Display panel and preparation method thereof

Abstract

The application belongs to the technical field of display, and discloses a display panel and a preparation method thereof. The display panel comprises a substrate, an encapsulation cover plate, an encapsulation assembly and a display device. The encapsulation substrate and the encapsulation cover plate are arranged in opposite intervals. The encapsulation assembly is used for sealingly connecting the encapsulation substrate and the encapsulation cover plate, and the encapsulation substrate and the encapsulation cover plate jointly form a sealed space. The display device is arranged in the sealed space. The display panel can be made by re-encapsulating the existing display device. The display device can be a cut or uncut display screen. The preparation method is simple, and it is not necessary to open a mold again. The display panel can be used for different shapes of screens, and the mold opening cost is saved, the inventory cost is reduced, and the encapsulation sealing performance is improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to display panels and their manufacturing methods. Background Technology

[0002] OLED displays boast advantages such as thinness, low power consumption, high brightness, excellent luminous efficiency, the ability to display pure black, and foldability, making them widely used in electronic devices such as televisions, computer monitors, mobile phones, and tablets. With the diversification of consumer demands, OLED displays come in various shapes and sizes. For example, in the mobile phone industry, the area corresponding to the front-facing camera may take the form of a notch or a waterdrop notch. Currently, to achieve these different screen shapes, new molds must be created for each. Rapidly changing market demands result in significant costs for mold development and production debugging resources. Furthermore, inventory cannot be mutually consumed, leading to increased inventory costs. Summary of the Invention

[0003] One object of the present invention is to provide a display panel that can be repackaged from existing display devices, with a simple manufacturing method, no need for new mold making, and the ability to be used with screens of different shapes, thereby saving mold making costs and reducing inventory costs.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A display panel is provided, comprising:

[0006] The package includes a substrate, a cover plate, a package assembly, and a display device. The substrate and the cover plate are arranged at intervals relative to each other. The package assembly seals and connects the substrate and the cover plate, and together with the substrate and the cover plate, forms a sealed space. The display device is disposed within the sealed space.

[0007] As a preferred structure of the present invention, the display device includes a substrate, a thin film transistor layer, a light-emitting device layer and an encapsulation layer stacked sequentially.

[0008] The encapsulation substrate is disposed on the side of the substrate opposite to the encapsulation layer, and the encapsulation cover is disposed on the side of the encapsulation layer opposite to the substrate. The encapsulation assembly includes at least one encapsulation ring, which is arranged around the periphery of the display device and sealed between the encapsulation substrate and the encapsulation cover. The encapsulation ring surrounding the entire periphery of the display device ensures effective encapsulation and prevents display failure caused by the intrusion of water, oxygen, and contaminants; multiple encapsulation rings further increase the sealing performance of the encapsulation assembly, providing better isolation performance.

[0009] In a preferred embodiment of the present invention, the encapsulation ring extends along the outer periphery of the encapsulation substrate and the encapsulation cover to seal the gap between the encapsulation substrate and the encapsulation cover to form the sealing space;

[0010] Alternatively, the encapsulating ring extends along the edge of the display device to seal the gap between the encapsulation substrate and the encapsulation cover, forming the sealed space. The encapsulating ring can be a regular shape or an irregular shape to ensure effective encapsulation.

[0011] As a preferred structure of the present invention, the display device has at least one opening, the opening being located at the edge of the display device or inside the display device;

[0012] Along the thickness direction of the display panel, the opening penetrates at least through the encapsulation layer of the display device. By cutting the display device to form the opening, universality is achieved between screens of different shapes.

[0013] In a preferred embodiment of the present invention, when viewed from the plane of the display panel, there is a gap between the encapsulation component and the display device, the width of which is greater than or equal to 50 μm. This certain spacing ensures that the encapsulation component is located in the non-display area of ​​the display device, avoiding any impact on the normal display effect.

[0014] In a preferred embodiment of the present invention, the encapsulation assembly includes at least one encapsulation ring, the width of which, when viewed from the plane of the display panel, is greater than or equal to 100 μm. A sufficiently wide encapsulation assembly extends the intrusion path of water, oxygen, and contaminants, further reducing the risk of encapsulation failure.

