Display device and method for manufacturing the same

Abstract

A display device and a manufacturing method thereof, the display device comprising: a display panel; a backplane disposed on one surface of the display panel; and a buffer plate. The buffer plate includes an adhesive member disposed on one surface of the backplane and a conductive structure disposed on one surface of the adhesive member, wherein the conductive structure covers each of the side surfaces of the adhesive member, the side surface of the backplane, and the side surface of the display panel.

Description

Technical Field

[0001] The present disclosure relates to a display device and a manufacturing method thereof, and more particularly, to a display device and a manufacturing method thereof capable of improving a grounding function and reducing image quality degradation. Background Art

[0002] Display devices are used in various forms and manners for televisions, monitors, smartphones, tablets, laptops, wearable devices, etc. Among the display devices used in various forms and manners, organic light emitting display devices (OLEDs) have been developed.

[0003] An organic light emitting display device has a self-luminous element that emits light by itself, so a separate light source is not required, thereby realizing a display device that can be bent or has various designs. In addition, compared with a liquid crystal display device (LCD) or a plasma display device (PDP), an organic light emitting display device can be thinner and has advantages of excellent color rendering, a large viewing angle, high contrast, and a fast response speed. Therefore, its use is gradually increasing.

[0004] An organic light emitting display device includes a display area for performing screen display and a non-display area formed along an outer edge of the display area. Additional components may be provided in the non-display area, or various connection components for connecting the additional components to each other, such as a flexible circuit board, may be provided in the non-display area.

[0005] Since a display device includes a plurality of additional components, the thickness and width of the device may increase. As the thickness and width of the display device increase, the design and portability of the device may deteriorate. Therefore, solutions for reducing the thickness and width of the display device are being studied. Summary of the Invention

[0006] Technical Problem

[0007] A display device constituting a display device includes a display panel, a back plate that supplements the stiffness of the display panel, and a plurality of components having various functions, such as a buffer plate for heat dissipation and shock absorption and an adhesive member laminated with each other.

[0008] When the size of the buffer plate is smaller than the size of each of the display panel and the back plate, the weight of the display device can be reduced and its manufacturing cost can be lowered, but its heat dissipation and shock absorption functions may be reduced. In addition, a step may occur between the buffer plate and the back plate, so that the display panel cannot be supported by the buffer plate and may protrude, and thus may be easily damaged due to an external impact.

[0009] Therefore, the applicant of the present disclosure has invented a display device and a display device that can improve the grounding function and reduce the degradation of image quality without forming a step between the buffer plate, the back plate, and the display panel.

[0010] An object to be achieved according to an embodiment of the present disclosure is to provide a display device and a display apparatus that can improve heat dissipation function and grounding function without forming steps between a buffer board, a backplane, and a display panel.

[0011] In addition, an object to be achieved according to an embodiment of the present disclosure is to provide a display device and a display apparatus that can improve uniform distribution of charges without forming steps between a buffer board, a backplane, and a display panel.

[0012] Furthermore, an object to be achieved according to an embodiment of the present disclosure is to provide a display device and a display apparatus that can reduce damage to the display device that occurs during a trimming process using a laser device without forming steps between a buffer board, a backplane, and a display panel.

[0013] The object of the present disclosure is not limited to the above object. Other objects and advantages not mentioned in the present disclosure can be understood based on the following description and can be more clearly understood based on the embodiments of the present disclosure. In addition, it is easily understood that the objects and advantages of the present disclosure can be achieved in the manner shown in the claims and their combinations.

[0014] Technical Solution

[0015] A first aspect of the present disclosure provides a display apparatus, including: a display panel; a backplane disposed on one surface of the display panel; and a buffer board including an adhesive member disposed on one surface of the backplane and a conductive structure disposed on one surface of the adhesive member, wherein the conductive structure covers each of side surfaces of the adhesive member, the backplane, and the display panel.

[0016] In an embodiment of the first aspect, side surfaces of the display panel, the backplane, and the adhesive member are aligned with each other.

[0017] In an embodiment of the first aspect, the conductive structure includes: an upper cover disposed on one surface of the adhesive member; and a side cover extending from the upper cover to cover side surfaces of the backplane, the display panel, and the adhesive member.

[0018] In an embodiment of the first aspect, the side cover horizontally protrudes from side surfaces of each of the display panel, the backplane, and the adhesive member by a predetermined horizontal dimension.

[0019] In an embodiment of the first aspect, the apparatus further includes: an optical film disposed on a surface of the display panel opposite to the surface of the display panel on which the backplane is disposed; and a cover member disposed on one surface of the optical film.

[0020] In one embodiment of the first aspect, the conductive structure covers the side surface of the optical film.

[0021] In one embodiment of the first aspect, the horizontal dimension of the portion of the conductive structure covering the side surface of the display panel is greater than the horizontal dimension of the portion of the conductive structure covering the side surface of each of the adhesive member and the back plate.

[0022] In one embodiment of the first aspect, the upper side of the display panel, the upper side of the back plate, and the upper side of the adhesive member are aligned with each other, the left side of the display panel, the left side of the back plate, and the left side of the adhesive member are aligned with each other, and the right side of the display panel, the right side of the back plate, and the right side of the adhesive member are aligned with each other.

[0023] In one embodiment of the first aspect, a plurality of holes are formed in the conductive structure and the conductive structure includes copper (Cu).

[0024] In one embodiment of the first aspect, the dimension by which the conductive structure horizontally extends from the side surface of each of the back plate, the display panel, and the adhesive member is less than 60 μm.

[0025] In one embodiment of the first aspect, the portions of the conductive structure covering the side surface of the adhesive member, the side surface of the back plate, and the side surface of the display panel vertically extend to have a flat vertical surface.

[0026] In one embodiment of the first aspect, one surface of the back plate provided with the adhesive member is the opposite surface of the surface of the back plate provided with the display panel, and one surface of the adhesive member provided with the conductive structure is the opposite surface of the surface of the adhesive member provided with the back plate.

[0027] The second aspect of the present disclosure provides a method of manufacturing a display device, the method including: providing a display device including a display panel, a back plate on the display panel, and a buffer plate on the back plate, wherein the buffer plate includes an adhesive member on the back plate and a conductive structure, wherein the conductive structure includes an upper cover provided on one surface of the adhesive member, wherein the side surfaces of the display panel, the back plate, and the adhesive member are aligned with each other in a line, wherein the conductive structure further includes a side cover that extends from the upper cover to cover the side surfaces of the adhesive member, the back plate, and the display panel, wherein the side cover has a first horizontal dimension; and performing a laser trimming process for cutting a part of the side cover of the conductive structure inward from its side end to reduce the first horizontal dimension of the side cover to a second horizontal dimension.

[0028] In one embodiment of the second aspect, the side cover covers the upper side surface, the left side surface, and the right side surface of the display device.

[0029] In one embodiment of the second aspect, a laser trimming process is performed along a cutting line overlapping with a side cover of the conductive structure, wherein the cutting line is formed along the upper edge, left edge, and right edge of the display device.

[0030] In one embodiment of the second aspect, a first horizontal dimension of the side cover is greater than 60 μm, and a second horizontal dimension of the side cover is less than 60 μm.

[0031] In one embodiment of the second aspect, the side cover of the conductive structure is configured such that as the side cover extends from the adhesive member toward the display panel, the horizontal dimension of the side cover increases.

