in that, The alignment system further includes: a lifting device; the pressing head is connected to the lifting device, and the lifting device can drive the pressing head to move towards or away from the support platform, so that the distance between the pressing surface and the support end face is adjustable. Alternatively, the alignment system may further include: a lifter; the support platform is connected to the lifter, and the lifter is capable of moving the support platform toward or away from the pressing head, so that the distance between the pressing surface and the support end face is adjustable; Alternatively, the alignment mechanism may further include: a first lifter and a second lifter; the pressing head is connected to the first lifter, which can drive the pressing head to move toward or away from the support platform; the support platform is connected to the second lifter, which can drive the support platform to move toward or away from the pressing head; so that the distance between the pressing surface and the support end face is adjustable.

7. The sheet bonding alignment system according to any one of claims 1 to 5, characterized in that, The sheet bonding alignment system further includes a loading platform and a unloading platform, wherein the loading platform is used to support the sheet to be bonded; and the unloading platform is used to support the bonded sheet.

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