[0015] In a preferred embodiment of the present invention, the encapsulation substrate and / or the encapsulation cover plate are provided with a fixing groove, and a portion of the encapsulation assembly extends into the fixing groove. The encapsulation ring covers the sidewalls and bottom of the fixing groove, increasing the adhesion between the substrate and the encapsulation cover plate, ensuring that the display device does not shift, and preventing display panel failure.

[0016] Another objective of this invention is to provide a method for manufacturing a display panel, which is used to repackage existing display devices to achieve universality of screens with different shapes, improve the sealing performance of the packaging, and the manufacturing method is simple, does not require re-molding, and can avoid packaging failure and ensure good display performance.

[0017] To achieve this objective, the present invention adopts the following technical solution:

[0018] A method for manufacturing a display panel is provided, comprising the following steps:

[0019] Step S1: Place the display device on the packaging substrate or packaging cover plate, and apply a packaging rubber ring to the packaging substrate or packaging cover plate so that the display device can be accommodated inside the packaging rubber ring.

[0020] Step S2: Cover the display device with the encapsulation cover plate in such a way that the display device and the encapsulation ring are located between the encapsulation cover plate and the display device, and the encapsulation ring surrounds the display device.

[0021] Step S3: Press and cure the encapsulation ring to form an encapsulation assembly. The encapsulation assembly, the encapsulation substrate, and the encapsulation cover plate together form a sealed space, and the display device is located in the sealed space.

[0022] In a preferred embodiment of the present invention, the following steps are included before step S1:

[0023] Step S0: Cut the display device to form at least one opening, the opening being located at the edge of the display device and / or inside the display device.

[0024] In a preferred embodiment of the present invention, steps S1 to S3 are performed in a nitrogen atmosphere. The nitrogen atmosphere prevents water, oxygen, and contaminants from remaining inside the encapsulated display panel.

[0025] The beneficial effects of this invention are:

[0026] The display panel provided by this invention includes an encapsulation assembly that seals and connects the encapsulation substrate and the encapsulation cover plate, forming a sealed space together. The display device is disposed within this sealed space, and the encapsulation assembly effectively isolates water, oxygen, and other contaminants. The display device is manufactured by cutting and processing an existing display device. After cutting, the display device lacks a portion of the encapsulation layer, exposing the electroluminescent components, which are prone to failure. The encapsulation assembly surrounds the display device completely, effectively isolating it from water, oxygen, and other contaminants, preventing them from penetrating the electroluminescent components, and extending the lifespan of the display panel. The encapsulation layer uses Frit encapsulation, a mature technology with excellent sealing performance, and is not limited by the shape of the display device. New display panels do not require new molds, achieving universality between screens of different shapes, saving mold costs and reducing inventory costs. The display device can also be an uncut ordinary display. When its encapsulation performance is poor, or due to environmental requirements, it can be re-encapsulated using the encapsulation substrate, encapsulation cover plate, and encapsulation assembly to further improve the sealing performance of the display device, extend the lifespan of the display panel, and meet application needs.

[0027] The manufacturing method provided by this invention can repackage existing display devices. The display device can be a display with a missing portion of its encapsulation layer cut off, or a complete display. When the display device is a complete display, the encapsulation component enhances its sealing performance, meeting higher encapsulation performance requirements. When the display device is a display with a missing portion of its encapsulation layer cut off, the encapsulation component prevents water, oxygen, and contaminants from intruding from the cut area, thus forming the aforementioned display panel. The new display panel does not require re-molding, achieving universality between different screen shapes, meeting different shape requirements for new screens, saving mold costs, and reducing inventory costs. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the display device provided in Embodiment 1 of the present invention;

[0029] Figure 2 This is a schematic diagram of the structure of the display panel provided in Embodiment 1 of the present invention. Figure 1 ;

[0030] Figure 3 yes Figure 2 Cross-sectional view of the structure along the AA direction;

[0031] Figure 4 yes Figure 2 Structural section along the BB direction Figure 1 ;

[0032] Figure 5 yes Figure 2 Structural section along the BB direction Figure 2 ;

[0033] Figure 6 This is a schematic diagram of the structure of the display panel provided in Embodiment 1 of the present invention. Figure 2 ;

[0034] Figure 7 This is a schematic diagram of the preparation method provided in Embodiment 2 of the present invention. Figure 1 ;

[0035] Figure 8 This is a schematic diagram of the preparation method provided in Embodiment 2 of the present invention. Figure 2 ;

[0036] Figure 9 This is a schematic diagram of the preparation method provided in Embodiment 2 of the present invention. Figure 3 .