[0032] In one embodiment of the second aspect, the method further includes: after performing the laser trimming process, disposing an optical film on the display panel; and disposing a cover member on a back surface of the optical film such that the cover member is bonded to the display device.

[0033] A third aspect of the present disclosure provides a method of manufacturing a display device, the method including: providing a display device including a display panel, a backplane on the display panel, and a buffer plate on the backplane, wherein the buffer plate includes an adhesive member on the backplane and a conductive structure on the adhesive member, wherein side surfaces of the display panel, the backplane, and the buffer plate are aligned with each other in a line, wherein a trench having a bottom surface and side walls is defined in an edge portion of the conductive structure; and performing a laser trimming process for using the bottom surface of the trench as a cutting line to cut a part of the display device inward from a side end of the display device such that the conductive structure melts and flows to form an upper cover disposed on one surface of the adhesive member and a side cover extending from the upper cover to cover side surfaces of the adhesive member, the backplane, and the display panel.

[0034] In one embodiment of the third aspect, the trench extends along the upper side, left side, and right side of the display device.

[0035] In one embodiment of the third aspect, a laser trimming process is performed along the cutting line, wherein the cutting line extends along the upper edge, left edge, and right edge of the display device.

[0036] In one embodiment of the third aspect, a depth of the trench from a top surface of the conductive structure is in a range of 20% to 30% of a total thickness of the conductive structure.

[0037] In one embodiment of the third aspect, as the side cover of the conductive structure extends from the adhesive member toward the display panel, the horizontal dimension of the side cover increases.

[0038] Beneficial effects

[0039] According to an embodiment of the present disclosure, a heat dissipation function and a grounding function can be achieved without creating a step between the buffer plate, the back plate, and the display panel.

[0040] In addition, according to an embodiment of the present disclosure, a conductive structure covering the side surfaces of each of the back plate and the display panel is introduced, thereby providing the advantage that charges can be evenly distributed without accumulating at specific positions.

[0041] In addition, according to an embodiment of the present disclosure, the display panel, the back plate, and the buffer plate are formed to have the same area size, thereby providing the advantage that the ends of the display panel, the ends of the back plate, and the ends of the buffer plate can be aligned with each other without creating a step therebetween.

[0042] In addition, a laser trimming process is performed in a state where the side cover of the conductive structure is formed to protrude a predetermined horizontal dimension from each of the side ends of the display panel, the back plate, and the bonding member, thereby providing the advantage that a uniform surface of the side cover can be achieved while maintaining its horizontal dimension such that the side cover can cover the entire side surface of the display device.

[0043] In addition, a laser trimming process is performed while the side cover of the conductive structure protrudes a predetermined horizontal dimension from each of the side ends of the display panel, the back plate, and the bonding member, thereby providing the advantage that the display device can be prevented from being cut during the laser trimming process such that the display panel, the back plate, and the bonding member can be aligned with each other in a straight line.

[0044] In addition, according to an embodiment of the present disclosure, a groove having a concave bottom surface and two opposing side walls is defined in an edge portion of the conductive structure such that no inclination is formed at the side ends of the display device during the laser trimming process and the display panel, the back plate, and the bonding member can be aligned with each other in a straight line.

[0045] The effects of the present disclosure are not limited to the above effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure.

[0047] Figure 2 is a cross-sectional view taken along Figure 1 I-I' of.

[0048] Figure 3 is a plan view showing a method of laser trimming the display device of Figure 1 ..

[0049] Figure 4 is a cross-sectional view taken along Figure 3Cross-sectional view taken along line I-I'.

[0050] Figures 5 to 7 It is a diagram showing the structure of a display device after laser trimming.

[0051] Figure 8 It is a plan view showing a display device according to another embodiment of the present disclosure.

[0052] Figure 9 It is along Figure 8 Cross-sectional views taken along II-II', III-III' and IV-IV'.

[0053] Figure 10 It is for showing Figure 8 A plan view of a method for laser trimming the display device.

[0054] Figure 11 It is along Figure 10 Cross-sectional view taken along III-III'.

[0055] Figure 12 It is a diagram for showing the structure in which a display device according to another embodiment of the present disclosure and a cover member are combined with each other.

[0056] Figure 13 It is a diagram schematically showing that charges caused by static electricity are released through a conductive thin film in a display device according to an embodiment of the present disclosure.

[0057] Figure 14 It is a diagram showing a display device according to still another embodiment of the present disclosure.

[0058] Figure 15 It is along Figure 14 Cross-sectional view taken along V-V'.

[0059] Figure 16 and Figure 17 It is a diagram for showing a method for laser trimming according to still another embodiment of the present disclosure. Detailed Description of the Invention

[0060] Referring to the embodiments described in detail later in conjunction with the accompanying drawings, the advantages and features of the present disclosure and the methods for achieving these advantages and features will become clear. However, the present disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms. Therefore, these embodiments are presented only to make the present disclosure complete and to fully inform those of ordinary skill in the art to which the present disclosure pertains of the scope of the present disclosure, and the present disclosure is defined only by the scope of the claims.

[0061] The shapes, sizes, ratios, angles, quantities, etc. disclosed in the drawings used to describe the embodiments of the present disclosure are exemplary, and the present disclosure is not limited thereto. In this document, the same reference numerals refer to the same elements. In addition, for the sake of simplicity of description, the description and details of well-known steps and elements are omitted. In addition, in the following detailed description of the present disclosure, many specific details are set forth to provide a thorough understanding of the present disclosure. However, it should be understood that the present disclosure may be practiced without these specific details. In other cases, well-known methods, steps, components, and circuits are not described in detail so as not to unnecessarily obscure aspects of the present disclosure.

[0062] The terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms "a" and "an" are intended to also include the plural forms. It should be further understood that when used in this specification, the terms "comprising", "including", and "having" specify the presence of stated features, integers, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, operations, elements, components, and / or portions thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. A phrase such as "at least one of" before a list of elements can modify the entire list of elements without modifying the individual elements of the list. When interpreting numerical values, there may be errors or tolerances even if they are not explicitly described.

[0063] In addition, it should also be understood that when a first element or layer is referred to as being "on" a second element or layer, the first element can be directly disposed on the second element or can be indirectly disposed on the second element with a third element or layer interposed between the first and second elements or layers. It should be understood that when an element or layer is referred to as "connected to" or "coupled to" another element or layer, it can be directly on the other element or layer, directly connected to or coupled to the other element or layer, or there can be one or more intermediate elements or layers. In addition, it should also be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there can also be one or more intermediate elements or layers.

[0064] In addition, as used herein, when a layer, film, region, plate, etc. is disposed "on" or "at the top of" another layer, film, region, plate, etc., the former may be in direct contact with the latter, or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is directly disposed "on" or "at the top of" another layer, film, region, plate, etc., the former is in direct contact with the latter and no other layer, film, region, plate, etc. is disposed between the former and the latter. In addition, as used herein, when a layer, film, region, plate, etc. is disposed "under" or "below" another layer, film, region, plate, etc., the former may be in direct contact with the latter, or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is directly disposed "under" or "below" another layer, film, region, plate, etc., the former is in direct contact with the latter and no other layer, film, region, plate, etc. is disposed between the former and the latter.

[0065] In the description of the temporal relationship, for example, the temporal precedence relationship between two events (such as "after", "subsequently", "before", etc.), unless it is specified as "directly after", "directly subsequently" or "directly before", another event may occur therebetween.

[0066] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Thus, without departing from the spirit and scope of the present disclosure, the first element, component, region, layer or part described below may be referred to as the second element, component, region, layer or part.

[0067] The features of the various embodiments of the present disclosure may be combined with each other partially or wholly, and may be technically related or interoperable. The embodiments may be implemented independently of each other, and may be implemented together in an associated relationship.

[0068] As used herein, the terms "substantially", "about" and similar terms are used as approximate terms and are intended to account for the inherent deviations of measured or calculated values that would be recognized by a person of ordinary skill in the art. This term may be used to prevent unauthorized infringers from using the exact or absolute numbers provided to assist in understanding the present disclosure for design purposes without authorization.

[0069] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this inventive concept belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0070] Hereinafter, the configuration of each of the display device and the display apparatus will be described in detail with reference to the accompanying drawings.

[0071] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure. Figure 2 is along Figure 1 a cross-sectional view taken along the line I-I' of Figure 3 is a plan view showing a method of laser trimming the display device of Figure 1 a cross-sectional view taken along the line I-I' of Figure 4 is along Figure 3 a cross-sectional view taken along the line I-I' of Figures 5 to 7 is a view showing the structure of the display device after laser trimming.

[0072] Referring to Figure 1 and Figure 2 the display device 1 may be configured to include a display panel 10, a backplane 20, and a buffer plate 30. The display device 1 may be adhered to the cover member by a module fixing member.

[0073] The display panel 10 may include a display substrate made of a polymer or plastic (such as polyimide (PI)) or glass. The display panel 10 may include a display area AA for displaying an image and a non-display area NAA. A plurality of sub-pixels for displaying an image and a driving circuit for driving the plurality of sub-pixels may be provided in the display area AA. The pixel array may include a plurality of sub-pixels and a driving circuit. The non-display area NAA may be formed to surround the display area and may refer to an area where an image is not displayed.

[0074] The bezel may be a non-display area NAA surrounding the display area AA in a display apparatus to which the display device 1 is applied. The non-display area NAA and the bezel of the display device 1 may refer to the same area. A circuit board 100, a driver integrated circuit 110, and a current connector 120 connected to an external device may be provided in the non-display area NAA.

[0075] In one embodiment of the present disclosure, a chip - on - film (COF) in which a driver integrated circuit 110 is directly mounted on a display panel 10 may be employed. The present disclosure is not limited thereto. The circuit board 100 may be implemented as a flexible printed circuit board (FPCB), and the circuit board 100 may be directly mounted or attached to the display panel 10.

[0076] One end of the circuit board 100 may be attached to the non - display area NAA of the display panel 10, and the circuit board 100 may be bent such that the other end thereof is disposed on the back surface of the display panel 10 to reduce the area of the portion of the non - display area NAA of the display panel 10 visible in the forward direction. In addition, as the circuit board 100 is bent, one end of the display panel 10 to which the circuit board 100 is mounted is bent to a certain extent, so that the area of the portion of the non - display area NAA of the display panel 10 visible in the forward direction can be further reduced.

[0077] In another embodiment, in order to minimize as much as possible the area of the portion of the non - display area NAA of the display panel 10 visible in the forward direction, the display panel 10 may be bent such that one end of the display panel 10 can be disposed on the back surface of the display panel 10. In the bent state of the circuit board 100, the driver integrated circuit 110 may be disposed on the back surface of the display substrate.

[0078] As the curvature radius of the bent display panel 10 or circuit board 100 increases, the area of the portion of the non - display area of the display panel 10 visible in the forward direction increases. Therefore, the overall thickness of the display device 1 may be reduced to make the curvature radius of the circuit board 100 smaller.

[0079] Although not shown, a pixel array including a thin - film transistor layer and a light - emitting element may be provided on the display panel 10. The pixel array includes a plurality of sub - pixels. Each of the plurality of sub - pixels may be a separate light - emitting unit, and each light - emitting element may be disposed in each of the plurality of sub - pixels.

[0080] The driver integrated circuit 110 generates a data signal and a gate control signal based on image data and a timing synchronization signal supplied from an external host driver system. In addition, the driver circuit may supply the data signal to the data lines of each pixel via a display pad, and may supply the gate control signal to the gate driving circuit via a display pad.

[0081] Since the driver integrated circuit 110 generates a large amount of heat, it may be necessary to effectively provide a heat - dissipation effect for the driver integrated circuit 110. For example, the heat from the driver integrated circuit 110 may be effectively dissipated through a buffer plate 30.

[0082] The buffer plate 30 may be disposed between the display panel 10 and the driver integrated circuit 110, such that heat generated not only from the driver integrated circuit 110 but also from the display panel 10 can be effectively dissipated through the buffer plate.

[0083] The back plate 20 may be disposed on the display panel 10. The back plate 20 may be disposed under the display substrate constituting the display panel 10 and may supplement the stiffness of the display substrate. The back plate 20 may be formed to have a certain strength and a certain thickness to supplement the stiffness of the display substrate.

[0084] The buffer plate 30 may be disposed on the back plate 20. The buffer plate 30 may have a heat dissipation function and a shock absorption function, and may include an adhesive member 31 and a conductive structure 32. For example, the adhesive member 31 and the conductive structure 32 may be sequentially stacked to constitute the back surface RS of the display device 1.

[0085] The conductive structure 32 includes a single structure of a porous substrate instead of a stacked structure of a heat dissipation layer and a buffer layer, so that delamination does not occur. The conductive structure may have a heat dissipation function and a shock absorption function.

[0086] In one embodiment, the size of the buffer plate 30 may be smaller than the size of each of the display panel 10 and the back plate 20. When the size of the buffer plate 30 is larger than the size of the display panel 10, the non-display area may increase. Therefore, in order not to increase the non-display area, the size of the buffer plate may be smaller than the size of the back plate 20. On the contrary, when the size of the buffer plate 30 is smaller than the size of the back plate 20, its weight can be reduced and its manufacturing cost can be lowered, but its heat dissipation and shock absorption functions may be reduced.

[0087] In addition, when the size of the buffer plate 30 is smaller than the size of the back plate 20, a step appears between the buffer plate 30 and the back plate 20. In the side end region of the display panel 10 where the step is formed, the display panel 10 protrudes while not being supported by the buffer plate 30. Therefore, when an external impact is applied to the display panel 10, the display panel 10 may be easily damaged.

[0088] Therefore, the display device 1 according to an embodiment of the present disclosure may be configured such that the side end E1 of the buffer plate 30 is aligned with the side end of each of the display panel 10 and the back plate 20, and the buffer plate completely overlaps the display panel 10. That is, the display panel 10, the back plate 20, and the buffer plate 30 may be attached to each other such that the end E1 of the display panel 10, the end E1 of the back plate 20, and the end E1 of the buffer plate 30 may be aligned with each other without generating a step therebetween.

[0089] In order to align the end E1 of the display panel 10, the end E1 of the backplane 20, and the end E1 of the buffer plate 30 with each other without creating a step therebetween, the display panel 10, the backplane 20, and the buffer plate 30 may have the same area size.