[0037] In the picture:

[0038] 1. Packaging substrate; 2. Packaging cover plate; 3. Packaging assembly; 30. Gap; 4. Display device; 41. Packaging layer; 42. Opening; 5. Fixing groove;

[0039] 100. Gel-like Frit layers. Detailed Implementation

[0040] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0041] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0043] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0044] Example 1

[0045] like Figures 1-6As shown, Embodiment 1 of the present invention provides a display panel, which includes an encapsulation substrate 1, an encapsulation cover plate 2, an encapsulation assembly 3, and a display device 4. The encapsulation substrate 1 and the encapsulation cover plate 2 are arranged at intervals relative to each other. The encapsulation assembly 3 seals and connects the encapsulation substrate 1 and the encapsulation cover plate 2, and together with the encapsulation substrate 1 and the encapsulation cover plate 2, forms a sealed space. The display device 4 is disposed within the sealed space. The encapsulation assembly 3 can be a Frit encapsulation layer formed by Frit encapsulation technology. The display device 4 before cutting can be a flexible OLED display, a rigid OLED display, or other forms. This embodiment does not impose specific limitations; in this embodiment, a flexible OLED display is used as an example for explanation. The display device 4 includes a cut area and a non-cut area; such as Figure 1 The diagram shown is a structural schematic of the display device 4 before cutting according to an embodiment of the present invention. The display device 4 can be cut using laser cutting or other cutting methods; this embodiment does not impose specific limitations. The shape of the cutting area can be designed according to usage requirements, and can be various shapes such as a fringe or teardrop shape; this embodiment does not impose specific limitations. A portion of the encapsulation layer 41 will be missing from the outer periphery of the cutting area of ​​the display device 4, exposing the electroluminescent components. These components are sensitive to the external environment and prone to failure. The encapsulation assembly 3 seals and connects the encapsulation substrate 1 and the encapsulation cover plate 2, forming a sealed space together. The display device 4 is disposed within this sealed space. Therefore, the encapsulation assembly 3 surrounds the display device 4 to seal the electroluminescent components. The encapsulation assembly 3 can isolate water, oxygen, and other contaminants, preventing them from intruding into the electroluminescent components and extending the lifespan of the display panel. Frit encapsulation technology is mature, with excellent isolation and sealing performance, and can encapsulate and protect the cut display device 4 without being limited by its shape. The new display panel does not require new mold making, achieving universality between screens of different shapes, saving mold making costs and reducing inventory costs. It should be noted that the display device 4 can also be an ordinary display that has not been cut. When its packaging performance is poor, or due to the needs of the usage environment, it can be re-encapsulated by the packaging substrate 1, the packaging cover 2, and the packaging assembly 3 to further improve the sealing performance of the display device 4 and extend the service life of the display panel, which is also within the protection scope of this invention.

[0046] As a preferred embodiment, the display device 4 includes a substrate, a thin-film transistor layer, a light-emitting device layer, and an encapsulation layer 41 stacked sequentially; the encapsulation substrate 1 is disposed on the side of the substrate opposite to the encapsulation layer 41, and the encapsulation cover plate 2 is disposed on the side of the encapsulation layer 41 opposite to the substrate. The encapsulation assembly 3 includes at least one encapsulation ring, which is disposed around the periphery of the display device 4 and sealably connected between the encapsulation substrate 1 and the encapsulation cover plate 2, such as... Figure 2As shown. Furthermore, the encapsulation component 3 can be provided with multiple encapsulation rings, which are set one by one from the edge of the display device 4 outwards to form a ring-shaped structure; the multiple encapsulation rings further increase the sealing performance of the encapsulation component 3 and provide better isolation performance.

[0047] As a preferred embodiment, the encapsulating ring extends along the outer periphery of the encapsulation substrate 1 and the encapsulation cover 2 to seal the gap between the encapsulation substrate 1 and the encapsulation cover 2, forming a sealed space; such as Figure 2 As shown, the encapsulating ring extends along the outer periphery of the encapsulation substrate 1 and the encapsulation cover 2, forming a regular shape according to the shape of the encapsulation substrate 1 and the encapsulation cover 2. Of course, in another embodiment, the encapsulating ring can also extend along the edge of the display device 4 to seal the gap between the encapsulation substrate 1 and the encapsulation cover 2 to form a sealed space. That is, when the display device 4 is cut to form an irregular shape, the encapsulating ring can be irregular in shape, always maintaining an equal distance from the display device 4.

[0048] As a preferred embodiment, the display device 4 has at least one opening 42, which is located at the edge of the display device 4 and / or inside the display device 4; along the thickness direction of the display panel, the opening 42 at least penetrates the encapsulation layer 41 of the display device 4. Figure 2 As shown, the display device 4 in this embodiment has an opening 42 formed at its upper edge, and has a notch-shaped cutting area; the cutting area causes a partial loss of the encapsulation layer 41, such as... Figure 4 and Figure 5 As shown, the encapsulation component 3 surrounding the display device 4 can ensure effective encapsulation and prevent display failure caused by the intrusion of water, oxygen and contaminants from the cutting area.

[0049] In another preferred embodiment, the display device 4 has an opening 42 formed by internal cutting, such as Figure 6 As shown, a circular opening 42 is cut into the interior of the display device 4, allowing water, oxygen, and contaminants to enter the electroluminescent components through the opening 42. Therefore, the encapsulation assembly 3 is arranged around the entire periphery of the display device 4, forming a sealed space together with the encapsulation substrate 1 and the encapsulation cover 2 to ensure effective encapsulation. Furthermore, an encapsulation ring can be placed inside the opening 42, meaning that at least one encapsulation ring is placed on the outer periphery of the display device 4 and inside the opening 42, thus forming the encapsulation assembly 3. This prevents display failure caused by the intrusion of water, oxygen, and contaminants from the cut area, resulting in better sealing performance.

[0050] It should be noted that the aforementioned opening 42 needs to avoid the circuit structure such as GIP of the display device 4. Generally, the opening 42 is set in the upper half of the display device 4 to avoid the display device 4 from malfunctioning due to cutting.

[0051] As a preferred embodiment, when viewed from the plane of the display panel, there is a gap 30 between the encapsulation component 3 and the display device 4, the width of which is greater than or equal to 50 μm. This certain spacing ensures that the encapsulation component 3 is located in the non-display area of ​​the display device 4, avoiding any impact on the normal display effect.

[0052] As a preferred embodiment, the encapsulation component 3 includes at least one encapsulation ring, the width of which is greater than or equal to 100 μm when viewed from the plane of the display panel. An encapsulation ring greater than 100 μm provides sufficient adhesion, increasing the bonding force between the encapsulation substrate 1 and the encapsulation cover plate 2; moreover, a sufficiently wide encapsulation ring can extend the intrusion path of water, oxygen, and contaminants, further reducing the risk of encapsulation failure.

[0053] As a preferred embodiment, the packaging substrate 1 and / or the packaging cover plate 2 are provided with a fixing groove 5, and part of the packaging component 3 extends into the fixing groove 5. Figure 5 As shown, a fixing groove 5 is provided on the encapsulation substrate 1, and the encapsulation component 3 extends downward into the fixing groove 5. The adhesive ring can cover the side walls and bottom of the fixing groove 5, thereby increasing the adhesion between the encapsulation substrate 1 and the encapsulation cover plate 2, ensuring that the display device 4 will not shift and avoiding display panel failure.