[0090] In this regard, when the display panel 10, the backplane 20, and the buffer plate 30 are attached to each other such that the end E1 of the display panel 10, the end E1 of the backplane 20, and the end E1 of the buffer plate 30 can be aligned with each other without creating a step therebetween, it is difficult to form the display device 1 to have an accurate target size. Therefore, the display device 1 is formed to have a size larger than the target size, and then the display device 1 is partially cut using a laser device to form a display device having the target size.

[0091] Specifically, referring again to Figure 1 , the display device 1 may be formed to have a size B larger than the target size A to be achieved.

[0092] Next, as shown in Figure 3 and Figure 4 , a method of cutting a part of the display device 1 from the side end of the display device 1 inward using the laser device L to form the display device 1 having the target size A may be performed.

[0093] The laser device L may cut the display device 1 by irradiating a laser beam along the cutting line CL1 of the display device 1 in the arrow direction of Figure 3 . The cutting line CL1 may be formed along three side portions of the display device 1. For example, the cutting line CL1 may be formed along the upper side, the left side, and the right side of the display device 1.

[0094] In this regard, since the circuit board 100 including the driver integrated circuit 110 and the current connector 120 is disposed on the lower side of the display device 1, it may be difficult to use laser cutting on its lower side. Therefore, except for the lower side of the display device 1, the cutting line CL1 may be formed. In this regard, the cutting line CL1 may overlap with the region corresponding to the target size A to be achieved.

[0095] Referring to Figure 4 , the laser device L may irradiate the laser beam in a straight line in the direction from the back surface RS of the display device 1 including the buffer plate 30 to the front surface FS of the display device 1 including the display panel 10. Then, the display device 1 having a stacked structure in which the buffer plate 30, the backplane 20, and the display panel 10 are stacked on each other may be partially cut together with the laser, and may be processed such that the side surfaces of the buffer plate 30, the backplane 20, and the display panel 10 are aligned with each other.

[0096] In this regard, in the process of cutting the buffer plate 30, the back plate 20, and the display panel 10 using the cutting method using the laser device L, an uneven conductive thin film 40 may be formed, as Figure 5 shown.

[0097] The cutting method using the laser device L can be performed by repeatedly irradiating an ultrashort pulse laser beam having a pulse duration in the femtosecond range onto the buffer plate 30 of the display device 1. When the ultrashort pulse laser beam is repeatedly irradiated thereon, the constituent material of the buffer plate 30 irradiated by the laser beam may melt. According to an embodiment, during the period of continuously applying laser pulses, the laser beam can be irradiated in a manner overlapping with the cutting line CL1 as the target point. Therefore, the cutting line CL1 irradiated by the laser pulse has a high temperature. When a subsequent laser pulse reaches the cutting line having a high temperature, the temperature of the cutting line exceeds the melting point of the material constituting the buffer plate 30, and it may start to melt.

[0098] Then, the molten material of the buffer plate 30 can flow downward to the display panel 10. However, when the cutting line CLl irradiated by the laser beam overlaps with the region corresponding to the target size A to be achieved, melting occurs at the side end portion of the buffer plate 30. In other words, the area of the melted portion is narrow. Therefore, the conductive thin film 40 formed of the material flowing down from the side end portion of the buffer plate 30 is thin and its surface is uneven. In addition, the conductive thin film 40 may be formed in a disconnected and discontinuous manner instead of being formed as a single connected film.

[0099] In addition, when the cutting method using the laser device L is performed, when the display device 1 is bent or when the display device 1 located on the laser device L is in an unaligned state, the laser beam can irradiate the display device. Then, as Figure 6 and Figure 7 shown, the side surfaces of the buffer plate 30, the back plate 20, and the display panel 10 are not aligned with each other in a straight line, but are inclined as they face the display panel 10, resulting in an inclination phenomenon having an inclination angle θ.

[0100] When the side surfaces of the buffer plate 30, the back plate 20, and the display panel 10 are inclined in the above manner while repeatedly irradiating the ultrashort pulse laser beam, even when the molten material of the buffer plate 30 flows down, a conductive thin film 50 that only covers a part of the side surface of the back plate 20 may be formed. In other words, the side surface of the display panel 10 is not covered by the molten material and is exposed.

[0101] As described above, in the side end portion of the display device 1, the conductive thin films 40 and 50 may be thin and their surfaces may be uneven, and / or the films may be discontinuous or disconnected. That is, the films may not cover the entire side end portion of the display device 1. Therefore, charges may be unevenly distributed throughout the display device 1, or may not be grounded through the back surface of the buffer plate 30, and thus may accumulate at specific positions. Therefore, fixed charges may be generated.

[0102] When the fixed charges do not move and accumulate at specific positions, the fixed charges may flow into the display panel 10 and cause poor image quality during subsequent operation of the display device. For example, a defect may occur in which green light is generated at a weak level in the organic light-emitting element, and thus the image quality may deteriorate. Since this defect is directly related to the reliability problem of the display device, the applicant of the present disclosure has invented a display device structure that can prevent such a defect.

[0103] The present disclosure will be described below with reference to the accompanying drawings.

[0104] Figure 8 is a plan view showing a display device according to another embodiment of the present disclosure. Figure 9 is along Figure 8 sectional views taken along II-II', III-III', and IV-IV' of Figure 10 is a plan view showing a method of laser trimming the display device of Figure 8 Figure 11 Figure 10 is along Figure 10 sectional view taken along III-III' of Figure 12 is a view for showing a structure in which a display device according to another embodiment of the present disclosure and a cover member are combined with each other.

[0105] Figure 13 is a view schematically showing that charges caused by static electricity are released through a conductive thin film in a display device according to an embodiment of the present disclosure.

[0106] Referring to Figure 8 and Figure 9 , the display device 2 may be configured to include a display panel 200, a back plate 210, and a buffer plate 220. Then, the display device 2 may be attached to the cover member through a module fixing member.

[0107] The display panel 200 may include a display substrate made of a flexible plastic material such as polyimide or a flexible glass material.

[0108] The display panel 200 may include a display area AA for displaying an image and a non-display area NAA.

[0109] The pixel array can be disposed in the display area AA. The pixel array can be implemented in the form of various elements for displaying an image. The pixel array can include a plurality of pixels arranged in pixel regions defined by signal lines on a display substrate. The pixels can display an image based on signals supplied to the signal lines. The signal lines can include gate lines, data lines, and pixel drive power supply lines.

[0110] Each of the plurality of pixels can include a thin-film transistor in the pixel region, an anode electrically connected to the thin-film transistor, a light-emitting element layer formed on the anode, and a cathode electrically connected to the light-emitting element layer.

[0111] The thin-film transistor can include a gate, a semiconductor layer, a source, and a drain. The semiconductor layer of the thin-film transistor can include silicon such as a-Si, polysilicon, or low-temperature polysilicon, or an oxide such as IGZO (indium-gallium-zinc-oxide).

[0112] The anode can be disposed in each pixel region and is disposed in a manner corresponding to an opening region defined according to the pattern shape of the pixel, and can be electrically connected to the thin-film transistor.

[0113] In one example, the light-emitting element layer can include an organic light-emitting element formed on the anode. The organic light-emitting element can be implemented to emit light of the same color, such as white light, for the pixel, or to emit light beams of different colors, such as red light beams, green light beams, and blue light beams, for the pixel.

[0114] In another example, the light-emitting element layer can include a micro light-emitting diode element electrically connected to each of the anode and the cathode. The micro light-emitting diode element can be a light-emitting diode implemented in the form of an integrated circuit (IC) or a chip, and can include a first terminal electrically connected to the anode and a second terminal electrically connected to the cathode.

[0115] The cathode can be commonly connected to the light-emitting elements of the light-emitting element layer respectively disposed in the pixel regions.

[0116] The encapsulation part is formed on the display substrate to cover the pixel array, thereby preventing oxygen, moisture, or foreign substances from penetrating into the light-emitting element layer of the pixel array. In one example, the encapsulation part can be formed as a multi-layer structure in which an organic material layer and an inorganic material layer are alternately stacked.

[0117] The non-display area NAA can be formed to surround the display area AA and can be used as an area where an image is not displayed, for example, a border area. A circuit board 240, a driver integrated circuit 250, and a current connector 260 connected to an external device can be disposed in the non-display area NAA.

[0118] The circuit board 240 can be implemented as a flexible printed circuit board (FPCB) and can be directly mounted or attached to the display panel 200. The driver integrated circuit 250 and the current connector 260 can be provided on the circuit board 240.

[0119] One end of the circuit board 240 can be attached to the non-display area NAA and the front surface FS of the display panel 200. The circuit board can be bent such that the other end thereof is disposed on the back surface RS of the display panel 200 to reduce the area of the portion of the non-display area NAA of the display panel 200 visible in the forward direction. In addition, as the circuit board 240 is bent, the end of the display panel 200 to which the circuit board 240 is mounted can be bent by a certain amount such that the area of the portion of the non-display area of the display panel 200 visible in the forward direction can be further reduced.

[0120] The driver integrated circuit 250 can generate data signals and gate control signals based on image data and timing synchronization signals supplied from an external host driver system and supply the generated signals to the data lines and gate lines of each pixel.

[0121] The backplane 210 can be provided on one surface of the display panel 200. The backplane 210 can be provided under the display substrate constituting the display panel 200 and can supplement the stiffness of the display substrate. The backplane 210 can be formed to have a certain strength and a certain thickness to supplement the stiffness of the display substrate.

[0122] The buffer plate 220 can be provided on one surface of the backplane 210. The buffer plate 220 can have a heat dissipation function and a shock absorption function and can be configured to include an adhesive member 221 and a conductive structure 222. The one surface of the backplane 210 on which the buffer plate 220 is provided can be a relative surface different from the one surface of the backplane 210 that contacts the display panel 200. For example, the adhesive member 221 and the conductive structure 222 can be sequentially stacked to constitute the back surface RS of the display device 2.

[0123] The adhesive member 221 can be a layer that directly contacts the backplane 220 to fix the buffer plate 220 to the backplane 220. The adhesive member 221 can be made of or include materials such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0124] The conductive structure 222 is provided on one surface of the adhesive member 221. In this regard, the one surface of the adhesive member 221 that contacts the conductive structure 222 can be opposite to the surface thereof that contacts the backplane 220.

[0125] The conductive structure 222 may include a porous metal structure that includes metal as a main component and has a plurality of pores therein. In one example, the conductive structure 222 may be formed by sintering a metal foam precursor that includes metal powder. However, the present disclosure is not limited thereto. The metal foam precursor may be understood as a structure before a process such as sintering. Preferably, the conductive structure 222 includes Cu (copper).

[0126] For example, a slurry including metal powder, a dispersant, and a binder may be used to produce the metal foam precursor.

[0127] The metal powder may include at least one metal powder selected from the group consisting of copper powder, nickel powder, iron powder, SUS powder, molybdenum powder, silver powder, platinum powder, gold powder, aluminum powder, chromium powder, indium powder, tin powder, magnesium powder, phosphorus powder, zinc powder, and manganese powder, or a mixture of the above metal powders, or an alloy powder of one or more metals. The present disclosure is not limited thereto.

[0128] In one example, the dispersant may include alcohol, without being limited thereto. The type of the binder is not particularly limited and may be appropriately selected according to the type of the metal component or the type of the dispersant used during the preparation of the slurry.

[0129] After preparing the slurry including the metal powder, the dispersant, and the binder as described above, the slurry may be injected into a mold having a predetermined shape or the slurry may be coated on a substrate. The metal foam precursor thus formed may be subjected to a sintering process and may thus be formed into the conductive structure 222. In this case, the conditions of the sintering process are not particularly limited as long as the temperature and duration thereof are such that the required amount of the solvent contained in the slurry is removed.

[0130] According to an embodiment of the present disclosure, the conductive structure 222 may be formed by injecting the above slurry into a mold having a predetermined shape and performing a sintering process thereon. According to another embodiment of the present disclosure, the conductive structure 222 may include a flexible metal film.

[0131] In this regard, the conductive structure 222 may have a shape including an upper cover 222a and side covers 222b, the upper cover 222a covering the top surface of the bonding member 221, and the side covers 222b covering all exposed opposite side surfaces of each of the bonding member 221, the back plate 210, and the display panel 200.

[0132] Therefore, the conductive structure 222 may be formed to cover the top surface and three sides of the display device 2. Since the circuit board 240 including the driver integrated circuit 250 and the current connector 260 is disposed on the lower side of the display device 2, the lower side of the display device 2 is not covered with the conductive structure 222. Therefore, referring to Figure 9In the portion obtained by cutting the lower side portion of the display device 2 along IV-IV', the conductive structure 222 may cover only the top surface of the display device 2.

[0133] In one example, the display device 2 according to an embodiment of the present disclosure may be configured such that the end E2 of the display panel 200, the end E2 of the backplane 210, and the end E2 of the adhesive member 221 coincide with each other without creating a step. To align the end E2 of the display panel 200, the end E2 of the backplane 210, and the end E2 of the adhesive member 221 with each other without creating a step, the display panel 200, the backplane 210, and the adhesive member 221 may be formed to have the same area size.

[0134] In this regard, the display panel 200, the backplane 210, and the adhesive member 221 may be formed to have the target size that the display device 2 is to achieve. Since the conductive structure 222 is disposed thereon, the side cover 222b of the conductive structure 222 may be formed to have an initial size D that is relatively larger than the target size C.

[0135] As Figure 9 shown, the side cover 222b of the conductive structure 222 may be formed to horizontally protrude from the side end E2 of each of the display panel 200, the backplane 210, and the adhesive member 221 by a predetermined horizontal dimension T1. For example, the horizontal dimension of the side cover 222b of the conductive structure 222 may be greater than 60 μm. When the horizontal dimension of the side cover 222b of the conductive structure 222 is less than 60 μm, the laser may irradiate the display panel 200 instead of the side cover 222b. Therefore, the display panel may be damaged. Thus, the horizontal dimension of the side cover 222b of the conductive structure 222 may be greater than 60 μm. The horizontal dimension may be the length extending in the width direction of the display panel, and the vertical dimension may be the length extending in the thickness direction of the display panel.

[0136] Furthermore, the side cover 222b of the conductive structure 222 may be formed to have a length of a certain size such that the side cover covers all the exposed side surfaces of the display panel 200. In one example, the side cover 222b may be formed to have a length extending 190 μm to 230 μm from the surface of the upper cover 222a.