[0054] Specifically, the display panel also includes an adhesive layer (not shown in the figure), which is disposed between the display device 4 and the encapsulation substrate 1, and / or between the display device 4 and the encapsulation cover plate 2. The adhesive layer between the display device 4 and the encapsulation cover plate 2 prevents gaps, which would cause light propagation interference, forming concentric rings of alternating light and dark, i.e., Newton's rings, affecting the normal display effect of the display panel and resulting in defective products after manufacturing. The adhesive layer between the display device 4 and the encapsulation substrate 1 fixes the position of the display device 4, preventing it from moving within the sealed space. Therefore, the adhesive layer not only improves the adhesion between the display device 4 and the encapsulation substrate 1, and between the display device 4 and the encapsulation cover plate 2, but also ensures that there are no gaps between the display device 4 and the encapsulation cover plate 2.

[0055] Example 2

[0056] Embodiment 2 of the present invention provides a preparation method for preparing the display panel in Embodiment 1, such as... Figures 7-9 As shown, it includes the following steps:

[0057] Step S1: Place the display device 4 on the encapsulation substrate 1 or the encapsulation cover plate 2, and apply an encapsulation ring to the encapsulation substrate 1 or the encapsulation cover plate 2. The display device 4 can be accommodated inside the encapsulation ring. The display device 4 can be a display with a cut-out portion of the encapsulation layer 41, or it can be a complete display. When the encapsulation ring is applied to the encapsulation substrate 1, it needs to surround the display device 4; when the encapsulation ring is applied to the encapsulation cover plate 2, it needs to be able to accommodate the display device 4 inside. In some embodiments, the encapsulation ring extends along the outer periphery of the encapsulation substrate 1 and the encapsulation cover plate 2. In other embodiments, the encapsulation ring may extend along the edge of the display device 4. The encapsulation substrate 1 may be a glass substrate, and the position of the display device 4 is fixed by means of adhesive or other methods. The encapsulation substrate 1 provides a fixing reference, which facilitates the formation of the encapsulation assembly 3. In this step, the encapsulation ring can be formed on the encapsulation substrate 1 or the encapsulation cover plate 2 by means of coating or printing. The dimensions of the encapsulation substrate 1 and the encapsulation cover plate 2 are set according to the dimensions of the display device 4 to ensure that the encapsulation ring is completely covered.

[0058] Step S2: Cover the display device 4 with the encapsulation cover 2 and the encapsulation ring located between the encapsulation cover 2 and the display device 4, and with the encapsulation ring surrounding the display device 4.

[0059] Step S3: Press and cure the encapsulating ring to form the encapsulation component 3. The encapsulation component 3, together with the encapsulation substrate 1 and the encapsulation cover plate 2, constitute a sealed space, within which the display device 4 is disposed. In this step, the encapsulation component 3 is formed using the Frit encapsulation method. The Frit encapsulation layer encapsulates the cut display device 4, preventing water, oxygen, and contaminants from intruding from the cut area and causing display failure. The encapsulating ring is cured through high-temperature baking, laser sintering, etc., forming an encapsulation component 3 with a glass-like structure, achieving a bonding connection between the encapsulation cover plate 2 and the encapsulation substrate 1, and effectively encapsulating the display device 4; after the encapsulation cover plate 2 is closed, it is necessary to ensure that there are no gaps between the encapsulation cover plate 2 and the display device 4.

[0060] The preparation method of Embodiment 2 of the present invention, through the above steps, can repackage an existing display device 4. The display device 4 can be a display with a missing portion of the encapsulation layer 41 cut off, or it can be a complete display. When the display device 4 is a complete display, the encapsulation component 3 can enhance the sealing performance of the display device 4 and meet higher encapsulation performance requirements. When the display device 4 is a display with a missing portion of the encapsulation layer 41 cut off, the encapsulation component 3 can prevent water, oxygen, and contaminants from invading from the cut area and causing display failure, thereby forming the display panel in Embodiment 1. The new display panel does not require re-molding, achieving universality between screens of different shapes, meeting the different shape requirements of the new screen, saving mold opening costs, and reducing inventory costs.

[0061] Specifically, steps S1-S3 are all performed in a nitrogen atmosphere. The nitrogen atmosphere prevents water, oxygen, and contaminants from remaining inside the display device 4 during the cutting process, and ultimately from remaining inside the packaged display panel.