[0137] Next, as Figure 10 and Figure 11 shown, a trimming process may be performed using the laser device L to cut a part of the side cover 222b of the conductive structure 222 from the side end of the conductive structure 222 inward to form the display device 2 with the target size C.

[0138] The trimming process can be understood as a process of removing unnecessary parts by irradiating a laser beam to a trimming target along a cutting line CL2 using a laser device L to cut the trimming target. The cutting line CL2 in the trimming process according to an embodiment of the present disclosure can be formed along three sides of the display device 2 including the conductive structure 222. For example, the cutting line CL2 can be formed along the upper side, left side, and right side of the display device 2.

[0139] In this regard, the cutting line CL2 can overlap with the conductive structure 222 other than the display panel 200, the backplane 210, and the bonding member 221.

[0140] The conductive structure 222 is not formed on the lower side of the display device 2 where the circuit board 240 is provided. Therefore, it is difficult to cut its lower side using a laser. Therefore, the cutting line CL2 can be formed except for the lower side of the display device 2. In this regard, the cutting line CL2 can overlap with the region corresponding to the target size C to be achieved.

[0141] The laser device L can irradiate the laser beam in a straight line in the direction from the back surface RS of the display device 2 where the conductive structure 222 is provided to the front surface FS of the display device 2 where the display panel 200 is provided. As described above, the cutting line CL2 overlaps with the side cover 222b of the conductive structure 222 other than the display panel 200, the backplane 210, and the bonding member 221. Therefore, the laser beam irradiated from the laser device L can be irradiated onto the side cover 222b of the conductive structure 222 to cut off the side cover, leaving its predetermined horizontal dimension. The horizontal dimension T2 of the side cover 222b of the conductive structure 222 remaining after the cutting process using the laser beam can be less than 60 μm. For example, the horizontal dimension T2 can be in the range of 30 μm to 59 μm.

[0142] The cutting method using the laser device L can be performed by repeatedly irradiating an ultrashort pulse laser beam having a pulse duration in the femtosecond range onto the side cover 222b of the conductive structure 222. When the ultrashort pulse laser beam is repeatedly irradiated thereon, the constituent material of the side cover 222b irradiated by the laser beam may melt. According to an embodiment, during the period of continuously applying the laser pulse, the laser beam can be irradiated in a manner overlapping with the cutting line CL2 as the target point. Therefore, the cutting line CL2 irradiated by the laser pulse has a high temperature. Therefore, the temperature of the cutting line CL2 rises such that the temperature exceeds the melting point of the constituent material of the side cover 222b of the conductive structure 222. Therefore, melting may start at the cutting line CL2.

[0143] Then, the molten material of the side cover 222b that constitutes the conductive structure 222 can flow downward toward the display panel 200. In this case, the side cover 222b according to an embodiment of the present disclosure is formed to protrude a predetermined horizontal dimension T1 from each side end E2 of the display panel 200, the back plate 210, and the adhesive member 221. Specifically, the horizontal dimension of the side cover 222b is less than 60 μm.

[0144] In other words, laser trimming is performed while the area of the portion to be melted is expanded by a predetermined horizontal dimension T1 from the side end E2. Therefore, when the material melts at the side end E2 and the molten material flows down, the horizontal dimension of the molten material is sufficient for the material to cover the side surface of the display device 2 and ensure a flat and uniform surface of the side portion made of the molten material. In addition, laser trimming is performed while the area of the portion to be melted is expanded by a predetermined horizontal dimension T1 from the side end E2, so that even after laser trimming, no disconnected portion is generated and a single continuous film can be formed.

[0145] In another example, as melting occurs at the side end E2 and the molten material flows downward toward the display panel 200, the side cover 222b of the conductive structure 222 after laser trimming may have a horizontal dimension that increases as it extends toward the display panel 200.

[0146] In an embodiment of the present disclosure, when the side cover 222b of the conductive structure 222 protrudes from each side end of the display panel 200, the back plate 210, and the adhesive member 221, a laser trimming process is performed. Therefore, the display panel 200, the back plate 210, and the adhesive member 221 are not removed during laser trimming. Accordingly, the side ends of the display panel 200, the side ends of the back plate 210, and the side ends of the adhesive member 221 can be kept in a state of being aligned with each other in a straight line and may not have an inclination. That is, the portion of the conductive structure 222 that covers the side surfaces of the adhesive member 221, the back plate 210, and the display panel 200 extends vertically to have a flat vertical surface.

[0147] In addition, since melting occurs at the side end E2 and the melted material flows downward toward the display panel 200, the interfacial adhesion between the display panel 200, the back plate 210, and the adhesive member 221 and the conductive structure 222 can be further improved.

[0148] Referring to Figure 12 , a display device 3 can be manufactured by attaching the display device 2 including the conductive structure 222 to the cover member 280.

[0149] For this reason, the optical film 230 may be disposed on the display panel 200. The optical film 230 may have a form in which one or more functional layers are stacked. However, the present disclosure is not limited thereto. For example, the optical film 230 may include an antireflection layer such as a polarizing film (POL), which may prevent reflection of external light to improve outdoor visibility and contrast of an image displayed on the display panel 200. In another example, the optical film 230 may further include a barrier layer to prevent permeation of moisture or oxygen. The barrier layer may be made of a material having low moisture permeability (e.g., a polymer material). The display panel 200 and the optical film 230 may be joined to each other by an adhesive member (not shown).

[0150] The cover member 280 may be coupled to the display device 2 on which the optical film 230 has been formed. For example, the module fixing member 270 may be disposed on the back surface of the cover member 280. Since the module fixing member 270 may be disposed to overlap the display area, the module fixing member 270 may include an adhesive member made of a transparent material. For example, the module fixing member 270 may be made of or include a material such as an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0151] Accordingly, the display device 2 may be fixedly coupled to the cover member 280 through the module fixing member 270. The cover member 280 may be disposed to cover the entire surface of the display device 2 to protect the display device 2 from external impacts. Since the cover member 280 includes a display area AA for displaying a screen, the cover member may be made of a transparent material such as cover glass to display the screen. For example, the cover member 280 may be made of a transparent plastic material, a glass material, or a strengthened glass material.

[0152] An anti-fingerprint coating film 285 may be disposed on the front surface of the cover member 280. The anti-fingerprint coating film 285 may be formed by coating a material including fluorosilane on the surface of the cover member 280 made of glass or plastic, and the anti-fingerprint coating film 285 may be used to prevent fingerprints or contaminants from adhering thereto and to facilitate removal of fingerprints or contaminants therefrom. The anti-fingerprint coating film 285 may be formed to cover the edge portion of the cover member 280.

[0153] A light-shielding film 275 may be disposed between the cover member 280 and the module fixing member 270. The light-shielding film 275 may be disposed on the edge portion of the back surface of the cover member 280 and may be formed in the non-display area NAA. The light-shielding film 275 may be formed by coating black ink.

[0154] In the present disclosure, a configuration is described in which a conductive structure 222 is provided on a structure where a display panel 200 and a backplane 210 are attached to each other. The present disclosure is not limited thereto. For example, in another embodiment, the conductive structure 222 may be provided on a structure where the display panel 200, the backplane 210, and the optical film 230 are attached to each other. In this case, a side cover 222b of the conductive structure 222 may be formed to cover a side surface of the optical film 230.