[0062] Furthermore, the following steps are included before step S1:

[0063] Step S0: The display device 4 is cut to form at least one opening 42, the opening 42 being located at the edge of the display device 4 or inside the display device 4. In this step S0, the display device 4 forms a cut area and a non-cut area, such as... Figure 7 As shown, the missing portion of the encapsulation layer 41 in the cut area will expose part of the electroluminescent components inside the display device 4; this embodiment does not limit the specific shape of the display device 4 before and after cutting.

[0064] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A display panel, characterized in that, include: The package includes a substrate (1), a cover plate (2), a package assembly (3), a display device (4), and an adhesive layer. The substrate (1) and the cover plate (2) are arranged at intervals relative to each other. The package assembly (3) seals the substrate (1) and the cover plate (2) together to form a sealed space. The display device (4) is disposed in the sealed space. The adhesive layer is disposed between the display device (4) and the cover plate (2) to make there no gap between the cover plate (2) and the display device (4). The display device (4) includes a substrate, a thin film transistor layer, a light-emitting device layer and a packaging layer (41) stacked in sequence. The display device (4) is a display with the missing portion of the encapsulation layer (41) cut out, and the cutting process must avoid the GIP circuit structure of the display device (4). The display device (4) has at least one opening (42), which is located at the edge of the display device (4) or inside the display device (4). Along the thickness direction of the display panel, the opening (42) penetrates at least the encapsulation layer (41) of the display device (4). Alternatively, the display device (4) may be a complete display; The display device (4) can be repackaged using the packaging substrate (1), the packaging cover plate (2), and the packaging assembly (3).

2. The display panel according to claim 1, characterized in that, The encapsulation substrate (1) is disposed on the side of the substrate away from the encapsulation layer (41), the encapsulation cover plate (2) is disposed on the side of the encapsulation layer (41) away from the substrate, and the encapsulation assembly (3) includes at least one encapsulation ring, which is disposed around the periphery of the display device (4) and sealed between the encapsulation substrate (1) and the encapsulation cover plate (2).

3. The display panel according to claim 2, characterized in that, The encapsulation ring extends along the outer periphery of the encapsulation substrate (1) and the encapsulation cover plate (2) to seal the gap between the encapsulation substrate (1) and the encapsulation cover plate (2) to form the sealing space; Alternatively, the encapsulation ring extends along the edge of the display device (4) to seal the gap between the encapsulation substrate (1) and the encapsulation cover plate (2) to form the sealing space.

4. The display panel according to any one of claims 1-3, characterized in that, Viewed from the plane of the display panel, there is a gap (30) between the encapsulation component (3) and the display device (4), the width of the gap (30) being greater than or equal to 50 μm.

5. The display panel according to any one of claims 1-3, characterized in that, The encapsulation component (3) includes at least one encapsulation ring, and the width of the encapsulation ring is greater than or equal to 100 μm when viewed from the plane of the display panel.

6. The display panel according to any one of claims 1-3, characterized in that, The packaging substrate (1) and / or the packaging cover plate (2) are provided with a fixing groove (5), and part of the packaging component (3) extends into the fixing groove (5).

7. A method for manufacturing a display panel, characterized in that, The method for preparing the display panel as described in any one of claims 1-6 includes the following steps: Step S1: Place the display device (4) on the packaging substrate (1) or the packaging cover plate (2), and apply a packaging ring on the packaging substrate (1) or the packaging cover plate (2). The display device (4) can be accommodated inside the packaging ring. Step S2: The encapsulation cover plate (2) is placed on the display device (4) with the display device (4) and the encapsulation ring located between the encapsulation cover plate (2) and the display device (4), and the encapsulation ring surrounding the display device (4). Step S3: Press and solidify the encapsulation ring to form an encapsulation component (3). The encapsulation component (3), the encapsulation substrate (1), and the encapsulation cover plate (2) together form a sealed space, and the display device (4) is located in the sealed space.

8. The method for manufacturing a display panel according to claim 7, characterized in that, The following steps are included before step S1: Step S0: Cut the display device (4) to form at least one opening (42), the opening (42) being located at the edge of the display device (4) and / or inside the display device (4).

9. The method for manufacturing a display panel according to claim 7, characterized in that, Steps S1 through S3 are performed under a nitrogen atmosphere.

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