[0155] The conductive structure 222 according to an embodiment of the present disclosure may have a shape covering a back surface and a side surface of the display panel 200. Since the conductive structure 222 having such a shape functions as a ground, charges or static electricity applied to a top surface of the cover member 280 may be released to the outside through the back surface of the conductive structure 222. This may enable the charges to be evenly distributed throughout the display device 1, and fixed charges do not accumulate at a specific position, thereby preventing the occurrence of image quality defects.

[0156] Specifically, as Figure 13 shown, it can be determined that when an electrostatic test is performed using a brass rod 290, the charges move from the conductive structure 222 covering the side surface of the display device 2 to the back surface of the conductive structure 222, so that no charges accumulate at a specific position. In this regard, the side surfaces of each of the optical film 230 and the module fixing member 270 are not covered by the conductive structure 222. However, under the action of an air passage (where the charges move into the air due to the electric force attracting the charges of copper, which is the material of the conductive structure 222), the charges can move to the conductive structure 222 and then can be released to the outside.

[0157] The electrostatic test refers to an evaluation test using the brass rod 290. In this test, the brass rod 290 may repeatedly rub the surface of the cover member 280 to generate static electricity.

[0158] In addition, according to an embodiment of the present disclosure, the side surface of the display panel 200 of the display device is completely covered by the conductive structure 222. This can prevent image quality defects that may occur due to the inflow of charges through the side surface of the display panel 200.

[0159] In addition, in a cutting process using a laser device, when a laser beam is continuously irradiated onto the display device and along a cutting line, damage to the display device may occur. The damage to the display device may cause defects in the display device. Therefore, a method capable of reducing the damage caused by the laser beam irradiation is required.

[0160] A method for reducing damage will be described below with reference to the drawings.

[0161] Figure 14 is a diagram showing a display device according to still another embodiment of the present disclosure. Figure 15 is alongFigure 14 A cross-sectional view taken along the V-V' plane. Figure 16 and Figure 17 is a diagram for showing a method of performing laser trimming according to another embodiment of the present disclosure.

[0162] Referring to Figure 14 and Figure 15 , the display device 4 may be configured to include a display panel 300, a backplane 310, and a buffer plate 320. Then, the display device 4 may be attached to the cover member by a module fixing member. In this regard, components that are the same as or similar to Figure 8 and Figure 9 will be briefly described.

[0163] The display panel 300 may include a display substrate made of a flexible plastic material such as polyimide or a flexible glass material.

[0164] The display panel 300 may include a display area AA for displaying an image and a non-display area NAA. The non-display area NAA may be formed to surround the display area AA and may be used as an area where no image is displayed, i.e., a border area. A circuit board 340, a driver integrated circuit 350, and a current connector 360 connected to an external device may be provided in the non-display area NAA. One end of the circuit board 340 may be attached to the front surface of the non-display area NAA and the display panel 300.

[0165] The driver integrated circuit 350 may supply signals to the data lines and gate lines of each pixel.

[0166] The backplane 310 may be provided on one surface of the display panel 300. The backplane 310 may be provided below the display substrate constituting the display panel 300 and may supplement the stiffness of the display substrate. The backplane 310 may be formed to have a certain strength and a certain thickness to supplement the stiffness of the display substrate. The buffer plate 320 may be provided on one surface of the backplane 310. The buffer plate 320 may have a heat dissipation function and a shock absorption function, and may be configured to include an adhesive member 321 and a conductive structure 322.

[0167] The adhesive member 321 may be a layer that directly contacts the backplane 320 to fix the buffer plate 320 to the backplane 320. The adhesive member 321 may be made of or include materials such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0168] The conductive structure 322 is provided on one surface of the adhesive member 321. In this regard, the one surface of the adhesive member 321 that contacts the conductive structure 322 may be opposite to the surface that contacts the backplane 320.

[0169] The conductive structure 322 may include a porous metal structure that includes metal as a main component and has a plurality of pores therein. In one example, the conductive structure 322 may be formed by sintering a metal foam precursor that includes metal powder. However, the present disclosure is not limited thereto. The metal foam precursor may be understood as a structure before a process such as sintering. For example, a slurry including metal powder, a dispersant, and a binder may be used to produce the metal foam precursor. After preparing the slurry including the above-described metal powder, dispersant, and binder, the slurry may be injected into a mold having a predetermined shape or the slurry may be coated on a substrate. The thus-formed metal foam precursor may be subjected to a sintering process and thus the conductive structure 322 may be formed.

[0170] According to an embodiment of the present disclosure, the conductive structure 222 may be formed by injecting the above-described slurry into a mold having a predetermined shape and performing a sintering process thereon. According to another embodiment of the present disclosure, the conductive structure 322 may be constituted by a flexible metal film.

[0171] In one example, the conductive structure 322 may include copper (Cu). The side ends of the display panel 300, the side ends of the back plate 310, and the side ends of the conductive structure 322 are aligned with each other without generating a step. For example, each of the display panel 300 and the back plate 310 may be formed to have the same area size as the conductive structure 322.

[0172] In this regard, the display device 4 including the display panel 300, the back plate 310, the adhesive member 321, and the conductive structure 322 may be formed to have a size F that is relatively larger than the target size E to be achieved.

[0173] In one example, a groove 340 having a concave bottom surface and two opposing sidewalls may be provided in an edge portion of the conductive structure 322. The groove 340 may be provided to overlap with an outer edge of a region corresponding to the target size E of the conductive structure 322. The groove 340 may be formed to have a predetermined depth d2 from the top surface of the conductive structure 322.

[0174] In one example, the groove 340 formed in the conductive structure 322 may be formed by injecting a slurry including metal powder, a dispersant, and a binder as described above into a mold having a groove shape, or the groove 340 formed in the conductive structure 322 may be formed by forming the conductive structure into a plate shape and then applying pressure on the plate using a mold having a groove shape.

[0175] The depth d2 of the trench 340 from the top surface of the conductive structure 322 may not exceed 30% of the total thickness T3 of the conductive structure. In one example, the depth d2 may be in the range of 20% to 30% of the total thickness T3. When the depth d2 of the trench 340 exceeds 30% of the total thickness T3 of the conductive structure 322, in the laser trimming process using a laser device, the depth deviates from the laser tolerance, such that the laser may not be able to irradiate the desired position. In addition, when the depth d2 of the trench 340 is less than 20% of the total thickness T3 of the conductive structure 322, there may be an inclination phenomenon where the side surface of the buffer plate 30, the side surface of the back plate 20, and the side surface of the display panel 10 are not aligned with each other, but are inclined at an inclination angle θ as they face the display panel 10, as Figure 6 shown.

[0176] In addition, when the depth d2 of the trench 340 is less than 20% of the total thickness T3 of the conductive structure 322, damage to the display panel due to the laser may occur as the laser beam irradiation time increases. Therefore, the display device is defective.

[0177] Next, as Figure 16 shown, a laser trimming process of cutting the display device 4 along the cutting line CL3 provided thereon with the conductive structure 322 is performed by the laser device L. The laser trimming process may irradiate a laser beam from the back surface of the display device 4 toward the front surface of the display device 4 provided with the display panel 300 along the cutting line CL3, thereby cutting the display device 4 into a target size E.

[0178] The cutting line CL3 may be formed along three sides of the display device 4. For example, the cutting line CL3 may be formed along the upper side, the left side, and the right side of the display device 4. The cutting line CL3 may overlap with the trench 340.

[0179] When the laser beam irradiates the cutting line CL3 (e.g., the trench 340), the temperature of the trench 340 rises. Therefore, melting may start when the temperature exceeds the melting point of the material constituting the conductive structure 322.

[0180] Then, during laser trimming, the material constituting the conductive structure 322 flows downward toward the display panel 300. In this regard, the material may flow downward from the side wall and the bottom surface of the trench 340 toward the display panel 300.

[0181] Then, as Figure 17As shown, a side cover 322b of a conductive structure 322 is formed to cover sidewalls of the adhesive member 321, sidewalls of the back plate 310, and sidewalls of the display panel 300. The conductive structure 322 is configured to include an upper cover 322a and a side cover 322b. In one example, the side cover 322b of the conductive structure 322 may be configured such that a horizontal dimension T6 of a portion thereof covering the sidewall of the display panel 300 is relatively greater than a horizontal dimension T5 of a portion thereof covering the sidewall of the adhesive member 321.

[0182] When a laser beam is irradiated onto the display device 4 when the trench 340 has been formed in the conductive structure 322, due to the depth of the trench 340, the duration of irradiating the laser beam can be reduced. Therefore, damage that may be caused by the laser can be reduced, thereby preventing defects in the display device.

[0183] The protection scope of the present disclosure shall be subject to the scope of the claims, and all technical concepts within the equivalent scope thereof shall be understood to be included within the scope of the present disclosure. Although the embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not necessarily limited to these embodiments. The present disclosure can be implemented in various modified ways without departing from the technical concept of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical concept of the present disclosure, but to describe the present disclosure. The scope of the technical concept of the present disclosure is not limited by the embodiments. Therefore, it should be understood that the above embodiments are illustrative rather than restrictive in all aspects. The protection scope of the present disclosure shall be interpreted by the claims, and all technical concepts within the scope of the present disclosure shall be understood to be included within the scope of the present disclosure.

Claims

1. A display device, comprising: a display panel; a backplane, the backplane being disposed on one surface of the display panel; and a buffer plate, the buffer plate including an adhesive member disposed on one surface of the backplane and a conductive structure disposed on one surface of the adhesive member, wherein the conductive structure covers each of a side surface of the adhesive member, a side surface of the backplane, and a side surface of the display panel, wherein the conductive structure includes: an upper cover disposed on the one surface of the adhesive member; and a side cover extending from the upper cover and covering the side surface of the backplane, the side surface of the display panel, and the side surface of the adhesive member.

2. The display device according to claim 1, wherein the side surface of the display panel, the side surface of the backplane, and the side surface of the adhesive member are aligned with each other.

3. The display device according to claim 1, wherein the side cover protrudes horizontally from the side surface of each of the display panel, the backplane, and the adhesive member.

4. The display device according to claim 1, wherein the display device further includes: an optical film disposed on a surface of the display panel opposite to the one surface of the display panel on which the backplane is disposed; and a cover member disposed on one surface of the optical film.

5. The display device according to claim 4, wherein the conductive structure covers a side surface of the optical film.

6. The display device according to claim 1, wherein a horizontal dimension of a portion of the conductive structure covering the side surface of the display panel is greater than a horizontal dimension of a portion of the conductive structure covering the side surface of each of the adhesive member and the backplane.

7. The display device according to claim 2, wherein an upper side of the display panel, an upper side of the backplane, and an upper side of the adhesive member are aligned with each other, a left side of the display panel, a left side of the backplane, and a left side of the adhesive member are aligned with each other, and a right side of the display panel, a right side of the backplane, and a right side of the adhesive member are aligned with each other.

8. The display device according to claim 1, wherein a plurality of holes are formed in the conductive structure and the conductive structure includes copper (Cu).

9. The display device according to claim 1, wherein a dimension by which the conductive structure horizontally extends from the side surface of the backplane, the side surface of the display panel, and the side surface of the adhesive member is less than 60 μm.

10. The display device according to claim 1, wherein a portion of the conductive structure covering the side surface of the adhesive member, the side surface of the backplane, and the side surface of the display panel has a flat vertical surface.

11. The display device according to claim 1, wherein One surface of the backplane provided with the bonding member is the opposite surface of the surface of the backplane provided with the display panel, and one surface of the bonding member provided with the conductive structure is the opposite surface of the surface of the bonding member provided with the backplane.

12. A method of manufacturing a display device, the method comprising: providing a display device including a display panel, a backplane on the display panel, and a buffer plate on the backplane, wherein the buffer plate includes a bonding member on the backplane and includes a conductive structure, wherein the conductive structure includes an upper cover provided on one surface of the bonding member, wherein side surfaces of the display panel, the backplane, and the bonding member are aligned with each other, wherein the conductive structure further includes a side cover extending from the upper cover and covering the side surfaces of the bonding member, the backplane, and the display panel, wherein the side cover has a first horizontal dimension; and performing a trimming process for cutting a part of the side cover of the conductive structure inward from a side end of the side cover to reduce the first horizontal dimension of the side cover to a second horizontal dimension.

13. The method according to claim 12, wherein, the side cover covers an upper side surface, a left side surface, and a right side surface of the display device.

14. The method according to claim 12, wherein, performing the trimming process includes a laser trimming process and performing the trimming process along a cutting line overlapping with the side cover of the conductive structure, wherein the cutting line is formed along an upper edge, a left edge, and a right edge of the display device.

15. The method according to claim 12, wherein, the first horizontal dimension of the side cover is greater than 60 μm, and the second horizontal dimension of the side cover is less than 60 μm.

16. The method according to claim 12, wherein, the side cover of the conductive structure is formed such that as the side cover extends from the bonding member toward the display panel, the horizontal dimension of the side cover increases.

17. The method according to claim 12, wherein, the method further includes, after performing the trimming process: providing an optical film on the display panel; and providing a cover member on the optical film and combining the cover member with the display device.

18. A method of manufacturing a display device, the method comprising: providing a display device including a display panel, a backplane on the display panel, and a buffer plate on the backplane, wherein the buffer plate includes a bonding member on the backplane and a conductive structure on the bonding member, wherein side surfaces of the display panel, the backplane, and the buffer plate are aligned with each other in a line, and wherein a groove having a bottom surface and a side wall is included in an edge portion of the conductive structure; and performing a trimming process for using the bottom surface of the groove as a cutting line to cut a part of the display device inward from a side surface of the display device; The formed conductive structure melts and flows to form an upper cover and side covers. The upper cover is disposed on one surface of the adhesive member, and the side covers extend from the upper cover to cover the side surface of the adhesive member, the side surface of the back plate, and the side surface of the display panel.

19. The method according to claim 18, wherein, the groove extends along the upper side, left side, and right side of the display device.

20. The method according to claim 18, wherein, performing a trimming process includes a laser trimming process and performing the trimming process along the cutting line, and wherein the cutting line extends along the upper edge, left edge, and right edge of the display device.

21. The method according to claim 18, wherein, the depth of the groove from the top surface of the conductive structure is in the range of 20% to 30% of the total thickness of the conductive structure.

22. The method according to claim 18, wherein, as the side covers of the conductive structure extend from the adhesive member to the display panel, the horizontal dimension of the side covers increases.

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